JPH06103855A - Contact device for circuit breaking - Google Patents

Contact device for circuit breaking

Info

Publication number
JPH06103855A
JPH06103855A JP25336892A JP25336892A JPH06103855A JP H06103855 A JPH06103855 A JP H06103855A JP 25336892 A JP25336892 A JP 25336892A JP 25336892 A JP25336892 A JP 25336892A JP H06103855 A JPH06103855 A JP H06103855A
Authority
JP
Japan
Prior art keywords
film
plating
contact device
contact
disconnecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP25336892A
Other languages
Japanese (ja)
Inventor
Masaaki Kikuchi
正晃 菊池
Kimiya Sato
公哉 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP25336892A priority Critical patent/JPH06103855A/en
Publication of JPH06103855A publication Critical patent/JPH06103855A/en
Pending legal-status Critical Current

Links

Landscapes

  • Patch Boards (AREA)
  • Trip Switchboards (AREA)

Abstract

PURPOSE:To enhance the anti-abrasiveness and electric characteristics and omit the grease applying process by covering the sliding part on the surface of a contact piece with a film of Ag-WC or Ag-WC-MoS2. CONSTITUTION:A disconnecting contact device includes a contact piece 2 having a contacting part, and on its surface, a film 2C is formed of 10-30mum thick which is prepared by abiding WC power as carbide hard particles during the Ag plating process according to the electric plating etc., agitating the plating solution at a constant speed, and causing eutectoid in the condition that the WC powder is dispersed uniformly in the Ag plating. The Ag content of the film is made exceeding 50%. Through similar procedures, a film of Ag-WC-MoS2 is produced. Thereby the electric characteristics and reliability of the device for a long period of time can be enhanced.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は、例えば遮断器または開
閉器などの主回路端子を母線に接離する断路接点装置に
関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a disconnection contact device for connecting and disconnecting a main circuit terminal such as a circuit breaker or a switch to a bus bar.

【0002】[0002]

【従来の技術】一般に閉鎖配電盤などの電気機器におい
ては、図4乃至図5に示すような遮断器または開閉器な
どを出し入れする際に主回路端子を母線に接離する断路
接点装置が設けられている。
2. Description of the Related Art Generally, an electric device such as a closed switchboard is provided with a disconnecting contact device for connecting and disconnecting a main circuit terminal to and from a bus bar when inserting and removing a breaker or a switch as shown in FIGS. ing.

【0003】この種の断路接点装置を図4および図5を
参照して説明する。これらの図において、断路接点装置
1は、接触子2が対を成して対向して1組を形成し、一
端は固定側導体3に接触部2aが突出して接触し、他端
は可動側導体4に接触部2bが突出して接触している。
また接触子2はピン5で連結され、ピン5をコイルばね
6で引っ張り、接触部2a,2bと固定側導体3および
可動側導体4とが押圧するように配置されている。また
導体が挿入されていないときには、導体が挿入しやすい
ように間隔片7で接触子2の間隔が一定に保たれてい
る。
A disconnecting contact device of this type will be described with reference to FIGS. 4 and 5. In these drawings, in the disconnecting contact device 1, the contacts 2 form a pair and face each other to form one set, one end of which is in contact with the fixed-side conductor 3 with the contact portion 2a protruding, and the other end of which is on the movable side. The contact portion 2b projects and contacts the conductor 4.
The contactor 2 is connected by a pin 5, and the pin 5 is pulled by a coil spring 6 so that the contact portions 2a and 2b and the fixed-side conductor 3 and the movable-side conductor 4 are pressed. Further, when the conductor is not inserted, the spacing between the contacts 2 is kept constant by the spacing piece 7 so that the conductor can be easily inserted.

【0004】[0004]

【発明が解決しようとする課題】しかしながら上述した
断路接点装置は、一般的には接触子表面に電気めっきに
よるAg皮膜が形成されているが、Agめっきは柔らか
いため摺動により取れやすい。このため、Ag皮膜保護
のため潤滑剤としてグリスを塗布しているが、グリスは
使用環境や経年的な酸化により劣化し、これに起因して
電気特性を損なうことがある。このため、定期的な保守
点検が必要不可欠であった。本発明の目的は、グリスを
不要としても耐摩耗性に優れ、かつ電気的特性を満足す
る断路接点装置を提供することにある。
However, in the disconnection contact device described above, an Ag film is generally formed on the surface of the contact by electroplating, but since the Ag plating is soft, it is easily removed by sliding. For this reason, although grease is applied as a lubricant to protect the Ag film, the grease deteriorates due to the environment of use and oxidation over time, which may impair the electrical characteristics. For this reason, regular maintenance and inspection was essential. An object of the present invention is to provide a disconnection contact device that has excellent wear resistance and that satisfies electrical characteristics without requiring grease.

【0005】[0005]

【課題を解決するための手段】上記目的を達成するため
に本発明は、断路接点装置における接触子表面摺動部
に、Ag−WCまたはAg−WC−MoS2皮膜層を被
覆して構成する。
In order to achieve the above object, the present invention comprises a contact surface sliding portion of a disconnecting contact device coated with an Ag-WC or Ag-WC-MoS 2 coating layer. .

【0006】[0006]

【作用】このような構成において、摺動部表面に被覆し
たAg−WC層またはAg−WC−MoS2層は硬さも
高く耐摩耗性に優れ、かつ電気特性にも優れており、グ
リスの塗布を不要にすることができる。
In such a structure, the Ag-WC layer or Ag-WC-MoS 2 layer coated on the surface of the sliding portion has high hardness, excellent wear resistance, and excellent electrical characteristics. Can be eliminated.

【0007】[0007]

【実施例】以下、本発明を図示の一実施例について説明
する。なお説明にあたっては、図4および図5と同一構
成部材には同じ符号を付す。ここでの実施例は、接触子
を例にとって説明する。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to an illustrated embodiment. In the description, the same components as those in FIGS. 4 and 5 are designated by the same reference numerals. In this embodiment, a contactor will be described as an example.

【0008】図1において、接触子2の接触部2aの表
面に、電気めっき法によるAgめっき工程中に炭化物系
硬質粒子であるWC粉末(大きさ:0.1〜1μm)を
添加し、そのめっき液を一定速度で攪拌してAgめっき
に均一にWC粉末を分散させた状態で共析させることに
より、10〜30μm程度の皮膜2Cを形成させる。皮
膜中のAgの量は50%以上になるようにする。そのよ
うなAg−WC皮膜で被覆することにより、グリースを
塗布することなく、長期間に渡る電気特性および信頼性
の向上を図るようにしたものである。接触子2と接触す
る導体へも同様の処理を施す。
In FIG. 1, WC powder (size: 0.1 to 1 μm), which is a carbide type hard particle, is added to the surface of the contact portion 2a of the contactor 2 during the Ag plating process by the electroplating method. The plating solution is stirred at a constant speed and co-deposited in a state where the WC powder is uniformly dispersed in the Ag plating to form the coating film 2C having a thickness of about 10 to 30 μm. The amount of Ag in the film should be 50% or more. By coating with such an Ag-WC film, it is possible to improve electrical characteristics and reliability for a long period of time without applying grease. The same treatment is applied to the conductor that contacts the contactor 2.

【0009】また、Ag−WC−MoS2皮膜のばあい
も同様で、電気めっき法によるAgめっき工程中に前述
のようなWC粉末および潤滑用無機化合物粒子であるM
oS2粉末(大きさ:0.1〜1μm)を添加し、その
めっき液を一定速度で攪拌してAgめっきに均一にWC
粉末およびMoS2粉末を分散させた状態で共析させ
る。次に示す表1は、AgとAg−WC皮膜の硬さおよ
び電気伝導度を比較した一例である。
The same applies to the case of the Ag-WC-MoS 2 coating, and during the Ag plating process by the electroplating method, the above-mentioned WC powder and the inorganic compound particles M for lubrication are used.
oS 2 powder (size: 0.1 to 1 μm) was added, and the plating solution was stirred at a constant speed to evenly WC Ag plating.
The powder and the MoS 2 powder are co-deposited in a dispersed state. Table 1 shown below is an example in which hardness and electric conductivity of Ag and Ag-WC coatings are compared.

【0010】[0010]

【表1】 すなわち、Ag膜に比べ70Ag−30WC被膜は約4
倍、50Ag−50WC被膜は5〜6倍近い硬さを有し
ており、このため摩耗が少なくなる。
[Table 1] That is, the 70Ag-30WC film is about 4 times thicker than the Ag film.
Double, the 50Ag-50WC coating has a hardness of about 5 to 6 times, and therefore wear is reduced.

【0011】一方、図2は銅材にAgめっきを施したも
のと、本発明のAg−WC(例えば、70Ag−30W
C)、Ag−WC−MoS2(例えば、70Ag−20
WC−10MoS2)被膜をコーティングしたものにつ
いて摩擦−磨耗特性(すべり距離と摩擦係数の関係)を
測定した結果の一例である。
On the other hand, FIG. 2 shows a copper material plated with Ag and the Ag-WC of the present invention (for example, 70Ag-30W).
C), Ag-WC-MoS 2 ( e.g., 70Ag-20
It is an example of the result of having measured the friction-abrasion characteristics (relationship between the sliding distance and the friction coefficient) of the one coated with a WC-10MoS 2 ) film.

【0012】すなわち、本考案のAg−WC、Ag−W
C−MoS2被膜がAgめっきに比べ摩擦係数が小さ
く、かじりが発生するまでのすべり距離が長く耐摩耗性
に優れていることを示している。
That is, the Ag-WC and Ag-W of the present invention
This shows that the C-MoS 2 coating has a smaller friction coefficient than Ag plating, a long sliding distance before galling occurs, and excellent wear resistance.

【0013】また図3は、実機での通電試験において得
られた時間−温度特性の一例を示す。Ag−WCおよび
Ag−WC−MoS2被膜はAgめっきに比べ高くはな
っているが、日本電気学会規格JEC−2300の規定
値105℃(温度上昇値65℃)は満足しており問題は
ない。
FIG. 3 shows an example of the time-temperature characteristic obtained in the current-carrying test in the actual machine. The Ag-WC and Ag-WC-MoS 2 coatings are higher than those of Ag plating, but satisfy the stipulated value 105 ° C (temperature rise value 65 ° C) of JEC-2300 standard of the Institute of Electrical Engineers of Japan, and there is no problem. .

【0014】以上、実施例として、Ag−WCおよびA
g−WC−MoS2被膜を施した場合について記述した
が、WCの代わりに炭化物系硬質粒子として比較的電気
伝導度の小さいTiC(炭化チタン)やZrC(炭化ジ
ルコニウム)、MoS2の代わりに潤滑用無機化合物と
してC(グラファイト)等を用いた皮膜により被覆して
も耐摩耗性が向上し、より信頼性の高いものとすること
ができる。また、接触子に皮膜を形成する方法として、
PVD法やCVD法を使用しても同様の効果を得ること
ができる。
As described above, as an example, Ag-WC and A
The case where a g-WC-MoS 2 coating is applied has been described, but instead of WC, TiC (titanium carbide) or ZrC (zirconium carbide), which has a relatively low electrical conductivity as carbide-based hard particles, and lubrication instead of MoS 2. Even if it is coated with a film using C (graphite) or the like as the inorganic compound for use, the abrasion resistance is improved and the reliability can be made higher. Also, as a method of forming a film on the contact,
The same effect can be obtained by using the PVD method or the CVD method.

【0015】[0015]

【発明の効果】以上のように本発明によれば、断路接点
装置における接触子の接触部表面にAg−WC皮膜また
はAg−WC−MoS2皮膜をコーティングすることに
より、硬さが高くかじりの発生も防止し、この摺動部に
グリスを塗布する必要がなく無潤滑油とすることが可能
になる。このため、グリスの経年劣化に伴う分解、清
掃、グリスの再塗布、再組立などの定期的なメンテナン
スが不要となり、信頼性の高い断路接点装置を得ること
ができる。また、電気的にも優れているため、長期間に
亘り動作特性および信頼性の向上を図ることができる。
As described above, according to the present invention, by coating the surface of the contact portion of the contact in the disconnecting contact device with the Ag-WC film or the Ag-WC-MoS 2 film, the hardness is high and the galling resistance is high. It is possible to prevent the occurrence of grease, and it is possible to use no lubrication oil without applying grease to the sliding portion. Therefore, periodic maintenance such as disassembly, cleaning, reapplication of grease, and reassembly due to deterioration of grease over time becomes unnecessary, and a highly reliable disconnection contact device can be obtained. Further, since it is electrically excellent, it is possible to improve the operating characteristics and reliability over a long period of time.

【図面の簡単な説明】[Brief description of drawings]

【図1】 本発明の断路接点装置の要部拡大図。FIG. 1 is an enlarged view of a main part of a disconnection contact device according to the present invention.

【図2】 [図1]の皮膜2CとAgめっきの摩擦・摩
耗特性図。
FIG. 2 is a friction / wear characteristic diagram of the coating 2C of FIG. 1 and Ag plating.

【図3】 [図1]の皮膜2CとAgめっきの温度上昇
特性図。
FIG. 3 is a temperature rise characteristic diagram of the film 2C of FIG. 1 and Ag plating.

【図4】 従来の断路接点装置の正面図。FIG. 4 is a front view of a conventional disconnecting contact device.

【図5】 従来の断路接点装置の側面図。FIG. 5 is a side view of a conventional disconnecting contact device.

【符号の説明】[Explanation of symbols]

2………接触子、2a,2b………接触部、2C………
皮膜
2 ... Contactor, 2a, 2b ... Contact part, 2C ...
Film

Claims (3)

【特許請求の範囲】[Claims] 【請求項1】 一端が固定側導体に接続され、他端が可
動側導体に接続する接触子を有し、この接触子表面およ
び導体表面にAgを主成分とする複合皮膜層を形成させ
たことを特徴とする断路接点装置。
1. A contact having one end connected to a fixed-side conductor and the other end connected to a movable-side conductor, and a composite coating layer containing Ag as a main component is formed on the contactor surface and the conductor surface. A disconnecting contact device characterized by the above.
【請求項2】 前記複合皮膜層は、Agと炭化物系硬質
粒子の共析皮膜であることを特徴とする請求項1記載の
断路接点装置。
2. The disconnection contact device according to claim 1, wherein the composite coating layer is an eutectoid coating of Ag and hard carbide particles.
【請求項3】 前記複合皮膜層は、Agと炭化物系硬質
粒子、および潤滑用無機化合物粒子の共析皮膜であるこ
とを特徴とする請求項1記載の断路接点装置。
3. The disconnection contact device according to claim 1, wherein the composite coating layer is a eutectoid coating of Ag, hard carbide particles, and lubricating inorganic compound particles.
JP25336892A 1992-09-24 1992-09-24 Contact device for circuit breaking Pending JPH06103855A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP25336892A JPH06103855A (en) 1992-09-24 1992-09-24 Contact device for circuit breaking

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP25336892A JPH06103855A (en) 1992-09-24 1992-09-24 Contact device for circuit breaking

Publications (1)

Publication Number Publication Date
JPH06103855A true JPH06103855A (en) 1994-04-15

Family

ID=17250382

Family Applications (1)

Application Number Title Priority Date Filing Date
JP25336892A Pending JPH06103855A (en) 1992-09-24 1992-09-24 Contact device for circuit breaking

Country Status (1)

Country Link
JP (1) JPH06103855A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11149840A (en) * 1997-11-13 1999-06-02 Energy Support Corp Electrode for switch
KR20010109934A (en) * 2000-06-05 2001-12-12 신동모 a
JP2014185889A (en) * 2013-03-22 2014-10-02 Nippon Tungsten Co Ltd Probe tip member and method of using the same

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11149840A (en) * 1997-11-13 1999-06-02 Energy Support Corp Electrode for switch
KR20010109934A (en) * 2000-06-05 2001-12-12 신동모 a
JP2014185889A (en) * 2013-03-22 2014-10-02 Nippon Tungsten Co Ltd Probe tip member and method of using the same

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