JPH06140453A - Wire bonding method - Google Patents
Wire bonding methodInfo
- Publication number
- JPH06140453A JPH06140453A JP4154879A JP15487992A JPH06140453A JP H06140453 A JPH06140453 A JP H06140453A JP 4154879 A JP4154879 A JP 4154879A JP 15487992 A JP15487992 A JP 15487992A JP H06140453 A JPH06140453 A JP H06140453A
- Authority
- JP
- Japan
- Prior art keywords
- wire bonding
- bonding
- heads
- bond
- bonds
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48471—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area being a ball bond, i.e. wedge-to-ball, reverse stitch
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10161—Shape being a cuboid with a rectangular active surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はワイヤーボンディング方
法に関する。FIELD OF THE INVENTION The present invention relates to a wire bonding method.
【0002】[0002]
【従来の技術】従来のワイヤーボンディング方法につい
て図2を用いて説明する。図2(c)は複数のワイヤー
ボンディング用ヘッドを有する設備のブロック図であ
り、図2(a),(b)はそれぞれ図2(c)のNO.
1ボンディング用ヘッド29及びNO.2ボンディング
用ヘッド30に対応するボンディング図である。2. Description of the Related Art A conventional wire bonding method will be described with reference to FIG. 2C is a block diagram of equipment having a plurality of wire bonding heads, and FIGS. 2A and 2B are NO.
1 bonding head 29 and NO. 2 is a bonding diagram corresponding to the two-bonding head 30. FIG.
【0003】マウントアイランド1上の半導体素子2の
電極3〜10とそれぞれに対応するリード11〜18と
をワイヤー19〜26で接続している。The electrodes 3 to 10 of the semiconductor element 2 on the mount island 1 and the corresponding leads 11 to 18 are connected by wires 19 to 26.
【0004】図2(a),(b),(c)に示すよう
に、従来のワイヤーボンディング方法では、複数のボン
ディング用ヘッドを有する設備においても、各ボンディ
ング用ヘッドがそれぞれ同じように、第1ボンドである
ボールボンドをペレット側に、第2ボンドであるウェッ
ジボンドをリード側にするというボンディングを行って
いた。As shown in FIGS. 2 (a), 2 (b) and 2 (c), in the conventional wire bonding method, even in equipment having a plurality of bonding heads, each bonding head has the same structure. Bonding has been performed in which the ball bond, which is one bond, is on the pellet side, and the wedge bond, which is the second bond, is on the lead side.
【0005】[0005]
【発明が解決しようとする課題】この従来のワイヤーボ
ンディング方法では、半導体装置製造の合理化に伴い、
今後さらに増加する複数のワイヤーボンディング用ヘッ
ドを有する製造ラインあるいは設備において、ワイヤー
ボンディングに起因する品質事故が発生した場合、半導
体装置とのその半導体装置を製造したワイヤーボンディ
ング用ヘッドとの対応がつかない為、その調査に莫大な
労力と時間を費やするという大きな問題点があった。In this conventional wire bonding method, the semiconductor device manufacturing is rationalized,
In a production line or equipment having a plurality of wire bonding heads, which will further increase in the future, when a quality accident occurs due to wire bonding, the semiconductor device and the wire bonding head that manufactured the semiconductor device cannot correspond to each other. Therefore, there was a big problem that a huge amount of labor and time were spent on the investigation.
【0006】[0006]
【課題を解決するための手段】本発明のワイヤーボンデ
ィング方法は複数のワイヤーボンディング用ヘッドを有
する製造ラインあるいは設備に於いて、半導体装置とそ
の半導体装置を製造したワイヤーボンディング用ヘッド
との対応を可能にするワイヤーボンディング方法を提供
するものである。According to the wire bonding method of the present invention, in a manufacturing line or equipment having a plurality of wire bonding heads, a semiconductor device and a wire bonding head that manufactures the semiconductor device can be handled. The present invention provides a wire bonding method.
【0007】すなわち、通常のワイヤーボンディング方
法では、第1ボンドであるボールボンドをペレット側
に、第2ボンドであるウェッジボンドをリード側に行う
ことによりワイヤーリングを完成するが、本発明では複
数のワイヤーボンディング用ヘッドそれぞれの特定のワ
イヤーボンディングに関して、逆ボンディング、つまり
第1ボンドであるボールボンドをリード側に第2ボンド
であるウェッジボンドをペレット側にするというワイヤ
ーボンディング方法である。That is, in the ordinary wire bonding method, the wire bonding is completed by performing the ball bond as the first bond on the pellet side and the wedge bond as the second bond on the lead side. Regarding specific wire bonding of each wire bonding head, it is a reverse bonding, that is, a wire bonding method in which a ball bond which is a first bond is a lead side and a wedge bond which is a second bond is a pellet side.
【0008】[0008]
【実施例】次に本発明について図面を参照して説明す
る。The present invention will be described below with reference to the drawings.
【0009】図1(a),(b)は本発明の一実施例の
ワイヤーボンディング方法のボンディング図であり、図
1(c)はそれに対応する複数のワイヤーボンディング
用ヘッドを有する設備のブロック図である。1A and 1B are bonding diagrams of a wire bonding method according to an embodiment of the present invention, and FIG. 1C is a block diagram of equipment having a plurality of wire bonding heads corresponding thereto. Is.
【0010】図1(a)は図1(c)のNO.1ワイヤ
ーボンディング用ヘッド29に対応するボンディング図
であり、マウントアイランド1上の半導体素子2の電極
3〜10が、それぞれに対応するリード11〜18に、
ワイヤー19〜26を介して接続されている。そのなか
で電極3とリード11のワイヤーボンディングに関して
のみ第1ボンドであるボールボンドをリード側に第2ボ
ンドであるウェッジボンドをペレット側にすることによ
り外観上でNO.1ボンディング用ヘッド29との対応
が可能となる。FIG. 1 (a) shows the NO. FIG. 11 is a bonding diagram corresponding to the 1-wire bonding head 29, in which the electrodes 3 to 10 of the semiconductor element 2 on the mount island 1 are connected to the leads 11 to 18 respectively corresponding thereto.
It is connected via wires 19 to 26. Among them, only with respect to wire bonding between the electrode 3 and the lead 11, the ball bond, which is the first bond, is set to the lead side, and the wedge bond, which is the second bond, is set to the pellet side. It is possible to correspond to one bonding head 29.
【0011】また図1(b)は図1(c)のNO.2ワ
イヤーボンディング用ヘッド30に対応するボンディン
グ図であり、そのなかで電極4とリード12のワイヤー
ボンディングに関してのみ、第1ボンドであるボールボ
ンドをリード側に第2ボンドであるウェッジボンドをペ
レット側にすることにより、外観上でNO.2ワイヤー
ボンディング用ヘッド30との対応が可能となる。Further, FIG. 1 (b) shows the NO. FIG. 6 is a bonding diagram corresponding to the two-wire bonding head 30, in which only the wire bonding of the electrode 4 and the lead 12 is such that the ball bond as the first bond is on the lead side and the wedge bond as the second bond is on the pellet side. By doing so, the appearance is NO. Correspondence with the two-wire bonding head 30 is possible.
【0012】なお、本実施例では複数のワイヤーボンデ
ィング用ヘッドを有する設備について説明したが、複数
のボンダー組込んだ製造ラインについても同様である。Although the equipment having a plurality of wire bonding heads has been described in the present embodiment, the same applies to a manufacturing line incorporating a plurality of bonders.
【0013】[0013]
【発明の効果】以上説明したように本発明は、複数のワ
イヤーボンディング用ヘッドを有する設備に於いて、そ
れぞれのボンダーに対応した特定のワイヤーに関し、第
1ボンドでありボールボンドをリード側に第2ボンドで
あるウェッジボンドをペレット側にボンディングするこ
とにより、半導体装置とその半導体装置を製造したワイ
ヤーボンディング用ヘッドとの対応が可能となり、ワイ
ヤーボンディングに起因する品質事故が発生した場合、
その対象ワイヤーボンディング用ヘッドを直に特定する
ことが出来るという効果を有する。As described above, the present invention relates to a specific wire corresponding to each bonder in a facility having a plurality of wire bonding heads, and the first bond is the ball bond on the lead side. By bonding a wedge bond, which is two bonds, to the pellet side, it becomes possible to deal with the semiconductor device and the wire bonding head that manufactured the semiconductor device, and when a quality accident due to wire bonding occurs,
The effect is that the target wire bonding head can be directly specified.
【図1】本発明の一実施例のワイヤーボンディング方法
によるボンディング図とそれに対応する複数のワイヤー
ボンディング用ヘッドを有する設備のブロック図。FIG. 1 is a bonding diagram of a wire bonding method according to an embodiment of the present invention and a block diagram of equipment having a plurality of wire bonding heads corresponding to the bonding diagram.
【図2】従来のワイヤーボンディング方法によるボンデ
ィング図とそれに対応する複数のワイヤーボンディング
用ヘッドを有する設備のブロック図。FIG. 2 is a block diagram of a bonding diagram according to a conventional wire bonding method and a facility having a plurality of wire bonding heads corresponding thereto.
1 マウントアイランド 2 半導体素子 3〜10 電極 11〜18 リード 19〜26 ワイヤー 27 マウンター 28 キュア装置 29 NO.1ワイヤーボンディング用ヘッド 30 NO.2ワイヤーボンディング用ヘッド 31 封入機 1 mount island 2 semiconductor element 3 to 10 electrode 11 to 18 lead 19 to 26 wire 27 mounter 28 cure device 29 NO. 1 wire bonding head 30 NO. 2 Wire bonding head 31 encapsulation machine
Claims (1)
有する設備あるいは製造ラインでワイヤーボンディング
を行う方法において、前記複数のワイヤーボンディング
用ヘッドのそれぞれは、一個の半導体装置の複数のワイ
ヤーボンディングのうち特定のワイヤーボンディングに
おいて第1ボンドであるボールボンドをリード側に第2
ボンドであるウエッジボンドを半導体ペレット側に行う
ようにし、これにより半導体装置とその半導体装置を製
造したワイヤーボンディング用ヘッドとの対応を可能に
したことを特徴とするワイヤーボンディング方法。1. A method of performing wire bonding in an equipment or a production line having a plurality of wire bonding heads, wherein each of the plurality of wire bonding heads is a specific wire among a plurality of wire bondings of one semiconductor device. In bonding, the ball bond, which is the first bond, is secondly bonded to the lead side.
A wire bonding method characterized in that a wedge bond, which is a bond, is formed on the side of the semiconductor pellet, thereby enabling correspondence between the semiconductor device and the wire bonding head that manufactured the semiconductor device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4154879A JPH06140453A (en) | 1992-06-15 | 1992-06-15 | Wire bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4154879A JPH06140453A (en) | 1992-06-15 | 1992-06-15 | Wire bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH06140453A true JPH06140453A (en) | 1994-05-20 |
Family
ID=15593947
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4154879A Withdrawn JPH06140453A (en) | 1992-06-15 | 1992-06-15 | Wire bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH06140453A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2718794A1 (en) * | 1994-04-16 | 1995-10-20 | Stihl Andreas | Starting aid device on a membrane carburettor. |
US6112972A (en) * | 1996-12-19 | 2000-09-05 | Texas Instruments Incorporated | Wire bonding with capillary realignment |
US11408382B2 (en) | 2017-03-27 | 2022-08-09 | Kohler Co. | Carburetor drain |
-
1992
- 1992-06-15 JP JP4154879A patent/JPH06140453A/en not_active Withdrawn
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2718794A1 (en) * | 1994-04-16 | 1995-10-20 | Stihl Andreas | Starting aid device on a membrane carburettor. |
US6112972A (en) * | 1996-12-19 | 2000-09-05 | Texas Instruments Incorporated | Wire bonding with capillary realignment |
US11408382B2 (en) | 2017-03-27 | 2022-08-09 | Kohler Co. | Carburetor drain |
US11614060B2 (en) | 2017-03-27 | 2023-03-28 | Kohler Co. | Carburetor drain |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990831 |