JPH0611639Y2 - Surface wave device - Google Patents
Surface wave deviceInfo
- Publication number
- JPH0611639Y2 JPH0611639Y2 JP16405086U JP16405086U JPH0611639Y2 JP H0611639 Y2 JPH0611639 Y2 JP H0611639Y2 JP 16405086 U JP16405086 U JP 16405086U JP 16405086 U JP16405086 U JP 16405086U JP H0611639 Y2 JPH0611639 Y2 JP H0611639Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead
- lead terminal
- wave device
- acoustic wave
- surface acoustic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Description
【考案の詳細な説明】 〈産業上の利用分野〉 この考案は表面波装置、更に詳しくは、表面波基板に取
付けるリード端子の構造に関するものである。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a surface acoustic wave device, and more particularly to a structure of a lead terminal attached to a surface acoustic wave substrate.
〈従来の技術と問題点〉 第５図と第６図は表面波装置の構造を示しており、表面
波基板１の表面に表面波用の櫛歯電極２、３、４、５と
四隅部分に各電極の引出電極６、７、８、９を設け、更
に基板１の裏面に導電性材料を用いたシールド電極10を
設けてエレメント11を形成し、このエレメント11の各引
出電極６、７、８、９及びシールド電極10にリード端子
12、13、14、15及び16を半田付けにより接続して同じ方
向に引出し、エレメント11の外周にモールド樹脂17を施
し、櫛歯電極２、３、４、５上及び表面波伝搬路上のダ
ンピング剤18間に空洞19を設けて構成されている。<Prior Art and Problems> FIGS. 5 and 6 show the structure of a surface acoustic wave device. The surface acoustic wave substrate 1 has a comb-shaped electrode 2, 3, 4, 5 for surface acoustic waves and four corners on the surface thereof. The extraction electrodes 6, 7, 8 and 9 of the respective electrodes are provided on the substrate 1, and the shield electrode 10 made of a conductive material is further provided on the back surface of the substrate 1 to form the element 11, and the extraction electrodes 6 and 7 of the element 11 are formed. , 8 and 9 and shield electrode 10 with lead terminals
12, 13, 14, 15 and 16 are connected by soldering and drawn out in the same direction, a mold resin 17 is applied to the outer periphery of the element 11, and the comb tooth electrodes 2, 3, 4, 5 and the damping on the surface wave propagation path are provided. A cavity 19 is provided between the agents 18.
第４図は上記表面波装置に用いられている従来のリード
端子の具体的な構造を示しており、耐引抜強度を向上さ
せるため、リード端子12、13、14、15の途中に折曲り部
20を設け、特に両端に位置するリード端子12、14には折
曲り部20の次に凹欠部21を連ねて設け、この凹欠部21内
にモールド樹脂17を入れることにより耐引抜強度を持た
せている。FIG. 4 shows a specific structure of a conventional lead terminal used in the above-mentioned surface acoustic wave device. In order to improve the pull-out resistance, a bent portion is formed in the middle of the lead terminals 12, 13, 14, and 15.
20 is provided, and in particular, lead terminals 12 and 14 located at both ends are provided with a recessed portion 21 next to the bent portion 20, and a molding resin 17 is placed in the recessed portion 21 to improve pull-out resistance. I have it.
ところで、折曲り部20と凹欠部21を設けたリード端子1
2、14は、寸法的に長くなり、モールド樹脂17の仕上り
高さ寸法Ｈが例えば10mmになる。By the way, the lead terminal 1 provided with the bent portion 20 and the recessed portion 21
2 and 14 are dimensionally long, and the finished height dimension H of the mold resin 17 is, for example, 10 mm.
このため、上記高さ寸法Ｈが５mm程度になる低背化をは
かる場合、第３図に示すようなリード端子構造を採用す
る必要がある。Therefore, in order to reduce the height of the height H to about 5 mm, it is necessary to adopt a lead terminal structure as shown in FIG.
即ち、両端部のリード端子12、14において、その途中に
鍔22を設け、前記凹欠部21を省いて長さ寸法を短くすれ
ばよい。That is, the lead terminals 12 and 14 at both ends may be provided with the collar 22 in the middle thereof and the recess 21 may be omitted to shorten the length dimension.
しかし、鍔22を備えたリード端子12、14を用いて樹脂モ
ールドタイプの表面波装置を作った場合、端子曲げ強度
試験を行なうと、第３図において、両端リード端子12、
14は細くなった部分Ａで曲りが生じ、この部分Ａから下
のモールド樹脂17が剥離し、最悪の場合、端子折れが発
生する。However, when a resin-molded surface acoustic wave device is made by using the lead terminals 12 and 14 provided with the collar 22, when a terminal bending strength test is performed, it is shown in FIG.
Bending occurs at the thinned portion A of the resin 14, and the molding resin 17 below is peeled off from this portion A, and in the worst case, terminal breakage occurs.
また、リード端子の引張り試験を行なうと、第３図の一
点鎖線のように、リード端子12、14は股さけ状態とな
り、モールド樹脂17が剥離するどころか、端子の折れあ
るいは半田付部分からの剥離が発生するという問題があ
る。When the lead terminal is subjected to a tensile test, the lead terminals 12 and 14 are in a claw-like state as shown by the alternate long and short dash line in FIG. 3, and the mold resin 17 is not peeled off, but is broken or peeled from the soldered portion. There is a problem that occurs.
この考案は上記のような問題を解決するためになされた
ものであり、リード端子の曲げ及び引張り強度が向上
し、モールド樹脂の剥離や端子の折れ発生を防止するこ
とができる表面波装置を提供することを目的とする。The present invention has been made in order to solve the above problems, and provides a surface wave device capable of improving bending and tensile strength of a lead terminal and preventing peeling of a molding resin and breakage of the terminal. The purpose is to do.
〈問題点を解決するための手段〉 上記のような問題点を解決するため、この考案は、リー
ド端子の途中でモールド樹脂内に埋まる位置に鍔を設
け、このリード端子の鍔と電極への取付端部との間に一
面側へ突出するリブを長手方向に沿って形成した構造と
したものである。<Means for Solving Problems> In order to solve the above problems, the present invention provides a collar at a position to be embedded in the mold resin in the middle of the lead terminal, and connects the collar of the lead terminal and the electrode. The structure is such that a rib protruding toward one surface is formed along the longitudinal direction between the mounting end and the mounting end.
〈作用〉 エレメントの引出電極に半田付けによって接続するリー
ド端子は、リブによって補強されると共に、リブの凹入
溝内に引出電極との接続用半田又はモールド樹脂の何れ
か一方もしくは両方を流入させ、リード端子の曲げ強度
及び引張り強度を向上させる。<Operation> The lead terminal to be connected to the lead-out electrode of the element by soldering is reinforced by the ribs, and either or both of the solder for connection with the lead-out electrode or the mold resin is made to flow into the groove of the rib. , Improve the bending strength and tensile strength of the lead terminal.
〈実施例〉 以下、この考案の実施例を添付図面の第１図と第２図に
もとづいて説明する。<Embodiment> An embodiment of the present invention will be described below with reference to FIGS. 1 and 2 of the accompanying drawings.
なお、第３図ないし第６図と同一部分は同じ符号を付す
ことによって説明に代える。It should be noted that the same parts as those in FIGS. 3 to 6 are denoted by the same reference numerals and will not be described.
第１図のように、リード端子の基本的な構造は第３図と
同様であり、各リード端子12、13、14、15と16は一枚の
金属板から打抜かれ、リード端子12、13、14、15は途中
が折曲がり、両端に位置するリード端子12、14は折曲が
り部分に鍔22が設けられている。As shown in FIG. 1, the basic structure of the lead terminals is the same as that of FIG. 3, and each of the lead terminals 12, 13, 14, 15 and 16 is punched out from a single metal plate to obtain the lead terminals 12, 13. , 14, 15 are bent in the middle, and lead terminals 12, 14 located at both ends are provided with flanges 22 at the bent portions.
両端に位置するリード端子12、14には鍔22と引出電極へ
の接続側端部23との間に第２図に示すような断面形状の
リブ24が長手方向に沿って設けられている。The lead terminals 12 and 14 located at both ends are provided with ribs 24 having a cross-sectional shape as shown in FIG. 2 along the longitudinal direction between the flange 22 and the end portion 23 on the side connected to the extraction electrode.
このリブ24は図示の場合、鍔22の下の部分から接続側端
部23との間に設けたが、鍔22の上端から上部の位置に設
けてもよい。In the illustrated case, the rib 24 is provided between the lower portion of the collar 22 and the connecting side end portion 23, but it may be provided at a position above the upper end of the collar 22.
また、図面では、内側に位置するリード端子13、15の折
曲り部分に鍔25を設け、この鍔25の横に前記と同様のリ
ブ24を形成した例を示している。Further, in the drawing, an example is shown in which the flange 25 is provided at the bent portion of the lead terminals 13 and 15 located inside, and the rib 24 similar to the above is formed next to the flange 25.
この考案の表面波装置は上記のような構造のリード端子
を用いて構成するものであり、リード端子12、13、14、
15を引出電極６、７、８、９に、またリード端子16を裏
面のシールド電極10に各々半田付けによって接続し、こ
の後表面波基板１の表面にワックスを塗布し、エレメン
ト11を溶融樹脂内に浸漬してその外周にモールド樹脂17
を施す。The surface acoustic wave device of the present invention is configured by using the lead terminals having the above-described structure. The lead terminals 12, 13, 14,
15 is connected to the extraction electrodes 6, 7, 8 and 9 and the lead terminal 16 is connected to the shield electrode 10 on the rear surface by soldering, and then wax is applied to the surface of the surface acoustic wave substrate 1 to melt the element 11 onto the molten resin. Immerse inside and mold resin 17
Give.
次に、加熱処理を行ないワックスをモールド樹脂17内に
吸引し、エレメント11の櫛歯電極上及び表面波伝搬路上
に空洞を形成して製品を完成する。Next, heat treatment is performed to suck the wax into the mold resin 17 to form cavities on the comb electrodes of the element 11 and on the surface wave propagation path to complete the product.
上記モールド樹脂17の形成時において樹脂の一部をリブ
24の凹入溝24ａ内に流入させ、リード端子12、13、14、
15の曲げ強度及び引張り強度を向上させる。When the molding resin 17 is formed, a part of the resin is ribbed.
24 into the recessed groove 24a, the lead terminals 12, 13, 14,
Improve the bending strength and tensile strength of 15.
即ち、リード端子12、13、14、15のモールド樹脂17内に
埋まる部分は、リブ24の形成によって耐折曲り強度が向
上し、しかもリブ24の凹入溝24ａ内に流入した樹脂がリ
ブ24を設けた部分を補強すると同時に、リード端子とモ
ールド樹脂17の接触量が多くなるため、リード端子12、
13、14、15は負荷が作用すると、鍔22又は25の下端部分
で曲がり、負荷を吸収することにより、耐曲げ及び引張
り強度を向上させる。That is, the portions of the lead terminals 12, 13, 14, 15 that are buried in the mold resin 17 have improved bending resistance due to the formation of the ribs 24, and the resin that has flowed into the recessed groove 24a of the ribs 24 has the ribs 24a. Since the amount of contact between the lead terminal and the molding resin 17 increases at the same time as reinforcing the portion provided with, the lead terminal 12,
When a load is applied, 13, 14 and 15 bend at the lower end portion of the collar 22 or 25 to absorb the load, thereby improving bending resistance and tensile strength.
なお、リード端子12、13、14、15は半田付けによって引
出電極６、７、８、９に取付けるが、このとき、半田を
リブ24の凹入溝24ａ内に流し込み、リード端子の強度を
向上させるようにしてもよい。The lead terminals 12, 13, 14, 15 are attached to the extraction electrodes 6, 7, 8, 9 by soldering. At this time, the solder is poured into the recessed groove 24a of the rib 24 to improve the strength of the lead terminal. You may allow it.
また、リブ24の凹入溝24ａは上記のようにモールド樹脂
17又は半田の何れか一方で埋めるほか、モールド樹脂と
半田の両者で埋めるようにしてもよい。Further, the recessed groove 24a of the rib 24 is formed by molding resin as described above.
It may be filled with either 17 or solder, or may be filled with both mold resin and solder.
ちなみに両端のリード端子12、14の引張り及び曲げ強度
の試験を行なったところ、引張り強度試験においては、
従来500ｇ−30ｓ保持でも破損が生じたが、この考案は
この試験をクリアするだけでなく１Kg−15ｓ保持にも耐
えることができた。By the way, when the tensile strength and bending strength of the lead terminals 12 and 14 at both ends were tested, in the tensile strength test,
Conventionally, damage occurred even after holding for 500g-30s, but this device not only passed this test, but could also hold for 1Kg-15s.
また曲げ強度試験において、両端のリード端子12、14に
300ｇの重りをつけ90°曲げを行なったところ、従来は
破損や剥離が生じたが、この考案はこれをクリアすると
共に、更に500ｇの90°曲げにも耐えることができた。In addition, in the bending strength test,
When a weight of 300 g was applied and bent 90 °, breakage and peeling occurred in the past, but this invention was able to clear this and also withstand 90 g of 500 g.
〈効果〉 以上のように、この考案によると、エレメントの外側を
モールド樹脂で被覆するタイプの表面波装置において、
リード端子の引張り及び曲げに対する強度が大幅に向上
し、リード端子の折れや引出電極からの剥離及びモール
ド樹脂の剥離発生がなくなるという効果がある。<Effect> As described above, according to the present invention, in the surface acoustic wave device of the type in which the outside of the element is covered with the mold resin,
The strength of the lead terminal against pulling and bending is significantly improved, and there is an effect that the lead terminal is not bent, and peeling from the lead electrode and peeling of the molding resin do not occur.
第１図はこの考案に係る表面波装置のリード端子構造を
示す正面図、第２図はリード端子のリブ部分を示す拡大
断面図、第３図は改良前のリード端子構造を示す正面
図、第４図は従来のリード端子構造を示す正面図、第５
図は表面波装置の基本的な構造を示す正面図、第６図は
同上の縦断面図である。 １……表面波基板 ２、３、４、５……櫛歯電極 ６、７、８、９……引出電極 10……シールド電極、11……エレメント 12、13、14、15、16……リード端子 17……モールド樹脂、19……空洞 22……鍔、24……リブ、24ａ……凹入溝1 is a front view showing a lead terminal structure of a surface acoustic wave device according to the present invention, FIG. 2 is an enlarged sectional view showing a rib portion of the lead terminal, FIG. 3 is a front view showing a lead terminal structure before improvement, FIG. 4 is a front view showing a conventional lead terminal structure, and FIG.
FIG. 6 is a front view showing the basic structure of the surface acoustic wave device, and FIG. 6 is a vertical sectional view of the same. 1 ... Surface wave substrate 2, 3, 4, 5 ... Comb-tooth electrode 6, 7, 8, 9 ... Extraction electrode 10 ... Shield electrode, 11 ... Element 12, 13, 14, 15, 16 ... Lead terminal 17: Mold resin, 19: Hollow 22: Tsuba, 24: Rib, 24a: Recessed groove
Claims (2)
と、基板の四隅部分に各表面波電極の引出電極とを設
け、各引出電極にリード端子を接続して同一方向に引出
し、表面波基板の外側にモールド樹脂を施した表面波装
置において、リード端子の途中でモールド樹脂内に埋ま
る位置に鍔を設け、このリード端子の鍔と電極への取付
側端部との間に一面側へ突出するリブを長手方向に沿っ
て形成したことを特徴とする表面波装置。1. A surface wave electrode having a comb-teeth shape or the like is provided on the surface of a surface wave substrate, and lead electrodes of the surface wave electrodes are provided at four corners of the substrate, and lead terminals are connected to the lead electrodes to connect in the same direction. In a surface acoustic wave device in which a molding resin is applied to the outside of the lead-out and surface wave substrate, a flange is provided at a position where it is embedded in the molding resin in the middle of the lead terminal, and between the flange of the lead terminal and the end of the electrode mounting side A surface acoustic wave device characterized in that a rib protruding toward one surface is formed along the longitudinal direction.
子取付用半田又はモールド樹脂の何れか一方又は両方を
流し込んだ実用新案登録請求の範囲第１項記載の表面波
装置。2. The surface acoustic wave device according to claim 1, wherein either one or both of the terminal mounting solder and the mold resin are poured into the recessed groove of the rib formed on the lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16405086U JPH0611639Y2 (en) | 1986-10-25 | 1986-10-25 | Surface wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16405086U JPH0611639Y2 (en) | 1986-10-25 | 1986-10-25 | Surface wave device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6370727U JPS6370727U (en) | 1988-05-12 |
| JPH0611639Y2 true JPH0611639Y2 (en) | 1994-03-23 |
Family
ID=31092811
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16405086U Expired - Lifetime JPH0611639Y2 (en) | 1986-10-25 | 1986-10-25 | Surface wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0611639Y2 (en) |
-
1986
- 1986-10-25 JP JP16405086U patent/JPH0611639Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6370727U (en) | 1988-05-12 |
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