JPH06226086A - Plasma treating device - Google Patents
Plasma treating deviceInfo
- Publication number
- JPH06226086A JPH06226086A JP5034395A JP3439593A JPH06226086A JP H06226086 A JPH06226086 A JP H06226086A JP 5034395 A JP5034395 A JP 5034395A JP 3439593 A JP3439593 A JP 3439593A JP H06226086 A JPH06226086 A JP H06226086A
- Authority
- JP
- Japan
- Prior art keywords
- plasma
- vacuum chamber
- treated
- electrodes
- processed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C59/00—Surface shaping of articles, e.g. embossing; Apparatus therefor
- B29C59/14—Surface shaping of articles, e.g. embossing; Apparatus therefor by plasma treatment
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
- Plasma Technology (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は金属製品あるいはプラス
チックやガラス等の非金属製品等の被処理物の表面をプ
ラズマ処理する為に用いられるプラズマ処理装置に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a plasma processing apparatus used for plasma processing a surface of an object to be processed such as a metal product or a non-metal product such as plastic or glass.
【０００２】[0002]
【従来の技術】真空チャンバー内に被処理物を存置さ
せ、一方真空チャンバー外のプラズマ発生装置でプラズ
マを発生させ、そのプラズマ発生装置からプラズマガス
を導入管を通して真空チャンバーに導き、そのプラズマ
ガスを真空チャンバー内の一方の側に設けた噴出口から
噴出させると共に真空チャンバー内の他方の側からは排
気を行なって真空チャンバー内にプラズマガスを流通さ
せ、その流通するプラズマガスを被処理物の表面に触れ
させてそこのプラズマ処理を行なうようにしている（例
えば特開昭６２−１５２３３号公報参照）。このような
技術によれば、被処理物の表面を上記プラズマガスによ
り良好にプラズマ処理できる特長がある。2. Description of the Related Art An object to be processed is kept in a vacuum chamber, while plasma is generated by a plasma generator outside the vacuum chamber, and a plasma gas is introduced from the plasma generator through an introduction pipe into the vacuum chamber, and the plasma gas is discharged. The plasma gas is ejected from the ejection port provided on one side of the vacuum chamber and exhausted from the other side of the vacuum chamber to circulate the plasma gas in the vacuum chamber. The plasma treatment is performed by touching (see, for example, Japanese Patent Laid-Open No. 62-15233). According to such a technique, there is a feature that the surface of the object to be treated can be favorably plasma-treated with the plasma gas.
【０００３】[0003]
【発明が解決しようとする課題】しかしこの従来の技術
では、流通するプラズマガスを被処理物の表面に触れさ
せるものである為、被処理物の表面の種々の部分におい
ては上記プラズマガス流の当りの良い所とそうでない所
ができ、処理むらを生ずる問題点があった。また上記プ
ラズマガスは真空チャンバー外で生成されたものを導入
管を通して送ってきたものである為、紫外線、イオン化
したガス、電子等の成分は送られてくる途中で著しく減
少してしまい、ラジカルなガスを主成分とするものにな
ってしまう。このようなプラズマガスによるプラズマ処
理後の被処理物の表面の性質は、後加工例えば塗装を行
なった場合に塗膜が剥がれ易くなる等、処理品表面の化
学的性質において劣ったものとなる問題点があった。However, in this conventional technique, since the flowing plasma gas is brought into contact with the surface of the object to be processed, the plasma gas flow of the above-mentioned plasma gas flows on various parts of the surface of the object to be processed. There was a problem that unevenness in processing occurred because there were places that were good and places that were not. In addition, since the plasma gas is one generated outside the vacuum chamber and sent through the introduction tube, components such as ultraviolet rays, ionized gas, and electrons are significantly reduced on the way of being sent, and radicals are not generated. It will be gas-based. Such a property of the surface of the object to be processed after the plasma treatment with the plasma gas is a problem that the chemical property of the surface of the treated product becomes inferior such that the coating film is easily peeled off after post-processing such as coating. There was a point.
【０００４】本願発明は上記従来技術の問題点（技術的
課題）を解決する為になされたもので、被処理物の全体
を均質に精密処理できると共に、処理された被処理物の
表面の化学的性質も向上させ得るようにしたプラズマ処
理装置を提供することを目的としている。The present invention has been made in order to solve the above-mentioned problems (technical problems) of the prior art. The object to be processed can be uniformly and precisely processed as a whole, and the surface chemistry of the processed object is treated. It is an object of the present invention to provide a plasma processing apparatus capable of improving the physical properties.
【０００５】[0005]
【課題を解決するための手段】上記目的を達成する為
に、本願発明におけるプラズマ処理装置は、真空チャン
バーには該真空チャンバー内にプラズマ雰囲気用のガス
を供給するためのガス供給手段を付設し、上記真空チャ
ンバー内には被処理物の存置用空間と、上記存置用空間
をプラズマ雰囲気にする為の少なくとも二つの電極を備
えさせ、上記二つの電極は、異なる電源装置に個別に接
続して相互にプラズマ発生量の制御を可能にしたもので
ある。In order to achieve the above object, in the plasma processing apparatus of the present invention, a gas supply means for supplying a gas for plasma atmosphere to the vacuum chamber is attached to the vacuum chamber. , The vacuum chamber is provided with a space for storing an object to be processed and at least two electrodes for making the storage space into a plasma atmosphere, and the two electrodes are individually connected to different power supply devices. It is possible to mutually control the plasma generation amount.
【０００６】[0006]
【作用】真空チャンバー内の空間に被処理物を存置さ
せ、二つの電極によってプラズマを発生させると、真空
チャンバー内はプラズマ雰囲気となる。二つの電源の出
力を調整すると二つの電極近傍におけるプラズマ発生量
を相互に変化させることができる。When the object to be treated is placed in the space inside the vacuum chamber and plasma is generated by the two electrodes, the inside of the vacuum chamber becomes a plasma atmosphere. By adjusting the outputs of the two power supplies, it is possible to mutually change the plasma generation amount in the vicinity of the two electrodes.
【０００７】[0007]
【実施例】以下本願の実施例を示す図面について説明す
る。図１に示されるプラズマ処理装置Ａにおいて、１は
真空チャンバーを示し、例えばステンレス製であり、図
示はしないが一部には被処理物の搬入及び搬出を行う為
の密閉可能な扉を備えた口が設けてある。その口は搬入
及び搬出の個別用であっても、共用であってもよい。２
は真空チャンバー内の被処理物の存置用空間を示す。３
は真空チャンバーの排気口で、真空排気装置４が接続し
てある。５はプラズマ雰囲気用のガス（プロセスガスと
呼ばれる）を真空チャンバー１内に供給する為のガス供
給手段を示し、図では一端をチャンバー１に接続し、他
端を図示外のガス供給源に接続したガス供給管を示す。Embodiments of the present invention will be described below with reference to the drawings. In the plasma processing apparatus A shown in FIG. 1, reference numeral 1 denotes a vacuum chamber, which is made of, for example, stainless steel, and a part of which is provided with a sealable door for loading and unloading objects to be processed, although not shown. There is a mouth. The mouth may be for loading and unloading individually, or may be shared. Two
Indicates a space for holding the object to be processed in the vacuum chamber. Three
Is an exhaust port of the vacuum chamber, to which the vacuum exhaust device 4 is connected. Reference numeral 5 denotes a gas supply means for supplying a gas for plasma atmosphere (referred to as process gas) into the vacuum chamber 1. In the figure, one end is connected to the chamber 1 and the other end is connected to a gas supply source (not shown). The gas supply pipe which carried out is shown.
【０００８】次に７，７は真空チャンバー１内に備えさ
せたプラズマ発生用の電極で、本例では二組が用いられ
ている。８，８は各電極７にプラズマ発生用電流を供給
する為の電源装置で、一例として１３．５６ＭＨｚの高
周波（ラジオ波とも呼ばる）の電流を供給できるもので
ある。２７．１２ＭＨｚでも良い。各電源装置８は各電
極７によるプラズマの発生量の制御が可能なよう夫々出
力が可変である。両電極７，７によるプラズマ発生量の
相対的な制御で足りる場合は、何れか一方のみが可変
で、残る一方が固定でも良い。上記電源装置８としては
出力調整可能な変圧器、電流調整器等が挙げられる。上
記電極７の数及び電極７と電源装置８との関係につい
て、上記電極７の数は３以上であっても良い。その場
合、対応数の電源装置８を準備して各電極７を夫々個別
に接続する構成、複数の電極７を二つ以上のグループに
分けると共に、グループ数と同数の電源装置８を準備
し、複数の電極７を各グループ毎に夫々別個の電源装置
８に接続する構成等を採用できる。９は高周波電流導入
の為の水冷されたフィードスルー、10は自動整合器であ
る。次に11は被処理物を存置用空間に搬入及びそこから
搬出する為の手段を示し、例えばローラコンベアが用い
られる。12は存置用空間に搬入された被処理物を示す。
該被処理物12は、成形時における離型剤その他の油脂類
が付着している樹脂製品、打ち抜き、成形その他の加工
に用いられた油脂類が付着している金属製品、表面に不
要な酸化物が付着した金属製品等である。この被処理物
は、例えば保持手段で保持した状態で取り扱う。保持手
段は、小物の被処理物（例えば樹脂製容器、金属製機械
部品）の場合は例えば図示の如き保持用容器13であり、
大物（例えば自動車の樹脂製バンパー）の場合はそれを
支える為の治具或いは台である。保持手段を用いぬ場合
もある。Next, 7 and 7 are electrodes for plasma generation provided in the vacuum chamber 1, and two sets are used in this example. Reference numerals 8 and 8 denote power supply devices for supplying a current for plasma generation to each electrode 7, and as an example, can supply a high frequency (also called radio wave) current of 13.56 MHz. It may be 27.12 MHz. The output of each power supply device 8 is variable so that the amount of plasma generated by each electrode 7 can be controlled. When it is sufficient to control the amount of plasma generated by both electrodes 7 and 7, only one of them may be variable and the other one may be fixed. Examples of the power supply device 8 include a transformer whose output can be adjusted and a current regulator. Regarding the number of the electrodes 7 and the relationship between the electrodes 7 and the power supply device 8, the number of the electrodes 7 may be 3 or more. In that case, a corresponding number of power supply devices 8 are prepared and each electrode 7 is individually connected, a plurality of electrodes 7 are divided into two or more groups, and the same number of power supply devices 8 as the number of groups are prepared. It is possible to employ a configuration in which a plurality of electrodes 7 are connected to separate power supply devices 8 for each group. Reference numeral 9 is a water-cooled feedthrough for introducing high-frequency current, and 10 is an automatic matching device. Next, reference numeral 11 denotes a means for loading and unloading the object to be processed into and from the existing space, and, for example, a roller conveyor is used. Reference numeral 12 indicates the object to be processed that has been carried into the storage space.
The object to be treated 12 is a resin product to which a release agent or other oils and fats are attached at the time of molding, a metal product to which oils and fats used for punching, molding and other processing are attached, and unnecessary oxidation on the surface. For example, a metal product to which an object is attached. The object to be processed is handled while being held by a holding means, for example. The holding means is, for example, a holding container 13 as shown in the case of a small object to be processed (for example, a resin container, a metal machine part),
In the case of a large object (for example, a resin bumper of an automobile), it is a jig or a stand for supporting it. In some cases, no holding means is used.
【０００９】次に上記プラズマ処理装置Ａによる被処理
物のプラズマ処理例えば脱脂について説明する。被処理
物12を存置用空間２内に入れる。次に真空チャンバー１
内を真空排気（例えば１０-1トル程度まで）する。排気
を継続したまま次にプロセスガス例えば酸素を、真空チ
ャンバー１内の圧力がプラズマ放電に適した圧力例えば
０．３〜３ｍｂａｒ程度となるように送り込む。次に高
周波電流を電極７に供給し、真空チャンバー１内にてプ
ラズマ放電（グロー放電）を行わせる。その出力密度は
例えば１×１０-4〜０．１Ｗ／ｃｍ3である。上記放電
により上記プロセスガスがプラズマ化され（低圧プラズ
マ或いは低温プラズマの発生）、真空チャンバー１内は
プラズマ雰囲気となる。このプラズマ雰囲気により被処
理物12の表面の脱脂及び活性化が行われる。その様子
は、上記プラズマ放電により生じた紫外線や酸素イオ
ン、ラジカルな状態の酸素、或いは電子が夫々被処理物
12の表面に付着している油脂類に当たる。すると油脂類
は分解されて水蒸気や二酸化炭素となり、被処理物12の
表面から離れる。このようにして被処理物から離れた水
蒸気や二酸化炭素は真空排気装置７による排気によって
真空チャンバー１外に排出される。上記のようなプラズ
マ放電を所定時間例えば１分程度継続することにより被
処理物12の脱脂及び活性化が完了する。その後は上記高
周波電流の供給を停止してプラズマ放電を停止させると
共に真空排気を停止し、真空チャンバー１内を例えば空
気によって大気圧まで復圧し、被処理物12を搬出する。Next, plasma processing of the object to be processed by the plasma processing apparatus A, for example, degreasing will be described. The object to be processed 12 is put into the space 2 for storage. Next, vacuum chamber 1
The inside is evacuated (for example, to about 10 -1 torr). Then, while continuing the exhaust, a process gas such as oxygen is fed so that the pressure in the vacuum chamber 1 becomes a pressure suitable for plasma discharge, for example, about 0.3 to 3 mbar. Next, a high frequency current is supplied to the electrode 7 to cause plasma discharge (glow discharge) in the vacuum chamber 1. The power density is, for example, 1 × 10 −4 to 0.1 W / cm 3 . The process gas is turned into plasma (generation of low-pressure plasma or low-temperature plasma) by the discharge, and the inside of the vacuum chamber 1 becomes a plasma atmosphere. The plasma atmosphere degreases and activates the surface of the object to be treated 12. The state is that the ultraviolet rays, oxygen ions, oxygen in a radical state, or electrons generated by the plasma discharge are the objects to be treated.
Hits oils and fats adhering to the surface of 12. Then, the fats and oils are decomposed into water vapor and carbon dioxide, which separate from the surface of the object to be treated 12. In this way, the water vapor and carbon dioxide separated from the object to be processed are exhausted to the outside of the vacuum chamber 1 by the exhaust of the vacuum exhaust device 7. Degreasing and activation of the object to be treated 12 are completed by continuing the above plasma discharge for a predetermined time, for example, about 1 minute. After that, the supply of the high-frequency current is stopped to stop the plasma discharge and the vacuum exhaust is stopped, and the inside of the vacuum chamber 1 is restored to the atmospheric pressure by, for example, air, and the object 12 to be processed is carried out.
【００１０】上記プラズマによる処理の場合、上述のよ
うな高周波を用いて低温プラズマの発生を行っている
為、真空チャンバー１内の各場所でのプラズマ雰囲気の
均一性を高めることができる。従って被処理物12の全体
を均一に脱脂及び活性化することができる。更にこの場
合、複数（本実施例では二つ）の電極７を用い、各々を
個別の電源装置８に接続してチャンバー１内の相互に異
なる場所でのプラズマ発生量のコントロールを可能にし
ている為、チャンバー１内での被処理物の配置状況にむ
らがあっても、被処理物全体における脱脂を均一に行う
ことができる。In the case of the above plasma treatment, since the low temperature plasma is generated by using the above-mentioned high frequency, the uniformity of the plasma atmosphere at each place in the vacuum chamber 1 can be improved. Therefore, the entire object 12 can be degreased and activated uniformly. Further, in this case, a plurality (two in this embodiment) of electrodes 7 are used, and each of them is connected to an individual power supply device 8 to enable control of the plasma generation amount at different places in the chamber 1. Therefore, even if the arrangement condition of the object to be processed in the chamber 1 is uneven, the entire object to be processed can be degreased uniformly.
【００１１】上記のようにして脱脂及び活性化が行われ
た被処理物12は次工程例えば塗装工程に送られる。その
塗装工程の実施の場合、上記のように紫外線、イオン、
ラジカルな酸素及び電子を含むプラズマ雰囲気によって
処理された被処理物12の表面は、脱脂の完全性が高く然
も活性化されて化学的性質が良好となっている為、例え
ばその親水性が高くなっている為、塗料の固着性が非常
に高い。The object 12 to be treated that has been degreased and activated as described above is sent to the next step, for example, the coating step. When performing the coating process, as described above, ultraviolet rays, ions,
The surface of the object to be treated 12 which has been treated by the plasma atmosphere containing radical oxygen and electrons has a high degree of complete degreasing and is still activated and has a good chemical property, for example, its hydrophilicity is high. Therefore, the adhesion of the paint is very high.
【００１２】上記プラズマ処理をされた被処理物は、そ
の後の埃の付着や経時的な表面の失活を避けるため、で
きるだけ速やかに塗装されるべきである。しかし上記プ
ラズマ処理処理の後、大気中の塵、埃が吸着される恐れ
があるため、それを除去する工程を設けることが製品処
理の品質保証上望ましい。上記工程は例えば塗装前に、
除電、除塵装置（例えば春日電機（株）製イオライザー
（商品名）ＮＩ−０１Ｄ型）によりイオン化した清浄エ
アで被処理物の表面をブローする。The plasma-treated object should be coated as quickly as possible in order to avoid subsequent dust adhesion and surface deactivation over time. However, since dust in the atmosphere may be adsorbed after the plasma treatment, it is desirable to provide a step of removing it in order to guarantee the quality of product treatment. The above process is, for example, before painting.
The surface of the object to be treated is blown with clean air ionized by a static eliminator and a dust eliminator (for example, Iolizer (trade name) NI-01D type manufactured by Kasuga Denki Co., Ltd.).
【００１３】上記プラズマ処理装置Ａにおいて個別の搬
入口と搬出口とを備える場合、被処理物の処理は連続的
に行うと良い。即ち存置用空間２にて処理を完了した被
処理物12を搬出口から搬出すると同時に、次の被処理物
12を搬入口から存置用空間２に搬入して前述のような処
理を行うことを繰り返す。こうすることにより非常に能
率的に被処理物の脱脂処理を行うことができる。When the plasma processing apparatus A is provided with an individual carry-in port and a carry-out port, it is preferable to carry out the processing of the object to be processed continuously. That is, the processed object 12 that has been processed in the storage space 2 is carried out from the carry-out port, and at the same time, the next processed object is processed.
12 is carried into the storage space 2 from the carry-in port, and the above-described processing is repeated. By doing so, the degreasing treatment of the object to be treated can be performed very efficiently.
【００１４】上記プロセスガスは被処理物の材質に適合
したものを用いるのが良く、上記例示されたものの他
に、酸素に対して、フッ素を含んだガス例えばＣＦ4を
２０〜４０％程度混合したものであっても良い。上記被
処理物が酸化され易い材質の場合、プロセスガスとして
はアルゴンに例えば30％程度の水素を混合したガスを用
いる。その他の不活性ガスを用いても良い。還元ガスを
用いても良い。そのようなガスを用いると、被処理物の
酸化を防ぐことが出来、金属の光輝性が保たれるばかり
でなく、酸化膜の除去も可能である。As the above process gas, it is preferable to use a gas suitable for the material of the object to be treated. In addition to the above exemplified gases, a gas containing fluorine such as CF 4 is mixed with oxygen in an amount of about 20 to 40%. It may be one that has been made. When the material to be processed is a material that is easily oxidized, a gas obtained by mixing, for example, about 30% hydrogen with argon is used as the process gas. Other inert gas may be used. A reducing gas may be used. When such a gas is used, the object to be treated can be prevented from being oxidized, and not only the glitter of the metal can be maintained, but also the oxide film can be removed.
【００１５】上記プラズマ処理装置Ａを用いた処理の他
の例としては、例えば銅合金製のリレー接点の洗浄（表
面の油脂の除去及び酸化物の還元）がある。或いは他の
金属製品の精密脱脂がある。例えば軟鋼製のエンジンマ
ウント用ブッシュに対してゴムを接着する場合の接着前
処理がある。この処理も前記の場合と略同様に行われ
る。処理を終えた金属製品は脱脂が完全で良好に活性化
されている為、次工程でのゴムの接着性が極めて高いも
のとなる。Another example of the processing using the plasma processing apparatus A is cleaning of a copper alloy relay contact (removal of oil and fat on the surface and reduction of oxide). Or there is precision degreasing of other metal products. For example, there is a pre-bonding process for bonding rubber to an engine mount bush made of mild steel. This processing is also performed in the substantially same manner as the above case. Since the degreasing is complete and the activated metal product is well activated, the adhesion of rubber in the next step becomes extremely high.
【００１６】次に上記プラズマ処理装置は、前述のよう
な用途の他にプラズマ重合によるリサイクルプラスチッ
クの表層への特定膜の形成等に用いることができる。Next, the above plasma processing apparatus can be used for forming a specific film on the surface layer of recycled plastic by plasma polymerization in addition to the above-mentioned applications.
【００１７】[0017]
【発明の効果】以上のように本願発明にあっては、被処
理物12の表面をプラズマ処理する場合、被処理物12の表
面にプラズマ雰囲気を触れさせてそこのプラズマ処理を
適正に行うことが出来るは勿論のこと、上記の場合、真
空チャンバー１内の被処理物の存置状態が不均一であっ
ても、いずれか一方又は両方の電源装置８の出力を調整
することによって、プラズマの発生量を調整して被処理
物に対するプラズマ処理の均一性の向上を図ることので
きる効果がある。As described above, in the present invention, when the surface of the object to be processed 12 is subjected to the plasma treatment, the plasma atmosphere is brought into contact with the surface of the object to be treated 12 and the plasma treatment is properly performed there. In addition to the above, it is possible to generate plasma by adjusting the output of either one or both of the power supply devices 8 even if the state of the object to be processed in the vacuum chamber 1 is uneven in the above case. There is an effect that the amount can be adjusted to improve the uniformity of plasma processing on the object to be processed.
【図１】縦断面略示図。FIG. 1 is a schematic vertical cross-sectional view.
【符号の説明】 １ 真空チャンバー ２ 存置用空間 ７ プラズマ発生用の電極 ８ 電源装置[Explanation of symbols] 1 vacuum chamber 2 space for storage 7 electrode for plasma generation 8 power supply device
Claims (1)
にプラズマ雰囲気用のガスを供給するためのガス供給手
段を付設し、上記真空チャンバー内には被処理物の存置
用空間と、上記存置用空間をプラズマ雰囲気にする為の
少なくとも二つの電極を備えさせ、上記二つの電極は、
異なる電源装置に個別に接続して相互にプラズマ発生量
の制御を可能にしたことを特徴とするプラズマ処理装
置。1. A vacuum chamber is provided with a gas supply means for supplying a gas for a plasma atmosphere into the vacuum chamber, and a space for storing the object to be processed and the space for storing the object in the vacuum chamber. Is provided with at least two electrodes for making a plasma atmosphere, and the two electrodes are
A plasma processing apparatus characterized in that they are individually connected to different power supply devices to enable mutual control of the plasma generation amount.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5034395A JPH06226086A (en) | 1993-01-28 | 1993-01-28 | Plasma treating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5034395A JPH06226086A (en) | 1993-01-28 | 1993-01-28 | Plasma treating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06226086A true JPH06226086A (en) | 1994-08-16 |
Family
ID=12412998
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5034395A Pending JPH06226086A (en) | 1993-01-28 | 1993-01-28 | Plasma treating device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06226086A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006307255A (en) * | 2005-04-27 | 2006-11-09 | Micro Denshi Kk | Treatment device for descaling or the like utilizing microwave |
| EP1931815A1 (en) * | 2005-09-13 | 2008-06-18 | Williams, Lee R. | Method of and apparatus for treating particulate materials for improving the surface characteristics thereof |
-
1993
- 1993-01-28 JP JP5034395A patent/JPH06226086A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006307255A (en) * | 2005-04-27 | 2006-11-09 | Micro Denshi Kk | Treatment device for descaling or the like utilizing microwave |
| JP4702680B2 (en) * | 2005-04-27 | 2011-06-15 | 株式会社エスイー | Processing equipment using microwaves |
| EP1931815A1 (en) * | 2005-09-13 | 2008-06-18 | Williams, Lee R. | Method of and apparatus for treating particulate materials for improving the surface characteristics thereof |
| EP1931815A4 (en) * | 2005-09-13 | 2010-04-21 | Williams Lee R | Method of and apparatus for treating particulate materials for improving the surface characteristics thereof |
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