JPH01170087A - Printed substrate - Google Patents

Printed substrate

Info

Publication number
JPH01170087A
JPH01170087A JP32694987A JP32694987A JPH01170087A JP H01170087 A JPH01170087 A JP H01170087A JP 32694987 A JP32694987 A JP 32694987A JP 32694987 A JP32694987 A JP 32694987A JP H01170087 A JPH01170087 A JP H01170087A
Authority
JP
Japan
Prior art keywords
hole
substrate
conductors
wiring
wiring conductors
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP32694987A
Other languages
Japanese (ja)
Inventor
Koji Touchi
戸内　孝治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP32694987A priority Critical patent/JPH01170087A/en
Publication of JPH01170087A publication Critical patent/JPH01170087A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

PURPOSE:To reduce through-holes in number so as to make an electronic circuit device high in density or a substrate standardized by a method wherein two or more wiring conductors are formed on the side wall of a through-hole or a slit along a thicknesswise direction of the substrate. CONSTITUTION:A through-hole 2 is provided to a substrate 1, superficial wiring conductors 3 are provided to four sides of the through-hole 2 reaching to the upper end of the through-hole 2 on the surface of the substrate 1, and four rear wiring conductors 4 are formed on the rear of the substrate 1 the same as the front. Moreover, front and rear connecting conductors 5 which connect four conductors of each of the rear and the front of the substrate 1 respectively are provided to four side walls of the through-hole 2. By these processes, two or more front-rear connecting wires can be formed for each through-hole or slit, so that the through-hole 2 can be decreased in number and an electronic circuit device can be made high in density or a substrate can be standardized.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、特に電子回路装置の高密度化に適する配線基
板に適する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention is particularly suitable for wiring boards suitable for increasing the density of electronic circuit devices.

〔従来の技術〕[Conventional technology]

従来、表裏の配線導体の結線は、基板に小円形の貫通孔
を設け、その側壁全面忙導体を形成するか、あるいは、
特開昭６１−２０４４９３号公報に記載のように、貫通
孔にジャンパ素子を通し表裏の配線導体に半田接続する
ことによって、１つの貫通孔に対し唯一の表裏結ｌＩｊ
を成していた。Conventionally, wiring conductors on the front and back sides were connected by providing a small circular through hole in the board and forming a conductor on the entire side wall, or by
As described in Japanese Unexamined Patent Publication No. 61-204493, by passing a jumper element through the through hole and soldering it to the wiring conductors on the front and back sides, only one front and back connection can be made for one through hole.
was completed.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

上記従来技術は１つの貫通孔に対し唯一の表裏結線を成
しているため、１つの印刷基板に多数の貫通孔を必要と
し、高密度化あるいは基板の標準化の障害となるという
問題があった。Since the above-mentioned conventional technology forms only one front and back connection for one through hole, it requires a large number of through holes on one printed circuit board, which poses a problem in that it becomes an obstacle to higher density or standardization of the board. .

本発明の目的は、貫通孔の数を削減することにより、電
子回路装置の高密度化あるいは基板の標準化を達成する
ことにある。An object of the present invention is to achieve higher density of electronic circuit devices or standardization of substrates by reducing the number of through holes.

〔問題点を解決するための手段〕[Means for solving problems]

上記目的は、１つの貫通孔るるいはスリットの側壁に基
板の厚さ方向Ｋｌｌ数の配線導体を形成することＫよシ
達成される。The above object is achieved by forming Kll number of wiring conductors in the thickness direction of the substrate on the side wall of one through hole or slit.

〔作用〕[Effect]

１つの貫通孔あるいはスリットの側壁に形成された各導
体は、側壁の上端部および下端部において、接続すべき
表面および裏面の各配線導体に各各接続される。したが
って、１つの貫通孔あるいはスリットの側壁に設けられ
た複数の導体により、表面配線と裏面配線の複数の結線
が得られるので。Each conductor formed on the side wall of one through hole or slit is connected to each wiring conductor on the front and back surfaces to be connected at the upper and lower ends of the side wall. Therefore, a plurality of connections between the front surface wiring and the back surface wiring can be obtained by a plurality of conductors provided on the side wall of one through hole or slit.

貫通孔の数を削減することができ、電子回路装置の高密
度化が達成され、基板の標準化が容易になる。The number of through holes can be reduced, higher density of electronic circuit devices can be achieved, and standardization of substrates can be facilitated.

〔実施例〕〔Example〕

以下、本発明の実施例を第１図から第４図により説明す
る。Embodiments of the present invention will be described below with reference to FIGS. 1 to 4.

第１図において、基板１に貫通孔２を設けており、基板
１の装面には貫通孔２の４辺それぞれに貫通孔２の上端
部に達する表面配線導体３が形成され、同様に裏面に−
）いても４本の裏面配線導体４が形成されている。さら
に、表裏各４本の配線導体をそれぞれ結線する表裏結線
導体５を貫通孔２の４つの側壁に設けた。したがって、
本実施例によれば、１つの貫通孔で４つの表裏結線を成
すことができ、第５図に示すような１つの小円形貫通孔
７で１つの表裏結線を成す従来の構成に比べ。In FIG. 1, a through hole 2 is provided in a substrate 1, and front wiring conductors 3 reaching the upper end of the through hole 2 are formed on each of the four sides of the through hole 2 on the mounting surface of the substrate 1, and similarly, on the back side. ni-
), four backside wiring conductors 4 are formed. Furthermore, front and back connection conductors 5 for connecting four wiring conductors on each of the front and back sides were provided on the four side walls of the through hole 2. therefore,
According to this embodiment, four front and back connections can be made with one through hole, compared to the conventional configuration in which one small circular through hole 7 makes one front and back connection as shown in FIG.

表裏結線の高密度化が可能となる。It is possible to increase the density of front and back connections.

また１本発明は、第２図に示すように表裏配線導体の数
を限定するものではな（、また、第３図に示すように貫
通孔の形状を限定するものでもない。さらに、第４図に
示すように基板１にスリット６を設け、その側壁に表裏
配線導体５を形成してもよい。Furthermore, the present invention does not limit the number of front and back wiring conductors as shown in FIG. 2 (nor does it limit the shape of the through holes as shown in FIG. 3. As shown in the figure, a slit 6 may be provided in the substrate 1, and front and back wiring conductors 5 may be formed on the side walls of the slit 6.

〔発明の効果〕〔Effect of the invention〕

本発明によれば、１つの貫通孔あるいはスリットについ
て複数の表裏結線を成すことができるので、従来方法に
比べ貫通孔の数を削減でき、電子回路装置の高密度化あ
るいは基板の標準化が図れるなどの優れた効果を奏する
。According to the present invention, a plurality of front and back connections can be made with one through hole or slit, so the number of through holes can be reduced compared to conventional methods, and it is possible to increase the density of electronic circuit devices and standardize boards. It has excellent effects.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明の第１の実施例を示す斜視図、第２図は
第２の実施例を示す斜視図、第３図は第３の実施例を示
す斜視図、第４図は第４の実施例を示す斜視図、第５図
は従来の構成を示す斜視図である。 １・・・基板、　　　　　　２・・・貫通孔、３・・・
表面配線導体、　４・・・裏面配線導体、５・・・表裏
結線導体、　６・・・スリット。 第４国 躬３１！１ しFIG. 1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is a perspective view showing a second embodiment, FIG. 3 is a perspective view showing a third embodiment, and FIG. FIG. 5 is a perspective view showing the conventional configuration. 1... Board, 2... Through hole, 3...
Surface wiring conductor, 4... Back wiring conductor, 5... Front and back connection conductor, 6... Slit. 4th country 31!1

Claims (1)

【特許請求の範囲】[Claims] １．基板と基板の表裏両面に印刷技術により形成した配
線導体と、前記表裏の配線導体を結線した導体とから成
る印刷基板において、基板に設けた貫通孔あるいはスリ
ットの側壁に基板の厚さ方向に配線した複数の配線導体
により、前記表裏両面の配線導体を結線したことを特徴
とする印刷基板。1. In a printed board consisting of a wiring conductor formed by printing technology on both the front and back sides of the board, and a conductor connecting the wiring conductors on the front and back sides, wiring is formed in the thickness direction of the board on the side wall of a through hole or slit provided in the board. A printed circuit board characterized in that the wiring conductors on both the front and back surfaces are connected by a plurality of wiring conductors.
JP32694987A 1987-12-25 1987-12-25 Printed substrate Pending JPH01170087A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32694987A JPH01170087A (en) 1987-12-25 1987-12-25 Printed substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32694987A JPH01170087A (en) 1987-12-25 1987-12-25 Printed substrate

Publications (1)

Publication Number Publication Date
JPH01170087A true JPH01170087A (en) 1989-07-05

Family

ID=18193572

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32694987A Pending JPH01170087A (en) 1987-12-25 1987-12-25 Printed substrate

Country Status (1)

Country Link
JP (1) JPH01170087A (en)

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