JPH06262526A - Diamond bonded grinding wheel and its manufacture - Google Patents
Diamond bonded grinding wheel and its manufactureInfo
- Publication number
- JPH06262526A JPH06262526A JP8904993A JP8904993A JPH06262526A JP H06262526 A JPH06262526 A JP H06262526A JP 8904993 A JP8904993 A JP 8904993A JP 8904993 A JP8904993 A JP 8904993A JP H06262526 A JPH06262526 A JP H06262526A
- Authority
- JP
- Japan
- Prior art keywords
- powder
- diamond
- sintered
- sintering
- abrasive grain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Polishing Bodies And Polishing Tools (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明の製造法によつて製造した
本発明のダイヤモンド結合砥石は、従来セラミックス材
或いは石材等硬質材の研摩又は切断等に使用されている
メタルボンドダイヤモンド砥石の利用分野と同じ分野に
おいて利用されるものである。BACKGROUND OF THE INVENTION The diamond-bonded grindstone of the present invention manufactured by the manufacturing method of the present invention is a metal-bonded diamond grindstone conventionally used for polishing or cutting hard materials such as ceramic materials or stone materials. It is used in the same field as.
【０００２】[0002]
【従来の技術】従来メタルボンド・ダイヤモンド砥石を
製造するに当っては、ダイヤモンド砥粒の保持材として
Ｃｕ・Ｓｎ・Ｎｉ・Ｃｏ・Ｆｅおよびそれらの合金粉末
又は鋳鉄フアイバーが使用されており、それらの保持材
とダイヤモンド砥粒との混合割合は、ダイヤモンド砥粒
を２５容量％と保持材を７５容量％とを標準割合とし、
使用目的に応じて色々な割合にて使用しているが、かか
る従来のメタルボンド砥石の製造作業では、保持材とダ
イヤモンド砥粒とを混合した混合粉末を型込めして数ｔ
ｏｎ／ｃｍ２の圧力にて加圧して加圧成形体を生成し、
次いで其の加圧成形体を水素炉または真空炉の中で１，
０００℃以下の温度であって使用した保持材の種類に対
応して選定した温度で加熱して焼結作業を行い、更に仕
上げ加工を加えてメタルボンドダイヤモンド砥石を生成
している。2. Description of the Related Art Conventionally, Cu, Sn, Ni, Co, Fe and alloy powders thereof or cast iron fibers have been used as a holding material for diamond abrasive grains in the production of metal bond diamond whetstones. As for the mixing ratio of the holding material and the diamond abrasive grains, the standard ratio is 25% by volume of the diamond abrasive grains and 75% by volume of the holding material,
Although it is used in various ratios according to the purpose of use, in the conventional manufacturing work of such a metal bond grindstone, a mixed powder obtained by mixing a holding material and diamond abrasive grains is put into a mold for several tons.
pressurizing at a pressure of on / cm 2 to produce a pressure molded body,
Then, press the molded body in a hydrogen furnace or a vacuum furnace.
The metal-bonded diamond grindstone is produced by heating at a temperature of 000 ° C. or less and at a temperature selected according to the type of holding material used for sintering, and further finishing.
【０００３】[0003]
【発明が解決しようとする問題点】従来のＣｕ・Ｓｎ・
Ｎｉ・Ｃｏ・Ｆｅ・鋳鉄ファイバーまたはこれらの金属
の合金の粉末を保持材として使用して製造して成るメタ
ルボンドダイヤモンド砥石においては研摩作業中に生ず
るダイヤモンド微粉末によって保持材組織が早く削りと
られてダイヤモンド砥粒が突出した状態となり、保持材
組織の中に埋まっているダイヤモンド砥粒の部分の容量
が５０％程度になれば砥粒が脱落してゆくことが多く、
また保持材が鋳鉄フアィバー組織である場合にも其の鋳
鉄フアィバー組織はダイヤモンド砥粒に対する結合力が
弱いために、其の鋳鉄フアィバー組織が保持しているダ
イヤモンド砥粒の容量が砥粒の容量の５０％程度になれ
ばダイヤモンド砥粒が鋳鉄フアィバー組織より分離して
脱落してゆくことが多い。斯様に金属または金属合金よ
り成る結合材組織によりダイヤモンド砥粒を保持して構
成しているダイヤモンド砥石においても鋳鉄フアィバー
組織によりダイヤモンド砥粒を保持して構成して成るダ
イヤモンド砥石においても、其の砥石における保持材と
ダイヤモンド砥粒が摩耗して其の保持部の砥粒の容量が
５０％程度になればダイヤモンド砥粒を保持している保
持材組織の保持力が弱いためにダイヤモンド砥粒は脱落
してゆくので砥石の寿命は短い。この寿命の短いことが
解決しようとする問題点であって、本発明はダイヤモン
ド砥石の寿命を長くすることのできるダイヤモンド砥石
を製造する手段を開発して問題点を解決しようとするも
のである。Problems to be Solved by the Invention Conventional Cu / Sn /
In a metal-bonded diamond grindstone manufactured by using powder of Ni / Co / Fe / cast iron fiber or an alloy of these metals as a holding material, the holding material structure is quickly shaved off by the fine diamond powder generated during polishing work. The diamond abrasive grains are projected, and when the volume of the diamond abrasive grains embedded in the holding material structure reaches about 50%, the abrasive grains often fall off,
Further, even when the holding material has a cast iron fiber structure, since the cast iron fiber structure has a weak bonding force to the diamond abrasive grains, the capacity of the diamond abrasive particles held by the cast iron fiber structure is equal to the capacity of the abrasive grains. When it becomes about 50%, the diamond abrasive grains often separate from the cast iron fiber structure and fall off. Thus, even in a diamond grindstone configured to hold diamond abrasive grains with a binder structure composed of a metal or a metal alloy, and also in a diamond grindstone structured to hold diamond abrasive grains with a cast iron fiber structure, When the holding material and the diamond abrasive grains in the grindstone are worn and the volume of the abrasive grains in the holding portion becomes about 50%, the holding force of the holding material structure holding the diamond abrasive grains is weak and the diamond abrasive grains are The life of the grindstone is short because it falls off. This short life is a problem to be solved, and the present invention is to solve the problem by developing means for manufacturing a diamond grindstone capable of prolonging the life of the diamond grindstone.
【０００４】[0004]
【問題点を解決するための手段】前項にて説明したよう
に、解決すべき問題点は、金属粉末或は鋳鉄フアィバー
をもってダイヤモンド砥粒を保持したダイヤモンド砥石
においては、砥粒保持材が個々のダイヤモンド砥粒を保
持している保持力が弱いために、保持材とダイヤモンド
砥粒が摩耗して、其の保持されている砥粒の容量が５０
％程度まで摩耗すれば脱落してゆくので、ダイヤモンド
砥粒の寿命が短く、ダイヤモンド砥粒の有効利用率が低
いことである。かかる問題点を解決する手段として、本
発明においては、ダイヤモンド結合砥石の製造原料とし
てＴｉ被覆ダイヤモンド粉末を使用し、このＴｉ被覆ダ
イヤモンド粉末を結合する原料として砥粒保持材硬質物
粉末と焼結助材粉末とを混合して使用するものである。
Ｔｉ被覆ダイヤモンド粉末としては個々のダイヤモンド
粒子をＴｉ皮膜が０．５重量％乃至０．７重量％の割合
にて被覆して成るＴｉ被覆ダイヤモンド粉末を使用し、
砥粒保持材硬質物粉末としては硬質炭化物・硬質硼化物
・硬質窒化物・硬質珪化物・硬質酸化物のうちより選択
した硬質物の粉末を使用し、焼結助材粉末としてはＮｉ
系合金粉末・Ｃｏ系合金粉末のうちより選択した合金粉
末を使用する。これ等の原料のうちでＴｉ被覆ダイヤモ
ンド粉末を１０容量％乃至４０容量％と、砥粒保持材硬
質物粉末を５０容量％乃至８２容量％と焼結助材粉末を
８容量％乃至１０容量％と、の割合範囲内より選定した
割合にて混合した混合粉末を、ダイヤモンド結合砥石の
製造に使用する焼結用原とする。斯様に配合した焼結用
原料を、砥石成形用型に型込めして５ｔｏｎ／ｃｍ２乃
至１７ｔｏｎ／ｃｍ２の圧力にて加圧すると共に８００
℃乃至１，１４０℃の温度にて加熱して焼結作業を行
う。此の焼結作業においては、Ｔｉ皮膜結合ダイヤモン
ド粒子の外面に接している砥粒保持材硬質物粉末と焼結
助材粉末とが焼結して砥粒保持材硬質物粉末と焼結助材
粉末が焼結して成るＴｉ皮膜結合ダイヤモンド粒子の多
数個を生成し、更に同時に砥粒保持材硬質物粉末と焼結
助材粉末とが相互に焼結して砥粒保持材硬質物粉末と焼
結助材粉末との焼結組織をも生成し、更に同時に、生成
した砥粒保持材硬質物粉末と焼結助材粉末と焼結Ｔｉ皮
膜結合ダイヤモンド粒子の多数個と、生成した砥粒保持
材硬質物粉末・焼結助材粉末焼結組織と、が複合焼結し
て、砥粒保持材硬質物粉末・焼結助材粉末・焼結Ｔｉ皮
膜結合ダイヤモンド粉末と砥粒保持材硬質物粉末・焼結
助材粉末の焼結組織より成る複合焼結組織体を生成し、
其の複合焼結組織体において個々のダイヤモンド粒子の
表面に焼結しているＴｉ皮膜と砥粒保持材硬質物粉末と
焼結助材粉末との複合焼結組織が個々のダイヤモンド砥
粒の間を充填していると共に、Ｔｉと焼結助材との合金
組織が個々のダイヤモンド砥粒に強く結合しており、更
に硬質物粉末焼結組織ばダイヤモンド砥粒の揺動を抑制
してダイヤモンド砥粒を堅く保持しているばかりでな
く、ダイヤモンド砥粒結合硬質物粉末焼結組織体を構成
してダイヤモンド砥粒を堅く保持しているので、その砥
粒を保持している深さが砥粒の容量の３０％程度になる
までは砥粒の周囲にゆるみを生じさせることなく砥粒の
脱落が起らない。従ってダイヤモンド砥粒の寿命が長く
なって、従来のメタルボンドダイヤモンド砥石における
砥粒の有効利用率がほぼ５０％であるのに比し、ダイヤ
モンド砥粒の有効利用率を著しく高くしたダイヤモンド
結合砥石を得ることができる。[Means for Solving the Problems] As explained in the previous section, the problems to be solved are that in the diamond grindstone in which the diamond abrasive grains are held by the metal powder or the cast iron fiber, the abrasive grain holding material is Since the holding force for holding the diamond abrasive grains is weak, the holding material and the diamond abrasive grains are worn, and the volume of the retained abrasive grains is 50.
%, The diamond abrasive grains fall off, so that the life of the diamond abrasive grains is short and the effective utilization rate of the diamond abrasive grains is low. As means for solving such a problem, in the present invention, Ti-coated diamond powder is used as a raw material for producing a diamond-bonded grindstone, and an abrasive-grain-holding material hard material powder and a sintering aid are used as raw materials for bonding the Ti-coated diamond powder. It is used by mixing with material powder.
As the Ti-coated diamond powder, a Ti-coated diamond powder obtained by coating individual diamond particles with a Ti coating in a ratio of 0.5% by weight to 0.7% by weight is used.
Abrasive grain holding material As the hard material powder, a hard material powder selected from hard carbide, hard boride, hard nitride, hard silicide, and hard oxide is used. As the sintering aid powder, Ni is used.
An alloy powder selected from the group-based alloy powder and the Co-based alloy powder is used. Of these raw materials, Ti-coated diamond powder is 10% to 40% by volume, abrasive grain holding material hard material powder is 50% to 82% by volume, and sintering aid powder is 8% to 10% by volume. The mixed powder mixed in a ratio selected from the ratio range of and is used as a raw material for sintering used in the production of a diamond bonded grindstone. The sintering raw material Such formulated, along with pressurized at a pressure of 5 ton / cm 2 to 17ton / cm 2 was put mold type grindstone molding 800
Sintering is performed by heating at a temperature of ℃ to 1,140 ℃. In this sintering operation, the abrasive grain holding material hard material powder and the sintering aid powder which are in contact with the outer surfaces of the Ti film-bonded diamond particles are sintered to give the abrasive grain holding material hard material powder and the sintering aid material. A large number of Ti film-bonded diamond particles formed by sintering the powder are generated, and at the same time, the abrasive grain holding material hard material powder and the sintering aid material powder are mutually sintered to form an abrasive grain holding material hard material powder. A sintered structure with the sintering aid powder is also generated, and at the same time, a large number of the generated abrasive grain holding material powder, the sintering aid powder, and the sintered Ti film-bonded diamond particles, and the generated abrasive grains. Holding material Hard material powder / sintering auxiliary material powder Sintered structure is compounded and sintered, abrasive grain holding material hard material / sintering auxiliary material powder / sintered Ti film-bonded diamond powder and abrasive grain holding material hard To produce a composite sintered structure consisting of a sintered structure of a powder of powder and a sintering aid powder,
In the composite sintered structure, the composite sintered structure of the Ti film, which is sintered on the surface of each diamond particle, the abrasive grain holding material hard material powder, and the sintering aid powder, is between the individual diamond abrasive grains. In addition, the alloy structure of Ti and the sintering aid is strongly bonded to each diamond abrasive grain, and if the hard powder sintered structure is used, the diamond abrasive grain can be suppressed from swinging. Not only the grains are held firmly, but the diamond abrasive grains are also held firmly because the diamond abrasive grain-bonded hard material powder sintered structure is firmly held. Up to about 30% of its capacity, the loosening of the abrasive grains does not occur and the abrasive grains do not fall off. Therefore, the life of the diamond abrasive grains is extended, and the effective utilization rate of the abrasive grains is about 50% in the conventional metal-bonded diamond grindstone. Obtainable.
【０００５】[0005]
【作 用】本発明のダイヤモンド結合砥石を製造する
に当って使用する原料には、砥粒としてはＴｉが０．５
重量％乃至０．７重量％の範囲内の割合のＴｉ皮膜を被
覆して成るＴｉ被覆ダイヤモンド粉末を砥粒保持材とし
ては硬質炭化物・硬質硼化物・硬質窒化物・硬質珪化物
・硬質酸化物のうちより選択した硬質物の粉末を、焼結
助材粉末としてはＮｉ系合金粉末・Ｃｏ系合金粉末のう
ちより選択した合金の粉末を使用する。これらの原料を
用いて本発明のダイヤモンド結合砥石を製造する場合の
焼結用原料としては、Ｔｉ被覆ダイヤモンド粉末を１０
容量％乃至４０容量％を、砥粒保持材硬質物粉末を５０
容量％乃至８２容量％と、焼結助材粉末を８容量％乃至
１０容量％と、の割合範囲内より選定した割合にて混合
した混合粉末を用い、斯様な割合にて混合した焼結用原
料を砥石成形用型に型込めして５ｔｏｎ／ｃｍ２乃至１
７ｔｏｎ／ｃｍ２の範囲内の圧力にて加圧すると共に８
００℃乃至１，１４０℃の範囲内の温度にて加熱して焼
結作業を行う。この焼結作業においては、個々のＴｉ被
覆ダイヤモンド粒子におけるＴｉ皮膜がダイヤモンド粒
子の表面に焼結結合してＴｉ皮膜結合ダイヤモンド粒子
の多数個を生成すると共に其の生成した個々のＴｉ皮膜
結合ダイヤモンド粒子が其の表面に接している砥粒保持
材硬質物粉末と焼結助材粉末とに焼結して砥粒保持材硬
質物粉末・焼結助材粉末・焼結Ｔｉ皮膜結合ダイヤモン
ド粉末との焼結組織を生成し、同時に、砥粒保持材硬質
物粉末と焼結助材粉末とより成る砥粒保持材硬質物粉末
と焼結助材粉末との焼結組織を生成し、更に同時に、生
成した砥粒保持材硬質物粉末と焼結助材粉末と焼結Ｔｉ
皮膜結合ダイヤモンド粉末との焼結組織と、生成した砥
粒保持材硬質物粉末・焼結助材粉末との焼結組織とが複
合焼結して砥粒保持材硬質物粉末と焼結助材粉末と焼結
Ｔｉ皮膜結合ダイヤモンド砥粒焼結組織と砥粒保持材硬
質物粉末・焼結助材粉末焼結組織との複合焼結組織体を
生成し、其の生成した複合焼結組織体においては、個々
のダイヤモンド砥粒の外面に接しているＴｉ皮膜と焼結
助材粉末の合金により成る合金組織が個々のダイヤモン
ド砥粒に強く焼結結合すると共に、Ｔｉ皮膜と焼結助材
粉末と砥粒保持硬質物粉末とが結合して成るダイヤモン
ド結合砥石を生成している。斯様にして生成したダイヤ
モンド結合砥石を用いて研摩作業を行うときは、砥石の
表面部においてダイヤモンド砥粒が摩耗してゆくときに
其の摩耗によって生じたダイヤモンド微粉末が、ダイヤ
モンド砥粒の間に充填している砥粒保持材硬質物粉末と
焼結助材粉末とＴｉ皮膜との焼結組織をも削ずりとって
ゆくのであるが、其の焼結組織は其の容積の大部分が砥
粒保持材硬質物粉末にて構成されていてダイヤモンド砥
粒を堅く保持しているので、研摩作業によって生ずるダ
イヤモンド砥粒の揺動が抑制され、ダイヤモンド砥粒の
容量の７０％程度が研摩作業に役立つことができる。従
って、ダイヤモンド砥粒の有効利用率が著しく高くな
り、ダイヤモンド結合砥石の寿命を長くすることができ
る。[Operation] The raw material used in the production of the diamond-bonded grindstone of the present invention contains Ti of 0.5 as abrasive grains.
The Ti-coated diamond powder formed by coating the Ti coating in the range of wt% to 0.7 wt% is used as an abrasive grain holding material for hard carbide, hard boride, hard nitride, hard silicide, and hard oxide. A powder of a hard material selected from the above is used, and a powder of an alloy selected from Ni-based alloy powder / Co-based alloy powder is used as the sintering aid powder. As a raw material for sintering when the diamond-bonded grindstone of the present invention is produced by using these raw materials, Ti-coated diamond powder is used.
50% by volume to 40% by volume of hard abrasive powder
% To 82% by volume, and 8% to 10% by volume of the sintering aid powder mixed in a ratio selected from the range, and the mixed powder is mixed in such a ratio. 5ton / cm 2 to 1 after putting the raw material for grinding into the grinding stone forming mold
Pressurize at a pressure within the range of 7 ton / cm 2 and 8
Sintering is performed by heating at a temperature in the range of 00 ° C to 1,140 ° C. In this sintering operation, the Ti coating on each Ti-coated diamond particle is sinter-bonded to the surface of the diamond particle to generate a large number of Ti-coating-bonded diamond particles, and the individual Ti-coating-bonded diamond particles thus generated. Of the abrasive grain holding material hard material powder and the sintering aid powder which are in contact with the surface of the abrasive grain holding material hard material powder / sintering aid material powder / sintered Ti film-bonded diamond powder Produces a sintered structure, at the same time, produces a sintered structure of an abrasive grain holding material hard material powder and a sintering aid powder consisting of abrasive grain holding material hard material powder and sintering aid material powder, and at the same time, Abrasive Grain Holding Material Hard Material Powder, Sintering Aid Material Powder and Sintered Ti
The sintered structure with the film-bonded diamond powder and the sintered structure of the generated abrasive grain holding material hard material powder / sintering auxiliary material powder are composite-sintered to give an abrasive grain holding material hard material powder and sintering auxiliary material. Powder and Sintering Ti film-bonded diamond abrasive grain sintered structure and abrasive grain holding material Hard material powder / sintering aid powder Sintered composite structure is generated, and the generated composite sintered structure In the above, the alloy structure composed of the alloy of the Ti coating and the sintering aid powder in contact with the outer surface of each diamond abrasive grain is strongly sinter-bonded to each diamond abrasive grain, and the Ti coating and the sintering aid powder are A diamond-bonded grindstone is formed by bonding the abrasive grain holding hard material powder. When performing a polishing operation using the diamond-bonded grindstone thus produced, when the diamond abrasive grains are worn on the surface portion of the grindstone, the diamond fine powder produced by the abrasion is between the diamond abrasive grains. Although the sintered structure of the abrasive grain holding material hard material powder, the sintering aid powder, and the Ti coating, which are filled in, is also scraped off, most of the volume of the sintered structure is large. Abrasive Grain Holding Material Because it is made up of hard material powder and firmly holds the diamond abrasive grains, fluctuation of the diamond abrasive grains caused by the polishing work is suppressed, and about 70% of the capacity of the diamond abrasive grains is polished. Can help you. Therefore, the effective utilization rate of the diamond abrasive grains is significantly increased, and the life of the diamond-bonded grindstone can be extended.
【０００６】[0006]
【実施例】Ｔｉ皮膜を０．６重量％の割合にて被覆して
いるＴｉ被覆ダイヤモンド粉末（デ・ビアス社製）を砥
粒として２５容量％と、砥粒保持材硬質物粉末とするＴ
ｉＣ粉末を６５容量％と、Ｃｏ−Ｃｒ系合金（４７．０
Ｃｏ−１６．０ Ｃｒ−２．０ Ｆｅ−１．５ Ｓｉ
−２．０ Ｂ−０．５Ｃ）のワレックスＮｏ．４０の粉
末を焼結助材粉末として１０容量％と、の割合にて混合
した混合粉末を砥石焼結用原料とした。其の焼結用原料
を型込めして１２ｔｏｎ／ｃｍ２の圧力にて加圧して加
圧成形体を生成した。次いで、其の加圧成形体を水素炉
の中で１，１４０℃の温度にて加熱して、個々のＴｉ被
覆ダイヤモンド粒子におけるＴｉ皮膜がダイヤモンド粒
子の表面に焼結結合すると共に、生成したＴｉ皮膜結合
ダイヤモンド粒子が其の粒子に接しているＴｉＣ粉末と
Ｃｏ−Ｃｒ系合金粉末としても焼結してＴｉＣ粉末・Ｃ
ｏ−Ｃｒ系合金粉末・焼結Ｔｉ皮膜結合ダイヤモンド粒
子の多数個より成るＴｉＣ粉末・Ｃｏ−Ｃｒ系合金粉末
・焼結Ｔｉ皮膜結合ダイヤモンド粉末を生成し、同時に
ＴｉＣ粉末とＣｏ−Ｃｒ系合金粉末との混合粉末が相互
に焼結してＴｉＣ粉末・Ｃｏ−Ｃｒ系合金粉末焼結組織
を生成し、更に同時に生成したＴｉＣ粉末・Ｃｏ−Ｃｒ
系合金粉末・焼結Ｔｉ皮膜結合ダイヤモンド粉末と、生
成したＴｉＣ粉末・Ｃｏ−Ｃｒ系合金粉末焼結組織と、
が複合焼結して、ダイヤモンド結合複合焼結組織体を構
成して成るダイヤモンド結合砥石を生成した。[Examples] T coated diamond powder (manufactured by De Beers) having a Ti coating coated at a ratio of 0.6% by weight was used as an abrasive grain of 25% by volume, and an abrasive grain holding material hard powder was used.
65% by volume of iC powder and Co-Cr alloy (47.0%)
Co-16.0 Cr-2.0 Fe-1.5 Si
-2.0 B-0.5 C) Wallex No. The powder of 40 was mixed with 10% by volume as a sintering aid powder, and the mixed powder was used as a raw material for sintering a grindstone. The sintering raw material was molded and pressed at a pressure of 12 ton / cm 2 to produce a pressure-molded body. Then, the pressed compact was heated in a hydrogen furnace at a temperature of 1,140 ° C., and the Ti coating on each Ti-coated diamond particle was sinter-bonded to the surface of the diamond particle and the produced Ti was formed. The TiC powder in which the film-bonded diamond particles are in contact with the particles and the Co-Cr alloy powder are also sintered to form TiC powder / C.
O-Cr alloy powder, TiC powder consisting of a large number of sintered Ti film-bonded diamond particles, Co-Cr alloy powder, and sintered Ti film-bonded diamond powder are produced at the same time, and TiC powder and Co-Cr alloy powder are also produced. TiC powder / Co—Cr system alloy powder sintered structure is generated by the mutual sintering of the mixed powders of TiC powder and Co—Cr powder.
-Based alloy powder / sintered Ti film-bonded diamond powder, the produced TiC powder / Co-Cr-based alloy powder sintered structure,
Was composite-sintered to produce a diamond-bonded grindstone composed of a diamond-bonded composite sintered structure.
【０００７】[0007]
【実施例】Ｔｉ皮膜を０．６重量％の割合にて被覆して
いるＴｉ被覆ダイヤモンド粉末（デ・ビアス社製）を砥
粒として２５容量％と、砥粒保持材硬質物粉末とするＴ
ｉＢ２粉末を６５容量％と、Ｎｉ−Ｃｒ系合金（８６．
０２ Ｎｉ−７．５ Ｃｒ−１．７５ Ｆｅ−１．６３
Ｂ−２．７５ Ｓｉ−０．３５Ｃ）のコルモノイＮ
ｏ．３２の粉末を焼結助材粉末として１０容量％と、の
割合にて混合した混合粉末を砥石焼結用原料とした。其
の焼結用原料を型込めして１２ｔｏｎ／ｃｍ２の圧力に
て加圧して加圧成形体を生成した。次いで、其の加圧成
形体を水素炉の中で１，１２０℃の温度にて加熱して、
個々のＴｉ被覆ダイヤモンド粒子におけるＴｉ皮膜がダ
イヤモンド粒子の表面に焼結結合すると共に生成したＴ
ｉ皮膜結合ダイヤモンド粒子が其の粒子に接しているＴ
ｉ Ｂ２粉末とＮｉ−Ｃｒ系合金粉末とにも焼結してＴ
ｉ Ｂ２粉末・Ｎｉ−Ｃｒ系合金粉末・焼結Ｔｉ皮膜結
合ダイヤモンド粒子の多数個より成るＴｉ Ｂ２粉末・
Ｎｉ−Ｃｒ系合金粉末・焼結Ｔｉ皮膜結合ダイヤモンド
粉末を生成し、同時にＴｒ Ｂ２粉末とＮｉ−Ｃｒ系合
金粉末との混合粉末が相互に焼結して、Ｔｉ Ｂ２粉末
・Ｎｒ−Ｃｒ系合金粉末焼結組織を生成し、更に同時に
生成したＴｉ Ｂ２粉末・Ｎｉ−Ｃｒ系合金粉末・焼結
Ｔｉ皮膜結合ダイヤモンド粉末と、生成したＴｉ Ｂ２
粉末・Ｎｉ−Ｃｒ系合金粉末焼結組織と、が複合焼結し
てダイヤモンド結合複合焼結組織体を構成して成るダイ
ヤモンド結合砥石を生成した。[Examples] T coated diamond powder (manufactured by De Beers) having a Ti coating coated at a ratio of 0.6% by weight was used as an abrasive grain of 25% by volume, and an abrasive grain holding material hard powder was used.
65% by volume of iB 2 powder and a Ni—Cr alloy (86.
02 Ni-7.5 Cr-1.75 Fe-1.63
B-2.75 Si-0.35C) Colmonoy N
o. The powder of 32 was mixed with 10% by volume as a sintering aid powder, and the mixed powder was used as a raw material for sintering a grindstone. The sintering raw material was molded and pressed at a pressure of 12 ton / cm 2 to produce a pressure-molded body. Then, the pressure molded body is heated in a hydrogen furnace at a temperature of 1,120 ° C.,
The Ti film formed on the individual Ti-coated diamond particles was sinter-bonded to the surface of the diamond particles and formed T
i The film-bonded diamond particle is in contact with the particle T
i B 2 powder and Ni-Cr alloy powder were also sintered to produce T
i B 2 powder / Ni-Cr alloy powder / Ti B 2 powder composed of a large number of sintered Ti film-bonded diamond particles
Ni—Cr alloy powder / sintered Ti film-bonded diamond powder is generated, and at the same time, the mixed powder of Tr B 2 powder and Ni—Cr alloy powder is mutually sintered to form Ti B 2 powder / Nr—Cr. TiB 2 powder / Ni—Cr alloy powder / sintered Ti film-bonded diamond powder, and TiB 2 produced
A diamond-bonded grindstone was produced by composing a powder-Ni-Cr alloy powder sintered structure and a diamond-bonded composite sintered structure.
【０００８】[0008]
【実施例】Ｔｉ皮膜を０．６重量％の割合にて被覆して
いるＴｉ被覆ダイヤモンド粉末（デ・ビアス社製）を砥
粒として２５容量％と、砥粒保持材硬質物粉末とするＴ
ｉＮ粉末を６５容量％と、Ｃｏ−Ｃｒ−Ｎｉ系合金（４
４．９５ Ｃｏ−１９．０Ｃｒ−１８．０ Ｎｉ−１
０．０ Ｗ−１．０ Ｆｅ−３．５ Ｂ−２．７５Ｓｉ
−０．８Ｃ）のワレックスＮｏ．５０の粉末を焼結助材
粉末として１０容量％と、の割合にて混合した混合粉末
を焼結用原料とした。其の焼結用原料を型込めして１２
ｔｏｎ／ｃｍ２の圧力にて加圧して加圧成形体を生成し
た。次いで、其の加圧成形体を水素炉の中で１，１２０
℃の温度にて加熱して個々のＴｉ被覆ダイヤモンド粒子
におけるＴｉ皮膜がダイヤモンド粒子の表面に焼結結合
すると共に、生成したＴｉ皮膜ダイヤモンド粒子が其の
粒子に接しているＴｉＮ粉末とＣｏ−Ｃｒ−Ｎｉ系合金
粉末ともに焼結してＴｉＮ粉末・Ｃｏ−Ｃｒ−Ｎｉ系合
金粉末・焼結Ｔｉ皮膜結合ダイヤモンド粒子の多数個よ
り成るＴｉＮ粉末・Ｃｏ−Ｃｒ−Ｎｉ系合金粉末・焼結
Ｔｉ皮膜結合ダイヤモンド粉末を生成し、同時にＴｉＮ
粉末とＣｏ−Ｃｒ−Ｎｉ系合金粉末との混合粉末が相互
に焼結してＴｉＮ粉末・Ｃｏ−Ｃｒ−Ｎｉ系合金粉末焼
結組織を生成し、更に同時に生成したＴｉＮ粉末・Ｃｏ
−Ｃｒ−Ｎｉ系合金粉末・焼結Ｔｉ皮膜結合ダイヤモン
ド粉末と生成したＴｉＮ粉末・Ｃｏ−Ｃｒ−Ｎｉ系合金
粉末焼結組織と、が複合焼結してダイヤモンド結合複合
焼結組織体を構成して成るダイヤモンド結合砥石を生成
した。[Examples] T coated diamond powder (manufactured by De Beers) having a Ti coating coated at a ratio of 0.6% by weight was used as an abrasive grain of 25% by volume, and an abrasive grain holding material hard powder was used.
65% by volume of iN powder and Co-Cr-Ni alloy (4
4.95 Co-19.0 Cr-18.0 Ni-1
0.0 W-1.0 Fe-3.5 B-2.75Si
-0.8C) Wallex No. A mixed powder obtained by mixing 50 powders with 10% by volume as a sintering aid powder was used as a sintering raw material. Put the raw material for sintering into 12
It was pressed at a pressure of ton / cm 2 to produce a pressure molded body. Then, the pressure molded body is placed in a hydrogen furnace for 1,120
The Ti film on each Ti-coated diamond particle is sintered and bonded to the surface of the diamond particle by heating at a temperature of ℃, and the produced Ti-coated diamond particle is in contact with the TiN powder and Co-Cr- TiN powder / Co-Cr-Ni alloy powder / sintered Ti coating bonded TiN powder / Co-Cr-Ni alloy powder / sintered Ti coating bonded by sintering together with Ni-based alloy powder Produces diamond powder and at the same time TiN
The mixed powder of the powder and the Co-Cr-Ni alloy powder is mutually sintered to generate a TiN powder / Co-Cr-Ni alloy powder sintered structure, and at the same time, the TiN powder / Co is formed.
-Cr-Ni alloy powder / sintered Ti film-bonded diamond powder and the generated TiN powder / Co-Cr-Ni alloy powder sintered structure are composite-sintered to form a diamond-bonded composite sintered structure. A diamond-bonded whetstone composed of
【０００９】[0009]
【実施例】Ｔｉ皮膜を０．６重量％の割合にて被覆して
いるＴｉ被覆ダイヤモンド粉末（デ・ビアス社製）を砥
粒として２５容量％と、砥粒保持材硬質物粉末とするＭ
ｏＳｉ２粉末を６５容量％と、Ｎｉ系合金（９３．２５
Ｎｉ−１．０ Ｃｒ−０．７５ Ｆｅ−１．６ Ｂ−
３．３ Ｓｉ−０．１Ｃ）のコルモノイＮｏ．２２の粉
末を焼結助材粉末として１０容量％と、の割合にて混合
した混合粉末を砥石焼結用原料とした。其の焼結用原料
を型込めして１２ｔｏｎ／ｃｍ２の圧力にて加圧して加
圧成形体を生成した。次いで、其の加圧成形体を水素炉
の中で１，１００℃の温度にて加熱して、個々のＴｉ被
覆ダイヤモンド粒子におけるＴｉ皮膜がダイヤモンド粒
子の表面に焼結結合すると共に、生成したＴｉ皮膜結合
ダイヤモンド粒子が其の粒子に接しているＭｏ Ｓｉ２
粉末とＮｉ系合金粉末とにも焼結してＭｏ Ｓｉ２粉末
・Ｎｉ系合金粉末・焼結Ｔｉ皮膜結合ダイヤモンド粒子
の多数個より成るＭｏ Ｓｉ２粉末・Ｎｉ系合金粉末・
焼結Ｔｉ皮膜結合ダイヤモド粉末を生成し、同時にＭｏ
Ｓｉ２粉末とＮｉ系合金粉末との混合粉末が相互に焼
結してＭｏ Ｓｉ２粉末・Ｎｉ系合金粉末焼結組織を生
成し、更に同時に生成したＭｏ Ｓｉ２粉末・Ｎｉ系合
金粉末・焼結Ｔｉ皮膜結合ダイヤモンド粉末と生成した
Ｍｏ Ｓｉ２粉末・Ｎｉ系合金粉末焼結組織と、が複合
焼結して、ダイヤモンド結合複合焼結組織体を構成して
成るダイヤモンド結合砥石を生成した。[Example] An amount of 25% by volume of Ti-coated diamond powder (made by De Beers Co., Ltd.) coated with a Ti film at a ratio of 0.6 wt% as abrasive grains and a hard-material powder for abrasive grain holding material M
65% by volume of oSi 2 powder and Ni-based alloy (93.25
Ni-1.0 Cr-0.75 Fe-1.6 B-
3.3 Si-0.1C) Colmonoy No. The powder of No. 22 was mixed with 10% by volume as a sintering aid powder, and a mixed powder was used as a raw material for grinding stone grinding. The sintering raw material was molded and pressed at a pressure of 12 ton / cm 2 to produce a pressure-molded body. Then, the pressure-formed body was heated in a hydrogen furnace at a temperature of 1,100 ° C., and the Ti coating on each Ti-coated diamond particle was sinter-bonded to the surface of the diamond particle, and the produced Ti was formed. Mo Si 2 with film-bound diamond particles in contact with it
Powder and Ni-based alloy powder are also sintered to form Mo 2 Si powder, Ni-based alloy powder, Mo Si 2 powder composed of a large number of sintered Ti film-bonded diamond particles, Ni-based alloy powder,
Sintered Ti film-bonded diamond powder is produced and at the same time Mo
A mixed powder of Si 2 powder and Ni-based alloy powder is mutually sintered to generate a Mo 2 Si 2 powder / Ni-based alloy powder sintered structure, and at the same time Mo 2 Si 2 powder / Ni-based alloy powder / fired A diamond-bonded grindstone constituted by forming a diamond-bonded composite sintered structure by composite sintering of the Ti-bonded Ti-film bonded diamond powder and the generated Mo 2 Si 2 powder / Ni-based alloy powder sintered structure was formed.
【００１０】[0010]
【実施例】Ｔｉ皮膜を０．６重量％の割合にて被覆して
いるＴｉ被覆ダイヤモンド粉末（デ・ビアス社製）を砥
粒として２５容量％と砥粒保持材硬質物粉末とするＡｌ
２Ｏ３粉末を６５容量％と、Ｎｉ−Ｃｒ系合金（６５．
６ Ｎｉ−２６．０ Ｃｒ−０．５ Ｆｅ−３．９ Ｓ
ｉ−３．１ Ｂ−０．９Ｃ）のコルモノイＮｏ．８粉末
を焼結助材粉末として１０容量％と、の割合にて混合し
た混合粉末を砥石焼結用原料とした。其の焼結用原料を
型込めして１２ｔｏｎ／ｃｍ２の圧力にて加圧して加圧
成形体を生成した。次いで、其の加圧成形体を水素炉の
中で１，１００℃の温度にて加熱して、個々のＴｉ被覆
ダイヤモン粒子におけるＴｉ皮膜がダイヤモンド粒子の
表面に焼結結合すると共に、生成したＴｉ皮膜結合ダイ
ヤモンド粒子が其の粒子に接しているＡｌ２ Ｏ３粉末
とＮｉ−Ｃｒ系合金粉末とにも焼結してＡｌ２ Ｏ３粉
末・Ｎｉ−Ｃｒ系合金粉末・焼結Ｔｉ皮膜結合ダイヤモ
ンド粒子の多数個より成るＡｌ２ Ｏ３粉末・Ｎｉ−Ｃ
ｒ系合金粉末・焼結Ｔｉ皮膜結合ダイヤモンド粉末を生
成し、同時にＡｌ２ Ｏ３粉末とＮｉ−Ｃｒ系合金粉末
との混合粉末が相互に焼結してＡｌ２ Ｏ３粉末・Ｎｉ
−Ｃｒ系合金粉末焼結組織を生成し、更に同時に生成し
たＡｌ２ Ｏ３粉末・Ｎｉ−Ｃｒ系合金粉末・焼結Ｔｉ
皮膜結合ダイヤモンド粉末と、生成したＡｌ２ Ｏ３粉
末・Ｎｉ−Ｃｒ系合金粉末焼結組織と、が複合焼結して
ダイヤモンド結合複合焼結組織体を構成して成るダイヤ
モンド結合砥石を生成した。[Example] Al using Ti-coated diamond powder (manufactured by De Beers Co.) coated with a Ti coating at a ratio of 0.6% by weight as an abrasive grain of 25% by volume and an abrasive grain-holding material hard material powder.
65% by volume of 2 O 3 powder and a Ni—Cr alloy (65.
6 Ni-26.0 Cr-0.5 Fe-3.9 S
i-3.1 B-0.9 C) Colmonoy No. A mixed powder obtained by mixing 8 powders as a sintering aid powder at a ratio of 10% by volume was used as a raw material for sintering a grindstone. The sintering raw material was molded and pressed at a pressure of 12 ton / cm 2 to produce a pressure-molded body. Then, the pressure-formed body was heated in a hydrogen furnace at a temperature of 1,100 ° C., and the Ti coating on each Ti-coated diamond particle was sinter-bonded to the surface of the diamond particle and the produced Ti was formed. Al 2 O 3 powder in which the film-bonded diamond particles are in contact with the Ni-Cr alloy powder and Al 2 O 3 powder / Ni-Cr alloy powder / sintered Ti film-bonded diamond Al 2 O 3 powder / Ni-C composed of many particles
The r-based alloy powder / sintered Ti film-bonded diamond powder is generated, and at the same time, the mixed powder of the Al 2 O 3 powder and the Ni—Cr-based alloy powder is mutually sintered to form the Al 2 O 3 powder / Ni.
Generates -Cr alloy powder sintered tissue, Al 2 produced more simultaneously O 3 powder, Ni-Cr alloy powder and sintering Ti
A diamond-bonded grindstone was produced in which the film-bonded diamond powder and the generated Al 2 O 3 powder / Ni—Cr alloy powder sintered structure were composite-sintered to form a diamond-bonded composite sintered structure.
【００１１】[0011]
【発明の効果】本発明のダイヤモンド結合砥石は、上記
の方法により焼結作業を行って生成した砥石であって、
個々のダイヤモンド砥粒を包囲し個々のダイヤモンド砥
粒の間を充填しているＴｉと焼結助材と硬質物粉末との
焼結組織においてＴｉと焼結助材との合金組織が個々の
ダイヤモンド砥粒に強く結合すると共に硬質物粉末と焼
結助材粉末との焼結組織がダイヤモンド砥粒を強く保持
しており、ダイヤモンド砥粒の揺動を抑制してダイヤモ
ンド砥粒の脱落を防止できるダイヤモンド砥粒結合硬質
物粉末焼結組織を構成していて、ダイヤモンド砥粒の容
量の７０％程度を研摩作業に役立てることができるの
で、ダイヤモンド砥粒の寿命が長くなりダイヤモンド砥
粒の有効利用率を従来のメタルボンド砥石における砥粒
の有効利用率より著しく高めたダイヤモンド結合砥石を
得ることができる効果がある。The diamond-bonded whetstone of the present invention is a whetstone produced by performing a sintering operation by the above method,
In the sintering structure of Ti, which surrounds the individual diamond abrasive grains and fills the space between the individual diamond abrasive grains, the sintering aid, and the hard material powder, the alloy structure of Ti and the sintering aid is the individual diamond. It is strongly bonded to the abrasive grains and the sintered structure of the hard material powder and the sintering aid powder strongly holds the diamond abrasive grains, and it is possible to prevent the diamond abrasive grains from falling off by suppressing the oscillation of the diamond abrasive grains. Since the diamond abrasive grain-bonded hard material powder sintered structure is composed and about 70% of the volume of the diamond abrasive grains can be utilized for polishing work, the life of the diamond abrasive grains is extended and the effective utilization rate of the diamond abrasive grains is increased. There is an effect that it is possible to obtain a diamond-bonded grindstone in which the effective utilization rate of the abrasive grains in the conventional metal bond grindstone is significantly increased.
Claims (2)
り成る砥粒粉末を１０容量％乃至４０容量％と、硬質の
炭化物・硼化物・窒化物・珪化物・酸化物のうちより選
択した硬質物の粉末を砥粒保持材として５０容量％乃至
８２容量％と、Ｎｉ系合金粉末或はＣｏ系合金粉末のう
ちより選択した合金粉末を焼結助材粉末として８容量％
乃至１０容量％と、の範囲内より選定した割合にて混合
した混合粉末を焼結用原料とし、其の焼結用原料を砥石
成形用型に型込めして５ｔｏｎ／ｃｍ２乃至１７ｔｏｎ
／ｃｍ２の範囲内の圧力にて加圧すると共に８００℃乃
至１，１４０℃の範囲内の温度にて加熱して個々のＴｉ
被覆ダイヤモンド粒子におけるＴｉ皮膜がダイヤモンド
粒子の表面に焼結結合して成るＴｉ皮膜結合ダイヤモン
ド粒子の多数個を生成すると共に其の生成した個々のＴ
ｉ皮膜結合ダイヤモンド粒子が其の外面に接している砥
粒保持材硬質物粉末と焼結助材粉末とに焼結して砥粒保
持材硬質物粉末・焼結助材粉末・焼結Ｔｉ皮膜結合ダイ
ヤモンド粒子の多数個を生成すると同時に、砥粒保持材
硬質物粉末と焼結助材粉末とより成る砥粒保持材硬質物
粉末・焼結助材粉末焼結組織を生成し、更に同時に生成
した砥粒保持材硬質物粉末・焼結助材粉末・焼結Ｔｉ皮
膜結合ダイヤモンド砥粒焼結組織と、生成した砥粒保持
材硬質物粉末・焼結助材粉末焼結組織と、が複合焼結し
て砥粒保持材硬質物粉末・焼結助材粉末・焼結Ｔｉ皮膜
結合ダイヤモンド砥粒焼結組織・砥粒保持材硬質物粉末
・焼結助材粉末焼結組織複合焼結組織体を生成し、其の
生成した複合焼結組織体において、Ｔｉと焼結助材との
合金組織が個々のダイヤモンド砥粒に強く結合すると共
に硬質物粉末・焼結助材粉末焼結組織がダイヤモンド砥
粒の揺動を抑制しダイヤモンド砥粒を堅く保持してダイ
ヤモンド砥粒結合硬質物粉末焼結組織体を構成している
ことを特徴とするダイヤモンド結合砥石。1. A hard material selected from hard carbides, borides, nitrides, silicides, and oxides, which comprises 10% by volume to 40% by volume of abrasive grain powder composed of a large number of Ti-coated diamond particles. The powder is 50% by volume to 82% by volume as an abrasive holding material, and the alloying powder selected from Ni-based alloy powder or Co-based alloy powder is 8% by volume as a sintering aid powder.
5 to 10% by volume and mixed powder in a ratio selected from the range of 5 ton / cm 2 to 17 ton is used as a sintering raw material, and the sintering raw material is put into a grinding stone forming mold.
Individual Ti by pressurizing at a pressure in the range of 1 / cm 2 and heating at a temperature in the range of 800 ° C. to 1140 ° C.
A large number of Ti film-bonded diamond particles formed by the Ti film on the coated diamond particles being sintered and bonded to the surface of the diamond particles and the individual T
i Film-bonded diamond particles are sintered to an abrasive grain holding material hard material powder and a sintering aid powder in contact with the outer surface of the abrasive grain holding material hard material powder / sintering aid powder / sintered Ti film At the same time as producing a large number of bonded diamond particles, an abrasive grain holding material hard material powder / sintering aid powder sintered structure consisting of abrasive grain holding material hard matter powder and sintering aid powder is produced, and at the same time Abrasive Grain Holding Material Hard Material Powder / Sintering Aid Powder / Sintered Ti Film Bonded Diamond Abrasive Grain Sintering Structure and Generated Abrasive Grain Holding Material Hard Material Powder / Sintering Aid Powder Sintering Structure Sintered abrasive grain holding material Hard material powder / sintering auxiliary material powder / sintered Ti film bonded diamond abrasive grain sintered structure / abrasive grain holding material hard material powder / sintering auxiliary material powder Sintered structure composite sintered structure And the alloy structure of Ti and a sintering aid is The hard material powder / sintering aid powder sintered structure suppresses the rocking of the diamond abrasive grains and firmly holds the diamond abrasive grains while firmly bonding to the earmond abrasive grains, and the diamond abrasive grain bonded hard material powder sintered structure is formed. A diamond-bonded grindstone characterized by being constructed.
り成る砥粒粉末を１０容量％乃至４０容量％と、硬質の
炭化物・硼化物・窒化物・珪化物・酸化物のうちより選
択した硬質物の粉末を砥粒保持材として５０容量％乃至
８２容量％と、Ｎｉ系合金粉末或はＣｏ系合金粉末のう
ちより選択した合金粉末を焼結助材粉末として８容量％
乃至１０容量％と、の範囲内より選定した割合にて混合
した混合粉末を焼結用原料とし、其の焼結用原料を砥石
成形用型に型込めして５ｔｏｎ／ｃｍ２乃至１７ｔｏｎ
／ｃｍ２の範囲内の圧力にて加圧すると共に８００℃乃
至１，１４０℃の範囲内の温度にて加熱して、個々のＴ
ｉ被覆ダイヤモンド粒子におけるＴｉ皮膜がダイヤモン
ド粒子の表面に焼結結合して成るＴｉ皮膜結合ダイヤモ
ンド粒子の多数個を生成すると共に其の生成した個々の
Ｔｉ皮膜結合ダイヤモンド粒子が其の外面に接している
砥粒保持材硬質物粉末と焼結助材粉末とに焼結して砥粒
保持材硬質物粉末・焼結Ｔｉ皮膜結合ダイヤモンド粒子
の多数個を生成すると同時に砥粒保持材硬質物粉末と焼
結助材粉末とより成る砥粒保持材硬質物粉末・焼結助材
粉末焼結組織を生成し、更に同時に生成した砥粒保持材
硬質物粉末・焼結助材粉末・焼結Ｔｉ皮膜結合ダイヤモ
ンド砥粒焼結組織と、生成した砥粒保持材硬質物粉末・
焼結助材粉末焼結組織と、が複合焼結して砥粒保持材硬
質物粉末・焼結助材粉末・焼結Ｔｉ皮膜結合ダイヤモン
ド砥粒焼結組織・砥粒保持材硬質物粉末焼結助材粉末焼
結組織複合焼結組織体を生成し、其の生成した複合焼結
組織体においてＴｉと焼結助材との合金組織が個々のダ
イヤモンド砥粒に強く結合すると共に硬質物粉末・焼結
助材粉末焼結組織がダイヤモンド砥粒の揺動を抑制し、
ダイヤモンド砥粒を堅く保持して成るダイヤモンド砥粒
結合硬質物粉末・焼結組織体を構成することを特徴とす
るダイヤモンド結合砥石の製造法。2. A hard material selected from hard carbides, borides, nitrides, silicides, and oxides, which is 10% by volume to 40% by volume of abrasive grain powder composed of a large number of Ti-coated diamond particles. The powder is 50% by volume to 82% by volume as an abrasive holding material, and the alloying powder selected from Ni-based alloy powder or Co-based alloy powder is 8% by volume as a sintering aid powder.
5 to 10% by volume and mixed powder in a ratio selected from the range of 5 ton / cm 2 to 17 ton is used as a sintering raw material, and the sintering raw material is put into a grinding stone forming mold.
Pressure at a pressure in the range of 1 / cm 2 and heating at a temperature in the range of 800 ° C. to 1,140 ° C.
A large number of Ti film-bonded diamond particles formed by the Ti film on the i-coated diamond particles being sintered and bonded to the surface of the diamond particles, and the individual Ti film-bonded diamond particles thus formed are in contact with the outer surface thereof. Abrasive grain holding material hard material powder and sintering aid material powder are sintered to produce a large number of abrasive grain holding material hard material powder / sintered Ti film-bonded diamond particles, and at the same time, abrasive grain holding material hard material powder and sintering Abrasive grain holding material consisting of binding material powder Hard material powder / sintering auxiliary material powder Sintering structure is generated, and at the same time, abrasive grain holding material hard material powder / sintering auxiliary material powder / sintered Ti film bond Diamond abrasive grain sintered structure and generated abrasive grain holding material hard material powder
Sintering auxiliary material powder Sintered structure and composite sintered to produce abrasive grain holding material hard material powder / sintering auxiliary material powder / sintered Ti coating bonded diamond abrasive grain sintered structure / abrasive grain holding material hard material powder firing Auxiliary Material Powder Sintered Microstructure A composite sintered structure is produced, and in the produced composite sintered structure, the alloy structure of Ti and the sintering aid is strongly bonded to the individual diamond abrasive grains and hard material powder.・ The sintering aid powder sintering structure suppresses the oscillation of diamond abrasive grains,
A method for producing a diamond-bonded grindstone, characterized in that a diamond-abrasive-grain-bonded hard material powder / sintered structure formed by firmly holding diamond abrasive grains is constituted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8904993A JPH06262526A (en) | 1993-03-11 | 1993-03-11 | Diamond bonded grinding wheel and its manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8904993A JPH06262526A (en) | 1993-03-11 | 1993-03-11 | Diamond bonded grinding wheel and its manufacture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06262526A true JPH06262526A (en) | 1994-09-20 |
Family
ID=13960031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8904993A Pending JPH06262526A (en) | 1993-03-11 | 1993-03-11 | Diamond bonded grinding wheel and its manufacture |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06262526A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3924969A1 (en) * | 1988-07-30 | 1990-02-01 | Mazda Motor | SAFETY BELT DEVICE FOR VEHICLE WITH TOP OPEN BODY |
| US20120017741A1 (en) * | 2009-04-29 | 2012-01-26 | Nv Bekaert Sa | Sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder |
| US20130074820A1 (en) * | 2011-09-22 | 2013-03-28 | Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense | Fret Saw Including a Cutting Wire Provided with Fixed Abrasive Grains each Including a Core Coated with a Hard Film |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02172672A (en) * | 1988-12-27 | 1990-07-04 | Hitachi Seiko Ltd | Grindstone for grinding ceramics |
-
1993
- 1993-03-11 JP JP8904993A patent/JPH06262526A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02172672A (en) * | 1988-12-27 | 1990-07-04 | Hitachi Seiko Ltd | Grindstone for grinding ceramics |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3924969A1 (en) * | 1988-07-30 | 1990-02-01 | Mazda Motor | SAFETY BELT DEVICE FOR VEHICLE WITH TOP OPEN BODY |
| US20120017741A1 (en) * | 2009-04-29 | 2012-01-26 | Nv Bekaert Sa | Sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder |
| US8720429B2 (en) * | 2009-04-29 | 2014-05-13 | Nv Bekaert Sa | Sawing wire with abrasive particles partly embedded in a metal wire and partly held by an organic binder |
| US20130074820A1 (en) * | 2011-09-22 | 2013-03-28 | Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense | Fret Saw Including a Cutting Wire Provided with Fixed Abrasive Grains each Including a Core Coated with a Hard Film |
| US8567385B2 (en) * | 2011-09-22 | 2013-10-29 | Chung-Shan Institute of Science and Technology, Armaments, Bureau, Ministry of National Defense | Fret saw including a cutting wire provided with fixed abrasive grains each including a core coated with a hard film |
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