JPH06198653A - Cleaning composition for mold - Google Patents
Cleaning composition for moldInfo
- Publication number
- JPH06198653A JPH06198653A JP34890092A JP34890092A JPH06198653A JP H06198653 A JPH06198653 A JP H06198653A JP 34890092 A JP34890092 A JP 34890092A JP 34890092 A JP34890092 A JP 34890092A JP H06198653 A JPH06198653 A JP H06198653A
- Authority
- JP
- Japan
- Prior art keywords
- mold
- cleaning
- cleaning composition
- sheet
- tolylbiguanide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/24—Hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3272—Urea, guanidine or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
- C11D7/3281—Heterocyclic compounds
Landscapes
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Detergent Compositions (AREA)
- Cleaning And De-Greasing Of Metallic Materials By Chemical Methods (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、成形用樹脂組成物の
成形作業の繰り返しにより汚染された熱硬化性樹脂成形
材料用成形用金型等の金型を洗浄するための金型洗浄用
組成物に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mold cleaning composition for cleaning a mold such as a mold for a thermosetting resin molding material, which has been contaminated by repeated molding operations of a molding resin composition. It is about things.
【０００２】[0002]
【従来の技術】熱硬化性樹脂成形材料の成形用金型を用
いての成形時には、上記熱硬化性樹脂成形材料中に含ま
れる離型剤が金型表面に滲出して離型作用を発揮する。
このような成形工程を繰り返すと、成形品の離型性が低
下したり、外観が悪くなる等の不都合が生じる。この原
因は、上記成形材料中に含まれる離型剤が、金型表面に
滲出して成形工程の繰り返しにより金型表面に順次積層
しながら徐々に劣化し、離型剤としての効果が失われた
汚染物層が形成されるためと考えられる。このような問
題を解決するため、離型剤の劣化層である汚染物層が形
成された段階で上記金型の洗浄作業が行われる。例え
ば、従来から、上記金型内に熱硬化性メラミン樹脂成形
材料を入れて成形硬化させ、上記金型表面の汚染物をそ
の成形品と一体化させ、その汚染物が一体化した成形品
を金型から取り出すことにより、金型表面を洗浄すると
いうことが行われている。しかし、このような洗浄方法
では、上記熱硬化性メラミン樹脂成形材料の縮合物とし
てホルマリンが副生し臭気を生じたり、この成形品の除
去も困難であり長時間を要するため、作業環境が著しく
悪化し洗浄作業性の低下の原因となる。2. Description of the Related Art At the time of molding a thermosetting resin molding material using a molding die, a mold release agent contained in the thermosetting resin molding material exudes to the surface of the mold and exhibits a mold releasing action. To do.
If such a molding process is repeated, the mold releasability of the molded product is deteriorated and the appearance is deteriorated. The reason for this is that the release agent contained in the above-mentioned molding material exudes to the surface of the mold and gradually deteriorates while being successively laminated on the surface of the mold by repeating the molding process, and the effect as the release agent is lost. It is thought that this is because a pollutant layer is formed. In order to solve such a problem, the work of cleaning the mold is performed when a contaminant layer, which is a deteriorated layer of the release agent, is formed. For example, conventionally, a thermosetting melamine resin molding material was placed in the mold and molded and cured, and contaminants on the mold surface were integrated with the molded product, and a molded product in which the contaminants were integrated was prepared. It is practiced to clean the surface of the mold by removing it from the mold. However, in such a cleaning method, formalin is produced as a by-product as a condensate of the thermosetting melamine resin molding material to generate an odor, and it is difficult to remove this molded product and it takes a long time, so that the working environment is remarkably high. This deteriorates the cleaning workability.
【０００３】このため、最近では、上記熱硬化性メラミ
ン樹脂成形材料に代えて未加硫ゴム系コンパウンドを使
用し、金型中で加硫させて加硫ゴム化し、その加硫ゴム
化する際に、金型表面の汚染物を加硫ゴムと一体化し、
ついで加硫ゴムを金型から取り出すことにより金型表面
を洗浄するという方法が提案され一部で実施されてい
る。Therefore, recently, when an unvulcanized rubber compound is used in place of the thermosetting melamine resin molding material, the compound is vulcanized in a mold to form a vulcanized rubber, which is then converted into a vulcanized rubber. In addition, the contaminants on the mold surface are integrated with the vulcanized rubber,
Then, a method of cleaning the surface of the mold by removing the vulcanized rubber from the mold has been proposed and partially implemented.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、上記熱
硬化性樹脂成形材料は、その要求特性によって組成が異
なり多種類であって、成形の繰り返しにより発生する金
型汚染の状態および汚染物の成分も多種多用である。な
かでも、離型剤としてポリエチレンワックスを含有して
なる成形材料を用いて成形を繰り返した際の金型汚染物
は、金型表面に対する焼き付けがひどく、上記未加硫ゴ
ム系コンパウンドを用いるような従来の洗浄方法では完
全に除去することが不可能であるという問題が生じてい
る。However, the above-mentioned thermosetting resin molding materials differ in composition depending on the required properties, and there are many types, and the state of mold contamination and the components of contaminants which occur due to repeated molding. It is used for various purposes. Among them, the mold contaminants when molding is repeated using a molding material containing polyethylene wax as a mold release agent are badly baked on the mold surface, and the unvulcanized rubber-based compound is used. There is a problem that it cannot be completely removed by the conventional cleaning method.
【０００５】この発明は、このような事情に鑑みなされ
たもので、成形用金型に対して優れた洗浄効果を有する
金型洗浄用組成物の提供をその目的とする。The present invention has been made in view of the above circumstances, and an object thereof is to provide a mold cleaning composition having an excellent cleaning effect on a molding mold.
【０００６】[0006]
【課題を解決するための手段】上記の目的を達成するた
め、この発明の金型洗浄用組成物は、高分子材料を主成
分とし、１，ｏ−トリルビグアニドを含有しているとい
う構成をとる。In order to achieve the above object, the mold cleaning composition of the present invention comprises a polymeric material as a main component and 1, o-tolylbiguanide. To take.
【０００７】[0007]
【作用】すなわち、この発明者は、離型剤としてポリエ
チレンワックスを含有する成形材料を用いた成形の繰り
返しにより形成された金型表面の汚染物を効果的に除去
するために一連の研究を重ねた。その結果、洗浄剤とし
て１，ｏ−トリルビグアニドという特定の物質を含有し
た金型洗浄用組成物を用いて金型表面の洗浄を行うと、
金型表面の汚染物がこの金型洗浄用組成物の成形品と一
体化し、金型から汚染物が効果的に除去されることを見
出しこの発明に到達した。That is, the present inventor has conducted a series of studies in order to effectively remove contaminants on the mold surface formed by repeating molding using a molding material containing polyethylene wax as a release agent. It was As a result, when the mold surface is cleaned using a mold cleaning composition containing a specific substance of 1, o-tolylbiguanide as a cleaning agent,
The inventors have found that contaminants on the surface of the mold are integrated with the molded product of the composition for cleaning a mold, and the contaminants are effectively removed from the mold, and the present invention has been reached.
【０００８】つぎに、この発明について詳しく説明す
る。Next, the present invention will be described in detail.
【０００９】この発明の金型洗浄用組成物は、ベースと
なる高分子材料と、特定の洗浄剤を用いて得られる。The mold cleaning composition of the present invention can be obtained by using a base polymer material and a specific cleaning agent.
【００１０】上記高分子材料としては、各種ゴム材料，
樹脂材料等があげられる。上記ゴム原料としては、特に
限定するものではないが、なかでもブタジエンゴム（Ｂ
Ｒ）とエチレン−プロピレンゴム（ＥＰＲ）の混合物が
好適にあげられる。上記ＢＲ（Ｘ）とＥＰＲ（Ｙ）との
混合割合（Ｘ／Ｙ）は、重量比で、Ｘ／Ｙ＝５０／５０
〜９０／１０の範囲に設定することが好ましい。すなわ
ち、両者の混合割合において、ＢＲが５０未満（ＥＰＲ
が５０を超える）では得られる金型再生用組成物からな
るクリーニングシートを用いて金型を洗浄すると、金型
からの剥離性が悪化する。逆に、ＢＲが９０を超える
（ＥＰＲが１０未満）と成形作業時に行うゴム成形品の
除去に際し、成形品の強度が低下しているため、破れ等
の不都合が生じ金型からの除去作業が困難となる傾向が
みられるからである。なお、上記ＥＰＲには、エチレン
−プロピレン−ジエンゴム（ＥＰＤＭ）をも含む趣旨で
ある。As the polymer material, various rubber materials,
Resin materials and the like can be mentioned. The rubber raw material is not particularly limited, but among them, butadiene rubber (B
A mixture of R) and ethylene-propylene rubber (EPR) is preferable. The mixing ratio (X / Y) of BR (X) and EPR (Y) is a weight ratio of X / Y = 50/50.
It is preferable to set in the range of 90/10. That is, BR is less than 50 (EPR
When the mold is washed with a cleaning sheet composed of the obtained composition for remanufacturing a mold, the releasability from the mold deteriorates. On the other hand, if the BR exceeds 90 (EPR is less than 10), the strength of the molded product is reduced when removing the rubber molded product during the molding work, and therefore inconvenience such as tearing occurs and the removal work from the mold is difficult. This is because it tends to be difficult. The EPR also includes ethylene-propylene-diene rubber (EPDM).
【００１１】上記高分子材料に含有される特定の洗浄剤
には、下記の一般式で表される１−ｏ−トリルビグアニ
ドが用いられる。この１−ｏ−トリルビグアニドを洗浄
剤として用いることがこの発明の特徴である。As the specific detergent contained in the polymer material, 1-o-tolylbiguanide represented by the following general formula is used. It is a feature of this invention that the 1-o-tolylbiguanide is used as a detergent.
【００１２】[0012]
【化１】 [Chemical 1]
【００１３】上記１−ｏ−トリルビグアニドの含有量
は、高分子材料１００重量部（以下「部」と略す）に対
して５〜１５部に設定することが好ましく、特に好まし
くは８〜１２部である。すなわち、１−ｏ−トリルビグ
アニドの含有量が５部未満では金型の洗浄力が低下し、
逆に１５部を超えると金型表面に１−ｏ−トリルビグア
ニドが過剰に滲出して金型表面の汚染の原因となる傾向
がみられるからである。The content of 1-o-tolylbiguanide is preferably set to 5 to 15 parts, and particularly preferably 8 to 12 parts, relative to 100 parts by weight of polymer material (hereinafter abbreviated as "part"). Is. That is, if the content of 1-o-tolylbiguanide is less than 5 parts, the detergency of the mold is lowered,
On the contrary, if it exceeds 15 parts, 1-o-tolylbiguanide tends to excessively exude to the surface of the mold, which tends to cause contamination of the surface of the mold.
【００１４】この発明の金型洗浄用組成物には、上記各
成分以外に必要に応じて、シリカパウダー等の補強剤、
有機過酸化物等の加硫剤、イミダゾール等の加硫助剤、
顔料等の他の添加剤を適宜配合することができる。In addition to the above-mentioned components, the mold cleaning composition of the present invention may contain a reinforcing agent such as silica powder, if necessary.
Vulcanizing agents such as organic peroxides, vulcanizing aids such as imidazole,
Other additives such as pigments can be appropriately mixed.
【００１５】上記他の添加剤の配合量は、高分子材料１
００部に対して、補強剤の場合４０〜５０部に、加硫剤
の場合１〜３部に、加硫助剤の場合５〜１５部に設定す
ることがそれぞれ好ましい。The blending amount of the above-mentioned other additives is the polymer material 1
With respect to 00 parts, it is preferable to set 40 to 50 parts for the reinforcing agent, 1 to 3 parts for the vulcanizing agent, and 5 to 15 parts for the vulcanization aid.
【００１６】この発明の金型洗浄用組成物は、つぎのよ
うにして得られる。すなわち、ベースとなる高分子材
料，１−ｏ−トリルビグアニドおよび他の添加剤を配合
し、これを混練機で混練することにより得られる。そし
て、このようにして得られた金型洗浄用組成物は、例え
ば金型洗浄時にはシート状に形成して用いられる。The mold cleaning composition of the present invention is obtained as follows. That is, it can be obtained by blending a base polymer material, 1-o-tolylbiguanide and other additives, and kneading them with a kneader. The mold cleaning composition thus obtained is used in the form of a sheet when cleaning the mold, for example.
【００１７】そして、金型の洗浄は、上記シート状に形
成された金型洗浄用組成物を、金型に装填して行われ
る。例えば、ベースとなる高分子材料がゴム材料の場
合、上記シートは未加硫状態であって、金型に装填し加
熱加硫させることによりシートに汚染物を付着一体化さ
せる。ついで、加硫のなされたシートを金型から取り出
すことにより金型の洗浄が行われる。Then, the mold is cleaned by loading the mold-cleaning composition formed into a sheet into the mold. For example, when the base polymer material is a rubber material, the above-mentioned sheet is in an unvulcanized state, and the sheet is loaded into a mold and vulcanized by heating so that contaminants are attached to and integrated with the sheet. Next, the vulcanized sheet is taken out of the mold to clean the mold.
【００１８】上記金型の洗浄は、つぎのようなメカニズ
ムによりなされると考えられる。すなわち、加熱加硫の
際に、ゴム材料中の１−ｏ−トリルビグアニドが溶融し
金型面に滲出して汚染物を膨潤させる。これにより、汚
染物の金型表面からの剥離除去が容易となる。そして、
加硫されたシートに金型表面から剥離された汚染物が接
着，一体化してシートを金型から取り出すことにより金
型表面の汚染物が除去され金型が洗浄される。The cleaning of the mold is considered to be performed by the following mechanism. That is, at the time of heat vulcanization, 1-o-tolylbiguanide in the rubber material is melted and exudes to the mold surface to swell the contaminant. This facilitates peeling and removal of contaminants from the mold surface. And
The contaminants separated from the surface of the mold are adhered to and integrated with the vulcanized sheet, and the sheet is taken out of the mold to remove the contaminants on the surface of the mold and clean the mold.
【００１９】つぎに、この発明の金型洗浄用組成物によ
り洗浄された金型は、汚染物が除去され、初期状態の金
型表面に戻っているため、通常、熱硬化性樹脂成形材料
の成形を行う際に、予め金型表面に離型剤を塗布しなけ
ればならず、例えば、離型剤としてポリエチレンワック
スを含有してなる成形材料の成形に際しては、同じポリ
エチレンワックスを塗布することが好ましい。そして、
金型表面へのポリエチレンワックスの塗布方法として
は、ポリエチレンワックスを含有した未加硫ゴム組成物
を準備し、これをシート状に形成したものを用いるのが
好ましい。そして、このポリエチレンワックスを含有し
た未加硫ゴム組成物からなるシートを上記洗浄工程と同
様、金型に装填して加熱することにより含有されたポリ
エチレンワックスが金型表面に塗布される。これは、加
熱加硫の際に未加硫ゴム組成物中のポリエチレンワック
スが溶融し、金型面に滲出して表面に均一な離型剤膜が
形成されるものと考えられる。なお、上記ポリエチレン
ワックスの含有量は、例えば未加硫ゴム組成物中のゴム
材料１００部に対して１５〜３５部の割合に設定するこ
とが好ましく、特に好ましくは２０〜３０部である。す
なわち、ポリエチレンワックスの含有量が１５部未満で
は充分な離型効果が発揮されず、逆に３５部を超えると
金型表面に過剰塗布されとともに、洗浄，再生後の金型
を用いて成形品を形成した場合にその成形品の外観が劣
化する傾向がみられるからである。Next, since the mold cleaned with the mold cleaning composition of the present invention is free from contaminants and returns to the initial mold surface, it is usually a thermosetting resin molding material. When molding, a mold release agent must be applied to the surface of the mold in advance. For example, when molding a molding material containing polyethylene wax as a mold release agent, the same polyethylene wax may be applied. preferable. And
As a method of applying the polyethylene wax to the surface of the mold, it is preferable to use an unvulcanized rubber composition containing polyethylene wax prepared and formed into a sheet. Then, the polyethylene wax contained is applied to the surface of the mold by loading the sheet made of the unvulcanized rubber composition containing the polyethylene wax into the mold and heating the same as in the cleaning step. It is considered that this is because the polyethylene wax in the unvulcanized rubber composition melts during heat vulcanization and exudes to the mold surface to form a uniform release agent film on the surface. The content of the polyethylene wax is preferably set to 15 to 35 parts, and particularly preferably 20 to 30 parts, relative to 100 parts of the rubber material in the unvulcanized rubber composition. That is, when the content of polyethylene wax is less than 15 parts, a sufficient releasing effect is not exhibited, and when it exceeds 35 parts, it is excessively applied to the surface of the mold, and the molded product is cleaned and regenerated using the mold. This is because the appearance of the molded product tends to deteriorate when the resin is formed.
【００２０】[0020]
【発明の効果】以上のように、この発明の金型洗浄用組
成物は、洗浄剤として１，ｏ−トリルビグアニドが含有
されている。このため、この発明の金型洗浄用組成物を
用いて金型表面の洗浄を行うと、金型表面の汚染物がこ
の金型洗浄用組成物に付着し一体化し金型から汚染物が
効果的に除去される。したがって、この発明の金型洗浄
用組成物により洗浄された金型を用いて形成される成形
品は、外観に優れたものが得られるようになる。INDUSTRIAL APPLICABILITY As described above, the mold cleaning composition of the present invention contains 1, o-tolylbiguanide as a cleaning agent. Therefore, when the mold surface is cleaned using the mold cleaning composition of the present invention, contaminants on the mold surface adhere to and are integrated with the mold cleaning composition, and the contaminants from the mold are effective. Will be removed. Therefore, the molded product formed by using the mold cleaned with the mold cleaning composition of the present invention can have excellent appearance.
【００２１】つぎに、実施例について比較例と併せて説
明する。Next, examples will be described together with comparative examples.
【００２２】[0022]
【実施例１〜６、比較例１〜６】下記の表１および表２
に示す各材料を同表に示す割合で配合し、混練機で混練
した。ついで、これを圧延ロールを用いて厚み５ｍｍの
シートに成形して目的とする金型洗浄用組成物を得た。Examples 1 to 6 and Comparative Examples 1 to 6 Tables 1 and 2 below.
The materials shown in Table 1 were blended in the proportions shown in the table and kneaded with a kneader. Then, this was molded into a sheet having a thickness of 5 mm by using a rolling roll to obtain a target mold cleaning composition.
【００２３】[0023]
【比較例７】金型洗浄用材料として、熱硬化性メラミン
樹脂を用いた。Comparative Example 7 A thermosetting melamine resin was used as a mold cleaning material.
【００２４】[0024]
【表１】 [Table 1]
【００２５】[0025]
【表２】 [Table 2]
【００２６】以上のようにして得られた実施例品および
比較例品のシート状金型洗浄用組成物を、離型剤として
ポリエチレンワックスを含有してなる成形用樹脂組成物
の繰り返し成形により表面が汚染された成形用金型に挟
み、１７５℃で５分間加熱加硫後、金型より取り出し、
汚染物の除去性を確認し評価した。また、熱硬化性メラ
ミン樹脂は、トランスファー成形し１７５℃で３分間加
熱硬化後金型より取り出し、同様にして汚染物の除去性
を目視により確認し評価した。そして、汚染物の除去が
完全になされたものを良、除去が不完全なものを不良と
した。その結果を下記の表３および表４に示す。The sheet-shaped mold-cleaning compositions of Examples and Comparative Examples obtained as described above were surface-repeated by repeatedly molding a molding resin composition containing polyethylene wax as a release agent. Sandwiched between molds contaminated with vulcanizate, heated and vulcanized at 175 ° C for 5 minutes, and then removed from the mold.
The removability of contaminants was confirmed and evaluated. The thermosetting melamine resin was transfer-molded, heat-cured at 175 ° C. for 3 minutes, and then taken out from the mold, and the removability of contaminants was visually confirmed and evaluated in the same manner. Then, the ones in which the contaminants were completely removed were evaluated as good, and those incompletely removed were evaluated as bad. The results are shown in Tables 3 and 4 below.
【００２７】[0027]
【表３】 [Table 3]
【００２８】[0028]
【表４】 [Table 4]
【００２９】上記表３および表４の結果から、比較例品
は金型洗浄性が不良であり充分に汚染物の除去がなされ
なかった。これに対して、実施例品は金型から取り出し
たシート状金型洗浄用組成物表面に、金型表面に形成さ
れた汚染物が移行転写されて付着していることが確認さ
れ、それによって金型表面が充分に洗浄されたことも確
認された。From the results shown in Tables 3 and 4 above, the comparative example product had a poor mold cleaning property, and the contaminants were not sufficiently removed. On the other hand, in the example product, it was confirmed that the contaminants formed on the mold surface were transferred and adhered to the surface of the sheet-shaped mold cleaning composition taken out from the mold, thereby It was also confirmed that the mold surface was sufficiently washed.
【００３０】さらに、上記実施例品および比較例品によ
り金型洗浄された金型に、ポリエチレンワックスを含有
したシート状の離型回復剤組成物（ブタジエンゴムとエ
チレン−プロピレンゴムの混合物ベース）を挟み、加熱
加硫（１７５℃×３分）を行って離型剤を金型表面に塗
布した。ついで、離型剤を塗布した金型にポリエチレン
ワックスを含有してなる成形用樹脂組成物を用いてトラ
ンスファー成形した。そして、得られた成形品の外観を
目視により評価した。得られた成形品の外観良好なもの
を良、外観が悪いものを不良とした。その結果を下記の
表５および表６に示した。Further, a sheet-like mold release recovery composition containing polyethylene wax (based on a mixture of butadiene rubber and ethylene-propylene rubber) was applied to the molds washed by the above-mentioned example products and comparative example products. The mold was sandwiched, and heat vulcanization (175 ° C. × 3 minutes) was performed to apply a release agent to the mold surface. Next, transfer molding was performed using a molding resin composition containing polyethylene wax in a mold coated with a release agent. Then, the appearance of the obtained molded product was visually evaluated. The obtained molded articles having good appearance were evaluated as good, and those having poor appearance were evaluated as bad. The results are shown in Tables 5 and 6 below.
【００３１】[0031]
【表５】 [Table 5]
【００３２】[0032]
【表６】 [Table 6]
【００３３】上記表５および表６の結果から、実施例品
を用いて金型表面が充分に洗浄された金型により得られ
た成形品の外観は良好であった。From the results shown in Tables 5 and 6 above, the appearance of the molded product obtained by the mold in which the mold surface was sufficiently cleaned using the example product was good.
Claims (3)
ルビグアニドを含有していることを特徴とする金型洗浄
用組成物。1. A mold cleaning composition comprising a polymer material as a main component and 1, o-tolylbiguanide.
記載の金型洗浄用組成物。2. The polymer material is a rubber material.
The mold cleaning composition as described above.
−プロピレンゴムの混合物である請求項２記載の金型洗
浄用組成物。3. The mold cleaning composition according to claim 2, wherein the rubber material is a mixture of butadiene rubber and ethylene-propylene rubber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4348900A JP3001738B2 (en) | 1992-12-28 | 1992-12-28 | Mold cleaning composition and mold cleaning sheet using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4348900A JP3001738B2 (en) | 1992-12-28 | 1992-12-28 | Mold cleaning composition and mold cleaning sheet using the same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06198653A true JPH06198653A (en) | 1994-07-19 |
| JP3001738B2 JP3001738B2 (en) | 2000-01-24 |
Family
ID=18400145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4348900A Expired - Lifetime JP3001738B2 (en) | 1992-12-28 | 1992-12-28 | Mold cleaning composition and mold cleaning sheet using the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3001738B2 (en) |
-
1992
- 1992-12-28 JP JP4348900A patent/JP3001738B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP3001738B2 (en) | 2000-01-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH10226799A (en) | Detergent composition for mold for molding semiconductor device and method for cleaning mold therewith | |
| JP5391072B2 (en) | Rubber composition for mold cleaning | |
| EP0546516B1 (en) | Rubber composition for cleaning metal mold and method for cleaning | |
| JP2011020416A (en) | Mold detergent composition and mold cleaning material, and method for cleaning mold using the same | |
| CN112898687A (en) | Mold cleaning material for semiconductor packaging mold and preparation method thereof | |
| JP6116789B2 (en) | Semiconductor device molding die cleaning sheet and semiconductor device molding die cleaning method using the same | |
| JP3503088B2 (en) | Mold cleaning composition | |
| JP5726517B2 (en) | Rubber composition for mold release recovery | |
| JP3001738B2 (en) | Mold cleaning composition and mold cleaning sheet using the same | |
| JP2974267B2 (en) | Rubber composition for mold cleaning | |
| JP2633101B2 (en) | Mold regeneration composition | |
| JP2844366B2 (en) | Rubber composition for mold cleaning | |
| JPH09262842A (en) | Cleaning of mold | |
| JPH05320330A (en) | Internal mold release agent | |
| JP2002128973A (en) | Ethylene propylene diene rubber composition and ethylene propylene diene rubber/plastic composite | |
| JP3155304B2 (en) | Thermoplastic elastomer composition | |
| JPH06340B2 (en) | Mold cleaning composition | |
| JP3585631B2 (en) | Mold cleaning method | |
| JPH09324287A (en) | Rubber composition for cleaning mold and method for cleaning mold | |
| JPH0220538A (en) | Rubber composition for cleaning mold | |
| JP2802998B2 (en) | Rubber composition for mold cleaning | |
| JP2783991B2 (en) | Semiconductor device manufacturing method | |
| JP2585699B2 (en) | Partially crosslinked thermoplastic elastomer composition for bonding polyurethane | |
| JPH03161310A (en) | Mold cleaning agent composition | |
| JPS58122942A (en) | Mold cleaner composition |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 9 Free format text: PAYMENT UNTIL: 20081112 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Year of fee payment: 12 Free format text: PAYMENT UNTIL: 20111112 |
|
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131112 Year of fee payment: 14 |
|
| EXPY | Cancellation because of completion of term | ||
| FPAY | Renewal fee payment (prs date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131112 Year of fee payment: 14 |