JPH0590947U - Resin molding equipment - Google Patents
Resin molding equipmentInfo
- Publication number
- JPH0590947U JPH0590947U JP5846591U JP5846591U JPH0590947U JP H0590947 U JPH0590947 U JP H0590947U JP 5846591 U JP5846591 U JP 5846591U JP 5846591 U JP5846591 U JP 5846591U JP H0590947 U JPH0590947 U JP H0590947U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- recess
- gate
- resin molding
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
(57)【要約】
【目的】樹脂モールド工程時において下金型５の収容凹
部６と収容された放熱板１とで形成されるゲート位置に
おいて、放熱板１をこの収容凹部６の壁面に密着さこせ
て隙間をなくし、樹脂漏れを防止することを目的とす
る。
【構成】下金型５に放熱板１が収容される収容凹部６が
凹設されると共に、外部のポットから供給される溶融樹
脂の流路となるランナー７から収容凹部６に向かって樹
脂注入口となるゲート８が凹設されている。このゲート
形成位置の反対面の収容凹部６には深い凹部５３が形成
されており、該凹部５３は下端面が下金型５と一体とな
った傾動壁１１によって収容凹部６と仕切られている。
凹部５３内には、形状記憶合金等の温度変化によって伸
縮自在となって傾動壁１１を押圧する伸縮部材１２が挿
着されている。
(57) [Abstract] [Purpose] At the gate position formed by the housing recess 6 of the lower die 5 and the housing heat sink 1 housed during the resin molding process, the heat sink 1 is brought into close contact with the wall surface of the housing recess 6. The purpose is to prevent the resin leakage by rubbing and eliminating the gap. [Structure] An accommodation recess 6 for accommodating the heat dissipation plate 1 is provided in the lower mold 5, and resin injection is performed from the runner 7 serving as a flow path of the molten resin supplied from an external pot toward the accommodation recess 6. A gate 8 serving as an entrance is recessed. A deep recess 53 is formed in the accommodation recess 6 on the surface opposite to the gate formation position, and the lower end of the recess 53 is separated from the accommodation recess 6 by a tilting wall 11 integrated with the lower mold 5. .
In the concave portion 53, a stretchable member 12 that is stretchable by a temperature change of a shape memory alloy or the like and presses the tilting wall 11 is inserted.
Description
【０００１】[0001]
本考案は、放熱板付きの半導体装置の樹脂モールド装置に関する。 The present invention relates to a resin molding device for a semiconductor device having a heat dissipation plate.
【０００２】[0002]
パワー用半導体装置は、図５に示すように、放熱性を良好にするために板厚の 厚い放熱板１上に半導体ペレット２をマウントし、該半導体ペレット２に各リー ド３を近接配置すると共にそれぞれのリード端部と対応する半導体ペレット２の 表面電極（図示せず）とをワイヤ４によりボンディングして、放熱板１上をモー ルド樹脂にて被覆する構造となっており、図示の樹脂モールド装置によって樹脂 モールドが行われている。即ち、この樹脂モールド装置の下金型５には、放熱板 １が収容される収容凹部６と外部のポット（図示せず）より供給される溶融樹脂 の流路となるランナー７と該ランナー７より各収容凹部６に向かって延びるゲー ト８が形成されている。また、上下金型の衝合面における放熱板１の位置の上金 型９にはキャビティ１０が凹設されている。 In the power semiconductor device, as shown in FIG. 5, a semiconductor pellet 2 is mounted on a thick heat dissipation plate 1 in order to improve heat dissipation, and the respective leads 3 are arranged close to the semiconductor pellet 2. At the same time, each lead end portion and the corresponding surface electrode (not shown) of the semiconductor pellet 2 are bonded by a wire 4, and the heat dissipation plate 1 is covered with a mold resin. Resin molding is performed by the molding machine. That is, in the lower mold 5 of this resin molding apparatus, a housing recess 6 for housing the heat dissipation plate 1 and a runner 7 serving as a flow path for the molten resin supplied from an external pot (not shown) and the runner 7 are provided. A gate 8 extending toward each accommodation recess 6 is formed. Further, a cavity 10 is recessed in the upper mold 9 at the position of the heat dissipation plate 1 on the abutting surfaces of the upper and lower molds.
【０００３】 このような樹脂モールド装置では、放熱板１を下金型５の収容凹部６に収容配 置して上金型９を閉じ、ランナー７よりゲート８を介してキャビティ１０内に溶 融樹脂を注入している。In such a resin molding apparatus, the heat sink 1 is housed in the housing recess 6 of the lower mold 5, the upper mold 9 is closed, and the runner 7 melts into the cavity 10 through the gate 8. Injecting resin.
【０００４】[0004]
しかしながら、上記樹脂モールド装置の下金型５の各収容凹部６は、収容され る各放熱板１の規定の寸法形状となっているが、この放熱板１に加工成形誤差等 を生じて収容凹部６より多少小さいと、図６のように、下金型５の収容凹部６と 放熱板１との間に隙間Ｔを生じるようになる。この隙間Ｔがゲート８の位置に形 成されると、溶融樹脂をランナー７を通して注入したときに、キャビティ１０に 樹脂が流れ込む一方、この隙間Ｔにまで樹脂が漏れだすようになり、放熱板１の 周側縁や裏面にまでに樹脂が付着するようになる。 However, although the housing recesses 6 of the lower mold 5 of the resin molding apparatus have the prescribed size and shape of the respective heat sinks 1 to be housed, the heat sinks 1 are subject to processing and molding errors, etc. If it is slightly smaller than 6, a gap T is formed between the housing recess 6 of the lower mold 5 and the heat dissipation plate 1 as shown in FIG. When the gap T is formed at the position of the gate 8, when the molten resin is injected through the runner 7, the resin flows into the cavity 10 while the resin leaks to the gap T. The resin will adhere even to the peripheral edge and back surface of the.
【０００５】 このように放熱板１の周側縁や裏面にまで樹脂が付着していると、放熱性の低 下はもとより、プリント基板等に配設したときに周囲に取り付けられる部品の邪 魔になる等の問題があるので、面倒ではあるが除去する必要があり、樹脂モール ド工程時において下金型５の収容凹部６と収容された放熱板１とで形成される特 にゲート８位置において放熱板１を収容凹部６の壁面に密着さこせて隙間Ｔをな くし、樹脂漏れを防止して樹脂モールドを行いたいといった要望があった。When the resin adheres to the peripheral side edge and the back surface of the heat dissipation plate 1 as described above, not only the heat dissipation is deteriorated, but also when the heat dissipation plate 1 is mounted on a printed circuit board or the like, it interferes with the components attached to the surroundings. Since it is troublesome, it must be removed, but it is formed by the housing recess 6 of the lower mold 5 and the heat sink 1 housed during the resin molding process. In the above, there has been a demand for the heat sink 1 to be closely attached to the wall surface of the housing recess 6 to eliminate the gap T and prevent resin leakage to perform resin molding.
【０００６】[0006]
上記課題を解決するために、本考案の樹脂モールド装置は、放熱板上に半導体 ペレットをマウントすると共に、該半導体ペレットと近接配置されたリード端部 とをボンディングしてから前記放熱板を下金型の収容凹部内に収容配置し、上下 金型の衝合面に形成したキャビティ内にゲートを介して溶融樹脂を注入して所定 部分を樹脂モールドする樹脂モールド装置において、下金型の上記ゲート形成位 置とほぼ対向する上記放熱板の収容凹部の側壁を傾動壁とし、該傾動壁を収容凹 部側に押圧する伸縮部材を設けたことを特徴とする。 In order to solve the above-mentioned problems, a resin molding apparatus of the present invention mounts a semiconductor pellet on a heat sink and bonds the semiconductor pellet and a lead end portion arranged in proximity to the heat sink, and then heats the heat sink. In the resin molding apparatus, which is housed and disposed in the housing recess of the mold, the molten resin is injected into the cavity formed in the abutting surfaces of the upper and lower molds through the gate to mold the predetermined portion with resin, the above-mentioned gate of the lower mold. It is characterized in that a side wall of the housing recess of the heat dissipation plate which is substantially opposed to the forming position is a tilting wall, and an expansion / contraction member for pressing the tilting wall toward the housing recess is provided.
【０００７】[0007]
上記構成の樹脂モールド装置では、下金型に凹設された放熱板の収容凹部に向 かって形成される樹脂注入口となるゲート形成位置とほぼ対向する位置の収容凹 部の側壁が傾動壁となって伸縮部材によって収容凹部側に押圧自在となる。収容 凹部に放熱板を収容する際には伸縮部材を収縮させ、樹脂注入時にはこの伸縮部 材を伸長させて傾動壁を収容凹部側に押圧すると、樹脂注入時に、放熱板の一側 面を収容凹部の傾動壁が押圧し、ゲートが形成された収容凹部の壁面に放熱板の 他側面を押し付けて密着させるようになる。これにより、樹脂が注入されるゲー ト位置の収容凹部と放熱板との間に隙間が生じず、樹脂が放熱板の側面に漏れ出 ることが防止できる。 In the resin molding apparatus having the above-described configuration, the side wall of the housing recess, which is substantially opposite to the gate forming position that serves as the resin injection port formed toward the housing recess of the heat sink plate recessed in the lower mold, is the tilting wall. Then, it becomes possible to press the accommodation recess side by the elastic member. Housing When the heat sink is housed in the recess, the expansion / contraction member is contracted, and when the resin is injected, the expandable member is expanded to push the tilting wall toward the housing recess side. The tilting wall of the concave portion presses, and the other side surface of the heat dissipation plate is pressed against the wall surface of the housing concave portion where the gate is formed so as to be in close contact. As a result, no gap is created between the heat sink and the housing recess at the gate position where the resin is injected, and the resin can be prevented from leaking to the side surface of the heat sink.
【０００８】[0008]
【実施例】 以下、図面を参照して本考案の一実施例を説明する。Embodiment An embodiment of the present invention will be described below with reference to the drawings.
【０００９】 図１は本考案の一実施例に係る樹脂モールド装置を一部破断して示す概略分解 斜視図であり、図２は図１のＡ−Ａ線に沿った概略断面図である。本考案の樹脂 モールド装置は、特にパワートランジスタ等の放熱性を考慮して比較的板厚の厚 い放熱板を有する半導体装置の樹脂モールド装置である。本考案の樹脂モールド 装置は、板厚の厚い放熱板１上に半導体ペレット２をダイボンディング等により マウントし、例えば、リードフレーム３０から延びる両端の支持用リード３ａ， ３ａの先端を溶接等により一体に固定すると共に、各リード３の先端を半導体ペ レット２に近接配置し、それぞれのリード３と対応する半導体ペレット２の表面 電極（図示せず）とをワイヤ４によりボンディングし、上記放熱板１とリードフ レーム３０を一体として下金型５に配置し、上金型９を閉じて樹脂モールドする ものである。FIG. 1 is a partially exploded perspective view of a resin molding apparatus according to an embodiment of the present invention, partially broken away, and FIG. 2 is a schematic cross-sectional view taken along the line AA of FIG. The resin molding device of the present invention is a resin molding device for a semiconductor device having a relatively large heat dissipation plate in consideration of heat dissipation of a power transistor or the like. In the resin molding apparatus of the present invention, the semiconductor pellet 2 is mounted on the thick heat dissipation plate 1 by die bonding or the like, and, for example, the tips of the supporting leads 3a, 3a extending from the lead frame 30 are integrated by welding or the like. The tip of each lead 3 is placed close to the semiconductor pellet 2, and each lead 3 and the corresponding surface electrode (not shown) of the semiconductor pellet 2 are bonded by a wire 4, and the heat sink 1 is fixed. The lead frame 30 and the lead frame 30 are integrally arranged in the lower mold 5, and the upper mold 9 is closed for resin molding.
【００１０】 上記下金型５には、放熱板１が収容される収容凹部６が凹設されており、外部 のポットから供給される溶融樹脂の流路となるランナー７から収容凹部６に向か って樹脂注入口となるゲート８が凹設されている。また、このゲート形成位置の 反対面の収容凹部６には前記放熱板１に固着された支持用リード３ａ，３ａ及び 各リード３を配置するために溝状リード支持部５１が形成された支持ブロック５ ２が突設されている。該支持ブロック５２の前記ゲート８の形成位置とほぼ対向 する面には図２に示すように、収容凹部６より深くなった凹部５３が形成されて おり、該凹部５３は収容凹部６との間に両端が切り込まれて下端面が下金型５と 一体となった傾動する傾動壁１１によって仕切られている。該傾動壁１１によっ て収容凹部６と仕切られた凹部５３内には、例えば、形状記憶合金等の温度変化 によって伸縮自在となる伸縮部材１２が挿着されている。該伸縮部材１２は、樹 脂注入前の温度の低いときには、収縮して傾動壁１１を押さえることがないが、 樹脂注入時に温度が上昇すると凹部５３内で伸長し、これに伴って傾動壁１１を 押圧する力が働き、収容凹部６側にこの傾動壁１１が傾くようになっている。The lower mold 5 is provided with an accommodation recess 6 for accommodating the heat dissipation plate 1, and faces the accommodation recess 6 from a runner 7 which serves as a flow path for the molten resin supplied from an external pot. The gate 8 that serves as a resin injection port is recessed. In addition, a supporting block in which a groove-shaped lead supporting portion 51 for arranging the supporting leads 3a, 3a fixed to the heat radiating plate 1 and each lead 3 is formed in the accommodating concave portion 6 on the surface opposite to the gate forming position. 52 is projected. As shown in FIG. 2, a concave portion 53 that is deeper than the accommodating concave portion 6 is formed on the surface of the supporting block 52 that is substantially opposite to the position where the gate 8 is formed. Both ends are cut and the lower end surface is partitioned by a tilting tilting wall 11 which is integrated with the lower mold 5. In the recess 53 that is partitioned from the housing recess 6 by the tilting wall 11, for example, an expandable member 12 that can expand and contract due to temperature change of a shape memory alloy or the like is inserted. When the temperature before injection of the resin is low, the elastic member 12 does not contract to press the tilting wall 11, but when the temperature rises during the resin injection, it expands in the recess 53, and the tilting wall 11 is accompanied by this. The force that presses against acts on the tilting wall 11 toward the accommodation recess 6 side.
【００１１】 一方、上金型９には放熱板１上に樹脂をモールドするためのキャビティ１０が 凹設されており、上記ランナー７を通ってゲート８から注入される溶融樹脂をキ ャビティ１０内に供給されるようになっている。On the other hand, the upper die 9 is provided with a cavity 10 for molding the resin on the heat dissipation plate 1, and the molten resin injected from the gate 8 through the runner 7 is filled in the cavity 10. To be supplied to.
【００１２】 上記構成の樹脂モールド装置によれば以下のように樹脂モールドを行うことが できる。即ち、図２に示すように、放熱板１に半導体ペレット２をマウントし、 対応する各リード３とワイヤ４とをワイヤボンディングしてから、下金型５の収 容凹部６に放熱板１を収容配置すると共に、支持ブロック５２のリード支持部５ １に各リード３及び支持用リード３ａを対応するリード支持部５１に配置する。 このとき、支持ブロック５２に凹設された凹部５３内に収容された伸縮部材１２ は、金型の温度が低いために収縮しており、傾動壁１１を押圧するまでに至らな い。放熱板１に成形誤差等が生じていると、収容凹部６との間に図示したような 隙間Ｔが生じる。According to the resin molding apparatus having the above configuration, resin molding can be performed as follows. That is, as shown in FIG. 2, the semiconductor pellets 2 are mounted on the heat sink 1, the corresponding leads 3 and the wires 4 are wire-bonded, and then the heat sink 1 is placed in the storage recess 6 of the lower mold 5. While accommodating and arranging, the leads 3 and the supporting leads 3a are arranged in the corresponding lead supporting portion 51 of the supporting block 52. At this time, the elastic member 12 accommodated in the concave portion 53 provided in the support block 52 is contracted because the temperature of the mold is low, and the tilting wall 11 is not pressed. When a molding error or the like occurs in the heat dissipation plate 1, a gap T as shown in the figure is formed between the heat dissipation plate 1 and the accommodation recess 6.
【００１３】 しかし、下金型５を加熱して伸縮部材１２の温度を高めると、温度上昇に伴っ て伸縮部材１２は凹部５３内で伸長し、図３に示すように、傾動壁１１を押圧す るようになる。該傾動壁１１が伸縮部材１２により押圧されると、放熱板１を押 さえつけ、ゲート８の形成された収容凹部６の壁面に放熱板１の側面を押し付け られて密着させるようになり、少なくとも樹脂の注入されるゲート８の位置にお いて収容凹部６と放熱板１との間に隙間がなくなる。However, when the temperature of the elastic member 12 is raised by heating the lower mold 5, the elastic member 12 expands in the recess 53 as the temperature rises and presses the tilting wall 11 as shown in FIG. It comes to smoke. When the tilting wall 11 is pressed by the expansion / contraction member 12, the heat dissipation plate 1 is pressed down, and the side surface of the heat dissipation plate 1 is pressed against the wall surface of the accommodation recess 6 in which the gate 8 is formed, so that the heat dissipation plate 1 is brought into close contact. At the position of the gate 8 where the resin is injected, there is no gap between the accommodation recess 6 and the heat dissipation plate 1.
【００１４】 そして、上金型９を閉じてから外部のポットから供給される溶融樹脂をランナ ー７を通じ、ゲート８を介してキャビティ１０内に注入する。このとき、ゲート ８の形成された位置おける収容凹部６と放熱板１との間には隙間が形成されてい ないので、供給された樹脂が隙間に漏れ出る心配がなくなる。Then, after closing the upper mold 9, a molten resin supplied from an external pot is injected into the cavity 10 through the runner 7 and the gate 8. At this time, since no gap is formed between the housing recess 6 at the position where the gate 8 is formed and the heat dissipation plate 1, there is no fear that the supplied resin leaks into the gap.
【００１５】 樹脂硬化後には、上金型９を開き、傾動壁１１を押圧していた伸縮部材１２に だけ例えば、冷風等を吹き付けて伸縮部材１２を急速に収縮させて傾動壁１１を 元の位置に戻すことで放熱板１を収容凹部６より取り出すことができる。After the resin is hardened, the upper mold 9 is opened, and only the elastic member 12 that has pressed the tilting wall 11 is blown with, for example, cool air to rapidly contract the elastic member 12 to restore the tilting wall 11 to the original position. By returning to the position, the heat dissipation plate 1 can be taken out from the accommodation recess 6.
【００１６】 このような樹脂モールド装置によると、ゲート８の形成位置における収容凹部 ６と放熱板１との間に隙間を生じることなく樹脂モールドが行えるので、放熱板 １の周側縁や裏面にまで漏れ出た樹脂が付着して硬化することがなくなり、樹脂 モールド後に放熱性を低下させる余分に付着した樹脂を除去することなく、確実 に放熱性等を確保することができるようになる。According to such a resin molding apparatus, resin molding can be performed without forming a gap between the accommodation recess 6 at the position where the gate 8 is formed and the heat dissipation plate 1. The resin that has leaked out will not adhere and be hardened, and the heat dissipation and the like can be surely secured without removing the excessively adhered resin that deteriorates the heat dissipation after the resin molding.
【００１７】 尚、伸縮部材としては、図４に示すように、下金型５に凹設された凹部５３に ブロック状の形状記憶合金製の伸縮部材１２ａとしてもよい。このようなブロッ ク状の伸縮部材であっても、樹脂モールド時の温度上昇により伸長して傾動壁１ １を押圧する力が生じ、該収容凹部６内に収容された放熱板１をゲート形成位置 の収容凹部壁面に密着させることができる。また、形状記憶合金に限らず他の温 度変化による伸縮が可能な部材であってもよい。As the expansion / contraction member, as shown in FIG. 4, the expansion / contraction member 12a made of a block-shaped shape memory alloy may be used in the recess 53 formed in the lower mold 5. Even with such a block-shaped elastic member, a force for expanding and pressing the tilting wall 11 due to the temperature rise during resin molding is generated, and the heat dissipation plate 1 housed in the housing recess 6 is formed into a gate. It can be brought into close contact with the wall surface of the accommodation recess at the position. Further, the member is not limited to the shape memory alloy, and may be a member capable of expanding and contracting due to temperature change.
【００１８】[0018]
以上の説明から明らかなように、本考案の樹脂モールド装置では、樹脂注入時 に伸縮部材を伸長させて傾動壁を収容凹部側に押圧して放熱板の一側面を収容凹 部の傾動壁で押圧し、ゲートが形成された収容凹部の壁面に放熱板の他側面を押 し付けて密着させることができ、樹脂が注入されるゲート位置の収容凹部と放熱 板との間に隙間が生じず、樹脂が放熱板の側面に漏れ出ることなく樹脂モールド でき、放熱板の周側縁や裏面にまで樹脂が付着することがなくなり、放熱性等の 低下が防止できるといった効果を奏する。 As is apparent from the above description, in the resin molding device of the present invention, the expandable member is expanded during resin injection to press the tilting wall toward the housing recess side so that one side of the heat dissipation plate is supported by the tilting wall of the housing recess. The other side surface of the heat sink can be pressed against the wall surface of the housing recess where the gate is formed so as to be in close contact, and no gap is created between the housing recess at the gate position where resin is injected and the heat sink. As a result, the resin can be resin-molded without leaking to the side surface of the heat dissipation plate, the resin does not adhere to the peripheral side edge and the back surface of the heat dissipation plate, and it is possible to prevent deterioration of heat dissipation and the like.
【図１】図１は本考案の一実施例に係る樹脂モールド装
置の一部破断して示す概略分解斜視図。FIG. 1 is a schematic exploded perspective view of a resin molding apparatus according to an embodiment of the present invention, partially broken away.
【図２】本考案の樹脂モールド装置による樹脂モールド
前を示す図１のＡ−Ａ線に沿った概略断面図。FIG. 2 is a schematic cross-sectional view taken along line AA of FIG. 1 showing a state before resin molding by the resin molding device of the present invention.
【図３】本考案の樹脂モールド装置による樹脂モールド
を示す図１のＡ−Ａ線に沿った概略断面図。FIG. 3 is a schematic cross-sectional view taken along the line AA of FIG. 1 showing a resin mold by the resin molding device of the present invention.
【図４】従来の樹脂モールド装置の概略断面図。FIG. 4 is a schematic sectional view of a conventional resin molding device.
１ 放熱板 ２ 半導体ペレット ３ リード ５ 下金型 ６ 収容凹部 ９ 上金型 １０ キャビティ １１ 傾動壁 １２ 伸縮部材 ５３ 凹部 DESCRIPTION OF SYMBOLS 1 Heat sink 2 Semiconductor pellet 3 Lead 5 Lower mold 6 Housing recess 9 Upper mold 10 Cavity 11 Tilting wall 12 Expandable member 53 Recess
【手続補正書】[Procedure amendment]
【提出日】平成５年５月２７日[Submission date] May 27, 1993
【手続補正１】[Procedure Amendment 1]
【補正対象書類名】明細書[Document name to be amended] Statement
【補正対象項目名】図面の簡単な説明[Name of item to be corrected] Brief explanation of the drawing
【補正方法】変更[Correction method] Change
【補正内容】[Correction content]
【図面の簡単な説明】[Brief description of drawings]
【図１】本考案の一実施例に係る樹脂モールド装置を一
部破断して示す概略分解斜視図。FIG. 1 is a schematic exploded perspective view showing a resin mold device according to an embodiment of the present invention with a part thereof cut away.
【図２】本考案の樹脂モールド装置による樹脂モールド
前を示す図１のＡ−Ａ線に沿った概略断面図。FIG. 2 is a schematic cross-sectional view taken along line AA of FIG. 1 showing a state before resin molding by the resin molding device of the present invention.
【図３】本考案の樹脂モールド装置による樹脂モールド
を示す図１のＡ−Ａ線に沿った概略断面図。FIG. 3 is a schematic cross-sectional view taken along the line AA of FIG. 1 showing a resin mold by the resin molding device of the present invention.
【図４】本考案の樹脂モールド装置における伸縮部材の
他例を示す概略断面図。FIG. 4 is a schematic cross-sectional view showing another example of the elastic member in the resin molding device of the present invention.
【図５】従来の樹脂モールド装置の概略断面図。FIG. 5 is a schematic sectional view of a conventional resin molding device.
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 // Ｂ２９Ｌ 31:34 4Ｆ ─────────────────────────────────────────────────── ─── Continuation of front page (51) Int.Cl. 5 Identification code Office reference number FI technical display area // B29L 31:34 4F
Claims (1)
と共に、該半導体ペレットと近接配置されたリード端部
とをボンディングしてから前記放熱板を下金型の収容凹
部内に収容配置し、上下金型の衝合面に形成したキャビ
ティ内にゲートを介して溶融樹脂を注入して所定部分を
樹脂モールドする樹脂モールド装置において、 下金型の上記ゲート形成位置とほぼ対向する上記放熱板
の収容凹部の側壁を傾動壁とし、該傾動壁を収容凹部側
に押圧する伸縮部材を設けたことを特徴とする樹脂モー
ルド装置。1. A semiconductor pellet is mounted on a heat radiating plate, and the semiconductor pellet and a lead end portion arranged in close proximity are bonded to each other, and then the heat radiating plate is housed and arranged in a housing concave portion of a lower mold, In a resin molding apparatus for injecting a molten resin through a gate into a cavity formed on an abutting surface of a mold to mold a predetermined portion with a resin, the heat dissipation plate which substantially faces the gate forming position of the lower mold is housed. A resin molding apparatus, wherein a side wall of the recess is a tilting wall, and an expansion / contraction member for pressing the tilting wall toward the accommodation recess is provided.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5846591U JPH0590947U (en) | 1991-06-28 | 1991-06-28 | Resin molding equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5846591U JPH0590947U (en) | 1991-06-28 | 1991-06-28 | Resin molding equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0590947U true JPH0590947U (en) | 1993-12-10 |
Family
ID=13085182
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5846591U Withdrawn JPH0590947U (en) | 1991-06-28 | 1991-06-28 | Resin molding equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0590947U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013089908A (en) * | 2011-10-21 | 2013-05-13 | Toyota Motor Corp | Heat sink fitted semiconductor device manufacturing method |
-
1991
- 1991-06-28 JP JP5846591U patent/JPH0590947U/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013089908A (en) * | 2011-10-21 | 2013-05-13 | Toyota Motor Corp | Heat sink fitted semiconductor device manufacturing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19950907 |