JPH0592908U - LED board for vehicle lighting - Google Patents
LED board for vehicle lightingInfo
- Publication number
- JPH0592908U JPH0592908U JP3858592U JP3858592U JPH0592908U JP H0592908 U JPH0592908 U JP H0592908U JP 3858592 U JP3858592 U JP 3858592U JP 3858592 U JP3858592 U JP 3858592U JP H0592908 U JPH0592908 U JP H0592908U
- Authority
- JP
- Japan
- Prior art keywords
- led
- printed wiring
- wiring board
- board
- pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Audible And Visible Signals (AREA)
Abstract
(57)【要約】
【目的】 従来のＬＥＤを光源とする車両用灯具におい
ては、プリント配線基板上に搭載されるＬＥＤの密度が
比較的に高く成るときには温度上昇が著しく、これによ
りＬＥＤに特性劣化或いは断線事故を生じ、車両用灯具
の信頼性を低下させる問題点を生じていた。
【構成】 プリント配線基板２に設けられるＬＥＤ３の
ハンダ付けのためのパット２ａ及び配線電路２ｂを可能
な限りに拡大し且つその表面をハンダ付け可能としてあ
るＬＥＤ基板１としたことで、ＬＥＤ３に生ずる発熱を
プリント配線基板２の全面に拡散させ温度を低下させる
と共に、その広い面積で放熱して一層に冷却効率を向上
させ、以て、ＬＥＤ３の過熱による特性劣化、断線事故
などを防止して車両用灯具の信頼性の向上を可能とす
る。
(57) [Summary] [Objective] In a conventional vehicle lighting device using an LED as a light source, when the density of LEDs mounted on a printed wiring board becomes relatively high, the temperature rises remarkably. There was a problem that deterioration or disconnection accident occurred and reliability of the vehicular lamp was lowered. A pad 2a for soldering an LED 3 and a wiring electric path 2b provided on a printed wiring board 2 are enlarged as much as possible and the surface of the LED board 1 is solderable, so that the LED 3 is produced. The heat is diffused over the entire surface of the printed wiring board 2 to lower the temperature, and the heat is dissipated in the large area to further improve the cooling efficiency, thereby preventing characteristic deterioration due to overheating of the LED 3 and disconnection accident. The reliability of the lighting fixture can be improved.
Description
【０００１】[0001]
本考案は車両用灯具に関するものであり、詳細には、前記車両用灯具の光源と してＬＥＤが採用されるときに形成されるプリント配線基板上に複数のＬＥＤが 搭載されたＬＥＤ基板の構成に係るものである。 The present invention relates to a vehicular lamp, and more particularly, to a configuration of an LED board having a plurality of LEDs mounted on a printed wiring board formed when an LED is used as a light source of the vehicular lamp. It is related to.
【０００２】[0002]
従来の、この種のＬＥＤ基板９０の構成の例を示すものが図３であり、プリン ト配線基板９１の裏面側にはＬＥＤ９２の脚部をハンダ付けにより取付けるため のパット９１ａと、各ＬＥＤ９２に給電を行うための配線電路９１ｂとが形成さ れるものとされ、更に前記配線電路９１ｂなどハンダ付けの必要がないと考えら れている部分はハンダの付着を防止するハンダレジスト９３で覆われるものとさ れている。 FIG. 3 shows an example of the structure of a conventional LED board 90 of this type. A pad 91a for mounting the legs of the LED 92 by soldering is provided on the back surface side of the print wiring board 91, and a pad 91a for each LED 92. A wiring electric line 91b for supplying electric power is formed, and a portion such as the wiring electric line 91b which is considered to be unnecessary for soldering is covered with a solder resist 93 for preventing adhesion of solder. It is said that.
【０００３】[0003]
しかしながら、前記した従来のＬＥＤ基板９０において、プリント配線基板９ １上にパット９１ａ及び配線電路９１ｂの敷設を行う際には、例えばパット９１ ａの外径については孔径の２．５倍、配線電路９１ｂの幅については１mm当り１ Ａの電流容量など、既存のこの種のプリント配線基板に対する設計手段で行われ るものであったので、前記プリント配線基板９１には給電以外の作用は期待でき ず、これにより、搭載密度が高いときには前記ＬＥＤ９２に過熱を生じて特性劣 化及び断線事故などを生じ易くなる問題点を生じて車両用灯具の信頼性を低下さ せるものとなり、この点の解決が課題とされるものとなっていた。 However, in the conventional LED board 90 described above, when the pad 91a and the wiring electric path 91b are laid on the printed wiring board 91, for example, the outer diameter of the pad 91a is 2.5 times the hole diameter, and the wiring electric path is As for the width of 91b, the current carrying capacity of 1 A per 1 mm, etc. was performed by the existing designing means for this kind of printed wiring board. As a result, when the mounting density is high, there is a problem that the LEDs 92 are likely to be overheated, resulting in deterioration of characteristics and accidents such as disconnection, thereby reducing the reliability of the vehicular lamp. It was supposed to be an issue.
【０００４】[0004]
本考案は前記した従来の課題を解決するための具体的手段として、プリント配 線基板上に複数のＬＥＤを配設して成る車両用灯具のＬＥＤ基板において、前記 プリント配線基板に設けられる前記ＬＥＤのハンダ付けのためのパット及び配線 電路を可能な限りに拡大し且つその表面をハンダ付け可能としてあることを特徴 とする車両用灯具のＬＥＤ基板を提供することで、プリント配線基板に放熱機能 を与え、前記した従来の課題を解決するものである。 The present invention is, as a concrete means for solving the above-mentioned conventional problems, in an LED board of a vehicle lamp in which a plurality of LEDs are arranged on a printed wiring board, the LED provided on the printed wiring board. By providing an LED board for a vehicle lamp, which is characterized by expanding the pad and wiring electric path for soldering as much as possible and soldering the surface thereof, a heat radiation function can be provided to the printed wiring board. This is to solve the above-mentioned conventional problems.
【０００５】[0005]
つぎに、本考案を図に示す一実施例に基づいて詳細に説明する。 図１及び図２に符号１で示すものは本考案に係るＬＥＤ基板であり、このＬＥ Ｄ基板１はプリント配線基板２上に複数のＬＥＤ３が搭載されて構成されるもの である点は従来例のものと同様であるが、本考案により前記ＬＥＤ３を取付け且 つ給電を行うために、前記プリント配線基板２の背面に設けられるパット２ａ及 び配線電路２ｂは可能な限りに拡大されるものとされている。 Next, the present invention will be described in detail based on an embodiment shown in the drawings. 1 and 2 is an LED substrate according to the present invention, and this LED substrate 1 is a conventional example in which a plurality of LEDs 3 are mounted on a printed wiring board 2. However, in order to mount the LED 3 and supply power to the LED 3 according to the present invention, the pad 2a and the wiring line 2b provided on the back surface of the printed wiring board 2 are enlarged as much as possible. Has been done.
【０００６】 また、従来はＬＥＤ３のプリント配線基板２へのハンダ付けを行う際に最低限 必要であるパット２ａの周辺部分を除いて、全面に例えばスクリーン印刷により ハンダレジスト４の塗布が行われるものとされ、前記配線電路２ｂにはハンダの 付着を防ぐものとされていたのに対し、本考案においては前記ハンダレジスト４ の塗布は全くに省略されるか、或いは組立上で付着が好ましくない部分に限定さ れ、これにより、上記のようにパット２ａ及び配線電路２ｂが拡大されたことと 相まって、例えばハンダリフロー炉によるハンダ付け工程を行った後には、前記 プリント配線基板２の背面の大部分にハンダ５の付着が行われ（図２参照）るも のとなる。Further, conventionally, the solder resist 4 is applied to the entire surface by, for example, screen printing, except for the peripheral portion of the pad 2a which is the minimum required when soldering the LED 3 to the printed wiring board 2. Therefore, in the present invention, the solder resist 4 is prevented from adhering to the wiring circuit 2b. Due to the expansion of the pad 2a and the wiring electric path 2b as described above, most of the back surface of the printed wiring board 2 can be removed after performing a soldering process using, for example, a solder reflow furnace. The solder 5 is attached to the solder (see FIG. 2).
【０００７】 尚、前記パット２ａ及び配線電路２ｂの面積の拡大に当たっては、例えば前記 パット２ａと配線電路２ｂとの接合部などに急激に幅が変化するクビレなどを生 じないものとしておき、前記したハンダリフロー炉によりハンダ付けを行った際 には前記プリント配線基板２の背面に均一な厚さで且つ厚くハンダ５が付着する ように図ることが好ましい。In order to increase the area of the pad 2a and the wiring electric path 2b, for example, the joint between the pad 2a and the wiring electric path 2b should be set so as not to cause sharp changes in width. When soldering is performed by the above solder reflow furnace, it is preferable to ensure that the solder 5 adheres to the back surface of the printed wiring board 2 with a uniform thickness and a large thickness.
【０００８】 次いで、上記の構成とした本考案のＬＥＤ基板１の作用及び効果について説明 を行えば、プリント配線基板２の背面のほぼ全面積を占める程にパット２ａと配 線電路２ｂとの面積が拡大され、且つそのほぼ全面にハンダ５が付着するものと されたことで、ＬＥＤ３の点灯時に生ずる発熱は脚部を介してハンダ５内に伝導 されるものとなり、このハンダ５が前記したようにプリント配線基板２の背面の ほぼ全面積を占めるものとされたことで、前記した発熱もプリント配線基板２の 全面に拡散されるものとなる。Next, the operation and effect of the LED board 1 of the present invention having the above-described structure will be described. The area between the pad 2a and the wiring line 2b is such that the back surface of the printed wiring board 2 occupies almost the entire area. The heat generated when the LED 3 lights up is conducted to the inside of the solder 5 through the legs because the solder 5 is expanded and the solder 5 is attached to almost the entire surface thereof. In addition, since the back surface of the printed wiring board 2 occupies almost the entire area, the above-mentioned heat is also diffused over the entire surface of the printed wiring board 2.
【０００９】 このことは即ち、ＬＥＤ３の温度を低下させるものとなると同時に、大気との 接触面積も増大させるので冷却効率も向上し、この冷却効率の向上により前記Ｌ ＥＤ３の温度は一層に低下するものとなる。This means that the temperature of the LED 3 is lowered, and at the same time, the contact area with the atmosphere is also increased, so that the cooling efficiency is improved, and the temperature of the LED 3 is further lowered by the improvement of the cooling efficiency. Will be things.
【００１０】[0010]
以上に説明したように本考案により、プリント配線基板に設けられるＬＥＤの ハンダ付けのためのパット及び配線電路を可能な限りに拡大し且つその表面をハ ンダ付け可能としてあるＬＥＤ基板としたことで、ＬＥＤに生ずる発熱をプリン ト配線基板の背面のほぼ全面積の広い面積に拡散させ温度を低下させると共に、 その広い面積で放熱して一層に冷却効率を向上させてＬＥＤを低温に保つものと し、以て、過熱による特性劣化、断線事故などを防止して、この種のＬＥＤを光 源とする車両用灯具の信頼性の向上に極めて優れた効果を奏するものである。 As described above, according to the present invention, the pad for wiring the LED provided on the printed wiring board and the wiring electric path are enlarged as much as possible, and the surface of the LED board can be soldered. , The heat generated in the LED is diffused to a large area of the entire back surface of the printed wiring board to lower the temperature, and the heat is dissipated in the large area to further improve the cooling efficiency and keep the LED at a low temperature. Therefore, it is possible to prevent characteristic deterioration due to overheating, disconnection accidents, etc., and to achieve an extremely excellent effect in improving the reliability of a vehicular lamp using this type of LED as a light source.
【図１】 本考案に係る車両用灯具のＬＥＤ基板の一実
施例を示す背面図である。FIG. 1 is a rear view showing an embodiment of an LED board of a vehicular lamp according to the present invention.
【図２】 図１のＡ―Ａ線に沿う断面図である。FIG. 2 is a sectional view taken along the line AA of FIG.
【図３】 従来例を示す背面図である。FIG. 3 is a rear view showing a conventional example.
１……ＬＥＤ基板 ２……プリント配線基板 ２ａ……パット ２ｂ……配線電路 ３……ＬＥＤ ４……ハンダレジスト ５……ハンダ 1 ... LED board 2 ... Printed wiring board 2a ... Pat 2b ... Wiring circuit 3 ... LED 4 ... Solder resist 5 ... Solder
Claims (1)
設して成る車両用灯具のＬＥＤ基板において、前記プリ
ント配線基板に設けられる前記ＬＥＤのハンダ付けのた
めのパット及び配線電路を可能な限りに拡大し且つその
表面をハンダ付け可能としてあることを特徴とする車両
用灯具のＬＥＤ基板。1. An LED board for a vehicle lamp comprising a plurality of LEDs arranged on a printed wiring board, wherein pads and wiring lines for soldering the LEDs provided on the printed wiring board are provided as much as possible. An LED substrate for a vehicle lighting device, characterized in that the LED substrate of the vehicle lamp is enlarged and the surface thereof can be soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3858592U JPH0592908U (en) | 1992-05-14 | 1992-05-14 | LED board for vehicle lighting |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3858592U JPH0592908U (en) | 1992-05-14 | 1992-05-14 | LED board for vehicle lighting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0592908U true JPH0592908U (en) | 1993-12-17 |
Family
ID=12529375
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3858592U Pending JPH0592908U (en) | 1992-05-14 | 1992-05-14 | LED board for vehicle lighting |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0592908U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101430602B1 (en) * | 2013-03-14 | 2014-08-18 | 미래정보산업(주) | Light emitting diode module |
-
1992
- 1992-05-14 JP JP3858592U patent/JPH0592908U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101430602B1 (en) * | 2013-03-14 | 2014-08-18 | 미래정보산업(주) | Light emitting diode module |
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