JPH06120367A - Division of ceramic substrate and apparatus therefor - Google Patents

Division of ceramic substrate and apparatus therefor

Info

Publication number
JPH06120367A
JPH06120367A JP26496792A JP26496792A JPH06120367A JP H06120367 A JPH06120367 A JP H06120367A JP 26496792 A JP26496792 A JP 26496792A JP 26496792 A JP26496792 A JP 26496792A JP H06120367 A JPH06120367 A JP H06120367A
Authority
JP
Japan
Prior art keywords
dividing
ceramic substrate
belt
roller
pressing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP26496792A
Other languages
Japanese (ja)
Other versions
JP3423014B2 (en
Inventor
Hiroshi Miura
博 三浦
Koki Abe
幸喜 阿部
Katsufumi Usui
克文 臼井
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP26496792A priority Critical patent/JP3423014B2/en
Priority to CN93114172A priority patent/CN1057485C/en
Publication of JPH06120367A publication Critical patent/JPH06120367A/en
Application granted granted Critical
Publication of JP3423014B2 publication Critical patent/JP3423014B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Processing Of Stones Or Stones Resemblance Materials (AREA)

Abstract

PURPOSE:To reduce machining cost by extending the period of replacement of components necessary for avoiding a failure in division by contriving to lessen wear of components in pressure contact with a ceramic substrate. CONSTITUTION:While a strip-form ceramic substrate 1 is held by a carrying belt 2 and a stopper belt 6 the substrate 1 passes between a pair of dividing rollers 5 and 8 provided with their axes 5a, 8a shifted. Then, by a pressing force F of the dividing roller 8 against the dividing roller 5, the strip-form ceramic substrate 1 is cut along its dividing groove into chip-form ceramic substrates 1a.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、多数の分割溝が平行に
形成されている短冊状のセラミック基板をチップ状に分
割する(ブレーキングする)際に用いて好適なセラミッ
ク基板の分割方法と、その分割装置とに関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for dividing a ceramic substrate suitable for use in dividing (braking) a strip-shaped ceramic substrate having a large number of dividing grooves in parallel into chips. , Its dividing device.

【0002】[0002]

【従来の技術】チップ部品のベース材などとして使用さ
れるチップ状のセラミック基板は、縦横に多数の分割溝
を形成した大面積のセラミック基板を縦方向または横方
向の分割溝に沿って一次分割して短冊状のセラミック基
板となした後、これを残りの分割溝に沿って二次分割す
ることにより得られる。そして、かかる二次分割を効率
的に行うために、従来、上記した短冊状のセラミック基
板を搬送用ベルトに搭載して搬送しながら、この短冊状
セラミック基板を、上面を凸に湾曲させた金属製の固定
プレートと、この湾曲面に合致する凹状底面を有して固
定プレートの上方で昇降可能な可動プレートとの間に位
置させ、次いで、加圧シリンダに連結した可動プレート
を固定プレートに向けて押圧付勢することにより、この
可動プレートの凹状底面に圧接される短冊状セラミック
基板に曲げ応力を加えてチップ状のセラミック基板に分
割するという分割方法ならびに分割装置が採用されてい
る。
2. Description of the Related Art A chip-shaped ceramic substrate used as a base material for a chip component is a large-area ceramic substrate in which a large number of vertical and horizontal dividing grooves are formed, and primary dividing is performed along the vertical or horizontal dividing grooves. Then, a strip-shaped ceramic substrate is formed, and then this is obtained by secondary division along the remaining division grooves. In order to efficiently perform such secondary division, conventionally, while the above-mentioned strip-shaped ceramic substrate is mounted on a transport belt and transported, the strip-shaped ceramic substrate is made of a metal whose upper surface is convexly curved. Between the fixed plate made of steel and a movable plate that has a concave bottom surface that matches this curved surface and that can move up and down above the fixed plate, and then direct the movable plate connected to the pressure cylinder to the fixed plate. A dividing method and a dividing device are adopted in which the strip-shaped ceramic substrate pressed against the concave bottom surface of the movable plate is subjected to a pressing force to apply bending stress to divide the strip-shaped ceramic substrate into chip-shaped ceramic substrates.

【0003】このほか、特公平2−60493号公報に
公告されているように、搬送用ベルトに従動して回転自
在な一対のベアリングの上方にゴムローラを配置し、こ
のゴムローラを搬送用ベルト上の短冊状セラミック基板
に圧接させて曲げ応力を加えることにより分割するとい
う分割装置も提案されている。
In addition, as disclosed in Japanese Patent Publication No. 2-6049 / 1990, a rubber roller is arranged above a pair of bearings that are rotatable by being driven by the conveyor belt, and the rubber roller is placed on the conveyor belt. A dividing device has also been proposed in which a strip-shaped ceramic substrate is pressed into contact with the strip-shaped ceramic substrate to apply bending stress to divide the strip.

【0004】[0004]

【発明が解決しようとする課題】しかしながら、上記し
た前者の従来技術は、短冊状セラミック基板に圧接する
可動プレートの凹状底面が局部的に摩耗して曲率が変わ
りやすいので、分割工程後、分割すべき個所が分割され
ずに残ってしまったり分割面にバリが形成されてしまう
等の不良を招来しやすく、また、かかる分割不良を極力
回避するために可動プレートを短期間のうちに交換しな
ければならず、これが加工コストを押し上げる要因とな
っていた。これに対し、上記した後者の従来技術は、ゴ
ムローラが回転しながら短冊状セラミック基板に圧接す
るので該ローラの外周面の摩耗は比較的むらが少ない
が、ゴム材を頻繁に短冊状セラミック基板に圧接させる
ことになるので摩耗が早く、分割不良を回避するために
はゴムローラを短期間のうちに交換しなければならなか
った。
However, in the former prior art described above, since the concave bottom surface of the movable plate pressed against the strip-shaped ceramic substrate is locally worn and its curvature is apt to change, after the dividing step, the dividing step is performed. It is easy to cause defects such as power spots left undivided or burrs formed on the split surface, and the movable plate must be replaced within a short period of time to avoid such split defects as much as possible. This had to be a factor that increased the processing cost. On the other hand, in the latter prior art described above, since the rubber roller is pressed against the strip-shaped ceramic substrate while rotating, the outer peripheral surface of the roller is relatively free from uneven wear, but the rubber material is frequently applied to the strip-shaped ceramic substrate. Since they are pressed against each other, they wear quickly, and the rubber roller had to be replaced within a short period of time in order to avoid defective division.

【0005】本発明はこのような従来技術の課題に鑑み
てなされたもので、その目的は、分割不良を回避するた
めに必要な部品の交換周期が長くて加工コストが低減で
きるセラミック基板の分割方法およびその分割装置を提
供することにある。
The present invention has been made in view of the above problems of the prior art, and an object of the present invention is to divide a ceramic substrate in which the replacement cycle of parts required for avoiding defective division is long and the processing cost can be reduced. A method and a dividing device thereof are provided.

【0006】[0006]

【課題を解決するための手段】上記目的を達成するため
に、本発明による分割方法は、多数の分割溝が平行に形
成されているセラミック基板を、該セラミック基板を搭
載して搬送する搬送用ベルトと該搬送用ベルトに対向し
て一体的に駆動される押え用ベルトとで挟持しながら、
上記搬送用ベルトに従動して回転する第1の分割用ロー
ラと、該第1の分割用ローラの軸心のセラミック基板搬
送方向側斜め上方に軸心を位置させ上記押え用ベルトに
従動して回転する第2の分割用ローラとの間を通過さ
せ、上記第1の分割用ローラに対する上記第2の分割用
ローラの押圧力により該セラミック基板を上記分割溝に
沿って分割するようにした。
In order to achieve the above object, the dividing method according to the present invention is for carrying a ceramic substrate having a large number of dividing grooves formed in parallel and carrying the ceramic substrate. While sandwiching between the belt and the pressing belt that is integrally driven facing the conveying belt,
A first dividing roller that rotates by being driven by the carrying belt, and an axial center positioned diagonally above the ceramic substrate carrying direction side of the axial center of the first dividing roller and driven by the holding belt. The ceramic substrate is passed along a rotating second dividing roller, and the ceramic substrate is divided along the dividing groove by the pressing force of the second dividing roller against the first dividing roller.

【0007】また、上記目的を達成するために、本発明
による分割装置は、セラミック基板を搭載して搬送する
ための搬送用ベルトと、該搬送用ベルトに対向して一体
的に駆動され該搬送用ベルト上のセラミック基板に圧接
可能な押え用ベルトと、上記搬送用ベルトに従動して回
転自在な第1の分割用ローラと、該第1の分割用ローラ
の軸心のセラミック基板搬送方向側斜め上方に軸心を位
置させ上記押え用ベルトに従動して回転自在な第2の分
割用ローラと、該第2の分割用ローラを上記第1の分割
用ローラに向けて押圧付勢するための押圧手段とを備え
る構成とした。
In order to achieve the above object, the dividing apparatus according to the present invention is provided with a conveyor belt for mounting and conveying a ceramic substrate and a conveyor belt which is integrally driven to face the conveyor belt. A pressing belt that can be pressed against the ceramic substrate on the belt, a first dividing roller that is rotatable following the conveying belt, and a ceramic substrate conveying direction side of the axis of the first dividing roller. A second splitting roller having an axial center diagonally above and rotatable by following the pressing belt, and for biasing the second splitting roller toward the first splitting roller. And a pressing means of the above.

【0008】[0008]

【作用】上記したように、分割溝を有するセラミック基
板を搬送用ベルトと押え用ベルトとで挟持したまま、互
いの軸心をずらして設置した第1および第2の分割用ロ
ーラの間を通過させ、この通過時に該セラミック基板に
曲げ応力が加えられるようにしてあると、次々と搬送さ
れてくるセラミック基板群に長尺の押え用ベルトを順繰
りにむらなく圧接させることができるので、該押え用ベ
ルトは長期間使用してもさほど摩耗せず、そのため分割
不良を回避するために必要な該押え用ベルトの交換周期
は長くなる。また、セラミック基板は第1および第2の
分割用ローラ間を通過してチップ状に分割された後も搬
送用ベルトと押え用ベルトとで挟持されるので、チップ
状セラミック基板を整列した状態で搬送することがで
き、そのため分割後の取扱い性が向上する。
As described above, the ceramic substrate having the dividing groove is sandwiched between the conveying belt and the pressing belt, and is passed between the first and second dividing rollers installed with their axes displaced from each other. If a bending stress is applied to the ceramic substrate during this passage, the long pressing belt can be pressed in sequence to the ceramic substrate groups that are successively conveyed. The belt for use does not wear so much even if it is used for a long period of time, so that the period for exchanging the presser belt required to avoid defective division becomes long. Further, since the ceramic substrate is sandwiched between the carrying belt and the holding belt even after passing through the first and second dividing rollers and being divided into chips, the chip-shaped ceramic substrates are aligned. It can be transported, and therefore the handling property after division is improved.

【0009】[0009]

【実施例】以下、本発明の実施例を図面に基づいて説明
する。
Embodiments of the present invention will be described below with reference to the drawings.

【0010】図1は実施例に係る分割装置の構成図であ
って、多数の分割溝が平行に形成されている短冊状セラ
ミック基板1をチップ状セラミック基板1aに分割する
ための装置の概略を示している。
FIG. 1 is a block diagram of a dividing apparatus according to an embodiment, and shows an outline of an apparatus for dividing a strip-shaped ceramic substrate 1 having a large number of dividing grooves formed in parallel into chip-shaped ceramic substrates 1a. Shows.

【0011】同図において、符号2は複数の従動プーリ
3に支持されつつ駆動プーリ4に駆動されるニトリルゴ
ム製の搬送用ベルトで、この搬送用ベルト2上に短冊状
セラミック基板1を搭載して図示右方へと搬送する。こ
の搬送用ベルト2は金属製の回転自在な分割用ローラ5
に圧接させてあり、図示せぬモータにより駆動プーリ4
を矢印A方向へ回転させると、搬送用ベルト2が矢印B
方向へ駆動され、搬送用ベルト2に従動して各従動プー
リ3および分割用ローラ5が矢印C方向へ回転するよう
になっている。符号6は複数の従動プーリ7に支持され
つつ搬送用ベルト2に対向しているニトリルゴム製の押
え用ベルトで、この押え用ベルト6は搬送用ベルト2と
一体的に駆動される。そして、押え用ベルト6は金属製
の回転自在な分割用ローラ8に圧接させてあり、この分
割用ローラ8はエアー圧力が任意に設定可能な加圧シリ
ンダ9に連結させてある。つまり、加圧シリンダ9によ
って分割用ローラ8を下方へ加圧すると、押え用ベルト
6が搬送用ベルト2上の短冊状セラミック基板1に圧接
するので、該セラミック基板1を介して押え用ベルト6
が搬送用ベルト2に駆動されるようになっており、搬送
用ベルト2の矢印B方向への移動に伴い押え用ベルト6
は矢印D方向へ駆動され、この押え用ベルト6に従動し
て分割用ローラ8は矢印E方向へ回転する。また、分割
用ローラ8の軸心8aが分割用ローラ5の軸心5aより
も図示右側にずらしてあるので、分割用ローラ5に対す
る分割用ローラ8の押圧力Fによって、両分割用ローラ
5,8間を通過する短冊状セラミック基板1に曲げ応力
を生じさせることができる。
In FIG. 1, reference numeral 2 denotes a nitrile rubber carrier belt which is driven by a drive pulley 4 while being supported by a plurality of driven pulleys 3. On the carrier belt 2, a strip-shaped ceramic substrate 1 is mounted. And convey it to the right in the figure. This conveyor belt 2 is made of a metallic rotatable roller 5 for dividing.
Driven by a motor (not shown).
When is rotated in the direction of arrow A, the conveyor belt 2
The driven pulley 3 and the splitting roller 5 are driven in the direction C and driven by the conveying belt 2 to rotate in the direction of arrow C. Reference numeral 6 is a holding belt made of nitrile rubber, which is supported by a plurality of driven pulleys 7 and faces the carrying belt 2. The holding belt 6 is driven integrally with the carrying belt 2. The pressing belt 6 is brought into pressure contact with a rotatable metal dividing roller 8, and the dividing roller 8 is connected to a pressure cylinder 9 whose air pressure can be arbitrarily set. That is, when the pressing roller 9 presses the dividing roller 8 downward, the pressing belt 6 comes into pressure contact with the strip-shaped ceramic substrate 1 on the conveying belt 2, so that the pressing belt 6 is interposed via the ceramic substrate 1.
Is driven by the conveyor belt 2, and the holding belt 6 is moved as the conveyor belt 2 moves in the direction of arrow B.
Is driven in the direction of arrow D, and the dividing roller 8 is rotated in the direction of arrow E by being driven by the pressing belt 6. Further, since the axis 8a of the dividing roller 8 is displaced to the right side of the figure from the axis 5a of the dividing roller 5, the pressing force F of the dividing roller 8 against the dividing roller 5 causes the dividing rollers 5, Bending stress can be generated in the strip-shaped ceramic substrate 1 passing between the eight.

【0012】上記の如くに構成された分割装置は、短冊
状セラミック基板1を搭載した搬送用ベルト2を矢印B
方向へ駆動していくと、該セラミック基板1は搬送用ベ
ルト2と押え用ベルト6とに挟持されて図示右方へと搬
送されていき、両ベルト2,6に挟持されたまま一対の
分割用ローラ5,8間を通過する。そして、この通過時
に、分割用ローラ5に対する分割用ローラ8の押圧力F
によって短冊状セラミック基板1に曲げ応力が生じるた
め、該セラミック基板1は分割溝に沿ってチップ状に分
割され、こうして得たチップ状セラミック基板1aは両
ベルト2,6に挟持されたまま図示右方へと搬送されて
いく。
In the dividing device constructed as described above, the conveyor belt 2 on which the strip-shaped ceramic substrate 1 is mounted is attached to the arrow B.
As it is driven in the direction, the ceramic substrate 1 is sandwiched between the conveyor belt 2 and the pressing belt 6 and conveyed to the right side in the drawing, and is divided into a pair of divided parts while being sandwiched between the belts 2 and 6. It passes between the rollers 5 and 8. Then, at the time of this passage, the pressing force F of the dividing roller 8 against the dividing roller 5 is
Since bending stress is generated in the strip-shaped ceramic substrate 1 by the above, the ceramic substrate 1 is divided into chips along the dividing grooves, and the chip-shaped ceramic substrate 1a thus obtained is sandwiched between the belts 2 and 6 and is shown on the right side in the figure. It will be transported towards you.

【0013】このように上記実施例は、搬送用ベルト2
上に搭載した短冊状セラミック基板1に押え用ベルト6
を押しつけたまま、該セラミック基板1を分割用ローラ
5,8によって分割するので、次々と搬送されてくる短
冊状セラミック基板1群に長尺の押え用ベルト6を順繰
りにむらなく圧接させることができ、よって押え用ベル
ト6は摩耗する領域が分散されるとともに摩耗を起こす
頻度が減り、長期間使用してもさほど摩耗しなくなる。
すなわち、図1に示す分割装置は、押え用ベルト6を長
期間交換しなくとも、分割不良を起こす虞のない良好な
運転状態を維持することができて、部品の交換周期が従
来の分割装置に比べて大幅に延びるという利点がある。
そして、交換周期が延びることに加えて、押え用ベルト
6の交換作業が容易で部品代も安く済むことから、分割
作業の加工コストが著しく低減できる。
As described above, in the above embodiment, the conveyor belt 2 is used.
A belt 6 for holding the strip-shaped ceramic substrate 1 mounted on the top.
Since the ceramic substrate 1 is divided by the dividing rollers 5 and 8 while pressing, the long pressing belt 6 can be pressed against the group of strip-shaped ceramic substrates 1 that are successively conveyed in sequence in a uniform manner. Therefore, the holding belt 6 is dispersed in the worn region and the frequency of wear is reduced, and the holding belt 6 is not worn so much even if it is used for a long period of time.
That is, the dividing device shown in FIG. 1 can maintain a good operating state without causing a division defect even if the holding belt 6 is not exchanged for a long period of time, and has a component exchanging cycle of the conventional dividing device. It has the advantage of being significantly longer than.
Further, in addition to the extension of the replacement cycle, the replacement work of the pressing belt 6 is easy and the cost of parts is low, so that the processing cost of the division work can be remarkably reduced.

【0014】また、上記実施例は、短冊状セラミック基
板1を分割用ローラ5,8によってチップ状に分割した
後も、このチップ状セラミック基板1aが搬送用ベルト
2と押え用ベルト6とで挟持されたままなので、分割し
て得られる各チップ状セラミック基板1aを整列した状
態で搬送することができ、よって分割後の取扱い性が向
上するという利点がある。
Further, in the above-mentioned embodiment, even after the strip-shaped ceramic substrate 1 is divided into chips by the dividing rollers 5 and 8, the chip-shaped ceramic substrate 1a is held by the carrying belt 2 and the holding belt 6. Since the chip-shaped ceramic substrates 1a obtained by the division can be conveyed in an aligned state because they are kept as they are, there is an advantage that the handling property after the division is improved.

【0015】[0015]

【発明の効果】以上説明したように、分割溝を有するセ
ラミック基板を搬送用ベルトと押え用ベルトとで挟持し
たまま、互いの軸心をずらして設置した一対の分割用ロ
ーラ間を通過させ、この通過時に該セラミック基板に曲
げ応力が加えられるようにした本発明によれば、セラミ
ック基板に圧接する押え用ベルトが摩耗しにくいので、
分割不良を回避するために必要な該押え用ベルトの交換
周期が長く、しかも該押え用ベルトの交換作業は容易で
部品代も安く済むことから、分割作業の加工コストが大
幅に低減できるという顕著な効果を奏し、また、セラミ
ック基板はチップ状に分割された後も搬送用ベルトと押
え用ベルトとで挟持されるので、チップ状セラミック基
板を整列した状態で搬送することができて分割後の取扱
い性が向上するという効果を奏する。
As described above, the ceramic substrate having the dividing groove is held between the conveying belt and the holding belt, and is passed between a pair of dividing rollers which are installed with their axes displaced from each other. According to the present invention in which bending stress is applied to the ceramic substrate at the time of this passage, the holding belt that is pressed against the ceramic substrate is less likely to wear,
The replacement cycle of the pressing belt required for avoiding a defective division is long, and the replacement work of the pressing belt is easy and the cost of parts is low. Therefore, the processing cost of the dividing work can be significantly reduced. In addition, since the ceramic substrate is sandwiched between the carrier belt and the holding belt even after being divided into chips, the chip-shaped ceramic substrates can be transported in an aligned state and can be transported after being divided. This has the effect of improving handleability.

【図面の簡単な説明】[Brief description of drawings]

【図1】実施例に係る分割装置の概略構成図である。FIG. 1 is a schematic configuration diagram of a dividing device according to an embodiment.

【符号の説明】[Explanation of symbols]

1 短冊状セラミック基板 1a チップ状セラミック基板 2 搬送用ベルト 4 駆動プーリ 5 分割用ローラ(第1の分割用ローラ) 5a 軸心 6 押え用ベルト 8 分割用ローラ(第2の分割用ローラ) 8a 軸心 9 加圧シリンダ(押圧手段) 1 Strip Ceramic Substrate 1a Chip Ceramic Substrate 2 Conveyor Belt 4 Drive Pulley 5 Dividing Roller (First Dividing Roller) 5a Shaft Center 6 Holding Belt 8 Dividing Roller (Second Dividing Roller) 8a Shaft Core 9 Pressurizing cylinder (pressing means)

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 多数の分割溝が平行に形成されているセ
ラミック基板を、該セラミック基板を搭載して搬送する
搬送用ベルトと該搬送用ベルトに対向して一体的に駆動
される押え用ベルトとで挟持しながら、上記搬送用ベル
トに従動して回転する第1の分割用ローラと、該第1の
分割用ローラの軸心のセラミック基板搬送方向側斜め上
方に軸心を位置させ上記押え用ベルトに従動して回転す
る第2の分割用ローラとの間を通過させ、上記第1の分
割用ローラに対する上記第2の分割用ローラの押圧力に
より該セラミック基板を上記分割溝に沿って分割するこ
とを特徴とするセラミック基板の分割方法。
1. A carrying belt for carrying a ceramic substrate on which a plurality of dividing grooves are formed in parallel and carrying the ceramic substrate, and a pressing belt integrally driven to face the carrying belt. The first pressing roller is rotated by being driven by the transfer belt while being sandwiched between the pressing roller and the pressing roller, and the shaft center is positioned obliquely above the ceramic substrate transfer direction side of the shaft axis of the first dividing roller. The belt is passed between the second dividing roller which is driven by the belt and rotates, and the ceramic substrate is moved along the dividing groove by the pressing force of the second dividing roller against the first dividing roller. A method for dividing a ceramic substrate, characterized by dividing.
【請求項2】 セラミック基板を搭載して搬送するため
の搬送用ベルトと、該搬送用ベルトに対向して一体的に
駆動され該搬送用ベルト上のセラミック基板に圧接可能
な押え用ベルトと、上記搬送用ベルトに従動して回転自
在な第1の分割用ローラと、該第1の分割用ローラの軸
心のセラミック基板搬送方向側斜め上方に軸心を位置さ
せ上記押え用ベルトに従動して回転自在な第2の分割用
ローラと、該第2の分割用ローラを上記第1の分割用ロ
ーラに向けて押圧付勢するための押圧手段とを備えたこ
とを特徴とするセラミック基板の分割装置。
2. A conveyor belt for mounting and carrying a ceramic substrate, and a holding belt that is integrally driven so as to face the conveyor belt and can be pressed against the ceramic substrate on the conveyor belt. A first splitting roller that is rotatable by being driven by the carrying belt, and an axial center that is located diagonally above the ceramic substrate carrying direction side of the axial center of the first splitting roller, and is driven by the holding belt. And a rotatable second splitting roller, and pressing means for pressing and biasing the second splitting roller toward the first splitting roller. Dividing device.
JP26496792A 1992-10-02 1992-10-02 Method and apparatus for dividing ceramic substrate Expired - Fee Related JP3423014B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP26496792A JP3423014B2 (en) 1992-10-02 1992-10-02 Method and apparatus for dividing ceramic substrate
CN93114172A CN1057485C (en) 1992-10-02 1993-09-28 Method of splitting ceramic substrate and splitting device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP26496792A JP3423014B2 (en) 1992-10-02 1992-10-02 Method and apparatus for dividing ceramic substrate

Publications (2)

Publication Number Publication Date
JPH06120367A true JPH06120367A (en) 1994-04-28
JP3423014B2 JP3423014B2 (en) 2003-07-07

Family

ID=17410699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP26496792A Expired - Fee Related JP3423014B2 (en) 1992-10-02 1992-10-02 Method and apparatus for dividing ceramic substrate

Country Status (2)

Country Link
JP (1) JP3423014B2 (en)
CN (1) CN1057485C (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184545A (en) * 2005-12-06 2007-07-19 Yamaha Corp Semiconductor unit, semiconductor device and method for manufacturing the same
JP2010045121A (en) * 2008-08-11 2010-02-25 Sony Chemical & Information Device Corp Method of manufacturing magnetic sheet
JP2011046045A (en) * 2009-08-26 2011-03-10 Mitsubishi Materials Corp Apparatus and method for manufacturing divided body
US8344489B2 (en) 2005-12-06 2013-01-01 Yamaha Corporation Semiconductor device and manufacturing method thereof
JP2016207943A (en) * 2015-04-27 2016-12-08 株式会社ディスコ Tabular object dividing device, processing device and tabular object dividing method

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Publication number Priority date Publication date Assignee Title
US5650075A (en) * 1995-05-30 1997-07-22 Motorola, Inc. Method for etching photolithographically produced quartz crystal blanks for singulation
DE102007016334B4 (en) * 2007-04-04 2011-04-21 Siemens Ag Wire saw and method of making a wire saw
CN104766821A (en) * 2014-01-02 2015-07-08 大族激光科技产业集团股份有限公司 Cell splitting device and cell splitting method
CN111086214B (en) * 2019-11-27 2022-04-26 汕头大学 Flexible rod of belt powder paving device

Citations (1)

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Publication number Priority date Publication date Assignee Title
JPH0189108U (en) * 1987-12-07 1989-06-13

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Publication number Priority date Publication date Assignee Title
US2252363A (en) * 1939-03-27 1941-08-12 Baker Perkins Co Inc Cracker machine
JPS59148620A (en) * 1983-02-15 1984-08-25 松下電器産業株式会社 Divider for ceramic substrate

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0189108U (en) * 1987-12-07 1989-06-13

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007184545A (en) * 2005-12-06 2007-07-19 Yamaha Corp Semiconductor unit, semiconductor device and method for manufacturing the same
US8344489B2 (en) 2005-12-06 2013-01-01 Yamaha Corporation Semiconductor device and manufacturing method thereof
JP2010045121A (en) * 2008-08-11 2010-02-25 Sony Chemical & Information Device Corp Method of manufacturing magnetic sheet
JP2011046045A (en) * 2009-08-26 2011-03-10 Mitsubishi Materials Corp Apparatus and method for manufacturing divided body
JP2016207943A (en) * 2015-04-27 2016-12-08 株式会社ディスコ Tabular object dividing device, processing device and tabular object dividing method

Also Published As

Publication number Publication date
JP3423014B2 (en) 2003-07-07
CN1092013A (en) 1994-09-14
CN1057485C (en) 2000-10-18

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