JPH0611920B2 - Multi-layer plated steel sheet with excellent solderability - Google Patents
Multi-layer plated steel sheet with excellent solderabilityInfo
- Publication number
- JPH0611920B2 JPH0611920B2 JP62201023A JP20102387A JPH0611920B2 JP H0611920 B2 JPH0611920 B2 JP H0611920B2 JP 62201023 A JP62201023 A JP 62201023A JP 20102387 A JP20102387 A JP 20102387A JP H0611920 B2 JPH0611920 B2 JP H0611920B2
- Authority
- JP
- Japan
- Prior art keywords
- plating
- solderability
- layer
- plated steel
- steel sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/226—Non-corrosive coatings; Primers applied before welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
- C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
- C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/48—After-treatment of electroplated surfaces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Chemical Treatment Of Metals (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Description
【発明の詳細な説明】 ［産業上の利用分野］ 本発明は半田用鋼板に係り、半田の広がり、半田強度
（以下、半田性と略す）、耐食性、加工性経時性、半田
浴へのZnの溶け込みの抑制および経済性に優れたZn単独
めっき、あるいはZn系合金めっきを下層とした半田付け
性に優れた複層めっき鋼板に関する。The present invention relates to a steel plate for soldering, which relates to the spread of solder, solder strength (hereinafter abbreviated as solderability), corrosion resistance, workability aging, Zn in a solder bath. The present invention relates to a Zn single plating excellent in suppression of penetration and economic efficiency, or a multi-layer plated steel sheet having a Zn-based alloy plating as a lower layer and excellent in solderability.
［従来の技術］ 半田の可能な鋼板として、Snめっき鋼板、Pb-Sn合金め
っき鋼板、Cuめっき鋼板が広く知られている。Snめっき
鋼板、Cuめっき鋼板は半田性に優れているが、これらの
標準電極電位（以下、電位と略す）はいずれも鋼板のFe
よりも貴であるため、めっきにピンホールが存在すると
その部分からFeが溶出し、赤錆が発生し易い。これらを
解消するためには高価な金属のめっき量を３０g/m2以上
にしなければならず、経済性の点から非常に不利であ
る。また、Cuめっき鋼板は表面が酸化され易く、変色し
半田性が著しく低下する。したがって、耐食性の向上の
ため、クロメート処理が施されている。しかし、耐食性
を改善するためにはクロメート量がCrとして０．０５mg
/dm2以上必要であるが、半田性に対しては著しく悪影響
を及ぼすので好ましくない。Pb-Sn合金めっき鋼板につ
いては、成形加工時に加工屑が発生し加工部品に付着す
る。このことが商品化した場合、加工屑によりショート
の原因となる。また、Pb公害も無視することはできな
い。[Prior Art] Sn-plated steel sheets, Pb-Sn alloy-plated steel sheets, and Cu-plated steel sheets are widely known as solderable steel sheets. Although Sn-plated steel sheets and Cu-plated steel sheets have excellent solderability, their standard electrode potentials (hereinafter abbreviated as potentials) are
Since it is more noble than that, if there is a pinhole in the plating, Fe is eluted from that portion and red rust is likely to occur. In order to solve these problems, the plating amount of expensive metal must be set to 30 g / m 2 or more, which is very disadvantageous from the economical point of view. In addition, the surface of the Cu-plated steel sheet is easily oxidized and discolors, and the solderability is significantly reduced. Therefore, in order to improve the corrosion resistance, chromate treatment is applied. However, in order to improve the corrosion resistance, the chromate amount as Cr is 0.05 mg.
/ dm 2 or more is required, but it is not preferable because it has a bad effect on solderability. Regarding Pb-Sn alloy plated steel sheet, processing chips are generated during the forming process and adhere to the processed parts. When this is commercialized, it causes a short circuit due to processing waste. Also, Pb pollution cannot be ignored.
［発明が解決しようとする問題点］ 前述のごとく、半田性、耐食性、加工性、経時性、半田
浴へのZnの溶け込みおよび経済性に優れためっき鋼板を
得るためには、安価な金属で経済性に優れ、Feの電位よ
り卑であるZnに注目して半田性、耐食性、経時性を向上
させる必要がある。しかし、公知の方法では半田性と耐
食性の向上は相反する傾向があるので、半田性と耐食性
の優れた鋼板を得ることは困難である。[Problems to be Solved by the Invention] As described above, in order to obtain a plated steel sheet excellent in solderability, corrosion resistance, workability, aging property, dissolution of Zn in the solder bath and economical efficiency, an inexpensive metal is used. It is necessary to improve solderability, corrosion resistance, and aging by paying attention to Zn, which is economical and less base than the potential of Fe. However, since the known methods tend to contradict the improvement in solderability and corrosion resistance, it is difficult to obtain a steel sheet excellent in solderability and corrosion resistance.
したがって、めっき層の改善が必要である。Therefore, it is necessary to improve the plating layer.
［問題を解決するための手段］ 本発明によるめっき層の改善は、鋼板上に、下層として
１〜50g/m2のFeの電位より卑で、安価な金属であるZnあ
るいはZnを主成分とした合金めっきと、中間層として、
その上に、0.1〜10g/m2のFe,NiまたはCoの単独めっき、
あるいはこれらの合金めっきと上層（最外層）に0.05〜
５g/m2のZn,Sn,Cuの単独めっき、あるいは合金めっきか
らなることを特徴とする。[Means for Solving the Problem] The improvement of the plating layer according to the present invention is to use Zn or Zn, which is an inexpensive metal, which is less expensive than the potential of Fe of 1 to 50 g / m 2 as a lower layer, on the steel sheet as a main component. Alloy plating and the intermediate layer,
On top of that, 0.1-10 g / m 2 Fe, Ni or Co single plating,
Or these alloy plating and upper layer (outermost layer) 0.05 ~
It is characterized in that it is composed of a single plating of 5 g / m 2 of Zn, Sn and Cu or an alloy plating.
以下、本発明について詳細に説明する。Hereinafter, the present invention will be described in detail.
本発明において、下層のZnめっき、あるいはZn合金めっ
きは公知のめっき浴で差し支えないが、Znめっきあるい
はZn合金めっき浴中にAl2(SO4)3などの平滑剤が添加さ
れている場合、Al3+イオンがめっき層中に析出し半田に
悪影響を及ぼすので好ましくない。同様に、ケイ酸およ
びその塩、ホウ酸およびその塩の添加は好ましくない。
Zn系合金めっきの場合、Ni,Co,Fe,Cu,Snが含まれるが、
めっき浴中に、Cr6+,Mo6+イオンが多く存在すると、耐
食性に対して効果的であるが、半田性に対して好ましく
ない。また、めっき層がFeより貴の場合、耐食性の効果
が減少する。めっき層は１g/m2以下になると下地めっき
としての効果が少なく、赤錆が発生し易い。５０g/m2以
上になると効果は飽和し経済性の点から好ましくない。In the present invention, the lower layer Zn plating, or the Zn alloy plating may be a known plating bath, but when a smoothing agent such as Al 2 (SO 4 ) 3 is added to the Zn plating or the Zn alloy plating bath, Al 3+ ions precipitate in the plating layer and adversely affect the solder, which is not preferable. Similarly, the addition of silicic acid and its salts, boric acid and its salts is not preferred.
In the case of Zn-based alloy plating, Ni, Co, Fe, Cu, Sn are included,
The presence of a large amount of Cr 6+ and Mo 6+ ions in the plating bath is effective for corrosion resistance but unfavorable for solderability. Further, when the plating layer is noble than Fe, the effect of corrosion resistance decreases. If the plating layer is 1 g / m 2 or less, the effect as the base plating is small and red rust is likely to occur. If it exceeds 50 g / m 2 , the effect is saturated and it is not preferable from the economical point of view.
下層のめっき層のみでも、十分半田用鋼板として使用で
きる場合もあるが、最近、半田の自動化によって連続的
に半田処理が行われるようになった。そこで半田時に半
田浴へのZnの溶け込みが問題になる場合がある。半田浴
にZnが存在すると、ツララの原因となり好ましくないと
されている。したがって、Znの半田浴への溶け込みと耐
食性の改善から、その中間層に、Feめっき、Niめっき、
Coめっき、あるいはこれらの合金めっきを施すことが望
ましい。中間層にSnあるいはPb-Snめっきを施しても、Z
nの半田浴への溶け込みを抑制することはできない。In some cases, the lower plating layer alone can be sufficiently used as a steel plate for soldering, but recently, soldering has been continuously performed by automation of soldering. Therefore, when soldering, the dissolution of Zn into the solder bath may become a problem. It is said that the presence of Zn in the solder bath is undesirable because it causes icicles. Therefore, from the dissolution of Zn in the solder bath and the improvement of corrosion resistance, Fe plating, Ni plating,
Co plating or alloy plating of these is desirable. Even if Sn or Pb-Sn plating is applied to the intermediate layer, Z
The dissolution of n into the solder bath cannot be suppressed.
Fe,Ni,Coの単独めっきあるいは合金めっきの場合、例え
ば、ワット浴のように浴中に、ホウ酸を含むものはホウ
酸がめっき層中に析出し、半田性に悪影響を及ぼすので
好ましくない。また、これらのめっきはZnに対して貴で
なければ耐食性への効果は認められない。めっき量が0.
1g/m2以下の場合はZnの半田浴への溶け込みは抑制でき
ず、耐食性への効果も認められない。また、１０g/m2以
上になると経済性に不利である。合金めっきの場合、効
果は単独めっきと同程度であるので作業性の点から単独
めっきの方が好ましい。In the case of Fe, Ni, Co single plating or alloy plating, for example, those containing boric acid in the bath such as Watt bath are not preferable because boric acid precipitates in the plating layer and adversely affects solderability. . Further, these platings have no effect on the corrosion resistance unless they are noble to Zn. Plating amount is 0.
When it is 1 g / m 2 or less, dissolution of Zn in the solder bath cannot be suppressed, and no effect on corrosion resistance is observed. Further, if it exceeds 10 g / m 2 , it is disadvantageous to the economy. In the case of alloy plating, the effect is similar to that of single plating, so single plating is preferable from the viewpoint of workability.
次に、半田性を更に改善するために０．０５〜５g/m2の
Znめっき、Snめっき、Cuめっきあるいはこれらの合金め
っきが施される。合金めっきには前記金属のほかにPb,N
i,Coの一種以上が含まれるが、その成分はZn,Sn,Cuの重
量を超えてはならない。それ以上になると、半田性が低
下する。めっき量が0.05g/m2以下では効果が見られず、
５g/m2以上では効果は飽和するので経済的に不利であ
る。Next, in order to further improve the solderability, 0.05 to 5 g / m 2
Zn plating, Sn plating, Cu plating or alloy plating of these is applied. For alloy plating, in addition to the above metals, Pb, N
One or more of i and Co are contained, but the components must not exceed the weight of Zn, Sn and Cu. If it is more than that, the solderability is deteriorated. No effect is seen when the plating amount is 0.05 g / m 2 or less,
At 5 g / m 2 or more, the effect is saturated, which is economically disadvantageous.
［作用］ 本発明の複層めっきによって、第２表に示すように、半
田性、耐食性、加工性、経時性および経済性が著しく向
上する結果が得られた。特性が向上する理由は明らかで
ないが、その理由として、中間のめっき層は下層のZnあ
るいはZn合金めっきに比べて高温高湿の雰囲気にさらさ
れた時、Ni,Coあるいはこれらの合金は酸化の成長が前
者に比べて遅く、黒錆や白錆の発生を抑制している。そ
の結果として、鋼板のFeの溶出が抑えられているものと
考えられる。また、表面の酸化の成長がZnやZnの合金め
っきに比べて遅いため、半田性の経時による低下が小さ
いものと考えられる。また、Ni,Coあるいはこれらの合
金めっき浴中にホウ酸やAl3+を含む場合は半田性が著し
く低下し、半田部のピンホールの原因となる。これは共
析により半田の濡れを悪くしているものと考えられる。
上層（最外層）のZn,Sn,Cuあるいはこれらを主成分とし
た合金めっきは耐食性と半田性が改善されるが、この場
合、Ni,Coあるいはこれらの合金めっき層は半田時に半
田浴へのZnの溶解を抑制する。つまりバリヤー層として
の働きをする。[Operation] As shown in Table 2, the multi-layer plating of the present invention resulted in remarkably improved solderability, corrosion resistance, workability, temporality and economy. The reason why the characteristics are improved is not clear, but the reason is that when the intermediate plating layer is exposed to an atmosphere of high temperature and high humidity as compared with the lower Zn or Zn alloy plating, Ni, Co or these alloys are not oxidized. It grows slower than the former and suppresses the generation of black rust and white rust. As a result, it is considered that the elution of Fe from the steel sheet is suppressed. In addition, since the growth of oxidation on the surface is slower than that of Zn or Zn alloy plating, it is considered that the decrease in solderability with time is small. Also, when boric acid or Al 3+ is contained in the Ni, Co or alloy plating bath of these, the solderability is remarkably deteriorated and causes pinholes in the solder portion. It is considered that this is because the wettability of the solder is deteriorated by eutectoid.
The upper layer (outermost layer) Zn, Sn, Cu or alloy plating mainly composed of these improves corrosion resistance and solderability, but in this case, Ni, Co or these alloy plating layers are not applied to the solder bath during soldering. Inhibits dissolution of Zn. That is, it functions as a barrier layer.
前述のごとく、ホウ酸およびホウ酸塩やAl3+イオンを含
まないめっき浴で半田付け性に優れた複層めっき鋼板を
得ることができる。めっき量の組合わせは使用環境によ
って任意に組合わせることができる。つまり使用環境の
厳しくないところでは経済性を考慮して、めっき量を薄
くすることができる。As described above, a double-layer plated steel sheet having excellent solderability can be obtained with a plating bath that does not contain boric acid, borate or Al 3+ ions. The combination of the plating amounts can be arbitrarily combined depending on the use environment. That is, it is possible to reduce the plating amount in consideration of economical efficiency in a place where the use environment is not severe.
このようにして作成しためっき鋼板は、そのまま使用し
てもよいが、半田性を損なわないように後処理を施すこ
とが好ましい。例えば、ポリエチレングリコールアルキ
ルフェニールエーテルを乾燥厚み０．５μｍ塗布すると
効果的である。The plated steel sheet thus prepared may be used as it is, but it is preferable to carry out a post-treatment so as not to impair the solderability. For example, it is effective to apply polyethylene glycol alkylphenyl ether to a dry thickness of 0.5 μm.
本発明は、かかる知見のもとになされたものであって、
本発明の処理をすることによって、半田性、耐食性、加
工性、経時性および経済性に優れた複層めっき鋼板を連
続的に生産することができる。The present invention was made based on such findings,
By performing the treatment of the present invention, it is possible to continuously produce a multi-layer plated steel sheet excellent in solderability, corrosion resistance, workability, aging property and economical efficiency.
［実施例］ 以下、本発明の効果を実施例１〜８により説明する。[Examples] The effects of the present invention will be described below with reference to Examples 1 to 8.
特性評価 （１）半田広がり：250℃に保持した半田浴上に50mm×5
0mmの試験片を静止し、その上に重量0.4gでハゼ折りし
たやに入り半田（JIS Z３２８３、RH50）を置き、１５
秒後の半田広がり面積を測定し評価した。 ○：広がり
面積200mm2以上、×：50mm2以下） （２）半田強度：0.18mmの銅細線２０芯を試験片に置
き、半田ゴテにてやに入り半田（RH50）を用いて、半田
付けを行い、銅線を試験片と逆方向にして、平行に引張
って強制的に破壊を試み、その状態を評価した。○：破
壊なし、×：完全破壊 （３）耐食性：ＪＩＳ Ｚ ２３７１による塩水噴霧試
験を２サイクル行い（１サイクル：８時間噴霧、１６時
間停止）、赤錆発生の有無によって評価した。○：赤錆
なし、×：全面赤錆 （４）加工性：エリクセン張出し（Ｅｒ＝７mm）、およ
びデュポン衝撃（1/2″×１kg×３０cm）を行い、セロ
テープで加工部のめっきの密着性を評価した。○：剥離
なし （５）経時変化：恒温恒湿（60℃、RH95％以上）で1,00
0時間経時後の外観（変色）を観察しさらに前述の半田
広がり性を評価した。○：変色なし、×全面変色 （６）半田浴中へのZnの溶け込み：めっき鋼板の５cm×
５cmケミコフラックス（ケミコート株式会社）に１秒浸
漬し、直ちにＨ６０Ａの250℃の半田浴中に５秒浸漬
し、引きあげた試料を塩酸で溶解後、原子吸光分析法で
Znを分析し、半田 浴中へのZnの溶け込み量を算出した。○：０〜20％、
△：20〜50％、×：50〜100％ 表２の実施例１〜８に示したように、本発明のめっきは
耐食性、半田性、経時性、経済性、半田浴中へのZnの溶
け込みにおいて優れた効果を示した。Characteristic evaluation (1) Solder spread: 50mm × 5 on the solder bath kept at 250 ℃
Hold a 0 mm test piece stationary, place a bald fold solder with a weight of 0.4 g on it and place solder (JIS Z3283, RH50) on it.
The solder spreading area after 2 seconds was measured and evaluated. ○: Spread area 200 mm 2 or more, ×: 50 mm 2 or less) (2) Solder strength: 0.18 mm copper fine wire 20 cores is placed on a test piece, and soldered with a soldering iron and solder (RH50) Then, the copper wire was set in the direction opposite to the test piece, and the copper wire was pulled in parallel to forcibly attempt the breakage, and the state was evaluated. ◯: No destruction, ×: Complete destruction (3) Corrosion resistance: A salt spray test according to JIS Z 2371 was performed for 2 cycles (1 cycle: 8 hours spraying, 16 hours stop), and the presence or absence of red rust was evaluated. ○: No red rust, ×: Full red rust (4) Workability: Erichsen overhang (Er = 7mm) and DuPont impact (1/2 ″ × 1kg × 30cm) were performed, and the adhesiveness of the plating on the processed part was evaluated with cellophane tape. ○: No peeling (5) Change over time: 1,00 at constant temperature and humidity (60 ℃, RH 95% or more)
The appearance (discoloration) after a lapse of 0 hours was observed, and the solder spreadability was evaluated. ○: No discoloration, × Discoloration on all surfaces (6) Penetration of Zn into solder bath: 5 cm of plated steel plate ×
Immerse the sample in 5 cm Chemicoflux (Chemicort Co., Ltd.) for 1 second, then immediately in a solder bath of H60A at 250 ° C for 5 seconds, dissolve the sample with hydrochloric acid, and then by atomic absorption spectrometry.
Analyze Zn and solder The amount of Zn dissolved in the bath was calculated. ○: 0 to 20%,
Δ: 20 to 50%, ×: 50 to 100% As shown in Examples 1 to 8 of Table 2, the plating of the present invention has corrosion resistance, solderability, aging property, economical efficiency, and Zn content in the solder bath. It showed an excellent effect in melting.
［発明の効果］ 本発明の複層めっき鋼板は、半田付け性のみならず耐食
性、経時性および半田浴へのZnの溶け込みの抑制に優れ
ているので、これらの諸特性の要求される半田の可能な
鋼板として広く用いられる。[Effects of the Invention] The multi-layer plated steel sheet of the present invention is excellent not only in solderability but also in corrosion resistance, aging property and suppression of dissolution of Zn into the solder bath. Widely used as a possible steel plate.
フロントページの続き (72)発明者 近藤 嘉一 山口県下松市大字西豊井1651番地 (56)参考文献 特開 昭57−92192（ＪＰ，Ａ) 特開 昭56−55592（ＪＰ，Ａ) 特公 昭60−56436（ＪＰ，Ｂ２)Continuation of the front page (72) Inventor Kaichi Kondo 1651 Nishi-Toyoi, Kudamatsu City, Yamaguchi Prefecture (56) References JP-A-57-92192 (JP, A) JP-A-56-55592 (JP, A) JP 60-56436 (JP, B2)
Claims (1)
めっき、あるいはZnにNi,Co,Fe,Cu,Snの一種以上を含む
合金めっきと中間層に0.1〜10g/m2のFe,NiまたはCoの単
独あるいは合金めっきと上層（最外層）に0.05〜５g/m2
のZn,Sn,Cu単独あるいは合金めっき、または、これらの
金属とPb,Co,Niの一種以上を含む合金めっきからなる半
田付け性に優れた複層めっき鋼板。1. A Zn single plating of 1 to 50 g / m 2 as a lower layer on a steel sheet, or an alloy plating containing one or more of Ni, Co, Fe, Cu and Sn in Zn and 0.1 to 10 g / m 2 as an intermediate layer. 2 Fe, Ni or Co alone or alloy plating and 0.05 to 5 g / m 2 in the upper layer (outermost layer)
A multi-layer plated steel sheet having excellent solderability, which comprises Zn, Sn, Cu alone or alloy plating, or alloy plating containing one or more of these metals and Pb, Co, Ni.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61233323A JPS6388085A (en) | 1986-10-02 | 1986-10-02 | Post-treatment of plated steel sheet |
| JP62201023A JPH0611920B2 (en) | 1986-10-02 | 1987-08-13 | Multi-layer plated steel sheet with excellent solderability |
| CA000551642A CA1332130C (en) | 1986-10-02 | 1987-11-12 | Method for post-treatment of plated steel sheet for soldering |
| FR8715773A FR2623212B1 (en) | 1986-10-02 | 1987-11-16 | POST-TREATMENT SOLUTION OF A PLATED STEEL SHEET FOR WELDING, AND METHOD FOR ITS APPLICATION |
| GB8726833A GB2212521B (en) | 1986-10-02 | 1987-11-17 | Method for post-treatment of plated steel sheet for soldering |
| DE19873740177 DE3740177A1 (en) | 1986-10-02 | 1987-11-26 | METHOD FOR POST-TREATING COATED STEEL SHEET |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61233323A JPS6388085A (en) | 1986-10-02 | 1986-10-02 | Post-treatment of plated steel sheet |
| JP62201023A JPH0611920B2 (en) | 1986-10-02 | 1987-08-13 | Multi-layer plated steel sheet with excellent solderability |
| CA000551642A CA1332130C (en) | 1986-10-02 | 1987-11-12 | Method for post-treatment of plated steel sheet for soldering |
| FR8715773A FR2623212B1 (en) | 1986-10-02 | 1987-11-16 | POST-TREATMENT SOLUTION OF A PLATED STEEL SHEET FOR WELDING, AND METHOD FOR ITS APPLICATION |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6447894A JPS6447894A (en) | 1989-02-22 |
| JPH0611920B2 true JPH0611920B2 (en) | 1994-02-16 |
Family
ID=39365786
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61233323A Pending JPS6388085A (en) | 1986-10-02 | 1986-10-02 | Post-treatment of plated steel sheet |
| JP62201023A Expired - Fee Related JPH0611920B2 (en) | 1986-10-02 | 1987-08-13 | Multi-layer plated steel sheet with excellent solderability |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61233323A Pending JPS6388085A (en) | 1986-10-02 | 1986-10-02 | Post-treatment of plated steel sheet |
Country Status (5)
| Country | Link |
|---|---|
| JP (2) | JPS6388085A (en) |
| CA (1) | CA1332130C (en) |
| DE (1) | DE3740177A1 (en) |
| FR (1) | FR2623212B1 (en) |
| GB (1) | GB2212521B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0631444B2 (en) * | 1989-06-07 | 1994-04-27 | 東洋鋼板株式会社 | Multi-layer plated steel sheet for solder |
| US5011711A (en) * | 1989-07-18 | 1991-04-30 | Toyo Kohan Co., Ltd. | Method for post-treatment of electroplated steel sheets for soldering |
| JPH03153883A (en) * | 1989-11-13 | 1991-07-01 | Nkk Corp | Multi-ply plated steel sheet having superior lubricity, corrosion resistance and suitability to coating |
| US5069730A (en) * | 1991-01-28 | 1991-12-03 | At&T Bell Laboratories | Water-soluble soldering paste |
| FR2683475B1 (en) * | 1991-11-08 | 1995-07-21 | Geb | BRAZING FLOW. |
| FR2742364B1 (en) * | 1995-12-14 | 1998-01-09 | Lorraine Laminage | METHOD FOR THE SURFACE TREATMENT OF A METAL SHEET FOR STAMPING |
Family Cites Families (35)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB525597A (en) * | 1938-05-16 | 1940-08-30 | Pope S Metaaldraadlampenfabrie | Improved method of soft-soldering insulated flexible electric conductors |
| US2400573A (en) * | 1940-12-09 | 1946-05-21 | Albert Kelvin Smith | Inhibitors |
| US2339200A (en) * | 1941-08-08 | 1944-01-11 | Frank J Sowa | Process for preventing tarnishing of metals |
| US2638449A (en) * | 1949-12-30 | 1953-05-12 | Socony Vacuum Oil Co Inc | Reaction products of fatty acids, dialkanolamines, and alkenyl succinic acid anhydrides |
| GB731121A (en) * | 1952-09-24 | 1955-06-01 | Standard Oil Dev Co | Improvements in or relating to rust preventive compositions |
| BE561643A (en) * | 1957-01-30 | |||
| CH381338A (en) * | 1957-02-13 | 1964-08-31 | Duralumin | Method of electric resistance welding of aluminum or aluminum alloy parts, and apparatus for carrying out the method |
| FR1332533A (en) * | 1961-06-13 | 1963-07-19 | Parker Ste Continentale | Process to facilitate the cold forming of metals without chip removal |
| US3281284A (en) * | 1963-03-25 | 1966-10-25 | Lubrizol Corp | Corrosion-proofing composition |
| DE1239166B (en) * | 1964-08-25 | 1967-04-20 | Metallgesellschaft Ag | Process for chemical surface treatment of metals |
| FR1442210A (en) * | 1965-08-09 | 1966-06-10 | Colloides Ind Francais Sa | Product for the surface protection of copper and copper alloys |
| US3382081A (en) * | 1965-09-02 | 1968-05-07 | Diamond Shamrock Corp | Chemical composition and method |
| GB1125942A (en) * | 1965-12-31 | 1968-09-05 | Borg Holding Ag | Process for the surface treatment of plants containing water and/or steam |
| GB1145206A (en) * | 1966-07-27 | 1969-03-12 | Grosvena Ag | Corrosion inhibiting compositions |
| DE1627741C3 (en) * | 1966-09-30 | 1974-06-20 | Nippon Steel Corp., Tokio | Solid lubricant layer applied to sheet steel to be formed and process for their manufacture |
| US3530017A (en) * | 1967-05-08 | 1970-09-22 | Diversey Corp | Process for surface treatment of metal expansion alloys |
| FR1592166A (en) * | 1968-10-23 | 1970-05-11 | ||
| SE346486B (en) * | 1968-12-23 | 1972-07-10 | Graenges Essem Ab | |
| US3669705A (en) * | 1969-07-09 | 1972-06-13 | Nat Steel Corp | Corrosion resistant articles having a zinc surface and process for preparing the same |
| JPS499022B1 (en) * | 1970-12-11 | 1974-03-01 | ||
| JPS5327694B2 (en) * | 1972-02-05 | 1978-08-10 | ||
| GB1421386A (en) * | 1973-09-19 | 1976-01-14 | Pyrene Chemical Services Ltd | Coating compostions |
| DE2449667B2 (en) * | 1974-10-18 | 1981-01-15 | Wacker-Chemie Gmbh, 8000 Muenchen | Stabilized perchlorethylene |
| JPS5227025A (en) * | 1975-08-27 | 1977-03-01 | Nippon Steel Corp | Surface treatment of galvanized steel iron |
| GB1550648A (en) * | 1976-06-11 | 1979-08-15 | Multicore Solders Ltd | Soft soldering |
| US4077815A (en) * | 1976-12-20 | 1978-03-07 | International Business Machines Corporation | Water soluble flux |
| DE2718364C3 (en) * | 1977-04-25 | 1980-02-07 | Mannesmannroehren-Werke Ag, 4000 Duesseldorf | Process for the corrosion protection of iron and steel by phosphating and post-treatment with an anti-rust oil |
| AU533705B2 (en) * | 1978-06-07 | 1983-12-08 | Albright & Wilson Limited | De-watering of metal surfaces |
| JPS5655592A (en) * | 1979-10-08 | 1981-05-16 | Nippon Kokan Kk <Nkk> | Surface-treated steel sheet excellent in corrosion resistance after painted |
| JPS5922793B2 (en) * | 1979-10-23 | 1984-05-29 | 新日本製鐵株式会社 | Rust prevention treatment method for steel materials |
| JPS5714751A (en) * | 1980-06-30 | 1982-01-26 | Yokogawa Hokushin Electric Corp | Vortex current type measuring apparatus |
| JPS5792192A (en) * | 1980-11-27 | 1982-06-08 | Sumitomo Metal Ind Ltd | Multiply plated steel plate |
| JPS5996291A (en) * | 1982-11-24 | 1984-06-02 | Kawasaki Steel Corp | One-side zinc-plated steel sheet |
| JPS59116397A (en) * | 1982-12-21 | 1984-07-05 | Sumitomo Metal Ind Ltd | Corrosion preventive steel sheet having high corrosion resistance |
| JPS6056436A (en) * | 1983-09-08 | 1985-04-02 | Mitsubishi Heavy Ind Ltd | Die forging method |
-
1986
- 1986-10-02 JP JP61233323A patent/JPS6388085A/en active Pending
-
1987
- 1987-08-13 JP JP62201023A patent/JPH0611920B2/en not_active Expired - Fee Related
- 1987-11-12 CA CA000551642A patent/CA1332130C/en not_active Expired - Fee Related
- 1987-11-16 FR FR8715773A patent/FR2623212B1/en not_active Expired - Fee Related
- 1987-11-17 GB GB8726833A patent/GB2212521B/en not_active Expired - Lifetime
- 1987-11-26 DE DE19873740177 patent/DE3740177A1/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2623212B1 (en) | 1994-05-13 |
| CA1332130C (en) | 1994-09-27 |
| GB8726833D0 (en) | 1987-12-23 |
| FR2623212A1 (en) | 1989-05-19 |
| JPS6447894A (en) | 1989-02-22 |
| DE3740177A1 (en) | 1989-06-08 |
| GB2212521B (en) | 1992-07-22 |
| GB2212521A (en) | 1989-07-26 |
| JPS6388085A (en) | 1988-04-19 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20050217757A1 (en) | Preflux, flux, solder paste and method of manufacturing lead-free soldered body | |
| JP4086949B2 (en) | Metal coated member | |
| JPH0978287A (en) | Material for electric contact and electric contact part | |
| JP2006219736A (en) | Surface-treated al sheet | |
| JP2005169495A (en) | Pre-flux, flux, solder paste and fabrication method of structure joined with lead-free solder | |
| JP4518507B2 (en) | Metal surface treatment agent | |
| JPH0148355B2 (en) | ||
| JPH0611920B2 (en) | Multi-layer plated steel sheet with excellent solderability | |
| JP4039653B2 (en) | Sn alloy for lead plating | |
| JP5649139B2 (en) | Surface coating layer structure on copper surface | |
| JPH0144438B2 (en) | ||
| JPH0631444B2 (en) | Multi-layer plated steel sheet for solder | |
| JP4888992B2 (en) | Method for producing surface-treated Al plate | |
| JPH06957B2 (en) | Double-layer plated steel sheet with excellent solderability | |
| US5631091A (en) | Bismuth coating protection for copper | |
| JPH0631442B2 (en) | Multi-layer plated steel sheet for solder | |
| JP2798512B2 (en) | Tin-plated copper alloy material and method for producing the same | |
| JPH01259195A (en) | Tin coated copper or copper alloy material | |
| JP5137317B2 (en) | Electronic components | |
| JP3173982B2 (en) | Lead-free solder plating bath and solder plating film obtained thereby | |
| JPS6024197B2 (en) | Pb alloy insoluble anode for electroplating | |
| JP4014739B2 (en) | Reflow Sn plating material and terminal, connector, or lead member using the reflow Sn plating material | |
| JP3767169B2 (en) | Method for manufacturing solder coating material | |
| JP2002256481A (en) | Steel sheet with plated bilayer superior in solder wettability and corrosion resistance | |
| JP2004238689A (en) | Plating material, terminal for electronic component, connector, lead member, and semiconductor device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |