JPH062693U - Tape carrier with excellent bendability - Google Patents

Tape carrier with excellent bendability

Info

Publication number
JPH062693U
JPH062693U JP3780492U JP3780492U JPH062693U JP H062693 U JPH062693 U JP H062693U JP 3780492 U JP3780492 U JP 3780492U JP 3780492 U JP3780492 U JP 3780492U JP H062693 U JPH062693 U JP H062693U
Authority
JP
Japan
Prior art keywords
tape carrier
end surface
base film
mounting substrate
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3780492U
Other languages
Japanese (ja)
Inventor
司 千葉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP3780492U priority Critical patent/JPH062693U/en
Publication of JPH062693U publication Critical patent/JPH062693U/en
Pending legal-status Critical Current

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Abstract

(57)【要約】 【目的】実装基板の表と裏即ち端面をまたいで二つ以上
の端子を接続するテープキャリヤーにおいて、端面のリ
ードの断面が発生せず、かつ端面に相当する部分及び表
裏に相当する部分も実装基板になじみ、コンパクトな配
線が出来るテープキャリヤーを提供することにある。 【構成】実装基板4の角部5を除く端面6に相当するベ
ースフィルムの部分を打抜き部7としたことにより、リ
ード2が実装基板4の角部5に接触せず、リードの断線
を防止できるし、実装基板4の角部5を除く端面6に相
当する部分のベースフィルムが打抜き部7となっている
ためその部分のリードが実装基板の端面6になじみコン
パクトな配線が出来る。
(57) [Abstract] [Purpose] In a tape carrier that connects two or more terminals across the front and back sides of the mounting board, that is, the end surface, a portion corresponding to the end surface where the lead cross section does not occur and the front and back surfaces are formed. The purpose is to provide a tape carrier that is compatible with the mounting board and has compact wiring. [Structure] By forming the punched portion 7 at the base film portion corresponding to the end surface 6 of the mounting substrate 4 excluding the corner portions 5, the leads 2 do not come into contact with the corner portions 5 of the mounting substrate 4 and lead disconnection is prevented. Since the base film of the portion corresponding to the end surface 6 of the mounting substrate 4 excluding the corners 5 is the punched portion 7, the lead in that portion fits into the end surface 6 of the mounting substrate 4 and compact wiring can be performed.

Description

【考案の詳細な説明】[Detailed description of the device]

【0001】[0001]

【産業上の利用分野】[Industrial applications]

本考案はテープキャリヤーに関する。 The present invention relates to a tape carrier.

【0002】[0002]

【従来の技術】[Prior art]

従来のテープキャリヤーを折り曲げて使用する場合は、図3に示すような接続 となる。即ち、図3(A)は折り曲げ部分にはベースフィルムが無い場合の例で ある。この場合非常にコンパクトに配線できるが、実装基板の角部5の部分には 大きな歪力が加わり、リードが断線する場合が多々ある。図3(B)の場合は折 り曲げ部分にベースフィルム3が連続して側面にも有る時の例であるが、ベース フィルムの分だけ厚いため角の部分5が円形になり更に端面6に相当する部分も 表裏面に相当する部分7も円形になりコンパクトな配線ができない。またベース フィルムがあるので銅箔単体よりも曲げ強度が強いが、接続作業性が著しく劣る 。この図(B)の場合を更に良化するため、折り曲げ部になる部分に2個の細長 いスリットを平行に並べて設けたことを特徴とするテープ型集積回路板(実開平 1−160834号公報)が開示されている。 When the conventional tape carrier is folded and used, the connection is as shown in FIG. That is, FIG. 3 (A) is an example in which there is no base film in the bent portion. In this case, the wiring can be made very compact, but a large strain force is applied to the corner portion 5 of the mounting board, and the lead is often disconnected. In the case of FIG. 3B, the base film 3 is continuous to the bent portion and is also on the side surface, but since the base film is thicker, the corner portion 5 becomes circular and the end face 6 is further formed. Both the corresponding portion and the portion 7 corresponding to the front and back surfaces are circular, and compact wiring cannot be performed. In addition, since it has a base film, its bending strength is stronger than that of the copper foil alone, but its connection workability is extremely poor. In order to further improve the case of this figure (B), a tape type integrated circuit board characterized in that two elongated slits are provided in parallel in a portion to be a bent portion (Japanese Utility Model Laid-Open No. 1-160834). ) Is disclosed.

【0003】[0003]

【考案が解決しようとする課題】[Problems to be solved by the device]

しかしながら実開平1−160834号公報記載のテープ型集積回路板は、2 個の細長いスリットの間の細長いベースフィルム部分が実装基板の角に接触して 断線を防ぐにしても、端面6に相当する部分にはベースフィルムが存在するため に端面6に相当する部分及び表裏面に相当する部分7のテープキャリヤーが充分 に平坦になることが出来ず、コンパクトな配線が出来ないという問題点があった 。 However, the tape-type integrated circuit board described in Japanese Utility Model Laid-Open No. 1-160834 is equivalent to the end face 6 even if the elongated base film portion between the two elongated slits contacts the corner of the mounting substrate to prevent disconnection. Since the base film exists in the part, the tape carrier of the part corresponding to the end face 6 and the part 7 corresponding to the front and back surfaces cannot be sufficiently flat, and there is a problem that compact wiring cannot be performed. .

【0004】 本考案の目的は、前記した欠点を解消し、実装基板の表と裏即ち端面をまたい で二つ以上の端子を接続するテープキャリヤーにおいて、端面のリードの断線が 発生せず、かつ端面に相当する部分及び表裏に相当する部分もなじみコンパクト な配線が出来るテープキャリヤーを提供することにある。An object of the present invention is to solve the above-mentioned drawbacks, in a tape carrier that connects two or more terminals across the front and back sides of the mounting board, that is, the end surface, does not cause breakage of the leads on the end surface, and It is an object of the present invention to provide a tape carrier capable of compact wiring, in which the portions corresponding to the end faces and the portions corresponding to the front and back sides are familiar.

【0005】[0005]

【課題を解決するための手段及び作用】[Means and Actions for Solving the Problems]

本考案の要旨は、ベースフィルムの実装基板の角部を除く端面に相当する部分 を打抜き部としたことにより、折り曲げによるリードの断線を防止し、かつ端面 に相当する部分及び表裏に相当する部分もなじみコンパクトな配線を得ることが 出来る。 The gist of the present invention is to prevent the lead from breaking due to bending by making the part corresponding to the end surface of the base film excluding the corners of the mounting substrate a punched part, and the part corresponding to the end surface and the part corresponding to the front and back sides. It is possible to obtain familiar and compact wiring.

【0006】 即ち、本考案の上記目的は、実装基板の表と裏、即ち端面をまたいで、二つ以 上の端子を接続するテープキャリヤーにおいて、実装基板の角部を除く前記端面 に相当するベースフィルムの部分を、打抜き部としたことを特徴とする折り曲げ 性に優れたテープキャリヤーによって達成される。That is, the above-mentioned object of the present invention corresponds to the end surface of the tape carrier excluding the corners of the mounting board in a tape carrier that connects two or more terminals across the front and back surfaces of the mounting board, that is, the end surface. This is achieved by a tape carrier excellent in bendability, which is characterized in that the base film portion is a punched portion.

【0007】 本考案の要点はテープキャリヤーのリードが実装基板の角部と接触せず、更に 端面に相当するベースフィルムの部分が屈曲性に優れていることにある。したが ってベースフィルムの打抜き部の幅は角部を除したものであれば良いことになる が、組立精度の問題から基板の厚さよりも100〜500μm狭いベースフィル ムの打抜き部の幅が妥当である。The main point of the present invention is that the leads of the tape carrier do not come into contact with the corners of the mounting board, and the base film portion corresponding to the end face has excellent flexibility. Therefore, the width of the punched part of the base film should be one excluding the corners, but due to the problem of assembly accuracy, the width of the punched part of the base film, which is 100 to 500 μm narrower than the thickness of the substrate, should be small. It is reasonable.

【0008】 本考案の打抜き部とは、その領域はベースフィルムの大部分が打抜かれた、可 撓性に優れた部分になっていることを意味し、打抜きの形状としては、スリット 状でも丸孔状でもかまわない。又スリット状の場合は一本でも、細いスリットを 複数本設けても良いし、又丸孔状の場合は千鳥状に設けてもかまわない。The punching part of the present invention means that the region is a part of the base film that is punched out and has excellent flexibility, and the punching shape may be a slit shape or a round shape. It may be a hole. Further, in the case of a slit shape, one slit may be provided, or a plurality of thin slits may be provided, and in the case of a round hole, they may be provided in a staggered pattern.

【0009】[0009]

【実施例】【Example】

図2は本考案の一実施例の平面図である。実装基板の角部5を除く端面6に相 当するベースフィルムの部分を打抜き部7としたものである。その他の構造上は 従来のテープキャリヤーと同じであるが、実装基板の端面に相当する部分のベー スフィルムの打抜き部の幅を制限しているのが本考案の主旨である。図1は本考 案のテープキャリヤーを実装して使用した時の横断面を示したものである。この 図から明らかなように実装基板4の角部5を除く端面6に相当するベースフィル ムの部分7を打抜き部7としたことにより、リード2が実装基板4の角部5に接 触せず、リードの断線を防止できるし、実装基板4の角部5を除く端面6に相当 する部分のベースフィルムが打抜き部7となっているためその部分のリードが実 装基板の端面6になじみコンパクトな配線が出来る。 FIG. 2 is a plan view of an embodiment of the present invention. The punched portion 7 is a base film portion corresponding to the end surface 6 excluding the corner portion 5 of the mounting substrate. The rest of the structure is the same as that of the conventional tape carrier, but the main purpose of the present invention is to limit the width of the punched portion of the base film corresponding to the end surface of the mounting substrate. FIG. 1 shows a cross section when the tape carrier of the present invention is mounted and used. As is clear from this figure, the base film portion 7 corresponding to the end surface 6 excluding the corner portion 5 of the mounting board 4 is used as the punched portion 7, so that the lead 2 is brought into contact with the corner portion 5 of the mounting board 4. The lead film can be prevented from being broken, and the base film of the portion corresponding to the end surface 6 of the mounting substrate 4 excluding the corners 5 is the punched portion 7. Therefore, the lead of that portion fits in the end surface 6 of the mounting substrate. Compact wiring is possible.

【0010】 以上の説明からリードの断線を防止するためには、基板の角部5を面取りし、 リードに大きな歪が加わらないようにする方法が考えられる。しかし実装基板の 面取は作業工程が増加し、コスト上昇につながるので、本考案の方法を用いれば コストアップにもつながらず、なじみ良く目的を達することが出来る。これは打 抜き部はデバイスホールやスプロケットホールと同時に加工できるため作業工程 や方法を変えることなく設けることができるからである。From the above description, in order to prevent the breakage of the leads, it is conceivable to chamfer the corner portions 5 of the substrate so as not to apply a large strain to the leads. However, the chamfering of the mounting board increases the number of work steps and increases the cost. Therefore, the method of the present invention can achieve the purpose well without increasing the cost. This is because the punched part can be machined at the same time as the device hole and sprocket hole, so it can be provided without changing the work process or method.

【0011】[0011]

【考案の効果】[Effect of device]

本考案の折り曲げ性に優れたテープキャリヤーにより、リードの断線が発生せ ず、かつコンパクトな配線が出来るテープキャリヤーにより、加工費を増大さす ことなく品質を向上させることが出来た。 The tape carrier of the present invention, which has excellent bendability, can improve the quality without increasing the processing cost by using the tape carrier which does not cause the disconnection of the lead and allows the compact wiring.

【図面の簡単な説明】[Brief description of drawings]

【図1】本考案のテープキャリヤーを実装した時の一実
施例を示す横断面図。
FIG. 1 is a cross-sectional view showing an embodiment when a tape carrier of the present invention is mounted.

【図2】本考案のテープキャリヤーの平面図、一実施例
(A)と他の実施例(B)。
FIG. 2 is a plan view of a tape carrier of the present invention, one embodiment (A) and another embodiment (B).

【図3】従来のテープキャリヤーを実装した時の横断面
図、一例(A)と他の例(B)。
FIG. 3 is a cross-sectional view when a conventional tape carrier is mounted, one example (A) and another example (B).

【符号の説明】[Explanation of symbols]

1 LSIチップ 2 リード 3 ベースフィルム 4 実装基板 5 実装基板の角部 6 実装基板の端面 7 表裏に相当する部分 8 打抜き部 1 LSI Chip 2 Lead 3 Base Film 4 Mounting Substrate 5 Corner of Mounting Substrate 6 End Face of Mounting Substrate 7 Corresponding to Front and Back 8 Stamping

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 【請求項1】実装基板の表と裏、即ち端面をまたいで、
二つ以上の端子を接続するテープキャリヤーにおいて、
実装基板の角部を除く前記端面に相当するベースフィル
ムの部分を、打抜き部としたことを特徴とする折り曲げ
性に優れたテープキャリヤー。
1. A front and back surface of a mounting board, that is, an end surface,
In a tape carrier that connects two or more terminals,
A tape carrier excellent in bendability, characterized in that a portion of the base film corresponding to the end face excluding the corner portion of the mounting substrate is a punched portion.
JP3780492U 1992-06-04 1992-06-04 Tape carrier with excellent bendability Pending JPH062693U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3780492U JPH062693U (en) 1992-06-04 1992-06-04 Tape carrier with excellent bendability

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3780492U JPH062693U (en) 1992-06-04 1992-06-04 Tape carrier with excellent bendability

Publications (1)

Publication Number Publication Date
JPH062693U true JPH062693U (en) 1994-01-14

Family

ID=12507704

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3780492U Pending JPH062693U (en) 1992-06-04 1992-06-04 Tape carrier with excellent bendability

Country Status (1)

Country Link
JP (1) JPH062693U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53142187U (en) * 1977-04-14 1978-11-09

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53142187U (en) * 1977-04-14 1978-11-09

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