JPH062603U - 4-terminal power type surface mount resistor - Google Patents
4-terminal power type surface mount resistorInfo
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- JPH062603U JPH062603U JP5338392U JP5338392U JPH062603U JP H062603 U JPH062603 U JP H062603U JP 5338392 U JP5338392 U JP 5338392U JP 5338392 U JP5338392 U JP 5338392U JP H062603 U JPH062603 U JP H062603U
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Abstract
(57)【要約】
【目的】 外部電極を４端子形にして、電流検出も可能
な電力型面実装抵抗器を提供する。
【構成】 少なくとも抵抗体を含む基部と、４端子を有
する外部電極と、電気絶縁性を有する耐熱性及び／又は
放熱性のモールド樹脂体もしくは少なくともケース体と
充填剤とからなる４端子電力型面実装抵抗器。
(57) [Summary] [Objective] To provide a power type surface mount resistor capable of detecting current by making the external electrodes 4-terminal type. A four-terminal power mold surface including a base including at least a resistor, an external electrode having four terminals, a heat-resistant and / or heat-dissipating molding resin body having electrical insulation, or at least a case body and a filler. Mounted resistor.
Description
【０００１】[0001]
本考案は、４端子電力型面実装抵抗器に関する。 The present invention relates to a 4-terminal power type surface mount resistor.
【０００２】[0002]
従来この種の抵抗器は知られておらず、例えば厚膜型または薄膜型のチップ抵 抗器（不図示）が知られているが、それはセラミック基体上の両端近傍に形成し た内部電極と、この内部電極両端を重ね合わせて形成した抵抗被膜と、この抵抗 被膜を被覆した保護膜とからなる基部より構成されている。あるいは低抵抗用（ 不図示）としては、例えば巻線抵抗器、酸化金属被膜抵抗器あるいは金属被膜抵 抗器等の、いずれかの両端に形成した一対の内部電極あるいは金属キャップから なる基部に、半田等を使用して外側へ外部電極を導出するように構成されている 。 Conventionally, this type of resistor has not been known. For example, a thick-film type or thin-film type chip resistor (not shown) is known. It has internal electrodes formed near both ends on a ceramic substrate. The base portion is composed of a resistance film formed by superposing both ends of the internal electrode and a protective film covering the resistance film. Alternatively, for low resistance (not shown), for example, a winding resistor, a metal oxide film resistor, a metal film resistor, or the like, on the base of a pair of internal electrodes or metal caps formed at either end, It is configured to lead the external electrodes to the outside using solder or the like.
【０００３】[0003]
前述のように、従来の電力型面実装抵抗器における外部電極は、いづれも２端 子構造のものしか知られていない。そのため電流検出及び大電流印加が困難とい う問題を有している。 As described above, the external electrodes of the conventional power type surface mount resistors are known to have only a two-terminal structure. Therefore, there is a problem that it is difficult to detect the current and apply a large current.
【０００４】 本考案は、このような点に鑑みなされたもので、抵抗値の精度が良好でバラツ キも減少し、かつ電圧用と電流用の端子として使い分けできるため電流検出が可 能となり、半田付け性も良好であり、更に、電気絶縁性を有する放熱用モールド 樹脂体、又は電気絶縁性を有する耐熱性放熱性の良好な充填剤を少なくとも耐熱 性ケース体内に充填するため、面実装が容易に可能な、４端子の外部電極を有す る４端子電力型面実装抵抗器を提供することを目的とする。The present invention has been made in view of the above point, and has a good resistance value accuracy and a reduced variation, and can be used as a voltage terminal and a current terminal separately, which enables current detection. Solderability is also good.Furthermore, at least the heat-resistant case body is filled with heat-insulating mold resin body that has electrical insulation properties, or heat-resistant heat-dissipating filler material that has electrical insulation properties. It is an object of the present invention to provide a 4-terminal power type surface mount resistor having 4-terminal external electrodes that can be easily performed.
【０００５】[0005]
本考案の４端子電力型面実装抵抗器は、少なくともセラミック基体と厚膜抵抗 体もしくは薄膜抵抗体及び内部電極よりなるＡと、少なくとも略円柱形の碍子と 厚膜抵抗体もしくは薄膜抵抗体及び内部電極よりなるＢと、少なくとも金属抵抗 体よりなるＣと、少なくともソリッド抵抗体と内部電極よりなるＤの、前記Ａ， Ｂ，Ｃ，Ｄのいずれか又はその組み合わせよりなる基部と、 前記Ａ，Ｂ，Ｄのいずれかの基部の前記各内部電極と電気的にそれぞれ接続 した各単体の平面視形状が略コ字形状でかつ縦断面視形状の一部に少なくとも段 差のある略Ｌ字形状を含み、前記単体の背中部が対向して１対を形成する外部電 極Ｅと、前記基部Ｃの前記金属抵抗体と一体兼用であって平面視略Ｈ形状を有す る外部電極Ｆの、前記Ｅ，Ｆのいずれかの４端子よりなる外部電極と、電気絶縁 性を有する放熱性のモールド樹脂体Ｇと、電気絶縁性を有する少なくとも耐熱性 ケース体及び耐熱性放熱性の良好な充填剤の組み合わせＪの、前記Ｇ，Ｊのいず れか、とよりなるものである。 A four-terminal power type surface mount resistor of the present invention comprises an A having at least a ceramic substrate, a thick film resistor or a thin film resistor, and an internal electrode, at least a substantially cylindrical insulator, and a thick film resistor or a thin film resistor and an internal resistor. A base made of any one of A, B, C, D or a combination of B made of an electrode, C made of at least a metal resistor, and D made of at least a solid resistor and an internal electrode, and A, B , D, each of which is electrically connected to each of the internal electrodes at the base, has a substantially U-shape in a plan view and a substantially L-shape having at least a step difference in a part of a longitudinal sectional view. An external electrode E which includes a pair of the back electrodes of the single body facing each other to form a pair, and an external electrode F which is also integrated with the metal resistor of the base C and has a substantially H shape in a plan view, Either E or F above The combination of an external electrode having four terminals, a heat-dissipating mold resin body G having electrical insulation properties, at least a heat-resistant case body having electrical insulation properties, and a filler J having good heat-resistance and heat dissipation properties, It consists of either J or.
【０００６】[0006]
本考案の４端子電力型面実装抵抗器は、外部電極の各単体における平面視形状 が略コ字形状でしかも縦断面形状の一部に少なくとも段差のある略Ｌ字形状を含 み前記単体の背中部が対向して１対を形成するか、もしくは外部電極の形状が平 面視略Ｈ形状であり、前記４端子電力型面実装抵抗器内の少なくとも基部を、電 気絶縁性を有する放熱用モールド樹脂体か、あるいは電気絶縁性を有する少なく とも耐熱性ケース体に耐熱性放熱性の良好な充填剤を充填して硬化し封止するた め、抵抗値精度が良好になり、そのバラツキも減少する。又、例えば電圧用と電 流用端子として使い分けできるため、電流検出も可能となる。更に、放熱用モー ルド樹脂体、又は耐熱性放熱性良好の充填剤を少なくとも耐熱性ケース体内に充 填し硬化させるため、面実装が容易に可能となる。 The four-terminal power type surface mount resistor of the present invention includes a substantially L-shaped external electrode having a substantially U-shaped plan view in plan view and at least a step in a part of the vertical cross-section. The back portions are opposed to each other to form a pair, or the external electrodes are substantially H-shaped in plan view, and at least the base portion of the 4-terminal power type surface mount resistor is electrically insulated and radiated. The mold resin body for use, or at least a heat-resistant case body that has electrical insulation properties, is filled with a heat-resistant and heat-dissipating filler material that is cured and sealed, resulting in good resistance value accuracy and variations. Also decreases. Further, since it can be used as a voltage terminal and a current terminal, for example, current can be detected. Furthermore, since the heat-dissipating mold resin body or the heat-resistant and heat-dissipating filler is filled into at least the heat-resistant case body and cured, surface mounting can be easily performed.
【０００７】[0007]
以下、本考案の４端子電力型面実装抵抗器の一実施例を図面を参照して説明す る。 An embodiment of the 4-terminal power type surface mount resistor of the present invention will be described below with reference to the drawings.
【０００８】[0008]
【第１実施例】 図１ないし図１０は、本考案に係わる第１実施例を説明するための図であり、 図１は、本考案の一実施例を示す４端子電力型面実装抵抗器の基部の平面図、図 ２は図１のＸ−Ｘ線縦断面図、図３は図１の基部の内部電極に半田により外部電 極と接続した状態を示す縦断面図、図４は図３に示される本考案の１対で４端子 を形成する外部電極１対の斜視図、図５は図３の基部とセラミック基体上の内部 電極と接続した側の外部電極の各一端部近傍をモールド樹脂体により封止し硬化 した状態を示す縦断面図、図６は図３の基部とセラミック基体上の内部電極と接 続した側の外部電極の各一端部近傍をケース体及び充填剤により封止し硬化した 状態を示す縦断面図、図７は図５又は図６のモールド樹脂体又はケース体より外 部へ導出した外部電極を折曲加工した状態を示す外観図、図８は図７の平面図、 図９は図７の底面図、図１０は図７をプリント基板上に半田実装した状態を示す 外観部分断面図である。以下、各図を参照して本考案に係わる一実施例を説明す る。First Embodiment FIGS. 1 to 10 are views for explaining a first embodiment according to the present invention. FIG. 1 is a four-terminal power type surface mount resistor showing an embodiment of the present invention. 2 is a plan view of the base of FIG. 1, FIG. 2 is a vertical cross-sectional view taken along line XX of FIG. 1, FIG. 3 is a vertical cross-sectional view showing a state in which internal electrodes of the base of FIG. 1 are connected to external electrodes by soldering, and FIG. FIG. 3 is a perspective view of a pair of external electrodes forming four terminals of the present invention shown in FIG. 3, and FIG. 5 shows the base of FIG. 3 and one end of each of the external electrodes on the side connected to the internal electrodes on the ceramic substrate. FIG. 6 is a vertical cross-sectional view showing a state in which the resin is sealed and cured by a mold resin body. FIG. 6 shows a case body and a filler near the base portion of FIG. 3 and each one end of the external electrode on the side connected to the internal electrode on the ceramic substrate. FIG. 7 is a vertical cross-sectional view showing a state of being sealed and cured, and FIG. 7 is outside the molded resin body or the case body of FIG. 5 or 6. FIG. 8 is a plan view of FIG. 7, FIG. 8 is a bottom view of FIG. 7, and FIG. 10 is a state of FIG. 7 solder-mounted on a printed circuit board. FIG. An embodiment according to the present invention will be described below with reference to the drawings.
【０００９】 １はセラミック基体であって、このセラミック基体１の表面長さ方向の両端位 置近傍に内部電極２，２を形成し、この内部電極２，２間に、例えば抵抗被膜３ の両端が内部電極２，２の各々の一部に接続し重ね合わさるようにして形成し、 この抵抗被膜３上に保護膜４を形成し、必要に応じて不図示の抵抗値修正を行い 、保護膜４ａを形成し、基板分割したものである。（図１、図２） このようにして、基部５が得られる。ここで、基部５は厚膜抵抗体、薄膜抵抗体 、固定抵抗器等のいづれでもよい。Reference numeral 1 denotes a ceramic substrate. Internal electrodes 2 and 2 are formed in the vicinity of both end positions in the surface length direction of the ceramic substrate 1. Between the internal electrodes 2 and 2, for example, both ends of a resistance coating 3 are formed. Are formed so as to be connected to a part of each of the internal electrodes 2 and 2 so as to be overlapped with each other, a protective film 4 is formed on the resistive film 3, and a resistance value (not shown) is corrected if necessary, and the protective film is formed. 4a is formed and the substrate is divided. (FIGS. 1 and 2) In this way, the base 5 is obtained. Here, the base portion 5 may be any one of a thick film resistor, a thin film resistor, a fixed resistor and the like.
【００１０】 ６は導電性結合剤であり、例えば半田である。内部電極２，２の各々と、縦断 面視形状の一部に段差を有し、略Ｌ字形状を含む外部電極７，７の各々の一端が セラミック基体１の長さ方向と略平行となるように対向して、導電性結合剤６， ６により電気的に各々接続される（図３）。この場合、前記外部電極７，７の縦 断面視略Ｌ字形の一端部８，８と内部電極２，２とが電気的に接続するように、 圧着又は溶接しても良い。ここで、外部電極７，７の形状は、図４に示すように 、単体の全体が段差のある略板状でかつ縦断面視略Ｌ字形状を含み、その各単体 の平面視形状は略コ字状で一体であって、両外部電極７，７はセラミック基体１ の長さ方向と略直角方向に平行な中心線に対して略左右対称となり、背中部９， ９が対向して１対となるように、一端部８，８の略裏面及び／又はその近傍と内 部電極２，２とが所定位置に配置され、一端部８，８の裏面及び／又はその近傍 と内部電極とを導電性結合剤６，６により接続する。Reference numeral 6 is a conductive binder, for example, solder. Each of the internal electrodes 2 and 2 has a step in a part of the vertical cross-sectional shape, and one end of each of the external electrodes 7 and 7 including a substantially L-shape is substantially parallel to the length direction of the ceramic substrate 1. Thus, they are electrically connected to each other by the conductive binders 6 and 6 (FIG. 3). In this case, the external electrodes 7, 7 may be crimped or welded so that the end portions 8, 8 of the substantially L-shape in longitudinal cross section are electrically connected to the internal electrodes 2, 2. Here, as shown in FIG. 4, the external electrodes 7 and 7 have a substantially plate-like shape having a step as a whole, and include a substantially L-shape in a vertical cross-section. The external electrodes 7 and 7 are U-shaped and unitary, and the outer electrodes 7 and 7 are substantially symmetrical with respect to a center line parallel to the longitudinal direction of the ceramic base body 1 at a right angle, and the back portions 9 and 9 face each other. The rear surfaces of the one ends 8 and 8 and / or the vicinity thereof and the inner electrodes 2 and 2 are arranged at predetermined positions so as to form a pair, and the rear surfaces of the one end 8 and / or the vicinity thereof and the internal electrodes are arranged. Are connected by conductive binders 6 and 6.
【００１１】 １０はモールド樹脂体であり、例えば電気絶縁性を有し放熱性の良好な液晶ポ リマー樹脂等である。ここでモールド樹脂体１０は電気絶縁性を有し、耐熱性、 放熱性が良好ならば、液晶ポリマー樹脂に限定されない。そして、モールド樹脂 体１０により、基部５と導電性結合剤６，６及び内部電極２，２と導電性結合剤 ６，６により接続した側の外部電極７，７の一部分を封止する（図５）。あるい は、電気絶縁性を有し耐熱性のケース体１１中へ電気絶縁性を有し耐熱性、放熱 性の良好な充填剤１２を充填し硬化する（図６）。そしてモールド樹脂体１０に よる封止又はケース体１１より外部へ導出した部分の外部電極７，７に、更に、 メッキ電極等を形成してもよい。 ここで、ケース体１１は例えばＰＰＳ（ポリフェニレンスルファイド）、エポ キシ又は液晶ポリマー等よりなる。また、充填剤１２は例えばシリコーン樹脂等 であり、ペースト状又は液体状のものをケース体１１の中に流し込むか又は注入 する。必要に応じてフタ体を（不図示）を被せる。そして、温度１００℃ないし ２００℃好ましくは１５０℃で３０分間加熱して、シリコーン樹脂を熱硬化させ る。Reference numeral 10 denotes a mold resin body, which is, for example, a liquid crystal polymer resin having an electric insulating property and a good heat dissipation property. Here, the mold resin body 10 is not limited to the liquid crystal polymer resin as long as it has electric insulation, heat resistance, and heat dissipation. Then, the mold resin body 10 seals a part of the external electrodes 7, 7 on the side connected by the base 5 and the conductive binders 6, 6 and the internal electrodes 2, 2 by the conductive binders 6, 6. 5). Alternatively, the electrically insulating, heat-resistant case body 11 is filled with the electrically insulating, heat-resistant, and heat-dissipating filler 12 and cured (FIG. 6). Then, a plating electrode or the like may be further formed on the external electrodes 7, 7 in the portion sealed by the mold resin body 10 or led out from the case body 11. Here, the case body 11 is made of, for example, PPS (polyphenylene sulfide), epoxy, liquid crystal polymer, or the like. The filler 12 is, for example, a silicone resin or the like, and a paste-like or liquid-like one is poured into or injected into the case body 11. If necessary, the lid body is covered (not shown). Then, the silicone resin is thermally cured by heating at a temperature of 100 ° C. to 200 ° C., preferably 150 ° C. for 30 minutes.
【００１２】 そして、モールド樹脂体１０又はケース体１１と充填剤１２より外部へ導出す る外部電極７，７を側面１３，１３に略沿うように折曲加工する。このようにし て、図７ないし図９に示す４端子電力型面実装抵抗器１４が得られる。 上記実施例では厚膜抵抗体による４端子電力型面実装抵抗器１４について説明 したが、薄膜抵抗体、固定抵抗器等のいづれかよりなる抵抗体又は四角、丸、円 柱等、形状はいずれでもよい。Then, the external electrodes 7, 7 led out to the outside from the mold resin body 10 or the case body 11 and the filler 12 are bent so as to be substantially along the side surfaces 13, 13. In this way, the 4-terminal power type surface mount resistor 14 shown in FIGS. 7 to 9 is obtained. Although the four-terminal power type surface mount resistor 14 using a thick film resistor has been described in the above embodiment, any shape such as a thin film resistor, a fixed resistor or a square resistor, a round resistor, a cylindrical resistor, or the like may be used. Good.
【００１３】 そして、４端子電力型面実装抵抗器１４を、例えばプリント基板１５の導電部 １６上へ面実装する場合は、図１０に示すように、図７ないし図９にて製造され た４端子電力型面実装抵抗器１４の外部電極７，７と導電部１６，１６とを導電 性結合剤６ａ，６ａ（例えば半田等）を使用して接続する。When the four-terminal power type surface mount resistor 14 is surface-mounted on the conductive portion 16 of the printed circuit board 15, for example, as shown in FIG. The external electrodes 7 and 7 of the terminal power type surface mount resistor 14 and the conductive portions 16 and 16 are connected by using conductive binders 6a and 6a (for example, solder).
【００１４】 このように構成することにより、面実装が可能で、例えば電圧だけでなく電流 検出も可能な４端子電力型面実装抵抗器を得ることができる。With this configuration, it is possible to obtain a four-terminal power type surface mount resistor that can be surface mounted and can detect not only voltage but also current.
【００１５】[0015]
【第２実施例】 次に、低抵抗用の金属抵抗体兼用の外部電極に適用した本考案に係わる第２実 施例を図１１ないし図１６を参照して以下に説明する。 図１１は第２実施例であって金属抵抗体兼４端子を有する外部電極１７をモー ルド樹脂体１０ａの外側へ略水平に導出した状態を示す平面透明図、図１２は図 １１のＹ−Ｙ線縦断面図、図１３は図１２の足部１８，１８，１８，１８をモー ルド樹脂体１０ａの側面１３ａ，１３ａ及び底面１９の一部に略沿って折曲加工 した状態を示す４端子電力型面実装抵抗器の平面透明図、図１４は図１３のＺ− Ｚ線縦断面図、図１５はケース体１１ａの中に金属抵抗体１７の略中央部を収納 もしくは挿入し、更にそのケース体１１ａ中に充填剤１２ａを充填し硬化してフ タ体２０を被せた後、足部１８，１８，１８，１８をケース体１１ａの側面１３ ａ，１３ａ及び底面１９の一部に略沿って折曲加工した状態を示す４端子電力型 面実装抵抗器の縦断面図、図１６は図１３、図１４あるいは図１５をプリント基 板１５ａ上に半田実装した状態を示す部分断面図である。Second Embodiment Next, a second embodiment according to the present invention applied to an external electrode also serving as a metal resistor for low resistance will be described below with reference to FIGS. 11 to 16. FIG. 11 is a second embodiment and is a transparent plan view showing a state in which the external electrode 17 having a metal resistor and four terminals is extended substantially horizontally to the outside of the molded resin body 10a, and FIG. FIG. 13 is a vertical cross-sectional view taken along the line Y, showing a state in which the legs 18, 18, 18, 18 of FIG. 12 are bent substantially along the side surfaces 13a, 13a and a part of the bottom surface 19 of the molded resin body 10a. 14 is a plane transparent view of the terminal power type surface mount resistor, FIG. 14 is a vertical cross-sectional view taken along the line ZZ of FIG. 13, and FIG. 15 shows a case body 11a in which a substantially central portion of the metal resistor 17 is housed or inserted. After the case body 11a is filled with the filler 12a and cured to cover the foot body 20, the legs 18, 18, 18, 18 are attached to the side surfaces 13a, 13a and a part of the bottom surface 19 of the case body 11a. A four-terminal power type surface mount resistor showing a state of being bent substantially along Sectional view, FIG. 16 FIG. 13 is a partial sectional view showing a solder mounting state in Fig. 14 or FIG. 15 the printed circuit board 15a.
【００１６】 １７は金属抵抗体であり、この金属抵抗体１７は洋白、銅・ニッケル（Ｃｕ− Ｎｉ）、ニッケル・クロム（Ｎｉ−Ｃｒ）等の低抵抗の金属もしくは合金等より なり、平面視形状は略Ｈ形状で４端子を有する。この金属抵抗体１７の略中央部 を不図示のモールド用金型を使用して、図１１及び図１２のようにモールド樹脂 体１０ａにより、４端子が取り出せるように封止し、硬化もしくは固化する。Reference numeral 17 denotes a metal resistor, which is made of a low resistance metal or alloy such as nickel silver, copper-nickel (Cu-Ni), nickel-chromium (Ni-Cr), and the like. The visual shape is substantially H-shaped and has four terminals. Using a molding die (not shown), the metal resistor body 17 is sealed with a molding resin body 10a as shown in FIGS. 11 and 12 so that four terminals can be taken out, and is cured or solidified. .
【００１７】 このモールド樹脂体１０ａは例えば、放熱性が良好なＰＰＳ（ポリフェニレン スルファイド）、又は液晶ポリマー等である。更に、モールド樹脂体１０ａの外 周側面１３ａ，１３ａ及び底面１９に略沿うようにして、前記不図示モールド成 形により形成された外部電極の足部１８，１８，１８，１８を折曲加工する（図 １３及び図１４）。 尚、必要に応じて、足部１８，１８，１８，１８を折曲加工する前に、略水平 に延びている足部１８，１８，１８，１８の表面にメッキ処理してもよい。ある いは、より放熱効果を増加させるために、放熱性の良好なケース体１１ａの中へ 金属抵抗体１７の一部分である略中央部を収納又は挿入し、シリコーン樹脂等の 耐熱性放熱性が良好で、しかも電気絶縁性を有する充填剤１２ａにてケース体１ １ａ内を充填し硬化してもよい。The mold resin body 10a is, for example, PPS (polyphenylene sulfide) having a good heat dissipation property, liquid crystal polymer, or the like. Further, the foot portions 18, 18, 18, 18 of the external electrode formed by the above-mentioned mold forming are bent so as to be substantially along the outer peripheral side surfaces 13a, 13a and the bottom surface 19 of the molded resin body 10a. (FIGS. 13 and 14). If necessary, the surfaces of the legs 18, 18, 18, 18 extending substantially horizontally may be plated before the legs 18, 18, 18, 18 are bent. Alternatively, in order to further increase the heat radiation effect, the substantially central portion which is a part of the metal resistor 17 is housed or inserted into the case body 11a having a good heat radiation property so that the heat resistance heat radiation property of the silicone resin or the like is improved. The inside of the case body 11a may be filled and cured with a filler 12a that is good and has electric insulation.
【００１８】 あるいは、この充填剤１２ａをケース体１１ａに充填した後、図１５に示すよ うに、フタ体２０を被せてもよい。ここで前記充填剤１２ａは、シリコーン樹脂 に限定されず、同様の特性を有する材料ならば、他の樹脂系でも、あるいは、複 合体化したものであってもよい。このようにして本考案の低抵抗用の４端子電力 型面実装抵抗器１４ａが得られる。Alternatively, as shown in FIG. 15, the lid body 20 may be covered after the case body 11a is filled with the filler 12a. Here, the filler 12a is not limited to the silicone resin, and may be another resin type or a compounded one as long as the material has similar characteristics. In this way, the low resistance 4-terminal power type surface mount resistor 14a of the present invention is obtained.
【００１９】 そして、低抵抗用の４端子電力型面実装抵抗器１４ａを、例えばプリント基板 １５ａの導電部１６ａ上へ面実装する場合には、図１６に示すように、図１３， 図１４あるいは図１５にて製造された４端子電力型面実装抵抗器１４ａの足部１ ８，１８，１８，１８と導電部１６ａ，１６ａ，１６ａ，１６ａとを導電性結合 剤６ｂ，６ｂ，６ｂ，６ｂ（例えば半田等）を使用して接続する。When the low resistance 4-terminal power type surface mount resistor 14a is surface-mounted on the conductive portion 16a of the printed circuit board 15a, as shown in FIG. 16, as shown in FIG. The foot portions 18, 18, 18, 18 and the conductive portions 16a, 16a, 16a, 16a of the four-terminal power type surface mount resistor 14a manufactured in FIG. 15 are connected to the conductive binders 6b, 6b, 6b, 6b. (For example, solder) is used for connection.
【００２０】 このように構成することにより、面実装が可能で、例えば電圧だけでなく電流 検出も可能な低抵抗用の４端子電力型面実装抵抗器を得ることができる。With this configuration, it is possible to obtain a 4-terminal power type surface mount resistor for low resistance which can be surface mounted and can detect not only voltage but also current.
【００２１】[0021]
【考案の効果】 本考案によれば、外部電極の形状が４端子となるように、その各単体の平面視 形状が略コ字形状で縦断面視形状の一部に少なくとも段差のある略Ｌ字形状を含 みしかもその各単体の背中部が対向して１対を形成するか、もしくは平面視略Ｈ 形状にして、本考案の４端子電力型面実装抵抗器内の少なくとも基部を、電気絶 縁性を有する放熱用モールド樹脂体により封止し硬化もしくは固化するか、ある いは少なくとも電気絶縁性を有する耐熱性ケース体に電気絶縁性を有する耐熱性 放熱性の良好な充填剤を充填して硬化もしくは固化して封止するため、抵抗値精 度が良好になり、そのバラツキも減少する。又、例えば電圧用と電流用端子とし て使い分けできるため、電流検出も可能となる。EFFECTS OF THE INVENTION According to the present invention, the shape of each external electrode is approximately U-shaped in plan view, and at least part of the vertical cross-sectional shape has at least a step so that the external electrode has four terminals. At least the base portion of the four-terminal power type surface mount resistor of the present invention is electrically connected to each other by forming a pair with the back portions of the single bodies facing each other to form a pair, or by forming the pair into a substantially H shape in plan view. It is sealed with a heat-dissipating mold resin that has insulation properties and then cured or solidified, or at least a heat-resistant case that has electrical insulation is filled with a heat-resistant filler that has electrical insulation and good heat dissipation. Since it is hardened or solidified and sealed, the resistance value accuracy is improved and the variation is reduced. Further, for example, since it is possible to use the voltage terminal and the current terminal separately, it is possible to detect the current.
【００２２】 更に、通電時又は通電終了直後の熱伝導、熱伝達又は蓄熱等によるセラミック 基板もしくは略円柱形碍子等に形成された厚膜、薄膜の抵抗体、金属板もしくは 金属線の抵抗体、ソリッド抵抗体等のいずれか又はその組み合わせよりなる基部 及び少なくとも前記基部に形成された周辺部等にコゲ又は熱損傷を与えることも なく、それに伴う種々の材質劣化や特性低下を生じることもない。Further, a thick film, a thin film resistor, a metal plate or a metal wire resistor formed on a ceramic substrate or a substantially cylindrical insulator by heat conduction, heat transfer, heat storage, or the like during energization or immediately after energization. It does not cause kogation or heat damage to the base made of any one of the solid resistors or the like or a combination thereof and at least the peripheral part formed on the base, and does not cause various material deterioration and characteristic deterioration accompanying it.
【００２３】 又、セラミック基板あるいは略円柱形碍子や内部電極等の温度が従来のように 上昇しないから、この内部電極と外部電極を接続したり、従来の電力型面実装電 子部品をプリント基板等に実装する場合に使用される低作業性の高温用半田も不 要となり、容易にしかも安価にプリント基板に実装できる。 又、基部とその周辺及び外部電極の表面温度は従来よりもかなり低く抑えるこ とができるから、例えばプリント基板等への面実装密度を向上できる。 更に、組み立てや加工もしやすいため、生産効率が向上できると共に、コスト ダウンにつながり、大量生産に適している。Further, since the temperature of the ceramic substrate, the substantially cylindrical insulator, the internal electrode, etc. does not rise as in the conventional case, the internal electrode and the external electrode are connected to each other, or the conventional power type surface mount electronic component is connected to the printed circuit board. It is not necessary to use high-temperature solder with low workability, which is used when mounting on a printed circuit board, and it can be mounted on a printed circuit board easily and inexpensively. Further, since the surface temperatures of the base portion, the periphery thereof and the external electrodes can be suppressed to be much lower than in the conventional case, the surface mounting density on a printed circuit board or the like can be improved. Furthermore, since it is easy to assemble and process, it can improve the production efficiency, reduce the cost, and are suitable for mass production.
【００２４】 更に、前記抵抗体の内部電極と外部電極は、例えば半田等のような導電性結合 剤により接続するかあるいは圧着もしくは溶接によっても接続可能であるため、 内部電極と外部電極の両者の接続がより簡便に、生産効率がよく、安価になし遂 げられる。Furthermore, since the internal electrode and the external electrode of the resistor can be connected by a conductive binder such as solder, or can be connected by crimping or welding, both the internal electrode and the external electrode can be connected. The connection is simpler, the production efficiency is good, and the cost is low.
【００２５】 又、低抵抗用に実施する場合は、金属抵抗体と外部電極とが一体化しているた め、機械的に強く、信頼性を向上しうる。又、金属抵抗体兼外部電極の４端子を 外側へ導出するように放熱用のモールド樹脂体で封止したため、あるいは耐熱性 、放熱性かつ電気絶縁性を有する充填剤をケース体内に充填して使用しているた め、半田付け性が良好であり、自動面実装が容易に可能になると共に、実装密度 を向上できる。又、製造工程を簡略化でき、自動実装できるため、安価に大量生 産効率を向上しうる。Further, in the case of implementing for low resistance, since the metal resistor and the external electrode are integrated, they are mechanically strong and reliability can be improved. In addition, the four terminals of the metal resistor and the external electrode are sealed with a heat-dissipating mold resin body so as to be led out to the outside, or the case body is filled with a filler having heat resistance, heat dissipation and electric insulation. Since it is used, it has good solderability, facilitates automatic surface mounting, and improves mounting density. In addition, since the manufacturing process can be simplified and automatic mounting can be performed, mass production efficiency can be improved at low cost.
【００２６】 又、金属抵抗体の場合は、わずかな抵抗値の増減も製品の精度に影響するが、 本考案によれば、金属抵抗体と外部電極との接続部が無いため、不要な接触部が 加味されずに、低抵抗値を確保することができる。また、通電時等においては、 接続部の電流集中、又は熱集中がおこらず、発熱又は放熱に関しては均一となる から、製品の熱的劣化や特性低下を招くこともない。更に、モールド樹脂体によ り封止、あるいは共に電気絶縁性を有する耐熱性、放熱性充填剤とケース体とを 組合わせているため、放熱効果が増加する。Further, in the case of a metal resistor, a slight increase or decrease in the resistance value also affects the accuracy of the product, but according to the present invention, since there is no connecting portion between the metal resistor and the external electrode, unnecessary contact is avoided. A low resistance value can be secured without adding parts. In addition, during energization, current concentration or heat concentration does not occur in the connection part, and heat generation or heat dissipation becomes uniform, so that thermal deterioration or characteristic deterioration of the product does not occur. Further, the heat-dissipating effect is increased because the heat-resisting and heat-dissipating filler, which is both electrically insulating and molded with the mold resin body, is combined with the case body.
【図１】本考案の一実施例を示す４端子電力型面実装抵
抗器の基部の平面図である。FIG. 1 is a plan view of a base portion of a 4-terminal power type surface mount resistor according to an embodiment of the present invention.
【図２】同図１のＸ−Ｘ線縦断面図である。FIG. 2 is a vertical sectional view taken along line XX of FIG.
【図３】同図１の基部の内部電極に半田により外部電極
と接続した状態を示す縦断面図である。FIG. 3 is a vertical cross-sectional view showing a state in which an internal electrode of the base portion of FIG. 1 is connected to an external electrode by soldering.
【図４】同図３の１対の外部電極の斜視図である。FIG. 4 is a perspective view of a pair of external electrodes of FIG.
【図５】同図３の基部とセラミック基体上の内部電極と
接続した側の外部電極の各一端部近傍をモールド樹脂体
により封止し硬化した状態を示す縦断面図である。FIG. 5 is a vertical cross-sectional view showing a state in which the base portion of FIG. 3 and each one end portion of the external electrode on the side connected to the internal electrode on the ceramic substrate are sealed with a mold resin body and cured.
【図６】同図３の基部とセラミック基板上の内部電極と
接続した側の外部電極の各一端部近傍をケース体及び充
填剤により封止し硬化した状態を示す縦断面図である。FIG. 6 is a vertical cross-sectional view showing a state in which the base of FIG. 3 and one end of each of the external electrodes on the side connected to the internal electrodes on the ceramic substrate are sealed with a case body and a filler and cured.
【図７】同図５又は同図６のモールド樹脂体又はケース
体より外部へ導出した外部電極を折曲加工した状態を示
す外観図である。FIG. 7 is an external view showing a state where the external electrode led out from the molded resin body or the case body of FIG. 5 or 6 is bent.
【図８】同図７の平面図である。8 is a plan view of FIG.
【図９】同図７の底面図である。FIG. 9 is a bottom view of FIG.
【図１０】同図７をプリント基板上に半田実装した状態
を示す外観部分断面図である。FIG. 10 is a partial external cross-sectional view showing a state where FIG. 7 is solder-mounted on a printed circuit board.
【図１１】本考案の一実施例を示すモールド樹脂体より
外側へ金属抵抗体兼４端子を有する外部電極を略水平に
導出した状態を示す平面透明図である。FIG. 11 is a transparent plan view showing a state in which an external electrode having metal resistors and four terminals is led out substantially horizontally to the outside of a molded resin body according to an embodiment of the present invention.
【図１２】同図１１のＹ−Ｙ線縦断面図である。12 is a vertical cross-sectional view taken along the line YY of FIG.
【図１３】同図１２の足部をモールド樹脂体の側面及び
底面の一部に略沿って折曲加工した状態を示す４端子電
力型面実装抵抗器の平面透明図である。FIG. 13 is a plan transparent view of a four-terminal power type surface mount resistor showing a state in which the foot portion of FIG. 12 is bent along substantially the side surface and part of the bottom surface of the molded resin body.
【図１４】同図１３のＺ−Ｚ線縦断面図である。14 is a vertical cross-sectional view taken along line ZZ of FIG.
【図１５】ケース体の中に金属抵抗体の略中央部を収納
もしくは挿入し、更にそのケース体中に充填剤を充填し
てフタ体を被せた後、足部をケース体の側面及び底面の
一部に略沿って折曲加工した状態を示す４端子電力型面
実装抵抗器の縦断面図である。FIG. 15: The metal resistor is housed or inserted into the case body, and after filling the case body with a filler and covering the lid body, the feet are placed on the side surface and the bottom surface of the case body. FIG. 4 is a vertical cross-sectional view of a 4-terminal power type surface mount resistor showing a state in which it is bent substantially along a part of FIG.
【図１６】図１３，図１４あるいは図１５をプリント基
板上に半田実装した状態を示す部分断面図である。16 is a partial cross-sectional view showing a state where FIG. 13, FIG. 14 or FIG. 15 is solder-mounted on a printed circuit board.
１． セラミック基体 ２． 内部電極 ３． 抵抗皮膜 ４，４ａ 保護膜 ５． 基部 ６，６ａ，６ｂ 導電性結合剤 ７． 外部電極 ８． 一端部 ９． 背中部 １０，１０ａ モールド樹脂体 １１，１１ａ ケース体 １２，１２ａ 充填剤 １３，１３ａ 側面 １４，１４ａ ４端子電力型面実装抵抗器 １５，１５ａ プリント基板 １６，１６ａ 導電部 １７． 金属抵抗体 １８． 足部 １９． 底面 ２０． フタ体 1. Ceramic substrate 2. Internal electrode 3. Resistive film 4, 4a Protective film 5. Base 6,6a, 6b Conductive binder 7. External electrode 8. One end 9. Back part 10,10a Molded resin body 11,11a Case body 12,12a Filler 13,13a Side surface 14,14a 4 terminal power type surface mount resistor 15,15a Printed circuit board 16,16a Conductive part 17. Metal resistor 18. Foot 19. Bottom surface 20. Lid body
Claims (1)
もしくは薄膜抵抗体及び内部電極よりなるＡと、少なく
とも略円柱形の碍子と厚膜抵抗体もしくは薄膜抵抗体及
び内部電極よりなるＢと、少なくとも金属抵抗体よりな
るＣと、少なくともソリッド抵抗体と内部電極よりなる
Ｄの、前記Ａ，Ｂ，Ｃ，Ｄのいずれか又はその組み合わ
せよりなる基部と、 前記Ａ，Ｂ，Ｄのいずれかの基部の前記各内部電極と電
気的にそれぞれ接続した各単体の平面視形状が略コ字形
状でかつ縦断面視形状の一部に少なくとも段差のある略
Ｌ字形状を含み、前記各単体の背中部が対向して１対を
形成する外部電極Ｅと、前記基部Ｃの前記金属抵抗体と
一体兼用であって平面視略Ｈ形状を有する外部電極Ｆ
の、前記Ｅ，Ｆのいずれかの４端子よりなる外部電極
と、電気絶縁性を有し放熱性のモールド樹脂体Ｇと、電
気絶縁性を有する少なくとも耐熱性ケース体及び耐熱性
放熱性の良好な充填剤の組み合わせＪの、前記Ｇ，Ｊの
いずれか、とよりなることを特徴とする４端子電力型面
実装抵抗器。1. A comprising at least a ceramic substrate, a thick film resistor or a thin film resistor and an internal electrode, at least a substantially cylindrical insulator, a B comprising a thick film resistor or a thin film resistor and an internal electrode, and at least a metal. A base made of any one of A, B, C, D or a combination of C made of a resistor and at least a solid resistor and an internal electrode, and a base made of any of A, B, D. The shape of each unit electrically connected to each of the internal electrodes is substantially U-shaped, and includes a substantially L-shape having a step at least in a part of the shape of the longitudinal section, and the back portion of each unit is An external electrode E that forms a pair facing each other, and an external electrode F that also doubles as the metal resistor of the base C and has a substantially H shape in plan view.
Of the external electrode consisting of the four terminals E or F, a mold resin body G having electric insulation and heat dissipation, at least a heat-resistant case body having electric insulation and good heat resistance and heat dissipation. A four-terminal power type surface mount resistor comprising any one of G and J of the combination J of various fillers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992053383U JP2572747Y2 (en) | 1992-06-19 | 1992-06-19 | 4 terminal power type surface mount resistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1992053383U JP2572747Y2 (en) | 1992-06-19 | 1992-06-19 | 4 terminal power type surface mount resistor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH062603U true JPH062603U (en) | 1994-01-14 |
| JP2572747Y2 JP2572747Y2 (en) | 1998-05-25 |
Family
ID=12941303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1992053383U Expired - Fee Related JP2572747Y2 (en) | 1992-06-19 | 1992-06-19 | 4 terminal power type surface mount resistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2572747Y2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000133501A (en) * | 1998-10-23 | 2000-05-12 | Matsushita Electric Ind Co Ltd | Resistor |
| JP2002050501A (en) * | 2000-08-01 | 2002-02-15 | K-Tech Devices Corp | Mounting body and using method thereof |
| JP2012004538A (en) * | 2010-05-18 | 2012-01-05 | Rohm Co Ltd | Surface mounting type resistor and surface mounting substrate mounted with the same |
| WO2012132470A1 (en) * | 2011-03-31 | 2012-10-04 | 古河電気工業株式会社 | Connecting terminal of shunt resistor, and battery state detecting apparatus |
-
1992
- 1992-06-19 JP JP1992053383U patent/JP2572747Y2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000133501A (en) * | 1998-10-23 | 2000-05-12 | Matsushita Electric Ind Co Ltd | Resistor |
| JP2002050501A (en) * | 2000-08-01 | 2002-02-15 | K-Tech Devices Corp | Mounting body and using method thereof |
| JP2012004538A (en) * | 2010-05-18 | 2012-01-05 | Rohm Co Ltd | Surface mounting type resistor and surface mounting substrate mounted with the same |
| WO2012132470A1 (en) * | 2011-03-31 | 2012-10-04 | 古河電気工業株式会社 | Connecting terminal of shunt resistor, and battery state detecting apparatus |
| JP2012215452A (en) * | 2011-03-31 | 2012-11-08 | Furukawa Electric Co Ltd:The | Connection terminal of shunt resistor, and battery state detection device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2572747Y2 (en) | 1998-05-25 |
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