JPH0590885A - Mounting method for surface acoustic wave device - Google Patents
Mounting method for surface acoustic wave deviceInfo
- Publication number
- JPH0590885A JPH0590885A JP3277353A JP27735391A JPH0590885A JP H0590885 A JPH0590885 A JP H0590885A JP 3277353 A JP3277353 A JP 3277353A JP 27735391 A JP27735391 A JP 27735391A JP H0590885 A JPH0590885 A JP H0590885A
- Authority
- JP
- Japan
- Prior art keywords
- acoustic wave
- surface acoustic
- wave device
- circuit board
- mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、弾性表面波フィルタ
などに用いられる弾性表面波装置に関し、詳しくは、フ
ェイスダウンボンディングを行うことにより実装される
表面実装型の弾性表面波装置の実装方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a surface acoustic wave device used for a surface acoustic wave filter or the like, and more particularly to a method of mounting a surface mounting type surface acoustic wave device which is mounted by face down bonding. ..
【０００２】[0002]
【従来の技術】例えば、図５に示すように、従来の弾性
表面波装置において用いられる弾性表面波素子２３は、
弾性表面波基板（圧電基板）２１の一方の主面の所定の
位置にくし歯状電極（ＩＤＴ）２２を配設することによ
り形成されている。また、弾性表面波基板２１の両端側
には、ＩＤＴ２２と接続する入出力電極２２ａが配設さ
れている。そして、この弾性表面波素子２３のＩＤＴ２
２に電圧が印加されると、圧電作用のため、弾性表面波
基板２１の表面付近に歪が生じ、この歪が表面波となっ
てその表面を伝搬する。2. Description of the Related Art For example, as shown in FIG. 5, a surface acoustic wave element 23 used in a conventional surface acoustic wave device is
It is formed by disposing a comb-teeth electrode (IDT) 22 at a predetermined position on one main surface of a surface acoustic wave substrate (piezoelectric substrate) 21. Input / output electrodes 22a connected to the IDT 22 are arranged on both ends of the surface acoustic wave substrate 21. Then, the IDT 2 of the surface acoustic wave element 23
When a voltage is applied to 2, the piezoelectric effect causes distortion in the vicinity of the surface of the surface acoustic wave substrate 21, and this distortion becomes a surface wave and propagates on the surface.
【０００３】上記のように、弾性表面波装置を構成する
弾性表面波素子２３の、ＩＤＴ２２が配設された機能面
（振動面）２３ａは、表面波を発生させる振動面である
とともに、ＩＤＴ２２により発生した表面波を伝搬させ
る表面波伝搬路２４としても機能する。したがって、こ
の弾性表面波素子２３を正常に機能させるためには、弾
性表面波素子２３のＩＤＴ２２が配設され、表面波伝搬
路２４が形成された方の主面（機能面）２３ａを、他の
部材などに接触させないようにする必要がある。As described above, the functional surface (vibration surface) 23a of the surface acoustic wave element 23 constituting the surface acoustic wave device, on which the IDT 22 is disposed, is a vibration surface for generating surface waves and is It also functions as the surface wave propagation path 24 for propagating the generated surface wave. Therefore, in order for the surface acoustic wave element 23 to function normally, the IDT 22 of the surface acoustic wave element 23 is arranged and the main surface (functional surface) 23a on which the surface wave propagation path 24 is formed is It is necessary to prevent it from coming into contact with the member, etc.
【０００４】そのために、弾性表面波素子をハーメチッ
クケースに収納することにより信頼性の向上を図った弾
性表面波装置が知られているが、製造コストが増大する
とともに、寸法が大きくなり小型化に対応できないとい
う問題点がある。Therefore, a surface acoustic wave device is known in which reliability is improved by housing the surface acoustic wave element in a hermetic case. However, the manufacturing cost increases, and the size increases and the size is reduced. There is a problem that we cannot handle it.
【０００５】また、図６に示すように、弾性表面波素子
２３の機能面２３ａを回路基板（実装対象）２５に対向
させ、はんだなどの接合部材２６を介して、回路基板２
５に実装することにより、弾性表面波素子２３の機能面
２３ａ上に所定の空間（振動空間）２７を形成するフェ
イスダウンボンディングタイプの弾性表面波装置が知ら
れているが、この弾性表面波装置においては、所定の振
動空間２７を確保するために、接合部材２６の厚み（す
なわち、はんだの量など）を微調整したり、図７に示す
ように、回路基板２５に凹部２８を形成したりしなけれ
ばならず、製造工程が複雑になり、製造コストが増大す
るという問題点がある。また、実装時に、弾性表面波素
子２３を押圧する力加減が微妙で、強く押圧すると所定
の厚みの振動空間２７を確保することができないばかり
でなく、はんだなどが流れて接続点のショート不良が発
生し、また、押圧する力が弱いと、接合させるべき箇所
（接合点）が多い場合などに、接続不良やオープン不良
が生じるという問題点があり、所定の厚みを有する振動
空間２７を確保することは必ずしも容易ではない。Further, as shown in FIG. 6, the functional surface 23a of the surface acoustic wave element 23 is opposed to the circuit board (mounting target) 25, and the circuit board 2 is connected via a joining member 26 such as solder.
There is known a face-down bonding type surface acoustic wave device in which a predetermined space (vibration space) 27 is formed on the functional surface 23a of the surface acoustic wave element 23 when mounted on the surface acoustic wave device 23. In order to secure a predetermined vibration space 27, the thickness of the joining member 26 (that is, the amount of solder, etc.) may be finely adjusted, or a recess 28 may be formed in the circuit board 25 as shown in FIG. However, there is a problem that the manufacturing process becomes complicated and the manufacturing cost increases. Further, when mounting, the amount of force for pressing the surface acoustic wave element 23 is delicate, and if it is strongly pressed, not only a vibration space 27 having a predetermined thickness cannot be ensured, but also solder or the like flows and short-circuit defects at connection points occur. If the force is generated and the pressing force is weak, there is a problem that connection failure or open failure occurs when there are many places to be joined (joint points), etc., and the vibration space 27 having a predetermined thickness is secured. It's not always easy.
【０００６】[0006]
【発明が解決しようとする課題】そこで、上記の問題点
を解決するために、発明者らは、図８，図９に示すよう
な弾性表面波装置及びその実装方法を提案している。す
なわち、この弾性表面波装置においては、弾性表面波基
板（圧電基板）３１の一方の主面の所定の位置にくし歯
状電極（ＩＤＴ）３２を配設することにより弾性表面波
素子３３が形成され、ＩＤＴ３２には外部との入出力の
ための入出力電極３２ａが接続されている。さらに、こ
の弾性表面波素子３３の機能面３３ａには、ＩＤＴ３２
及び表面波伝搬路３４を囲むように、例えば、エポキシ
樹脂からなる環状部材４０が配設されている（図８，
９）。Therefore, in order to solve the above problems, the inventors have proposed a surface acoustic wave device and a mounting method thereof as shown in FIGS. That is, in this surface acoustic wave device, the surface acoustic wave element 33 is formed by disposing the interdigital electrode (IDT) 32 at a predetermined position on one main surface of the surface acoustic wave substrate (piezoelectric substrate) 31. The IDT 32 is connected to the input / output electrode 32a for input / output with the outside. Further, the IDT 32 is provided on the functional surface 33a of the surface acoustic wave element 33.
An annular member 40 made of, for example, epoxy resin is disposed so as to surround the surface wave propagation path 34 (FIG. 8,
9).
【０００７】そして、弾性表面波装置を実装する場合、
まず、弾性表面波素子３３の機能面３３ａを回路基板３
５と対向させ、弾性表面波素子３３を環状部材４０を介
して回路基板３５の所定の位置に載置する。そして、環
状部材４０を介在させた状態で、接合部材３６により、
弾性表面波素子３３の入出力電極３２ａ（図８）を回路
基板３５上の線路（図示せず）に電気的に接続するとと
もに、弾性表面波素子３３を回路基板３５に固定する。
これにより、弾性表面波素子３３の機能面３３ａと回路
基板３５との間には、振動空間３７が確実に形成される
（図９）。When mounting the surface acoustic wave device,
First, the functional surface 33a of the surface acoustic wave element 33 is connected to the circuit board 3
5, the surface acoustic wave element 33 is placed at a predetermined position on the circuit board 35 via the annular member 40. Then, with the annular member 40 interposed, the joining member 36
The input / output electrode 32a (FIG. 8) of the surface acoustic wave element 33 is electrically connected to a line (not shown) on the circuit board 35, and the surface acoustic wave element 33 is fixed to the circuit board 35.
Thereby, the vibration space 37 is reliably formed between the functional surface 33a of the surface acoustic wave element 33 and the circuit board 35 (FIG. 9).
【０００８】しかし、この弾性表面波装置の実装方法に
おいては、弾性表面波装置を実装した回路基板（アセン
ブリ基板）が全体的に封止されている場合は特に問題は
ないが、これが封止されていない場合、ほこりや有害ガ
スなどの侵入により機能が低下するおそれがあり、信頼
性を確保するためには、アセンブリ基板を全体的に封止
するか、弾性表面波装置のみを個々に封止するかしなけ
ればならないという問題点がある。However, in this method of mounting the surface acoustic wave device, there is no problem if the circuit board (assembly substrate) on which the surface acoustic wave device is mounted is entirely sealed, but this is sealed. If not installed, the function may deteriorate due to intrusion of dust or harmful gas. To ensure reliability, either seal the assembly substrate as a whole or seal only the surface acoustic wave device individually. There is a problem that it must be done.
【０００９】この発明は上記の問題点を解決するもので
あり、回路基板などに実装される弾性表面波装置を、簡
便な方法で、効率よく封止することが可能な弾性表面波
装置の実装方法を提供することを目的とする。The present invention is intended to solve the above-mentioned problems, and it is possible to efficiently seal a surface acoustic wave device mounted on a circuit board or the like by a simple method. The purpose is to provide a method.
【００１０】[0010]
【課題を解決するための手段】上記目的を達成するため
に、この発明の弾性表面波装置の実装方法は、弾性表面
波基板の一方の主面にくし歯状電極などの電極を配設し
て弾性表面波素子を形成するとともに、前記くし歯状電
極及び表面波が伝搬する表面波伝搬路を囲むように、前
記くし歯状電極が配設された弾性表面波素子の機能面に
所定の厚みを有する環状部材を配設してなる弾性表面波
装置の実装方法であって、前記弾性表面波素子の機能面
を回路基板などの実装対象に対向させ、所定の厚みを有
する環状部材を弾性表面波素子と実装対象との間に介在
させた状態で、接合部材により前記弾性表面波素子を前
記回路基板に接続固定した後、樹脂ポッティングするこ
とにより弾性表面波素子の機能面を封止することを特徴
とする。In order to achieve the above object, a method of mounting a surface acoustic wave device according to the present invention comprises disposing an electrode such as a comb-shaped electrode on one main surface of a surface acoustic wave substrate. To form a surface acoustic wave element, and to surround the comb-shaped electrode and the surface wave propagation path through which the surface wave propagates, a predetermined surface is provided on the functional surface of the surface acoustic wave element in which the comb-shaped electrode is arranged. A method for mounting a surface acoustic wave device comprising disposing an annular member having a thickness, wherein a functional surface of the surface acoustic wave element is made to face a mounting target such as a circuit board, and an annular member having a predetermined thickness is elastic. The surface of the surface acoustic wave device is sealed by connecting the surface acoustic wave device to the circuit board with a joining member while fixing the surface acoustic wave device and the mounting target, and then performing resin potting. It is characterized by
【００１１】[0011]
【作用】この発明の弾性表面波装置においては、弾性表
面波素子の機能面に、くし歯状電極及び表面波伝搬路を
囲むように配設された所定の厚みを有する環状部材が、
回路基板などの実装対象との間にスペーサとして介在
し、弾性表面波素子の機能面と実装対象との間に、環状
部材の厚みに対応した振動空間が確実に形成されるとと
もに、樹脂ポッティングすることにより、所定の振動空
間を保持した状態で弾性表面波装置が確実に封止され
る。In the surface acoustic wave device of the present invention, on the functional surface of the surface acoustic wave element, an annular member having a predetermined thickness, which is arranged so as to surround the comb-teeth electrode and the surface wave propagation path,
It is interposed as a spacer between the circuit board and other objects to be mounted, and a vibration space corresponding to the thickness of the annular member is reliably formed between the functional surface of the surface acoustic wave element and the objects to be mounted, and resin potting is performed. As a result, the surface acoustic wave device is reliably sealed while maintaining a predetermined vibration space.
【００１２】[0012]
【実施例】以下、この発明の実施例を図に基づいて説明
する。図１は、弾性表面波素子を実装対象である回路基
板上に載置した状態を示す正面断面図であり、図２はそ
の側面断面図である。図１及び図２に示すように、弾性
表面波素子３の機能面（振動面）３ａ上に形成されたく
し歯状電極（ＩＤＴ）（図示せず）及び表面波が伝搬す
る表面波伝搬路（図示せず）を囲むように、所定の厚み
を有する環状部材１０を配設してなる弾性表面波装置Ａ
を、回路基板（実装対象）５上の所定の位置に載置し、
所定の振動空間７を形成させる。それから、例えば、は
んだなどの接合部材６により、弾性表面波素子３の入出
力電極（図示せず）を回路基板５上の線路（図示せず）
に電気的に接続するとともに、弾性表面波素子３を回路
基板５に固定する。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a front sectional view showing a state in which a surface acoustic wave element is mounted on a circuit board which is a mounting target, and FIG. 2 is a side sectional view thereof. As shown in FIGS. 1 and 2, a comb-teeth electrode (IDT) (not shown) formed on the functional surface (vibration surface) 3a of the surface acoustic wave element 3 and a surface wave propagation path through which the surface wave propagates ( A surface acoustic wave device A in which an annular member 10 having a predetermined thickness is provided so as to surround (not shown).
Is placed at a predetermined position on the circuit board (mounting target) 5,
A predetermined vibration space 7 is formed. Then, an input / output electrode (not shown) of the surface acoustic wave element 3 is connected to a line (not shown) on the circuit board 5 by a joining member 6 such as solder.
And the surface acoustic wave element 3 is fixed to the circuit board 5.
【００１３】それから、図３及び図４に示すように、弾
性表面波装置Ａを封止用のポッティング用の樹脂（例え
ば、エポキシ樹脂）１１で覆い、加熱して樹脂１１を硬
化させる。Then, as shown in FIGS. 3 and 4, the surface acoustic wave device A is covered with a potting resin 11 (for example, an epoxy resin) for sealing and heated to cure the resin 11.
【００１４】この樹脂ポッティングの工程において、樹
脂１１は、その粘度が高いこともあり、弾性表面波素子
３と回路基板５の間に挾持された環状部材１０によって
仕切られた振動空間７内にまでは侵入することがなく、
弾性表面波装置Ａは所定の振動空間７を保持した状態で
樹脂１１により外気から確実に遮断される。In this resin potting process, the resin 11 may have a high viscosity, so that even the inside of the vibrating space 7 partitioned by the annular member 10 sandwiched between the surface acoustic wave element 3 and the circuit board 5. Will not invade,
The surface acoustic wave device A is reliably shielded from the outside air by the resin 11 while holding the predetermined vibration space 7.
【００１５】この発明の弾性表面波装置の実装方法にお
いて、環状部材を構成する材料については特別の制約は
ないが、シリコーン樹脂や、シリコーンゴムなどの弾性
材料を用いて環状部材を形成した場合には、その弾性力
によりシール効果を向上させて、振動空間への封止用の
樹脂の侵入をより確実に防止することができるととも
に、樹脂を吸音材としても機能させ、特性を向上させる
ことができる。したがって可能であれば、弾性材料を用
いて環状部材を形成することが好ましい。In the method of mounting the surface acoustic wave device of the present invention, there is no particular limitation on the material forming the annular member, but when the annular member is formed using an elastic material such as silicone resin or silicone rubber. Can improve the sealing effect by its elastic force to prevent the resin for sealing from invading the vibrating space more reliably, and also make the resin function as a sound absorbing material to improve the characteristics. it can. Therefore, if possible, it is preferable to form the annular member using an elastic material.
【００１６】また、この発明の弾性表面波装置の実装方
法においては、ポッティング用の樹脂材料についても特
に制約はなく、エポキシ系樹脂、シリコン樹脂その他種
々の樹脂材料を用いることができる。Further, in the mounting method of the surface acoustic wave device of the present invention, there is no particular limitation on the resin material for potting, and various resin materials such as epoxy resin, silicon resin and the like can be used.
【００１７】なお、この発明の弾性表面波装置の実装方
法においては、複数の弾性表面波装置を同時に（一まと
めにして）樹脂ポッティングすることが可能であり、ま
た、弾性表面波装置の近傍に位置する半導体チップなど
を同時に樹脂ポッティングすることも可能である。In the method of mounting a surface acoustic wave device according to the present invention, it is possible to simultaneously (collectively) resin pot a plurality of surface acoustic wave devices, and to arrange the surface acoustic wave devices near the surface acoustic wave device. It is also possible to simultaneously perform resin potting on the semiconductor chips and the like.
【００１８】[0018]
【発明の効果】上述のように、この発明の弾性表面波装
置の実装方法は、環状部材を弾性表面波素子と実装対象
との間に介在させた状態で、接合部材により弾性表面波
素子を回路基板などの実装対象に接続固定した後、樹脂
ポッティングするようにしているので、複雑な製造工程
を必要とせず、製造コストを増大させることなしに、弾
性表面波素子の機能面上に、所定の厚みを有する振動空
間を確保しつつ、弾性表面波装置を確実に封止すること
が可能になり、回路基板などに実装された弾性表面波装
置の信頼性を向上させることができる。As described above, according to the method of mounting the surface acoustic wave device of the present invention, the surface acoustic wave device is joined to the surface acoustic wave device with the annular member interposed between the surface acoustic wave device and the object to be mounted. Since the resin potting is performed after connecting and fixing to the mounting target such as a circuit board, a complicated manufacturing process is not required, and a predetermined surface is formed on the functional surface of the surface acoustic wave element without increasing the manufacturing cost. It is possible to reliably seal the surface acoustic wave device while ensuring a vibrating space having a thickness of 1, and it is possible to improve the reliability of the surface acoustic wave device mounted on a circuit board or the like.
【図１】この発明の一実施例にかかる弾性表面波装置の
実装方法の一工程を示す正面断面図である。FIG. 1 is a front sectional view showing a step of a method of mounting a surface acoustic wave device according to an embodiment of the present invention.
【図２】この発明の一実施例にかかる弾性表面波装置の
実装方法の一工程を示す側面断面図である。FIG. 2 is a side sectional view showing a step of a method of mounting the surface acoustic wave device according to the embodiment of the present invention.
【図３】この発明の一実施例にかかる実装方法により弾
性表面波装置を実装した状態を示す正面断面図である。FIG. 3 is a front sectional view showing a state in which a surface acoustic wave device is mounted by a mounting method according to an embodiment of the present invention.
【図４】この発明の一実施例にかかる実装方法により弾
性表面波装置を実装した状態を示す側面断面図である。FIG. 4 is a side sectional view showing a state in which the surface acoustic wave device is mounted by the mounting method according to the embodiment of the present invention.
【図５】従来の弾性表面波装置を構成する弾性表面波素
子を示す平面図である。FIG. 5 is a plan view showing a surface acoustic wave element forming a conventional surface acoustic wave device.
【図６】従来の弾性表面波装置を回路基板上に実装した
状態を示す断面図である。FIG. 6 is a cross-sectional view showing a state in which a conventional surface acoustic wave device is mounted on a circuit board.
【図７】従来の弾性表面波装置を他の回路基板上に実装
した状態を示す断面図である。FIG. 7 is a cross-sectional view showing a state in which a conventional surface acoustic wave device is mounted on another circuit board.
【図８】この発明が関連する弾性表面波装置を示す平面
図である。FIG. 8 is a plan view showing a surface acoustic wave device to which the present invention is related.
【図９】この発明が関連する弾性表面波装置の実装状態
を示す断面図である。FIG. 9 is a cross-sectional view showing a mounted state of the surface acoustic wave device to which the invention relates.
Ａ 弾性表面波装置 １ 弾性表面波基板 ３ 弾性表面波素子 ３ａ 機能面（振動面） ５ 回路基板（実装対象） ６ 接合部材 ７ 振動空間 １０ 環状部材 １１ 樹脂 A surface acoustic wave device 1 surface acoustic wave substrate 3 surface acoustic wave element 3a functional surface (vibration surface) 5 circuit board (mounting target) 6 joining member 7 vibration space 10 annular member 11 resin
Claims (1)
電極などの電極を配設して弾性表面波素子を形成すると
ともに、前記くし歯状電極及び表面波が伝搬する表面波
伝搬路を囲むように、前記くし歯状電極が配設された弾
性表面波素子の機能面に所定の厚みを有する環状部材を
配設してなる弾性表面波装置の実装方法であって、前記
弾性表面波素子の機能面を回路基板などの実装対象に対
向させ、所定の厚みを有する環状部材を弾性表面波素子
と実装対象との間に介在させた状態で、接合部材により
前記弾性表面波素子を前記回路基板に接続固定した後、
樹脂ポッティングすることにより弾性表面波素子の機能
面を封止することを特徴とする弾性表面波装置の実装方
法。1. A surface acoustic wave device in which an electrode such as a comb-shaped electrode is arranged on one main surface of a surface acoustic wave substrate to form a surface acoustic wave element, and the surface of the comb-shaped electrode and the surface wave propagate. A method for mounting a surface acoustic wave device, comprising an annular member having a predetermined thickness provided on a functional surface of a surface acoustic wave element provided with the comb-teeth-shaped electrode so as to surround a path. With the functional surface of the surface acoustic wave element facing a mounting object such as a circuit board, and an annular member having a predetermined thickness interposed between the surface acoustic wave element and the mounting object, the surface acoustic wave element is joined by a joining member. After connecting and fixing to the circuit board,
A method for mounting a surface acoustic wave device, characterized in that a functional surface of a surface acoustic wave element is sealed by resin potting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27735391A JP3189324B2 (en) | 1991-09-28 | 1991-09-28 | Mounting method of surface acoustic wave device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27735391A JP3189324B2 (en) | 1991-09-28 | 1991-09-28 | Mounting method of surface acoustic wave device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0590885A true JPH0590885A (en) | 1993-04-09 |
| JP3189324B2 JP3189324B2 (en) | 2001-07-16 |
Family
ID=17582345
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27735391A Expired - Lifetime JP3189324B2 (en) | 1991-09-28 | 1991-09-28 | Mounting method of surface acoustic wave device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3189324B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004012331A1 (en) * | 2002-07-31 | 2004-02-05 | Murata Manufacturing Co., Ltd. | Piezoelectric component and method for manufacturing the same |
| US6754950B2 (en) * | 1995-06-30 | 2004-06-29 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
| US7183124B2 (en) | 2002-10-04 | 2007-02-27 | Toyo Communication Equipment Co., Ltd. | Surface mount saw device manufacturing method |
| US9762088B2 (en) | 2012-10-03 | 2017-09-12 | Mitsubishi Electric Corporation | Electromagnetic transmission device, power amplification device, and electromagnetic transmission system |
| US10321572B2 (en) | 2016-04-01 | 2019-06-11 | Skyworks Filter Solutions Japan Co., Ltd. | Electronic package including cavity defined by resin and method of forming same |
| US11264253B2 (en) | 2017-03-09 | 2022-03-01 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium |
-
1991
- 1991-09-28 JP JP27735391A patent/JP3189324B2/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6754950B2 (en) * | 1995-06-30 | 2004-06-29 | Kabushiki Kaisha Toshiba | Electronic component and method of production thereof |
| WO2004012331A1 (en) * | 2002-07-31 | 2004-02-05 | Murata Manufacturing Co., Ltd. | Piezoelectric component and method for manufacturing the same |
| US7042056B2 (en) | 2002-07-31 | 2006-05-09 | Murata Manufacturing Co., Ltd. | Chip-size package piezoelectric component |
| US7183124B2 (en) | 2002-10-04 | 2007-02-27 | Toyo Communication Equipment Co., Ltd. | Surface mount saw device manufacturing method |
| US9762088B2 (en) | 2012-10-03 | 2017-09-12 | Mitsubishi Electric Corporation | Electromagnetic transmission device, power amplification device, and electromagnetic transmission system |
| US10321572B2 (en) | 2016-04-01 | 2019-06-11 | Skyworks Filter Solutions Japan Co., Ltd. | Electronic package including cavity defined by resin and method of forming same |
| US10999932B2 (en) | 2016-04-01 | 2021-05-04 | Skyworks Filter Solutions Japan Co., Ltd. | Electronic package including cavity defined by resin and method of forming same |
| US11264253B2 (en) | 2017-03-09 | 2022-03-01 | Kokusai Electric Corporation | Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3189324B2 (en) | 2001-07-16 |
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