JPH0128688Y2 - - Google Patents
Info
- Publication number
- JPH0128688Y2 JPH0128688Y2 JP18968283U JP18968283U JPH0128688Y2 JP H0128688 Y2 JPH0128688 Y2 JP H0128688Y2 JP 18968283 U JP18968283 U JP 18968283U JP 18968283 U JP18968283 U JP 18968283U JP H0128688 Y2 JPH0128688 Y2 JP H0128688Y2
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- substrate
- container
- auxiliary terminal
- auxiliary
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 10
- 239000012212 insulator Substances 0.000 claims description 3
- 239000011347 resin Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000002184 metal Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【考案の詳細な説明】
〔考案の属する技術分野〕
本考案は、例えばパワートランジスタモジユー
ルなどのように容器と絶縁されている半導体素体
の上方に引き出される主端子のほかに設けられる
補助端子のように側方において上向きに引き出さ
れる端子を有する半導体装置に関する。[Detailed description of the invention] [Technical field to which the invention pertains] The invention relates to an auxiliary terminal provided in addition to a main terminal drawn out above a semiconductor element insulated from a container, such as a power transistor module. This invention relates to a semiconductor device having a terminal that is pulled out upward from the side.
容器基板あるいは支持体との取付け部が電位を
持たない絶縁型半導体装置において引き出される
端子は、導電性容器基板と絶縁された半導体素体
支持板上に直接固定するかセラミツク板のような
絶縁板を介して固定し半導体素体の電極との間を
導線等によつて接続していた。しかしそのように
設けられる主端子のほかに補助端子を設ける場合
場所の関係、あるいはコストの関係から容器内に
注入される樹脂によつて補助端子を固定する方法
がとられていた。第１図ａ，ｂはそのような補助
端子を示し、金属基板１、絶縁側枠２、絶縁蓋体
３からなる容器内に収容された半導体素体から蓋
体３を貫通して上方へ引き出された主端子４のほ
かに、側方において上方へ引き出される補助端子
５は容器内に注入される樹脂６によつて固定され
る。しかしこの樹脂６は半導体素体を覆う応力吸
収のためのバツフアコート７の上に注入されるた
め、補助端子５は特に上から下へ向く力に対する
機械的強度が弱いという欠点があつた。
In an insulated semiconductor device where the attachment part to the container substrate or support body does not have a potential, the terminals to be drawn out should be fixed directly on the semiconductor element support plate that is insulated from the conductive container substrate, or fixed on an insulating plate such as a ceramic plate. The electrodes of the semiconductor element were connected to each other by conductive wires or the like. However, when an auxiliary terminal is provided in addition to the main terminal, the auxiliary terminal has been fixed using resin injected into the container due to space constraints or cost considerations. FIGS. 1a and 1b show such auxiliary terminals, which are pulled out from a semiconductor body housed in a container consisting of a metal substrate 1, an insulating side frame 2, and an insulating lid 3 through the lid 3. In addition to the main terminal 4, which is pulled out laterally and upwardly, the auxiliary terminal 5 is fixed by resin 6 poured into the container. However, since this resin 6 is injected onto the buffer coat 7 for absorbing stress that covers the semiconductor element, the auxiliary terminal 5 has a disadvantage in that its mechanical strength is weak, especially against forces directed from above to below.
本考案は上述の補助端子のように半導体素体の
側方において上方に引き出される端子を低コスト
でかつ端子強度が十分であるように固定した半導
体装置を提供することを目的とする。
SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor device in which terminals, such as the above-mentioned auxiliary terminals, which are drawn upward from the sides of a semiconductor body are fixed at low cost and with sufficient terminal strength.
本考案は基板に対して垂直に引き出される端子
の下部を基板上に支持された絶縁体の溝に挿入す
ることによつて上述の目的を達成する。
The present invention achieves the above object by inserting the lower part of the terminal, which is drawn out perpendicularly to the substrate, into the groove of the insulator supported on the substrate.
第２図ａ，ｂは本考案の一実施例を示し、この
場合補助端子５は金属基板１の上に立てられた絶
縁板８の溝９に差し込まれている。この絶縁板８
は例えば低価格のガラスエポキシ板よりなり、端
子５と共に樹脂６により固定されるので、はんだ
あるいは接着材を用いる必要はなく、補助端子５
に上から下向きに加わる力は絶縁板８によつて支
えられて機械的に安定になる。
FIGS. 2a and 2b show an embodiment of the present invention, in which the auxiliary terminal 5 is inserted into a groove 9 of an insulating plate 8 set up on a metal substrate 1. This insulating plate 8
is made of, for example, a low-cost glass epoxy plate, and is fixed together with the terminal 5 by the resin 6, so there is no need to use solder or adhesive, and the auxiliary terminal 5
The force applied downward from above is supported by the insulating plate 8 and becomes mechanically stable.
第３図は別の実施例で、補助端子５は容器側枠
の２の突出部２１に設けられた溝９に差し込まれ
ている。この場合補助端子５は上下方向には突出
部２１により、横方向には側枠２の壁により支え
られるのでより一層安定になる。 FIG. 3 shows another embodiment, in which the auxiliary terminal 5 is inserted into a groove 9 provided in two protrusions 21 of the side frame of the container. In this case, the auxiliary terminal 5 is supported by the protrusion 21 in the vertical direction and by the wall of the side frame 2 in the lateral direction, making it even more stable.
本考案は容器基板に支持された半導体素体から
素体の側方において上方に引き出される端子を基
板上に支持された絶縁体の溝に挿入して支持する
もので高価なセラミツク板を用いる必要もなく、
またろう付け、接着等の工数も要しないので安価
に端子強度の信頼性を向上させることができる。
The present invention involves inserting and supporting a terminal drawn upward from a semiconductor element supported on a container substrate on the side of the element into a groove in an insulator supported on the substrate, which necessitates the use of an expensive ceramic plate. Without any
Furthermore, since no man-hours are required for brazing, adhesion, etc., the reliability of the terminal strength can be improved at low cost.
第１図は従来の補助端子の支持状態を示し、ａ
は一部破砕正面断面図、ｂは側面図、第２図は本
考案の一実施例の補助端子の支持状態を示し、ａ
は一部破砕正面断面図、ｂは側断面図、第３図は
異なる実施例の要部断面図である。
１……金属基板、２……絶縁側枠、５……補助
端子、６……注型樹脂、８……絶縁板、９……
溝。
Figure 1 shows the supporting state of the conventional auxiliary terminal, a
2 is a partially fragmented front sectional view, b is a side view, FIG.
3 is a partially fragmented front sectional view, b is a side sectional view, and FIG. 3 is a sectional view of a main part of a different embodiment. DESCRIPTION OF SYMBOLS 1...Metal board, 2...Insulating side frame, 5...Auxiliary terminal, 6...Casting resin, 8...Insulating plate, 9...
groove.
Claims (1)
方において上方へ引き出される端子の下部が基板
上に支持された絶縁体の溝に挿入されたことを特
徴とする半導体装置。 1. A semiconductor device characterized in that a lower part of a terminal pulled out upward on the side of a semiconductor body fixed on a conductive container substrate is inserted into a groove in an insulator supported on the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18968283U JPS6096845U (en) | 1983-12-08 | 1983-12-08 | semiconductor equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18968283U JPS6096845U (en) | 1983-12-08 | 1983-12-08 | semiconductor equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6096845U JPS6096845U (en) | 1985-07-02 |
| JPH0128688Y2 true JPH0128688Y2 (en) | 1989-08-31 |
Family
ID=30408897
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18968283U Granted JPS6096845U (en) | 1983-12-08 | 1983-12-08 | semiconductor equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6096845U (en) |
-
1983
- 1983-12-08 JP JP18968283U patent/JPS6096845U/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6096845U (en) | 1985-07-02 |
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