JPH06278178A - Manufacture of injection molded product and its molding device - Google Patents

Manufacture of injection molded product and its molding device

Info

Publication number
JPH06278178A
JPH06278178A JP7046093A JP7046093A JPH06278178A JP H06278178 A JPH06278178 A JP H06278178A JP 7046093 A JP7046093 A JP 7046093A JP 7046093 A JP7046093 A JP 7046093A JP H06278178 A JPH06278178 A JP H06278178A
Authority
JP
Japan
Prior art keywords
cavity
mold
pressing member
card
injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7046093A
Other languages
Japanese (ja)
Inventor
Mitsunori Takeda
光徳 竹田
Kazuichi Nakazato
和市 中里
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
M G KK
Dai Nippon Printing Co Ltd
MG Co Ltd
Original Assignee
M G KK
Dai Nippon Printing Co Ltd
MG Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by M G KK, Dai Nippon Printing Co Ltd, MG Co Ltd filed Critical M G KK
Priority to JP7046093A priority Critical patent/JPH06278178A/en
Publication of JPH06278178A publication Critical patent/JPH06278178A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/46—Means for plasticising or homogenising the moulding material or forcing it into the mould
    • B29C45/56—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding
    • B29C45/5675—Means for plasticising or homogenising the moulding material or forcing it into the mould using mould parts movable during or after injection, e.g. injection-compression moulding for making orifices in or through the moulded article
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/0025—Preventing defects on the moulded article, e.g. weld lines, shrinkage marks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2017/00—Carriers for sound or information
    • B29L2017/006—Memory cards, chip cards

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

PURPOSE:To manufacture an injection molded product with partially thin section, for example, a substrate for IC card with high dimension accuracy and effectively while controlling the generation of weld lines and improving mechanical strength. CONSTITUTION:The manufacturing method consists of the process of injecting molten resin into a cavity 41 of a mold device 22 and the process of protruding a pressing component 56 moving relatively to a mold into the cavity 41 on a section corresponding to a zone in which a comparatively thin wall section is formed at the time or close at the time of completing the filling of molten resin into the cavity 41. Also the method comprising the process of solidifying the molten resin to the degree of at least retaining the given shape in the state that the pressing component 56 is protruded into the cavity 41 and manufacturing an injection molded product and the process of releasing the injection molded product thus manufactured out of the mold.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、射出成形品の製造方法
および成形装置に係り、さらに詳しくは、たとえばＩＣ
カード用カード基材のように、部分的に薄い部分を有す
る射出成形品を、その機械的強度を向上させつつ、高寸
法精度で効率的に製造することができる射出成形品の製
造方法およびそれに用いる成形装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing an injection-molded article and a molding apparatus, more specifically, for example, an IC.
An injection-molded article manufacturing method and an injection-molded article manufacturing method capable of efficiently manufacturing a molded article having a partially thin portion, such as a card base material for a card, with high dimensional accuracy while improving its mechanical strength. The present invention relates to a molding device used.

【０００２】[0002]

【従来の技術】一般のＩＣカードは、カード基材に埋設
用凹部を形成し、この埋設用凹部にＩＣモジュールを埋
設して製造される。カード基材は、従来では、硬質塩化
ビニル積層体などで構成され、このカード基材に埋設用
凹部を形成するため、エンドミルなどの手段で切削加工
される。2. Description of the Related Art A general IC card is manufactured by forming a recess for embedding in a card base material and embedding an IC module in the recess for embedding. Conventionally, the card base material is composed of a hard vinyl chloride laminate or the like, and is cut by a means such as an end mill to form a recess for embedding in the card base material.

【０００３】このような従来の製造法では、切削工程を
必要とし、製造能率があまり高く取れないという問題が
ある。この問題を解決するために、射出成形法でＩＣカ
ード用カード基材を製造することが提案されている。In such a conventional manufacturing method, there is a problem that a cutting step is required and the manufacturing efficiency cannot be so high. In order to solve this problem, it has been proposed to manufacture a card base material for an IC card by an injection molding method.

【０００４】この提案に係る成形法では、図９，１０に
示すように、型締めされた状態でキャビティ２が形成さ
れる下型４と、ＩＣモジュールの埋設用凹部６（図１０
参照）を形成するための金型凸部８が設けられた上型１
０とを使用する。樹脂のゲート１２は、たとえばキャビ
ティ２の端部に設けてあり、このゲート１２から溶融樹
脂をキャビティ２内に注入して射出成形を行なう。そし
て成形品の冷却後に型開きを行い、図１０に示す形状の
成形品を取出し、ゲート１２の跡１２ａを切断除去し
て、ＩＣカード用カード基材１４を製造する。このよう
な方法によると、埋設用凹部６が形成されたＩＣカード
用カード基材１４を効率よく製造できる。In the molding method according to this proposal, as shown in FIGS. 9 and 10, a lower mold 4 in which a cavity 2 is formed in a mold clamped state and a recess 6 for embedding an IC module (see FIG. 10).
Upper mold 1 provided with a mold protrusion 8 for forming
Use 0 and. The resin gate 12 is provided, for example, at the end of the cavity 2, and molten resin is injected into the cavity 2 from the gate 12 to perform injection molding. Then, the mold is opened after cooling the molded product, the molded product having the shape shown in FIG. 10 is taken out, and the trace 12a of the gate 12 is cut and removed to manufacture the card base material 14 for the IC card. According to such a method, the card base material 14 for an IC card in which the embedding recess 6 is formed can be efficiently manufactured.

【０００５】[0005]

【発明が解決しようとする課題】このようにして製造さ
れるＩＣカード用カード基材１４は、厚みが０．７６〜
０．８４ｍｍと薄く、しかも埋設用凹部６に埋設される
ＩＣモジュールの厚みが０．５５〜０．６５ｍｍ程度あ
るので、基材１４の最も薄い部分では０．２ｍｍ程度の
厚みしかない。このために、ゲート１２から注入される
樹脂が金型凸部８の裏側に回り込みにくくなり、また、
樹脂の流れ方向に沿って図１０に示すようにウエルドラ
イン１６が形成されるという問題が生じる。The thickness of the card base material 14 for an IC card manufactured in this manner is 0.76 to
Since the thickness of the IC module embedded in the recess 6 for embedding is as thin as 0.84 mm and is about 0.55 to 0.65 mm, the thinnest portion of the base material 14 has a thickness of only about 0.2 mm. For this reason, the resin injected from the gate 12 is less likely to go around to the back side of the mold convex portion 8, and
There arises a problem that the weld line 16 is formed along the resin flow direction as shown in FIG.

【０００６】このようにウエルドライン１６が形成され
ると、成形後のＩＣカード用カード基材の薄肉部に反り
を発生させ、ウエルドライン１６の部分で曲げ負荷に対
して弱くなり、不良品発生の原因になる。この場合、樹
脂の流れをスムーズにしてウエルドラインの発生を防止
するには、金型の温度を上昇させることも考えられる
が、金型の温度を高くすると、樹脂が焼けて劣化するこ
とがあり、また、成形後の冷却時間が長くなると共に、
成形品の機械的強度が低下する。When the weld line 16 is formed in this manner, a warp is generated in the thin portion of the IC card base material after molding, and the weld line 16 becomes vulnerable to bending load, resulting in defective products. Cause In this case, in order to smooth the flow of the resin and prevent the generation of weld lines, it is possible to raise the temperature of the mold, but if the temperature of the mold is raised, the resin may burn and deteriorate. Also, as the cooling time after molding becomes longer,
The mechanical strength of the molded product decreases.

【０００７】本発明は、このような実状に鑑みてなさ
れ、たとえばＩＣカード用カード基材のように部分的に
薄い部分を有する射出成形品を、ウエルドラインの発生
を抑制しつつ、しかも機械的強度を向上させつつ、高寸
法精度で効率的に製造することができる射出成形品の製
造方法およびそれに用いる成形装置を提供することを目
的とする。The present invention has been made in view of such circumstances, and an injection molded article having a partially thin portion such as a card base material for an IC card is mechanically treated while suppressing the occurrence of weld lines. An object of the present invention is to provide a method for manufacturing an injection-molded article that can be manufactured with high dimensional accuracy and efficiency while improving strength, and a molding apparatus used for the method.

【０００８】[0008]

【課題を解決するための手段】上記目的を達成するため
に、本発明の射出成形品の製造方法は、金型のキャビテ
ィ内に溶融成形材を注入する工程と、キャビティ内への
溶融成形材の充填が完了する時点付近に、比較的薄肉部
が形成される領域に相当する部分で、金型に対して相対
移動自在の押圧部材をキャビティ内に突出させる工程
と、押圧部材がキャビティ内に突出した状態で溶融成形
材を、少なくとも所定の形状を保持し得る程度に固化さ
せ、射出成形品を得る工程と、得られた射出成形品を金
型内から取り出す工程とを有する。In order to achieve the above object, a method of manufacturing an injection-molded article according to the present invention comprises a step of injecting a molten molding material into a cavity of a mold and a molten molding material into the cavity. In the vicinity of the time when the filling is completed, in the portion corresponding to the region where the relatively thin portion is formed, the step of projecting the pressing member that is movable relative to the mold into the cavity, and the pressing member inside the cavity The method includes the steps of solidifying the melt-molded material in a protruding state to an extent that at least a predetermined shape can be obtained to obtain an injection-molded product, and taking out the obtained injection-molded product from the mold.

【０００９】本発明のＩＣカード用カード基材の製造方
法は、金型のキャビティ内に溶融成形材を注入する工程
と、キャビティ内への溶融成形材の充填が完了する時点
付近に、ＩＣカードのＩＣモジュールが収容される凹部
に相当する部分で、金型に対して相対移動自在の押圧部
材をキャビティ内に突出させる工程と、押圧部材がキャ
ビティ内に突出した状態で溶融成形材を、少なくとも所
定の形状を保持し得る程度に固化させ、ＩＣカード用カ
ード基材を得る工程と、得られたＩＣカード用カード基
材を金型内から取り出す工程とを有する。The method of manufacturing a card base material for an IC card according to the present invention comprises a step of injecting a molten molding material into a cavity of a mold and a step of filling the molten molding material into the cavity near the completion of the IC card. In a portion corresponding to the concave portion in which the IC module is housed, a step of projecting a pressing member, which is movable relative to the mold, into the cavity; The method includes a step of solidifying to a degree capable of retaining a predetermined shape to obtain an IC card card base material, and a step of taking out the obtained IC card card base material from the mold.

【００１０】本発明の射出成形装置は、キャビティが形
成された金型と、金型のキャビティ内に対して突出移動
および後退移動が自在に配置された押圧部材と、前記押
圧部材を駆動し、押圧部材の突出移動および後退移動を
可能にする駆動手段とを有する。The injection molding apparatus of the present invention comprises a mold having a cavity formed therein, a pressing member which is arranged so as to be capable of projecting and retracting with respect to the inside of the mold cavity, and which drives the pressing member. And a driving unit that allows the pressing member to move in the protruding and retracting directions.

【００１１】本発明の射出成形装置では、キャビティ内
に溶融成形材が充填された時点近傍で、前記押圧部材を
キャビティ内に突出させ、溶融成形材が少なくとも所定
の形状を保持し得る程度に固化した後、押圧部材をキャ
ビティ内から後退移動させるように、前記駆動手段を制
御する制御手段をさらに有することが望ましい。In the injection molding apparatus of the present invention, the pressing member is projected into the cavity in the vicinity of the time when the molten molding material is filled in the cavity, and the molten molding material is solidified to such an extent that it can hold at least a predetermined shape. After that, it is preferable to further include control means for controlling the driving means so as to move the pressing member backward from the cavity.

【００１２】[0012]

【作用】本発明に係る射出成形装置を用いた射出成形品
の製造方法では、キャビティ内に溶融成形材が完全に充
填されるまでは、押圧部材がキャビティ内に対して大き
く突出しない。そのため、キャビティ内に注入された溶
融成形材は、ウエルドラインをほとんど形成することな
く、キャビティ内に均一に流れ込む。溶融成形材の注入
中においては、成形品の薄肉部に相当する狭空隙部が形
成されていないので、成形材の粘度を低下させるために
成形材を高温にすることなく、キャビティ内に均一に充
填することが可能である。成形材を高温にする必要がな
いことから、得られる成形品の機械的強度が向上する。In the method of manufacturing an injection molded product using the injection molding apparatus according to the present invention, the pressing member does not largely project into the cavity until the cavity is completely filled with the molten molding material. Therefore, the molten molding material injected into the cavity uniformly flows into the cavity with almost no weld lines. During the injection of the molten molding material, the narrow voids corresponding to the thin parts of the molded product are not formed, so the molding material is not heated to a high temperature in order to reduce its viscosity It is possible to fill. Since it is not necessary to raise the temperature of the molding material, the mechanical strength of the obtained molded product is improved.

【００１３】本発明では、キャビティ内への充填が完了
する時点近傍で、押圧部材をキャビティ内に所定量突出
させる。押圧部材で押された溶融成形材の部分は、得ら
れる成形品の薄肉部に相当し、この部分を高寸法精度で
成形することができる。しかも、成形材が、キャビティ
内で、固化する前に押圧されるので、成形材の密度は、
キャビティ内で均一となり、得られる成形品の寸法精度
および機械的強度が向上する。本発明に係る射出成形品
の製造方法および成形装置は、たとえばＩＣカード用カ
ード基材などのように、部分的に薄肉部を有する射出成
形品を、機械的強度を向上させつつ、しかも高寸法精度
で効率的に製造する場合などに良好に適用することがで
きる。According to the present invention, the pressing member is projected into the cavity by a predetermined amount near the time when the filling into the cavity is completed. The portion of the melt-molded material pressed by the pressing member corresponds to the thin portion of the obtained molded product, and this portion can be molded with high dimensional accuracy. Moreover, since the molding material is pressed in the cavity before it is solidified, the density of the molding material is
It becomes uniform in the cavity, and the dimensional accuracy and mechanical strength of the obtained molded product are improved. INDUSTRIAL APPLICABILITY The method and apparatus for manufacturing an injection-molded product according to the present invention can improve the mechanical strength of an injection-molded product partially having a thin portion such as a card base material for an IC card, while having a high dimension. It can be favorably applied in the case of manufacturing with high accuracy and efficiency.

【００１４】[0014]

【実施例】以下、本発明の一実施例に係る射出成形品の
製造方法および射出成形装置について、図面を参照しつ
つ詳細に説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing an injection molded article and an injection molding apparatus according to an embodiment of the present invention will be described in detail below with reference to the drawings.

【００１５】図１は本発明の一実施例に係る射出成形装
置の全体構成図、図２〜４は本実施例で用いる金型装置
の要部断面図であり、金型装置の動きを示す、図５は本
実施例に係る押圧部材駆動するための駆動手段の要部を
示す断面図、図６は図５に示すVI−VI線に沿う方向から
見た押圧部材周辺の要部断面図、図７は本実施例に係る
製造方法で得られるＩＣカード用カード基材の斜視図、
図８は本発明の他の実施例で得られる射出成形品の断面
図である。FIG. 1 is an overall configuration diagram of an injection molding apparatus according to an embodiment of the present invention, and FIGS. 2 to 4 are cross-sectional views of essential parts of a mold apparatus used in this embodiment, showing the movement of the mold apparatus. 5 is a sectional view showing a main part of a driving means for driving the pressing member according to the present embodiment, and FIG. 6 is a sectional view of a main part around the pressing member as seen from a direction along line VI-VI shown in FIG. FIG. 7 is a perspective view of a card base material for an IC card obtained by the manufacturing method according to the present embodiment,
FIG. 8 is a sectional view of an injection-molded article obtained in another embodiment of the present invention.

【００１６】図１に示すように、本実施例に係る射出成
形装置２０は、金型装置２２と、射出機２４とを有す
る。射出機２４は、成形材としての樹脂ペレットを投入
するためのホッパ２６と、投入された樹脂ペレットを混
練して溶融させるためのスクリュー部２８と、溶融され
た樹脂を金型装置２２のキャビティ内へ注入するノズル
３０とを有する。射出機２４は、射出制御装置３２によ
り制御される。As shown in FIG. 1, the injection molding apparatus 20 according to this embodiment has a mold device 22 and an injection machine 24. The injection machine 24 includes a hopper 26 for loading resin pellets as a molding material, a screw portion 28 for kneading and melting the loaded resin pellets, and a molten resin in a cavity of the mold device 22. Nozzle 30 for injecting into The injection machine 24 is controlled by the injection control device 32.

【００１７】金型装置２２は、図２〜４に示すように、
可動側取付板３４と、固定側取付板３６とを有する。固
定側取付板３６は、射出成形装置２０のベースに対して
固定され、射出機２４のノズル３０の先端が圧接される
注入口３８を有する。固定側取付板３６には、固定側型
板３７が連結してあり、固定側型板３７および固定側取
付板３６には、注入口３８と金型のキャビティ４１内と
を連通するゲート３９が形成してある。The mold device 22 is, as shown in FIGS.
It has a movable side mounting plate 34 and a fixed side mounting plate 36. The fixed-side mounting plate 36 is fixed to the base of the injection molding device 20 and has an injection port 38 to which the tip of the nozzle 30 of the injection machine 24 is pressed. A fixed-side mold plate 37 is connected to the fixed-side mount plate 36, and a gate 39 that connects the injection port 38 and the cavity 41 of the mold is connected to the fixed-side mold plate 37 and the fixed-side mount plate 36. Has been formed.

【００１８】可動側取付板３４は、固定側取付板３６に
対して矢印Ｘ方向に接近および離反移動自在に構成して
ある。可動側取付板３４の駆動は、たとえば油圧シリン
ダあるいは油圧モータあるいは電気モータなどにより行
なわれる。The movable side mounting plate 34 is configured to be movable toward and away from the fixed side mounting plate 36 in the direction of arrow X. The movable side mounting plate 34 is driven by, for example, a hydraulic cylinder, a hydraulic motor, an electric motor, or the like.

【００１９】可動側取付板３４には、スペーサブロック
４０を介して、受け板４２が連結してある。可動側取付
板３４と受け板４２との間には、スペーサブロック４０
により、空隙４４が形成してあり、二枚の積層板４６
ａ，４６ｂで構成されるエジェクタープレート４６が空
隙４４内で矢印Ｘ方向に移動自在に収容してある。エジ
ェクタープレート４６の前面側には、エジェクターロッ
ド４８の後端が連結してあり、エジェクタープレートの
移動と共に、ロッド４８が、受け板４２に対して軸方向
に相対的移動自在となっている。エジェクタープレート
４６の後面側には、駆動ロッド４７が連結してある。駆
動ロッド４７は、たとえば油圧シリンダーにより駆動さ
れ、エジェクタープレート４６およびエジェクターロッ
ド４８を軸移動させ、後述するように、射出成形後の成
形品をキャビティ４１内から取り出す際の自動排出機構
の一部を構成している。A receiving plate 42 is connected to the movable side mounting plate 34 via a spacer block 40. A spacer block 40 is provided between the movable side mounting plate 34 and the receiving plate 42.
A void 44 is formed, and the two laminated plates 46
An ejector plate 46 composed of a and 46b is accommodated in the space 44 so as to be movable in the arrow X direction. The rear end of the ejector rod 48 is connected to the front surface side of the ejector plate 46, and the rod 48 is movable relative to the receiving plate 42 in the axial direction as the ejector plate moves. A drive rod 47 is connected to the rear surface side of the ejector plate 46. The drive rod 47 is driven by, for example, a hydraulic cylinder to axially move the ejector plate 46 and the ejector rod 48, and as will be described later, a part of an automatic ejection mechanism for taking out a molded product after injection molding from the cavity 41. I am configuring.

【００２０】受け板４２には、可動側型板４９が連結し
てある。可動側型板４９における固定側型板３７との割
面５０の略中央部には、凹部５１が形成してあり、この
凹部５１内に、ストリッパープレート５２が矢印Ｘ方向
に移動自在に収容してある。ストリッパープレート５２
の後端面には、前述したエジェクターロッド４８の先端
が連結してある。ストリッパープレート５２の前面と、
固定側型板３７の割面５０との間に、溶融樹脂が注入さ
れるキャビティ４１が形成される。A movable side mold plate 49 is connected to the receiving plate 42. A concave portion 51 is formed in a substantially central portion of a split surface 50 of the movable side mold plate 49 with respect to the fixed side mold plate 37, and a stripper plate 52 is housed in the concave portion 51 so as to be movable in an arrow X direction. There is. Stripper plate 52
The tip of the ejector rod 48 described above is connected to the rear end surface of the rear end. The front of the stripper plate 52,
A cavity 41 into which the molten resin is injected is formed between the fixed side template 37 and the split surface 50.

【００２１】ストリッパープレート５２には、その表裏
面を貫通する貫通孔５４が形成してある。この貫通孔５
４には、ロッド状の押圧部材５６が軸方向移動自在に挿
通してある。押圧部材５６の先端は、キャビティ４１内
に適宜突出および後退移動自在となっている。押圧部材
５６の後端部は、第１コマ部材５８、第２コマ部材６０
および第３コマ部材６２で構成されるコマ体６４に対し
て連結されている。第１，第２，第３コマ部材５８，６
０，６２は、図６に示すように、ボルト６３などにより
一体に連結してあり、これらを連結する際に、押圧部材
５６の後端部がこれらに一体に連結される。Through holes 54 are formed in the stripper plate 52 to penetrate the front and back surfaces thereof. This through hole 5
4, a rod-shaped pressing member 56 is inserted so as to be movable in the axial direction. The tip of the pressing member 56 can be appropriately projected and retracted into the cavity 41. The rear end of the pressing member 56 has a first top member 58 and a second top member 60.
Also, it is connected to a top body 64 composed of the third top member 62. First, second and third top members 58, 6
As shown in FIG. 6, 0 and 62 are integrally connected by a bolt 63 or the like, and when connecting them, the rear end portion of the pressing member 56 is integrally connected to them.

【００２２】コマ体６４は、可動側型板４９と受け板４
２との接合部分に形成してある凹部内で、矢印Ｘ方向に
微小移動自在に収容してある。しかも、このコマ体６４
には、駆動用溝６６が形成してあり、その駆動用溝６６
内に楔部材６８の先端が挿通自在になっている。楔部材
６８の後端部は、受け板４２および可動側型板４９上に
設置された圧力シリンダ７０に連結してある。圧力シリ
ンダ７０への流体圧の導入および導出に応じて、楔部材
６８は、その軸方向に移動されるようになっている。圧
力シリンダ７０は、たとえば油圧駆動され、油圧を導入
するための配管を通して、電磁弁などで構成される切替
弁７２に接続してある。切替弁７２には、油圧ポンプな
どで構成される油圧源７４が油圧配管を通して接続され
る。切替弁７２の切り替え制御は、図１に示すように、
たとえばケーブル７６を介して接続された射出制御装置
３２からの制御信号に基づき行なわれる。The frame body 64 includes a movable side mold plate 49 and a receiving plate 4.
It is accommodated in the recess formed in the joint portion with 2 so as to be slightly movable in the direction of arrow X. Moreover, this frame body 64
The driving groove 66 is formed in the
The tip of the wedge member 68 can be inserted therein. The rear end portion of the wedge member 68 is connected to the pressure cylinder 70 installed on the receiving plate 42 and the movable side mold plate 49. The wedge member 68 is adapted to be moved in the axial direction according to the introduction and the derivation of the fluid pressure to the pressure cylinder 70. The pressure cylinder 70 is hydraulically driven, for example, and is connected to a switching valve 72 including an electromagnetic valve or the like through a pipe for introducing hydraulic pressure. A hydraulic power source 74 configured by a hydraulic pump or the like is connected to the switching valve 72 through hydraulic piping. The switching control of the switching valve 72 is performed as shown in FIG.
For example, it is performed based on a control signal from the injection control device 32 connected via the cable 76.

【００２３】図５に詳示するように、楔部材６８には、
勾配面６７が形成してあり、この勾配面６７が、コマ体
６４の駆動用溝６６に形成してある駆動用勾配面８０に
対して係合し、摺接移動自在になっている。また、楔部
材６８の勾配面６７と反対側の先端部には、微小凸部８
４が形成してあり、この微小凸部８４が、駆動用溝６６
の駆動用勾配面８０と反対側に形成された戻り用勾配面
８２に対して係合するようになっている。As shown in detail in FIG. 5, the wedge member 68 includes
A sloped surface 67 is formed, and this sloped surface 67 is engaged with a drive sloped surface 80 formed in the drive groove 66 of the top body 64 and is slidably movable. Further, at the tip of the wedge member 68 on the side opposite to the sloped surface 67, the minute convex portion 8
4 are formed, and the minute projections 84 are formed in the drive grooves 66.
The driving sloped surface 80 is engaged with a return sloped surface 82 formed on the opposite side.

【００２４】すなわち、楔部材６８が図中点線位置まで
矢印Ｙ方向に沿って駆動用溝６６内に押し込まれると、
勾配面６７と勾配面８０との摺接により、コマ体６４を
構成するコマ部材６０，６２は、矢印Ｘ方向に沿って、
図中点線位置まで突出移動する。また、楔部材６８が点
線位置から実線位置まで戻ると、微小突起８４と戻り用
勾配面８２との摺接により、図中実線位置まで引き戻さ
れることになる。このように楔部材６８を圧力シリンダ
７０により軸方向に移動させることで、コマ体６４を矢
印Ｘ方向に沿って微小移動させることが可能になり、コ
マ体６４に連結してある押圧部材５６を、その軸方向に
微小移動させ、その先端をキャビティ４１内に対して突
出および後退移動させることを可能にしている。That is, when the wedge member 68 is pushed into the drive groove 66 along the arrow Y direction to the position indicated by the dotted line in the drawing,
Due to the slidable contact between the sloped surface 67 and the sloped surface 80, the top members 60 and 62 that form the top body 64 are moved along the arrow X direction.
It moves to the position indicated by the dotted line in the figure. Further, when the wedge member 68 returns from the dotted line position to the solid line position, it is pulled back to the solid line position in the figure by the slidable contact between the minute projections 84 and the return gradient surface 82. By moving the wedge member 68 in the axial direction by the pressure cylinder 70 in this way, the top body 64 can be finely moved in the direction of the arrow X, and the pressing member 56 connected to the top body 64 is moved. It is possible to make a minute movement in the axial direction and to make the tip end project and retract with respect to the inside of the cavity 41.

【００２５】なお、本実施例では、コマ体６４を第１コ
マ部材５８と第２コマ部材６０と第３コマ部材６２によ
り形成し、これらを連結することにより、押圧部材５６
の一体化を図ったが、加工上の制限が許せば、これらを
すべて一体部材あるいは二部材程度で構成することも可
能である。また、本実施例では、押圧部材５６をキャビ
ティ４１内に対して突出および後退移動させるための駆
動手段として、楔部材６８とコマ体６４との係合を用い
たが、駆動手段としては、これに限定されず、ラックと
ピニオンを用いた駆動機構、カム機構を用いた駆動機
構、テコあるいはシーソー部材などを用いた駆動機構な
どを用いることができる。In the present embodiment, the top body 64 is formed by the first top member 58, the second top member 60, and the third top member 62, and these members are connected to each other, so that the pressing member 56 is formed.
However, if processing restrictions permit, it is possible to construct all of them as an integral member or as two members. Further, in the present embodiment, the engagement between the wedge member 68 and the top body 64 is used as the driving means for causing the pressing member 56 to project and retract with respect to the inside of the cavity 41. However, the drive mechanism using a rack and a pinion, the drive mechanism using a cam mechanism, the drive mechanism using a lever or a seesaw member, and the like can be used.

【００２６】ただし、本実施例のように楔部材６８とコ
マ体６４とを用いる駆動機構を用いれば、押圧部材５６
に対して大きな移動力が印可されるので、特に好まし
い。押圧部材５６は、後述するように、溶融樹脂が充填
された圧力１０００〜１５００Ｋｇ／ｃｍ2 下のキャビ
ティ４１内に突出移動させる必要があることから、押圧
部材５６に対してはかなり大きな移動力が作用すること
が望ましいからである。また、本実施例によれば、設置
スペース的に有利であり、しかも押圧部材の細かい位置
制御ができるので好ましい。However, if the drive mechanism using the wedge member 68 and the top body 64 is used as in the present embodiment, the pressing member 56 is used.
It is particularly preferable because a large moving force is applied to. As will be described later, the pressing member 56 needs to project and move into the cavity 41 under a pressure of 1000 to 1500 Kg / cm 2 filled with the molten resin, so that a considerable moving force is applied to the pressing member 56. This is because it is desirable to act. Further, according to the present embodiment, it is advantageous in terms of installation space, and moreover, fine position control of the pressing member can be performed, which is preferable.

【００２７】次に、本実施例に係る射出成形装置２０を
用いた射出成形品の製造方法について詳細に説明する。
本実施例では、比較的薄肉部を部分的に有する射出成形
品として、たとえば図７に示すＩＣカード用カード基材
９０を製造する例について説明する。ＩＣカード用カー
ド基材９０では、厚みが０．７６〜０．８４ｍｍと薄
く、しかも埋設用凹部９２に埋設されるＩＣモジュール
の厚みが０．５５〜０．６５ｍｍ程度あるので、基材９
０の最も薄い部分では０．２ｍｍ程度の厚みしかない。
このために、従来の射出成形法では、満足する機械的強
度および寸法精度を有するＩＣカード用カード基材を製
造することは困難であった。以下に示す本実施例の製造
方法によれば、このようなＩＣカード用カード基材９０
でも、満足する機械的強度および寸法精度を有するＩＣ
カード用カード基材を製造することができる。Next, a method of manufacturing an injection molded product using the injection molding device 20 according to this embodiment will be described in detail.
In the present embodiment, an example of manufacturing an IC card base material 90 shown in FIG. 7, for example, as an injection-molded article partially having a relatively thin portion will be described. The card base material 90 for IC cards has a thin thickness of 0.76 to 0.84 mm, and the thickness of the IC module embedded in the recess 92 for embedding is about 0.55 to 0.65 mm.
The thinnest part of 0 has a thickness of only about 0.2 mm.
For this reason, it has been difficult to manufacture a card base material for an IC card having satisfactory mechanical strength and dimensional accuracy by the conventional injection molding method. According to the manufacturing method of the present embodiment described below, such a card base material 90 for an IC card is used.
However, IC with satisfactory mechanical strength and dimensional accuracy
A card base material for a card can be manufactured.

【００２８】本実施例では、まず、図２に示すように、
可動側取付板３４を固定側取付板３６に対して最大限に
近づけ、可動側型板４９の割面５０と固定側型板３７の
割面５０とを型締めする。その状態では、エジェクター
プレート４６は、空隙４４内で駆動ロッド４７により最
後方位置に設定され、ストリッパープレート５２は、凹
部５１内で最後方位置にセットされる。そのため、スト
リッパープレート５２の前面と固定側型板３７の割面５
０との間に、キャビティ４１が形成される。キャビティ
４１の空隙厚さは、得られるＩＣカード用カード基材の
肉厚に実質的に等しく、たとえば約０．８mmである。In this embodiment, first, as shown in FIG.
The movable-side mounting plate 34 is brought as close as possible to the fixed-side mounting plate 36, and the split surface 50 of the movable-side mold plate 49 and the split surface 50 of the fixed-side mold plate 37 are clamped. In that state, the ejector plate 46 is set to the rearmost position in the gap 44 by the drive rod 47, and the stripper plate 52 is set to the rearmost position in the recess 51. Therefore, the front surface of the stripper plate 52 and the split surface 5 of the fixed-side template 37
A cavity 41 is formed between the cavities 41 and 0. The void thickness of the cavity 41 is substantially equal to the thickness of the resulting card base material for an IC card, for example, about 0.8 mm.

【００２９】また、キャビティ４１内への成形樹脂の充
填前には、図１に示す射出制御装置３２からの制御信号
に基づき、楔部材６８を駆動するための圧力シリンダ７
０には油圧が導入されず、楔部材６８は、矢印Ｙ方向に
沿って最大後退位置（図２上側）にセットされる。その
ため、コマ体６４は、矢印Ｘ方向に沿って、最大後退位
置（図２左側）に位置し、押圧部材５６の先端も、キャ
ビティ４１内に対して、最大後退位置に位置する。押圧
部材５６の配置位置は、得られるＩＣカード用カード基
材９０の埋設用凹部９２に対応する位置である。Before the molding resin is filled in the cavity 41, the pressure cylinder 7 for driving the wedge member 68 is controlled based on a control signal from the injection control device 32 shown in FIG.
No hydraulic pressure is introduced to 0, and the wedge member 68 is set to the maximum retracted position (upper side in FIG. 2) along the arrow Y direction. Therefore, the top body 64 is located at the maximum retracted position (left side in FIG. 2) along the arrow X direction, and the tip of the pressing member 56 is also located at the maximum retracted position with respect to the inside of the cavity 41. The arranging position of the pressing member 56 is a position corresponding to the embedding concave portion 92 of the obtained IC card card base material 90.

【００３０】本実施例では、押圧部材５６のキャビティ
４１内に対する初期突出量は、約０．４mmであり、キャ
ビティ４１の空隙厚さが約０．８mmであることから、キ
ャビティ４１でのその部分の隙間寸法Ａは、約０．４mm
である。ただし、本発明では、初期突出量は、０．４mm
に限定されず、０．５〜０mmでも良い。初期突出量が小
さいほど、溶融樹脂充填時の流れが良好となるが、後工
程での押圧部材５６の突出移動の制御が難しくなる。In this embodiment, the initial protrusion amount of the pressing member 56 into the cavity 41 is about 0.4 mm, and the cavity thickness of the cavity 41 is about 0.8 mm. The clearance dimension A is about 0.4 mm
Is. However, in the present invention, the initial protrusion amount is 0.4 mm.
However, the thickness is not limited to 0.5 to 0 mm. The smaller the initial protrusion amount, the better the flow at the time of filling the molten resin, but it becomes difficult to control the protrusion movement of the pressing member 56 in the subsequent process.

【００３１】可動側型板４９と固定側型板３７との型締
め力は、樹脂充填圧力に応じて決定され、充填圧力が約
１０００〜１５００Ｋｇ／ｃｍ2 である場合には、約１
００トンである。The mold clamping force between the movable side mold plate 49 and the fixed side mold plate 37 is determined according to the resin filling pressure, and is about 1 when the filling pressure is about 1000 to 1500 Kg / cm 2.
It is 00 tons.

【００３２】次に、本実施例では、図２に示す状態で、
注入口３８から、図１に示す射出機２４を用いて、溶融
成形材としての溶融樹脂をキャビティ４１内に注入す
る。溶融樹脂としては、ＡＢＳ樹脂単独あるいはＰＢＴ
樹脂等、他の合成樹脂とのブレンド樹脂、または塩化ビ
ニル等の合成樹脂が用いられる。ここでは一実施例とし
てＡＢＳ樹脂を用いた。注入時の樹脂の温度は、たとえ
ば２３０℃程度である。また、キャビティ４１周囲の金
型装置２２は、熱交換流体などにより、約８０℃の温度
に設定されている。ＩＣカード用カード基材を成形する
場合におけるキャビティ４１内への溶融樹脂の充填時間
は、たとえば約０．４秒である。Next, in this embodiment, in the state shown in FIG.
A molten resin as a molten molding material is injected into the cavity 41 from the injection port 38 using the injection machine 24 shown in FIG. As the molten resin, ABS resin alone or PBT
A blended resin with another synthetic resin such as a resin, or a synthetic resin such as vinyl chloride is used. Here, ABS resin was used as an example. The temperature of the resin at the time of injection is, for example, about 230 ° C. The mold device 22 around the cavity 41 is set to a temperature of about 80 ° C. by a heat exchange fluid or the like. The filling time of the molten resin into the cavity 41 when molding the card base material for the IC card is, for example, about 0.4 seconds.

【００３３】本実施例では、キャビティ４１内への充填
開始信号に基づき、たとえば１／１０秒以下をカウント
できるタイマーを作動させ、充填の終期を検出する。た
とえば、０．４秒で充填が完了するのであれば、充填開
始信号から０．４秒後を充填終期として検出し、その充
填終期近傍のいずれかの時点で、切替弁７２に制御信号
を送る。切替弁７２に対して制御信号を送るタイミング
は、たとえば実験的に定められ、充填時間が０．４秒で
ある場合には、０．３〜０．４秒の間のいずれかの時点
で制御信号を送ることが望ましい。In this embodiment, based on the filling start signal into the cavity 41, a timer capable of counting, for example, 1/10 seconds or less is operated to detect the end of filling. For example, if the filling is completed in 0.4 seconds, 0.4 seconds after the filling start signal is detected as the filling end period, and the control signal is sent to the switching valve 72 at any point near the filling end period. . The timing of sending the control signal to the switching valve 72 is experimentally determined, and when the filling time is 0.4 seconds, the control is performed at any time point between 0.3 and 0.4 seconds. It is desirable to send a signal.

【００３４】なお、本発明では、充填終期をタイマーに
より検知することなく、キャビティ４１内に設置する圧
力センサあるいはその他のセンサにより検知することも
できる。そのセンサに連動して所定の時間差を設けて、
あるいは設けることなく、制御信号を発するように構成
することもできる。いずれにしても、充填終期の近傍に
おいて、制御信号を発し、押圧部材５６をキャビティ４
１内に突出させることが必要である。In the present invention, the end of filling may be detected by a pressure sensor installed in the cavity 41 or another sensor without being detected by a timer. A predetermined time difference is provided in conjunction with the sensor,
Alternatively, the control signal may be issued without being provided. In any case, in the vicinity of the end of filling, a control signal is issued to push the pressing member 56 into the cavity 4
It is necessary to make it protrude into 1.

【００３５】切替弁７２が制御信号を受け取ると、油圧
源７４からの油圧を圧力シリンダ７０内に導入し、図３
に示すように、瞬時に、楔部材６８を矢印Ｙ方向に沿っ
て前進移動（図示上下方移動）させ、コマ体６４を押圧
部材５６と共に、キャビティ４１方向に微小移動させ
る。その結果、押圧部材５６の先端は、溶融樹脂の圧力
に逆らい、キャビティ４１内に最大限に突出する。When the switching valve 72 receives the control signal, the hydraulic pressure from the hydraulic pressure source 74 is introduced into the pressure cylinder 70,
As shown in FIG. 7, the wedge member 68 is instantaneously moved forward (moved downward in the drawing) along the arrow Y direction, and the top body 64 together with the pressing member 56 is slightly moved in the direction of the cavity 41. As a result, the tip of the pressing member 56 opposes the pressure of the molten resin and projects into the cavity 41 to the maximum extent.

【００３６】押圧部材５６の突出タイミングが、余りに
遅いと、溶融樹脂が固化し、突出が不可能になるおそれ
があり好ましくない。また、突出させるタイミングが余
りに早すぎると、押圧部材５６の先端部に、狭空隙部が
生じ、この部分を溶融樹脂が良好に通過しないおそれが
あり好ましくない。If the projection timing of the pressing member 56 is too late, the molten resin may solidify and the projection may become impossible, which is not preferable. Further, if the timing of projecting is too early, a narrow void portion is formed at the tip portion of the pressing member 56, and molten resin may not pass through this portion, which is not preferable.

【００３７】押圧部材５６の突出により、キャビティ４
１における隙間寸法Ｂは、最終的に得られるＩＣカード
用カード基材９０の埋設用凹部９２（図７参照）の肉厚
寸法である約０．２mmとなる。押圧部材５６の移動スト
ロークは、初期突出量が０．４mmである場合には、０．
２mmである。The protrusion of the pressing member 56 causes the cavity 4
The clearance dimension B in 1 is about 0.2 mm, which is the wall thickness dimension of the embedding recess 92 (see FIG. 7) of the card base material 90 for the IC card finally obtained. When the initial protrusion amount is 0.4 mm, the movement stroke of the pressing member 56 is 0.
It is 2 mm.

【００３８】キャビティ４１内への充填開始から約１０
秒後には、キャビティ４１内の樹脂は、形状を保持し得
る程度に固化する。そこで、充填開始から約１０秒後
に、図４に示す型開きを行なう。型開きに際しては、可
動側取付板３４を固定側取付板３６から引き離す。その
際に、駆動ロッド４７によりエジェクタープレート４６
を押圧し、エジェクタープレート４６をエジェクターロ
ッド４８と共に、可動側型板４９および受け板４２に対
して相対的に固定側型板３６方向に移動させ、ストリッ
パープレート５２を可動側型板４９の割面から突き出す
ように押し出す。About 10 from the start of filling the cavity 41.
After a second, the resin in the cavity 41 is solidified to the extent that the shape can be maintained. Therefore, about 10 seconds after the start of filling, the mold opening shown in FIG. 4 is performed. When the mold is opened, the movable side mounting plate 34 is separated from the fixed side mounting plate 36. At that time, the ejector plate 46 is driven by the drive rod 47.
Is pressed to move the ejector plate 46 together with the ejector rod 48 in the direction of the fixed-side mold plate 36 relative to the movable-side mold plate 49 and the receiving plate 42, and the stripper plate 52 is separated from the movable-side mold plate 49. Push it out so that it sticks out.

【００３９】その結果、キャビティ内で成形された射出
成形品としてのＩＣカード用カード基材９０が金型内か
ら容易に取り出すことができる。それと同時に、あるい
はその後に、図１に示す射出制御装置３２から切替弁７
２に制御信号が送信され、圧力シリンダー７０に油圧が
導入または導出され、楔部材６８を上限位置まで引き上
げる。楔部材６８の上方移動に連動して、図５に示す微
小凸部８４と戻り用勾配面８２との摺接移動により、コ
マ体６４が待機位置まで戻され、押圧部材５６は最大突
出位置から待機位置まで引き戻される。As a result, the card base material 90 for an IC card, which is an injection molded product molded in the cavity, can be easily taken out from the mold. Simultaneously with or after that, the injection control device 32 shown in FIG.
2, the control signal is transmitted to the pressure cylinder 70, and the hydraulic pressure is introduced into or discharged from the pressure cylinder 70 to pull up the wedge member 68 to the upper limit position. In conjunction with the upward movement of the wedge member 68, the top body 64 is returned to the standby position by the sliding contact movement of the minute convex portion 84 and the return slope surface 82 shown in FIG. 5, and the pressing member 56 is moved from the maximum protruding position. It is pulled back to the standby position.

【００４０】本実施例によれば、図２に示すキャビティ
４１内に溶融樹脂が完全に充填されるまでは、押圧部材
５６がキャビティ４１内に対して大きく突出しない。そ
のため、キャビティ４１内に注入された溶融樹脂は、ウ
エルドラインをほとんど形成することなく、キャビティ
内に均一に流れ込む。溶融樹脂の注入中においては、成
形品の薄肉部に相当する狭空隙部が形成されていないの
で、溶融樹脂の粘度を低下させるために樹脂を異常に高
温にすることなく、キャビティ内に均一に充填すること
が可能である。樹脂を高温にする必要がないことから、
得られる成形品としてのＩＣカード用カード基材９０の
機械的強度が向上する。従来の射出成形法では、ＩＣカ
ード用カード基材として要求される機械的強度を持たせ
ることが困難であった。本実施例では、ＩＣカード用カ
ード基材として要求される機械的強度を有する射出成形
品をきわめて容易に製造することができる。According to this embodiment, the pressing member 56 does not largely project into the cavity 41 until the molten resin is completely filled in the cavity 41 shown in FIG. Therefore, the molten resin injected into the cavity 41 uniformly flows into the cavity with almost no weld line. During the injection of the molten resin, the narrow voids corresponding to the thin parts of the molded product are not formed, so the temperature of the molten resin is not raised abnormally to reduce the viscosity and It is possible to fill. Since it is not necessary to raise the temperature of the resin,
The mechanical strength of the obtained card base material 90 for an IC card as a molded product is improved. In the conventional injection molding method, it was difficult to provide the mechanical strength required as a card base material for IC cards. In this embodiment, an injection molded product having the mechanical strength required as a card base material for IC cards can be manufactured very easily.

【００４１】また、本実施例では、キャビティ４１内へ
の充填が完了する時点近傍で、押圧部材５６をキャビテ
ィ４１内に所定量突出させる。押圧部材５６で押された
溶融樹脂の部分は、ＩＣカード用カード基材に形成され
る埋設用凹部９２に相当し、この部分を高寸法精度で成
形することができる。しかも、溶融樹脂が、キャビティ
内で、固化する前に押圧されるので、樹脂の密度は、キ
ャビティ内で均一となり、得られる成形品の寸法精度お
よび機械的強度が向上する。Further, in this embodiment, the pressing member 56 is projected into the cavity 41 by a predetermined amount in the vicinity of the time when the filling into the cavity 41 is completed. The portion of the molten resin pressed by the pressing member 56 corresponds to the embedding recess 92 formed in the card base material for the IC card, and this portion can be molded with high dimensional accuracy. Moreover, since the molten resin is pressed in the cavity before it is solidified, the resin density becomes uniform in the cavity, and the dimensional accuracy and mechanical strength of the obtained molded product are improved.

【００４２】なお、本発明は、上述した実施例に限定さ
れるものではなく、本発明の範囲内で種々に改変するこ
とができる。たとえば、上述した実施例では、成形材と
して、ＡＢＳ樹脂などの合成樹脂を用いたが、本発明で
は、合成樹脂に限らず、ゴム材などの射出成形されるこ
とが可能な全ての成形材を用いることができる。The present invention is not limited to the above-mentioned embodiments, but can be variously modified within the scope of the present invention. For example, although the synthetic resin such as ABS resin is used as the molding material in the above-described embodiments, the present invention is not limited to the synthetic resin, and any molding material that can be injection-molded such as rubber material is used. Can be used.

【００４３】また、押圧部材５６の具体的形状は、特に
限定されず、得ようとする射出成形品に形成すべき薄肉
部の具体的形状に応じて種々に改変することができる。The specific shape of the pressing member 56 is not particularly limited, and can be variously modified according to the specific shape of the thin portion to be formed in the injection molded product to be obtained.

【００４４】さらに、本発明に係る製造方法は、ＩＣカ
ード用カード基材の製造方法に限定されず、部分的に薄
肉部を有する射出成形品の製造方法全てに対して適用す
ることができる。たとえば図８に示すように、薄肉部分
１０４の面積が、厚肉部分１０２の面積に対して大きい
射出成形品１００を成形する場合にも本発明を適用する
ことが可能である。薄肉部分１０４を形成するための押
圧部材の形状を工夫すればよい。Further, the manufacturing method according to the present invention is not limited to the method for manufacturing a card base material for IC cards, but can be applied to all the manufacturing methods for injection-molded articles partially having a thin portion. For example, as shown in FIG. 8, the present invention can be applied to the case of molding an injection-molded product 100 in which the area of the thin portion 104 is larger than the area of the thick portion 102. The shape of the pressing member for forming the thin portion 104 may be devised.

【００４５】[0045]

【発明の効果】以上説明してきたように、本発明によれ
ば、たとえばＩＣカード用カード基材のように部分的に
薄い部分を有する射出成形品を、ウエルドラインの発生
を抑制しつつ、しかも機械的強度を向上させつつ、高寸
法精度で効率的に製造することができる。As described above, according to the present invention, an injection-molded article having a partially thin portion, such as a card base material for IC cards, can be used while suppressing the generation of weld lines. It is possible to efficiently manufacture with high dimensional accuracy while improving the mechanical strength.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例に係る射出成形装置の全体構
成図である。FIG. 1 is an overall configuration diagram of an injection molding apparatus according to an embodiment of the present invention.

【図２】本実施例で用いる金型装置の要部断面図であ
り、金型装置の動きを示す図である。FIG. 2 is a cross-sectional view of a main part of a mold device used in the present embodiment, showing the movement of the mold device.

【図３】本実施例で用いる金型装置の要部断面図であ
り、金型装置の動きを示す図である。FIG. 3 is a cross-sectional view of a main part of a mold device used in the present embodiment, showing the movement of the mold device.

【図４】本実施例で用いる金型装置の要部断面図であ
り、金型装置の動きを示す図である。FIG. 4 is a cross-sectional view of a main part of the mold device used in the present embodiment, showing the movement of the mold device.

【図５】本実施例に係る押圧部材駆動するための駆動手
段の要部を示す断面図である。FIG. 5 is a cross-sectional view showing a main part of a driving unit for driving a pressing member according to the present embodiment.

【図６】図５に示すVI−VI線に沿う方向から見た押圧部
材周辺の要部断面図である。6 is a cross-sectional view of a main part around a pressing member as seen from a direction along line VI-VI shown in FIG.

【図７】本実施例に係る製造方法で得られるＩＣカード
用カード基材の斜視図である。FIG. 7 is a perspective view of a card base material for an IC card obtained by the manufacturing method according to the present embodiment.

【図８】本発明の他の実施例で得られる射出成形品の断
面図である。FIG. 8 is a sectional view of an injection-molded article obtained in another example of the present invention.

【図９】従来例に係る射出成形法を用いたＩＣカード用
カード基材の製造方法を示す要部断面図である。FIG. 9 is a cross-sectional view of essential parts showing a method for manufacturing a card base material for an IC card using an injection molding method according to a conventional example.

【図１０】図９に示す方法で得られるＩＣカード用カー
ド基材の正面図である。FIG. 10 is a front view of a card base material for an IC card obtained by the method shown in FIG.

【符号の説明】[Explanation of symbols]

２０… 射出成形装置 ２２… 金型装置 ２４… 射出機 ３２… 射出制御装置 ３４… 可動側取付板 ３６… 固定側取付板 ３７… 固定側型板 ３８… 注入口 ４１… キャビティ ４６… エジェクタープレート ４８… エジェクターロッド ５０… 割面 ５２… ストリッパープレート ５６… 押圧部材 ６４… コマ体 ６６… 駆動用溝 ６７… テーパ面 ６８… 楔部材 ７０… 圧力シリンダ ７２… 切替弁 ７４… 油圧源 ８０… 駆動用テーパ面 ８２… 戻り用テーパ面 ８４… 微小凸部 ９０… ＩＣカード用カード基材 ９２… 埋設用凹部 １００… 射出成形品 １０２… 厚肉部 １０４… 薄肉部 20 ... Injection molding device 22 ... Mold device 24 ... Injection machine 32 ... Injection control device 34 ... Movable side mounting plate 36 ... Fixed side mounting plate 37 ... Fixed side template 38 ... Injection port 41 ... Cavity 46 ... Ejector plate 48 ... Ejector rod 50 ... Split surface 52 ... Stripper plate 56 ... Pressing member 64 ... Top body 66 ... Driving groove 67 ... Tapered surface 68 ... Wedge member 70 ... Pressure cylinder 72 ... Switching valve 74 ... Hydraulic source 80 ... Driving taper surface 82 Return taper surface 84 Micro protrusion 90 Card base material for IC card 92 Buried recess 100 Injection molded product 102 Thick portion 104 Thin portion

─────────────────────────────────────────────────────
─────────────────────────────────────────────────── ───

【手続補正書】[Procedure amendment]

【提出日】平成６年６月２日[Submission date] June 2, 1994

【手続補正１】[Procedure Amendment 1]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】特許請求の範囲[Name of item to be amended] Claims

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【特許請求の範囲】[Claims]

【手続補正２】[Procedure Amendment 2]

【補正対象書類名】明細書[Document name to be amended] Statement

【補正対象項目名】００３０[Name of item to be corrected] 0030

【補正方法】変更[Correction method] Change

【補正内容】[Correction content]

【００３０】本実施例では、押圧部材５６のキャビティ
４１内に対する初期突出量は、約０．４mmであり、キャ
ビティ４１の空隙厚さが約０．８mmであることから、キ
ャビティ４１でのその部分の隙間寸法Ａは、約０．４mm
である。ただし、本発明では、初期突出量は、０．４mm
に限定されず、０．５mm以下でも良い。初期突出量が小
さいほど、溶融樹脂充填時の流れが良好となるが、後工
程での押圧部材５６の突出移動の制御が難しくなる。In this embodiment, the initial protrusion amount of the pressing member 56 into the cavity 41 is about 0.4 mm, and the cavity thickness of the cavity 41 is about 0.8 mm. The clearance dimension A is about 0.4 mm
Is. However, in the present invention, the initial protrusion amount is 0.4 mm.
However , the thickness is not limited to 0.5 mm and may be 0.5 mm or less . The smaller the initial protrusion amount, the better the flow at the time of filling the molten resin, but it becomes difficult to control the protrusion movement of the pressing member 56 in the subsequent process.

Claims (4)

【特許請求の範囲】[Claims] 【請求項１】 金型のキャビティ内に溶融成形材を注入
する工程と、 キャビティ内への溶融成形材の充填が完了する時点付近
に、比較的薄肉部が形成される領域に相当する部分で、
金型に対して相対移動自在の押圧部材をキャビティ内に
突出させる工程と、 押圧部材がキャビティ内に突出した状態で溶融成形材
を、少なくとも所定の形状を保持し得る程度に固化さ
せ、射出成形品を得る工程と、 得られた射出成形品を金型内から取り出す工程とを有す
る射出成形品の製造方法。1. A step of injecting a molten molding material into a cavity of a mold, and a portion corresponding to a region where a relatively thin portion is formed near the time when the filling of the molten molding material into the cavity is completed. ,
The step of projecting a pressing member that is movable relative to the mold into the cavity, and solidifying the molten molded material to the extent that it can hold at least a predetermined shape with the pressing member protruding into the cavity, and injection molding A method of manufacturing an injection-molded product, comprising the steps of obtaining a product and taking out the obtained injection-molded product from a mold. 【請求項２】 金型のキャビティ内に溶融成形材を注入
する工程と、 キャビティ内への溶融成形材の充填が完了する時点付近
に、ＩＣカードのＩＣモジュールが収容される凹部に相
当する部分で、金型に対して相対移動自在の押圧部材を
キャビティ内に突出させる工程と、 押圧部材がキャビティ内に突出した状態で溶融成形材
を、少なくとも所定の形状を保持し得る程度に固化さ
せ、ＩＣカード用カード基材を得る工程と、 得られたＩＣカード用カード基材を金型内から取り出す
工程とを有するＩＣカード用カード基材の製造方法。2. A portion corresponding to a recess for accommodating an IC module of an IC card near the step of injecting the molten molding material into the cavity of the mold and the time when the filling of the molten molding material into the cavity is completed. Then, a step of projecting a pressing member movable relative to the mold into the cavity, and a step of solidifying the molten molded material in a state where the pressing member projects into the cavity, to such an extent that at least a predetermined shape can be retained, A method for producing a card base material for an IC card, comprising a step of obtaining a card base material for an IC card and a step of taking out the obtained card base material for an IC card from a mold. 【請求項３】 キャビティが形成された金型と、 金型のキャビティ内に対して突出移動および後退移動が
自在に配置された押圧部材と、 前記押圧部材を駆動し、押圧部材の突出移動および後退
移動を可能にする駆動手段とを有する射出成形装置。3. A mold in which a cavity is formed, a pressing member which is arranged so as to be capable of projecting and retracting movement in the cavity of the mold, and a pressing member which is driven to project and move the pressing member. An injection molding apparatus having a driving means capable of moving backward. 【請求項４】 前記キャビティ内に溶融成形材が充填さ
れた時点近傍で、前記押圧部材をキャビティ内に突出さ
せ、溶融成形材が少なくとも所定の形状を保持し得る程
度に固化した時点で、押圧部材をキャビティ内から後退
移動させるように、前記駆動手段を制御する制御手段を
有する請求項３に記載の射出成形装置。4. The pressing member is projected into the cavity in the vicinity of the time when the molten molding material is filled in the cavity, and is pressed when the molten molding material is solidified to such an extent that it can hold at least a predetermined shape. The injection molding apparatus according to claim 3, further comprising control means for controlling the driving means so as to move the member backward from the cavity.
JP7046093A 1993-03-29 1993-03-29 Manufacture of injection molded product and its molding device Pending JPH06278178A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7046093A JPH06278178A (en) 1993-03-29 1993-03-29 Manufacture of injection molded product and its molding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7046093A JPH06278178A (en) 1993-03-29 1993-03-29 Manufacture of injection molded product and its molding device

Publications (1)

Publication Number Publication Date
JPH06278178A true JPH06278178A (en) 1994-10-04

Family

ID=13432159

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7046093A Pending JPH06278178A (en) 1993-03-29 1993-03-29 Manufacture of injection molded product and its molding device

Country Status (1)

Country Link
JP (1) JPH06278178A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010510914A (en) * 2006-11-27 2010-04-08 エーセーイーエム テクノロジーズ ベー．フェー． Apparatus and method for molding a product
JP2011194895A (en) * 2004-08-26 2011-10-06 Apic Yamada Corp Resin molding die
JP2015059883A (en) * 2013-09-20 2015-03-30 株式会社デンソー Position detection device
CN114311508A (en) * 2021-12-17 2022-04-12 苏州优耐鑫模具科技有限公司 High-reliability double-color injection mold for tight fitting molding

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011194895A (en) * 2004-08-26 2011-10-06 Apic Yamada Corp Resin molding die
JP2010510914A (en) * 2006-11-27 2010-04-08 エーセーイーエム テクノロジーズ ベー．フェー． Apparatus and method for molding a product
JP2015059883A (en) * 2013-09-20 2015-03-30 株式会社デンソー Position detection device
CN114311508A (en) * 2021-12-17 2022-04-12 苏州优耐鑫模具科技有限公司 High-reliability double-color injection mold for tight fitting molding
CN114311508B (en) * 2021-12-17 2023-09-05 苏州优耐鑫模具科技有限公司 High-reliability double-color injection mold for close fitting molding

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