JPH06125155A - Metal-base circuit board - Google Patents
Metal-base circuit boardInfo
- Publication number
- JPH06125155A JPH06125155A JP27319192A JP27319192A JPH06125155A JP H06125155 A JPH06125155 A JP H06125155A JP 27319192 A JP27319192 A JP 27319192A JP 27319192 A JP27319192 A JP 27319192A JP H06125155 A JPH06125155 A JP H06125155A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- circuit board
- metal plate
- base circuit
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電気機器、通信機、自動
車等に用いられる金属ベース回路基板に関するものであ
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a metal base circuit board used for electric equipment, communication equipment, automobiles and the like.
【０００２】[0002]
【従来の技術】金属ベース回路基板は熱伝導性が良好な
特徴を有し、実装部品の発熱を放熱する事を主目的とし
て使用されている。金属ベース回路基板の金属板の材質
はアルミニウム、銅、鉄、珪素鋼板、等が使用されてい
る。従来、この金属板の絶縁層と反対側の面（以下、裏
面という）および側面は使用材質がそのまま露出してい
た。この金属ベース回路基板はその裏面を放熱フィン、
ラジエータ等に取り付けて使用されていた。2. Description of the Related Art A metal base circuit board has a characteristic of good thermal conductivity and is used mainly for radiating the heat generated by mounted components. The material of the metal plate of the metal base circuit board is aluminum, copper, iron, silicon steel plate, or the like. Conventionally, the material used is exposed as it is on the surface (hereinafter referred to as the back surface) and the side surface on the side opposite to the insulating layer of the metal plate. This metal-based circuit board has its backside radiating fins,
It was used by being attached to a radiator, etc.
【０００３】[0003]
【発明が解決しようとする課題】しかし、上述の方法に
おいては、次のような問題点があった。放熱を効果的に
行う為には金属ベース回路基板の裏面を放熱フィン、ラ
ジエータ等に隙間無く取り付ける必要がある。しかしな
がら、従来は金属ベース回路基板をボルト等で放熱フィ
ンに取り付けていた為に、基板の反り等の影響で密着性
が悪く熱伝導が低下するという問題があった。However, the above-mentioned method has the following problems. In order to effectively dissipate heat, it is necessary to attach the back surface of the metal base circuit board to a heat dissipating fin, a radiator or the like without any gap. However, conventionally, since the metal base circuit board is attached to the heat radiation fins with bolts or the like, there is a problem that the adhesion is poor and the heat conduction is lowered due to the influence of the warp of the board or the like.
【０００４】また、金属板に導電回路からアース接続を
するには、従来はエンドミル等で絶縁層を部分的に切削
し除去したのち、超音波ワイヤーボンディングするか、
貫通穴にピンを挿入カシメ固定する等の方法がとられて
いた。しかしこれらの方法は非常に生産性が低く加工コ
ストが高くなる原因となっていた。Further, in order to make a ground connection from a conductive circuit to a metal plate, conventionally, an insulating layer is partially cut and removed by an end mill or the like, and then ultrasonic wire bonding is performed.
A method such as inserting a pin into the through hole and fixing by caulking has been adopted. However, these methods have been a cause of extremely low productivity and high processing cost.
【０００５】金属板が銅である銅ベース基板では半田接
続が可能で、放熱フィンの半田付けや、貫通穴部とパタ
ーンの半田接続も可能であるが、銅表面は非常に酸化腐
食しやすく、半田接続の信頼性に問題があった。A copper base substrate having a metal plate made of copper can be connected by soldering, and a radiating fin can be soldered or a through hole and a pattern can be connected by soldering. However, the copper surface is easily oxidized and corroded, There was a problem with the reliability of the solder connection.
【０００６】本発明はかかる問題点に鑑みてなされたも
のであって、金属ベース回路基板の金属板の裏面及び側
面にニッケルめっきまたは金めっきを施すことにより、
放熱フィンを金属ベース回路基板の金属板に密着して容
易に取り付けるけることができ、また導電回路とのアー
ス接続も容易に半田接続することができ、且つ耐腐食性
に優れた金属ベース回路基板を提供することを目的とす
るものである。The present invention has been made in view of the above problems, and by applying nickel plating or gold plating to the back and side surfaces of the metal plate of the metal base circuit board,
A metal base circuit board that can be easily attached by closely attaching the radiation fin to the metal plate of the metal base circuit board, and can also be easily soldered to the ground connection with the conductive circuit and has excellent corrosion resistance. It is intended to provide.
【０００７】[0007]
【課題を解決するための手段】本発明の特徴は、金属板
上に絶縁層及び導電性金属箔を順に積層した積層物の導
電性金属箔をエッチングして導電回路を形成した金属ベ
ース回路基板において、前記金属板の絶縁層と反対側の
表面がニッケルめっきまたは金めっきされてなる金属ベ
ース回路基板であり、また前記金属板の側面がニッケル
めっきまたは金めっきされてなる金属ベース回路基板で
ある。そしてまた、前記導電回路の表面および前記金属
板の裏面がニッケルめっきまたは金めっきされてなるこ
とを特徴とする金属ベース回路基板である。A feature of the present invention is that a metal base circuit board in which a conductive circuit is formed by etching a conductive metal foil of a laminate in which an insulating layer and a conductive metal foil are sequentially laminated on a metal plate In, the surface of the metal plate opposite to the insulating layer is a metal base circuit board plated with nickel or gold, and the side surface of the metal plate is a metal base circuit board plated with nickel or gold. . A front surface of the conductive circuit and a back surface of the metal plate are nickel-plated or gold-plated.
【０００８】[0008]
【作用および実施例】以下、本発明の詳細について説明
する。図１は、本発明の金属ベース回路基板の概略図で
あり、金属板１に絶縁層２を介して導電性金属箔を貼着
して得られた導電回路３が形成されている。（ａ）は概
略平面図、（ｂ）は金属板１の裏面のみにめっき４を施
した概略断面図、（ｃ）は金属板１の裏面と側面にめっ
き４を施した概略断面図である。OPERATION AND EXAMPLES The details of the present invention will be described below. FIG. 1 is a schematic view of a metal base circuit board of the present invention, in which a conductive circuit 3 obtained by adhering a conductive metal foil to a metal plate 1 via an insulating layer 2 is formed. (A) is a schematic plan view, (b) is a schematic sectional view in which only the back surface of the metal plate 1 is plated 4, and (c) is a schematic sectional view in which the back surface and the side surface of the metal plate 1 are plated 4. .
【０００９】金属板１は銅板、鉄板、アルミニウム板、
真鍮板、ステンレス板等のいずれも採用でき、通常の板
厚は０．１〜５．０ｍｍの範囲のものを用いることがで
きる。The metal plate 1 is a copper plate, an iron plate, an aluminum plate,
A brass plate, a stainless plate, or the like can be used, and a plate having a normal plate thickness of 0.1 to 5.0 mm can be used.
【００１０】金属板１の裏面には、本発明でいうニッケ
ルめっきまたは金めっき４が施されている。ニッケルめ
っきまたは金めっき４は印刷サイズ等の大板の状態で、
効率良く実施することができる。めっきの厚みは特に制
限は無いが通常０．１〜５．０μｍの範囲で使用され
る。On the back surface of the metal plate 1, nickel plating or gold plating 4 according to the present invention is applied. Nickel plating or gold plating 4 is a large plate such as printing size,
It can be implemented efficiently. The thickness of plating is not particularly limited, but it is usually used in the range of 0.1 to 5.0 μm.
【００１１】金属板の側面にもニッケルめっきまたは金
めっきが必要な場合には、金属ベース回路基板を個片に
分割後に、ニッケルめっきまたは金めっきを施せば良
い。このようにニッケルめっきまたは金めっきは必要に
応じて選択的に効率よく実施可能である。ニッケルめっ
きの厚さは１〜５μｍ程度が好ましく、また金めっきの
厚さは０．０１〜２．０μｍ程度が好ましく、ワイヤー
ボンディングするときは０．１μｍが好適である。When nickel plating or gold plating is also required on the side surface of the metal plate, the metal base circuit board may be divided into individual pieces and then nickel plating or gold plating may be applied. Thus, nickel plating or gold plating can be selectively and efficiently carried out as needed. The thickness of nickel plating is preferably about 1 to 5 μm, the thickness of gold plating is preferably about 0.01 to 2.0 μm, and 0.1 μm is suitable for wire bonding.
【００１２】また、金属ベース回路基板上の導電回路の
表面および金属板の裏面がニッケルめっきまたは金めっ
きされてなる金属ベース回路基板は、金属板および導電
回路の表面がともにアルミニウムまたはアルミニウム合
金である時は、一工程で同時にニッケルめっきまたは金
めっきすることができ、効率よく目的とする金属ベース
回路基板を得ることができる。Further, in the metal base circuit board in which the front surface of the conductive circuit and the back surface of the metal plate on the metal base circuit board are nickel-plated or gold-plated, the surfaces of the metal plate and the conductive circuit are both aluminum or aluminum alloy. In some cases, nickel plating or gold plating can be performed at the same time in one step, and the target metal-based circuit board can be efficiently obtained.
【００１３】導電回路３となる金属箔としては、銅箔、
アルミニウム箔、真鍮箔、ニッケル箔あるいはこれらの
接合箔等のいずれも採用できる。導電回路の表面が銅、
アルミニウムまたはその他の金属のうち、二種以上の材
質で形成されている時は二工程以上の工程でめっきしな
ければならない。As the metal foil which becomes the conductive circuit 3, copper foil,
Any of aluminum foil, brass foil, nickel foil, or a bonding foil thereof can be used. The surface of the conductive circuit is copper,
If aluminum or other metal is formed of two or more materials, plating must be performed in two or more steps.
【００１４】絶縁層２としては、絶縁性を有する材質で
あればいずれも採用でき、例えばエポキシ樹脂、フェノ
ール樹脂、不飽和ポリエステル樹脂、ポリイミド樹脂等
をガラス布に含浸させたもの、無機フィラーを充填した
もの、樹脂層のみで形成したもの、フィルム状に接着し
たものなどがある。As the insulating layer 2, any material having an insulating property can be adopted, for example, a glass cloth impregnated with epoxy resin, phenol resin, unsaturated polyester resin, polyimide resin or the like, or filled with an inorganic filler. There are those formed by only the resin layer, those formed only by the resin layer, and those adhered in a film shape.
【００１５】[0015]
【実施例１】次に、本発明の実施例について図面に基づ
き説明する。図２に示すように、金属板１として板厚
１．５ｍｍのアルミニウム板に厚さ８０μｍの絶縁層２
を介して厚さ３５μｍの箔を接着し、エッチング処理し
て導電回路３を形成した。Embodiment 1 Next, an embodiment of the present invention will be described with reference to the drawings. As shown in FIG. 2, a metal plate 1 is an aluminum plate having a thickness of 1.5 mm and an insulating layer 2 having a thickness of 80 μm.
A foil having a thickness of 35 μm was adhered to the substrate via etching, and the conductive circuit 3 was formed by etching.
【００１６】この金属ベース回路基板の金属板１の裏面
は本発明でいうニッケルめっき４が厚さ３．０μｍで施
されているThe back surface of the metal plate 1 of this metal base circuit board is coated with nickel plating 4 according to the present invention with a thickness of 3.0 μm.
【００１７】そして、この裏面のニッケルめっき４を利
用して半田５を介して放熱フィン６を取り付けることが
できた。The radiating fins 6 could be attached via the solder 5 by using the nickel plating 4 on the back surface.
【００１８】[0018]
【実施例２】さらに、金属板１の側面にもニッケルめっ
き４を施した例を説明する。図３に示すように、金属基
板１として板厚１．５ｍｍのアルミニウム板に厚さ８０
μｍの絶縁層２を介して厚さ３５μｍの銅箔を接着し、
エッチング処理して導電回路３を形成した。Example 2 Further, an example in which the side surface of the metal plate 1 is also plated with nickel 4 will be described. As shown in FIG. 3, a metal substrate 1 is an aluminum plate having a thickness of 1.5 mm and a thickness of 80.
35 μm thick copper foil is bonded through the insulating layer 2 of μm,
The conductive circuit 3 was formed by etching.
【００１９】金属板１の裏面及び側面にニッケルめっき
４が厚さ３．０μｍで施されている。Nickel plating 4 having a thickness of 3.0 μm is applied to the back and side surfaces of the metal plate 1.
【００２０】そして、金属板１の側面のニッケルめっき
４を利用して半田５を介して導電回路３と金属板１を電
気的に接続することができた。これとは別に、金属板１
の裏面及び側面のそれぞれの一部に０．１μm の厚さの
金めっきが施されているものを作製した。ニッケルめっ
きを施したものと同様金めっき４を利用して半田５を介
して導電回路３と金属板１を電気的に接続することがで
きた。It was possible to electrically connect the conductive circuit 3 and the metal plate 1 via the solder 5 by using the nickel plating 4 on the side surface of the metal plate 1. Apart from this, metal plate 1
A part of each of the back surface and the side surface of was subjected to gold plating with a thickness of 0.1 μm was manufactured. It was possible to electrically connect the conductive circuit 3 and the metal plate 1 through the solder 5 by using the gold plating 4 as in the case of nickel plating.
【００２１】[0021]
【実施例３】さらに、金属板１の裏面および側面、なら
びに導電回路３の表面にも効率よくニッケルめっき４を
施したもの、さらにその上に金めっきを施した例を説明
する。Third Embodiment Further, an example will be described in which the back surface and the side surface of the metal plate 1 and the surface of the conductive circuit 3 are efficiently plated with nickel 4, and further gold plating is applied thereon.
【００２２】図４に示すように、金属板１として板厚
１．５ｍｍのアルミニウム板に厚さ８０μm の絶縁層２
を介して、厚さ４０μm のアルミニウム箔と厚さ１０μ
m の銅箔とを接合した接合箔をアルミニウム箔を上にし
て接着し、エッチング処理して導電回路を大板に複数個
面付け形成した。As shown in FIG. 4, a metal plate 1 is an aluminum plate having a thickness of 1.5 mm and an insulating layer 2 having a thickness of 80 μm.
Through the aluminum foil of thickness 40μm and thickness 10μ
A copper foil of m 2 was bonded to the bonding foil with the aluminum foil facing upward, and an etching treatment was performed to form a plurality of conductive circuits on a large plate.
【００２３】そして、この大板から多数の個片に分割し
た金属ベース回路基板の金属板１の裏面、側面および導
電回路３の表面にニッケルめっき４を３μｍ施した。さ
らに別に、同様の操作で作製した前記ニッケルめっきを
施した金属ベース回路基板の導電回路の表面、金属板の
側面および裏面のそれぞれの一部表面に金めっきを０．
１μｍ施したものを作製した。Then, nickel plating 4 was applied to a thickness of 3 μm on the back and side surfaces of the metal plate 1 of the metal base circuit board divided into a large number of pieces from this large plate and the surface of the conductive circuit 3. Separately, gold plating is applied to the surface of the conductive circuit of the nickel-plated metal base circuit board prepared by the same operation, and the partial surfaces of the side surface and the back surface of the metal plate.
One having a thickness of 1 μm was produced.
【００２４】本実施例においては、ニッケルめっきを施
す表面が同一材質のアルミニウムで構成されているため
に、ニッケルめっき加工を一括して実施可能であり、極
めて効率よく、かつ高品質なニッケルめっきを施すこと
ができた。In this embodiment, since the surfaces to be nickel-plated are made of aluminum of the same material, the nickel-plating processing can be carried out all at once, and extremely efficient and high-quality nickel plating is possible. I was able to give it.
【００２５】[0025]
【発明の効果】本発明の金属ベース回路基板によれば、
金属板の裏面にニッケルめっきまたは金めっきが施され
ているので放熱フィンを隙間なく、容易に半田接合で
き、放熱性の優れた実装部品を得ることが可能となっ
た。これにより、金属ベース回路基板本来の目的である
熱伝導が確実に行われ、搭載された電子素子の発熱によ
る温度の上昇を防止でき、極めて信頼性の高い電子部品
を構成することが可能となった。According to the metal base circuit board of the present invention,
Since the back surface of the metal plate is nickel-plated or gold-plated, the radiation fins can be easily solder-joined without a gap, and it is possible to obtain a mounted component having excellent heat radiation. As a result, the heat conduction, which is the original purpose of the metal base circuit board, is reliably performed, the temperature rise due to the heat generation of the mounted electronic element can be prevented, and it becomes possible to construct an extremely reliable electronic component. It was
【００２６】さらに、側面にも裏面と同時にニッケルめ
っきまたは金めっきを施すことにより、導電回路と金属
板を半田接合で容易に電気的に接続することができる。
これにより、従来行われていた超音波ワイヤーボンディ
ングやピン挿入カシメ等の煩雑な工程を省略することが
でき、作業効率が良く信頼性の高い金属ベース回路基板
が得られた。Furthermore, the conductive circuit and the metal plate can be easily electrically connected by soldering by plating the side surface with nickel or gold at the same time as the back surface.
As a result, complicated processes such as ultrasonic wire bonding and pin insertion caulking that have been performed conventionally can be omitted, and a metal base circuit board with good work efficiency and high reliability can be obtained.
【図１】図１（ａ）は、本発明の一例を示す金属ベース
回路基板の平面図、（ｂ）は本発明の一例を示す金属板
の裏面にＮｉめっきを施した金属ベース回路基板の概略
断面図、（Ｃ）は本発明の一例を示す、金属板の裏面と
側面にＮｉめっきを施した金属ベース回路基板の概略断
面図をそれぞれ示す。FIG. 1 (a) is a plan view of a metal base circuit board showing an example of the present invention, and FIG. 1 (b) is a metal base circuit board having a back surface of a metal plate plated with Ni showing an example of the present invention. FIG. 3C is a schematic cross-sectional view showing an example of the present invention, showing a schematic cross-sectional view of a metal base circuit board in which a back surface and a side surface of a metal plate are plated with Ni.
【図２】図２は、本発明の一例を示す金属ベース回路基
板の裏面に半田接合で放熱フィンを取り付けた概略断面
図を示す。FIG. 2 is a schematic cross-sectional view in which a heat radiation fin is attached to the back surface of a metal base circuit board showing an example of the present invention by soldering.
【図３】図３は、本発明の一例を示す金属板の側面およ
び裏面に施されたＮｉめっきに半田接合を介して導電回
路と金属板の側面を電気的に接続した金属ベース回路基
板の概略断面図を示す。FIG. 3 shows an example of the present invention of a metal base circuit board in which a conductive circuit and a side surface of a metal plate are electrically connected to each other through a solder joint to Ni plating applied to a side surface and a back surface of the metal plate. A schematic sectional drawing is shown.
【図４】図４は、本発明の一例を示す金属板の材質と導
電回路の表面材質が同一材質で構成されたもので、金属
板の裏面および側面、ならびに導電回路の表面にニッケ
ルめっきを施した金属ベース回路基板の概略断面図を示
す。FIG. 4 is a view showing an example of the present invention in which the metal plate and the surface of the conductive circuit are made of the same material, and nickel plating is applied to the back and side surfaces of the metal plate and the surface of the conductive circuit. The schematic sectional drawing of the applied metal base circuit board is shown.
１ ：金属板 ２ ：絶縁層 ３ ：導電回路 ４ ：ニッケルめっきまたは金めっき ５ ：半田 ６ ：放熱フィン 1: Metal plate 2: Insulating layer 3: Conductive circuit 4: Nickel plating or gold plating 5: Solder 6: Radiating fin
Claims (3)
に積層した積層物の導電性金属箔をエッチングして導電
回路を形成した金属ベース回路基板において、前記金属
板の絶縁層と反対側の表面がニッケルめっきまたは金め
っきされてなることを特徴とする金属ベース回路基板。1. A metal base circuit board in which a conductive circuit is formed by etching a conductive metal foil of a laminate in which an insulating layer and a conductive metal foil are sequentially stacked on a metal plate, and the conductive layer is opposite to the insulating layer of the metal plate. A metal-based circuit board whose side surface is nickel-plated or gold-plated.
は金めっきされてなることを特徴とする金属ベース回路
基板。2. A metal base circuit board, wherein a side surface of the metal plate is plated with nickel or gold.
絶縁層と反対側の表面がニッケルめっきまたは金めっき
されてなることを特徴とする金属ベース回路基板。3. A metal base circuit board, wherein the surface of the conductive circuit and the surface of the metal plate opposite to the insulating layer are nickel-plated or gold-plated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27319192A JP3199191B2 (en) | 1992-10-12 | 1992-10-12 | Metal base circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27319192A JP3199191B2 (en) | 1992-10-12 | 1992-10-12 | Metal base circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06125155A true JPH06125155A (en) | 1994-05-06 |
| JP3199191B2 JP3199191B2 (en) | 2001-08-13 |
Family
ID=17524373
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27319192A Expired - Fee Related JP3199191B2 (en) | 1992-10-12 | 1992-10-12 | Metal base circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3199191B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008305811A (en) * | 2007-05-09 | 2008-12-18 | Mitsubishi Chemicals Corp | Substrate for fixing led chip and manufacturing method thereof |
| JP2009188032A (en) * | 2008-02-04 | 2009-08-20 | Fuji Electric Systems Co Ltd | Power converting device |
| WO2019230335A1 (en) * | 2018-05-31 | 2019-12-05 | 日東電工株式会社 | Wiring circuit board, method for manufacturing same, and wiring circuit sheet |
| JP2022066456A (en) * | 2018-05-31 | 2022-04-28 | 日東電工株式会社 | Manufacturing method of wiring circuit board and wiring circuit sheet |
-
1992
- 1992-10-12 JP JP27319192A patent/JP3199191B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008305811A (en) * | 2007-05-09 | 2008-12-18 | Mitsubishi Chemicals Corp | Substrate for fixing led chip and manufacturing method thereof |
| JP2009188032A (en) * | 2008-02-04 | 2009-08-20 | Fuji Electric Systems Co Ltd | Power converting device |
| WO2019230335A1 (en) * | 2018-05-31 | 2019-12-05 | 日東電工株式会社 | Wiring circuit board, method for manufacturing same, and wiring circuit sheet |
| JP2019212659A (en) * | 2018-05-31 | 2019-12-12 | 日東電工株式会社 | Wiring circuit board, manufacturing method thereof, and wiring circuit sheet |
| US11284503B2 (en) | 2018-05-31 | 2022-03-22 | Nitto Denko Corporation | Wiring circuit board, producing method thereof, and wiring circuit sheet |
| JP2022066456A (en) * | 2018-05-31 | 2022-04-28 | 日東電工株式会社 | Manufacturing method of wiring circuit board and wiring circuit sheet |
| TWI822782B (en) * | 2018-05-31 | 2023-11-21 | 日商日東電工股份有限公司 | Wired circuit board, manufacturing method thereof, and wired circuit sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3199191B2 (en) | 2001-08-13 |
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