JPH01170087A - Printed substrate - Google Patents
Printed substrateInfo
- Publication number
- JPH01170087A JPH01170087A JP32694987A JP32694987A JPH01170087A JP H01170087 A JPH01170087 A JP H01170087A JP 32694987 A JP32694987 A JP 32694987A JP 32694987 A JP32694987 A JP 32694987A JP H01170087 A JPH01170087 A JP H01170087A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- substrate
- conductors
- wiring
- wiring conductors
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract description 14
- 239000004020 conductor Substances 0.000 claims abstract description 26
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、特に電子回路装置の高密度化に適する配線基
板に適する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention is particularly suitable for wiring boards suitable for increasing the density of electronic circuit devices.
従来、表裏の配線導体の結線は、基板に小円形の貫通孔
を設け、その側壁全面忙導体を形成するか、あるいは、
特開昭61−204493号公報に記載のように、貫通
孔にジャンパ素子を通し表裏の配線導体に半田接続する
ことによって、1つの貫通孔に対し唯一の表裏結lIj
を成していた。Conventionally, wiring conductors on the front and back sides were connected by providing a small circular through hole in the board and forming a conductor on the entire side wall, or by
As described in Japanese Unexamined Patent Publication No. 61-204493, by passing a jumper element through the through hole and soldering it to the wiring conductors on the front and back sides, only one front and back connection can be made for one through hole.
was completed.
上記従来技術は1つの貫通孔に対し唯一の表裏結線を成
しているため、1つの印刷基板に多数の貫通孔を必要と
し、高密度化あるいは基板の標準化の障害となるという
問題があった。Since the above-mentioned conventional technology forms only one front and back connection for one through hole, it requires a large number of through holes on one printed circuit board, which poses a problem in that it becomes an obstacle to higher density or standardization of the board. .
本発明の目的は、貫通孔の数を削減することにより、電
子回路装置の高密度化あるいは基板の標準化を達成する
ことにある。An object of the present invention is to achieve higher density of electronic circuit devices or standardization of substrates by reducing the number of through holes.
上記目的は、1つの貫通孔るるいはスリットの側壁に基
板の厚さ方向Kll数の配線導体を形成することKよシ
達成される。The above object is achieved by forming Kll number of wiring conductors in the thickness direction of the substrate on the side wall of one through hole or slit.
1つの貫通孔あるいはスリットの側壁に形成された各導
体は、側壁の上端部および下端部において、接続すべき
表面および裏面の各配線導体に各各接続される。したが
って、1つの貫通孔あるいはスリットの側壁に設けられ
た複数の導体により、表面配線と裏面配線の複数の結線
が得られるので。Each conductor formed on the side wall of one through hole or slit is connected to each wiring conductor on the front and back surfaces to be connected at the upper and lower ends of the side wall. Therefore, a plurality of connections between the front surface wiring and the back surface wiring can be obtained by a plurality of conductors provided on the side wall of one through hole or slit.
貫通孔の数を削減することができ、電子回路装置の高密
度化が達成され、基板の標準化が容易になる。The number of through holes can be reduced, higher density of electronic circuit devices can be achieved, and standardization of substrates can be facilitated.
以下、本発明の実施例を第1図から第4図により説明す
る。Embodiments of the present invention will be described below with reference to FIGS. 1 to 4.
第1図において、基板1に貫通孔2を設けており、基板
1の装面には貫通孔2の4辺それぞれに貫通孔2の上端
部に達する表面配線導体3が形成され、同様に裏面に−
)いても4本の裏面配線導体4が形成されている。さら
に、表裏各4本の配線導体をそれぞれ結線する表裏結線
導体5を貫通孔2の4つの側壁に設けた。したがって、
本実施例によれば、1つの貫通孔で4つの表裏結線を成
すことができ、第5図に示すような1つの小円形貫通孔
7で1つの表裏結線を成す従来の構成に比べ。In FIG. 1, a through hole 2 is provided in a substrate 1, and front wiring conductors 3 reaching the upper end of the through hole 2 are formed on each of the four sides of the through hole 2 on the mounting surface of the substrate 1, and similarly, on the back side. ni-
), four backside wiring conductors 4 are formed. Furthermore, front and back connection conductors 5 for connecting four wiring conductors on each of the front and back sides were provided on the four side walls of the through hole 2. therefore,
According to this embodiment, four front and back connections can be made with one through hole, compared to the conventional configuration in which one small circular through hole 7 makes one front and back connection as shown in FIG.
表裏結線の高密度化が可能となる。It is possible to increase the density of front and back connections.
また1本発明は、第2図に示すように表裏配線導体の数
を限定するものではな(、また、第3図に示すように貫
通孔の形状を限定するものでもない。さらに、第4図に
示すように基板1にスリット6を設け、その側壁に表裏
配線導体5を形成してもよい。Furthermore, the present invention does not limit the number of front and back wiring conductors as shown in FIG. 2 (nor does it limit the shape of the through holes as shown in FIG. 3. As shown in the figure, a slit 6 may be provided in the substrate 1, and front and back wiring conductors 5 may be formed on the side walls of the slit 6.
本発明によれば、1つの貫通孔あるいはスリットについ
て複数の表裏結線を成すことができるので、従来方法に
比べ貫通孔の数を削減でき、電子回路装置の高密度化あ
るいは基板の標準化が図れるなどの優れた効果を奏する
。According to the present invention, a plurality of front and back connections can be made with one through hole or slit, so the number of through holes can be reduced compared to conventional methods, and it is possible to increase the density of electronic circuit devices and standardize boards. It has excellent effects.
第1図は本発明の第1の実施例を示す斜視図、第2図は
第2の実施例を示す斜視図、第3図は第3の実施例を示
す斜視図、第4図は第4の実施例を示す斜視図、第5図
は従来の構成を示す斜視図である。
1・・・基板、 2・・・貫通孔、3・・・
表面配線導体、 4・・・裏面配線導体、5・・・表裏
結線導体、 6・・・スリット。
第4国
躬31!1
しFIG. 1 is a perspective view showing a first embodiment of the present invention, FIG. 2 is a perspective view showing a second embodiment, FIG. 3 is a perspective view showing a third embodiment, and FIG. FIG. 5 is a perspective view showing the conventional configuration. 1... Board, 2... Through hole, 3...
Surface wiring conductor, 4... Back wiring conductor, 5... Front and back connection conductor, 6... Slit. 4th country 31!1
Claims (1)
線導体と、前記表裏の配線導体を結線した導体とから成
る印刷基板において、基板に設けた貫通孔あるいはスリ
ットの側壁に基板の厚さ方向に配線した複数の配線導体
により、前記表裏両面の配線導体を結線したことを特徴
とする印刷基板。1. In a printed board consisting of a wiring conductor formed by printing technology on both the front and back sides of the board, and a conductor connecting the wiring conductors on the front and back sides, wiring is formed in the thickness direction of the board on the side wall of a through hole or slit provided in the board. A printed circuit board characterized in that the wiring conductors on both the front and back surfaces are connected by a plurality of wiring conductors.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32694987A JPH01170087A (en) | 1987-12-25 | 1987-12-25 | Printed substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32694987A JPH01170087A (en) | 1987-12-25 | 1987-12-25 | Printed substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01170087A true JPH01170087A (en) | 1989-07-05 |
Family
ID=18193572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32694987A Pending JPH01170087A (en) | 1987-12-25 | 1987-12-25 | Printed substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01170087A (en) |
-
1987
- 1987-12-25 JP JP32694987A patent/JPH01170087A/en active Pending
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