JPH06107499A - Production of sic whisker - Google Patents

Production of sic whisker

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Publication number
JPH06107499A
JPH06107499A JP27949892A JP27949892A JPH06107499A JP H06107499 A JPH06107499 A JP H06107499A JP 27949892 A JP27949892 A JP 27949892A JP 27949892 A JP27949892 A JP 27949892A JP H06107499 A JPH06107499 A JP H06107499A
Authority
JP
Japan
Prior art keywords
sic
whiskers
diameter
mixed
sio
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP27949892A
Other languages
Japanese (ja)
Inventor
Akira Yamakawa
昭 山川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokai Carbon Co Ltd
Original Assignee
Tokai Carbon Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokai Carbon Co Ltd filed Critical Tokai Carbon Co Ltd
Priority to JP27949892A priority Critical patent/JPH06107499A/en
Publication of JPH06107499A publication Critical patent/JPH06107499A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To efficiently produce thick SiC whiskers having >=2mum diameter by a sublimation-recrystallization method. CONSTITUTION:When the objective SiC whiskers are produced, beta-crystal-based SiC whiskers having such aspect properties as 0.3-1.5mum diameter and 10-100mum length are mixed with a starting material mixture prepd. by blending C with SiO2 in <=2.5 molar ratio of C to SiO2 so that the amt. of carbon remaining in a reactional product obtd. by reducing and carbonizing the mixture is regulated to <=0.5wt.% and formed SiC powder has <=1mum particle diameter or >=0.18deg half-width of (111) diffracted rays. The beta-crystal-based SiC whiskers may be mixed with SiC powder formed from the starting material mixture. The resulting mixture is heat-treated at 1,300-2,200 deg.C in a nonoxidizing atmosphere.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、径太性状のSiCウイ
スカーを製造する方法に係り、詳しくはSiC粉末を昇
華源としてSiCウイスカーを熱処理する工程により効
率よく直径2μm 以上に径太化することが可能なSiC
ウイスカーの製造方法に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing a large diameter SiC whisker, and more specifically, to efficiently increase the diameter to 2 μm or more by a step of heat treating SiC whiskers using SiC powder as a sublimation source. Capable of SiC
The present invention relates to a method of manufacturing whiskers.

【0002】[0002]

【従来の技術】SiCの針状単結晶で構成されるウイス
カーは、比強度、比弾性率、耐熱性、化学的安定性等の
特性面で卓越した性能を示すことから、各種の金属、セ
ラミックス、プラスチックス材料の複合強化材として有
用されている。このうち、特に破壊靭性に乏しいセラミ
ックス材の複合強化には、直径の大きな径太SiCウイ
スカーが効果的とされている。また、ウイスカーは微細
な針状繊維形態を呈しているため、人体の呼吸器系に吸
入された場合に呼吸器障害を起こす危険性が指摘されて
以来、この障害危険度が少ない直径2μm 以上の径太ウ
イスカーの開発が強く要請されている。
2. Description of the Related Art Whiskers made of SiC needle-shaped single crystals show excellent performance in terms of characteristics such as specific strength, specific elastic modulus, heat resistance and chemical stability. , Is used as a composite reinforcing material for plastics materials. Among them, large-diameter SiC whiskers having a large diameter are said to be effective for the composite strengthening of ceramic materials having particularly poor fracture toughness. Moreover, since whiskers have a fine needle-like fiber shape, since it has been pointed out that there is a risk of respiratory damage when inhaled into the respiratory system of the human body, this risk of injury is less than 2 μm in diameter. There is a strong demand for the development of thick whiskers.

【0003】このような事態に対処するため、本出願人
は直径2μm を越える径太タイプのSiCウイスカーを
製造する技術として、直径0.3〜1.5μm 、長さ1
0〜100μm の性状を有するβ結晶型を主体とするS
iCウイスカーを非酸化性雰囲気中で1800〜220
0℃の温度に熱処理する方法(特開平3−37198 号公
報)、前記と同一のSiCウイスカーを原料として少な
くとも30重量%の比率で粒径1μm 以下もしくは(1
11)回折線の半価幅0.18deg 以上のSiC粉末と
混合し、該混合物を非酸化性雰囲気中で1800〜22
00℃の温度で熱処理する方法(特開平3−141200号公
報)を開発した。
In order to cope with such a situation, the present applicant has proposed a technique for producing a thick type SiC whisker having a diameter of more than 2 μm, a diameter of 0.3 to 1.5 μm, and a length of 1.
S mainly composed of β crystal type having a property of 0 to 100 μm
iC whisker 1800-220 in non-oxidizing atmosphere
A method of heat treatment at a temperature of 0 ° C. (Japanese Patent Laid-Open No. 3-37198) is used, and the same SiC whiskers as described above are used as a raw material at a ratio of at least 30% by weight and a particle size of 1 μm or less or
11) Mixing with a SiC powder having a half width of the diffraction line of 0.18 deg or more, and mixing the mixture in a non-oxidizing atmosphere from 1800 to 22
A method of heat treatment at a temperature of 00 ° C (Japanese Patent Laid-Open No. 3-141200) was developed.

【0004】これらの先行技術は、一定条件下の加熱処
理を施すことによりSiCウイスカーが昇華再結晶して
径太化する改質機構を利用したものであるが、特に後者
(特開平3−141200号公報)の方法では混合する特定性
状のSiC粉末が昇華原子の供給源となって比較的簡単
な加熱処理を介して効率よく直径2μm 以上の径太Si
Cウイスカーを得ることができる。
These prior arts utilize a reforming mechanism in which SiC whiskers are sublimed and recrystallized to be thickened by heat treatment under a certain condition. Particularly, the latter (Japanese Patent Laid-Open No. 3-141200). In this method, the SiC powder having a specific property to be mixed serves as a supply source of sublimation atoms, and a thick Si having a diameter of 2 μm or more is efficiently provided through a relatively simple heat treatment.
You can get C whiskers.

【0005】[0005]

【発明が解決しようとする課題】前記の製造方法では、
昇華源として粒径が1μm 以下であるか(111)回折
線の半価幅が0.18deg 以上のSiC粉末を使用する
ことが要件となる。この理由は、前記の要件を満たさな
いと得られるSiCウイスカーに粒状物が多量に混在す
る現象が生じて歩留りの低下を招くためであるが、その
ほかにSiC粉末にカーボン成分が多く含まれていると
径太化が円滑に進行しなくなる問題点がある。
In the above manufacturing method,
It is necessary to use, as a sublimation source, SiC powder having a particle size of 1 μm or less or a half width of (111) diffraction line of 0.18 deg or more. The reason for this is that a large amount of particles are mixed in the obtained SiC whiskers if the above requirements are not met, leading to a decrease in yield. In addition, however, the SiC powder contains a large amount of carbon components. Therefore, there is a problem that the diameter increase does not proceed smoothly.

【0006】一般にSiC粉末の製造手段には、シリカ
を炭素によって還元炭化する方法、ハロゲン化珪素化合
物と炭化水素を気相反応させる方法、有機珪素化合物を
熱分解させる方法が知られている。このうちでは還元炭
化法(アチソン法)が最も工業生産に適しており、直接
にSiC微粉末を製造するための還元炭化法としてC/
SiO2 モル比を3.2〜5.0の範囲に配合した原料
を予熱帯、加熱帯、冷却帯を備える反応容器内で連続的
に自重降下させながら1650〜2100℃の温度に加
熱してSiC化反応をおこなわせる方法(特開昭54−33
899 号公報)も提案されている。ところが、従来の還元
炭化条件では総じて反応生成物中に余剰のカーボン成分
が多く残留するため、本発明の目的にはそのまま適用す
ることができない。
[0006] In general, known methods for producing SiC powder include a method of reducing and carbonizing silica with carbon, a method of reacting a silicon halide compound and hydrocarbon in a gas phase, and a method of thermally decomposing an organic silicon compound. Of these, the reduction carbonization method (Acheson method) is most suitable for industrial production, and C / is used as a reduction carbonization method for directly producing SiC fine powder.
A raw material mixed with a SiO 2 molar ratio in the range of 3.2 to 5.0 is heated to a temperature of 1650 to 2100 ° C. while continuously lowering its own weight in a reaction vessel equipped with a preheating zone, a heating zone and a cooling zone. Method for carrying out SiC formation reaction (JP-A-54-33)
No. 899) has also been proposed. However, since a large amount of surplus carbon component generally remains in the reaction product under the conventional reducing carbonization conditions, it cannot be applied as it is for the purpose of the present invention.

【0007】本発明は、特開平3−141200号公報に記載
した発明において昇華源に用いるSiC粉末の生成条件
およびSiCウイスカーの生成工程に改良を加えたもの
で、その目的は、昇華再結晶法を用いて直径2μm 以上
の径太ウイスカーを効率よく生成させることができるS
iCウイスカーの製造方法を提供することにある。
The present invention is an improvement of the conditions for producing the SiC powder used as a sublimation source and the process for producing the SiC whiskers in the invention described in JP-A-3-141200, and its purpose is to use a sublimation recrystallization method. S can be used to efficiently generate thick whiskers with a diameter of 2 μm or more.
It is to provide a method for manufacturing an iC whisker.

【0008】[0008]

【課題を解決するための手段】上記の目的を達成するた
めの本発明によるSiCウイスカーの製造方法は、直径
0.3〜1.5μm 、長さ10〜100μm のアスペク
ト性状を有するβ結晶型主体のSiCウイスカーを、C
/SiO2 モル比2.5以下の成分系を還元炭化した際
に反応生成物中に残留するカーボン成分が0.5重量%
以下で、生成するSiC粉末の粒径が1μm 以下または
(111)回折線の半価幅が0.18deg 以上になるよ
うに配合したC/SiO2 混合原料もしくは該混合原料
から生成させたSiC粉末と混合し、ついで非酸化雰囲
気中で1300〜2200℃の温度に熱処理することを
構成上の特徴とする。
A method of manufacturing a SiC whisker according to the present invention for achieving the above object comprises a β crystal type main body having an aspect property of a diameter of 0.3 to 1.5 μm and a length of 10 to 100 μm. Of SiC whiskers
0.5% by weight of the carbon component remaining in the reaction product when the component system having a / SiO 2 molar ratio of 2.5 or less is reduced and carbonized.
In the following, a C / SiO 2 mixed raw material or an SiC powder produced from the mixed raw material, which is compounded so that the particle diameter of the generated SiC powder is 1 μm or less or the half width of the (111) diffraction line is 0.18 deg or more. And then heat-treated in a non-oxidizing atmosphere to a temperature of 1300 to 2200 ° C.

【0009】本発明に用いられるSiCウイスカーは、
製造履歴に影響されることなくいずれの方法によって製
造されたものであってもよい。例えばSiCl4 、Si
HCl3 、(CH)3 Siのような分解性珪素化合物を
CH4 、CCl4 、C3 8などの炭材成分と気相反応
させる方法、SiO2 を含む固形状の珪素源原料とカー
ボン粉末を混合するか、籾殻炭のように前記成分を複合
的に含有する物質を加熱反応させる方法等によって製造
されるSiCウイスカー等が使用対象となる。
The SiC whiskers used in the present invention are
It may be manufactured by any method without being affected by the manufacturing history. For example, SiCl 4 , Si
A method of reacting a decomposable silicon compound such as HCl 3 (CH) 3 Si with a carbonaceous material component such as CH 4 , CCl 4 or C 3 H 8 in a gas phase, a solid silicon source material containing SiO 2 and carbon An SiC whisker or the like produced by a method of mixing powders or a method of heating and reacting a substance such as rice husk charcoal that contains the above components in a complex manner is used.

【0010】しかし、SiCウイスカーのアスペクト性
状として直径0.3〜1.5μm 、長さ10〜100μ
m を有するβ結晶型主体のものを選択使用する必要があ
る。この理由は、前記範囲のアスペクト性状を備えるS
iCウイスカーが昇華再結晶による径太効果が最も顕著
に現出し、またβ結晶型主体のものでないと目的とする
直径2μm 以上の径太化改質ができなくなるためであ
る。なお、β結晶型主体のものとは、SiCウイスカー
の結晶系が全てβ型か、α/β混在型であってもβ型が
支配的な形態を意味するが、特に積層欠陥密度が低い高
β比率のものほど少ない粒状物含有量で径太化が進行す
る。最も好適なSiCウイスカーの結晶性状は、下式に
よるα度が20以下で、(111)回折線の半価幅が
0.14deg以下の場合である。 α度 = (H1 ×2/H2)×100 ただし上式において、H1 は粉末X線回折法でCuKα
を線源とした際の2θ約33.5deg に出る回折強度、
2 は2θ約35.6deg に出る回折強度である。
However, SiC whiskers have aspect ratios of 0.3 to 1.5 μm in diameter and 10 to 100 μm in length.
It is necessary to select and use those mainly containing the β crystal type having m. The reason for this is that S having an aspect property in the above range is used.
This is because the iC whiskers have the most prominent effect of the diameter increase due to sublimation recrystallization, and unless the iC whiskers are mainly of the β crystal type, the intended diameter increase modification of 2 μm or more cannot be performed. The β-crystal type mainly means that the SiC whiskers have all the crystal system of β-type or the α / β mixed type is predominantly of β-type, but the stacking fault density is particularly low. The larger the β ratio, the smaller the particle content and the larger the diameter. The most preferable crystal property of SiC whiskers is when the α degree according to the following formula is 20 or less and the half width of the (111) diffraction line is 0.14 deg or less. α degree = (H 1 × 2 / H 2 ) × 100 However, in the above formula, H 1 is CuKα by powder X-ray diffraction method.
When 2 is used as the radiation source, the diffraction intensity at 2θ of about 33.5 deg,
H 2 is the diffraction intensity appearing at 2θ of about 35.6 deg.

【0011】上記性状のSiCウイスカーは、還元炭化
法によりSiC粉末を生成させるC/SiO2 混合原料
もしくは該混合原料から生成させたSiC粉末と混合す
る。この際の重要な要件は、混合原料におけるC/Si
2 モル比が2.5以下の成分系になるように設定し、
反応生成物中に残留するカーボン成分が0.5重量%以
下で、かつ生成するSiC粉末の粒径が1μm 以下また
は(111)回折線の半価幅が0.18deg 以上になる
ように原料配合することである。C/SiO2のモル比
を2.5以下に設定するのは、余剰カーボン成分の含有
量を0.5重量%以下に減少させ、同時に生成するSi
C粉末の粒径を1μm 以下または(111)回折線の半
価幅を0.18deg に保持するための条件となる。
The SiC whiskers having the above-mentioned properties are mixed with a C / SiO 2 mixed raw material for producing SiC powder by the reduction carbonization method or with SiC powder produced from the mixed raw material. The important requirement in this case is C / Si in the mixed raw materials.
Set so that the O 2 molar ratio is 2.5 or less,
The raw material is blended so that the carbon component remaining in the reaction product is 0.5% by weight or less, and the particle size of the produced SiC powder is 1 μm or less or the half width of (111) diffraction line is 0.18 deg or more. It is to be. The C / SiO 2 molar ratio is set to 2.5 or less so that the content of the surplus carbon component is reduced to 0.5% by weight or less and Si produced simultaneously
The condition is that the particle size of the C powder is 1 μm or less or the half width of the (111) diffraction line is maintained at 0.18 deg.

【0012】反応生成物中にカーボン成分が0.5重量
%を越えて残留すると、SiCウイスカーの径太化が減
退すると共に微細な粉末状SiCの混在量が多くなる。
またSiC粉末の粒径が1μm を上廻り、(111)回
折線の半価幅が0.18deg未満になると昇華原子に転
化する比率が減少し、粒状物として残留する率が高くな
る。本発明に最も好適な原料配合は、C/SiO2 のモ
ル比を2.5〜2.0の範囲に調整し、SiCウイスカ
ーの配合量をC/SiO2 混合原料に配合する場合には
少なくとも10重量%、生成SiC粉末に配合する場合
には30重量%以上になるような比率に設定することで
ある。この配合条件により残留カーボン成分が0.5重
量%以下で、粒径1μm 以下または(111)回折線の
半価幅0.18deg 以上のSiC粉末を効率よく確保す
ることができる。そのうえ、残留SiO2 粉末の混在も
すくなくなるから、何ら後処理を施すことなく、そのま
ま使用に供することが可能となる。
When the carbon component remains in the reaction product in an amount of more than 0.5% by weight, the diameter of the SiC whisker is reduced and the amount of fine powdery SiC mixed is increased.
When the particle size of the SiC powder exceeds 1 μm and the full width at half maximum of the (111) diffraction line is less than 0.18 deg, the ratio of conversion to sublimation atoms decreases, and the rate of remaining as a granular material increases. The most preferable raw material blending for the present invention is to adjust the C / SiO 2 molar ratio to a range of 2.5 to 2.0, and to mix the SiC whiskers in the C / SiO 2 mixed raw material at least. The content is set to 10% by weight, and when blended with the produced SiC powder, the ratio is 30% by weight or more. With this blending condition, it is possible to efficiently secure a SiC powder having a residual carbon content of 0.5% by weight or less and a particle size of 1 μm or less or a half width of (111) diffraction line of 0.18 deg or more. In addition, since the residual SiO 2 powder is not mixed easily, it can be used as it is without any post-treatment.

【0013】C/SiO2 を構成する成分系としては、
C成分として炭素粉末、コークス粉末、カーボンブラッ
ク等を、またSiO2 成分として珪砂、シリカゲル、シ
リカゾル等を用いることができるが、これら成分系は可
及的に微細で分散性の良好な混合原料に調製できること
が好ましい。本発明の目的には、カーボンブラックをシ
リカゾル溶液とともに機械的に撹拌して分散混合したの
ち乾燥したものが最適な混合原料となる。
As the component system which constitutes C / SiO 2 ,
Carbon powder, coke powder, carbon black or the like can be used as the C component, and silica sand, silica gel, silica sol or the like can be used as the SiO 2 component, but these component systems are finely mixed and have good dispersibility. Preferably, it can be prepared. For the purpose of the present invention, an optimum mixed raw material is one in which carbon black is mechanically stirred together with a silica sol solution, dispersed and mixed, and then dried.

【0014】SiCウイスカーをC/SiO2 混合原料
に配合する態様を採る場合には、前記のC/SiO2
合原料に10重量%以上の配合比率でSiCウイスカー
を均一に混合し、混合物を反応容器に充填したのち非酸
化性雰囲気中で1300〜2200℃の温度範囲で熱処
理する。この工程の加熱段階は、まず約1700℃まで
の温度に加熱してSiC粉末の生成を十分におこなわ
せ、ついで1700〜2200℃の温度に上昇してSi
Cウイスカーの径太化処理をおこなう。この方法を適用
すると、SiC粉末の生成と径太SiCウイスカーの生
成を一連工程でおこなうことができ、工程操作の上で有
利となる。
[0014] When taking the aspect of blending SiC whiskers C / SiO 2 mixed material is uniformly mixed with SiC whiskers at 10 wt% or more blending ratio to the C / SiO 2 material mixture, the mixture reaction After filling the container, heat treatment is performed in a temperature range of 1300 to 2200 ° C. in a non-oxidizing atmosphere. In the heating step of this process, first, heating to a temperature of up to about 1700 ° C. is performed to sufficiently generate SiC powder, and then the temperature is raised to a temperature of 1700 to 2200 ° C.
The diameter of C whiskers is increased. When this method is applied, generation of SiC powder and generation of large-diameter SiC whiskers can be performed in a series of steps, which is advantageous in process operation.

【0015】また、SiCウイスカーをSiC粉末に配
合する態様を採るときには、予めC/SiO2 混合粉末
を反応容器に充填して非酸化性雰囲気中で約1700℃
までの温度に処理してSiC粉末を調製し、このSiC
粉末にSiCウイスカーを30重量%以上の比率になる
ように配合して非酸化性雰囲気下で1700〜2200
℃の温度域でSiCウイスカーの径太化処理をおこな
う。したがって、この方法では2段階の熱処理工程とな
る。
When the SiC whiskers are mixed with the SiC powder, the C / SiO 2 mixed powder is filled in the reaction vessel in advance and the temperature is about 1700 ° C. in a non-oxidizing atmosphere.
To prepare a SiC powder,
SiC whiskers were added to the powder in an amount of 30% by weight or more and mixed in a non-oxidizing atmosphere at 1700 to 2200.
The SiC whiskers are thickened in the temperature range of ℃. Therefore, this method requires a two-step heat treatment process.

【0016】[0016]

【作用】本発明によれば、径太化の熱処理過程で積層欠
陥密度の低いβ型SiCウイスカーが種となり、粒子径
が小さく、欠陥密度の高いSiC粉末は昇華原子の供給
源として機能する。すなわち、SiCウイスカーと混合
状態で介在するSiC粉末は熱を受けて昇華再結晶しな
がら大粒化する。この段階で、積層欠陥等で挟まれた微
細結晶子や小粒径の粒子は他の箇所に比べて界面エネル
ギーが高く不安定な状態となるため、容易に昇華する。
そして昇華した原子は、種となる安定なβ型SiCウイ
スカーの表面に析出して円滑に径太化を進行させる。
According to the present invention, β-type SiC whiskers having a low stacking fault density are seeds during the heat treatment process for increasing the diameter, and the SiC powder having a small particle size and a high defect density functions as a source of sublimation atoms. That is, the SiC powder intervening in a mixed state with the SiC whiskers is subjected to heat to be sublimed and recrystallized to become large particles. At this stage, the fine crystallites or particles having a small particle diameter sandwiched by stacking faults have a high interfacial energy and are in an unstable state as compared with other portions, and thus easily sublime.
Then, the sublimated atoms are deposited on the surface of a stable β-type SiC whisker as a seed and smoothly increase in diameter.

【0017】上記の機構において、SiCウイスカーに
混合するSiC粉末として、C/SiO2 モル比が2.
5以下の成分系を還元炭化して反応生成物中に残留する
余剰カーボン成分量を0.5重量%以下とし、かつ粒径
が1μm 以下または(111)回折線の半価幅が0.1
8deg以上の性状とすることにより、常にSiC粒状物
の残留量が少なく、重量損失が少ない状態で円滑にSi
Cウイスカーの径太化を進行させることが可能となる。
また、SiCウイスカーをC/SiO2 混合原料に直接
混合した場合には、一連工程で径太SiCウイスカーの
製造ができ、生産工程を有利に展開させることができ
る。
In the above mechanism, the SiC powder mixed with the SiC whiskers has a C / SiO 2 molar ratio of 2.
The amount of surplus carbon component remaining in the reaction product by reducing and carbonizing a component system of 5 or less is 0.5% by weight or less, and the particle size is 1 μm or less or the half width of the (111) diffraction line is 0.1.
By setting the property to 8 deg or more, the amount of residual SiC granules is always small, and Si is smoothened with little weight loss.
The diameter of the C whiskers can be increased.
Further, when the SiC whiskers are directly mixed with the C / SiO 2 mixed raw material, the large diameter SiC whiskers can be produced in a series of steps, and the production steps can be advantageously developed.

【0018】[0018]

【実施例】【Example】

実施例1〜3、比較例1〜2 (1) SiC粉末の生成 DBP吸油量129ml/100g 、窒素吸着比表面積99m2
/g、凝集体ストークスモード径0.09μm の粒子特性
を備えるカーボンブラック〔東海カーボン(株)製、
“シースト5H”〕とSiO2 含有率50重量%のシリ
カゾル溶液〔旭電化工業(株)製、“アデライトAT−
50”〕をC/SiO2 モル比を変えて配合し、撹拌混
合機〔(株)ダルトン製、万能混合撹拌機25AM型〕
を用いて十分に分散混合した。混合物を110℃に設定
された乾燥器中で一晩乾燥したのち黒鉛反応容器に充填
し、上部に黒鉛板を載せて窒素ガス雰囲気に保持された
電気加熱炉にセットし、1650℃の温度で2時間熱処
理を施した。
Examples 1 to 3, Comparative Examples 1 to 2 (1) Generation of SiC powder DBP oil absorption 129 ml / 100 g, nitrogen adsorption specific surface area 99 m 2
/ g, aggregate Stokes mode carbon black having particle characteristics of 0.09 μm [Tokai Carbon Co., Ltd.,
"SEAST 5H"] and a silica sol solution having a SiO 2 content of 50% by weight [Asahi Denka Kogyo KK, "Adelite AT-"
50 "] was mixed by changing the C / SiO 2 molar ratio, and the mixture was stirred (manufactured by Dalton Co., Ltd., universal mixing stirrer 25AM type).
Was thoroughly dispersed and mixed. The mixture was dried overnight in a drier set at 110 ° C, then charged into a graphite reaction vessel, and a graphite plate was placed on the top and placed in an electric heating furnace kept in a nitrogen gas atmosphere at a temperature of 1650 ° C. Heat treatment was performed for 2 hours.

【0019】冷却後、反応生成物を取り出し、未反応S
iO2 の有無、酸化重量減の度合、SiC粉末の50重
量%平均径を測定した。その結果を、用いた混合原料の
C/SiO2 モル比と対比させて表1に示した。なお、
未反応SiO2 の確認は粉末X線回折により、酸化重量
減の測定は反応生成物を大気中600℃の温度で24時
間処理する方法で、また平均径は粉末X線回折でSiO
2 が検出されなかった生成物を酸化処理し、5%HF溶
液で洗浄処理したSiC粉末の沈降法による50重量%
平均径を測る方法でおこなった。
After cooling, the reaction product is taken out and unreacted S
The presence or absence of iO 2 , the degree of oxidation weight loss, and the 50 wt% average diameter of the SiC powder were measured. The results are shown in Table 1 in comparison with the C / SiO 2 molar ratio of the mixed raw material used. In addition,
The unreacted SiO 2 was confirmed by powder X-ray diffraction, the oxidation weight loss was measured by treating the reaction product in the atmosphere at a temperature of 600 ° C. for 24 hours, and the average diameter was measured by powder X-ray diffraction.
50% by weight of the SiC powder obtained by oxidation treatment of the product in which 2 was not detected and washed with a 5% HF solution by the sedimentation method
The average diameter was measured.

【0020】[0020]

【表1】 [Table 1]

【0021】表1の結果から明らかなとおり、C/Si
2 モル比が2.5を越える混合原料を用いた比較例
1、2では酸化重量減が多く、0.5重量%以上のカー
ボンブラックが残留していた。
As is clear from the results shown in Table 1, C / Si
In Comparative Examples 1 and 2 using the mixed raw material having an O 2 molar ratio exceeding 2.5, the oxidation weight loss was large, and 0.5% by weight or more of carbon black remained.

【0022】(2) SiCウイスカーの径太化 直径1.0μm 、長さ50μm のアスペクト性状を有
し、α度が0.5で(111)回折線の半価幅が0.1
375deg のβ結晶型を主体とするSiCウイスカー
〔東海カーボン(株)製、“トーカウイスカーTWS−
400”〕を、上記で生成したSiC粉末に対し50重
量%の比率で配合した。配合物をエタノールとともにジ
ューサーミキサーに入れ、2分間撹拌混合処理したの
ち、真空乾燥してエタノール分を揮散除去した。つい
で、混合物を黒鉛ルツボに詰め、Arガス雰囲気に保持
された電気炉中で1800℃の温度で熱処理した。熱処
理後におけるSiCウイスカーのアスペクト性状、Si
C粒状物の混在度合、大気中600℃酸化時の重量変化
等を測定し、その結果を表2に示した。
(2) Increasing the diameter of SiC whiskers The aspect ratio is 1.0 μm in diameter and 50 μm in length, α degree is 0.5, and half width of (111) diffraction line is 0.1.
SiC whisker mainly composed of β crystal type of 375 deg [Tokai Carbon Co., Ltd., "Tokai Whisker TWS-
400 ″] was blended at a ratio of 50% by weight with respect to the SiC powder generated above. The blend was placed in a juicer mixer together with ethanol, stirred and mixed for 2 minutes, and then vacuum dried to volatilize and remove the ethanol content. Then, the mixture was packed in a graphite crucible and heat-treated in an electric furnace maintained in an Ar gas atmosphere at a temperature of 1800 ° C. Aspect characteristics of the SiC whiskers after the heat treatment, Si
The degree of mixing of the C particulates and the weight change during oxidation at 600 ° C. in the atmosphere were measured, and the results are shown in Table 2.

【0023】[0023]

【表1】 [Table 1]

【0024】表2の結果から、本発明の実施例によれば
直径2μm 以上の径太SiCウイスカーが粒状物の混在
および酸化重量変化が少ない状態で製造されることが認
められる。これに対し、比較例では径太化効果が殆ど認
められず、粒状物の混在、酸化重量変化も大きくなって
いる。
From the results shown in Table 2, it is recognized that according to the examples of the present invention, thick SiC whiskers having a diameter of 2 μm or more are produced in a state in which the inclusion of particulates and the change in oxidized weight are small. On the other hand, in the comparative example, the effect of increasing the diameter is hardly recognized, and the mixture of the particulate matter and the change in the oxidation weight are large.

【0025】実施例4〜6、比較例3〜4 実施例1〜3、比較例1〜2の同一のC/SiO2 混合
原料に、同一のSiCウイスカーを23重量%の比率で
配合した。配合物を実施例1と同様に撹拌混合と乾燥処
理を施したのち黒鉛反応容器に充填し、室温から165
0℃まで10℃/min で昇温して3時間保持し、その後
10℃/min の速度で1900℃に昇温し30分間保持
した。このようにして製造されたSiCウイスカーのア
スペクト性状、粒状物の混在度合、大気中600℃酸化
時の重量変化等を測定し、結果を表3に示した。
Examples 4 to 6 and Comparative Examples 3 to 4 The same C / SiO 2 mixed raw materials of Examples 1 to 3 and Comparative Examples 1 and 2 were mixed with the same SiC whiskers at a ratio of 23% by weight. The mixture was stirred, mixed and dried in the same manner as in Example 1 and then charged into a graphite reaction vessel, and the temperature was raised to 165 from room temperature.
The temperature was raised to 0 ° C. at 10 ° C./min and held for 3 hours, then raised to 1900 ° C. at a rate of 10 ° C./min and held for 30 minutes. The aspect properties of the SiC whiskers thus produced, the degree of inclusion of particulates, the weight change during oxidation at 600 ° C. in air, etc. were measured, and the results are shown in Table 3.

【0026】[0026]

【表3】 [Table 3]

【0027】表3から、SiCウイスカーをC/SiO
2 混合原料に直接混合して径太化処理をおこなった場合
にも、実施例のものは比較例と比べて良好な結果が得ら
れることが判明する。
From Table 3, the SiC whiskers were replaced with C / SiO.
It can be seen that even when the two mixed raw materials are directly mixed and subjected to the diameter thickening treatment, good results are obtained in the examples, as compared with the comparative examples.

【0028】[0028]

【発明の効果】以上のとおり、本発明の方法に従えばS
iCウイスカーに特定のC/SiO2もしくはSiC粉
末を混合して昇華再結晶化させることにより、粒状物が
混在しない状態で直径2μm 以上の径太SiCウイスカ
ーを効率よく製造することができる。したがって、とく
に各種セラミックス材の靭性改善を目的とする複合強化
材用のSiCウイスカーを得るための製造技術として極
めて有用である。
As described above, according to the method of the present invention, S
By mixing a specific C / SiO 2 or SiC powder with iC whiskers for sublimation recrystallization, it is possible to efficiently manufacture large diameter SiC whiskers having a diameter of 2 μm or more in a state where no particulate matter is mixed. Therefore, it is extremely useful as a manufacturing technique for obtaining a SiC whisker for a composite reinforcing material for the purpose of improving the toughness of various ceramic materials.

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 直径0.3〜1.5μm 、長さ10〜1
00μm のアスペクト性状を有するβ結晶型主体のSi
Cウイスカーを、C/SiO2 モル比2.5以下の成分
系を還元炭化した際に反応生成物中に残留するカーボン
成分が0.5重量%以下で、生成するSiC粉末の粒径
が1μm 以下または(111)回折線の半価幅が0.1
8deg 以上になるように配合したC/SiO2 混合原料
もしくは該混合原料から生成させたSiC粉末と混合
し、ついで非酸化雰囲気中で1300〜2200℃の温
度に熱処理することを特徴とするSiCウイスカーの製
造方法。
1. A diameter of 0.3 to 1.5 μm and a length of 10 to 1
Si mainly composed of β crystal type having an aspect property of 00 μm
When C whiskers are reduced and carbonized with a component system having a C / SiO 2 molar ratio of 2.5 or less, the carbon content remaining in the reaction product is 0.5% by weight or less, and the particle size of the produced SiC powder is 1 μm. Or less or the full width at half maximum of the (111) diffraction line is 0.1
A SiC whisker characterized by being mixed with a C / SiO 2 mixed raw material or an SiC powder produced from the mixed raw material which is blended so as to be 8 deg or more, and then heat-treated at a temperature of 1300 to 2200 ° C. in a non-oxidizing atmosphere Manufacturing method.
【請求項2】 β結晶型主体のSiCウイスカーが、α
度20以下で、(111)回折線の半価幅が0.14de
g 以下である請求項1記載のSiCウイスカーの製造方
法。
2. A SiC whisker mainly composed of β crystal is formed by α
The full width at half maximum of (111) diffraction line is 0.14 de
The method for manufacturing a SiC whisker according to claim 1, wherein the method is less than or equal to g.
【請求項3】 C/SiO2 混合原料を、カーボンブラ
ックをシリカゾルに混合分散させて調製する請求項1ま
たは2記載のSiCウイスカーの製造方法。
3. The method for producing a SiC whisker according to claim 1, wherein the C / SiO 2 mixed raw material is prepared by mixing and dispersing carbon black in silica sol.
【請求項4】 SiC粉末の生成を約1700℃までの
温度でおこない、SiCウイスカーの径太化を1700
〜2200℃の温度域でおこなう請求項1または2記載
のSiCウイスカーの製造方法。
4. The SiC powder is produced at a temperature up to about 1700 ° C. to increase the diameter of the SiC whiskers by 1700.
The method for producing a SiC whisker according to claim 1 or 2, which is carried out in a temperature range of from ~ 2200 ° C.
JP27949892A 1992-09-24 1992-09-24 Production of sic whisker Pending JPH06107499A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP27949892A JPH06107499A (en) 1992-09-24 1992-09-24 Production of sic whisker

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP27949892A JPH06107499A (en) 1992-09-24 1992-09-24 Production of sic whisker

Publications (1)

Publication Number Publication Date
JPH06107499A true JPH06107499A (en) 1994-04-19

Family

ID=17611889

Family Applications (1)

Application Number Title Priority Date Filing Date
JP27949892A Pending JPH06107499A (en) 1992-09-24 1992-09-24 Production of sic whisker

Country Status (1)

Country Link
JP (1) JPH06107499A (en)

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