JPH0574988A - Cooler of intergrated circuit - Google Patents
Cooler of intergrated circuitInfo
- Publication number
- JPH0574988A JPH0574988A JP3234264A JP23426491A JPH0574988A JP H0574988 A JPH0574988 A JP H0574988A JP 3234264 A JP3234264 A JP 3234264A JP 23426491 A JP23426491 A JP 23426491A JP H0574988 A JPH0574988 A JP H0574988A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- heat
- heat conduction
- conduction block
- insulating cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、セラミック基板に搭載
した集積回路を冷却するための集積回路の冷却装置に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an integrated circuit cooling device for cooling an integrated circuit mounted on a ceramic substrate.
【０００２】[0002]
【従来の技術】図２は従来の集積回路の冷却装置の一例
を示す断面図である。2. Description of the Related Art FIG. 2 is a sectional view showing an example of a conventional integrated circuit cooling device.
【０００３】セラミック基板に搭載した集積回路を冷却
するための従来の集積回路の冷却装置は、図２に示すよ
うに、外部接続用ピン２２を有するセラミック基板２１
に搭載された集積回路（ＩＣ）２５の上に、熱伝導性の
コンパウンド２４の上に熱伝導ブロック３０に密着して
設けてあるピストン３５を搭載してねじ３５によって締
付け、熱伝導ブロック３０の上にコールドプレート３１
を搭載し、下部においてセラミック基板２１に密着して
固定されいる枠２３の上面を熱伝導ブロック３０の下面
と密着させ、コールドプレート３１の内部のＩＣ２５に
対応する位置に冷媒３２を流通させる流路３３を設け、
ＩＣ２５に発生する熱をコールドプレート３１の流路３
３中を流れる冷媒３２によって冷却する構造となってい
る。As shown in FIG. 2, a conventional integrated circuit cooling device for cooling an integrated circuit mounted on a ceramic substrate has a ceramic substrate 21 having external connection pins 22.
On the integrated circuit (IC) 25 mounted on, the piston 35 mounted on the heat conductive compound 24 in close contact with the heat conductive block 30 is mounted and tightened by the screw 35. Cold plate 31 on top
A flow path through which the upper surface of the frame 23, which is mounted in close contact with and fixed to the ceramic substrate 21 in the lower part, is in close contact with the lower surface of the heat conduction block 30, and the refrigerant 32 is circulated to the position corresponding to the IC 25 inside the cold plate 31. 33 is provided,
The heat generated in the IC 25 is applied to the flow path 3 of the cold plate 31.
3 has a structure in which it is cooled by a refrigerant 32 flowing therein.
【０００４】[0004]
【発明が解決しようとする課題】上述したような従来の
集積回路の冷却装置は、集積回路がセラミック基板に傾
いて取付けられたとき、ピストンの姿勢を集積回路の傾
きに合せることができないため、一つの集積回路にピス
トンとの間隔が広いところと狭いところとが生じ、この
ため冷却性能が低下するという欠点を有している。また
集積回路から冷媒までの間に、金属同志の接触のみによ
って熱を伝達している箇所が２箇所あるため、熱の伝達
性が悪いという欠点も有している。更に、集積回路の数
が多くなると、ねじの締付け回数が多くなって作業工数
が増大するという欠点も有している。In the conventional cooling device for an integrated circuit as described above, when the integrated circuit is tilted and mounted on the ceramic substrate, the posture of the piston cannot be adjusted to the tilt of the integrated circuit. One integrated circuit has a wide gap with a piston and a narrow gap with the piston, which has a drawback that cooling performance is deteriorated. In addition, since there are two places where heat is transferred only by the contact between the metals from the integrated circuit to the coolant, there is a drawback that the heat transfer property is poor. Further, when the number of integrated circuits increases, the number of screw tightening increases and the work man-hour increases.
【０００５】[0005]
【課題を解決するための手段】本発明の集積回路の冷却
装置は、外部接続用のピンを有するセラミック基板に搭
載された集積回路上に搭載し上面に複数個のピンを植設
した絶縁冷却板と、下面の前記ピンに対応した位置に前
記ピンを挿入する穴を有する熱伝導ブロックと、前記熱
伝導ブロックの上に搭載され内部の前記集積回路に対応
する位置に冷媒を流通させる流路を有するコールドプレ
ートと、下部において前記セラミック基板に密着して固
定され上面において前記熱伝導ブロックの下面と密着し
て固定された枠とを備え、前記集積回路と前記絶縁冷却
板との間隙が一定となるように調整した後前記絶縁冷却
板と前記熱伝導ブロックとをはんだによって固定し、前
記間隙を熱伝導性のコンパウンドで充填したものであ
る。SUMMARY OF THE INVENTION An integrated circuit cooling device according to the present invention is an insulating cooling device mounted on an integrated circuit mounted on a ceramic substrate having pins for external connection and having a plurality of pins implanted on the upper surface. A plate, a heat conduction block having a hole for inserting the pin at a position corresponding to the pin on the lower surface, and a flow path for circulating the refrigerant at a position mounted on the heat conduction block and corresponding to the integrated circuit inside And a frame fixed to the ceramic substrate in the lower part and fixed to the lower surface of the heat conductive block in the upper surface, and the gap between the integrated circuit and the insulating cooling plate is constant. After adjusting so that the insulating cooling plate and the heat conduction block are fixed by solder, the gap is filled with a heat conductive compound.
【０００６】[0006]
【実施例】次に、本発明の実施例について図面を参照し
て説明する。Embodiments of the present invention will now be described with reference to the drawings.
【０００７】図１は本発明の一実施例を示す断面図であ
る。FIG. 1 is a sectional view showing an embodiment of the present invention.
【０００８】図１において、外部接続用ピン２を有する
セラミック基板１の上には、集積回路（ＩＣ）５が搭載
されている。ＩＣ５から放散される熱を伝達する絶縁冷
却板６は、熱伝達性がよくしかも電気的に絶縁性が高い
炭化シリコンや窒化アルミ塔の材料で形成されており、
その上面に銅等の熱伝達性のよい材料で形成した複数個
のピン７を金錫合金等の高温はんだで蝋付けして固定し
ている。熱伝達性がよい金属材料（アルミや銅等）で形
成されて腐食を防止するために表面にメッキを施した熱
伝導ブロック１０は、その下面の絶縁冷却板６の各ピン
７と対応する位置に、対応するピン７を挿入するための
穴９が設けてあり、この穴９の大きさは、ＩＣ５のセラ
ミック基板１への取付けの高さのばらつきやＩＣ５の傾
斜に応じて絶縁冷却板６の位置や傾斜を変えることがで
きるように、高さ方向と横方向とに充分な余裕をもたせ
てある。絶縁冷却板６は、各ピン７を熱伝導ブロック１
０の穴９に挿入され、空洞部分に錫鉛はんだ（はんだ）
８を充填されて仮固定されている。熱伝達性がよい金属
材料で形成されているコールドプレート１１は、熱伝導
ブロック１０の上に搭載されており、内部のＩＣ５と対
応する位置に、冷媒１２を流通させるための流路１３を
設けてある。コールドプレート１１と熱伝導ブロック１
０との接触面は、熱が容易に伝達されるように、共に表
面粗さを小さくして密着性を良くしてある。熱伝導ブロ
ック１０とセラミック基板１とを固定する枠３は、下部
においてセラミック基板１に接着によって固定されお
り、熱伝導ブロック１０とは、ＩＣ５と絶縁冷却板６と
の間隔を調整した後、ねじによって固定される。In FIG. 1, an integrated circuit (IC) 5 is mounted on a ceramic substrate 1 having external connection pins 2. The insulating cooling plate 6 for transmitting the heat radiated from the IC 5 is formed of a material such as silicon carbide or an aluminum nitride tower, which has a good heat transfer property and a high electric insulation property.
A plurality of pins 7 formed of a material having a good heat transfer property such as copper is fixed on the upper surface by brazing with high temperature solder such as gold-tin alloy. The heat conduction block 10 formed of a metal material having good heat transfer property (aluminum, copper, etc.) and plated on its surface to prevent corrosion is located at a position corresponding to each pin 7 of the insulating cooling plate 6 on the lower surface thereof. A hole 9 for inserting a corresponding pin 7 is provided in the insulating cooling plate 6 depending on variations in mounting height of the IC 5 on the ceramic substrate 1 and inclination of the IC 5. There is a sufficient margin in the height direction and the lateral direction so that the position and inclination of can be changed. Insulating cooling plate 6 has pins 7 for heat conduction block 1
Inserted in hole 9 of 0, tin lead solder (solder) in the cavity
8 is filled and temporarily fixed. The cold plate 11 made of a metal material having a good heat transfer property is mounted on the heat conduction block 10, and the flow path 13 for circulating the refrigerant 12 is provided at a position corresponding to the IC 5 inside. There is. Cold plate 11 and heat conduction block 1
The contact surface with 0 has both a small surface roughness and good adhesion so that heat can be easily transferred. The frame 3 for fixing the heat conduction block 10 and the ceramic substrate 1 is fixed to the ceramic substrate 1 by adhesion at the lower portion. The heat conduction block 10 is screwed after adjusting the distance between the IC 5 and the insulating cooling plate 6. Fixed by
【０００９】このように構成した集積回路の冷却装置
は、ＩＣ５の上に所定の厚さの耐熱性ラバーを搭載し、
更にその上に熱伝導ブロック１０に仮固定されている絶
縁冷却板６を搭載し、熱伝導ブロック１０を加熱する。
これによってはんだ８が溶けて絶縁冷却板６が耐熱性ラ
バーに密着し、絶縁冷却板６とＩＣ５との間隔は、何れ
の箇所においても一定の間隔となる。再びはんだ８が固
化して絶縁冷却板６が熱伝導ブロック１０に固定された
後、耐熱性ラバーを除去してそのあとに熱伝導性のコン
パウンド４を充填する。このようにしてＩＣ５と絶縁冷
却板６との間隔を調整した後、枠３と熱伝導ブロック１
０とをねじによって固定する。In the integrated circuit cooling device thus constructed, a heat resistant rubber having a predetermined thickness is mounted on the IC 5,
Further, the insulating cooling plate 6 temporarily fixed to the heat conduction block 10 is mounted thereon, and the heat conduction block 10 is heated.
As a result, the solder 8 is melted and the insulating cooling plate 6 is brought into close contact with the heat-resistant rubber, so that the insulating cooling plate 6 and the IC 5 are spaced from each other at a constant distance. After the solder 8 is solidified again and the insulating cooling plate 6 is fixed to the heat conductive block 10, the heat resistant rubber is removed and then the heat conductive compound 4 is filled. After adjusting the distance between the IC 5 and the insulating cooling plate 6 in this way, the frame 3 and the heat conduction block 1 are adjusted.
Fix 0 and 0 with screws.
【００１０】[0010]
【発明の効果】以上説明したように、本発明の集積回路
の冷却装置は、絶縁冷却板と熱伝導ブロックとをはんだ
を介してピンによって結合し、ＩＣと絶縁冷却板との間
隔が一定になるように調整した後にはんだを固化させて
絶縁冷却板を熱伝導ブロックにを固定するようにするこ
とにより、ＩＣがセラミック基板に傾いて取付けられた
り高さにばらつきがあっても、常にＩＣと絶縁冷却板と
の間隔を一定にすることができるため、冷却性能を向上
させることができるという効果がある。また、ＩＣから
冷媒までの間の金属同志の接触箇所が１箇所のみとなる
ため、これによっても冷却性能を向上させることができ
るという効果がある。更に、ＩＣの数に無関係に、１回
の加熱ですべての絶縁冷却板の高さと傾斜とを調整でき
るため、調整のための作業工数を低減できるという効果
もある。As described above, in the cooling device for an integrated circuit according to the present invention, the insulating cooling plate and the heat conducting block are joined by the pins via the solder so that the distance between the IC and the insulating cooling plate becomes constant. After adjusting so that the solder is solidified and the insulating cooling plate is fixed to the heat conduction block, even if the IC is mounted on the ceramic substrate at an inclination or has a variation in height, Since the distance from the insulating cooling plate can be made constant, the cooling performance can be improved. Further, since there is only one metal contact point between the IC and the coolant, this also has the effect of improving the cooling performance. Furthermore, regardless of the number of ICs, the height and inclination of all the insulating and cooling plates can be adjusted by heating once, which also has the effect of reducing the number of work steps for adjustment.
【図１】本発明の一実施例を示す断面図である。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】従来の集積回路の冷却装置の一例を示す断面図
である。FIG. 2 is a cross-sectional view showing an example of a conventional integrated circuit cooling device.
１ セラミック基板 ２ 外部接続用ピン ３ 枠 ４ コンパウンド ５ 集積回路（ＩＣ） ６ 絶縁冷却板 ７ ピン ８ 錫鉛はんだ（はんだ） ９ 穴 １０ 熱伝導ブロック １１ コールドプレート １２ 冷媒 １３ 流路 ２１ セラミック基板 ２２ 外部接続用ピン ２３ 枠 ２４ コンパウンド ２５ 集積回路（ＩＣ） ３０ 熱伝導ブロック ３１ コールドプレート ３２ 冷媒 ３３ 流路 ３４ ピストン ３５ ねじ 1 Ceramic Board 2 External Connection Pin 3 Frame 4 Compound 5 Integrated Circuit (IC) 6 Insulation Cooling Plate 7 Pin 8 Tin Lead Solder (Solder) 9 Hole 10 Heat Conduction Block 11 Cold Plate 12 Refrigerant 13 Flow Channel 21 Ceramic Substrate 22 External Connection pin 23 Frame 24 Compound 25 Integrated circuit (IC) 30 Heat conduction block 31 Cold plate 32 Refrigerant 33 Flow path 34 Piston 35 Screw
Claims (2)
板に搭載された集積回路上に搭載し上面に複数個のピン
を植設した絶縁冷却板と、下面の前記ピンに対応した位
置に前記ピンを挿入する穴を有する熱伝導ブロックと、
前記熱伝導ブロックの上に搭載され内部の前記集積回路
に対応する位置に冷媒を流通させる流路を有するコール
ドプレートと、下部において前記セラミック基板に密着
して固定され上面において前記熱伝導ブロックの下面と
密着して固定された枠とを備え、前記集積回路と前記絶
縁冷却板との間隙が一定となるように調整した後前記絶
縁冷却板と前記熱伝導ブロックとをはんだによって固定
し、前記間隙を熱伝導性のコンパウンドで充填したこと
を特徴とする集積回路の冷却装置。1. An insulating cooling plate mounted on an integrated circuit mounted on a ceramic substrate having pins for external connection and having a plurality of pins planted on the upper surface, and the pins on the lower surface at positions corresponding to the pins. A heat conduction block having a hole for inserting
A cold plate mounted on the heat conduction block and having a flow path for circulating a coolant in a position corresponding to the integrated circuit inside, and a lower surface of the heat conduction block which is fixed in close contact with the ceramic substrate and is fixed to the lower surface of the heat conduction block. And a frame fixed in close contact with the integrated circuit, and after adjusting the gap between the integrated circuit and the insulating cooling plate to be constant, the insulating cooling plate and the heat conduction block are fixed by solder, and the gap is formed. A cooling device for an integrated circuit, which is filled with a thermally conductive compound.
板に搭載された集積回路上に搭載し上面に複数個のピン
を植設した絶縁冷却板と、下面の前記ピンに対応した位
置に前記ピンを挿入する穴を有する熱伝導ブロックと、
前記熱伝導ブロックの上に搭載され内部の前記集積回路
に対応する位置に冷媒を流通させる流路を有するコール
ドプレートと、下部において前記セラミック基板に密着
して固定され上面において前記熱伝導ブロックの下面と
密着して固定された枠とを備え、前記集積回路と前記絶
縁冷却板との間隙が一定となるように調整した後前記絶
縁冷却板と前記熱伝導ブロックとを錫鉛はんだによって
固定し、前記間隙を熱伝導性のコンパウンドで充填した
ことを特徴とする集積回路の冷却装置。2. An insulating cooling plate mounted on an integrated circuit mounted on a ceramic substrate having pins for external connection and having a plurality of pins planted on the upper surface, and the pins on the lower surface at positions corresponding to the pins. A heat conduction block having a hole for inserting
A cold plate mounted on the heat conduction block and having a flow path for circulating a coolant in a position corresponding to the integrated circuit inside, and a lower surface of the heat conduction block which is fixed in close contact with the ceramic substrate and is fixed to the lower surface of the heat conduction block. And a frame fixed in close contact with each other, and after adjusting the gap between the integrated circuit and the insulating cooling plate to be constant, fixing the insulating cooling plate and the heat conduction block with tin-lead solder, A cooling device for an integrated circuit, wherein the gap is filled with a thermally conductive compound.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3234264A JPH0574988A (en) | 1991-09-13 | 1991-09-13 | Cooler of intergrated circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3234264A JPH0574988A (en) | 1991-09-13 | 1991-09-13 | Cooler of intergrated circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0574988A true JPH0574988A (en) | 1993-03-26 |
Family
ID=16968248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3234264A Pending JPH0574988A (en) | 1991-09-13 | 1991-09-13 | Cooler of intergrated circuit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0574988A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009507081A (en) * | 2005-09-07 | 2009-02-19 | ブレインセルス，インコーポレイティド | Regulation of neurogenesis by HDac inhibition |
| JP2016072618A (en) * | 2015-09-02 | 2016-05-09 | 株式会社日立製作所 | Cooling structure of heating element |
| US9437797B2 (en) | 2014-09-29 | 2016-09-06 | Hitachi, Ltd. | Cooling structure of heating element and power conversion device |
| JP2016220383A (en) * | 2015-05-20 | 2016-12-22 | 株式会社日立製作所 | Cooling structure of heating element and power conversion device |
-
1991
- 1991-09-13 JP JP3234264A patent/JPH0574988A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009507081A (en) * | 2005-09-07 | 2009-02-19 | ブレインセルス，インコーポレイティド | Regulation of neurogenesis by HDac inhibition |
| US9437797B2 (en) | 2014-09-29 | 2016-09-06 | Hitachi, Ltd. | Cooling structure of heating element and power conversion device |
| US9807913B2 (en) | 2014-09-29 | 2017-10-31 | Hitachi, Ltd. | Cooling structure of heating element and power conversion device |
| JP2016220383A (en) * | 2015-05-20 | 2016-12-22 | 株式会社日立製作所 | Cooling structure of heating element and power conversion device |
| JP2016072618A (en) * | 2015-09-02 | 2016-05-09 | 株式会社日立製作所 | Cooling structure of heating element |
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