JPH0578889A - Aluminum alloy sheet for terminal - Google Patents
Aluminum alloy sheet for terminalInfo
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- JPH0578889A JPH0578889A JP27483891A JP27483891A JPH0578889A JP H0578889 A JPH0578889 A JP H0578889A JP 27483891 A JP27483891 A JP 27483891A JP 27483891 A JP27483891 A JP 27483891A JP H0578889 A JPH0578889 A JP H0578889A
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- aluminum alloy
- terminal
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- thickness
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電気部品である端子用ア
ルミニウム合金板に関し、更に、詳述すると、強度、加
工性、導電率及び接触抵抗が優れた端子用アルミニウム
合金板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an aluminum alloy plate for terminals which is an electric component, and more specifically to an aluminum alloy plate for terminals which is excellent in strength, workability, conductivity and contact resistance.
【０００２】[0002]
【従来の技術】従来、端子用材料及び導電体材料として
は、Ｃｕ又はその合金が多用されている。これらの部品
用材料としては、Ｃｕ系の材料の特性が優れているた
め、他の材料を適用する試みは殆どなされていない。僅
かに、アルミニウムワイヤー等に使用される部品を、ア
ルミニウム又はアルミニウム合金（以下、総称してアル
ミニウム材という）で製造する検討が開始された段階で
ある。例えば、特開平２−２００７５０では、管路気中
の送電線に対するアルミニウム合金材料の適用が提案さ
れ、また特開平２−１３３５５４にはアルミニウム材の
リードフレームへの適用の提案等がある。2. Description of the Related Art Conventionally, Cu or its alloy has been widely used as a terminal material and a conductor material. As a material for these parts, since Cu-based materials have excellent properties, attempts to apply other materials have hardly been made. At this stage, a study has started to manufacture a part used for an aluminum wire or the like from aluminum or an aluminum alloy (hereinafter collectively referred to as an aluminum material). For example, Japanese Patent Application Laid-Open No. 2-200750 proposes application of an aluminum alloy material to a transmission line in the air in a pipeline, and Japanese Patent Application Laid-Open No. 2-133554 proposes application of an aluminum material to a lead frame.
【０００３】しかしながら、近年、自動車の軽量化の要
求から、自動車用のパネル材は一部アルミニウム合金の
採用が開始されている。この動きに伴い、自動車用の電
気部品も軽量化が望まれており、特に端子材においてそ
の要求が高い。これらの部品用の材料として、アルミニ
ウム材を使用する場合は、 端子としての構造体の強度機能を満足するために、
素材強度が高いこと、 折り曲げ加工等の加工が必須であり、ある程度の加
工性を有すること、 電気部品であるため、導電率ができる限り高いこ
と、 が必要条件である。However, in recent years, in order to reduce the weight of automobiles, the use of aluminum alloys for some automobile panel materials has started. Along with this movement, it is desired to reduce the weight of electric parts for automobiles, and particularly, the demand for terminal materials is high. When using aluminum as the material for these parts, in order to satisfy the strength function of the structure as a terminal,
It is necessary that the strength of the material is high, bending and other processing are indispensable and that it has a certain degree of workability, and that it is an electrical component, so its electrical conductivity is as high as possible.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、従来の
アルミニウム合金板は、上述の条件をほぼ満たすことは
できても、アルミニウム合金板自体は接触抵抗が高く、
そのままでは発熱現象のため、端子として使用すること
が困難である。なお、端子材料としては、曲げ加工を受
け易いため、前述の特性の中でも特に曲げ加工に対する
耐性が優れていることが要求される。However, although the conventional aluminum alloy sheet can substantially meet the above-mentioned conditions, the aluminum alloy sheet itself has a high contact resistance,
As it is, it is difficult to use as a terminal because of the heat generation phenomenon. Since the terminal material is susceptible to bending, it is required to have particularly excellent resistance to bending among the above characteristics.
【０００５】本発明はかかる問題点に鑑みてなされたも
のであって、上述の要求特性を全て満足すると共に、接
触抵抗が低く、発熱にも強く、曲げ加工に対する耐性も
優れた端子用アルミニウム合金板を提供することを目的
とする。The present invention has been made in view of the above problems, and is an aluminum alloy for terminals which satisfies all the above-mentioned required characteristics, has a low contact resistance, is strong against heat generation, and has excellent resistance to bending. The purpose is to provide a plate.
【０００６】[0006]
【課題を解決するための手段】本発明に係る端子用アル
ミニウム合金板は、Ｍｇ；０．６〜１．４重量％及びＳ
ｉ；０．４〜１．２重量％を含有し、不純物としてのＦ
ｅを０．６重量％以下、Ｃｕを０．４重量％以下に規制
し、残部がＡｌ及び各０．１重量％以下の不可避的不純
物からなり、板厚が１．０ｍｍ以下であるアルミニウム
合金素板と、この素板上に０．５〜２μｍの厚さで形成
されたＮｉめっき膜からなる下地膜と、この下地膜上に
形成され厚さが１〜５μｍの半田めっき層とを有するこ
とを特徴とする。The aluminum alloy plate for terminals according to the present invention comprises Mg; 0.6 to 1.4 wt% and S.
i; 0.4 to 1.2% by weight and containing F as an impurity
An aluminum alloy in which e is regulated to 0.6% by weight or less, Cu is regulated to 0.4% by weight or less, the balance is Al and inevitable impurities of 0.1% by weight or less, and the plate thickness is 1.0 mm or less. A base plate, a base film made of a Ni plating film having a thickness of 0.5 to 2 μm formed on the base plate, and a solder plating layer having a thickness of 1 to 5 μm formed on the base film. It is characterized by
【０００７】[0007]
【作用】以下、本発明について詳細に説明する。The present invention will be described in detail below.
【０００８】先ず、素材となるアルミニウム合金素板と
しては、端子板として良好な加工性と十分な強度を得る
ために、加工時には比較的低い強度であり、加工後の処
理により強度を向上できる熱処理型合金を使用すること
が望ましい。また、自動車に搭載するためにはある程度
の耐食性が必要である。このため、素板としてＪＩＳ６
０００系のアルミニウム合金を選定した。First, the aluminum alloy base plate as a raw material has a relatively low strength during processing so as to obtain good workability and sufficient strength as a terminal plate, and heat treatment capable of improving the strength by post-processing treatment. It is desirable to use type alloys. In addition, a certain level of corrosion resistance is required for mounting on an automobile. For this reason, JIS6
A 000 series aluminum alloy was selected.
【０００９】Ｍｇ及びＳｉ Ｍｇ及びＳｉは６０００系熱処理型合金として強度を得
るために必須の成分であり、このため、Ｍｇ；０．６〜
１．４重量％及びＳｉ；０．４〜１．２重量％の添加が
必要である。Ｍｇが０．６重量％Ｍｇ未満である場合、
又はＳｉが０．４重量％未満の場合は、十分な強度が得
られない。また、Ｍｇが１．４重量％を超える場合、又
はＳｉが１．２重量％を超える場合は、Ｍｇ2Ｓｉの晶
出物が粗大化し、これによる伸びの低下等によって加工
性が低下する。このため、Ｍｇ及びＳｉを上記範囲とす
る。 Mg and Si Mg and Si are essential components for obtaining strength as a 6000 heat treatment type alloy, and therefore Mg; 0.6 to 0.6
1.4 wt% and Si; 0.4-1.2 wt% addition is required. If Mg is less than 0.6 wt% Mg,
Alternatively, if Si is less than 0.4% by weight, sufficient strength cannot be obtained. Further, when Mg exceeds 1.4% by weight or when Si exceeds 1.2% by weight, the crystallized substance of Mg 2 Si is coarsened and the workability is deteriorated due to the reduction of elongation and the like. Therefore, Mg and Si are set within the above range.
【００１０】Ｃｕ Ｃｕは不純物であるが、ＣｕはＭｇ及びＡｌと結合し、
時効析出物を形成して強度を向上させる効果がある。こ
のため、Ｃｕが素板に含有されていても良いが、Ｃｕの
過剰の含有は素板の導電性を低下させてしまうため、Ｃ
ｕ含有量は０．４重量％以下に規制する。 Cu Cu is an impurity, but Cu combines with Mg and Al,
It has the effect of forming an age precipitate and improving the strength. Therefore, Cu may be contained in the base plate, but excessive inclusion of Cu lowers the conductivity of the base plate.
The u content is regulated to 0.4% by weight or less.
【００１１】Ｆｅ Ｆｅは不純物であるが、Ｆｅは再結晶粒の粒径を微細化
する効果もある。このため、素板にＦｅが含有されてい
ても良いが、Ｆｅが多量に含有されると、晶出物が粗大
化し、加工性を低下させるため、Ｆｅ含有量は０，６重
量％以下に規制する。 Fe Fe is an impurity, but Fe also has the effect of reducing the grain size of recrystallized grains. For this reason, Fe may be contained in the base plate, but if a large amount of Fe is contained, the crystallized material will be coarsened and the workability will be reduced, so the Fe content will be 0.6% by weight or less. regulate.
【００１２】不可避的不純物 その他、Ｍｎ，Ｃｒ，Ｚｎ等の不可避的不純物は夫々
０．１重量％以下であれば添加されていても実質上問題
はない。[0012] Inevitable impurities and other unavoidable impurities such as Mn, Cr, and Zn are not problematic even if they are added in an amount of 0.1% by weight or less.
【００１３】また、鋳塊組織微細化剤であるＴｉ又はＴ
ｉ−Ｂ等も、Ｔｉ量に換算して０．１重量％以下であれ
ば、実質上問題はない。Further, Ti or T which is an ingot structure refiner
With respect to i-B and the like, if it is 0.1% by weight or less in terms of Ti amount, there is substantially no problem.
【００１４】上述の組成を有するアルミニウム合金素板
は、以下のようにして製造することができる。先ず、こ
れらの組成の鋳塊を望ましくは４８０℃以上５６０℃以
下の温度で２時間以上２４時間以下の均質化焼鈍を行
い、その後熱間圧延及び冷間圧延により１ｍｍ以下の所
定板厚の素板に仕上げる。次いで、この圧延板を望まし
くは１００℃／分以上の昇温速度で４８０℃以上５６０
℃以下の温度に加熱し、この温度に３０秒以下保持し、
３００℃／分以上の冷却速度にて冷却する。昇温速度が
１００℃／分未満、また、降温速度が３００℃／分未
満、熱処理保持温度が４８０℃未満の場合は、端子とし
ての使用時に十分な強度が得られなく、熱処理保持温度
が５６０℃を超えると、バーニングが発生し易い。The aluminum alloy base plate having the above composition can be manufactured as follows. First, the ingots having these compositions are preferably homogenized and annealed at a temperature of 480 ° C. or higher and 560 ° C. or lower for 2 hours or more and 24 hours or less, and then hot rolled or cold rolled to a sheet having a predetermined plate thickness of 1 mm or less. Finish into a board. Next, this rolled plate is desirably heated to 480 ° C. or higher and 560 ° C. or higher at a heating rate of 100 ° C./min or higher.
Heat to a temperature below ℃, hold this temperature for 30 seconds or less,
Cool at a cooling rate of 300 ° C./min or more. When the temperature rising rate is less than 100 ° C./min, the temperature lowering rate is less than 300 ° C./min, and the heat treatment holding temperature is less than 480 ° C., sufficient strength cannot be obtained when used as a terminal, and the heat treatment holding temperature is 560 If it exceeds ℃, burning is likely to occur.
【００１５】この焼鈍板を所定寸法に切断した後、表面
にめっきを施す。このめっきは接触抵抗の低下のために
必須である。なお、このめっきはコイル形状及びシート
形状等のいずれの形状において処理してもよい。After cutting this annealed plate to a predetermined size, the surface is plated. This plating is essential for lowering contact resistance. The plating may be performed in any shape such as a coil shape and a sheet shape.
【００１６】めっき下地膜としてＮｉのめっき層を０．
５〜２μｍの厚さで形成する。これは電気めっき等によ
り形成できる。下地膜はＡｌとの電位差が小さい金属
で、処理条件によってはめっき後の折り曲げ加工に耐え
られるものであることが必要である。このため、めっき
下地膜として、Ｎｉめっきを選定する。このＮｉめっき
下地膜の厚さが０．５μｍ未満では、膜の均一性に欠
け、２μｍを超えると、加工性が低下する。このため、
下地膜の厚さは０．５〜２μｍとする。As a plating base film, a Ni plating layer of 0.
It is formed with a thickness of 5 to 2 μm. This can be formed by electroplating or the like. The base film is a metal having a small potential difference from Al, and it is necessary that it can withstand bending after plating depending on the processing conditions. Therefore, Ni plating is selected as the plating base film. If the thickness of the Ni-plated underlayer film is less than 0.5 μm, the film lacks uniformity, and if it exceeds 2 μm, the workability is deteriorated. For this reason,
The thickness of the base film is 0.5 to 2 μm.
【００１７】半田めっき層は端子としての接触抵抗の低
下のために行うもので、半田付けの可能な端子として必
要なものである。半田めっき層は１μｍ以上の厚さが必
要であり、５μｍを超える場合は、経済的に無駄であ
る。The solder plating layer is provided to reduce the contact resistance as a terminal and is necessary as a solderable terminal. The solder plating layer needs to have a thickness of 1 μm or more, and if it exceeds 5 μm, it is economically wasteful.
【００１８】[0018]
【実施例】以下、本発明の実施例について説明する。EXAMPLES Examples of the present invention will be described below.
【００１９】下記表１に示す組成のアルミニウム合金
を、５１０℃にて４時間均質化焼鈍した後に、熱間圧延
して厚さを３．５ｍｍとし、次に冷間圧延により厚さを
０．８ｍｍとした。そして、１５０℃／分の昇温速度で
加熱した後５１０℃に１０秒間保持することにより溶体
化焼鈍を行い、その後、４００℃／分の冷却速度にて冷
却した。この圧延板を切断した後に、１７０℃に２０時
間加熱する焼鈍を実施し、その後、機械的性質、加工性
及び導電率を評価した。これらの結果を下記表２に示
す。Aluminum alloys having the compositions shown in Table 1 below were homogenized and annealed at 510 ° C. for 4 hours, then hot-rolled to a thickness of 3.5 mm, and then cold-rolled to a thickness of 0. It was 8 mm. Then, the solution was annealed by heating it at a temperature rising rate of 150 ° C./min and then holding it at 510 ° C. for 10 seconds, and then cooling it at a cooling rate of 400 ° C./min. After cutting this rolled plate, annealing was carried out by heating at 170 ° C. for 20 hours, and then the mechanical properties, workability and conductivity were evaluated. The results are shown in Table 2 below.
【００２０】[0020]
【表１】 [Table 1]
【００２１】[0021]
【表２】 [Table 2]
【００２２】この表２から明らかなように、溶体化処理
のままの場合には、本実施例の端子材が強度及び加工性
の点で優れていることが明らかである。比較例１の端子
材でも加工後に焼鈍すれば、端子材として使用可能であ
るが、２００℃程度の高温での使用（大電流の通過時）
等に起因する強度低下（過時効現象）により構造体とし
て信頼性が低下する虞れがあり、好ましくない。比較例
２は強度が高いが、加工性が悪い。As is clear from Table 2, it is clear that the terminal material of this example is excellent in strength and workability when the solution treatment is left as it is. Even if the terminal material of Comparative Example 1 is annealed after processing, it can be used as a terminal material, but it is used at a high temperature of about 200 ° C. (when a large current passes through).
There is a risk that the strength of the structure will decrease due to a decrease in strength (overaging phenomenon) caused by the above, which is not preferable. Comparative Example 2 has high strength but poor workability.
【００２３】次に、表１の実施例欄記載の合金につき、
下記表３に示す２層メッキを行い、その耐食性、加工性
及びウィスカの有無を評価した。Next, regarding the alloys described in the Example column of Table 1,
Two-layer plating shown in Table 3 below was performed, and its corrosion resistance, workability, and the presence or absence of whiskers were evaluated.
【００２４】[0024]
【表３】 [Table 3]
【００２５】なお、耐食性は５重量％食塩水を３５℃の
温度で５時間噴霧し、腐食の進行程度を評価し、基板の
アルミニウム合金とメッキ膜が同程度に腐食溶解する場
合を○、基板の腐食の進行の方が早い場合を×とした。Corrosion resistance was evaluated by spraying 5 wt% saline solution at a temperature of 35 ° C. for 5 hours and evaluating the progress of corrosion. When the aluminum alloy of the substrate and the plating film were corroded and dissolved to the same degree, the substrate was The case where the corrosion progressed faster was marked with x.
【００２６】また、加工性は０．５ｍｍの肩Ｒで直角曲
げをして剥離しない場合を○、一部でも剥離する場合を
×とした。Further, the workability was evaluated as ◯ when it was bent at a right angle with a shoulder R of 0.5 mm and was not peeled, and when it was partially peeled, it was x.
【００２７】更に、ウィスカはめっき表面より成長する
ヒゲ状の結晶をいい、このウィスカが有る場合を×、な
い場合を○とした。ウィスカが存在すると、ショート等
のトラブルが発生し易い。Further, whiskers are whisker-like crystals that grow from the plating surface. When there are whiskers, they are marked with x, and when there are no whiskers, they are marked with ◯. When the whiskers are present, troubles such as a short circuit are likely to occur.
【００２８】メッキ工程は以下のとおりである。なお、
各処理時間には、水洗時間も含む。アルカリ洗浄剤ＵＡ
−６８（上村工業製商品名、以下同じ）の５０ｇ／リッ
トルを、５０℃に加熱したものに、アルミニウム合金素
板を５分間浸漬してクリーニングを施した。次いで、こ
の素板を、エッチング剤ＡＺ−１０２（商品名）の５０
ｇ／リットルを、６０℃に加熱したものに１分間浸漬し
てエッチングした。その後、１００ｇ／リットルのジス
マッターＡＺ−２０１（商品名）と８００ｍリットル／
リットルのＨＮＯ3との混合液（２０℃）中に４５秒間
浸漬して酸洗（ジスマット）し、更にＡＺ−４０１の原
液（２５℃）に３０秒間浸漬して亜鉛置換した後、メッ
キした。その後、６０ｇ／リットルの第３リン酸ソーダ
液を６０℃に加熱したものに３０秒間浸漬した。The plating process is as follows. In addition,
Each treatment time includes a washing time. Alkaline cleaner UA
50 g / liter of -68 (trade name, manufactured by Uemura Kogyo Co., Ltd., hereinafter) was heated to 50 ° C., and the aluminum alloy base plate was immersed for 5 minutes for cleaning. Next, this blank plate is treated with an etching agent AZ-102 (trade name) of 50
The g / l was immersed in a material heated to 60 ° C. for 1 minute for etching. After that, 100 g / liter Dissatter AZ-201 (trade name) and 800 ml / liter
It was dipped in a mixed solution (20 ° C.) of HNO 3 for 45 seconds for pickling (dismutting), and further dipped for 30 seconds in a stock solution of AZ-401 (25 ° C.) for zinc substitution, and then plated. Then, 60 g / liter of sodium phosphate tribasic solution was immersed in a solution heated to 60 ° C. for 30 seconds.
【００２９】比較例３でのＣｕめっきは、カリ浴（金属
銅；３５、Ｆ・ＫＣＮ；１０、ＫＯＨ；４０、Ｋ2Ｃ
Ｏ3；１５。いずれも単位はｇ／リットル）により４０
℃の温度で１Ａ／ｄｍ2の条件で形成した。スズメッキ
は硫酸浴（硫酸第１スズ６０ｇ／リットル、硫酸１００
ｇ／リットル、アサヒスタナーＳＢ−Ｒ（商品名）３０
ｍリットル／リットル｝により、２５℃にて２Ａ／ｄｍ
2の条件で形成した。両メッキ間は５重量％硫酸にて処
理した。本実施例でのＮｉめっきはスルニックＣＬ−Ｍ
浴（商品名；Ｎｉ濃度ｇ／リットル）にて、５５℃、１
Ａ／ｄｍ2の条件で形成し、半田めっきは半田浴｛リー
ドＳコンク（すず塩）、リードＰコンク（鉛塩）、リー
ドアシッド（有機酸）等により建浴、これらはいずれも
商品名｝にて、２５℃、２．５Ａ／ｄｍ2の条件で形成
した。Cu plating in Comparative Example 3 was carried out using a potassium bath (metal copper; 35, F · KCN; 10, KOH; 40, K 2 C).
O 3 ; 15. In each case, the unit is g / liter) 40
It was formed under the condition of 1 A / dm 2 at a temperature of ° C. Tin plating is performed with sulfuric acid bath (stannous sulfate 60 g / l, sulfuric acid 100
g / liter, Asahi Stanner SB-R (trade name) 30
2 A / dm at 25 ° C depending on m liter / liter}
It was formed under the condition of 2 . Between both platings, treatment was performed with 5% by weight sulfuric acid. The Ni plating in this embodiment is Sulnik CL-M.
55 ° C in a bath (brand name; Ni concentration g / liter), 1
Solder bath is formed under the condition of A / dm 2, and a solder bath {lead S conc (tin salt), lead P conc (lead salt), lead acid (organic acid), etc. is a construction bath, all of which are trade names} At 25 ° C. and 2.5 A / dm 2 .
【００３０】比較例２でのＮｉめっきはワット浴にて５
５℃、２Ａ／ｄｍ2にて形成し、半田めっきは上記と同
様とした。Ni plating in Comparative Example 2 was performed with a Watt bath at 5
It was formed at 5 ° C. and 2 A / dm 2 , and the solder plating was the same as above.
【００３１】その結果、表３から明らかなように、本実
施例は、耐食性及び加工性が優れており、ウィスカが存
在しないものであった。これに対し、比較例３は耐食性
が悪く、ウィスカも存在した。また、比較例４は加工性
が悪いものであった。As a result, as is clear from Table 3, in this example, the corrosion resistance and workability were excellent, and no whiskers existed. On the other hand, Comparative Example 3 had poor corrosion resistance and had whiskers. Further, Comparative Example 4 had poor workability.
【００３２】[0032]
【発明の効果】本発明によれば、強度及び曲げ加工性が
優れていると共に、導電率も端子として十分に高く、更
に接触抵抗が低くて発熱に対する耐性も優れたアルミニ
ウム合金端子を得ることができる。According to the present invention, it is possible to obtain an aluminum alloy terminal which is excellent in strength and bending workability, has a sufficiently high conductivity as a terminal, and has a low contact resistance and an excellent resistance to heat generation. it can.
Claims (1)
０．４〜１．２重量％を含有し、不純物としてのＦｅを
０．６重量％以下、Ｃｕを０．４重量％以下に規制し、
残部がＡｌ及び各０．１重量％以下の不可避的不純物か
らなり、板厚が１．０ｍｍ以下であるアルミニウム合金
素板と、この素板上に０．５〜２μｍの厚さで形成され
たＮｉめっき膜からなる下地膜と、この下地膜上に形成
され厚さが１〜５μｍの半田めっき層とを有することを
特徴とする端子用アルミニウム合金板。1. Mg-0.6-1.4 wt% and Si;
0.4 to 1.2 wt% is contained, Fe as impurities is regulated to 0.6 wt% or less, and Cu is regulated to 0.4 wt% or less,
The balance was made of Al and inevitable impurities of 0.1% by weight or less, and an aluminum alloy base plate having a plate thickness of 1.0 mm or less, and a thickness of 0.5 to 2 μm formed on the base plate. An aluminum alloy plate for a terminal, comprising: a base film made of a Ni plating film; and a solder plating layer having a thickness of 1 to 5 μm formed on the base film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27483891A JPH0578889A (en) | 1991-09-25 | 1991-09-25 | Aluminum alloy sheet for terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27483891A JPH0578889A (en) | 1991-09-25 | 1991-09-25 | Aluminum alloy sheet for terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0578889A true JPH0578889A (en) | 1993-03-30 |
Family
ID=17547293
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27483891A Pending JPH0578889A (en) | 1991-09-25 | 1991-09-25 | Aluminum alloy sheet for terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0578889A (en) |
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|---|---|---|---|---|
| EP0984499A1 (en) * | 1998-09-02 | 2000-03-08 | SANYO ELECTRIC Co., Ltd. | Lithium secondary cell |
| US6521374B1 (en) | 1998-09-02 | 2003-02-18 | Sanyo Electric Co., Ltd. | Lithium secondary cell |
| JP2006206945A (en) * | 2005-01-27 | 2006-08-10 | Toyo Kohan Co Ltd | SURFACE-TREATED Al SHEET HAVING EXCELLENT SOLDERABILITY WITH LOW MELTING POINT |
| CN102416725A (en) * | 2010-09-24 | 2012-04-18 | 神钢力得米克株式会社 | Electronic part material |
| JP2012087411A (en) * | 2010-09-24 | 2012-05-10 | Shinko Leadmikk Kk | Electronic component material |
| JP2015014027A (en) * | 2013-07-05 | 2015-01-22 | 三菱アルミニウム株式会社 | Aluminum alloy sheet for electrification part and production method thereof |
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-
1991
- 1991-09-25 JP JP27483891A patent/JPH0578889A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0984499A1 (en) * | 1998-09-02 | 2000-03-08 | SANYO ELECTRIC Co., Ltd. | Lithium secondary cell |
| EP1205988A1 (en) * | 1998-09-02 | 2002-05-15 | SANYO ELECTRIC Co., Ltd. | Lithium secondary cell |
| US6521374B1 (en) | 1998-09-02 | 2003-02-18 | Sanyo Electric Co., Ltd. | Lithium secondary cell |
| JP2006206945A (en) * | 2005-01-27 | 2006-08-10 | Toyo Kohan Co Ltd | SURFACE-TREATED Al SHEET HAVING EXCELLENT SOLDERABILITY WITH LOW MELTING POINT |
| CN102416725A (en) * | 2010-09-24 | 2012-04-18 | 神钢力得米克株式会社 | Electronic part material |
| JP2012087411A (en) * | 2010-09-24 | 2012-05-10 | Shinko Leadmikk Kk | Electronic component material |
| JP2015014027A (en) * | 2013-07-05 | 2015-01-22 | 三菱アルミニウム株式会社 | Aluminum alloy sheet for electrification part and production method thereof |
| JP2015034330A (en) * | 2013-08-09 | 2015-02-19 | 株式会社神戸製鋼所 | Aluminum alloy sheet for electric connection part and method for producing the same |
| WO2015133588A1 (en) * | 2014-03-05 | 2015-09-11 | 古河電気工業株式会社 | Terminal and method for manufacturing terminal |
| CN106030918A (en) * | 2014-03-05 | 2016-10-12 | 古河电气工业株式会社 | Terminal and method for manufacturing terminal |
| EP3116069A4 (en) * | 2014-03-05 | 2017-08-30 | Furukawa Electric Co. Ltd. | Terminal and method of manufacturing a terminal |
| US10516245B2 (en) | 2014-03-05 | 2019-12-24 | Furukawa Electric Co., Ltd. | Terminal and method of manufacturing a terminal |
| JPWO2015133588A1 (en) * | 2014-03-05 | 2017-04-06 | 古河電気工業株式会社 | Terminal and terminal manufacturing method |
| JP6025078B1 (en) * | 2015-06-30 | 2016-11-16 | 住友電気工業株式会社 | Lead conductor and power storage device |
| CN107636863A (en) * | 2015-06-30 | 2018-01-26 | 住友电气工业株式会社 | Leading-in conductor and electrical storage device |
| WO2017002421A1 (en) * | 2015-06-30 | 2017-01-05 | 住友電気工業株式会社 | Lead conductor and power storage device |
| CN106868561A (en) * | 2017-03-03 | 2017-06-20 | 福建省创越拉链科技有限公司 | A kind of aluminium section bar slide fastener preparation method with coloring non-ferrous metal |
| CN107675047A (en) * | 2017-10-12 | 2018-02-09 | 广东和胜工业铝材股份有限公司 | Al Mg Si Cu alloys and preparation method thereof |
| CN107675047B (en) * | 2017-10-12 | 2019-07-02 | 广东和胜工业铝材股份有限公司 | Al-Mg-Si-Cu alloy and preparation method thereof |
| CN108866401A (en) * | 2018-07-16 | 2018-11-23 | 东北轻合金有限责任公司 | A kind of manufacturing method of the aluminium alloy strips of automobile decoration |
| CN112322879A (en) * | 2020-10-09 | 2021-02-05 | 美图（福建）铝业有限公司 | Manufacturing method and die for high-strength large-section aluminum alloy template profile |
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