JPH06269744A - Automatic tip separating and feeding device - Google Patents
Automatic tip separating and feeding deviceInfo
- Publication number
- JPH06269744A JPH06269744A JP8274393A JP8274393A JPH06269744A JP H06269744 A JPH06269744 A JP H06269744A JP 8274393 A JP8274393 A JP 8274393A JP 8274393 A JP8274393 A JP 8274393A JP H06269744 A JPH06269744 A JP H06269744A
- Authority
- JP
- Japan
- Prior art keywords
- chip
- wheel
- tip
- suction
- feeding device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Branching, Merging, And Special Transfer Between Conveyors (AREA)
- Specific Conveyance Elements (AREA)
- Sorting Of Articles (AREA)
- Feeding Of Articles To Conveyors (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、主としてチップ（各種
小形電子部品）をテープのチップ装填孔に装填してチッ
プテープを製造するチップテーピングマシン、若しくは
チップをカセット（設定数のチップを収納する）に装填
してチップカセットを製造するチップカセット製造装置
の一部装置として使用するものであり、直線整列フィダ
ーから１列送給されてくるチップをチップ移乗制御部を
経て、間欠回転するホイールの各チップ支持部に１個宛
分離して吸着支持し、該チップをホイールの円周に沿っ
て備えた検測手段、不良チップの脱却手段で順次セレク
トして、残った良品チップのみを装填手段でチップテー
プ若しくはチップカセットに装填するようにした、チッ
プ自動分離送給装置に係るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention is mainly a chip taping machine for manufacturing chips by loading chips (various small electronic components) into chip loading holes of a tape, or a cassette of cassettes (for storing a preset number of chips). ) Is used as a part of a chip cassette manufacturing device for manufacturing a chip cassette, and the chips fed from the linear alignment feeder in one row are intermittently rotated through a chip transfer control unit. Each chip support part is separated by one and adsorbed and supported, and the chips are sequentially selected by the inspection means provided along the circumference of the wheel and the defective chip removal means, and only the remaining good chips are loaded. The present invention relates to an automatic chip separating / feeding device which is loaded on a chip tape or a chip cassette.
【０００２】[0002]
【前提技術とその課題】本発明は、本願の発明者、出願
人が先に特許出願した、（イ）特願平１−９２３２６号
（特開平２−２７０７１７号）、発明の名称「チップ自
動分離送給装置」、（ロ）特願平１−１４２３６２号
（特開平３−８６１９号）、発明の名称「チップ自動分
離送給装置」の改良発明に係り、上記特許出願発明の課
題点を解決することを目的とするものである。The present invention is based on (A) Japanese Patent Application No. 1-92326 (Japanese Patent Application Laid-Open No. 2-270717), which has been previously filed by the inventor and the applicant of the present invention, and the title of the invention is "chip automatic". Separation and feeding device ", (b) Japanese Patent Application No. 1-142362 (Japanese Patent Laid-Open No. 3-8619), and an improved invention of the title" automatic chip separation and feeding device ". The purpose is to resolve.
【０００３】即ち、発明（イ）は、チップをホイールの
円周面に直立状態に支持して搬送する点で本発明と一致
しているが、チップをチップ移乗制御部からホイールの
チップ支持部へ吸気口の吸気力で吸引装填するとき、吸
気口がチップ支持部の下方部に開設されているだけなの
で、チップの装填がややスムーズにいかない難点があ
り、不完全装填を生じる恐れがあり、また、チップの下
方部だけを吸着するだけなので、回転搬送時の吸着支持
としては不十分であって、従来同様にチップの搬送途中
脱落を防止するカバー若しくはガイド等をホイールの内
周面に沿って設置する必要があるが、該カバー、ガイド
等を取付けると検測手段や不良チップ脱却手段の設置が
やり難くなる上に、検測や脱却装填の様子を外部から目
で直接監視できない（本発明はできる）欠点があった。That is, the invention (a) is consistent with the present invention in that the chip is supported by the circumferential surface of the wheel in an upright state and conveyed, but the chip is transferred from the chip transfer control unit to the chip supporting unit of the wheel. When suction-loading with the suction force of the intake port, the intake port is only opened in the lower part of the chip support part, so there is a problem that the chip loading is not smooth and there is a possibility that incomplete loading may occur. Also, since it only adsorbs only the lower part of the chip, it is not sufficient as a suction support during rotary transfer, and a cover or guide that prevents the chip from falling off during transfer is attached to the inner peripheral surface of the wheel as in the conventional case. It is necessary to install along the cover, but if the cover, guide, etc. are attached, it becomes difficult to install the inspection means and the defective chip removal means, and the state of inspection and removal loading cannot be directly monitored from the outside. The present invention can be) there is a problem.
【０００４】また、発明（イ）の出願においては、検測
手段及び不良チップ脱却手段の存在の記載はあるが、手
段自体の内容は開示されていない。そこで、本発明は有
効な検測手段及び不良チップ脱却手段を新規に開発した
ものである。Further, in the application of the invention (a), there is a description of the existence of the inspection means and the defective chip removal means, but the content of the means itself is not disclosed. Therefore, the present invention newly develops effective inspection means and defective chip removal means.
【０００５】発明（ロ）は、チップ支持部がホイールの
円周部に水平に形成されており、チップを水平に支持搬
送するように備えたものであるが、このタイプには下記
のような課題点があった。即ち、チップを水平に支持す
るため、チップの厚味に合わせてホイールの厚さを極め
て薄くせざるを得ず、よって、ホイールが脆弱で破損、
損耗しやすく、反り、歪みを生じやすく、反面、製造加
工がしにくい。According to the invention (b), the chip supporting portion is formed horizontally on the circumferential portion of the wheel, and the chip supporting portion is provided so as to horizontally support and convey the chip. There were issues. That is, in order to support the chip horizontally, it is unavoidable to make the thickness of the wheel extremely thin according to the thickness of the chip, so the wheel is fragile and damaged,
It is easily worn and easily warped and distorted. On the other hand, it is difficult to manufacture and process.
【０００６】チップが回転搬送途中で脱落しないように
ホイールのチップ支持部をカバーすることを要し、よっ
てホイールの円周面及びチップ支持部の上下面を覆うカ
バーを取り付けねばならず、また、該カバーを取付けた
ために、検測手段、不良チップ脱却手段、装填手段等の
設置がやり難くなる上に、検測、脱却、装填の様子を外
部から目で直接監視できない欠点があった。[0006] It is necessary to cover the tip supporting portion of the wheel so that the tip does not fall off during the rotary conveyance, and therefore a cover for covering the circumferential surface of the wheel and the upper and lower surfaces of the tip supporting portion must be attached, and Since the cover is attached, it is difficult to install the inspection means, the defective chip removal means, the loading means, and the like, and there is a drawback that the states of the inspection, the removal, and the loading cannot be directly observed from the outside.
【０００７】[0007]
【課題を解決する手段】本発明は上記の課題を下記の手
段により有効に解決したものである。即ち、本発明は、
ホイールの円周面に、チップを直立状態に吸着支持する
チップ支持部を垂直に等間隔に設け、各チップ支持部の
中央部に吸気口を開設し、ホイールのチップ支持部と対
設して直線整列フィダーの先端の間に、チップ支持部の
下方部に向って開口した吸気口と光センサーを備えたチ
ップ移乗制御部を設け、また、ホイールの円周に沿っ
て、チップの検測手段と不良チップの脱却手段と検測済
み良品チップの装填手段を備えた、チップ自動分離送給
装置によって課題を解決したものである。The present invention effectively solves the above problems by the following means. That is, the present invention is
On the circumferential surface of the wheel, chip support parts that adsorb and support chips in an upright state are provided vertically at equal intervals, and intake ports are opened at the center of each chip support part, facing the chip support part of the wheel. Between the tip of the linear alignment feeder, a chip transfer control unit equipped with an air inlet and an optical sensor opened toward the lower part of the chip support unit is provided, and a chip inspection means is provided along the circumference of the wheel. The problem is solved by an automatic chip separation / feeding device equipped with a means for removing defective chips and a means for loading good chips that have already been measured.
【０００８】次に、本発明の実施例を図面につき説明す
ると、ホイール１の円周面に、チップｔを直立状態に吸
着支持するチップ支持部２を垂直に等間隔に設け、各チ
ップ支持部２の中央部に吸気口３を開設し、ホイール１
のチップ支持部２と対設した直線整列フィダー４の先端
の間に、チップ支持部２の下方部に向って開口した吸気
口７と光センサー６を備えたチップ移乗制御部５を設
け、また、ホイール１の円周に沿って、チップｔの検測
手段８と不良チップの脱却手段９と検測済み良品チップ
の装填手段１０を備えてチップ自動分離送給装置Ａを構
成したものである。An embodiment of the present invention will now be described with reference to the drawings. On the circumferential surface of the wheel 1, chip supporting portions 2 for adsorbing and supporting the chips t in an upright state are vertically provided at equal intervals, and each chip supporting portion is provided. Inlet 3 is opened in the center of 2 and wheel 1
Between the tip of the linear support feeder 2 and the tip support part 2 of the chip support part 2, a chip transfer control part 5 having an intake port 7 opening toward the lower part of the chip support part 2 and an optical sensor 6 is provided. Along with the circumference of the wheel 1, the automatic chip separation and feeding device A is provided with the inspection means 8 for the chips t, the removing means 9 for the defective chips, and the loading means 10 for the inspected non-defective chips. .
【０００９】上記チップ自動分離送給装置Ａにおいて、
ホイール１は、その円周面にチップｔを直立状態に吸着
支持するコ形溝状のチップ支持部２を垂直に等間隔に形
成し、各チップ支持部２の背面中央部に吸気口３を開設
し、パルスモーター１１等でチップ支持部２の間隔毎に
間欠制御回転するように設けたものであり、該ホイール
１の下面に密接して各チップ支持部２の各吸気口３に連
通した欠円状の吸気溝１２を形成した固定部１３を備
え、該吸気溝１２を通して各チップ支持部２の吸気口３
から連続吸気するようにしたものである。In the chip automatic separating and feeding apparatus A,
The wheel 1 is provided with U-shaped groove-shaped chip support portions 2 for vertically adsorbing and supporting the chips t in an upright state on its circumferential surface at equal intervals, and an intake port 3 is provided at the center of the back surface of each chip support portion 2. It is provided so as to be intermittently controlled and rotated by the pulse motor 11 or the like at intervals of the tip support portion 2, and is in close contact with the lower surface of the wheel 1 and communicates with each intake port 3 of each tip support portion 2. A fixed portion 13 having a cutout-shaped intake groove 12 is provided, and an intake port 3 of each chip support 2 is provided through the intake groove 12.
It is intended to continuously inhale from.
【００１０】チップ移乗制御部５は、振動式等の直線整
列フィダー４のチップ送給中心線上で、ホイール１のチ
ップ支持部２の略中央部に対面する位置に光センサー６
の光通過孔６ａをあけると共に、同チップ支持部２の下
方部に対面する位置に吸気口７を開設し、また、必要に
応じてチップ吸着口１４を光通過孔９ａと並べて、直線
整列フィダー４の先端との間に開設したものである。The chip transfer control unit 5 is located on the chip feeding center line of the linear alignment feeder 4 of the vibration type or the like, and is located at a position facing the substantially central portion of the chip support unit 2 of the wheel 1 with the optical sensor 6 provided.
The light passage hole 6a is opened, and the air intake port 7 is opened at a position facing the lower portion of the chip support portion 2. Further, the chip suction port 14 is aligned with the light passage hole 9a if necessary, and a linear alignment feeder is provided. It was established between the tip of No.4.
【００１１】なお、チップ移乗制御部５の上面におい
て、１５は直線整列フィダー４の先端とホイール１のチ
ップ支持部２の間でチップの進行を案内するガイド部で
あり、該ガイド部１５はチップ支持部２に近い側で略気
密構成の吸引部１５ａと、フィダー４の先端に近い側で
上面開放構成の無吸引部１５ｂからなり、吸引部１５ａ
に光センサー６の光通過孔６ａを設け、また、無吸引部
１５ｂに必要に応じてチップ吸着口１４を開設したもの
である。On the upper surface of the chip transfer control unit 5, reference numeral 15 is a guide unit for guiding the progress of the chip between the tip of the linear alignment feeder 4 and the chip support unit 2 of the wheel 1. The guide unit 15 is a chip. The suction portion 15a having a substantially airtight structure on the side closer to the support portion 2 and the non-suction portion 15b having an open upper surface on the side closer to the tip of the feeder 4 are suction portions 15a.
The light passing hole 6a of the optical sensor 6 is provided in the above, and the chip suction port 14 is opened in the non-suction portion 15b as required.
【００１２】チップｔの抵抗値等を検測するの検測手段
８は、ホイール１の円周に沿って、該ホイール１のチッ
プ支持部２の直上に固定検測端子８ａを、直下に可動検
測端子８ｂを設置し、可動検測端子８ｂを固定検測端子
８ａに向って設定寸法上下動するように備えたものであ
り、チップ支持部２に吸着支持されたチップｔの下端
（電極）を可動検測端子８ｂの上昇動で押動して上端
（電極）を固定検測端子８ａに圧接通電してチップｔの
検測を行うように備えたものである。The measuring means 8 for measuring the resistance value or the like of the tip t is movable along the circumference of the wheel 1 with a fixed measuring terminal 8a directly above the tip supporting portion 2 of the wheel 1 and directly below. The inspection terminal 8b is provided, and the movable inspection terminal 8b is provided so as to move up and down by a set dimension toward the fixed inspection terminal 8a. The lower end of the tip t (electrode ) Is pushed by the ascending movement of the movable inspection terminal 8b, and the upper end (electrode) is pressed against the fixed inspection terminal 8a to be energized to inspect the tip t.
【００１３】不良チップの脱却手段９は、ホイール１の
内周に沿って、該ホイール１のチップ支持部２の直上に
噴気ノズル９ａを備えると共に、同チップ支持部２の直
下に適宜の落下シュート９ｂを備えたものであり、前段
の検測手段８で検測された不良チップｔを、チップ支持
部２の吸気口３による吸着支持力よりも強力な噴気ノズ
ル９ａの噴気で落下シュート９ｂに向って脱却するよう
に備えたものである。The defective chip removing means 9 is provided with an injection nozzle 9a along the inner circumference of the wheel 1 just above the chip support 2 of the wheel 1 and an appropriate drop chute just below the chip support 2. 9b, the defective chip t measured by the measuring means 8 in the preceding stage is dropped onto the drop chute 9b by the fumes of the fuming nozzle 9a stronger than the suction supporting force of the suction port 3 of the chip supporting portion 2. It is prepared for you to leave.
【００１４】そして、検測手段８及び不良チップの脱却
手段９を経て、チップ支持部２に吸着支持搬送されてき
た良品チップｔを、適宜の装填手段１０、例えば、ホイ
ール１の内周に沿って備えたサクションヘッド（図示せ
ず）若しくは噴気ノズル１０ａと落下シュートなどの装
填手段１０で、チップテープ若しくはチップカセット等
へ装填するように備えたものである。Then, the non-defective chip t, which has been sucked and supported and conveyed to the chip support portion 2 via the inspection means 8 and the defective chip removal means 9, is provided along an appropriate loading means 10, for example, the inner circumference of the wheel 1. A suction head (not shown) or an ejection nozzle 10a and a dropping chute or the like are provided so that the chip tape or the chip cassette can be loaded.
【００１５】[0015]
【作用】直線整列フィダー４から順に押せ押せの状態
で、若しくは、ばらばらの状態で１列送給されてきたチ
ップｔ1 がチップ移乗制御部５に乗り、その先端が無吸
引部１５ｂを通り吸引部１５ａに進入した瞬間に、吸気
口３、７の吸気による吸引力が作用して、該チップｔ1
は１瞬の間にホイール１のチップ支持部２に装填吸着支
持される。The chips t 1 that have been fed in a row from the linear alignment feeder 4 in order of being pressed or in a separated state ride on the chip transfer control unit 5 and the tip thereof passes through the suctionless unit 15b to suck. At the moment of entering the portion 15a, the suction force by the intake air of the intake ports 3 and 7 acts, and the tip t 1
Is loaded and adsorbed and supported by the chip support portion 2 of the wheel 1 in a moment.
【００１６】この間、チップｔ1 は光通過孔６ａを通過
するので光センサーの光線を１瞬間遮断し、吸気口３、
７、特にチップ支持部２の下方部の吸気口７の吸引力で
先端から倒立するように９０°回転して直立状態に吸引
装填され、該直立状態を背面中央部の吸気口３の吸引力
で吸着支持される。During this time, since the tip t 1 passes through the light passage hole 6a, the light beam of the optical sensor is interrupted for a moment, and the air inlet 3,
7, especially the suction force of the suction port 7 at the lower part of the tip support 2 rotates 90 ° so as to invert from the tip and is suction-loaded in an upright state. Supported by adsorption.
【００１７】そして、上記光線の１瞬間遮断を光センサ
ー６が検知し、ホイール１を１駒回転して、チップｔ1
を次位へ送ると共に、次のチップｔ2 のための空のチッ
プ支持部２がガイド部１５の正面に到来して停止する。Then, the optical sensor 6 detects the momentary interruption of the light beam, and the wheel 1 is rotated by one frame so that the tip t 1
And sends the to next order, an empty tip support portion 2 for the next chip t 2 is stopped by coming in front of the guide portion 15.
【００１８】上記のようにｔ1 の先端が無吸引部１５ｂ
から吸引部１５ａに進入した瞬間にチップ支持部２に吸
引装填されるため、次のチップｔ2 との間に空きが生じ
るが、その時チップｔ2 の先端は無吸引部１５ｂにあ
り、吸気口３、７の吸引力が全く作用しないため、チッ
プｔ2 はその先端が吸引部１５ａに進入しない限り吸引
装填されることがなく、よって、先のチップｔ1 の装填
時にチップｔ2 が一緒に吸引されてしまうトラブルを生
じる恐れが全くない。As described above, the tip of t 1 has no suction portion 15b.
Since the tip support portion 2 is suction-loaded at the moment when the tip t 2 enters from the suction portion 15a, there is a space between the tip tip 2 and the next tip t 2 , but at that time, the tip of the tip t 2 is in the non-suction portion 15b and the suction port since the suction force of 3,7 does not act at all, the chip t 2 is without its leading end is sucked loaded unless enters the suction unit 15a, therefore, together chip t 2 during loading of the previous chip t 1 There is no risk of inhalation problems.
【００１９】なお、直線整列フィダーの１列送給チップ
が押せ押せの状態で高速送給されてくるために、先の装
填チップｔ1 と次のチップｔ2 の間の距離及び時間がと
り難いような場合には、ガイド部１５の光通過孔６ａの
前段にチップ吸着口１４（または図示しない出没ストッ
パーピン）を設けて、光センサー６の検知と連携してチ
ップｔ2 を一瞬吸引停止するようにする。即ち、チップ
吸気口１４（または出没ストッパーピン）は、通常の場
合は必要ないが、チップの種類や送給、装填速度等との
関係で必要とされる場合に設けるものである。Since the single-row feed tip of the linear alignment feeder is fed at a high speed while being pressed, it is difficult to take the distance and time between the first tip t 1 and the next tip t 2. In such a case, a tip suction port 14 (or a retractable stopper pin (not shown)) is provided in the preceding stage of the light passage hole 6a of the guide portion 15, and the tip t 2 is temporarily sucked and stopped in cooperation with the detection of the optical sensor 6. To do so. That is, the chip intake port 14 (or the retractable stopper pin) is not necessary in the normal case, but is provided when it is necessary in relation to the type of chip, feeding, loading speed, and the like.
【００２０】上記のようにして、各チップ支持部２にチ
ップｔを吸着支持したホイールが回転して（第１）検測
手段８の位置にくると、可動検測端子８ｂが上昇してチ
ップ支持部２内のチップｔの下端（電極）に当接して押
し上げチップｔの上端（電極）を固定検測端子８ａに圧
接し通電して、抵抗値等の検測を行う。As described above, when the wheel supporting the tip t by suction on each tip supporting portion 2 rotates to the position of the (first) inspection means 8, the movable inspection terminal 8b rises and the tip is moved. The lower end (electrode) of the tip t in the support portion 2 is brought into contact with the upper end (electrode) of the push-up tip t to press the fixed measuring terminal 8a to energize, and the resistance value or the like is measured.
【００２１】更にホイール１が回転して不良チップの
（第１）脱却手段９の位置にくると、チップ支持部２の
チップｔが、先の検測手段８で不良チップと検測された
場合は、噴気ノズル９ａから圧力空気が噴出して、吸気
口３で吸着支持されているチップｔを、下方の落下シュ
ート９ｂに向けて吹き落し脱却する。チップｔが良品チ
ップと検測された場合は、上記脱却作用は行われず、チ
ップはチップ支持部２に吸着支持されたまま回転搬送さ
れる。When the wheel 1 further rotates to the position of the (first) removing means 9 of the defective chip, the chip t of the chip supporting portion 2 is detected as a defective chip by the above-mentioned measuring means 8. The compressed air is ejected from the squirt nozzle 9a, and the tip t sucked and supported by the intake port 3 is blown off toward the lower drop chute 9b to be removed. When the chip t is detected as a non-defective chip, the releasing action is not performed, and the chip is rotatably conveyed while being suction-supported by the chip support portion 2.
【００２２】続いて、更にホイール１が回転して（第
２）検測手段８でチップを検測し、（第２）脱却手段９
で不良チップを脱却し、Then, the wheel 1 is further rotated, the chip is measured by the (second) measuring means 8, and the (second) releasing means 9 is used.
To remove the defective chip,
【００２３】上記２段階の検測手段と不良チップ脱却手
段を通ってセレクトされたチップｔだけが最後の装填手
段１０の位置に到達し、ここで、チップカセット（図示
せず）に装填する場合は噴気ノズル１０ａの噴気でチッ
プ支持部２から脱却され、落下シュートを経てカセット
内に装填され、また、チップテープ（図示せず）に装填
する場合はサクションヘッド等でチップ支持部２からテ
ープのチップ装填凹部に装填されるものである。When only the chip t selected through the above-described two-step inspection means and defective chip removal means reaches the position of the last loading means 10 and is loaded into a chip cassette (not shown) here Is ejected from the chip support part 2 by the fumes of the fumarolic nozzle 10a, loaded into the cassette through the drop chute, and when loaded on a chip tape (not shown), the tape is removed from the chip support part 2 with a suction head or the like. It is loaded in the chip loading recess.
【００２４】[0024]
【効果】ホイールのチップ支持部にチップを直立状態に
吸着支持するようにしたので、チップを水平に支持する
場合と異なり、ホイールを格段に肉厚に強固に構成でき
て耐久性に秀れ製造加工が容易となり、チップ支持部の
背面中央に吸気口を設けてチップを極めて安定的に吸着
支持し得るようにしたので、チップがホイールの回転中
に脱落する恐れがなく、よって、従来ホイールの円周に
沿って設置せねばならなかったカバーやガイドプレート
等が不要となり、その結果、ホイールの円周に検測手
段、脱却手段、装填手段、その他の付属機構を設置しや
すくなると共に、ホイールの円周部分が露出するため、
検測手段、脱却手段、その他の位置において搬送中のチ
ップを外部から直接監視し得て、トラブル発生の予防、
処理等を容易に行える極めて秀れた特長がある。[Effect] Since the chips are supported by the chip support part of the wheel in an upright state, unlike the case where the chips are supported horizontally, the wheel can be constructed to be significantly thick and strong, and it has excellent durability. Since the machining is easy, and the air inlet is provided in the center of the back surface of the tip support part so that the tip can be adsorbed and supported very stably, there is no risk of the tip falling off during rotation of the wheel, therefore The cover, guide plate, etc. that had to be installed along the circumference are no longer required, and as a result, it becomes easier to install the inspection means, the removal means, the loading means, and other attached mechanisms on the circumference of the wheel, and the wheel. Because the circumference part of is exposed,
It is possible to directly monitor the chips being conveyed at the inspection means, the removal means, and other positions from the outside, and prevent the occurrence of troubles.
It has an outstanding feature that processing can be performed easily.
【００２５】チップ移乗制御部からホイールのチップ支
持部にチップを直立装填するとき、特にチップ保持部の
下方部に対面した位置に吸気口７を開設したので、該吸
気口７の吸引力がチップの先端部を倒立回転するように
作用すると共に、正確な直立状態に吸引し得て、チップ
の装填、吸着支持を正しい姿勢で確実に行い得るように
した多大の効果がある。When the chips are vertically loaded from the chip transfer control unit to the chip support unit of the wheel, since the intake port 7 is opened especially at a position facing the lower part of the chip holding unit, the suction force of the intake port 7 is There is a great effect that the tip portion of the device can be rotated upside down, and the tip can be sucked in an accurate upright state so that chip loading and suction support can be reliably performed in a correct posture.
【図１】本発明の実施例の縦断正面図。FIG. 1 is a vertical sectional front view of an embodiment of the present invention.
【図２】図１の平面図。FIG. 2 is a plan view of FIG.
【図３】（イ）、（ロ）はチップの１個分離、移乗、装
填及び吸着支持の作用説明図。3 (a) and 3 (b) are operation explanatory views of one chip separation, transfer, loading, and suction support.
【図４】検測手段の実施例の一部拡大正面図。FIG. 4 is a partially enlarged front view of the embodiment of the inspection means.
Ａ 本発明装置 ｔ チップ １ ホイール ２ チップ支持部 ３ 吸気口 ４ 直線整列フィダー ５ チップ移乗制御部 ６ 光センサー ６ａ 光通過孔 ７ 吸気口 ８ 検測手段 ８ａ 固定検測端子 ８ｂ 可動検測端子 ９ 不良チップの脱却手段 ９ａ 噴気ノズル ９ｂ 落下シュート １０ 装填手段 １０ａ 噴気ノズル １１ パルスモーター １２ 吸気溝 １３ 固定部 １４ チップ吸着口 １５ ガイド部 １５ａ 吸引部 １５ｂ 無吸引部 A device of the present invention t chip 1 wheel 2 chip support part 3 intake port 4 linear alignment feeder 5 chip transfer control part 6 optical sensor 6a light passage hole 7 intake port 8 inspection means 8a fixed inspection terminal 8b movable inspection terminal 9 defective Tip removal means 9a Fume nozzle 9b Drop chute 10 Loading means 10a Fume nozzle 11 Pulse motor 12 Intake groove 13 Fixing part 14 Tip suction port 15 Guide part 15a Suction part 15b Non-suction part
Claims (6)
吸着支持するチップ支持部を垂直に等間隔に設け、各チ
ップ支持部の中央部に吸気口を開設し、ホイールのチッ
プ支持部と対設した直線整列フィダーの先端の間に、チ
ップ支持部の下方部に向って開口した吸気口と光センサ
ーを備えたチップ移乗制御部を設け、また、ホイールの
円周に沿って、チップの検測手段と不良チップの脱却手
段と検測済み良品チップの装填手段を備えた、チップ自
動分離送給装置。1. A tip supporting portion for a wheel, wherein chip supporting portions for adsorbing and supporting chips in an upright state are vertically provided at equal intervals on a circumferential surface of a wheel, and air inlets are opened at central portions of the respective chip supporting portions. Between the tip of the linear alignment feeder that is opposed to the tip transfer control section, which is equipped with an air inlet and an optical sensor that opens downward to the tip support section, and along the circumference of the wheel Automatic chip separation and feeding device, which is equipped with the inspection means, the removal means for defective chips, and the loading means for good chips that have been inspected.
態に吸着支持するコ形溝状のチップ支持部を垂直に等間
隔に形成し、各チップ支持部の背面中央部に吸気口を開
設し、パルスモーター等で間欠制御回転するように設け
たものであり、 該ホイールの下面に密接して各チップ支持部の各吸気口
に連通した欠円状の吸気溝を形成した固定部を備え、該
吸気溝を通して各チップ支持部の吸気口から連続吸気す
るようにしたものである、請求項１のチップ自動分離送
給装置。2. A wheel is formed with U-shaped groove-shaped chip support portions for vertically adsorbing and supporting chips in an upright state on a circumferential surface of the wheel at equal intervals, and an intake port is provided at the center of the back surface of each chip support portion. It is provided so as to rotate intermittently with a pulse motor or the like, and has a fixed portion that is in close contact with the lower surface of the wheel and that has an intake circular groove formed in the shape of an open circle that communicates with each intake port of each chip support section. The chip automatic separation / feeding device according to claim 1, further comprising: an air intake port for continuously inhaling air from the air intake port of each chip support portion through the air intake groove.
フィダーのチップ送給中心線上で、ホイールのチップ支
持部の略中央部に対面する位置に光センサーの光通過孔
をあけると共に、同チップ支持部の下方部に対面する位
置に吸気口を開設し、また、必要に応じてチップ吸着口
を光通過孔と並べて開設したものである、請求項１のチ
ップ自動分離送給装置。3. The chip transfer control unit opens a light passage hole of an optical sensor at a position facing a substantially central portion of a chip support unit of a wheel on a chip feeding center line of a linear alignment feeder of a vibration type or the like, The automatic chip separation and feeding device according to claim 1, wherein an air intake port is opened at a position facing a lower portion of the chip support part, and a chip suction port is opened side by side with the light passage hole if necessary.
って、該ホイールのチップ支持部の直上（または直下）
に固定検測端子を、直下（または直上）に可動検測端子
を設置し、可動検測端子を固定検測端子に向って設定寸
法上下動するように備えたものであり、チップ支持部に
吸着支持されたチップの一端（電極）を可動検測端子の
上（下）動で押動して他端（電極）を固定検測端子に圧
接通電してチップの検測を行うように備えたものであ
る、請求項１のチップ自動分離送給装置。4. The tip inspection means is located immediately above (or immediately below) the tip support portion of the wheel along the circumference of the wheel.
It is equipped with a fixed inspection terminal at and a movable inspection terminal directly below (or directly above), and the movable inspection terminal is provided to move up and down by a set dimension toward the fixed inspection terminal. Prepared to perform chip inspection by pushing one end (electrode) of the suction-supported chip by upward (down) movement of the movable inspection terminal and pressing the other end (electrode) to the fixed inspection terminal to energize The automatic chip separation and feeding device according to claim 1, wherein
に沿って、該ホイールのチップ支持部の直上に噴気ノズ
ルを備えると共に、同チップ支持部の直下に適宜の落下
シュートを備えたものであり、前段の検測手段で検測さ
れた不良チップを、チップ支持部の吸気口による吸着支
持力よりも強力な噴気ノズルの噴気で落下シュートに向
って脱却するように備えたものである、請求項１のチッ
プ自動分離送給装置。5. A means for removing defective chips is provided with an injection nozzle along the inner circumference of the wheel, directly above the chip support portion of the wheel, and with an appropriate drop chute just below the chip support portion. In addition, the defective chip detected by the inspection means in the previous stage is provided so as to escape toward the drop chute with the fumes of the fuming nozzle stronger than the suction supporting force of the suction port of the chip supporting portion. The automatic chip separation and feeding device according to claim 1.
チップ支持部に吸着支持搬送されてきた良品チップを、
ホイールの内周に沿って備えたサクションヘッド若しく
は噴気ノズルと落下シュートなどの適宜の装填手段でチ
ップテープ若しくはチップカセット等へ装填するように
備えた、請求項１のチップ自動分離送給装置。6. The inspection means and the defective chip removal means are used,
Good chips that have been suction-supported and transported to the chip support
2. The automatic chip separation and feeding device according to claim 1, which is equipped so as to be loaded on a chip tape or a chip cassette by an appropriate loading means such as a suction head or an ejection nozzle provided along the inner circumference of a wheel and a drop chute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08274393A JP3262400B2 (en) | 1993-03-17 | 1993-03-17 | Automatic chip feeder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP08274393A JP3262400B2 (en) | 1993-03-17 | 1993-03-17 | Automatic chip feeder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06269744A true JPH06269744A (en) | 1994-09-27 |
| JP3262400B2 JP3262400B2 (en) | 2002-03-04 |
Family
ID=13782909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP08274393A Expired - Lifetime JP3262400B2 (en) | 1993-03-17 | 1993-03-17 | Automatic chip feeder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3262400B2 (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001163435A (en) * | 1999-12-14 | 2001-06-19 | Nitto Kogyo Co Ltd | Setting surface arranging carrying device of chip |
| JP2002113427A (en) * | 2000-08-02 | 2002-04-16 | Hyuu Brain:Kk | Device for testing fine object |
| JP2002284335A (en) * | 2001-03-26 | 2002-10-03 | Shinko Electric Co Ltd | Component attitude selecting device |
| KR100401422B1 (en) * | 2000-08-28 | 2003-10-17 | 가부시키가이샤 무라타 세이사쿠쇼 | Transferring apparatus for chips and method of use |
| US7119299B2 (en) | 2003-01-20 | 2006-10-10 | Tokyo Weld Co., Ltd. | Work inspection system |
| JP2007230661A (en) * | 2006-02-27 | 2007-09-13 | Tokyo Weld Co Ltd | Workpiece carrying system |
| JP2012246102A (en) * | 2011-05-27 | 2012-12-13 | Tokyo Weld Co Ltd | Workpiece conveyance inspection system, and workpiece conveyance inspection method |
| CN107394559A (en) * | 2017-07-21 | 2017-11-24 | 信华科技（厦门）有限公司 | A kind of continuously cutting with terminal product and collecting device |
| JP2019112199A (en) * | 2017-12-25 | 2019-07-11 | 株式会社菊水製作所 | Molding conveyance device |
-
1993
- 1993-03-17 JP JP08274393A patent/JP3262400B2/en not_active Expired - Lifetime
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001163435A (en) * | 1999-12-14 | 2001-06-19 | Nitto Kogyo Co Ltd | Setting surface arranging carrying device of chip |
| JP2002113427A (en) * | 2000-08-02 | 2002-04-16 | Hyuu Brain:Kk | Device for testing fine object |
| KR100401422B1 (en) * | 2000-08-28 | 2003-10-17 | 가부시키가이샤 무라타 세이사쿠쇼 | Transferring apparatus for chips and method of use |
| JP2002284335A (en) * | 2001-03-26 | 2002-10-03 | Shinko Electric Co Ltd | Component attitude selecting device |
| US7119299B2 (en) | 2003-01-20 | 2006-10-10 | Tokyo Weld Co., Ltd. | Work inspection system |
| JP2007230661A (en) * | 2006-02-27 | 2007-09-13 | Tokyo Weld Co Ltd | Workpiece carrying system |
| JP2012246102A (en) * | 2011-05-27 | 2012-12-13 | Tokyo Weld Co Ltd | Workpiece conveyance inspection system, and workpiece conveyance inspection method |
| CN107394559A (en) * | 2017-07-21 | 2017-11-24 | 信华科技（厦门）有限公司 | A kind of continuously cutting with terminal product and collecting device |
| CN107394559B (en) * | 2017-07-21 | 2023-05-23 | 信华科技（厦门）有限公司 | Continuous cutting and collecting equipment for product with terminal |
| JP2019112199A (en) * | 2017-12-25 | 2019-07-11 | 株式会社菊水製作所 | Molding conveyance device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3262400B2 (en) | 2002-03-04 |
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