JPH06283343A - Manufacture of flyback transformer - Google Patents
Manufacture of flyback transformerInfo
- Publication number
- JPH06283343A JPH06283343A JP5066418A JP6641893A JPH06283343A JP H06283343 A JPH06283343 A JP H06283343A JP 5066418 A JP5066418 A JP 5066418A JP 6641893 A JP6641893 A JP 6641893A JP H06283343 A JPH06283343 A JP H06283343A
- Authority
- JP
- Japan
- Prior art keywords
- weight
- epoxy resin
- fbt
- parts
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、耐熱性の優れた注型用
エポキシ樹脂組成物を用いて絶縁処理することにより、
フライバックトランス（以下ＦＢＴと略す）を製造する
方法に関する。FIELD OF THE INVENTION The present invention provides an epoxy resin composition for casting which is excellent in heat resistance and is insulation-treated.
The present invention relates to a method for manufacturing a flyback transformer (hereinafter abbreviated as FBT).
【０００２】[0002]
【従来の技術】一般にテレビ受像機やディスプレイに用
いられるＦＢＴは、図１に示すように、プラスチック製
ボビン１に分割巻きした１次コイル２、プラスチック製
ボビン３に積層巻きした２次コイル４、１個以上の高圧
ダイオード５、高圧抵抗からなるフォーカスブロック６
(但し、高圧コンデンサーを含む場合もある)などを注型
樹脂組成物７で絶縁処理してケース８内に収納した構造
からなる。2. Description of the Related Art Generally, as shown in FIG. 1, an FBT used in a television receiver or a display has a primary coil 2 dividedly wound around a plastic bobbin 1, a secondary coil 4 laminatedly wound around a plastic bobbin 3, Focus block 6 consisting of one or more high-voltage diodes 5 and high-voltage resistors
(However, it may include a high-voltage capacitor) and the like, and is housed in a case 8 after being insulated with a casting resin composition 7.
【０００３】上記のように、ＦＢＴは熱膨張係数の異な
る構成部品からなるため、その注型樹脂硬化物はヒート
サイクルに対し、クラックおよび剥離を生じないことが
重要であり、かつ電気特性、耐熱性、難燃性および耐湿
性等の諸特性が必要であり、一方、絶縁の点から、液状
物である注型樹脂組成物はコイル間へ充分含浸する必要
がある。As described above, since FBT is composed of components having different thermal expansion coefficients, it is important that the cast resin cured product does not cause cracking and peeling during heat cycle, and the electrical characteristics and heat resistance are high. Various properties such as heat resistance, flame retardancy, and moisture resistance are required. On the other hand, from the viewpoint of insulation, it is necessary that the casting resin composition that is a liquid substance be sufficiently impregnated between the coils.
【０００４】したがって、上記諸特性のバランスのとれ
たエポキシ樹脂組成物が、一般に、ＦＢＴ用注型樹脂組
成物として使用されている。Therefore, an epoxy resin composition in which the above various properties are well balanced is generally used as a casting resin composition for FBT.
【０００５】近年、高電圧部品であるＦＢＴは、小型
化、高性能化が進み、そのために使用時における温度上
昇が約１０℃程度高くなるので、絶縁耐圧寿命の観点か
ら、これに用いるエポキシ樹脂硬化物の耐熱性を従来品
よりも１０℃以上向上させることが必要となり、かつ耐
ヒートサイクル性にも優れることが必須条件となった。In recent years, the FBT, which is a high voltage component, has been made smaller and has higher performance, and the temperature rise during use has been increased by about 10 ° C. Therefore, from the viewpoint of withstand voltage life, the epoxy resin used for this is used. It was necessary to improve the heat resistance of the cured product by 10 ° C or more as compared with the conventional product, and it was also an essential condition that the heat cycle resistance was excellent.
【０００６】一方、エポキシ樹脂を用いたＦＢＴの製造
法に関して、従来から、性能向上が次々と行なわれてき
たが、特定粒径水和アルミナ配合エポキシ樹脂組成物で
絶縁処理することによりコイル間への樹脂含浸性を向上
したＦＢＴの製造方法(特開昭６１−２６０６１３号公
報)、安定化赤リン難燃剤配合エポキシ樹脂組成物で絶
縁処理することにより電気特性を改良したＦＢＴの製造
法(特開平１−１５０３０９号公報)などに見られるよう
に、多くは初期の性能向上しかはかられていなかった。On the other hand, with respect to the method for producing an FBT using an epoxy resin, the performance has been improved one after another. However, insulation treatment with an epoxy resin composition containing a hydrated alumina having a specific particle size is performed to cause a gap between coils. Of the FBT with improved resin impregnation property (JP-A-61-260613), and a method of producing FBT with improved electrical characteristics by insulating treatment with a stabilized red phosphorus flame retardant-containing epoxy resin composition (special As disclosed in, for example, Kaihei 1-150309), most of them have only improved the initial performance.
【０００７】特に、エポキシ樹脂組成物の改良によるＦ
ＢＴの絶縁耐圧寿命向上に関するものは、現在も報告さ
れていない。In particular, F by improving the epoxy resin composition
No report has yet been made on the improvement of withstand voltage life of BT.
【０００８】[0008]
【発明が解決しようとする課題】上記必須条件を満たす
ＦＢＴを製造するために、硬化前の液状物であるエポキ
シ樹脂組成物がコイル間へ充分含浸するとともに、エポ
キシ樹脂硬化物のガラス転移温度(Ｔg)は１２０℃以上
必要であり、得られたＦＢＴの使用温度を現行(９５℃
〜１００℃)よりも１０℃高くした時、ＦＢＴは絶縁耐
圧寿命が現行ＦＢＴと同程度以上まで長く、１１０℃／
２時間と−５０℃／２時間のヒートサイクルを５０サイ
クル以上行なっても、コイルの絶縁に用いたエポキシ樹
脂硬化物にクラックの発生がなく、かつ部品との剥離が
起こらず、ＦＢＴとしての性能を充分に満足することが
課題であった。In order to produce an FBT satisfying the above essential requirements, the epoxy resin composition, which is a liquid material before curing, is sufficiently impregnated between the coils and the glass transition temperature of the cured epoxy resin ( Tg is required to be 120 ° C or higher, and the operating temperature of the obtained FBT is the current (95 ° C).
When the temperature of the FBT is higher than that of the current FBT by 10 ° C, the withstand voltage life of the FBT is as long as that of the current FBT or more.
Even if the heat cycle of 2 hours and −50 ° C./2 hours is performed for 50 cycles or more, the epoxy resin cured product used for the insulation of the coil does not have cracks and does not peel off from the parts, and the performance as an FBT. It was an issue to fully satisfy
【０００９】[0009]
【課題を解決するための手段】上記課題を解決するため
に、本発明者らが鋭意検討を重ねた結果、特定のエポキ
シ樹脂組成物を用いてＦＢＴを絶縁処理することによっ
て、上記課題を満たすＦＢＴが得られ、本発明に到達し
た。In order to solve the above-mentioned problems, the inventors of the present invention have conducted extensive studies, and as a result, the above-mentioned problems can be satisfied by insulating the FBT with a specific epoxy resin composition. The FBT was obtained and the present invention was reached.
【００１０】すなわち、本発明は、一般式(化４)That is, the present invention has the general formula (Formula 4)
【００１１】[0011]
【化４】 [Chemical 4]
【００１２】で示されるエピクロルヒドリン・ビスフェ
ノールＡ型エポキシ樹脂65〜82重量部と臭素化フェニル
モノグリシジルエーテルと臭素化クレジルモノグリシジ
ルエーテルとの混合物18〜35重量部との合計100重量部
(エポキシ化合物)に対し、三酸化アンチモン粉末5〜30
重量部、水和アルミナ粉末40〜100重量部、シリカ粉末3
0〜100重量部と、化学式(化５）A total of 100 parts by weight of 65 to 82 parts by weight of an epichlorohydrin-bisphenol A type epoxy resin represented by and 18 to 35 parts by weight of a mixture of brominated phenyl monoglycidyl ether and brominated cresyl monoglycidyl ether.
(Epoxy compound), antimony trioxide powder 5 ~ 30
Parts by weight, hydrated alumina powder 40 to 100 parts by weight, silica powder 3
0-100 parts by weight and chemical formula
【００１３】[0013]
【化５】 [Chemical 5]
【００１４】で示されるグリセロールトリス（アンヒド
ロトリメリテート)と水添無水フタル酸との混合物(酸無
水物硬化剤)と硬化促進剤とからなるエポキシ樹脂組成
物を用いて絶縁処理することを特徴とするＦＢＴの製造
方法に関する(但し、上記式中、ｎ＝０〜２、エポキシ
当量＝１８５〜１９５)。Insulation treatment is carried out using an epoxy resin composition comprising a mixture of glycerol tris (anhydro trimellitate) and hydrogenated phthalic anhydride (an acid anhydride curing agent) and a curing accelerator represented by The present invention relates to a method for producing a characteristic FBT (however, in the above formula, n = 0 to 2, epoxy equivalent = 185 to 195).
【００１５】本発明に用いる上記エピクロルヒドリン・
ビスフェノールＡ型エポキシ樹脂の配合量は65〜82重量
部が良く、65重量部より少ないと樹脂硬化物の耐ヒート
サイクル性が低下し、82重量部より多いと樹脂組成物の
粘度が高くなりコイル含浸性が低下し、電気特性が不十
分となり、ＦＢＴの性能を満足しない。The above-mentioned epichlorohydrin used in the present invention
The amount of the bisphenol A type epoxy resin blended is preferably 65 to 82 parts by weight, and if it is less than 65 parts by weight, the heat cycle resistance of the cured resin decreases, and if it exceeds 82 parts by weight, the viscosity of the resin composition increases and the coil The impregnating property is deteriorated, the electric characteristics become insufficient, and the performance of FBT is not satisfied.
【００１６】上記臭素化フェニルモノグリシジルエーテ
ルと臭素化クレジルモノグリシジルエーテルとの混合物
の配合量は18〜35重量部が良く、18重量部より少ないと
樹脂組成物の粘度が高くなりコイル含浸性が低下し、電
気特性が不十分となるだけでなく、樹脂硬化物の難燃性
が不十分で、35重量部より多いと樹脂硬化物の耐ヒート
サイクル性が低下し、ＦＢＴの性能を満足しない。The blending amount of the above-mentioned brominated phenyl monoglycidyl ether and brominated cresyl monoglycidyl ether is preferably 18 to 35 parts by weight. If it is less than 18 parts by weight, the viscosity of the resin composition will be high and the coil impregnability will be high. In addition to the deterioration of the electrical properties, the flame retardancy of the resin cured product is insufficient. If it is more than 35 parts by weight, the heat cycle resistance of the resin cured product is reduced and the performance of FBT is not satisfied. .
【００１７】上記三酸化アンチモン粉末の配合量は、上
記エポキシ化合物の合計100重量部に対し、5〜30重量部
が良く、5重量部より少ないと樹脂硬化物の難燃性が不
十分で、30重量部より多いと樹脂組成物の粘度が高くな
りコイル含浸性が低下し、電気特性が不十分となり、Ｆ
ＢＴの性能を満足しない。The amount of the antimony trioxide powder blended is preferably 5 to 30 parts by weight with respect to 100 parts by weight of the total amount of the epoxy compounds. If it is less than 5 parts by weight, the flame retardancy of the cured resin is insufficient. If the amount is more than 30 parts by weight, the viscosity of the resin composition becomes high and the coil impregnating property is deteriorated, resulting in insufficient electric characteristics.
The performance of BT is not satisfied.
【００１８】上記水和アルミナ粉末の配合量は、上記エ
ポキシ化合物の合計100重量部に対し、40〜100重量部が
良く、40重量部より少ないと樹脂硬化物の難燃性が不十
分で、100重量部より多いと樹脂組成物の粘度が高くな
りコイル含浸性が低下し、電気特性が不十分となり、Ｆ
ＢＴの性能を満足しない。The amount of the hydrated alumina powder blended is preferably 40 to 100 parts by weight per 100 parts by weight of the epoxy compound. If it is less than 40 parts by weight, the flame retardancy of the cured resin is insufficient, If the amount is more than 100 parts by weight, the viscosity of the resin composition becomes high, the coil impregnating property is deteriorated, and the electrical characteristics become insufficient.
The performance of BT is not satisfied.
【００１９】上記シリカ粉末の配合量は、上記エポキシ
化合物の合計100重量部に対し、30〜100重量部が良く、
30重量部より少ないと樹脂組成物の硬化時における熱伝
導性が低下し樹脂硬化物の耐ヒートサイクル性が不十分
となり、100重量部より多いと、樹脂組成物の粘度が高
くなりコイル含浸性が低下し、電気特性が不十分とな
り、ＦＢＴの性能を満足しない。The content of the silica powder is preferably 30 to 100 parts by weight based on 100 parts by weight of the total of the epoxy compounds.
If it is less than 30 parts by weight, the thermal conductivity at the time of curing the resin composition is lowered and the heat cycle resistance of the cured resin becomes insufficient, and if it is more than 100 parts by weight, the viscosity of the resin composition becomes high and the coil impregnability Deteriorates, the electric characteristics become insufficient, and the performance of the FBT is not satisfied.
【００２０】上記グリセロールトリス(アンヒドロトリ
メリテート)と水添無水フタル酸との混合物(酸無水物硬
化剤)は、樹脂組成物を化学反応させて樹脂硬化物に変
えＦＢＴの性能を発揮させるために必須の成分であり、
また、硬化促進剤は、上記化学反応を促進するために必
要な成分である。The mixture of glycerol tris (anhydro trimellitate) and hydrogenated phthalic anhydride (an acid anhydride curing agent) chemically reacts the resin composition to convert it into a resin cured product and exhibits the performance of FBT. Is an essential ingredient for
Further, the curing accelerator is a component necessary to accelerate the above chemical reaction.
【００２１】特に、上記グリセロールトリス(アンヒド
ロトリメリテート)は耐熱性樹脂硬化物を与える成分で
あるが、常温で固体であるために、作業性の点から、耐
熱性を低下させない水添無水フタル酸を混合した液状化
成分が特に良い。In particular, the glycerol tris (anhydrotrimellitate) is a component that gives a cured product of a heat resistant resin, but since it is a solid at room temperature, it is a hydrogenated anhydrous product that does not lower the heat resistance from the viewpoint of workability. A liquefied component mixed with phthalic acid is particularly preferable.
【００２２】上記エポキシ樹脂組成物において、上記酸
無水物硬化剤の配合量は特に限定するものではないが、
樹脂組成物の硬化性を一層向上するには、上記エポキシ
化合物１エポキシ当量あたり酸無水物０.７当量以上の
割合が特に良く、また、樹脂硬化物の耐湿性を一層向上
するには、上記エポキシ化合物１エポキシ当量あたり酸
無水物１.２当量以下の割合が特に良い。In the above epoxy resin composition, the compounding amount of the above acid anhydride curing agent is not particularly limited,
In order to further improve the curability of the resin composition, the ratio of the acid anhydride of 0.7 equivalent or more per 1 epoxy equivalent of the epoxy compound is particularly preferable, and in order to further improve the moisture resistance of the resin cured product, Epoxy compound A ratio of 1.2 equivalents or less of acid anhydride per epoxy equivalent is particularly preferable.
【００２３】すなわち、上記エポキシ樹脂組成物におい
て、上記酸無水物硬化剤の配合量は特に限定するもので
はないが、上記エポキシ化合物１エポキシ当量あたり酸
無水物０.７〜１.２当量の割合の時に、一層電気特性が
向上し、ＦＢＴの性能が一層良くなる。That is, in the epoxy resin composition, the compounding amount of the acid anhydride curing agent is not particularly limited, but the ratio of the acid anhydride is 0.7 to 1.2 equivalents per 1 epoxy equivalent of the epoxy compound. At that time, the electric characteristics are further improved and the performance of the FBT is further improved.
【００２４】上記酸無水物硬化剤において、水添無水フ
タル酸成分は特に限定するものではないが、グリセロー
ルトリス(アンヒドロトリメリテート)を良く溶解し、樹
脂組成物の粘度を低くし、樹脂硬化物の耐熱性を維持す
るには、メチルヘキサヒドロ無水フタル酸とヘキサヒド
ロ無水フタル酸との混合成分が一層有効である。In the above acid anhydride curing agent, the hydrogenated phthalic anhydride component is not particularly limited, but it dissolves glycerol tris (anhydrotrimellitate) well, lowers the viscosity of the resin composition, and A mixed component of methylhexahydrophthalic anhydride and hexahydrophthalic anhydride is more effective for maintaining the heat resistance of the cured product.
【００２５】さらに、上記酸無水物硬化剤においてその
組成は特に限定するものではないが、樹脂硬化物の耐熱
性を一層向上するには、グリセロールトリス(アンヒド
ロトリメリテート)とメチルヘキサヒドロ無水フタル酸
とヘキサヒドロ無水フタル酸との混合物中におけるグリ
セロールトリス(アンヒドロトリメリテート)の含有量が
2重量％以上の割合が特に良く、また樹脂組成物の粘度
を低くしコイル含浸性を一層良くするにはグリセロール
トリス(アンヒドロトリメリテート)の含有量が50重量％
以下の割合が特に良い。Further, the composition of the acid anhydride curing agent is not particularly limited, but in order to further improve the heat resistance of the resin cured product, glycerol tris (anhydrotrimellitate) and methylhexahydroanhydride are required. The content of glycerol tris (anhydrotrimellitate) in the mixture of phthalic acid and hexahydrophthalic anhydride
A ratio of 2% by weight or more is particularly preferable, and in order to lower the viscosity of the resin composition and improve the coil impregnation property, the content of glycerol tris (anhydrotrimellitate) is 50% by weight.
The following ratios are particularly good.
【００２６】すなわち、上記酸無水物硬化剤においてそ
の組成は特に限定するものではないが、グリセロールト
リス(アンヒドロトリメリテート)とメチルヘキサヒドロ
無水フタル酸とヘキサヒドロ無水フタル酸との混合物中
におけるグリセロールトリス(アンヒドロトリメリテー
ト)の含有量が2〜50重量％の割合の時に、一層耐熱性と
電気特性が向上し、ＦＢＴの性能が一層良くなる。That is, the composition of the above acid anhydride curing agent is not particularly limited, but glycerol tris (anhydrotrimellitate), methylhexahydrophthalic anhydride and hexahydrophthalic anhydride in a mixture of glycerol are mixed. When the content of tris (anhydrotrimellitate) is 2 to 50% by weight, the heat resistance and electric characteristics are further improved and the performance of FBT is further improved.
【００２７】また、メチルヘキサヒドロ無水フタル酸と
ヘキサヒドロ無水フタル酸との混合物の代わりにメチル
テトラヒドロ無水フタル酸を用いてもＦＢＴの性能を満
足する。Also, the performance of FBT can be satisfied by using methyltetrahydrophthalic anhydride instead of the mixture of methylhexahydrophthalic anhydride and hexahydrophthalic anhydride.
【００２８】すなわち、上記同様に、酸無水物硬化剤に
おいて、グリセロールトリス(アンヒドロトリメリテー
ト)とメチルテトラヒドロ無水フタル酸との混合物中に
おけるグリセロールトリス(アンヒドロトリメリテート)
の含有量が2〜50重量％の割合の時に、一層耐熱性と電
気特性が向上し、ＦＢＴの性能が一層良くなる。That is, as in the above, in the acid anhydride curing agent, glycerol tris (anhydrotrimellitate) in a mixture of glycerol tris (anhydrotrimellitate) and methyltetrahydrophthalic anhydride.
When the content of is 2 to 50% by weight, the heat resistance and electric characteristics are further improved and the performance of the FBT is further improved.
【００２９】一般式(化６)General formula (Formula 6)
【００３０】[0030]
【化６】 [Chemical 6]
【００３１】で示されるフェニルジグリシジルエーテル
型エポキシ樹脂は、樹脂硬化物の耐熱性を一層向上させ
る成分であり、これを配合したエポキシ樹脂組成物を用
いて絶縁処理することにより、一層高性能なＦＢＴを製
造できる(但し、上記式中、ｎ＝０〜２、有機基Ｒ1、Ｒ
2、Ｒ3、Ｒ4＝ＣmＨ2m+1、ｍ＝０〜１０)。The phenyl diglycidyl ether type epoxy resin represented by is a component that further improves the heat resistance of the cured resin, and by performing insulation treatment using an epoxy resin composition containing this, a higher performance is obtained. FBT can be produced (however, in the above formula, n = 0 to 2, organic groups R 1 , R 2
2, R 3, R 4 = C m H 2m + 1, m = 0~10).
【００３２】上記エピクロルヒドリン・ビスフェノール
Ａ型エポキシ樹脂成分は単独に用いても良いが、樹脂硬
化物の耐熱性を一層向上させるには、上記フェニルジグ
リシジルエーテル型エポキシ樹脂20重量％以上含有する
時に特に良く、また、樹脂硬化物の耐ヒートサイクル性
を充分満足させるには、上記フェニルジグリシジルエー
テル型エポキシ樹脂が80重量％以下の時に良い。The above epichlorohydrin / bisphenol A type epoxy resin component may be used alone, but in order to further improve the heat resistance of the cured resin product, it is particularly necessary to add 20% by weight or more of the above phenyl diglycidyl ether type epoxy resin. In addition, in order to sufficiently satisfy the heat cycle resistance of the cured resin product, the above phenyl diglycidyl ether type epoxy resin is preferably 80% by weight or less.
【００３３】すなわち、上記エピクロルヒドリン・ビス
フェノールＡ型エポキシ樹脂成分中に上記フェニルジグ
リシジルエーテル型エポキシ樹脂が20〜80重量％含有す
る時に、一層樹脂硬化物の耐熱性を向上し耐ヒートサイ
クル性を充分満足でき、ＦＢＴの性能が一層良くなる。That is, when the phenyldiglycidyl ether type epoxy resin is contained in the epichlorohydrin / bisphenol A type epoxy resin component in an amount of 20 to 80% by weight, the heat resistance of the cured resin is further improved and the heat cycle resistance is sufficiently improved. It is satisfactory and the performance of the FBT is even better.
【００３４】さらに、上記エピクロルヒドリン・ビスフ
ェノールＡ型エポキシ樹脂成分が、上記フェニルジグリ
シジルエーテル型エポキシ樹脂20〜80重量％を含有する
成分であり、かつ、上記酸無水物硬化剤がメチルテトラ
ヒドロ無水フタル酸の単一成分であるエポキシ樹脂組成
物を用いて絶縁処理することによっても、高性能なＦＢ
Ｔを製造できる。但し、上記エピクロルヒドリン・ビス
フェノールＡ型エポキシ樹脂において、上記フェニルジ
グリシジルエーテル型エポキシ樹脂成分含有量が20重量
％未満の時には耐熱性が不十分であり、80重量％を越え
ると耐ヒートサイクル性が不十分となる。Further, the epichlorohydrin / bisphenol A type epoxy resin component is a component containing 20 to 80% by weight of the phenyl diglycidyl ether type epoxy resin, and the acid anhydride curing agent is methyltetrahydrophthalic anhydride. High-performance FB can also be obtained by performing insulation treatment using an epoxy resin composition that is a single component of
T can be manufactured. However, in the above epichlorohydrin-bisphenol A type epoxy resin, when the content of the above phenyldiglycidyl ether type epoxy resin component is less than 20% by weight, heat resistance is insufficient, and when it exceeds 80% by weight, heat cycle resistance is poor. Will be enough.
【００３５】上記硬化促進剤は特に限定するものではな
いが、特に、樹脂組成物の可使時間が長く、硬化反応が
速く、樹脂硬化物の耐熱性を一層向上するには、２−エ
チル−４−メチルイミダゾール、１−シアノエチル−２
−エチル−４−メチルイミダゾール等のイミダゾール系
化合物が有効である。The above-mentioned curing accelerator is not particularly limited, but in particular, in order to further improve the heat resistance of the resin cured product by prolonging the pot life of the resin composition, the curing reaction is fast, and 2-ethyl- 4-methylimidazole, 1-cyanoethyl-2
Imidazole compounds such as -ethyl-4-methylimidazole are effective.
【００３６】上記硬化促進剤の配合量は特に限定するも
のではないが、特に、硬化反応の促進とＦＢＴの一層の
性能向上のためには、上記エポキシ化合物の合計100重
量部に対し、上記イミダゾール系硬化促進剤の配合量は
0.1重量部以上が良く、また10重量部より多くても効果
は変わらない。The compounding amount of the above curing accelerator is not particularly limited, but in particular, in order to accelerate the curing reaction and further improve the performance of the FBT, the above imidazole is added to 100 parts by weight of the total amount of the above epoxy compound. The compounding amount of the system hardening accelerator is
0.1 parts by weight or more is preferable, and even if it is more than 10 parts by weight, the effect does not change.
【００３７】すなわち、上記エポキシ化合物の合計100
重量部に対し、上記イミダゾール系硬化促進剤を0.1〜1
0重量部配合する時に、樹脂組成物の可使時間が長く、
硬化反応が速く、樹脂硬化物の耐熱性を一層向上でき、
ＦＢＴの性能が一層向上する。That is, the total of the above epoxy compounds is 100
0.1 to 1 parts by weight of the above imidazole-based curing accelerator with respect to parts by weight.
When compounding 0 parts by weight, the pot life of the resin composition is long,
The curing reaction is fast, and the heat resistance of the cured resin can be further improved.
The performance of the FBT is further improved.
【００３８】上記シランカップリング剤は樹脂組成物に
配合しなくても良いが、特に、エポキシ樹脂、無機充填
剤(水和アルミナ、三酸化アンチモン、シリカなど)およ
びＦＢＴ構成部品(ボビン、コイル、ダイオードなど)と
の接着を一層促進させるためには、γ−グリシドキシプ
ロピルトリメトキシシラン等のエポキシ基を有するシラ
ンカップリング剤を配合することにより有効である。The above silane coupling agent need not be compounded in the resin composition, but in particular, epoxy resin, inorganic filler (hydrated alumina, antimony trioxide, silica, etc.) and FBT component (bobbin, coil, In order to further promote the adhesion to (diode, etc.), it is effective to add a silane coupling agent having an epoxy group such as γ-glycidoxypropyltrimethoxysilane.
【００３９】接着促進効果をあげるためには、上記シラ
ンカップリング剤の配合量は、上記エポキシ化合物の合
計100重量部に対し、0.1重量部以上が良く、また10重量
部より多くても効果は変わらない。In order to enhance the adhesion promoting effect, the compounding amount of the silane coupling agent is preferably 0.1 part by weight or more, and more than 10 parts by weight, based on 100 parts by weight of the epoxy compound in total. does not change.
【００４０】すなわち、上記エポキシ化合物の合計100
重量部に対し、上記シランカップリング剤0.1〜10重量
部配合する時に、エポキシ樹脂、無機充填剤およびＦＢ
Ｔ構成部品との接着を一層促進し、ＦＢＴの性能が一層
向上する。That is, the total of the above epoxy compounds is 100
When 0.1 to 10 parts by weight of the above-mentioned silane coupling agent is added to the parts by weight, epoxy resin, inorganic filler and FB
Adhesion with the T component is further promoted, and the performance of the FBT is further improved.
【００４１】[0041]
【作用】本発明に係るエポキシ樹脂組成物は、耐熱性樹
脂硬化物を与える特定の化学構造の酸無水物硬化剤(上
記の化学式２)を配合した組成物である。The epoxy resin composition according to the present invention is a composition containing an acid anhydride curing agent having a specific chemical structure (chemical formula 2 above) that gives a cured product of a heat resistant resin.
【００４２】上記注型用エポキシ樹脂組成物を用いてＦ
ＢＴを絶縁処理することにより、樹脂硬化物のガラス転
移温度(Ｔｇ)が１２０℃以上であり、得られたＦＢＴの
使用温度を現行(９５℃〜１００℃)よりも１０℃高くし
た時、ＦＢＴは絶縁耐圧寿命が現行ＦＢＴと同程度以上
まで長く、他の特性(耐ヒートサイクル性、含浸性等の
諸特性)も充分満足し、高性能である。Using the above casting epoxy resin composition, F
By insulating the BT, the glass transition temperature (Tg) of the resin cured product is 120 ° C or higher, and when the operating temperature of the obtained FBT is 10 ° C higher than the current temperature (95 ° C to 100 ° C), the FBT is Has a high withstand voltage as long as the current FBT or more, and other characteristics (characteristics such as heat cycle resistance and impregnation) are fully satisfied and it has high performance.
【００４３】[0043]
【実施例】以下、本発明を実施例に基づき詳細に説明す
るが、本発明はこれに限定されるものではない。EXAMPLES The present invention will now be described in detail based on examples, but the present invention is not limited thereto.
【００４４】実施例および比較例においては、上記の式
(化１、化２および化３)で示されるエポキシ樹脂組成物
の３成分をそれぞれ略称で示した。In Examples and Comparative Examples, the above formula
The three components of the epoxy resin composition represented by (Chemical formula 1, Chemical formula 2 and Chemical formula 3) are abbreviated respectively.
【００４５】略称の意味は次のとおりである。The abbreviations have the following meanings.
【００４６】イ．一般式(化７)B. General formula (Formula 7)
【００４７】[0047]
【化７】 [Chemical 7]
【００４８】で示されるエピクロルヒドリン・ビスフェ
ノールＡ型エポキシ樹脂として、次の化合物を用いた。The following compounds were used as the epichlorohydrin-bisphenol A type epoxy resin represented by:
【００４９】略称ＥＰＸ(エポキシ当量１９０) ロ．化学式(化８)Abbreviation EPX (epoxy equivalent 190) b. Chemical formula
【００５０】[0050]
【化８】 [Chemical 8]
【００５１】で示される新日本理化社製グリセロールト
リス(アンヒドロトリメリテート)を略称でＧＴＭとす
る。Glycerol tris (anhydrotrimellitate) manufactured by Shin Nippon Rika Co., Ltd. is abbreviated as GTM.
【００５２】ハ．一般式(化９)C. General formula (Formula 9)
【００５３】[0053]
【化９】 [Chemical 9]
【００５４】で示されるフェニルジグリシジルエーテル
型エポキシ樹脂として、次の２種類の化合物を用いた。The following two types of compounds were used as the phenyl diglycidyl ether type epoxy resin represented by:
【００５５】略称ＭＰＤＧＥ(化１０、エポキシ当量１
４１)Abbreviation MPDGE (Chemical formula 10, epoxy equivalent 1
41)
【００５６】[0056]
【化１０】 [Chemical 10]
【００５７】略称ＰＤＧＥ(化１１、エポキシ当量１１
９）Abbreviation PDGE (chemical formula 11, epoxy equivalent 11
9)
【００５８】[0058]
【化１１】 [Chemical 11]
【００５９】その他、次の成分も略称で示した。In addition, the following components are also abbreviated.
【００６０】ニ．臭素化フェニルモノグリシジルエーテ
ルと臭素化クレジルモノグリシジルエーテルとの混合物
として、ジブロモフェニルモノグリシジルエーテルとジ
ブロモクレジルモノグリシジルエーテルとの混合物（重
量比でほぼ７：３)を主成分としたマナック社製市販品
のＥＢ−２００Ｂを用いた。D. As a mixture of brominated phenyl monoglycidyl ether and brominated cresyl monoglycidyl ether, commercially available from Manac Co., which is mainly composed of a mixture of dibromophenyl monoglycidyl ether and dibromocresyl monoglycidyl ether (weight ratio about 7: 3). The product EB-200B was used.
【００６１】略称ＥＢ−２００Ｂ(臭素含有量５１％、
エポキシ当量３２６) ホ．メチルヘキサヒドロ無水フタル酸：略称Ｍｅ−ＨＨ
ＰＡ ヘ．ヘキサヒドロ無水フタル酸：略称ＨＨＰＡ ト．メチルテトラヒドロ無水フタル酸：略称Ｍｅ−ＴＨ
ＰＡ チ．硬化促進剤の１−シアノエチル−２−エチル−４−
メチルイミダゾール：略称２Ｅ４ＭＺ−ＣＮ(四国化成
工業社製市販品) リ．シランカップリング剤のγ−グリシドキシプロピル
トリメトキシシラン：略称ＫＢＭ４０３(信越化学工業
社製市販品) また、用いた無機充填剤の平均粒子径は次のとおりであ
る。Abbreviation EB-200B (bromine content 51%,
Epoxy equivalent 326) E. Methylhexahydrophthalic anhydride: Abbreviation Me-HH
PA F. Hexahydrophthalic anhydride: Abbreviation HHPA. Methyltetrahydrophthalic anhydride: Abbreviation Me-TH
PA H. 1-Cyanoethyl-2-ethyl-4-curing accelerator
Methylimidazole: Abbreviation 2E4MZ-CN (commercially available product of Shikoku Chemicals Co., Ltd.) Γ-Glycidoxypropyltrimethoxysilane as a silane coupling agent: Abbreviation KBM403 (commercially available from Shin-Etsu Chemical Co., Ltd.) The average particle diameter of the inorganic filler used is as follows.
【００６２】 三酸化アンチモン粉末：０．５μｍ 水和アルミナ粉末 ：８μｍ シリカ粉末 ：１３．４μｍ ＦＢＴは、液状のエポキシ樹脂組成物を１．３〜２．６
ｋＰａで真空注入後に、１００℃／３時間＋１３０℃／
３時間の硬化条件にて硬化させ、絶縁処理品として製造
した。Antimony trioxide powder: 0.5 μm Hydrated alumina powder: 8 μm Silica powder: 13.4 μm FBT is a liquid epoxy resin composition of 1.3 to 2.6.
After vacuum injection at kPa, 100 ℃ / 3 hours + 130 ℃ /
It was cured under the curing condition for 3 hours to produce an insulation-treated product.
【００６３】エポキシ樹脂硬化物および樹脂硬化により
絶縁処理したＦＢＴの特性評価を次のように行なった。The characteristics of the epoxy resin cured product and FBT insulation-treated by resin curing were evaluated as follows.
【００６４】(１)樹脂硬化物のガラス転移温度Ｔｇ(℃)
は示差走査熱量計(ＤＳＣ)によって測定した。(1) Glass transition temperature Tg (° C.) of cured resin
Was measured by a differential scanning calorimeter (DSC).
【００６５】120℃以上のＴｇを有する樹脂硬化物は良
好であり、120℃未満のＴｇを有するものは不良であ
る。A resin cured product having a Tg of 120 ° C. or higher is good, and a resin cured product having a Tg of less than 120 ° C. is bad.
【００６６】(２)ＦＢＴの耐ヒートサイクル性は、絶縁
処理後の初期動作特性が良好なＦＢＴについて１１０℃
／２時間と−５０℃／２時間のヒートサイクルを６０サ
イクル行なった後、ＦＢＴの動作特性を検討し、実用性
の合否を判定する。(2) The heat cycle resistance of the FBT is 110 ° C. for the FBT having good initial operation characteristics after insulation treatment.
After 60 heat cycles of / 2 hours and -50 [deg.] C./2 hours, the operating characteristics of the FBT are examined to determine whether the practicability is acceptable or not.
【００６７】(３)ＦＢＴの含浸性は、絶縁処理後のＦＢ
Ｔを切断、研磨し、顕微鏡観察(約８０倍)で内部のボイ
ドの有無を確認した。ボイド無しを良好、ボイド有りを
不良とした。(3) The impregnating property of FBT is FB after insulation treatment.
T was cut and polished, and the presence or absence of internal voids was confirmed by microscopic observation (about 80 times). The absence of voids was rated as good, and the presence of voids was rated as bad.
【００６８】(４)樹脂硬化物の難燃性はＵＬ規格に準
じ、大きさが127mm×12.7mm×1.6mmの試験片を用いて、
評価した。(4) The flame retardance of the cured resin product complies with UL standards, and a test piece measuring 127 mm × 12.7 mm × 1.6 mm is used.
evaluated.
【００６９】絶縁処理したＦＢＴの難燃性は、電気用品
取締法に準じ評価した。The flame retardancy of the insulation-treated FBT was evaluated according to the Electrical Appliance and Material Control Law.
【００７０】樹脂硬化物の難燃性がＵＬ９４Ｖ−０に相
当、かつＦＢＴの難燃性が電気用品取締法合格相当の時
に「○」、それ以外の時には「×」とした。When the flame retardancy of the resin cured product was equivalent to UL94V-0 and the flame retardancy of the FBT was equivalent to passing the Electrical Appliance and Material Control Law, it was marked with "O", and otherwise it was marked with "X".
【００７１】(５)樹脂硬化物の耐湿性は、その試験片を
60℃、95％ＲＨの雰囲気に1000時間放置し、ＪＩＳ Ｋ
６９１１に準じて25℃、10ｋＨｚで比誘電率、誘電正接
および吸水率を求めた。(5) Moisture resistance of the resin cured product
Leave it in an atmosphere of 60 ° C and 95% RH for 1000 hours, then use JIS K
According to 6911, the relative permittivity, dielectric loss tangent and water absorption were determined at 25 ° C. and 10 kHz.
【００７２】比誘電率が4.5以下、誘電正接が2.5％以
下、かつ、吸水率が1％以下の時に、樹脂硬化物の耐湿
性が良好で「○」、それ以外の時には不良で「×」とし
た。When the relative permittivity is 4.5 or less, the dielectric loss tangent is 2.5% or less, and the water absorption rate is 1% or less, the moisture resistance of the cured resin product is good, and "○" is obtained. And
【００７３】(６)樹脂硬化物の接着性は、ボビン、ケー
ス材の一つであるポリブチレンテレフタレート(ＰＢＴ)
を選び、大きさ12mm×12mm×3mmの板(ＰＢＴ板)を接着
面積１cm2のアルミニウム棒同志の間にはさみ、アルミ
ニウム棒とＰＢＴ板との間の接着層約50μmに液状のエ
ポキシ樹脂組成物を付着、上記条件で加熱硬化して接着
試料とし、25℃でアルミニウム棒同志の引張り試験によ
り求めた。(6) The adhesiveness of the resin cured product is bobbin, which is one of the case materials, polybutylene terephthalate (PBT).
And a plate (PBT plate) having a size of 12 mm × 12 mm × 3 mm is sandwiched between aluminum rods having an adhesion area of 1 cm 2 and a liquid epoxy resin composition is formed in an adhesive layer of about 50 μm between the aluminum rod and the PBT plate. Was adhered and cured by heating under the above conditions to obtain an adhered sample, which was obtained by a tensile test of aluminum rods at 25 ° C.
【００７４】引張り試験後に破断面を観察し、いずれの
試料も樹脂硬化物とＰＢＴ板との間が剥離することを確
かめた。The fracture surface was observed after the tensile test, and it was confirmed that the cured resin and the PBT plate were peeled off from each other in all the samples.
【００７５】(６)ツイスト線の耐電圧保持率は、耐熱ウ
レタン樹脂被覆銅線(線径φ0.45mm、皮膜厚15μｍ)のツ
イストペアを、エポキシ樹脂組成物中に埋込み、上記条
件で硬化(電圧印加部分のみを空気中に開放)した試料を
作製し、150℃／30dayの期間放置し、初期耐電圧の保持
率として求めた。(6) The withstand voltage holding ratio of the twisted wire is such that a twisted pair of heat-resistant urethane resin-coated copper wire (wire diameter φ0.45 mm, film thickness 15 μm) is embedded in an epoxy resin composition and cured under the above conditions (voltage A sample in which only the applied portion was opened to the air was prepared, left for a period of 150 ° C./30 days, and the retention rate of the initial withstand voltage was obtained.
【００７６】さらに、後述するが、１.５ｋＶＡＣで絶
縁破壊する温度と時間との関係を求める時にも、上記の
ように作製したツイストペア試料を用いた。Further, as will be described later, the twisted pair sample prepared as described above was used also when determining the relationship between the temperature and the time at which dielectric breakdown occurred at 1.5 kVAC.
【００７７】表１〜表６に実施例、表７〜表９に比較例
をそれぞれ示した。Examples are shown in Tables 1 to 6 and comparative examples are shown in Tables 7 to 9.
【００７８】[0078]
【表１】 [Table 1]
【００７９】[0079]
【表２】 [Table 2]
【００８０】[0080]
【表３】 [Table 3]
【００８１】[0081]
【表４】 [Table 4]
【００８２】[0082]
【表５】 [Table 5]
【００８３】[0083]
【表６】 [Table 6]
【００８４】[0084]
【表７】 [Table 7]
【００８５】[0085]
【表８】 [Table 8]
【００８６】[0086]
【表９】 [Table 9]
【００８７】実施例の樹脂組成Ｎｏ．のものについて組
成の特徴を以下に示す。Resin composition No. of the example. The characteristics of the composition of the above are shown below.
【００８８】１．実施例組成Ｎｏ.１〜Ｎｏ.４はエポキ
シ化合物ＥＰＸとＥＢ−２００Ｂの配合割合を変えたも
の。1. Example compositions No. 1 to No. 4 are obtained by changing the compounding ratio of the epoxy compounds EPX and EB-200B.
【００８９】２．実施例組成Ｎｏ.５およびＮｏ.６は三
種の充填剤の配合割合を変えたもの(最小量と最大量)。2. Example compositions No. 5 and No. 6 are those in which the compounding ratios of the three kinds of fillers are changed (minimum amount and maximum amount).
【００９０】３．実施例組成Ｎｏ.７〜Ｎｏ.１０はエポ
キシ化合物と酸無水物硬化剤の配合割合(当量比)を変え
たもの。3. The compositions No. 7 to No. 10 of the examples are different in the compounding ratio (equivalent ratio) of the epoxy compound and the acid anhydride curing agent.
【００９１】４．実施例組成Ｎｏ.１１〜Ｎｏ.１４は酸
無水物硬化剤中のＧＴＭの配合割合を変えたもの。4. Example compositions No. 11 to No. 14 are those in which the mixing ratio of GTM in the acid anhydride curing agent is changed.
【００９２】５．実施例組成Ｎｏ.１５〜Ｎｏ.１６は、
酸無水物硬化剤中の水添無水フタル酸としてＭｅ−ＴＨ
ＰＡ単一成分を用い、ＧＴＭの配合割合を変えたもの。5. Example compositions No. 15 to No. 16 are
Me-TH as hydrogenated phthalic anhydride in acid anhydride curing agent
A single PA component was used, but the blending ratio of GTM was changed.
【００９３】６．実施例組成Ｎｏ.１７〜Ｎｏ.１９はエ
ポキシ化合物中のＥＰＸとＭＰＤＧＥの配合割合を変え
たもの。6. Example compositions No. 17 to No. 19 are different in the compounding ratio of EPX and MPDGE in the epoxy compound.
【００９４】７．実施例組成Ｎｏ.２０〜Ｎｏ.２２はエ
ポキシ化合物中のＥＰＸとＰＤＧＥの配合割合を変えた
もの。7. Example compositions No. 20 to No. 22 are different in the compounding ratio of EPX and PDGE in the epoxy compound.
【００９５】８．実施例組成Ｎｏ.２３およびＮｏ.２４
は、酸無水物硬化剤として水添無水フタル酸のＭｅ−Ｔ
ＨＰＡのみを用い、エポキシ化合物中のＥＰＸの５０重
量％をＭＰＤＧＥとＰＤＧＥにそれぞれ置き換えたも
の。8. Example composition No. 23 and No. 24
Is hydrogenated phthalic anhydride Me-T as an acid anhydride curing agent.
Using only HPA and replacing 50% by weight of EPX in the epoxy compound with MPDGE and PDGE, respectively.
【００９６】９．実施例組成Ｎｏ.２５〜Ｎｏ.２８は促
進剤２Ｅ４ＭＺ−ＣＮの配合割合を変えたもの。9. The composition Nos. 25 to 28 of the examples are those in which the compounding ratio of the accelerator 2E4MZ-CN is changed.
【００９７】１０．実施例組成Ｎｏ.２９〜Ｎｏ.３２は
シランカップリング剤ＫＢＭ４０３の配合割合を変えた
もの。10. Example compositions No. 29 to No. 32 are obtained by changing the compounding ratio of the silane coupling agent KBM403.
【００９８】次に、比較例の樹脂組成Ｎｏ．のものにつ
いて組成の特徴を以下に示す。Next, the resin composition No. of the comparative example. The characteristics of the composition of the above are shown below.
【００９９】１１．比較例組成Ｎｏ.１およびＮｏ.２は
エポキシ化合物ＥＰＸとＥＢ−２００Ｂの配合割合が本
発明範囲からはずれるもの。11. Comparative compositions No. 1 and No. 2 are those in which the compounding ratios of the epoxy compounds EPX and EB-200B are out of the range of the present invention.
【０１００】１２．比較例組成Ｎｏ.３〜Ｎｏ.１０は三
種の充填剤のいずれかの配合割合が本発明範囲からはず
れるもの。12. Comparative compositions No. 3 to No. 10 are those in which the blending ratio of any of the three kinds of fillers is out of the range of the present invention.
【０１０１】１３．比較例組成Ｎｏ.１１〜Ｎｏ.１４
は、エポキシ化合物にＭＰＤＧＥおよびＰＤＧＥを含ま
ず、酸無水物硬化剤にＧＴＭを含まない、本発明とは異
なる組成のもの。なお、前３者の組成はＫＢＭ４０３と
２Ｅ４ＭＺ−ＣＮの配合割合のみを変えたもの。13. Comparative composition No. 11 to No. 14
Is a composition different from that of the present invention in which the epoxy compound does not contain MPDGE and PDGE and the acid anhydride curing agent does not contain GTM. The composition of the former three is different only in the compounding ratio of KBM403 and 2E4MZ-CN.
【０１０２】１４．比較例組成Ｎｏ.１５およびＮｏ.１
６は、エポキシ化合物がＥＰＸを含まず、前者がＥＢ−
２００ＢとＭＰＤＧＥ、後者がＥＢ−２００ＢとＰＤＧ
Ｅからなる、本発明とは異なる組成のもの。14. Comparative composition No. 15 and No. 1
In No. 6, the epoxy compound does not contain EPX and the former is EB-
200B and MPDGE, the latter EB-200B and PDG
A composition different from that of the present invention consisting of E.
【０１０３】１５．比較例組成Ｎｏ.１７およびＮｏ.１
８は、エポキシ化合物がＥＰＸを含まず、それぞれ、Ｅ
Ｂ−２００ＢとＭＰＤＧＥ、ＥＢ−２００ＢとＰＤＧＥ
からなるもので、さらに、酸無水物硬化剤にＧＴＭを含
まない、本発明とは異なる組成のもの。15. Comparative composition No. 17 and No. 1
In No. 8, the epoxy compound does not contain EPX,
B-200B and MPDGE, EB-200B and PDGE
And a composition different from that of the present invention in which the acid anhydride curing agent does not contain GTM.
【０１０４】以上の樹脂組成の特徴(１〜１５)に着目し
て、表１〜表６の実施例の樹脂組成と特性および表７〜
表９の比較例の樹脂組成と特性を比較すると、明らか
に、実施例樹脂組成Ｎｏ．１〜Ｎｏ．３２のものは、Ｆ
ＢＴ用注型樹脂組成物に必要な特性をいずれも満たして
おり、一方、比較例樹脂組成Ｎｏ．１〜Ｎｏ．１８のも
のは、ＦＢＴ用注型樹脂組成物に必要な特性をバランス
良く満たすことが出来ないことがわかる。Focusing on the above-mentioned characteristics (1 to 15) of the resin composition, the resin compositions and characteristics of the examples in Tables 1 to 6 and Tables 7 to
Comparing the resin composition and characteristics of the comparative example in Table 9, the resin composition No. 1-No. 32 is F
All of the properties required for the cast resin composition for BT are satisfied, while the resin composition No. 1-No. It can be seen that No. 18 cannot satisfy the properties required for the FBT casting resin composition in a well-balanced manner.
【０１０５】次いで、上記エポキシ樹脂組成物につい
て、エポキシ樹脂埋込みツイストペア(耐熱ウレタン樹
脂被覆銅線)を作り、温度を変えて１.５ｋＶＡＣで絶縁
破壊する時間(耐圧寿命)を求めた。Then, with respect to the above epoxy resin composition, an epoxy resin-embedded twisted pair (copper wire coated with heat-resistant urethane resin) was prepared, and the time for dielectric breakdown (breakdown voltage life) at 1.5 kVAC at different temperatures was determined.
【０１０６】耐圧寿命の最も低い実施例組成Ｎｏ.１１
および耐圧寿命の最も高い比較例組成Ｎｏ.１４(Ｔｇと
耐電圧保持率以外の上記特性が実施例組成物と同等以
上)を用いたエポキシ樹脂埋込みツイストペアの耐圧寿
命を一例として図２に示す。Example composition No. 11 having the lowest withstand voltage life
2 shows, as an example, the withstand voltage life of the epoxy resin-embedded twisted pair using Comparative Example composition No. 14 having the highest withstand voltage life (the above characteristics other than Tg and withstand voltage holding ratio are equal to or higher than those of the example compositions).
【０１０７】ＦＢＴの現行最高温度１００℃の時の寿命
時間は、比較例組成Ｎｏ.１４の直線との交点であり、
その寿命時間を示す時の実施例組成Ｎｏ.１１の寿命温
度は、前記交点を通る温度軸に平行な直線と実施例組成
Ｎｏ.１１の直線との交点から温度軸に垂線を引いて求
める。The life time of the FBT at the current maximum temperature of 100 ° C. is the intersection with the straight line of the composition No. 14 of Comparative Example,
The life temperature of the example composition No. 11 when the life time is indicated is determined by drawing a perpendicular line from the intersection of the straight line parallel to the temperature axis passing through the intersection and the straight line of the example composition No. 11 to the temperature axis.
【０１０８】図２から、本発明の樹脂組成物を用いたツ
イストペアの耐圧寿命温度は現行最高温度１００℃より
も１０℃以上向上することが明らかである。From FIG. 2, it is clear that the withstand voltage life temperature of the twisted pair using the resin composition of the present invention is improved by 10 ° C. or more from the current maximum temperature of 100 ° C.
【０１０９】[0109]
【発明の効果】以上説明したように、本発明によれば、
特定の耐熱性エポキシ樹脂組成物で絶縁処理してＦＢＴ
を製造することにより、得られたＦＢＴは耐電圧特性、
誘電特性などの動作特性および難燃性等に優れるのみな
らず、ＦＢＴの使用温度を現行より１０℃以上向上で
き、絶縁耐圧寿命を改善できるので、ＦＢＴの信頼性が
向上する。As described above, according to the present invention,
Insulation treatment with specific heat resistant epoxy resin composition and FBT
The FBT obtained by manufacturing
Not only is it excellent in operating characteristics such as dielectric characteristics and flame retardancy, but the operating temperature of the FBT can be increased by 10 ° C. or more compared with the current one, and the withstand voltage life can be improved, so the reliability of the FBT is improved.
【０１１０】したがって、本発明によるＦＢＴは一層高
性能化が進み、テレビ受像機やディスプレイの高性能、
多機能化に対応可能であり、工業的価値は大きい。Therefore, the performance of the FBT according to the present invention is further improved, and the performance of the TV receiver and the display is improved.
It is compatible with multiple functions and has great industrial value.
【図１】本発明にかかるＦＢＴの概略断面図である。FIG. 1 is a schematic sectional view of an FBT according to the present invention.
【図２】本発明にかかるエポキシ樹脂埋込みツイストペ
アの耐圧寿命を示す図である。FIG. 2 is a diagram showing a withstand voltage life of an epoxy resin-embedded twisted pair according to the present invention.
１…１次ボビン、 ２…１次コイル、 ３…２次ボビン、 ４…２次コイル、 ５…高圧ダイオード、 ６…フォーカスブロック(高圧抵抗を含む)、 ７…注型樹脂組成物、 ８…ケース。 1 ... Primary bobbin, 2 ... Primary coil, 3 ... Secondary bobbin, 4 ... Secondary coil, 5 ... High voltage diode, 6 ... Focus block (including high voltage resistance), 7 ... Casting resin composition, 8 ... Case.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 渡辺 孝三 岩手県水沢市真城字北野１番地株式会社日 立水沢エレクトロニクス内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Kozo Watanabe 1 Kitano, Masaki, Mizusawa-shi, Iwate Prefecture
Claims (8)
ポキシ樹脂65〜82重量部と、臭素化フェニルモノグリシ
ジルエーテルと臭素化クレジルモノグリシジルエーテル
との混合物18〜35重量部との合計100重量部(エポキシ化
合物)に対し、三酸化アンチモン粉末5〜30重量部、水和
アルミナ粉末40〜100重量部、シリカ粉末30〜100重量部
と、化学式(化２) 【化２】 で示されるグリセロールトリス(アンヒドロトリメリテ
ート)と水添無水フタル酸との混合物(酸無水物硬化剤)
と硬化促進剤とからなるエポキシ樹脂組成物を用いて絶
縁処理することを特徴とするフライバックトランス(以
下、ＦＢＴと略記する)の製造方法(但し、上記式中ｎ＝
０〜２、エポキシ当量＝１８５〜１９５)。1. A general formula (Formula 1) 65 to 82 parts by weight of an epichlorohydrin-bisphenol A type epoxy resin represented by and 18 to 35 parts by weight of a mixture of a brominated phenyl monoglycidyl ether and a brominated cresyl monoglycidyl ether, for a total of 100 parts by weight (epoxy compound) , Antimony trioxide powder 5 to 30 parts by weight, hydrated alumina powder 40 to 100 parts by weight, silica powder 30 to 100 parts by weight, and the chemical formula (Formula 2) Mixture of glycerol tris (anhydrotrimellitate) and hydrogenated phthalic anhydride (acid anhydride curing agent)
And a curing accelerator are used for insulation treatment, and a method for manufacturing a flyback transformer (hereinafter abbreviated as FBT) is provided (where n =
0-2, epoxy equivalent = 185-195).
し、０.７〜１.２酸無水物当量の上記酸無水物硬化剤量
を配合したエポキシ樹脂組成物を用いて絶縁処理するこ
とを特徴とするＦＢＴの製造方法。2. An epoxy resin composition in which 0.7 to 1.2 acid anhydride equivalents of the acid anhydride curing agent are mixed with 1 epoxy equivalent of the epoxy compound to perform insulation treatment. FBT manufacturing method.
ス(アンヒドロトリメリテート)2〜50重量％、メチルヘ
キサヒドロ無水フタル酸とヘキサヒドロ無水フタル酸と
の混合物50〜98重量％の組成であるエポキシ樹脂組成物
を用いて絶縁処理することを特徴とするＦＢＴの製造方
法。3. The acid anhydride curing agent has a composition of 2 to 50% by weight of glycerol tris (anhydrotrimellitate) and 50 to 98% by weight of a mixture of methylhexahydrophthalic anhydride and hexahydrophthalic anhydride. A method for producing an FBT, which comprises performing an insulation treatment using a certain epoxy resin composition.
ス(アンヒドロトリメリテート)2〜50重量％、メチルテ
トラヒドロ無水フタル酸50〜98重量％の組成であるエポ
キシ樹脂組成物を用いて絶縁処理することを特徴とする
ＦＢＴの製造方法。4. Insulation using an epoxy resin composition in which the acid anhydride curing agent has a composition of 2 to 50% by weight of glycerol tris (anhydrotrimellitate) and 50 to 98% by weight of methyl tetrahydrophthalic anhydride. A method of manufacturing an FBT, which comprises treating the FBT.
Ａ型エポキシ樹脂成分が、一般式(化３) 【化３】 で示されるフェニルジグリシジルエーテル型エポキシ樹
脂20〜80重量％を含有する成分であるエポキシ樹脂組成
物を用いて絶縁処理することを特徴とするＦＢＴの製造
方法(但し、上記式中、ｎ＝０〜２、有機基Ｒ1、Ｒ2、
Ｒ3、Ｒ4＝ＣmＨ2m+1、ｍ＝０〜１０)。5. The epichlorohydrin-bisphenol A type epoxy resin component is represented by the general formula (Chemical Formula 3): The phenyldiglycidyl ether type epoxy resin represented by the formula (10) is used for insulation treatment using an epoxy resin composition which is a component containing 20 to 80% by weight (however, in the above formula, n = 0. ~ 2, organic groups R 1 , R 2 ,
R 3, R 4 = C m H 2m + 1, m = 0~10).
Ａ型エポキシ樹脂成分が、上記フェニルジグリシジルエ
ーテル型エポキシ樹脂20〜80重量％を含有する成分であ
り、かつ、上記酸無水物硬化剤がメチルテトラヒドロ無
水フタル酸であるエポキシ樹脂組成物を用いて絶縁処理
することを特徴とするＦＢＴの製造方法。6. The epichlorohydrin / bisphenol A type epoxy resin component is a component containing 20 to 80% by weight of the phenyldiglycidyl ether type epoxy resin, and the acid anhydride curing agent is methyltetrahydrophthalic anhydride. A method for producing an FBT, which comprises performing an insulation treatment using the epoxy resin composition of
ルイミダゾール、１−シアノエチル−２−エチル−４−
メチルイミダゾール等のイミダゾール系化合物であり、
上記エポキシ化合物の合計100重量部に対し、0.1〜10重
量部配合したエポキシ樹脂組成物を用いて絶縁処理する
ことを特徴とするＦＢＴの製造方法。7. The curing accelerator is 2-ethyl-4-methylimidazole, 1-cyanoethyl-2-ethyl-4-.
An imidazole compound such as methylimidazole,
A method for producing an FBT, which comprises performing an insulation treatment using an epoxy resin composition in which 0.1 to 10 parts by weight are blended with respect to a total of 100 parts by weight of the epoxy compound.
ラン等のエポキシ基を有するシランカップリング剤を、
上記エポキシ化合物の合計100重量部に対し、0.1〜10重
量部配合したエポキシ樹脂組成物を用いて絶縁処理する
ことを特徴とするＦＢＴの製造方法。8. A silane coupling agent having an epoxy group such as γ-glycidoxypropyltrimethoxysilane,
A method for producing an FBT, which comprises performing an insulation treatment using an epoxy resin composition in which 0.1 to 10 parts by weight are blended with respect to a total of 100 parts by weight of the epoxy compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5066418A JPH06283343A (en) | 1993-03-25 | 1993-03-25 | Manufacture of flyback transformer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5066418A JPH06283343A (en) | 1993-03-25 | 1993-03-25 | Manufacture of flyback transformer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06283343A true JPH06283343A (en) | 1994-10-07 |
Family
ID=13315233
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5066418A Pending JPH06283343A (en) | 1993-03-25 | 1993-03-25 | Manufacture of flyback transformer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06283343A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100365048C (en) * | 2003-05-15 | 2008-01-30 | 长兴化学工业股份有限公司 | Resin composition with high dielectric constant and its usage |
| JP5828835B2 (en) * | 2010-04-08 | 2015-12-09 | デンカ株式会社 | Thermally conductive moisture curable resin composition |
| WO2018181384A1 (en) * | 2017-03-31 | 2018-10-04 | 日立化成株式会社 | Epoxy resin composition, curable resin composition and electronic component device |
| CN110746741A (en) * | 2019-09-30 | 2020-02-04 | 北京石墨烯技术研究院有限公司 | Resin composite material and preparation method and application thereof |
-
1993
- 1993-03-25 JP JP5066418A patent/JPH06283343A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100365048C (en) * | 2003-05-15 | 2008-01-30 | 长兴化学工业股份有限公司 | Resin composition with high dielectric constant and its usage |
| JP5828835B2 (en) * | 2010-04-08 | 2015-12-09 | デンカ株式会社 | Thermally conductive moisture curable resin composition |
| WO2018181384A1 (en) * | 2017-03-31 | 2018-10-04 | 日立化成株式会社 | Epoxy resin composition, curable resin composition and electronic component device |
| JPWO2018181384A1 (en) * | 2017-03-31 | 2020-02-06 | 日立化成株式会社 | Epoxy resin composition, curable resin composition, and electronic component device |
| CN110746741A (en) * | 2019-09-30 | 2020-02-04 | 北京石墨烯技术研究院有限公司 | Resin composite material and preparation method and application thereof |
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