JPH06244049A - Method for lead wire connection - Google Patents
Method for lead wire connectionInfo
- Publication number
- JPH06244049A JPH06244049A JP5352853A JP35285393A JPH06244049A JP H06244049 A JPH06244049 A JP H06244049A JP 5352853 A JP5352853 A JP 5352853A JP 35285393 A JP35285393 A JP 35285393A JP H06244049 A JPH06244049 A JP H06244049A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- lead wire
- connecting piece
- lead wires
- piece
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は電子部品（素子）の電
極にリード線を接続するためのリード線の接続方法に関
するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead wire connecting method for connecting a lead wire to an electrode of an electronic component (element).
【０００２】[0002]
【従来の技術と発明が解決しようとする課題】電子部品
には、例えば磁器コンデンサ、バリスタまたはサーミス
タ等のような単機能の素子や、これら単機能の素子を複
数個接続して複合化させた複合電子部品などがある。2. Description of the Related Art For electronic parts, a single-function element such as a ceramic capacitor, a varistor or a thermistor, or a plurality of these single-function elements are connected to form a composite. There are composite electronic parts.
【０００３】図８は従来の磁器コンデンサの一例の斜視
図、図９は図８のＢ−Ｂ矢視断面図、図１０は図８の磁
器コンデンサに接続されたリード線の平面図である。こ
の磁器コンデンサは、これらの図に示すように、やや扁
平な円柱状の素体１０と、素体１０の両端面に形成され
た一対の電極１１，１１と、この一対の電極１１，１１
にハンダ１６で各々接続された一対のリード線１２，１
２とからなる。FIG. 8 is a perspective view of an example of a conventional ceramic capacitor, FIG. 9 is a sectional view taken along the line BB of FIG. 8, and FIG. 10 is a plan view of lead wires connected to the ceramic capacitor of FIG. As shown in these figures, this porcelain capacitor includes a slightly flat cylindrical element body 10, a pair of electrodes 11 and 11 formed on both end surfaces of the element body 10, and the pair of electrodes 11 and 11, respectively.
A pair of lead wires 12 and 1 connected to each other by solder 16
It consists of 2.
【０００４】リード線１２は部分Ｐ1 で鈍角に屈曲し、
部分Ｐ1 を境界にして、一方の側（図９では右側）がリ
ード側部１３、他方の側（同図では左側）がリードアッ
プ部１５及び接続部１４となっている。リードアップ部
１５は、同図に示すように、接続部１４との境界になる
部分Ｐ2 で電極１１から離れる方向に少し立ち上がって
いる。接続部１４及びリードアップ部１５の一部は電極
１１にハンダ１６で接続されている。The lead wire 12 bends at an obtuse angle at the portion P 1 ,
With the portion P 1 as a boundary, one side (right side in FIG. 9) is the lead side portion 13, and the other side (left side in FIG. 9) is the lead-up portion 15 and the connecting portion 14. As shown in the figure, the lead-up portion 15 is slightly raised in a direction away from the electrode 11 at a portion P 2 which is a boundary with the connection portion 14. Part of the connection portion 14 and the lead-up portion 15 is connected to the electrode 11 by solder 16.
【０００５】素体１０の電極１１へのリード線１２の接
続は、一対のリード線１２，１２を持ち、接続部１４，
１４の間に素体１０を入れ、素体１０を接続部１４が電
極１１，１１に接触するようにして接続部１４で挟持さ
せ、この状態で電極１１にリード線１２の接続部１４を
ハンダ付けすることにより行なわれる。The lead wire 12 is connected to the electrode 11 of the element body 10 by having a pair of lead wires 12, 12.
The element body 10 is inserted between 14 and the element body 10 is sandwiched by the connection portions 14 so that the connection portions 14 contact the electrodes 11 and 11. In this state, the connection portions 14 of the lead wires 12 are soldered to the electrodes 11. It is done by attaching.
【０００６】しかし、この方法は、ハンダ付けの際に、
素体１０がリード線１２，１２の接続部１４，１４に点
接触ないし線接触という不安定な状態で支持されてお
り、素体１０がリード線１２，１２の接続部１４，１４
からずれ易いので、ハンダ付け作業が極めて面倒で、素
子ズレ（リード線１２が電極１１の所定位置に正しい状
態で接続されないこと）を生じ易いという問題点があっ
た。However, this method is not suitable for soldering.
The element body 10 is supported by the connecting portions 14, 14 of the lead wires 12, 12 in an unstable state of point contact or line contact, and the element body 10 is connected by the connecting portions 14, 14 of the lead wires 12, 12.
Since there is a tendency to dislocate, the soldering work is extremely troublesome, and there is a problem that element shift (the lead wire 12 is not properly connected to a predetermined position of the electrode 11) occurs.
【０００７】第１１図は複合化させた電子部品の斜視図
である。この電子部品は、素子１０の一の電極１１に２
個の素子１７，１７がリード線１８，１８を介して各々
ハンダ付けされている。しかし、素子１０の電極１１は
小さく、リード線１８も小さくて細いので、一の電極１
１に２以上の素子１７をリード線１８を介して各々ハン
ダ付けするのは極めて困難であった。FIG. 11 is a perspective view of a composite electronic component. This electronic component has two electrodes on one electrode 11 of the element 10.
The individual elements 17 and 17 are soldered via lead wires 18 and 18, respectively. However, the electrode 11 of the element 10 is small, and the lead wire 18 is also small and thin.
It was extremely difficult to solder two or more elements 17 to one via the lead wires 18.
【０００８】この発明は、これらの問題点を解決するた
めになされたもので、素子ズレをなくし、また、素子の
一の電極に２以上のリード線を同時にハンダ付けさせる
ことができるようなリード線の接続方法を提供すること
を目的とするものである。The present invention has been made in order to solve these problems, and it is possible to eliminate element displacement and to allow two or more lead wires to be simultaneously soldered to one electrode of the element. The purpose is to provide a method for connecting lines.
【０００９】[0009]
【課題を解決するための手段】この発明に係るリード線
の接続方法は、平坦な挟持面を有する金属製の接続片を
各々取り付けた一対のリード線を持ち、一対の電極を背
中合わせに有する素子を間に置いて該各接続片の挟持面
を対向させ、該素子の電極に該各接続片の挟持面を接触
させた状態で該素子を該接続片に挟持させ、該接続片及
び該素子をハンダが溶融する温度に加熱する方法であっ
て、該接続片の挟持面及び／又は該電極にはハンダ層が
形成されているものである。SUMMARY OF THE INVENTION A lead wire connecting method according to the present invention is an element having a pair of lead wires to which metal connecting pieces each having a flat holding surface are attached, and a pair of electrodes being back to back. With the sandwiching surface of each connecting piece facing each other with the sandwiching surface of each connecting piece in contact with the sandwiching surface of each connecting piece to the electrode of the element, and the connecting piece and the element. Is heated to a temperature at which the solder melts, and a solder layer is formed on the sandwiching surface of the connection piece and / or the electrode.
【００１０】ここで、前記接続片の挟持面及び／又は前
記電極には粘性を有するフラックスが塗布されているの
が好ましい。また、前記リード線には他の素子が予め接
続されていてもよい。また、前記接続片には複数本のリ
ード線が接続されていてもよい。更に、前記接続片に挟
持される前記素子の電極は平坦になっているのが好まし
い。Here, it is preferable that a viscous flux is applied to the holding surface of the connection piece and / or the electrode. Further, another element may be connected in advance to the lead wire. Moreover, a plurality of lead wires may be connected to the connection piece. Furthermore, it is preferable that the electrodes of the element sandwiched between the connection pieces are flat.
【００１１】[0011]
【作用】請求項１記載の発明は、平坦な挟持面を有する
金属製の接続片を介してリード線を接続するので、素子
に接続片をハンダ付けする際に、素子と接続片が面接触
し、素子が接続片の挟持面で安定した状態で挟持され
る。According to the first aspect of the present invention, the lead wire is connected through the metal connecting piece having the flat holding surface. Therefore, when the connecting piece is soldered to the element, the element and the connecting piece are in surface contact with each other. Then, the element is clamped in a stable state by the clamping surface of the connecting piece.
【００１２】請求項２記載の発明は、前記接続片の挟持
面及び／又は前記電極には粘性を有するフラックスが塗
布されているので、素子が接続片に挟持される場合、素
子と接続片の挟持面とが粘着し、素子が接続片の挟持面
の間で更に安定した状態で挟持される。According to a second aspect of the present invention, since a flux having viscosity is applied to the sandwiching surface of the connection piece and / or the electrode, when the element is sandwiched by the connection piece, the element and the connection piece are separated from each other. The holding surface adheres to the holding surface, and the element is held between the holding surfaces of the connecting pieces in a more stable state.
【００１３】請求項３記載の発明は、前記リード線には
他の素子が予め接続されているので、素子の電極に接続
片が接続されれば他の素子も同時に接続される。According to the third aspect of the present invention, the other element is connected to the lead wire in advance. Therefore, if the connecting piece is connected to the electrode of the element, the other element is simultaneously connected.
【００１４】請求項４記載の発明は、他の素子が各々接
続された複数のリード線が一の接続片に予め接続されて
いるので、この一の接続片を一の電極に接続すれば、複
数の他の素子を一の素子の一の電極に一度に接続したこ
とになる。In a fourth aspect of the present invention, a plurality of lead wires to which other elements are respectively connected are previously connected to one connecting piece. Therefore, if this one connecting piece is connected to one electrode, A plurality of other elements are connected to one electrode of one element at a time.
【００１５】請求項５記載の発明は、前記接続片に挟持
される前記素子の電極が平坦になっているので、素子が
接続片によって更に確実に挟持される。According to the fifth aspect of the present invention, since the electrodes of the element sandwiched by the connection pieces are flat, the elements are more reliably sandwiched by the connection pieces.
【００１６】[0016]
【実施例】図１はこの発明の一実施例を示す工程図、図
２は図１の（Ｄ）に示すものの拡大図、図３は図２のＡ
−Ａ矢視断面図である。以下、これらの図を参照しなが
らこの実施例について説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a process drawing showing an embodiment of the present invention, FIG. 2 is an enlarged view of what is shown in FIG. 1D, and FIG.
FIG. 7 is a cross-sectional view taken along arrow A. Hereinafter, this embodiment will be described with reference to these drawings.
【００１７】まず、図１の（Ａ）に示すように、チタン
酸バリウムを主成分とする粉末原料をプレスにて扁平な
円柱状に成形し、これを焼成炉において所定温度で焼成
し、素体１０を得る。First, as shown in FIG. 1A, a powder raw material containing barium titanate as a main component is formed into a flat columnar shape by a press, and this is fired at a predetermined temperature in a firing furnace, Get body 10.
【００１８】次に、同図（Ｂ）に示すように、素体１０
の両端面（同図では上下面）に銀ペーストを印刷し、８
５０℃で焼き付け、銀を主成分とする金属膜からなる電
極１１，１１を形成する。Next, as shown in FIG.
Print silver paste on both end surfaces (upper and lower surfaces in the figure) of
By baking at 50 ° C., the electrodes 11, 11 made of a metal film containing silver as a main component are formed.
【００１９】ここで、銀ペーストは、酸化銀の粉末に硼
珪酸鉛ガラスの粉末（５〜１０％）を混合し、溶剤等で
溶解したものを使用することができる。Here, as the silver paste, one prepared by mixing lead oxide borosilicate glass powder (5 to 10%) with silver oxide powder and dissolving with a solvent or the like can be used.
【００２０】次に、両端部に筒状部２１を形成した接続
片１９を製造し、同図（Ｃ）に示すように、接続片１９
の筒状部２１内にリード線１２の先端部を挿入し、筒状
部２１を外側からカシメ、接続片１９にリード線１２を
固着させる。Next, a connecting piece 19 having tubular portions 21 formed at both ends is manufactured, and as shown in FIG.
The distal end portion of the lead wire 12 is inserted into the tubular portion 21, and the tubular portion 21 is caulked from the outside, and the lead wire 12 is fixed to the connecting piece 19.
【００２１】次に、この接続片１９及びリード線１２の
一部をハンダ中に浸漬し、これらをハンダで被覆する。
そして、接続片１９の板状部２０の裏面に松脂を塗布
し、接続片１９を板状部２０の裏面相互で対向させる。Next, the connecting piece 19 and a part of the lead wire 12 are immersed in solder to coat them with solder.
Then, pine resin is applied to the back surface of the plate-shaped portion 20 of the connection piece 19 so that the connection pieces 19 face each other on the back surface of the plate-shaped portion 20.
【００２２】次に、同図（Ｄ）に示すように、接続片１
９の間に素体１０を挟持させ、この状態でこれらを加熱
炉中に入れ、接続片１９の板状部２０の裏面に被覆され
ていたハンダによって、電極１１に接続片１９を接続さ
せる。しかして、図２及び図３に示すような構造の磁器
コンデンサの半製品が形成される。Next, as shown in FIG.
The element body 10 is sandwiched between 9 and is put in a heating furnace in this state, and the connection piece 19 is connected to the electrode 11 by the solder coated on the back surface of the plate-shaped portion 20 of the connection piece 19. As a result, a semi-finished product of the porcelain capacitor having the structure shown in FIGS. 2 and 3 is formed.
【００２３】次に、リード線１２のリード側部１３を残
して、これらをエポキシ系の合成樹脂浴中に浸漬し、図
１（Ｅ）に示すように、合成樹脂２０で被覆した磁器コ
ンデンサの完成品を得る。Next, leaving the lead side portions 13 of the lead wires 12 and immersing them in an epoxy-based synthetic resin bath, as shown in FIG. Get the finished product.
【００２４】第２実施例 図４はこの発明の第２実施例を示す工程図、図５は図４
の（Ｄ）に示すものの拡大図である。この工程の基本的
部分は前述した第１実施例におけると同様である。ただ
し、接続片１９の筒状部２１に挿入されるリード線が他
の素子１７のリード線１８である点、及び１個の接続片
１９に挿入されているリード線１８が２本になっている
点で相違している。Second Embodiment FIG. 4 is a process diagram showing a second embodiment of the present invention, and FIG.
It is an enlarged view of what is shown to (D) of. The basic part of this process is the same as in the first embodiment described above. However, the lead wire inserted into the tubular portion 21 of the connection piece 19 is the lead wire 18 of the other element 17, and the number of the lead wire 18 inserted into one connection piece 19 is two. It is different in that there is.
【００２５】ところで、上記第２実施例では、１個の接
続片１９に他の素子１７を２個同時に接続した場合につ
いて説明したが、これに限定されるものではなく、例え
ば、図６に示すように、１個の接続片１９に他の素子１
７を４個同時に接続してもよいし、これ以上接続しても
よい。In the second embodiment described above, the case where two other elements 17 are simultaneously connected to one connecting piece 19 has been described, but the present invention is not limited to this and, for example, shown in FIG. As shown in FIG.
Four 7 may be connected at the same time, or more may be connected.
【００２６】なお、この発明で使用する接続片１９とし
ては、上記実施例で説明した形状のものに限定されるも
のではなく、例えば、図７（Ａ）に示ように、長方形の
板状部２０の中央にパイプ状の筒状部２１を形成したも
の、また、図７（Ｂ）に示すように、かまぼこ状の金属
部材２３に貫通穴２４を形成し、この貫通穴２４にリー
ド線１２を嵌合させるようにしたもの、また、図７
（Ｃ）に示すように、角柱状の金属部材２５に貫通穴２
６を形成し、この貫通穴２６にリード線１２を嵌合させ
るようにしたものでもよい。The connecting piece 19 used in the present invention is not limited to the shape described in the above embodiment, and for example, as shown in FIG. 7 (A), a rectangular plate-like portion. A pipe-shaped tubular portion 21 is formed in the center of 20. Further, as shown in FIG. 7B, a through hole 24 is formed in a semicylindrical metal member 23, and the lead wire 12 is formed in the through hole 24. Which are fitted together, and also in FIG.
As shown in (C), the through hole 2 is formed in the prismatic metal member 25.
6 may be formed and the lead wire 12 may be fitted into the through hole 26.
【００２７】なお、上記説明では、この発明を磁器コン
デンサに適用する場合についてのみ説明したが、この発
明は磁器コンデンサ以外の電子部品全般についても適用
できることはいうまでもない。In the above description, only the case where the present invention is applied to a porcelain capacitor has been described, but it goes without saying that the present invention can be applied to all electronic parts other than the porcelain capacitor.
【００２８】[0028]
【発明の効果】請求項１記載の発明は、素子に接続片を
ハンダ付けする際に、素子を接続片の挟持面で支持して
いるので、素子と接続片が面接触し、素子が接続片の挟
持面で安定した状態で挟持され、従って、素子ズレが発
生し難いという効果がある。According to the invention of claim 1, when the connecting piece is soldered to the element, the element is supported by the holding surface of the connecting piece, so that the element and the connecting piece are in surface contact, and the element is connected. It is held in a stable state by the holding surface of one piece, so that there is an effect that element displacement is unlikely to occur.
【００２９】しかも、請求項１記載の発明は、素子に接
続片をハンダ付けする際に、素子が接続片の間で安定し
た状態で保持されるので、接続片がズレることをあまり
気にしなくてすみ、従って、ハンダ付け作業が容易にな
るという効果がある。In addition, in the invention described in claim 1, when the connecting piece is soldered to the element, the element is held in a stable state between the connecting pieces, so that the connecting piece is not so much deviated. This has the effect of facilitating soldering work.
【００３０】また、請求項２記載の発明は、素子が接続
片に挟持される場合、素子の電極と接続片の挟持面とが
粘着し、素子が接続片の挟持面の間で更に安定した状態
で保持されるので、素子ズレの発生が更に抑制され、ハ
ンダ付け作業が更に容易になるという効果がある。According to the second aspect of the invention, when the element is sandwiched between the connecting pieces, the electrodes of the element and the sandwiching surface of the connecting piece adhere to each other, and the element is further stabilized between the sandwiching surfaces of the connecting piece. Since it is held in this state, the occurrence of element displacement is further suppressed, and the soldering work is further facilitated.
【００３１】また、請求項３記載の発明は、他の素子が
予め接続されたリード線が接続片に予め接続されている
ので、一の素子の電極に他の素子を容易に接続させるこ
とができるという効果がある。According to the third aspect of the invention, since the lead wire to which the other element is connected in advance is connected to the connecting piece in advance, the electrode of the one element can be easily connected to the other element. The effect is that you can do it.
【００３２】また、請求項４記載の発明は、他の素子が
各々接続された複数のリード線が一の接続片に予め接続
されているので、この一の接続片を一の素子に一の電極
に接続すれば、複数の素子を一の素子の一の電極に容易
且つ確実に接続することができるという効果がある。In the invention according to claim 4, a plurality of lead wires, to which other elements are respectively connected, are connected in advance to one connecting piece. Therefore, one connecting piece is connected to one element. When connected to the electrodes, there is an effect that a plurality of elements can be easily and surely connected to one electrode of one element.
【００３３】更に、請求項５記載の発明は、素子の電極
が平坦になっているので、素子が接続片によって確実に
挟持され、素子ズレの発生が更に抑制され、ハンダ付け
作業が更に容易になるという効果がある。Further, in the invention according to claim 5, since the electrodes of the element are flat, the element is securely sandwiched by the connecting pieces, the occurrence of element deviation is further suppressed, and the soldering work is further facilitated. There is an effect that.
【図１】図１はこの発明の第１実施例を示す工程図であ
る。FIG. 1 is a process drawing showing a first embodiment of the present invention.
【図２】図２は図１の（Ｄ）に示すものの拡大図であ
る。FIG. 2 is an enlarged view of what is shown in FIG. 1 (D).
【図３】図３は図２のＡ−Ａ矢視断面図である。3 is a cross-sectional view taken along the line AA of FIG.
【図４】図４はこの発明の第２実施例を示す工程図であ
る。FIG. 4 is a process drawing showing a second embodiment of the present invention.
【図５】図５は図４の（Ｄ）に示すものの拡大図であ
る。5 is an enlarged view of what is shown in FIG. 4 (D).
【図６】図６はこの発明の他の実施例によって得られた
電子部品の斜視図である。FIG. 6 is a perspective view of an electronic component obtained according to another embodiment of the present invention.
【図７】図７はこの発明で使用する接続片の他の例を示
す斜視図である。FIG. 7 is a perspective view showing another example of the connecting piece used in the present invention.
【図８】図８は従来の磁器コンデンサの斜視図である。FIG. 8 is a perspective view of a conventional porcelain capacitor.
【図９】図９は図８のＢ−Ｂ矢視断面図である。9 is a sectional view taken along the line BB of FIG.
【図１０】図１０は図８の磁器コンデンサに接続された
リード線の平面図である。10 is a plan view of a lead wire connected to the porcelain capacitor of FIG. 8. FIG.
【図１１】図１１は複合化した電子部品の従来例を示す
斜視図である。FIG. 11 is a perspective view showing a conventional example of a composite electronic component.
１０ 素体 １１ 電極 １２ リード線 １７ 他の素子 １８ リード線 １９ 接続片 ２０ 板状部 ２１ 筒状部 DESCRIPTION OF SYMBOLS 10 Element 11 Electrode 12 Lead wire 17 Other element 18 Lead wire 19 Connection piece 20 Plate part 21 Cylindrical part
Claims (5)
各々取り付けた一対のリード線を持ち、一対の電極を背
中合わせに有する素子を間に置いて該各接続片の挟持面
を対向させ、該素子の電極に該各接続片の挟持面を接触
させた状態で該素子を該接続片に挟持させ、該接続片及
び該素子をハンダが溶融する温度に加熱する方法であっ
て、該接続片の挟持面及び／又は該電極にはハンダ層が
形成されていることを特徴とするリード線の接続方法。1. A pair of lead wires to which metal connecting pieces each having a flat holding surface are attached, and an element having a pair of electrodes back-to-back is placed between them so that the holding surface of each connecting piece faces each other. A method of sandwiching the element with the connecting piece with the sandwiching surface of each connecting piece in contact with the electrode of the element, and heating the connecting piece and the element to a temperature at which the solder melts, A method for connecting lead wires, wherein a solder layer is formed on the sandwiching surface of the connection piece and / or the electrode.
には粘性を有するフラックスが塗布されていることを特
徴とする請求項１記載のリード線の接続方法。2. The lead wire connecting method according to claim 1, wherein a flux having a viscosity is applied to the holding surface of the connection piece and / or the electrode.
れていることを特徴とする請求項１又は２記載のリード
線の接続方法。3. The lead wire connecting method according to claim 1, wherein another element is previously connected to the lead wire.
接続されていることを特徴とする請求項３記載のリード
線の接続方法。4. The method of connecting lead wires according to claim 3, wherein a plurality of lead wires are connected to one connection piece.
が平坦になっていることを特徴とする請求項１〜４記載
のリード線の接続方法。5. The lead wire connecting method according to claim 1, wherein the electrodes of the element sandwiched between the connection pieces are flat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5352853A JPH06244049A (en) | 1989-11-02 | 1993-12-28 | Method for lead wire connection |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12859189 | 1989-11-02 | ||
| JP1-128591 | 1989-11-02 | ||
| JP5352853A JPH06244049A (en) | 1989-11-02 | 1993-12-28 | Method for lead wire connection |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06244049A true JPH06244049A (en) | 1994-09-02 |
Family
ID=26464198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5352853A Pending JPH06244049A (en) | 1989-11-02 | 1993-12-28 | Method for lead wire connection |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06244049A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5646793A (en) * | 1979-09-20 | 1981-04-28 | Parker Pen Co | Ball pen |
| JPS5976413A (en) * | 1982-10-22 | 1984-05-01 | 富士通株式会社 | Method of producing terminal piece for electronic part |
| JPS6139513A (en) * | 1984-07-30 | 1986-02-25 | 株式会社村田製作所 | Method of mounting lead terminal in electronic component |
| JPS6474715A (en) * | 1987-09-16 | 1989-03-20 | Marcon Electronics Co | Manufacture of electron component |
| JPH0236521A (en) * | 1988-07-26 | 1990-02-06 | Tokin Corp | Method of soldering electronic component lead wire |
-
1993
- 1993-12-28 JP JP5352853A patent/JPH06244049A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5646793A (en) * | 1979-09-20 | 1981-04-28 | Parker Pen Co | Ball pen |
| JPS5976413A (en) * | 1982-10-22 | 1984-05-01 | 富士通株式会社 | Method of producing terminal piece for electronic part |
| JPS6139513A (en) * | 1984-07-30 | 1986-02-25 | 株式会社村田製作所 | Method of mounting lead terminal in electronic component |
| JPS6474715A (en) * | 1987-09-16 | 1989-03-20 | Marcon Electronics Co | Manufacture of electron component |
| JPH0236521A (en) * | 1988-07-26 | 1990-02-06 | Tokin Corp | Method of soldering electronic component lead wire |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19960206 |