JPH0575033B2 - - Google Patents
Info
- Publication number
- JPH0575033B2 JPH0575033B2 JP21863086A JP21863086A JPH0575033B2 JP H0575033 B2 JPH0575033 B2 JP H0575033B2 JP 21863086 A JP21863086 A JP 21863086A JP 21863086 A JP21863086 A JP 21863086A JP H0575033 B2 JPH0575033 B2 JP H0575033B2
- Authority
- JP
- Japan
- Prior art keywords
- triazine
- epoxy resin
- diamino
- weight
- isocyanuric acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 claims description 59
- 239000003822 epoxy resin Substances 0.000 claims description 30
- 229920000647 polyepoxide Polymers 0.000 claims description 30
- -1 imidazole compound Chemical class 0.000 claims description 22
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 14
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 claims description 13
- 239000000203 mixture Substances 0.000 claims description 10
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 claims description 10
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 10
- 229920003986 novolac Polymers 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 7
- 239000000945 filler Substances 0.000 claims description 6
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims description 5
- ZXLYUNPVVODNRE-UHFFFAOYSA-N 6-ethenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=C)=N1 ZXLYUNPVVODNRE-UHFFFAOYSA-N 0.000 claims description 2
- VSJSLPXIIKNTDZ-UHFFFAOYSA-N benzene-1,3-diol;2-methylphenol Chemical compound CC1=CC=CC=C1O.OC1=CC=CC(O)=C1 VSJSLPXIIKNTDZ-UHFFFAOYSA-N 0.000 claims description 2
- 150000007973 cyanuric acids Chemical class 0.000 claims description 2
- VZXTWGWHSMCWGA-UHFFFAOYSA-N 1,3,5-triazine-2,4-diamine Chemical compound NC1=NC=NC(N)=N1 VZXTWGWHSMCWGA-UHFFFAOYSA-N 0.000 claims 1
- 238000006116 polymerization reaction Methods 0.000 claims 1
- 239000000976 ink Substances 0.000 description 21
- 239000011248 coating agent Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- 238000001723 curing Methods 0.000 description 9
- 239000000126 substance Substances 0.000 description 8
- 238000013508 migration Methods 0.000 description 7
- 230000005012 migration Effects 0.000 description 7
- 229920005989 resin Polymers 0.000 description 7
- 239000011347 resin Substances 0.000 description 7
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 6
- 238000002845 discoloration Methods 0.000 description 6
- 239000003063 flame retardant Substances 0.000 description 6
- 150000004820 halides Chemical class 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 239000003960 organic solvent Substances 0.000 description 5
- 239000003973 paint Substances 0.000 description 5
- 229940123208 Biguanide Drugs 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 150000002460 imidazoles Chemical class 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 238000007650 screen-printing Methods 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000002253 acid Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- ULKLGIFJWFIQFF-UHFFFAOYSA-N 5K8XI641G3 Chemical compound CCC1=NC=C(C)N1 ULKLGIFJWFIQFF-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000002829 reductive effect Effects 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- RUEBPOOTFCZRBC-UHFFFAOYSA-N (5-methyl-2-phenyl-1h-imidazol-4-yl)methanol Chemical compound OCC1=C(C)NC(C=2C=CC=CC=2)=N1 RUEBPOOTFCZRBC-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- HHOJVZAEHZGDRB-UHFFFAOYSA-N 2-(4,6-diamino-1,3,5-triazin-2-yl)ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCC1=NC(N)=NC(N)=N1 HHOJVZAEHZGDRB-UHFFFAOYSA-N 0.000 description 1
- ZQNVWAQNCHHONO-UHFFFAOYSA-N 2-methyl-1-phenylimidazole Chemical compound CC1=NC=CN1C1=CC=CC=C1 ZQNVWAQNCHHONO-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- UIDDPPKZYZTEGS-UHFFFAOYSA-N 3-(2-ethyl-4-methylimidazol-1-yl)propanenitrile Chemical compound CCC1=NC(C)=CN1CCC#N UIDDPPKZYZTEGS-UHFFFAOYSA-N 0.000 description 1
- SESYNEDUKZDRJL-UHFFFAOYSA-N 3-(2-methylimidazol-1-yl)propanenitrile Chemical compound CC1=NC=CN1CCC#N SESYNEDUKZDRJL-UHFFFAOYSA-N 0.000 description 1
- QEYVCBUJGVFCST-UHFFFAOYSA-N 4-(4,6-diamino-1,3,5-triazin-2-yl)benzonitrile Chemical compound NC1=NC(N)=NC(C=2C=CC(=CC=2)C#N)=N1 QEYVCBUJGVFCST-UHFFFAOYSA-N 0.000 description 1
- MRQVAPFIKUBIFK-UHFFFAOYSA-N 6-(2-anilinoethyl)-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(CCNC=2C=CC=CC=2)=N1 MRQVAPFIKUBIFK-UHFFFAOYSA-N 0.000 description 1
- QZVXBDKYTZDVNN-UHFFFAOYSA-N 6-(2-butoxyethyl)-1,3,5-triazine-2,4-diamine Chemical compound CCCCOCCC1=NC(N)=NC(N)=N1 QZVXBDKYTZDVNN-UHFFFAOYSA-N 0.000 description 1
- HNNISBWFFMLWQV-UHFFFAOYSA-N 6-(2-methoxyethyl)-1,3,5-triazine-2,4-diamine Chemical compound COCCC1=NC(N)=NC(N)=N1 HNNISBWFFMLWQV-UHFFFAOYSA-N 0.000 description 1
- YDKJKJNLRMJEIJ-UHFFFAOYSA-N 6-(2-octadecoxyethyl)-1,3,5-triazine-2,4-diamine Chemical compound CCCCCCCCCCCCCCCCCCOCCC1=NC(N)=NC(N)=N1 YDKJKJNLRMJEIJ-UHFFFAOYSA-N 0.000 description 1
- JBMULNXONZBYEI-UHFFFAOYSA-N 6-(2-propan-2-yloxyethyl)-1,3,5-triazine-2,4-diamine Chemical compound CC(C)OCCC1=NC(N)=NC(N)=N1 JBMULNXONZBYEI-UHFFFAOYSA-N 0.000 description 1
- ODANSDVVRAMNRC-UHFFFAOYSA-N 6-(2-propoxyethyl)-1,3,5-triazine-2,4-diamine Chemical compound CCCOCCC1=NC(N)=NC(N)=N1 ODANSDVVRAMNRC-UHFFFAOYSA-N 0.000 description 1
- CMLCJCVZSICAQZ-UHFFFAOYSA-N 6-[2-(3-methylanilino)ethyl]-1,3,5-triazine-2,4-diamine Chemical compound CC1=CC=CC(NCCC=2N=C(N)N=C(N)N=2)=C1 CMLCJCVZSICAQZ-UHFFFAOYSA-N 0.000 description 1
- BLFOHEWODUWQKH-UHFFFAOYSA-N 6-[2-(4-methylanilino)ethyl]-1,3,5-triazine-2,4-diamine Chemical compound C1=CC(C)=CC=C1NCCC1=NC(N)=NC(N)=N1 BLFOHEWODUWQKH-UHFFFAOYSA-N 0.000 description 1
- DAXJCJLWSILRDU-UHFFFAOYSA-N 6-[2-(benzylamino)ethyl]-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(CCNCC=2C=CC=CC=2)=N1 DAXJCJLWSILRDU-UHFFFAOYSA-N 0.000 description 1
- PBXMQAANKCCZSW-UHFFFAOYSA-N 6-[2-(naphthalen-2-ylamino)ethyl]-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(CCNC=2C=C3C=CC=CC3=CC=2)=N1 PBXMQAANKCCZSW-UHFFFAOYSA-N 0.000 description 1
- FHMCVCWLLXILJQ-UHFFFAOYSA-N 6-[2-(propylamino)ethyl]-1,3,5-triazine-2,4-diamine Chemical compound CCCNCCC1=NC(N)=NC(N)=N1 FHMCVCWLLXILJQ-UHFFFAOYSA-N 0.000 description 1
- UZHQVVTTWPBVHQ-UHFFFAOYSA-N 6-ethenyl-1,3,5-triazine-2,4-diamine;1,3,5-triazinane-2,4,6-trione Chemical compound O=C1NC(=O)NC(=O)N1.NC1=NC(N)=NC(C=C)=N1 UZHQVVTTWPBVHQ-UHFFFAOYSA-N 0.000 description 1
- YZVJFFKAKLWXOE-UHFFFAOYSA-N 6-heptadecyl-1,3,5-triazine-2,4-diamine Chemical compound CCCCCCCCCCCCCCCCCC1=NC(N)=NC(N)=N1 YZVJFFKAKLWXOE-UHFFFAOYSA-N 0.000 description 1
- NGYGUYRBWLUDRP-UHFFFAOYSA-N 6-propyl-1,3,5-triazine-2,4-diamine Chemical compound CCCC1=NC(N)=NC(N)=N1 NGYGUYRBWLUDRP-UHFFFAOYSA-N 0.000 description 1
- LCFVJGUPQDGYKZ-UHFFFAOYSA-N Bisphenol A diglycidyl ether Chemical compound C=1C=C(OCC2OC2)C=CC=1C(C)(C)C(C=C1)=CC=C1OCC1CO1 LCFVJGUPQDGYKZ-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- UUQQGGWZVKUCBD-UHFFFAOYSA-N [4-(hydroxymethyl)-2-phenyl-1h-imidazol-5-yl]methanol Chemical compound N1C(CO)=C(CO)N=C1C1=CC=CC=C1 UUQQGGWZVKUCBD-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- XUCHXOAWJMEFLF-UHFFFAOYSA-N bisphenol F diglycidyl ether Chemical compound C1OC1COC(C=C1)=CC=C1CC(C=C1)=CC=C1OCC1CO1 XUCHXOAWJMEFLF-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 238000004649 discoloration prevention Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000001023 inorganic pigment Substances 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 239000012860 organic pigment Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000009974 thixotropic effect Effects 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 230000002087 whitening effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
- H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
Description
産業上の利用分野
本発明は、エポキシ樹脂レジストインキ組成物
に関するものであり、この組成物は電気絶縁性、
耐湿性、耐熱性、密着性、耐溶剤性、耐薬品性等
に優れた硬化塗膜を与え、また銅、銀回路の電気
的腐蝕による変色とマイグレーシヨンを抑制する
優れた硬化塗膜を与えるので、プリント配線板の
製造用のプリント配線板用レジストインキとして
有用である。
従来の技術
紙−フエノール、紙−エポキシあるいはガラス
−エポキシ等を基材とする銅張り積層板のエツチ
ングにより所望の回路を形成したプリント配線
板、またこれらの基材よりなる絶縁基材上に、フ
エノール樹脂あるいはエポキシ樹脂等をバインダ
ーとする銀系、銅系あるいはカーボン系等の導体
ペーストで所望の回路をスクリーン印刷したプリ
ント配線板、あるいはこれらの基材上に化学的あ
るいは電気的にメツキにより所望の回路を形成し
たプリント配線板において、各回路は通常プリン
ト配線板上に露出しているため、環境雰囲気中の
湿気等により腐蝕したり、あるいは外力により剥
離あるいは断線したりしがちである。
このようなトラブルを防止し、同時に回路の信
頼性を向上させる方法として、スクリーン印刷あ
るいはロールコート等により永久レジストと称す
る保護膜で回路を保護する手段がとられている。
前記の永久レジストには、電気絶縁性、耐湿
性、耐熱性、密着性、耐溶剤性、耐薬品性等のす
ぐれた各特性が要求される。
さらにプリント配線板の回路は微細かつ複雑で
ある場合が多く、ハンダ付けあるいはメツキ付け
を行う際に、回路間の短絡が起こる惧れがあるの
で、ハンダあるいはメツキ付けの必要な部分以外
にレジストインキをスクリーン印刷により、塗膜
を形成する方法が行われている。
この場合のレジストインキには、スクリーン印
刷に適したインキの粘度と糸曳き性、さらに塗布
されたインキが流動しないような適度のチクソト
ロピツク性等が必要である。
このようなレジストインキとしては、エポキシ
樹脂系、エポキシ−メラミン樹脂系、フエノール
樹脂系等の熱硬化型樹脂、あるいは紫外線硬化型
樹脂が知られている。
発明が解決しようとする問題点
信頼性が高く、さらに造膜性、作業性とのバラ
ンスも良いとされているものが熱硬化型のエポキ
シ樹脂系レジストインキである。
この種のレジストインキは、一液型、二液型を
問わず、硬化剤あるいは硬化促進剤として、イミ
ダゾール化合物を含むものが多い。
しかし、このエポキシ樹脂−イミダゾール化合
物系レジストインキには、
(1) ハロゲン化物で難燃比されたプリント配線板
上では、レジストインキの硬化性が悪くなる。
（この原因はハロゲン化物が、イミダゾール化
合物のエポキシ樹脂に対する反応性を低下させ
る為であると推測されている）
(2) ハンダ付けあるいはメツキ付けを必要とする
導体部分、例えばランド、パツド、接続端子部
分等に毛細管現象でレジストインキ中の樹脂分
が滲み出し、ハンダあるいはメツキ付けを阻害
する所謂ブリードアウトと呼ばれる現象を起こ
す。
(3) 基材中にエポキシ樹脂等の液状成分がしみ込
むことにより塗膜の外観不良さらには塗膜が白
化し、塗膜性能が著しく低下した状態となる所
謂チヨーキング現象を起こす等の欠点があり、
その防止策として、前記(1)の場合には塗膜の膜
厚をより厚くしたり、重ね塗りをしたりあるい
はより高温でより長時間の硬化を行う等の措置
が講じられていた。しかしながらこの方法によ
れば、スクリーンパターンの再現精度が悪くな
つたり、基材に対して熱歪みがかかりすぎ、基
材のソリがより大きくなる等の欠陥があつた。
前記(2)と(3)の場合には、有機溶剤に溶解させた
固形エポキシ樹脂を単独あるいは液状エポキシ樹
脂と併用することにより、ブリードアウトやチヨ
ーキング現象を回避する措置がとられている。し
かし、かかる措置をとつたとしても、前記(1)に記
載の欠点を解消し難いものであつた。
さらに最近のプリント配線板は小形化、高密度
化が進み、そのため高温・高湿度の条件下におい
て直流電圧を印加した場合に、回路の変色及びマ
イグレーシヨンの発生が大きな問題となつてい
る。
変色あるいはマイグレーシヨン抑制性能を有す
る保護膜用樹脂には、トリアジンあるいはビスマ
レイミド・トリアジン樹脂以外に有用なものはほ
とんど見当たらない。
しかし、これらの樹脂を用いた塗料には、加熱
硬化条件（温度、時間）、可使時間あるいは造膜
性の点で問題があり満足できない。
問題点を解決するための手段
本発明者等は、このような事情に鑑み鋭意研究
を重ねた結果、イミダゾール化合物を用いるエポ
キシ樹脂系レジストインキ組成物において、レゾ
ルシン・オルソクレゾールノボラツク共重合体型
多官能エポキシ樹脂を配合することにより、ハロ
ゲン化物で難燃化された基板に対しても非難燃化
基板と同様の印刷条件あるいは硬化条件の設定が
可能であり、ブリードアウト、チヨーキングの発
生もなく、造膜性にも優れ、硬化速度も早くな
り、ガラス転移温度も高くなり、さらには回路の
変色やマイグレーシヨンも抑制しうることを見い
出すに至つた。
すなわち、本発明は、(a)レゾルシン・オルソク
レゾールノボラツク共重合体型多官能エポキシ樹
脂と(b)液状多価フエノールのポリグリシジルエー
テルを重量比として30〜100：70〜０の割合で含
むエポキシ樹脂100重量部、(c)イミダゾール化合
物３〜15重量部及び(d)適量の充填剤を成分として
均一に分散して得られるエポキシ樹脂レジストイ
ンキ組成物及び(a)レゾルシン・オルソクレゾール
ノボラツク共重合体型多官能エポキシ樹脂と(b)液
状多価フエノールのポリグリシジルエーテルを重
量比として30〜100：70〜０の割合で含むエポキ
シ樹脂100重量部、(c)イミダゾール化合物３〜15
重量部、(d)２，４−ジアミノ−６−ビニル−ｓ−
トリアジン・イソシアヌル酸付加物あるいは２−
置換−４，６−ジアミノ−ｓ−トリアジン・イソ
シアヌル酸付加物のうちいずれか１種又は２種以
上からなるトリアジン化合物３〜20重量部及び(e)
適量の充填剤を成分として均一に分散して得られ
るエポキシ樹脂レジストインキ組成物である。
本発明の実施に適するレゾルシン・オルソクレ
ゾールノボラツク共重合体型多官能エポキシ樹脂
は、式で示され、エポキシ当量125〜190、融点
70〜100℃の範囲のものが好ましい。
式
INDUSTRIAL APPLICATION FIELD The present invention relates to an epoxy resin resist ink composition, which has electrical insulation properties,
Provides a cured coating film with excellent moisture resistance, heat resistance, adhesion, solvent resistance, chemical resistance, etc., and also provides an excellent cured coating film that suppresses discoloration and migration caused by electrical corrosion of copper and silver circuits. Therefore, it is useful as a printed wiring board resist ink for manufacturing printed wiring boards. PRIOR ART Printed wiring boards in which a desired circuit is formed by etching a copper-clad laminate based on paper-phenol, paper-epoxy, glass-epoxy, etc., or on an insulating base material made of these base materials. Printed wiring boards are screen-printed with a desired circuit using a silver-based, copper-based, or carbon-based conductive paste with a binder such as phenol resin or epoxy resin, or the desired circuit is printed on these substrates by chemical or electrical plating. In a printed wiring board on which circuits are formed, each circuit is usually exposed on the printed wiring board, and therefore tends to be corroded by moisture in the environment, or to peel or break due to external force. In order to prevent such troubles and improve the reliability of circuits at the same time, methods have been taken to protect circuits with a protective film called permanent resist by screen printing, roll coating, or the like. The above permanent resist is required to have excellent properties such as electrical insulation, moisture resistance, heat resistance, adhesion, solvent resistance, and chemical resistance. Furthermore, the circuits on printed wiring boards are often minute and complex, and there is a risk of short circuits between circuits when soldering or plating. A method of forming a coating film is by screen printing. The resist ink in this case needs to have an ink viscosity and stringiness suitable for screen printing, as well as appropriate thixotropic properties so that the applied ink does not flow. As such resist inks, thermosetting resins such as epoxy resins, epoxy-melamine resins, and phenol resins, and ultraviolet curable resins are known. Problems to be Solved by the Invention Thermosetting epoxy resin resist inks are said to be highly reliable and have a good balance between film-forming properties and workability. This type of resist ink, regardless of whether it is a one-component type or a two-component type, often contains an imidazole compound as a curing agent or curing accelerator. However, this epoxy resin-imidazole compound-based resist ink has the following problems: (1) The curability of the resist ink deteriorates on a printed wiring board that has been flame retardant with a halide.
(The cause of this is presumed to be that halides reduce the reactivity of imidazole compounds to epoxy resins.) (2) Conductor parts that require soldering or plating, such as lands, pads, and connection terminals. The resin in the resist ink oozes out through capillary action, causing a so-called bleed-out phenomenon that inhibits soldering or plating. (3) Liquid components such as epoxy resins seep into the base material, resulting in poor appearance of the paint film, as well as whitening of the paint film, resulting in a so-called yoking phenomenon, in which the performance of the paint film is significantly reduced. ,
To prevent this, in the case of (1) above, measures have been taken such as increasing the thickness of the coating film, applying multiple coats, or curing at a higher temperature for a longer time. However, according to this method, there were defects such as poor reproduction accuracy of the screen pattern, excessive thermal distortion of the base material, and increased warpage of the base material. In the cases of (2) and (3) above, measures are taken to avoid the bleed-out and choke phenomenon by using a solid epoxy resin dissolved in an organic solvent alone or in combination with a liquid epoxy resin. However, even if such measures were taken, it was difficult to eliminate the drawbacks described in (1) above. Furthermore, recent printed wiring boards have become smaller and more dense, and as a result, discoloration and migration of circuits have become serious problems when a DC voltage is applied under conditions of high temperature and high humidity. There are almost no useful protective film resins other than triazine or bismaleimide triazine resins that have the ability to suppress discoloration or migration. However, paints using these resins are unsatisfactory due to problems in heat curing conditions (temperature, time), pot life, and film-forming properties. Means for Solving the Problems In view of the above circumstances, the present inventors have conducted intensive research and have developed a resorcinol/orthocresol novolak copolymer polyester in an epoxy resin resist ink composition using an imidazole compound. By blending a functional epoxy resin, it is possible to set the same printing or curing conditions for flame-retardant substrates with halides as for flame-retardant substrates, and there is no bleed-out or yoking. They have discovered that it has excellent film-forming properties, has a faster curing speed, has a higher glass transition temperature, and can also suppress discoloration and migration of circuits. That is, the present invention provides an epoxy resin containing (a) a resorcinol/orthocresol novolac copolymer type polyfunctional epoxy resin and (b) a polyglycidyl ether of liquid polyhydric phenol in a weight ratio of 30 to 100:70 to 0. An epoxy resin resist ink composition obtained by uniformly dispersing 100 parts by weight of a resin, (c) 3 to 15 parts by weight of an imidazole compound, and (d) an appropriate amount of filler, and (a) a resorcinol/orthocresol novolak composition. 100 parts by weight of an epoxy resin containing a polymer type polyfunctional epoxy resin and (b) a polyglycidyl ether of liquid polyhydric phenol in a weight ratio of 30 to 100:70 to 0, (c) an imidazole compound of 3 to 15
Parts by weight, (d) 2,4-diamino-6-vinyl-s-
Triazine/isocyanuric acid adduct or 2-
3 to 20 parts by weight of a triazine compound consisting of one or more of substituted-4,6-diamino-s-triazine/isocyanuric acid adducts; and (e)
This is an epoxy resin resist ink composition obtained by uniformly dispersing an appropriate amount of filler as a component. The resorcinol/orthocresol novolac copolymer type multifunctional epoxy resin suitable for carrying out the present invention is represented by the formula, has an epoxy equivalent of 125 to 190, a melting point of
A temperature range of 70 to 100°C is preferred. formula
【化】
本発明の実施に適する代表的な液状多価フエノ
ールのポリグリシジルエーテルは、例えばビスフ
エノールＡジクリシジルエーテル、ビスフエノー
ルＦジグリシジルエーテル、あるいはポリエステ
ル・エーテルエラストマー含有ビスフエノールＡ
ジグリシジルエーテル等である。
エポキシ樹脂におけるレゾルシン・オルソクレ
ゾールノボラツク共重合体型多官能エポキシ樹脂
の占める割合が30％より少ない場合には、ハロゲ
ン化物で難燃化された基板上での硬化性が悪く且
つブリードアウト及びチヨーキングの抑制作用が
低下する。
本発明における液状多価フエノールのポリグリ
シジルエーテルの添加は必須要件でないけれど
も、これを併用した場合には、インキ中の有機溶
剤がスクリーン版上で蒸発して生じるインクの目
詰りを防ぎ、また加熱硬化後の塗膜中に残存する
有機溶剤による電気的信頼性及び耐湿性能等の低
下をなからしめ、且つ有機溶剤の蒸発によつて生
じる塗膜厚みの変化を低減させることができる。
本発明の実施に適するイミダゾール化合物は、
２−メチル−イミダゾール、２−エチル−４−メ
チル−イミダゾール、１−フエニル−２−メチル
−イミダゾール、２，４−ジアミノ−６−｛2′−
メチルイミダゾリル(1)′｝エチル−ｓ−トリアジ
ン、２，４−ジアミノ−６−｛2′−メチルイミダ
ゾリル−(1)′｝エチル−ｓ−トリアジン・イソシ
アヌル酸付加物、２−フエニル−４，５−ジヒド
ロキシルメチルイミダゾール、２−フエニル−４
−メチル−５−ヒドロキシルメチルイミダゾー
ル、１−シアノエチル−２−メチルイミダゾー
ル、１−シアノエチル−２−エチル−４−メチル
イミダゾール、２−エチル−４−メチル−イミダ
ゾール・トリメリツト酸付加物等である。
これらイミダゾール化合物の添加量は、エポキ
シ樹脂100重量部に対して３〜15重量部とすべき
であり、この範囲を下廻る硬化が遅く充分な架橋
構造をもつた塗膜が得られず、またこの範囲より
多いと未反応のイミダゾール化合物が塗膜中に残
存し、電気的性能、耐湿性、耐薬品性等が低下す
る。
また本発明の実施においては、共硬化剤として
ジシアンジアミド、ｐ−エトキシフエニルビグア
ニド、１−０−トリルビグアニドを併用すること
によつて、被着体との密着性や耐薬品性をさらに
改善することができる。ジシアンジアミドはエポ
キシ樹脂100重量部に対して0.5〜３重量部、ｐ−
エトキシフエニルビグアニド又は１−０−トリル
ビグアニドは３〜20重量部の範囲が好ましい。
本発明に適する充填剤は、炭酸カルシウム、硫
酸バリウム、マイカ粉、タルク粉、シリカ、アル
ミナ等の微粉末である。
またこれらの充填剤の２種以上を組み合わせて
使用することもでき、印刷適正等を考慮して、配
合量をエポキシ樹脂100重量部に対して30〜120重
量部の範囲で自由に調整すべきである。
本発明に適する銅および銀回路の変色防止及び
マイグレーシヨン抑制作用を有するトリアジン化
合物としては、特願昭59−13122号明細書に記載
した下式で示される２，４−ジアミノ−６−ビニ
ル−ｓ−トリアジン・イソシアヌル酸付加物、
式 Typical liquid polyglycidyl ethers of polyhydric phenols suitable for carrying out the present invention include, for example, bisphenol A dicrycidyl ether, bisphenol F diglycidyl ether, or bisphenol A containing polyester ether elastomer.
diglycidyl ether, etc. If the proportion of the resorcinol-orthocresol novolak copolymer type polyfunctional epoxy resin in the epoxy resin is less than 30%, the curability on a flame-retardant substrate with a halide will be poor and bleed-out and yoking will occur. Decreased inhibitory effect. Although the addition of polyglycidyl ether of liquid polyhydric phenol in the present invention is not an essential requirement, when it is used together, it prevents clogging of the ink caused by evaporation of the organic solvent in the ink on the screen plate, and also prevents clogging of the ink caused by heating. It is possible to prevent deterioration in electrical reliability, moisture resistance, etc. due to organic solvent remaining in the coating film after curing, and to reduce changes in coating film thickness caused by evaporation of the organic solvent. Imidazole compounds suitable for the practice of this invention are:
2-Methyl-imidazole, 2-ethyl-4-methyl-imidazole, 1-phenyl-2-methyl-imidazole, 2,4-diamino-6-{2'-
Methylimidazolyl(1)'}ethyl-s-triazine, 2,4-diamino-6-{2'-methylimidazolyl-(1)'}ethyl-s-triazine isocyanuric acid adduct, 2-phenyl-4, 5-dihydroxylmethylimidazole, 2-phenyl-4
-methyl-5-hydroxylmethylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 2-ethyl-4-methyl-imidazole trimellitic acid adduct, and the like. The amount of these imidazole compounds added should be 3 to 15 parts by weight per 100 parts by weight of the epoxy resin; below this range curing is slow and a coating film with a sufficient crosslinked structure cannot be obtained; If the amount exceeds this range, unreacted imidazole compounds will remain in the coating film, and electrical performance, moisture resistance, chemical resistance, etc. will deteriorate. Furthermore, in carrying out the present invention, adhesion to adherends and chemical resistance are further improved by using dicyandiamide, p-ethoxyphenyl biguanide, and 1-0-tolyl biguanide as co-curing agents. be able to. Dicyandiamide is 0.5 to 3 parts by weight, p-
The amount of ethoxyphenyl biguanide or 1-0-tolyl biguanide is preferably in the range of 3 to 20 parts by weight. Fillers suitable for the present invention are fine powders such as calcium carbonate, barium sulfate, mica powder, talcum powder, silica, alumina, and the like. It is also possible to use two or more of these fillers in combination, and the amount should be adjusted freely within the range of 30 to 120 parts by weight per 100 parts by weight of the epoxy resin, taking into consideration printing suitability, etc. It is. As a triazine compound having an effect of preventing discoloration and suppressing migration of copper and silver circuits suitable for the present invention, 2,4-diamino-6-vinyl- s-triazine isocyanuric acid adduct, formula
【化】
及び特願昭60−51828号明細書に示した２−置換
−４，６−ジアミノ−ｓ−トリアジン・イソシア
ヌル酸付加物すなわち２−エチル−４，６−ジア
ミノ−ｓ−トリアジン・イソシアヌル酸付加物、
２−ｎ−プロピル−４，６−ジアミノ−ｓ−トリ
アジン・イソシアヌル酸付加物、２−ヘプタデシ
ル−４，６−ジアミノ−ｓ−トリアジン・イソシ
アヌル酸付加物、２−メトキシエチル−４，６−
ジアミノ−ｓ−トリアジン・イソシアヌル酸付加
物、２−ｎ−プロポキシエチル−４，６−ジアミ
ノ−ｓ−トリアジン・イソシアヌル酸付加物、２
−イソプロポキシエチル−４，６−ジアミノ−ｓ
−トリアジン・イソシアヌル酸付加物、２−ｎ−
ブトキシエチル−４，６−ジアミノ−ｓ−トリア
ジン・イソシアヌル酸付加物、２−ｎ−オクタデ
シルオキシエチル−４，６−ジアミノ−ｓ−トリ
アジン・イソシアヌル酸付加物、２−アミノエチ
ル−４，６−ジアミノ−ｓ−トリアジン・イソシ
アヌル酸付加物、２−アリルアミノエチル−４，
６−ジアミノ−ｓ−トリアジン・イソシアヌル酸
付加物、２−プロピルアミノエチル−４，６−ジ
アミノ−ｓ−トリアジン・イソシアヌル酸付加
物、２−ｎ−ドデシルアミノエーテル−４，６−
ジアミノ−ｓ−トリアジン・イソシアヌル酸付加
物、２−アミノエチルオミノエチル−４，６−ジ
アミノ−ｓ−トリアジン・イソシアヌル酸付加
物、２−０−シアノフエニル−４，６−ジアミノ
−ｓ−トリアジン・イソシアヌル酸付加物、２−
ｐ−シアノフエニル−４，６−ジアミノ−ｓ−ト
リアジン・イソシアヌル酸付加物、２−フエニル
アミノエチル−４，６−ジアミノ−ｓ−トリアジ
ン・イソシアヌル酸付加物、２−０−トルイルア
ミノエチル−４，６−ジアミノ−ｓ−トリアジ
ン・イソシアヌル酸付加物、２−ｍ−トルイルア
ミノエチル−４，６−ジアミノ−ｓ−トリアジ
ン・イソシアヌル酸付加物、２−ｐ−トルイルア
ミノエチル−４，６−ジアミノ−ｓ−トリアジ
ン・イソシアヌル酸付加物、２−ベンジルアミノ
エチル−４，６−ジアミノ−ｓ−トリアジン・イ
ソシアヌル酸付加物、２−β−ナフチルアミノエ
チル−４，６−ジアミノ−ｓ−トリアジン・イソ
シアヌル酸付加物、２−アセトキシルエチル−
４，６−ジアミノ−ｓ−トリアジン・イソシアヌ
ル酸付加物、２−アクリロイルキシエチル−４，
６−ジアミノ−ｓ−トリアジン・イソシアヌル酸
付加物、２−（2′−エチル−イミダゾール−(4)〕−
ジチオカルボニルエチル−４，６−ジアミノ−ｓ
−トリアジン・イソシアヌル酸付加物、２−β−
ピリジルエチル−４，６−ジアミノ−ｓ−トリア
ジン・イソシアヌル酸付加物、２−ベンズトリア
ゾリル−４，６−ジアミノ−ｓ−トリアジン・イ
ソシアヌル酸付加物、２−（ビス−1′，3′−ジエ
チレントリアミノエチル）−４，６−ジアミノ−
ｓ−トリアジン・イソシアヌル酸付加物、２−
（ビス−ｍ−キシリレンジアミノエチル）−４，６
−ジアミノ−ｓ−トリアジン・イソシアヌル酸付
加物、２−メタクリロイルオキシエチル−４，６
−ジアミノ−ｓ−トリアジン・イソシアヌル酸付
加物であるがより好ましくは、式で示される２
−メタクリロイルオキシエチル−４，６−ジアミ
ノ−ｓ−トリアジン・イソシアヌル酸付加物であ
る。
式 [Chemical formula] and the 2-substituted-4,6-diamino-s-triazine isocyanuric acid adduct, that is, 2-ethyl-4,6-diamino-s-triazine isocyanuric acid, shown in Japanese Patent Application No. 1982-51828. acid adduct,
2-n-propyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2-heptadecyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2-methoxyethyl-4,6-
Diamino-s-triazine/isocyanuric acid adduct, 2-n-propoxyethyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2
-isopropoxyethyl-4,6-diamino-s
-triazine/isocyanuric acid adduct, 2-n-
Butoxyethyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2-n-octadecyloxyethyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2-aminoethyl-4,6- Diamino-s-triazine isocyanuric acid adduct, 2-allylaminoethyl-4,
6-diamino-s-triazine/isocyanuric acid adduct, 2-propylaminoethyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2-n-dodecylaminoether-4,6-
Diamino-s-triazine/isocyanuric acid adduct, 2-aminoethylominoethyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2-0-cyanophenyl-4,6-diamino-s-triazine/isocyanuric acid adduct Acid adduct, 2-
p-cyanophenyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2-phenylaminoethyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2-0-tolylaminoethyl-4 , 6-diamino-s-triazine/isocyanuric acid adduct, 2-m-tolylaminoethyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2-p-tolylaminoethyl-4,6-diamino -s-triazine/isocyanuric acid adduct, 2-benzylaminoethyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2-β-naphthylaminoethyl-4,6-diamino-s-triazine/isocyanuric acid adduct Acid adduct, 2-acetoxylethyl-
4,6-diamino-s-triazine isocyanuric acid adduct, 2-acryloylxyethyl-4,
6-diamino-s-triazine isocyanuric acid adduct, 2-(2'-ethyl-imidazole-(4))-
dithiocarbonylethyl-4,6-diamino-s
-triazine/isocyanuric acid adduct, 2-β-
Pyridylethyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2-benztriazolyl-4,6-diamino-s-triazine/isocyanuric acid adduct, 2-(bis-1',3' -diethylenetriaminoethyl)-4,6-diamino-
s-triazine isocyanuric acid adduct, 2-
(bis-m-xylylene diaminoethyl)-4,6
-Diamino-s-triazine isocyanuric acid adduct, 2-methacryloyloxyethyl-4,6
-Diamino-s-triazine/isocyanuric acid adduct, more preferably 2 represented by the formula
-methacryloyloxyethyl-4,6-diamino-s-triazine/isocyanuric acid adduct. formula
【化】
なお前記トリアジン化合物は、そのいずれか１
種又は２種以上をエポキシ樹脂に対して３〜20重
量部の範囲で添加すべきであり、トリアジン化合
物の添加量がこの範囲を上廻ると、銅や銀の変色
防止及びマイグレーシヨン抑制効果は認められる
が、インキの耐薬品性、耐水性及び密着性を低下
させる傾向がある。
なお本発明においては、必要に応じて有機顔
料、無機顔料等の着色剤、塗膜表面流動調整剤、
消泡剤、揺変性付与剤等を添加しても良い。さら
にスクリーン印刷適正を付与させるために、有機
溶剤を添加して粘度を調整することも可能であ
る。
以下、実施例及び比較例によつて本発明を具体
的に説明する。
実施例及び比較例
試験において用いたレゾシル・オルリクレゾー
ルノボラツク共重合体型多官能エポキシ樹脂、固
形状ビスフエノールＡジグリシジルエーテル及び
クレゾールノボラツクエポキシ樹脂はそれぞれ酢
酸ジエチレングリコールモノエチルエーテル30重
量部に対して100重量部を120℃で加温溶解させ
た。
表１に示した各例のレジストインキは調合物を
三本ペイントロールを用いてグラインドゲージに
よる測定で、粒子径を10μ以下になるよう均一に
粉砕し混練した。
なお、数値単位は、断わりない限り重量部をも
つて示した。[Chemical formula] The triazine compound may be any one of the above triazine compounds.
The triazine compound or two or more species should be added in the range of 3 to 20 parts by weight to the epoxy resin, and if the amount of the triazine compound added exceeds this range, the discoloration prevention and migration suppressing effect of copper and silver will be reduced. However, it tends to reduce the chemical resistance, water resistance and adhesion of the ink. In addition, in the present invention, colorants such as organic pigments and inorganic pigments, coating film surface fluidity regulators,
Antifoaming agents, thixotropy imparting agents, etc. may be added. Furthermore, in order to impart suitability for screen printing, it is also possible to adjust the viscosity by adding an organic solvent. Hereinafter, the present invention will be specifically explained using Examples and Comparative Examples. Examples and Comparative Examples The resocyl-ollycresol novolac copolymer type polyfunctional epoxy resin, solid bisphenol A diglycidyl ether, and cresol novolac epoxy resin used in the test were each used in a proportion of 30 parts by weight of diethylene glycol monoethyl ether acetate. 100 parts by weight was dissolved by heating at 120°C. The resist inks of each example shown in Table 1 were prepared by grinding and kneading the formulation using three paint rolls so that the particle size was uniformly 10 μm or less as measured by a grind gauge. In addition, numerical units are shown in parts by weight unless otherwise specified.
【表】【table】
【表】
次に、表１において得たエポキシ樹脂レジスト
インキ組成物の性能評価試験を行つた結果は、表
に示したとおりであつた。[Table] Next, a performance evaluation test was conducted on the epoxy resin resist ink composition obtained in Table 1, and the results were as shown in the table.
【表】【table】
【表】
発明の効果
本発明エポキシ樹脂レジストインキ組成物は、
ハロゲン化物で難燃料化させたプリント配線板に
対しても、非難燃性のものと同様の印刷条件及び
硬化温度で取り扱うことができ、且つブリードア
ウト、チヨーキングの発生を伴わず、さらに導体
回路の変色やマイグレーシヨンの抑制に顕著な効
果が認められる。[Table] Effects of the invention The epoxy resin resist ink composition of the present invention is
Printed wiring boards that have been made flame retardant with halides can be handled under the same printing conditions and curing temperatures as flame retardant ones, and they do not cause bleed-out or tyoke, and they can also be used for conductor circuits. A remarkable effect is observed in suppressing discoloration and migration.
Claims (1)
共重合体型多官能エポキシ樹脂と(b)液状多価フエ
ノールのポリジグリシジルエーテルを重量比とし
て30〜100：70〜０の割合で含むエポキシ樹脂100
重量部、(c)イミダゾール化合物３〜15重量部及び
(d)適量の充填剤を配合したことを特徴とするエポ
キシ樹脂レジストインキ組成物。 ２ (a)レゾルシン・オルソクレゾールノボラツク
共重合体型多官能エポキシ樹脂と(b)液状多価フエ
ノールのポリグリシジルエーテルを重合比として
30〜100：70〜０の割合で含むエポキシ樹脂100重
量部、(c)イミダゾール化合物３〜15重量部(d)２，
４−ジアミノ−６−ビニル−ｓ−トリアジン・イ
ソシアヌル酸付加物あるいは２−置換−４，６−
ジアミノ−ｓ−トリアジン・イソシアヌル酸付加
物のうちいずれか１種又は２種以上からなるトリ
アジン化合物３〜20重量部及び(e)適量の充填剤を
配合したことを特徴とするエポキシ樹脂レジスト
インキ組成物。[Claims] 1. Contains (a) a resorcinol-orthocresol novolac copolymer type polyfunctional epoxy resin and (b) a polydiglycidyl ether of liquid polyhydric phenol in a weight ratio of 30 to 100:70 to 0. epoxy resin 100
parts by weight, (c) 3 to 15 parts by weight of imidazole compound, and
(d) An epoxy resin resist ink composition characterized by containing an appropriate amount of filler. 2 Polymerization ratio of (a) resorcinol/orthocresol novolac copolymer type polyfunctional epoxy resin and (b) polyglycidyl ether of liquid polyhydric phenol
100 parts by weight of epoxy resin contained in a ratio of 30 to 100:70 to 0, (c) 3 to 15 parts by weight of imidazole compound, (d) 2,
4-diamino-6-vinyl-s-triazine/isocyanuric acid adduct or 2-substituted-4,6-
An epoxy resin resist ink composition comprising 3 to 20 parts by weight of a triazine compound consisting of one or more diamino-s-triazine/isocyanuric acid adducts and (e) an appropriate amount of a filler. thing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61218630A JPS6372770A (en) | 1986-09-16 | 1986-09-16 | Epoxy resin-based resist ink composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61218630A JPS6372770A (en) | 1986-09-16 | 1986-09-16 | Epoxy resin-based resist ink composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6372770A JPS6372770A (en) | 1988-04-02 |
| JPH0575033B2 true JPH0575033B2 (en) | 1993-10-19 |
Family
ID=16722961
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61218630A Granted JPS6372770A (en) | 1986-09-16 | 1986-09-16 | Epoxy resin-based resist ink composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6372770A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1786858A4 (en) * | 2004-08-31 | 2009-09-16 | Hyperion Catalysis Int | Conductive thermosets by extrusion |
-
1986
- 1986-09-16 JP JP61218630A patent/JPS6372770A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6372770A (en) | 1988-04-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4602970B2 (en) | Electrically stable and impact resistant conductive adhesive composition for electronic devices | |
| WO2001002486A1 (en) | Liquid thermosetting resin composition and method of permanent hole-filling for printed wiring board using the same | |
| JPH0412595A (en) | Conductive paste composition | |
| JPS6210567B2 (en) | ||
| JPH10298526A (en) | Composition for connecting circuit and film using the same | |
| JPH06136341A (en) | Adhesive | |
| JP3548691B2 (en) | Liquid thermosetting filling composition and method for filling permanent holes in printed wiring boards using the same | |
| EP0166588B1 (en) | Epoxy resin composition | |
| KR20120033670A (en) | Adhesive composition for halogen-free coverlay film and coverlay film using the same | |
| JP6777548B2 (en) | Conductive paste | |
| JP2005089629A (en) | Electroconductive adhesive | |
| JPH0575033B2 (en) | ||
| KR100777500B1 (en) | Varnish for laminate or prepreg, laminate or prepreg obtained with this varnish, and printed circuit board made with this laminate or prepreg | |
| JP4009371B2 (en) | Thermosetting resin composition, protective film comprising the cured product, and method for forming the same | |
| JPS6079079A (en) | Adhesive composition | |
| JP2007197498A (en) | Conductive adhesive | |
| JPS6330578A (en) | Epoxy-resin-base resist ink composition | |
| JPH0119834B2 (en) | ||
| JP4337204B2 (en) | Interlayer insulation adhesive for multilayer printed wiring boards | |
| JP3484957B2 (en) | Conductive adhesive | |
| JPH0153982B2 (en) | ||
| JP2627916B2 (en) | Solder resist composition | |
| JPS6253531B2 (en) | ||
| KR100707254B1 (en) | Adhesive resin composition and use thereof | |
| JPH0122313B2 (en) |