JPH06140753A - Electronic circuit board - Google Patents

Electronic circuit board

Info

Publication number
JPH06140753A
JPH06140753A JP31267692A JP31267692A JPH06140753A JP H06140753 A JPH06140753 A JP H06140753A JP 31267692 A JP31267692 A JP 31267692A JP 31267692 A JP31267692 A JP 31267692A JP H06140753 A JPH06140753 A JP H06140753A
Authority
JP
Japan
Prior art keywords
chip component
land
square
electronic circuit
shape
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP31267692A
Other languages
Japanese (ja)
Inventor
Motoo Kumagai
元男 熊谷
Masayuki Ito
伊藤正幸
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP31267692A priority Critical patent/JPH06140753A/en
Publication of JPH06140753A publication Critical patent/JPH06140753A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To eliminate a shift of a chip component and an erected chip component or to make possible a soldering of a small chip component by a method wherein the form of a land of a printed-wiring board is formed into a square to the chip component on its inside and into the form of a semicircle combined with the square on its outside. CONSTITUTION:The form of a land 1 with a solder on a chip component 5 on a printed-wiring board, which is used as an electronic circuit board, is formed into a square inscribed a semicircle therein and into the form of a semicircle combine with the square. Or the form of a land 2 with a solder is formed into a forum lacking one part of a circle. In such a way, the form of a land with a solder is formed into a form of a combination of a square and a semicircle, whereby an erected chip component subsequent to a reflow and a misalignment of a chip component can be be significantly reduced. Moreover, an irregularity in a mounting process, such as an irregularity in printing, can be well absorbed.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明はチップ部品のハンダ付品
質の向上を目指した電子回路基板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic circuit board aimed at improving the soldering quality of chip parts.

【０００２】[0002]

【従来の技術】図３、図４は電子回路のチップ部品のハ
ンダ付ランドの形状を示した図で、図３はハンダ付ラン
ド３の形状が方形であり、図４はハンダ付ランド４の形
状が円形をしている。2. Description of the Related Art FIGS. 3 and 4 are views showing the shape of a soldered land of a chip part of an electronic circuit. FIG. 3 shows a square shape of the soldered land 3 and FIG. The shape is circular.

【０００３】従来、電子回路のチップ部品のハンダ付ラ
ンドの形状は、図３、図４に示すように方形または円形
であった。Conventionally, the shape of the soldered land of the chip part of the electronic circuit has been a square or a circle as shown in FIGS.

【０００４】[0004]

【発明が解決しようとする課題】近年、１００５チップ
部品（巾０．５ｍｍ、長さ１．０ｍｍ）等の小型部品が
電子回路基板にハンダ付にて搭載されるようになってき
た。In recent years, small components such as 1005 chip components (width 0.5 mm, length 1.0 mm) have been mounted on electronic circuit boards by soldering.

【０００５】この１００５チップ部品は従来、検査の主
役である人間の目では、検査が大変困難なサイズの部品
である。従来、１６０８チップ部品（巾０．８ｍｍ、長
さ１．６ｍｍ）のレベルのチップ部品のハンダ付時の欠
点、すなわち、ズレやチップ部品立ち（チップ部品の片
側が浮き上がる）等があり、１００５チップ部品におけ
るハンダ付工程では、その問題がさらに大きくクローズ
アップされてきた。Conventionally, the 1005 chip component is a component of a size that is very difficult to inspect by human eyes, which is the main character of the inspection. Conventionally, there is a defect when soldering a chip component of a level of 1608 chip component (width 0.8 mm, length 1.6 mm), that is, misalignment, chip component standing (one side of the chip component is lifted up), etc. In the soldering process for parts, the problem has been highlighted more greatly.

【０００６】本発明はかかる課題を解決するためになさ
れたもので、チップ部品のハンダ付けに際しては、ズ
レ、チップ部品立ちの無い、又は少ないハンダ付がなさ
れる電子回路基板を提供することを目的とする。The present invention has been made to solve the above problems, and it is an object of the present invention to provide an electronic circuit board in which there is no misalignment or chip component standing or little soldering when soldering chip components. And

【０００７】[0007]

【課題を解決するための手段】上記の目的を達成するた
めに、この発明の電子回路基板はハンダ付けするプリン
ト配線板のランド形状はチップ部品に対して内側が方形
でその外側に半円が合体された形状を有するものであ
る。In order to achieve the above object, the electronic circuit board of the present invention has a land shape of a printed wiring board to be soldered which is a square inside the chip part and a semicircle outside the chip part. It has a united shape.

【０００８】[0008]

【作用】本発明では、ハンダ付のランド形状を方形と半
円を組み合わせた形状にすることにより、リフロー後の
チップ部品立ち、チップ部品ズレが大幅に減少すること
が判明した。In the present invention, it has been found that by forming the land shape with solder into a shape combining a square and a semicircle, the chip component standing after the reflow and the chip component displacement are significantly reduced.

【０００９】[0009]

【実施例】図１は本発明の一実施例である電子回路基板
としてのプリント配線板におけるチップ部品のハンダ付
けランドの形状を示す平面図であり、その形状は半円を
内接させた方形と半円を合体させたものである。また、
図２はハンダ付ランドの他の形状を示した平面図で、円
形の一部を切欠いた形状を示した図である。1 is a plan view showing the shape of a soldering land of a chip component in a printed wiring board as an electronic circuit board according to an embodiment of the present invention, the shape being a square with a semicircle inscribed therein. And a half circle are combined. Also,
FIG. 2 is a plan view showing another shape of the soldered land, which is a shape in which a part of a circle is cut out.

【００１０】図１、図２において１，２はそれぞれハン
ダ付けランドを示している。In FIGS. 1 and 2, reference numerals 1 and 2 denote soldering lands, respectively.

【００１１】いま、図１，２，３に示すようなプリント
配線板のハンダ付けランドに、図５に示す形の１００５
チップ部品をリフローハンダ付けした。図５において、
５はチップ部品、５ａはこのチップ部品のハンダ付け電
極である。Now, in the soldering land of the printed wiring board as shown in FIGS. 1, 2 and 3, 1005 of the shape shown in FIG.
The chip parts were reflow soldered. In FIG.
Reference numeral 5 is a chip component, and 5a is a soldering electrode for this chip component.

【００１２】ハンダ付けは１５０μｔのメタルマスク
で、直径０．５ｍｍの円形で共晶のハンダペーストをプ
リント配線板の各々のハンダ付けランド上に図６に示す
時間−温度特性で印刷した後、１００５チップを前後も
しくは左右に各０．２ｍｍズラして、各々４０００個ず
つマウントした。Soldering is performed with a metal mask of 150 μt, and a circular eutectic solder paste having a diameter of 0.5 mm is printed on each soldering land of the printed wiring board with time-temperature characteristics shown in FIG. The chips were deviated 0.2 mm forward and backward or left and right, and 4,000 chips each were mounted.

【００１３】その結果を図７に示す。図７は各ハンダ付
けランド１，２，３に対して前後に０．２ｍｍ、左右に
０．２ｍｍズラしてチップ部品４０００個をハンダ付け
した場合の欠陥品の発生確率を示した図である。図７の
結果に見られるように、本実施例によるハンダ付ランド
形状（特に図１）は、いずれの項目においても、好まし
い結果を示しており、本ランド形状の秀れていることが
解る。The results are shown in FIG. FIG. 7 is a diagram showing the probability of occurrence of defective products when each of the soldering lands 1, 2, and 3 is displaced 0.2 mm in the front and back and 0.2 mm in the left and right to solder 4000 chip parts. . As can be seen from the results of FIG. 7, the soldered land shape according to the present embodiment (particularly FIG. 1) shows favorable results in any item, and it is understood that the land shape is excellent.

【００１４】[0014]

【発明の効果】以上説明したとおり、本発明のチップ部
品ハンダ付けランド形状は、従来の形状と比べると、マ
ウントズレ、又は、印刷のバラツキ等の実装工程中のバ
ラツキをよく吸収する形態であることがわかる。As described above, the chip part soldering land shape of the present invention is a mode in which variations in the mounting process such as mount deviation or printing variations are well absorbed as compared with the conventional shape. I understand.

【００１５】１つの電子回路基板に数百個のオーダーで
使用されるチップ部品の各抵抗及び容量としては従来例
の４２／４０００という確率の欠陥ハンダ付部品の存在
は、大変大きな値であり、従って、本発明の電子回路基
板のハンダ付品質の向上は目ざましいものである。The existence of defective soldered parts having a probability of 42/4000 of the conventional example as the resistance and capacitance of the chip parts used on the order of several hundreds on one electronic circuit board is a very large value, Therefore, the improvement of the soldering quality of the electronic circuit board of the present invention is remarkable.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例である電子回路基板としての
プリント配線板におけるチップ部品のハンダ付ランドの
形状を示す平面図である。FIG. 1 is a plan view showing the shape of a soldered land of a chip component in a printed wiring board as an electronic circuit board that is an embodiment of the present invention.

【図２】ハンダ付ランドの他の形状を示した平面図であ
る。FIG. 2 is a plan view showing another shape of the land with solder.

【図３】従来のハンダ付ランドの形状（方形）を示した
図である。FIG. 3 is a view showing a shape (square) of a conventional soldered land.

【図４】従来のハンダ付ランドの形状（円形）を示した
図である。FIG. 4 is a view showing a shape (circular shape) of a conventional land with solder.

【図５】本発明の実施例に用いるチップ部品を示した側
断面図及び平面図である。5A and 5B are a side sectional view and a plan view showing a chip part used in an example of the present invention.

【図６】本発明の半田付けを行った際の時間−温度特性
を示す図である。FIG. 6 is a diagram showing time-temperature characteristics when the soldering of the present invention is performed.

【図７】本発明を実施した場合のチップ部品のハンダ付
の成果を比較した図である。FIG. 7 is a diagram comparing results of soldering of chip components when the present invention is implemented.

【符号の説明】[Explanation of symbols]

１，２，３，４ ハンダ付ランド ５ チップ部品 ５ａ チップ部品のハンダ付電極 1,2,3,4 Solder land 5 Chip parts 5a Solder electrodes for chip parts

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 一対のハンダ付電極を有する複数のチッ
プ部品をプリント配線板にハンダ付けする電子回路基板
において、ハンダ付けするプリント配線板のランド形状
はチップ部品に対して内側が方形でその外側に半円が合
体された形状を有することを特徴とする電子回路基板。1. In an electronic circuit board for soldering a plurality of chip components having a pair of soldered electrodes to a printed wiring board, the land shape of the printed wiring board to be soldered is rectangular inside the chip components and outside thereof. An electronic circuit board having a shape in which semicircles are united with each other.
JP31267692A 1992-10-29 1992-10-29 Electronic circuit board Pending JPH06140753A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31267692A JPH06140753A (en) 1992-10-29 1992-10-29 Electronic circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31267692A JPH06140753A (en) 1992-10-29 1992-10-29 Electronic circuit board

Publications (1)

Publication Number Publication Date
JPH06140753A true JPH06140753A (en) 1994-05-20

Family

ID=18032087

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31267692A Pending JPH06140753A (en) 1992-10-29 1992-10-29 Electronic circuit board

Country Status (1)

Country Link
JP (1) JPH06140753A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057467A (en) * 1999-08-18 2001-02-27 Sony Corp Printed wiring board
EP1940207A2 (en) 2006-12-28 2008-07-02 Robert Bosch Gmbh Electric device with a carrier element with a minimum of one special connecting surface and a component mounted on the surface

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001057467A (en) * 1999-08-18 2001-02-27 Sony Corp Printed wiring board
EP1940207A2 (en) 2006-12-28 2008-07-02 Robert Bosch Gmbh Electric device with a carrier element with a minimum of one special connecting surface and a component mounted on the surface
DE102006062494A1 (en) 2006-12-28 2008-07-03 Robert Bosch Gmbh Electric device with a carrier element with at least one special pad and a surface mounted device

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