JPH0632078A - Metal mask and its production - Google Patents
Metal mask and its productionInfo
- Publication number
- JPH0632078A JPH0632078A JP21329992A JP21329992A JPH0632078A JP H0632078 A JPH0632078 A JP H0632078A JP 21329992 A JP21329992 A JP 21329992A JP 21329992 A JP21329992 A JP 21329992A JP H0632078 A JPH0632078 A JP H0632078A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- metal mask
- layer
- resist film
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Screen Printers (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
- Printing Plates And Materials Therefor (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、例えばＩＣチップ用リ
ードフレームやハイブリッドＩＣの配線パターンプリン
ト基板などの製造に使用されたり、コンピューター用セ
ラミック配線基板などのスルーホール導体ペーストの充
填などに使用される、スクリーン印刷用のメタルマスク
及びその製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is used, for example, in the manufacture of lead patterns for IC chips, printed wiring boards of hybrid ICs, etc., and filling of through-hole conductor paste for ceramic wiring boards for computers. The present invention relates to a metal mask for screen printing and a method for manufacturing the same.
【０００２】[0002]
【従来の技術】この種のメタルマスクはＣ、Ａｕ、Ａｇ
やＣｕなどの導電性インキや導電性ペースト（以下、イ
ンキ・ぺーストという。）を通すための透孔を有する
が、その製造法としてエッチングにより、例えば、図８
に示すようにマスク基板２に透孔３を開口したものがあ
る。2. Description of the Related Art This type of metal mask is made of C, Au, Ag.
Although it has a through hole for passing a conductive ink such as Cu or Cu or a conductive paste (hereinafter referred to as an ink paste), the manufacturing method thereof is, for example, as shown in FIG.
There is a mask substrate 2 having a through hole 3 as shown in FIG.
【０００３】また、この種のメタルマスクの製造法とし
て電鋳によることも公知である。その電鋳に際しては、
例えば、図９の（Ａ）〜（Ｄ）にその製造過程の工程図
を示すように、まず、図９の（Ａ）に示すように電鋳母
型１０の表面にフィルム状のフォトレジスト１１を重ね
合わせ、そのフォトレジスト１１の上に、マスクパター
ンに相当するパターンをもつフィルム１２を密着させて
焼き付け、現像処理して、同図の（Ｂ）に示すようにレ
ジスト膜１３を形成する。次いで、同図の（Ｃ）に示す
ように電鋳母型１０のレジスト膜１３で覆われていない
表面に電着金属２１を電着させ、しかるのち、同図の
（Ｄ）に示すようにその電着金属２１を電鋳母型１０か
ら剥離し、レジスト膜１３を除去することにより、メタ
ルマスクの電鋳製品を得る。It is also known that a metal mask of this type is manufactured by electroforming. In that electroforming,
For example, as shown in FIGS. 9A to 9D which are process diagrams of the manufacturing process, first, as shown in FIG. 9A, a film-shaped photoresist 11 is formed on the surface of the electroforming mold 10. Are superposed on each other, and a film 12 having a pattern corresponding to a mask pattern is closely adhered onto the photoresist 11 to be baked and developed to form a resist film 13 as shown in FIG. Then, as shown in (C) of the same figure, an electrodeposited metal 21 is electrodeposited on the surface of the electroformed mold 10 which is not covered with the resist film 13, and then, as shown in (D) of the same figure. The electrodeposited metal 21 is peeled off from the electroforming mother die 10 and the resist film 13 is removed to obtain an electroformed product having a metal mask.
【０００４】[0004]
【発明が解決しようとする課題】しかし、エッチングに
よる上記メタルマスクでは、透孔３の内面が荒く滑らか
でないため、インキ・ぺーストの通過性が悪い。その通
過性を良好にするためにメッキを施すとなると工程数の
増加を招く不利がある。とくに、印刷に際しそのマスク
基板２のスキージかけ面４側にインキ・ぺーストをのせ
てスキージをかけるとき、スキージ印圧でマスク基板２
の非透孔部５を被印刷物の表面に対し押しつけるが、そ
の押しつけ荷重が非透孔部５の印刷面６側のフラットな
裏面全体に広がって作用するので、単位面積当たりの荷
重が小さくなり、このため被印刷物の表面との密着性に
劣り、インキ・ぺーストのにじみや非透孔部５の裏面へ
の回り込みが起こり易い。However, in the above-mentioned metal mask formed by etching, the inner surface of the through hole 3 is rough and not smooth, so that the ink paste cannot pass through easily. If plating is performed to improve the passability, there is a disadvantage that the number of steps is increased. In particular, when a squeegee is applied with an ink paste on the squeegee application surface 4 side of the mask substrate 2 at the time of printing, the mask substrate 2 is applied with squeegee printing pressure.
The non-perforated portion 5 of the non-perforated portion 5 is pressed against the surface of the printing object, but the pressing load spreads and acts on the entire flat back surface of the non-perforated portion 5 on the printing surface 6 side, so the load per unit area is reduced. For this reason, the adhesion to the surface of the material to be printed is poor, and ink bleeding and wraparound of the non-permeable holes 5 to the back surface are likely to occur.
【０００５】これに対し、電鋳による上記メタルマスク
では、透孔３の内面がレジスト膜１３との接触面である
ため、やはり荒く滑らかでなくざらざらしており、イン
キ・ぺーストの通過性が悪い。また、このメタルマスク
が比較的厚手になると、フォトレジスト１１を図９の
（Ａ）のように２層、３層と重ねることになり、このよ
うに複数層に重ねた場合は、指数関数的に光線（紫外
線）の吸収が行われ、この結果電鋳母型１０の位置には
ほとんど紫外線が達し難くなり、レジスト膜１３の電鋳
母型１０側の下層部１３ａに達する紫外線量が少なくな
り、表面硬化が先行して下層部１３ａが未硬化になり易
いことから、レジスト膜１３の下層部１３ａが電鋳母型
１０から剥がれたり、浮きやすいといった欠陥が生じ
る。この状態で電鋳を行うと、電着がそのレジスト膜１
３の下層部１３ａの剥がれや浮き部分に逃れ出て、図９
の（Ｄ）に示すようにバリ（薄片状）ｆが発生しやす
い。このため、メタルマスクの被印刷物の表面との密着
性が悪くなり、インキ・ぺーストの印刷時にそのインキ
・ぺーストがにじんだり、メタルマスクの裏面へ回り込
みやすく、印刷精度が悪い。とくに、インキ・ぺースト
を透孔３に誘い込みやすくするために、透孔３のスキー
ジかけ面側入口と印刷面側出口との比（ａ：ｂ）を大き
くとる必要があるが、前述のようにフォトレジスト１１
の電鋳母型１０への密着性の関係上その比が大きくとれ
ず、このためインキ・ぺーストを透孔３に誘い込みにく
くする。また、これにおいても印刷時にスキージによる
押しつけ荷重が非透孔部５のフラットな裏面全体に広が
って作用するため、被印刷物の表面との密着性に劣り、
インキ・ぺーストのにじみや非透孔部５の裏面への回り
込みが起こり易い。On the other hand, in the above metal mask formed by electroforming, since the inner surface of the through hole 3 is the contact surface with the resist film 13, the surface is rough and not rough, and the ink and paste passability is low. bad. When the metal mask is relatively thick, the photoresist 11 is overlaid with two layers and three layers as shown in FIG. 9 (A). As a result, light rays (ultraviolet rays) are absorbed, and as a result, almost no ultraviolet rays reach the position of the electroforming mother die 10, and the amount of ultraviolet rays reaching the lower layer portion 13a of the resist film 13 on the electroforming mother die 10 side decreases. Since the lower layer portion 13a is likely to be uncured due to the surface hardening, the lower layer portion 13a of the resist film 13 may be peeled off from the electroforming mold 10 or may be easily floated. If electroforming is performed in this state, the electrodeposition will be that resist film 1
9 escapes to the peeling or floating portion of the lower layer portion 13a of FIG.
As shown in (D), burr (flake shape) f is likely to occur. For this reason, the adhesion of the metal mask to the surface of the object to be printed deteriorates, the ink paste bleeds during printing of the ink paste, and the ink paste easily wraps around to the back surface of the metal mask, resulting in poor printing accuracy. In particular, in order to easily draw the ink paste into the through holes 3, it is necessary to set a large ratio (a: b) between the squeegee hanging surface side inlet and the printing surface side outlet of the through holes 3, as described above. On photoresist 11
Due to the adhesiveness to the electroforming mother die 10, the ratio cannot be made large, which makes it difficult to draw the ink paste into the through holes 3. Further, also in this case, since the pressing load by the squeegee spreads and acts on the entire flat back surface of the non-permeable hole portion 5 at the time of printing, the adhesion to the surface of the printing target is poor,
Ink and paste bleeding and wraparound to the back surface of the non-permeable holes 5 are likely to occur.
【０００６】本発明の目的は、上記のようなメタルマス
クの透孔および非透孔部の断面形状に工夫を凝らすこと
により、インキ・ぺーストの透孔への誘い込み及び通過
性を良好にし、またインキ・ぺーストのにじみやマスク
裏面への回り込みの防止を図り、もって精度の高い印刷
を可能にする優れたメタルマスクを得るにある。本発明
の他の目的は、メタルマスクの電鋳法を更に発展改良す
ることによりそのような優れたメタルマスクも容易に得
る点にある。An object of the present invention is to improve the attraction and passage of the ink paste into the through holes by making ingenuity in the sectional shapes of the through holes and the non-through holes of the metal mask as described above. Another object is to obtain an excellent metal mask that prevents bleeding of ink and paste and wraps around the back surface of the mask, thus enabling highly accurate printing. Another object of the present invention is to easily obtain such an excellent metal mask by further developing and improving the electroforming method of the metal mask.
【０００７】[0007]
【課題を解決するための手段】本発明のメタルマスク
は、図１に例示するように、マスク基板２に設けるイン
キ・ぺースト通し用の透孔３の断面形状として、スキー
ジかけ面４側に向かって先拡がりの漏斗状となる形に形
成し、透孔３を囲む非透孔部５の印刷面６側にカウンタ
ーシンク７を形成したものである。As shown in FIG. 1, a metal mask of the present invention has a cross-sectional shape of a through hole 3 for passing an ink / paste provided on a mask substrate 2 on the side of a squeegee application surface 4. The counter sink 7 is formed in a funnel shape that widens toward the front, and the counter sink 7 is formed on the printing surface 6 side of the non-permeable hole portion 5 surrounding the through hole 3.
【０００８】本発明のメタルマスクを製造するに際して
は、図３および図５に例示するように、電鋳母型１０の
表面に、マスクパターンに相当するパターンをもつレジ
スト膜１３を形成する工程と、電鋳母型１０のレジスト
膜１３で覆われていない表面に、レジスト膜１３の厚さ
を越えて突出する断面ほぼ円弧状のカウンターシンク形
成用電着層１４を電着形成する工程と、カウンターシン
ク形成用電着層１４の表面に剥離処理を施したのち非透
孔部電着層１５を電着形成する工程と、非透孔部電着層
１５をカウンターシンク形成用電着層１４から剥離する
工程とを経てメタルマスクを得るものである。When manufacturing the metal mask of the present invention, as shown in FIGS. 3 and 5, a step of forming a resist film 13 having a pattern corresponding to the mask pattern on the surface of the electroforming mold 10. A step of electrodeposition forming a countersink forming electrodeposition layer 14 having a substantially arcuate cross-section protruding over the thickness of the resist film 13 on the surface of the electroforming mold 10 not covered with the resist film 13. A step of subjecting the surface of the countersink-forming electrodeposition layer 14 to a peeling treatment and then electrodepositing the non-perforated part electrodeposited layer 15; The metal mask is obtained through the step of peeling from the metal mask.
【０００９】[0009]
【作用】スキージかけ面４側に向かって先拡がりの漏斗
状となる断面形状をもつ透孔３によれば、スキージかけ
面４上にのせられるインキ・ぺーストＰはスキージＳを
かけることにより、透孔３内に円滑かつ容易に誘い込ま
れる。By virtue of the through hole 3 having a funnel-shaped cross-section that expands toward the squeegee application surface 4, the ink paste P placed on the squeegee application surface 4 is applied by applying the squeegee S. It is smoothly and easily introduced into the through hole 3.
【００１０】非透孔部５の印刷面６側にカウンターシン
ク７を形成してあるので、図２の（Ａ）に例示するよう
に非透孔部５の印刷面６側においてそのカウンターシン
ク７の存在箇所では被印刷物８の表面と接触せず、非透
孔部５の周縁５ａのみが接触することになり、スキージ
Ｓによる押しつけ荷重はその周縁５ａに集中して作用す
るため、被印刷物８の表面への密着性が高められ、イン
キ・ぺーストＰのにじみや非透孔部５の裏面への回り込
みを防止できる。Since the counter sink 7 is formed on the printing surface 6 side of the non-perforated portion 5, the counter sink 7 is formed on the printing surface 6 side of the non-perforated portion 5 as illustrated in FIG. At the location where the squeegee exists, the surface of the material to be printed 8 does not come into contact, but only the peripheral edge 5a of the non-permeable portion 5 comes into contact. The adhesion of the ink paste P to the surface of the non-perforated portion 5 and the wraparound of the non-permeable portion 5 to the back surface can be prevented.
【００１１】カウンターシンク形成用電着層１４のレジ
スト膜１３より突出する断面ほぼ円弧状の突出部上に非
透孔部電着層１５を電着形成するとき、その電着が前記
断面ほぼ円弧状の突出部のアールに沿って成長するの
で、透孔３の断面形状としてスキージかけ面４側に向か
って先拡がりの漏斗状となる形に形成することができ
る。When the non-perforated part electrodeposition layer 15 is electrodeposited on the projection of the countersink forming electrodeposition layer 14 protruding from the resist film 13 and having a substantially arcuate cross section, the electrodeposition is substantially circular as described above. Since it grows along the radius of the arc-shaped protrusion, the cross-sectional shape of the through hole 3 can be formed in a funnel shape that is divergent toward the squeegee hanging surface 4 side.
【００１２】非透孔部電着層１５をカウンターシンク形
成用電着層１４から剥離することにより、カウンターシ
ンク７を有する非透孔部５を得ることができる。The non-permeable portion 5 having the counter sink 7 can be obtained by peeling the non-permeable portion electrodeposited layer 15 from the counter sink forming electrodeposited layer 14.
【００１３】透孔３の内面全体が電鋳面で鏡面状に形成
されるので、インキ・ぺーストＰの通過性が良好にな
り、印刷後の洗浄効果も高められる。Since the entire inner surface of the through hole 3 is formed as a mirror-finished electroformed surface, the ink paste P can be easily passed therethrough and the cleaning effect after printing can be enhanced.
【００１４】[0014]
【発明の効果】従って本発明のメタルマスクによれば、
インキ・ぺーストを透孔３内に誘い込み易くするととも
に残すようなこともなく通過性に優れ、また印刷後の洗
浄効果も高めることができる。とくに、このメタルマス
クはスキージによる押しつけ荷重で非透孔部５の周縁５
ａを被印刷物８の表面に対し確実に密着させることがで
きるので、印刷時にインキ・ぺーストのにじみや非透孔
部５の裏面への回り込みを防止できて、精度の高いスク
リーン印刷を可能にする。Therefore, according to the metal mask of the present invention,
The ink paste can be easily drawn into the through holes 3 and is excellent in passing without leaving it, and the cleaning effect after printing can be enhanced. In particular, this metal mask is subjected to the pressing load of the squeegee and the peripheral edge 5 of the non-permeable portion 5
Since a can be surely brought into close contact with the surface of the object to be printed 8, it is possible to prevent bleeding of the ink / paste and the wraparound to the back surface of the non-perforated portion 5 at the time of printing, thereby enabling highly accurate screen printing. To do.
【００１５】また本発明のメタルマスクの製造方法によ
れば、カウンターシンク形成用電着層１４のレジスト膜
１３より突出する断面ほぼ円弧状の突出部上に非透孔部
電着層１５を形成し、この非透孔部電着層１５を剥離し
てメタルマスクとするため、スキージかけ面４側に向か
って先拡がりの漏斗状となる形の透孔３と、カウンター
シンク７をもつ非透孔部５とを有し、かつバリの無いメ
タルマスクを容易に得ることができる。Further, according to the method for manufacturing a metal mask of the present invention, the non-permeable hole electrodeposition layer 15 is formed on the projection of the countersink forming electrodeposition layer 14 which projects from the resist film 13 and has a substantially arcuate cross section. However, since the non-permeable portion electrodeposition layer 15 is peeled off to form a metal mask, the non-permeable material having the counter sink 7 and the transparent hole 3 having a funnel shape that widens toward the squeegee surface 4 side. It is possible to easily obtain a metal mask having the holes 5 and having no burr.
【００１６】[0016]
【実施例】本発明に係るメタルマスクの一実施例を図１
および図２に基づき説明する。このメタルマスク１はマ
スク基板２にインキ・ぺースト通し用の透孔３を所望の
印刷パターンに対応させてパターンニング形成してい
る。例えば、被印刷物８として、その表裏両面に回路パ
ターン（図示せず）が印刷された、図２の（Ａ）に示す
ようなコンピューター用セラミック配線基板が挙げられ
るが、この配線基板には図２の（Ｂ）のように表裏両面
の回路パターンどうしを導通させるためのタングステン
やモリブデンなどの導電性ペーストＰが充填されるスル
ーホール９が所望パターンに形成されており、そのパタ
ーンに対応させて上記透孔３をマスク基板２にパターン
ニング形成する。その透孔３の断面形状はスキージかけ
面４側に向かって先拡がりの漏斗状となる形に形成し、
透孔３を囲む非透孔部５の印刷面６側にはカウンターシ
ンク７を形成したものである。FIG. 1 shows an embodiment of a metal mask according to the present invention.
And it demonstrates based on FIG. In this metal mask 1, through holes 3 for passing ink and paste are patterned on a mask substrate 2 in correspondence with a desired printing pattern. For example, as the printed material 8, there is a ceramic wiring board for computer as shown in FIG. 2A in which a circuit pattern (not shown) is printed on both front and back surfaces. (B), through holes 9 filled with a conductive paste P such as tungsten or molybdenum for electrically connecting the circuit patterns on the front and back sides are formed in a desired pattern, and the through pattern 9 is formed corresponding to the pattern. The through holes 3 are formed in the mask substrate 2 by patterning. The cross-sectional shape of the through hole 3 is formed in a funnel shape that is divergent toward the squeegee hanging surface 4 side.
A counter sink 7 is formed on the non-perforated portion 5 surrounding the through hole 3 on the printing surface 6 side.
【００１７】このような断面形状をもつメタルマスク１
は、例えば、図２の（Ａ）に示すように位置決めテーブ
ルＴ上の被印刷物８の表面上にスルーホール９と透孔３
とが合うように置かれ、スキージかけ面４にインキ・ぺ
ーストＰをのせ、スキージＳをかけてインキ・ぺースト
Ｐを透孔３内に誘い込み、スルーホール９に充填するの
である。このさい、透孔３はスキージかけ面４側に向か
って先拡がりの漏斗状に形成されているので、インキ・
ぺーストＰは透孔３内に導入しやすい。また、非透孔部
５の下面にカウンターシンク７を有するので、印刷時に
スキージＳによる押しつけ荷重が非透孔部５の印刷面８
側の周縁５ａのみに集中的に作用して被印刷物８の表面
との密着性を良好にするため、インキ・ぺーストＰのに
じみや非透孔部５の印刷面６側への回り込みを抑制し、
精度の高い印刷ができるに至った。A metal mask 1 having such a sectional shape
Is, for example, as shown in FIG. 2A, the through hole 9 and the through hole 3 are formed on the surface of the printing object 8 on the positioning table T.
The ink paste P is placed on the squeegee application surface 4, and the squeegee S is applied to guide the ink paste P into the through holes 3 to fill the through holes 9. At this time, since the through holes 3 are formed in a funnel shape that is expanded toward the squeegee hanging surface 4 side,
The paste P is easily introduced into the through hole 3. Further, since the counter sink 7 is provided on the lower surface of the non-permeable hole portion 5, the pressing load of the squeegee S is applied to the printing surface 8 of the non-permeable hole portion 5 during printing.
In order to improve the adhesion to the surface of the print object 8 by intensively acting only on the peripheral edge 5a on the side, the bleeding of the ink paste P and the wraparound of the non-permeable holes 5 to the printing surface 6 side are suppressed. Then
Highly accurate printing is now possible.
【００１８】非透孔部５のスキージかけ面４側にアール
Ｒをつける形に形成しておくと、スキージＳの先端の引
っ掛かりを防止し得てスムーズな摺動を可能とし、また
その摺動抵抗を減少し、スキージＳのへたりを少なくす
ることもできて好ましい。When the non-perforated portion 5 is formed in a shape having a radius R on the squeegee surface 4 side, the tip of the squeegee S can be prevented from being caught, and smooth sliding is possible, and the sliding It is preferable because the resistance can be reduced and the squeegee S can be less likely to settle.
【００１９】上記メタルマスク１は次のようにして電鋳
により製造することができる。まず、図３の（Ａ）に示
すようにステンレス鋼製の電鋳母型１０の表面にフィル
ム状または液状のフォトレジスト１１を用いて、例えば
５〜２５μの均一な膜を形成する。フォトレジスト１１
としては、例えば、東京応化工業株式会社製の「ＴＰＲ
−１０１ ＲＥＡ」を用いる。The metal mask 1 can be manufactured by electroforming as follows. First, as shown in FIG. 3 (A), a film-like or liquid photoresist 11 is used to form a uniform film of, for example, 5 to 25 μm on the surface of a stainless steel electroformed mold 10. Photoresist 11
For example, "TPR manufactured by Tokyo Ohka Kogyo Co., Ltd.
-101 REA "is used.
【００２０】次いで、同図の（Ｂ）に示すようにフォト
レジスト１１の上に所望のマスクパターンに相当するパ
ターンをもつフィルム１２を密着させ、紫外線ランプを
照射して焼き付け、現像、乾燥の各処理を行って、同図
の（Ｃ）に示すようにレジスト膜１３を形成する。Then, as shown in FIG. 3B, a film 12 having a pattern corresponding to a desired mask pattern is brought into close contact with the photoresist 11 and is irradiated with an ultraviolet lamp to be baked, developed and dried. By processing, a resist film 13 is formed as shown in FIG.
【００２１】次いで、電鋳母型１０をスルファミン酸ニ
ッケル浴などの電鋳槽に移し、ニッケル、あるいはニッ
ケルーコバルト合金で電鋳を行って、同図の（Ｄ）に示
すように電鋳母型１０のレジスト膜１３で覆われていな
い表面に、レジスト膜１３の厚さを越えて突出するごと
く７〜３０μ程度の高さで断面ほぼ円弧状のカウンター
シンク形成用電着層１４を形成する。Then, the electroforming mother die 10 is transferred to an electroforming tank such as a nickel sulfamate bath and electroformed with nickel or a nickel-cobalt alloy, and as shown in FIG. On the surface of the mold 10 not covered with the resist film 13, a counter sink forming electrodeposition layer 14 having a substantially arcuate cross section is formed with a height of about 7 to 30 μ so as to protrude beyond the thickness of the resist film 13. .
【００２２】次いで、そのカウンターシンク形成用電着
層１４の表面に剥離処理を施したうえで、２次電鋳を行
って同図の（Ｅ）に示すように非透孔部電着層１５（例
えば、５０〜１００μ厚）を形成する。このさい、ニッ
ケル電鋳浴中に光沢剤を添加することにより電鋳の成長
方向を縦横方向に制御できる。例えば、サッカリンなど
の第１種光沢剤を添加することにより横（厚み方向と直
交する方向）に広げることができて厚みが薄く、透孔３
のスキージかけ面側入口と印刷面側出口との比ａ：ｂ
（図１参照）を大きくとることができる。ブチンジオー
ルなどの第２種光沢剤を添加することにより縦（厚み方
向）に広げることができて厚みがあり、透孔３の前記比
を小さくすることができる。Next, the surface of the countersink-forming electrodeposited layer 14 is subjected to a peeling treatment, and then secondary electroforming is performed, so that the non-perforated portion electrodeposited layer 15 is formed as shown in FIG. (For example, 50 to 100 μm thick) is formed. At this time, the growth direction of electroforming can be controlled in the vertical and horizontal directions by adding a brightening agent to the nickel electroforming bath. For example, by adding a first-class brightening agent such as saccharin, it can be spread laterally (in a direction orthogonal to the thickness direction) and the thickness is small, and the through-hole 3
Ratio of the squeegee-side entrance and the printing-side exit a: b
(See FIG. 1) can be increased. By adding a second-type brightening agent such as butynediol, it is possible to expand in the vertical direction (thickness direction) to have a thickness, and the above ratio of the through holes 3 can be reduced.
【００２３】最後に、非透孔部電着層１５をカウンター
シンク形成用電着層１４から剥離することにより、同図
の（Ｆ）に示すようにスキージかけ面４側に向かって先
拡がりの漏斗状となる断面形状をもつ透孔３と、カウン
ターシンク７をもつ非透孔部５とを有するメタルマスク
１の電鋳製品を得る。Finally, the non-perforated portion electrodeposited layer 15 is peeled off from the countersink forming electrodeposited layer 14 so that it spreads toward the squeegee surface 4 as shown in FIG. An electroformed product of the metal mask 1 having a through hole 3 having a funnel-shaped cross-sectional shape and a non-through hole portion 5 having a counter sink 7 is obtained.
【００２４】上記カウンターシンク形成用電着層１４
は、図３の（Ｄ）に示すように、レジスト膜１３の厚さ
を越えて突出する断面ほぼ円弧状に形成されるため、イ
ンキ・ぺーストＰの誘い込みを容易にする断面漏斗状の
透孔３を容易に形成することができ、またカウンターシ
ンク形成用電着層１４の表面側に電着される非透孔部電
着層１５の下面にはカウンターシンク７が容易に形成さ
れる。カウンターシンク７の断面形状は図１に示すよう
ななべ形に代えて、例えば図４に示すような丸形に形成
することもできる。Electrodeposited layer 14 for forming the counter sink
As shown in FIG. 3D, since the cross section is formed in a substantially arcuate shape protruding beyond the thickness of the resist film 13, a transparent funnel-shaped cross section that facilitates the attraction of the ink paste P is formed. The holes 3 can be easily formed, and the counter sink 7 is easily formed on the lower surface of the non-permeable hole electrodeposition layer 15 electrodeposited on the surface side of the counter sink forming electrodeposition layer 14. The sectional shape of the counter sink 7 may be formed in a round shape as shown in FIG. 4, for example, instead of the pan shape shown in FIG.
【００２５】上記実施例ではメタルマスク１の非透孔部
電着層１５がニッケルまたはニッケルーコバルト合金の
単層で構成されるが、ニッケル・銅・ニッケルの三層で
非透孔部電着層１５を構成することもできる。図５の
（Ａ）〜（Ｈ）は非透孔部電着層１５がニッケル・銅・
ニッケルの三層からなるメタルマスク１を得る製造過程
の工程を示す。まず、上記実施例の場合と同様に図５の
（Ａ）に示すごとく電鋳母型１０の表面にフィルム状ま
たは液状のフォトレジスト１１を用いて均一な膜を形成
し、次いで、同図の（Ｂ）に示すようにフォトレジスト
１１の上に所望のマスクパターンに相当するパターンを
もつフィルム１２を密着させて焼き付け、現像、乾燥の
各処理を行って、同図の（Ｃ）に示すようにレジスト膜
１３を形成する。次いで、同図の（Ｄ）に示すようにニ
ッケル１次電鋳でカウンターシンク形成用電着層１４を
形成する。次いで、同図の（Ｅ）に示すようにカウンタ
ーシンク形成用電着層１４の表面に剥離処理を施したう
えで、ニッケル２次電鋳を行って２次電着層１６を形成
する。更に、同図の（Ｆ）に示すように２次電着層１６
の上に銅３次電鋳を行って３次電着層１７を形成する。
更に、同図の（Ｇ）に示すように３次電着層１７の上に
ニッケル４次電鋳を行って４次電着層１８を形成する。
最後に、２次・３次・４次電着層１６・１７・１８をカ
ウンターシンク形成用電着層１４から剥離することによ
り、同図の（Ｈ）に示すごとくカウンターシンク７を有
する非透孔部電着層１５がニッケル・銅・ニッケルの三
層からなる、というメタルマスク１を得る。In the above embodiment, the non-permeable portion electrodeposition layer 15 of the metal mask 1 is composed of a single layer of nickel or nickel-cobalt alloy, but the non-permeable portion electrodeposition is composed of three layers of nickel, copper and nickel. Layer 15 can also be constructed. In (A) to (H) of FIG. 5, the non-permeable portion electrodeposition layer 15 is made of nickel, copper, or
The steps of the manufacturing process for obtaining the metal mask 1 composed of three layers of nickel will be described. First, as in the case of the above embodiment, as shown in FIG. 5A, a uniform film is formed on the surface of the electroforming mother die 10 by using a film-like or liquid photoresist 11, and then, as shown in FIG. As shown in (B), a film 12 having a pattern corresponding to a desired mask pattern is closely adhered onto the photoresist 11 and baked, developed, and dried. As shown in (C) of FIG. A resist film 13 is formed on. Next, as shown in (D) of the same figure, a counter sink forming electrodeposition layer 14 is formed by nickel primary electroforming. Next, as shown in (E) of the same figure, after performing a peeling treatment on the surface of the countersink forming electrodeposition layer 14, nickel secondary electroforming is performed to form the secondary electrodeposition layer 16. Further, as shown in (F) of FIG.
Copper third electroforming is performed thereon to form a third electrodeposition layer 17.
Further, as shown in (G) of the same figure, the fourth electrodeposition layer 18 is formed on the third electrodeposition layer 17 by performing nickel fourth electroforming.
Finally, the secondary / tertiary / quaternary electrodeposited layers 16, 17 and 18 are peeled off from the countersink forming electrodeposited layer 14 to provide a non-transparent layer having the countersink 7 as shown in FIG. A metal mask 1 in which the hole electrodeposition layer 15 is composed of three layers of nickel, copper and nickel is obtained.
【００２６】この場合、図６に示すように銅のみを選択
的に腐食させるエッチング液により銅３次電着層１７の
印刷面６側に臨む一部を溶かして凹溝１９を形成する。
また、図７に示すようにその凹溝１９には四フッ化エチ
レンなどの撥水性物質２０を充填しておくと、非透孔部
５の印刷面６へのインキ・ぺーストＰの回り込みをより
効果的に防止できる。また、その撥水性物質２０に代え
て、発泡剤を混入した樹脂を充填した後加熱または紫外
線照射などで発泡させることもできる。In this case, as shown in FIG. 6, the concave groove 19 is formed by melting a part of the copper third electrodeposition layer 17 facing the printing surface 6 with an etching solution that selectively corrodes only copper.
Further, as shown in FIG. 7, when the concave groove 19 is filled with a water repellent substance 20 such as tetrafluoroethylene, the ink paste P is prevented from wrapping around around the printing surface 6 of the non-perforated hole portion 5. It can be prevented more effectively. Further, instead of the water-repellent substance 20, it is also possible to fill a resin mixed with a foaming agent and then foam the resin by heating or irradiation with ultraviolet rays.
【図１】メタルマスクの一部拡大断面図である。FIG. 1 is a partially enlarged sectional view of a metal mask.
【図２】メタルマスクの使用例を示す断面図である。FIG. 2 is a cross-sectional view showing a usage example of a metal mask.
【図３】メタルマスクの製造過程の工程説明図である。FIG. 3 is a process explanatory view of the manufacturing process of the metal mask.
【図４】他の実施例を示すメタルマスクの一部拡大断面
図である。FIG. 4 is a partially enlarged cross-sectional view of a metal mask showing another embodiment.
【図５】他の実施例を示すメタルマスクの製造過程の工
程説明図である。FIG. 5 is a process explanatory view of the manufacturing process of the metal mask showing another embodiment.
【図６】他の実施例を示すメタルマスクの一部拡大断面
図である。FIG. 6 is a partially enlarged sectional view of a metal mask showing another embodiment.
【図７】他の実施例を示すメタルマスクの一部拡大断面
図である。FIG. 7 is a partially enlarged cross-sectional view of a metal mask showing another embodiment.
【図８】従来例のメタルマスクの一部拡大断面図であ
る。FIG. 8 is a partially enlarged cross-sectional view of a conventional metal mask.
【図９】従来例のメタルマスクの製造過程の工程説明図
である。FIG. 9 is a process explanatory view of the manufacturing process of the conventional metal mask.
１ メタルマスク ２ マスク基板 ３ 透孔 ４ スキージかけ面 ５ 非透孔部 ６ 印刷面 ７ カウンターシンク １０ 電鋳母型 １３ レジスト膜 １４ カウンターシンク形成用電着層 １５ 非透孔部電着層 DESCRIPTION OF SYMBOLS 1 Metal mask 2 Mask substrate 3 Through hole 4 Squeegee surface 5 Non-permeable hole part 6 Printing surface 7 Counter sink 10 Electroforming mother mold 13 Resist film 14 Counter sink forming electrodeposition layer 15 Non-permeable part electrodeposition layer
フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｈ０５Ｋ 3/12 Ｄ 7511−4Ｅ Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display area H05K 3/12 D 7511-4E
Claims (2)
の透孔３を設けたメタルマスクにおいて、 透孔３の断面形状がスキージかけ面４側に向かって先拡
がりの漏斗状となる形に形成されており、 透孔３を囲む非透孔部５の印刷面６側にカウンターシン
ク７が形成されていることを特徴とするメタルマスク。1. A metal mask in which a through hole 3 for passing an ink / paste is provided in a mask substrate 2, wherein the through hole 3 has a cross-sectional shape that is a funnel shape that widens toward the squeegee surface 4 side. The metal mask is characterized in that a counter sink 7 is formed on the printing surface 6 side of the non-permeable hole portion 5 surrounding the through hole 3.
に相当するパターンをもつレジスト膜１３を形成する工
程と、 電鋳母型１０のレジスト膜１３で覆われていない表面
に、レジスト膜１３の厚さを越えて突出する断面ほぼ円
弧状のカウンターシンク形成用電着層１４を電着形成す
る工程と、 カウンターシンク形成用電着層１４の表面に剥離処理を
施したのち非透孔部電着層１５を電着形成する工程と、 非透孔部電着層１５をカウンターシンク形成用電着層１
４から剥離する工程とからなるメタルマスクの製造方
法。2. A step of forming a resist film 13 having a pattern corresponding to a mask pattern on the surface of the electroforming mother die 10, and a resist film on the surface of the electroforming mother die 10 not covered with the resist film 13. 13. A step of electrodepositing a countersink forming electrodeposition layer 14 having a substantially arcuate cross section protruding beyond the thickness of 13, and a non-permeable hole after the surface of the countersink forming electrodeposition layer 14 is subjected to a peeling treatment. The step of electrodepositing the partially electrodeposited layer 15, and the electrodeposited layer 1 for forming the non-perforated part electrodepositing layer 15
4. A method for manufacturing a metal mask, which comprises a step of peeling from 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21329992A JP3261471B2 (en) | 1992-07-16 | 1992-07-16 | Manufacturing method of metal mask |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21329992A JP3261471B2 (en) | 1992-07-16 | 1992-07-16 | Manufacturing method of metal mask |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0632078A true JPH0632078A (en) | 1994-02-08 |
| JP3261471B2 JP3261471B2 (en) | 2002-03-04 |
Family
ID=16636830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21329992A Expired - Lifetime JP3261471B2 (en) | 1992-07-16 | 1992-07-16 | Manufacturing method of metal mask |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3261471B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06210975A (en) * | 1993-01-19 | 1994-08-02 | Nakanuma Art Screen Kk | Metal printing plate |
| JPH0852856A (en) * | 1994-08-10 | 1996-02-27 | Kengo Hiruta | Screen printing machine |
| US6221228B1 (en) | 1997-12-03 | 2001-04-24 | Seiko Instruments Inc. | Part fabricating method and part fabricating apparatus |
| CN103207519A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A production process for a metal mask plate having a three-dimensional structure with a pattern opening |
| JP2017036471A (en) * | 2015-08-07 | 2017-02-16 | 大日本印刷株式会社 | Vapor deposition mask manufacturing method |
| WO2018096649A1 (en) * | 2016-11-25 | 2018-05-31 | 株式会社メイコー | Metal mask and manufacturing method for same |
| JP2018111322A (en) * | 2018-04-04 | 2018-07-19 | マクセルホールディングス株式会社 | Mask for printing |
-
1992
- 1992-07-16 JP JP21329992A patent/JP3261471B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06210975A (en) * | 1993-01-19 | 1994-08-02 | Nakanuma Art Screen Kk | Metal printing plate |
| JPH0852856A (en) * | 1994-08-10 | 1996-02-27 | Kengo Hiruta | Screen printing machine |
| US6221228B1 (en) | 1997-12-03 | 2001-04-24 | Seiko Instruments Inc. | Part fabricating method and part fabricating apparatus |
| CN103207519A (en) * | 2012-01-16 | 2013-07-17 | 昆山允升吉光电科技有限公司 | A production process for a metal mask plate having a three-dimensional structure with a pattern opening |
| JP2017036471A (en) * | 2015-08-07 | 2017-02-16 | 大日本印刷株式会社 | Vapor deposition mask manufacturing method |
| WO2018096649A1 (en) * | 2016-11-25 | 2018-05-31 | 株式会社メイコー | Metal mask and manufacturing method for same |
| JP2018111322A (en) * | 2018-04-04 | 2018-07-19 | マクセルホールディングス株式会社 | Mask for printing |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3261471B2 (en) | 2002-03-04 |
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