JPH06164109A - Method for removing solder ball - Google Patents
Method for removing solder ballInfo
- Publication number
- JPH06164109A JPH06164109A JP31820492A JP31820492A JPH06164109A JP H06164109 A JPH06164109 A JP H06164109A JP 31820492 A JP31820492 A JP 31820492A JP 31820492 A JP31820492 A JP 31820492A JP H06164109 A JPH06164109 A JP H06164109A
- Authority
- JP
- Japan
- Prior art keywords
- synthetic resin
- resin film
- solder
- circuit board
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半田ボールの除去方法に
係り、詳しくは、電子部品の電極をプリント基板の電極
に半田付けした際に生じる半田ボールを簡単に除去でき
る半田ボールの除去方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a solder ball removing method, and more particularly, to a solder ball removing method capable of easily removing a solder ball generated when an electrode of an electronic component is soldered to an electrode of a printed circuit board. It is a thing.
【０００２】[0002]
【従来の技術】チップマウンタなどにより電子部品が搭
載されたプリント基板はリフロー装置へ送られ、電子部
品の電極をプリント基板の電極に固着するための半田付
けが行われる。2. Description of the Related Art A printed circuit board on which electronic components are mounted is sent to a reflow device by a chip mounter or the like, and soldering is performed to fix the electrodes of the electronic components to the electrodes of the printed circuit board.
【０００３】この半田付けは、半田をその溶融温度以上
に加熱することにより行われるため、溶融した半田の一
部が周囲へ流動し、半田ボールが生じやすい。半田ボー
ルは回路パターンの短絡の原因となるので除去しなけれ
ばならない。Since this soldering is performed by heating the solder to a temperature higher than its melting temperature, a part of the melted solder flows to the surroundings, and solder balls are easily generated. Solder balls cause a short circuit in the circuit pattern and must be removed.
【０００４】従来、半田ボールを除去する方法として
は、ブラシによりプリント基板の表面の半田ボールをこ
すり落とす方法や、液体フロンによりプリント基板を洗
浄する方法が知られている。Conventionally, as a method of removing the solder balls, a method of scraping off the solder balls on the surface of the printed circuit board with a brush and a method of cleaning the printed circuit board with a liquid flon are known.
【０００５】[0005]
【発明が解決しようとする課題】しかしながらブラシに
よる除去では、すべての半田ボールを完全に除去するこ
とは難しく、またブラシでこすられた半田ボールがプリ
ント基板から落下せずに却ってプリント基板の凹所など
に入り込み、短絡を生じやすいという問題点があった。
また液体フロンは半田ボールの洗浄効果は大きいが、環
境上の問題を生じることから、その使用は中止したいも
のである。However, it is difficult to completely remove all the solder balls by using a brush, and the solder balls rubbed by the brush do not drop from the printed circuit board, but rather the recessed areas of the printed circuit board. However, there is a problem in that a short circuit is likely to occur.
Although liquid CFC has a great cleaning effect on solder balls, it causes environmental problems, so its use should be discontinued.
【０００６】そこで本発明は、プリント基板の表面に生
じた半田ボールを簡単確実に除去できる半田ボールの除
去方法を提供することを目的とする。SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide a solder ball removing method which can easily and surely remove a solder ball generated on the surface of a printed circuit board.
【０００７】[0007]
【課題を解決するための手段】このために本発明は、プ
リント基板の表面に合成樹脂を塗布して合成樹脂膜を形
成し、この合成樹脂膜の内部に半田ボールを包含させて
この合成樹脂膜をプリント基板から剥ぎ取るようにして
いる。To this end, according to the present invention, a synthetic resin is applied to the surface of a printed circuit board to form a synthetic resin film, and a solder ball is included in the synthetic resin film to form the synthetic resin film. The film is peeled off from the printed circuit board.
【０００８】[0008]
【作用】上記構成によれば、プリント基板の表面に生じ
た半田ボールを合成樹脂膜と一緒に簡単に除去すること
ができる。According to the above construction, the solder balls generated on the surface of the printed board can be easily removed together with the synthetic resin film.
【０００９】[0009]
【実施例】次に、図面を参照しながら本発明の実施例を
説明する。Embodiments of the present invention will now be described with reference to the drawings.
【００１０】図１は電子部品が半田付けされたプリント
基板、図２はその部分拡大図を示している。本実施例の
電子部品１はリード付電子部品であり、モールド体２か
ら電極であるリード３が多数本延出している。このリー
ド３はプリント基板４の表面に形成された回路パターン
の電極５に半田６により半田付けされている。上述した
ように、半田付けは半田を高温度に加熱して溶融させる
ことにより行われるため、溶融した半田６の一部が周囲
へ流動し、半田ボール７が生じている。FIG. 1 shows a printed circuit board to which electronic components are soldered, and FIG. 2 shows a partially enlarged view thereof. The electronic component 1 of this embodiment is an electronic component with leads, and a large number of leads 3 as electrodes are extended from the molded body 2. The leads 3 are soldered to the electrodes 5 of the circuit pattern formed on the surface of the printed circuit board 4 by the solder 6. As described above, since soldering is performed by heating the solder to a high temperature to melt it, part of the melted solder 6 flows to the surroundings, and the solder ball 7 is generated.
【００１１】図３は半田ボール７を除去する方法を示し
ている。図３（ａ）に示すように、半田７は電極５と電
極５の間に生じており、ブラシなどでは除去しにくいも
のである。そこで図３（ｂ）に示すように、プリント基
板４の表面に合成樹脂膜８を形成し、半田ボール７をこ
の合成樹脂膜８の内部に包含させる。この合成樹脂膜８
は、スプレーやディスペンサにより液状の合成樹脂を塗
布した後、これを硬化させることにより形成する。この
合成樹脂としては、アクリル系やエポキシ系などの速硬
性と若干の弾性を有す熱硬化性樹脂や光硬化性樹脂が望
ましい。FIG. 3 shows a method of removing the solder balls 7. As shown in FIG. 3A, the solder 7 is generated between the electrodes 5 and is difficult to remove with a brush or the like. Therefore, as shown in FIG. 3B, a synthetic resin film 8 is formed on the surface of the printed circuit board 4, and the solder balls 7 are included inside the synthetic resin film 8. This synthetic resin film 8
Is formed by applying a liquid synthetic resin by spraying or a dispenser and then curing the synthetic resin. As the synthetic resin, a thermosetting resin or a photocurable resin having fast curing property and some elasticity such as acrylic resin or epoxy resin is desirable.
【００１２】次に図３（ｃ）に示すように、合成樹脂膜
８をプリント基板４から剥ぎ取れば、半田ボール７は合
成樹脂膜８と一緒に除去される。こように本方法によれ
ば、電極５と電極５の間などの狭い場所に生じた半田ボ
ール７でも簡単に除去することができる。なお合成樹脂
膜はプリント基板の全面に形成してもよく、あるいは半
田ボールが生じやすい電極付近などに部分的に形成して
もよい。Next, as shown in FIG. 3C, when the synthetic resin film 8 is peeled off from the printed circuit board 4, the solder balls 7 are removed together with the synthetic resin film 8. As described above, according to this method, even the solder balls 7 generated in a narrow space such as between the electrodes 5 can be easily removed. The synthetic resin film may be formed on the entire surface of the printed board, or may be partially formed in the vicinity of the electrodes where solder balls are likely to occur.
【００１３】[0013]
【発明の効果】以上説明したように本発明は、プリント
基板の表面に合成樹脂を塗布して合成樹脂膜を形成し、
この合成樹脂膜の内部に半田ボールを包含させてプリン
ト基板から剥ぎ取るようにしているので、プリント基板
の表面に生じた半田ボールを簡単確実に除去することが
でき、殊に電極と電極の間の狭い場所に生じた半田ボー
ルも確実に除去することができる。As described above, according to the present invention, a synthetic resin is applied to the surface of a printed circuit board to form a synthetic resin film,
Since the solder balls are included in this synthetic resin film and peeled off from the printed circuit board, the solder balls generated on the surface of the printed circuit board can be easily and reliably removed, especially between the electrodes. Solder balls generated in a narrow space can be reliably removed.
【図１】本発明の一実施例のプリント基板の斜視図FIG. 1 is a perspective view of a printed circuit board according to an embodiment of the present invention.
【図２】本発明の一実施例のプリント基板の部分拡大図FIG. 2 is a partially enlarged view of a printed circuit board according to an embodiment of the present invention.
【図３】（ａ）本発明の一実施例の半田ボールの除去中
のプリント基板の断面図 （ｂ）本発明の一実施例の半田ボールの除去中のプリン
ト基板の断面図 （ｃ）本発明の一実施例の半田ボールの除去中のプリン
ト基板の断面図FIG. 3A is a cross-sectional view of a printed circuit board according to an embodiment of the present invention during removal of solder balls. FIG. 3B is a cross-sectional view of a printed circuit board during removal of solder balls according to an embodiment of the present invention. Sectional view of a printed circuit board during solder ball removal according to one embodiment of the invention
１ 電子部品 ３ リード（電極） ４ プリント基板 ５ 電極 ６ 半田 ７ 半田ボール ８ 合成樹脂膜 1 Electronic Component 3 Lead (Electrode) 4 Printed Circuit Board 5 Electrode 6 Solder 7 Solder Ball 8 Synthetic Resin Film
Claims (1)
田付けした際にプリント基板の表面に生じる半田ボール
の除去方法であって、電子部品が半田付けされたプリン
ト基板の表面に合成樹脂を塗布して合成樹脂膜を形成す
ることにより、前記合成樹脂膜の内部に半田ボールを包
含させ、前記合成樹脂膜を前記プリント基板から剥ぎ取
ることを特徴とする半田ボールの除去方法。1. A method of removing a solder ball generated on a surface of a printed circuit board when an electrode of an electronic component is soldered to an electrode of the printed circuit board, wherein a synthetic resin is applied to a surface of the printed circuit board to which the electronic component is soldered. A method of removing a solder ball, comprising forming a synthetic resin film by coating to include a solder ball inside the synthetic resin film, and peeling the synthetic resin film from the printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31820492A JPH06164109A (en) | 1992-11-27 | 1992-11-27 | Method for removing solder ball |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31820492A JPH06164109A (en) | 1992-11-27 | 1992-11-27 | Method for removing solder ball |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH06164109A true JPH06164109A (en) | 1994-06-10 |
Family
ID=18096601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31820492A Pending JPH06164109A (en) | 1992-11-27 | 1992-11-27 | Method for removing solder ball |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06164109A (en) |
-
1992
- 1992-11-27 JP JP31820492A patent/JPH06164109A/en active Pending
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