JPH0579686B2 - - Google Patents

Info

Publication number
JPH0579686B2
JPH0579686B2 JP7598590A JP7598590A JPH0579686B2 JP H0579686 B2 JPH0579686 B2 JP H0579686B2 JP 7598590 A JP7598590 A JP 7598590A JP 7598590 A JP7598590 A JP 7598590A JP H0579686 B2 JPH0579686 B2 JP H0579686B2
Authority
JP
Japan
Prior art keywords
polyphenylene oxide
resin composition
flame retardant
laminate
flame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP7598590A
Other languages
English (en)
Japanese (ja)
Other versions
JPH03275760A (ja
Inventor
Hideto Misawa
Takayoshi Koseki
Tokio Yoshimitsu
Toshiharu Takada
Yoshihide Sawa
Takaaki Sakamoto
Takahiro Heiuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP7598590A priority Critical patent/JPH03275760A/ja
Publication of JPH03275760A publication Critical patent/JPH03275760A/ja
Publication of JPH0579686B2 publication Critical patent/JPH0579686B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement

Landscapes

  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polymerisation Methods In General (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
JP7598590A 1990-03-26 1990-03-26 ポリフェニレンオキサイド系樹脂組成物 Granted JPH03275760A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7598590A JPH03275760A (ja) 1990-03-26 1990-03-26 ポリフェニレンオキサイド系樹脂組成物

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7598590A JPH03275760A (ja) 1990-03-26 1990-03-26 ポリフェニレンオキサイド系樹脂組成物

Publications (2)

Publication Number Publication Date
JPH03275760A JPH03275760A (ja) 1991-12-06
JPH0579686B2 true JPH0579686B2 (fr) 1993-11-04

Family

ID=13592068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7598590A Granted JPH03275760A (ja) 1990-03-26 1990-03-26 ポリフェニレンオキサイド系樹脂組成物

Country Status (1)

Country Link
JP (1) JPH03275760A (fr)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2965277B2 (ja) * 1992-07-24 1999-10-18 松下電工株式会社 ポリフェニレンオキサイド系樹脂組成物とこれを用いた金属箔張積層板
JP5261943B2 (ja) * 2006-02-17 2013-08-14 日立化成株式会社 セミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
TWI441866B (zh) 2006-02-17 2014-06-21 Hitachi Chemical Co Ltd A thermosetting resin composition of a semi-IPN type composite and a varnish, a prepreg and a metal laminate
JP5303852B2 (ja) * 2006-04-13 2013-10-02 日立化成株式会社 セミipn型複合体の樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP5303853B2 (ja) * 2006-04-14 2013-10-02 日立化成株式会社 Ipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP5303854B2 (ja) * 2006-10-24 2013-10-02 日立化成株式会社 新規なセミipn型複合体の熱硬化性樹脂組成物並びにこれを用いたワニス、プリプレグ及び金属張積層板
JP5104507B2 (ja) 2007-04-26 2012-12-19 日立化成工業株式会社 セミipn型複合体の熱硬化性樹脂を含有する樹脂ワニスの製造方法、並びにこれを用いたプリント配線板用樹脂ワニス、プリプレグ及び金属張積層板
JP5901066B2 (ja) 2012-04-27 2016-04-06 三井金属鉱業株式会社 樹脂組成物、樹脂層付金属箔、金属張積層板及びプリント配線板
WO2015152427A1 (fr) 2014-04-04 2015-10-08 日立化成株式会社 Dérivé d'éther de polyphénylène comprenant un groupe maléimide n-substitué, et composition de résine thermodurcissable, vernis de résine, préimprégné, stratifié à revêtement métallique, et carte de câblage imprimé multicouche utilisant ledit dérivé d'éther de polyphénylène comprenant un groupe maléimide n-substitué
WO2016114286A1 (fr) 2015-01-13 2016-07-21 日立化成株式会社 Composition de résine, support avec couche de résine, préimprégné, stratifié, carte de circuit imprimé multicouche, et carte de circuit imprimé pour radar à ondes millimétriques

Also Published As

Publication number Publication date
JPH03275760A (ja) 1991-12-06

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