JPH0573783B2 - - Google Patents
Info
- Publication number
- JPH0573783B2 JPH0573783B2 JP59029878A JP2987884A JPH0573783B2 JP H0573783 B2 JPH0573783 B2 JP H0573783B2 JP 59029878 A JP59029878 A JP 59029878A JP 2987884 A JP2987884 A JP 2987884A JP H0573783 B2 JPH0573783 B2 JP H0573783B2
- Authority
- JP
- Japan
- Prior art keywords
- weight
- parts
- ferrite
- magnetic
- present
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 229910001047 Hard ferrite Inorganic materials 0.000 claims description 12
- 229910001035 Soft ferrite Inorganic materials 0.000 claims description 11
- 239000011342 resin composition Substances 0.000 claims description 11
- 125000003118 aryl group Chemical group 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229920002492 poly(sulfone) Polymers 0.000 claims description 9
- 239000006247 magnetic powder Substances 0.000 claims description 6
- 239000000203 mixture Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims 1
- 238000010292 electrical insulation Methods 0.000 description 8
- 239000004695 Polyether sulfone Substances 0.000 description 7
- 229920006393 polyether sulfone Polymers 0.000 description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 5
- 238000000465 moulding Methods 0.000 description 5
- 239000000047 product Substances 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229920006015 heat resistant resin Polymers 0.000 description 4
- 239000000696 magnetic material Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 229920004695 VICTREX™ PEEK Polymers 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000889 permalloy Inorganic materials 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- 229910018605 Ni—Zn Inorganic materials 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical group OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000011231 conductive filler Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 125000005843 halogen group Chemical group 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000002798 polar solvent Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229910052761 rare earth metal Inorganic materials 0.000 description 1
- 150000002910 rare earth metals Chemical class 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 125000001174 sulfone group Chemical group 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Hard Magnetic Materials (AREA)
- Soft Magnetic Materials (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Description
本発明は電気・電子機器を構成する筐体および
電気・電子部品等に使用する電気特性、成形加工
性および耐熱性に優れた樹脂組成物に関する。
電気・電子機器は近年、機器の小型化、軽量
化、および薄形化が進んでおり、これに伴なつて
電磁波遮蔽性、電気絶縁性、透磁性、耐熱性、成
形加工性等の諸特性を同時に満足する材料が求め
られている。
一般に樹脂に電磁波遮蔽性を付与するためには
導電性充填剤を添加することが行なわれている
が、添加量が少ないと電磁波遮蔽効果が少なく、
添加量が多いと電磁波遮蔽効果は大となるが導電
性となり電気絶縁性が低下しかつ成形加工性も悪
くなつてしまう等の問題がある。このため電磁波
遮蔽性、電気絶縁性および成形加工性を同時に満
足させることは困難であつた。また一般に樹脂の
耐熱性と成形加工性は相反するものであり、得ら
れる樹脂組成物の耐熱性向上を図ると成形加工性
は低下することが知られている。
本発明者等はこのため上述の諸特性を同時に満
足させる樹脂組成物につき種々検討した結果、芳
香族ポリスルホン樹脂にハードフエライト、鉄粉
等の磁性金属およびソフトフエライトよりなる特
定の混合比の磁性体粉末混合物を特定量添加する
ことにより、広い周波数領域で電磁波遮蔽性を有
し、かつ電気絶縁性、透磁性および成形加工性の
良好な樹脂組成物が得られることを見い出し、本
発明を完成した。
すなわち本発明は芳香族ポリスルホン樹脂100
重量部とハードフエライト、磁性金属粉およびソ
フトフエライトの３種の磁性体粉末の混合物30〜
300重量部からなつており、かつ上記３種の磁性
体の混合割合が、ハードフエライト40〜60重量
部、磁性金属15〜35重量部、ソフトフエライト15
〜35重量部の比率である耐熱性、電磁波遮蔽性、
電気絶縁性および成形加工性の優れた電気・電子
機器用耐熱性樹脂組成物である。
本発明で用いられる芳香族ポリスルホン樹脂と
は、例えばアルカリフエノレート基と、電子吸引
性スルホン基で活性化された芳香族ハロゲン基と
を非プロトン性極性溶媒中で縮合反応させること
により得られる形式の重合体であり、アリーレン
結合（芳香族結合）、エーテル結合およびスルホ
ン結合の三者を必須の結合単位とする線状重合体
である。
例えば極めて代表的な例として次のような構造
のものが挙げられる。
The present invention relates to a resin composition having excellent electrical properties, moldability, and heat resistance for use in housings and electrical/electronic parts constituting electrical/electronic equipment. In recent years, electrical and electronic devices have become smaller, lighter, and thinner, and with this, various properties such as electromagnetic shielding, electrical insulation, magnetic permeability, heat resistance, and moldability have improved. There is a need for materials that satisfy both of these requirements. Generally, conductive fillers are added to resins to give them electromagnetic shielding properties, but if the amount added is small, the electromagnetic shielding effect is small;
If the amount added is large, the electromagnetic wave shielding effect will be large, but there will be problems such as conductivity resulting in lower electrical insulation and poor moldability. Therefore, it has been difficult to simultaneously satisfy electromagnetic wave shielding properties, electrical insulation properties, and moldability. Furthermore, it is generally known that the heat resistance and molding processability of a resin are contradictory, and that when the heat resistance of the resulting resin composition is improved, the molding processability is reduced. For this reason, the present inventors have conducted various studies on resin compositions that simultaneously satisfy the above-mentioned properties, and have found a magnetic material with a specific mixing ratio of aromatic polysulfone resin, hard ferrite, magnetic metal such as iron powder, and soft ferrite. The present inventors have discovered that by adding a specific amount of a powder mixture, a resin composition can be obtained that has electromagnetic wave shielding properties over a wide frequency range and has good electrical insulation, magnetic permeability, and moldability, and has completed the present invention. . That is, the present invention uses aromatic polysulfone resin 100
Weight part and mixture of three types of magnetic powders: hard ferrite, magnetic metal powder, and soft ferrite 30~
300 parts by weight, and the mixing ratio of the above three magnetic materials is 40 to 60 parts by weight of hard ferrite, 15 to 35 parts by weight of magnetic metal, and 15 parts by weight of soft ferrite.
Heat resistance, electromagnetic shielding property, which is the ratio of ~35 parts by weight
This is a heat-resistant resin composition for electrical and electronic devices with excellent electrical insulation and moldability. The aromatic polysulfone resin used in the present invention is a type obtained by, for example, a condensation reaction between an alkali phenolate group and an aromatic halogen group activated with an electron-withdrawing sulfone group in an aprotic polar solvent. It is a linear polymer with three essential bonding units: arylene bonds (aromatic bonds), ether bonds, and sulfone bonds. For example, a very typical example has the following structure.
【表】
これらのポリアリルスルホン樹脂は、例えば特
公昭40−10067号、特公昭42−7799号および特公
昭47−617号などに記載の方法によつて容易に製
造することができる。
本発明においては耐熱性および成形加工性の点
より上述の(1)式で表わされるポリエーテルスルホ
ンの使用が特に好ましい。
本発明で用いられるハードフエライトとしては
Ba系、Sr系またはSm−Co系等の希土類系等の
磁性材が用いられる。磁性金属粉末としては透磁
性の高いNiパーマロイ、Moパーマロイおよび鉄
が特に好ましい。またソフトフエライトとしては
Mn−Zn系、Mg−Zn系またはNi−Zn系等用いら
れることができる。特にハードフエライトとして
はSr系が、ソフトフエライトとしてはMn−Zn系
の使用が好ましい。
本発明において使用されるこれら３種の磁性体
粉末の混合割合は、最終製品に要求される電磁波
遮蔽周波数領域、電気絶縁性および成形加工性を
考慮して、ハードフエライト40〜60重量部、磁性
金属15〜35重量部、ソフトフエライト15〜35重量
部の比率の範囲で選択する。ハードフエライトの
割合がこの混合比より少ない場合には電磁波遮蔽
性が十分でなくなり、逆に多すぎる場合は体積固
有抵抗が大きくなりすぎるとともに、電磁波遮蔽
性に製品ごとのバラツキを生じ好ましくない。
本発明におけるこれ等磁性体粉末混合物の添加
量は、芳香族ポリスルホン樹脂100重量部に対し
30〜300重量部好ましくは50〜250重量部である。
この量より少ない場合には電磁波遮蔽性が劣り、
300重量部越えて添加した場合には、得られる樹
脂組成物の電気絶縁性の低下および成形加工生の
悪化等の問題が生じ好ましくない。
本発明の芳香族ポリスルホン樹脂への特定され
た磁性体粉末の添加は、一般には芳香族ポリスル
ホン樹脂と磁性体粉末とをヘンシエルミキサー等
一般の混合機で混合したのち、一般の押出機によ
りペレツト化することにより行なわれる。また本
発明の耐熱性樹脂組成物には、安定剤、紫外線吸
収剤、滑剤、着色剤を樹脂組成物の品質を損わな
い範囲で混和しても良い。
本発明の耐熱性樹脂組成物は、射出成形法、押
出成形法、圧縮成形法、回転成形法等公知の成形
法により成形され実用に供される。
本発明の耐熱性樹脂組成物を溶融成形して得ら
れる成形物は優れた電磁波遮蔽性および電気絶縁
性を有しており電気・電子機器分野において広く
活用することができる。
以下に実施例により本発明を具体的に説明す
る。
実施例１〜３および比較例１〜３
芳香族ポリスルホン樹脂としてポリエーテルス
ルホン樹脂（PESと略す）〔VICTREX PES
200P（商標）〕を、ハードフエライトとしてSr系
フエライトを、磁性金属体として鉄粉を、ソフト
フエライトとしてMn−Zn系をそれぞれ表−１に
示した量を添加し、ヘンシエルミシサーで混合し
た後、単軸押出機によりストランド状に押し出し
ペレツト化した。このペレツトを用い射出成形機
により50mm角の箱および蓋を成形した。箱の内側
に磁界発生用コイルを、外側にキヤツチコイルを
設置した。磁界発生用コイルに105Hzの電流を流
し、キヤツチコイルに発生した電流を検出するこ
とにより電磁波遮蔽性を測定した。またこの蓋の
体積固有抵抗を測定した。結果を表−１に示し
た。[Table] These polyallylsulfone resins can be easily produced by the methods described in, for example, Japanese Patent Publications No. 40-10067, Japanese Patent Publication No. 42-7799, and Japanese Patent Publication No. 47-617. In the present invention, it is particularly preferable to use polyether sulfone represented by the above formula (1) from the viewpoint of heat resistance and moldability. The hard ferrite used in the present invention is
A rare earth-based magnetic material such as Ba-based, Sr-based, or Sm-Co-based magnetic material is used. As the magnetic metal powder, Ni permalloy, Mo permalloy, and iron, which have high magnetic permeability, are particularly preferred. Also, as a soft ferrite
Mn-Zn system, Mg-Zn system, Ni-Zn system, etc. can be used. In particular, it is preferable to use Sr type hard ferrite and Mn-Zn type as soft ferrite. The mixing ratio of these three types of magnetic powder used in the present invention is determined by considering the electromagnetic shielding frequency range, electrical insulation properties, and moldability required for the final product: 40 to 60 parts by weight of hard ferrite, 40 to 60 parts by weight of hard ferrite, The ratio is selected within the range of 15 to 35 parts by weight of metal and 15 to 35 parts by weight of soft ferrite. If the proportion of hard ferrite is less than this mixing ratio, the electromagnetic wave shielding property will not be sufficient, and if it is too large, the volume resistivity will become too large and the electromagnetic wave shielding property will vary from product to product, which is not preferable. The amount of these magnetic powder mixtures added in the present invention is based on 100 parts by weight of aromatic polysulfone resin.
The amount is 30 to 300 parts by weight, preferably 50 to 250 parts by weight.
If the amount is less than this, the electromagnetic wave shielding properties will be poor,
If more than 300 parts by weight is added, problems such as a decrease in electrical insulation properties of the resulting resin composition and deterioration of molding properties are undesirable. In order to add the specified magnetic powder to the aromatic polysulfone resin of the present invention, the aromatic polysulfone resin and the magnetic powder are generally mixed using a general mixer such as a Henschel mixer, and then pelletized using a general extruder. This is done by making In addition, stabilizers, ultraviolet absorbers, lubricants, and colorants may be mixed into the heat-resistant resin composition of the present invention as long as they do not impair the quality of the resin composition. The heat-resistant resin composition of the present invention is molded by a known molding method such as an injection molding method, an extrusion molding method, a compression molding method, or a rotational molding method, and is put into practical use. Molded products obtained by melt-molding the heat-resistant resin composition of the present invention have excellent electromagnetic shielding properties and electrical insulation properties, and can be widely used in the fields of electrical and electronic equipment. The present invention will be specifically explained below using Examples. Examples 1 to 3 and Comparative Examples 1 to 3 Polyether sulfone resin (abbreviated as PES) as aromatic polysulfone resin [VICTREX PES
200P (trademark)], Sr-based ferrite as a hard ferrite, iron powder as a magnetic metal, and Mn-Zn-based as a soft ferrite in the amounts shown in Table 1 were added and mixed in a Henschel miscer. Thereafter, the mixture was extruded into strands using a single-screw extruder to form pellets. This pellet was used to mold a 50 mm square box and lid using an injection molding machine. A magnetic field generating coil was installed inside the box, and a catch coil was installed outside. Electromagnetic wave shielding performance was measured by passing a 10 5 Hz current through the magnetic field generating coil and detecting the current generated in the catch coil. The volume resistivity of this lid was also measured. The results are shown in Table-1.
【表】
比較例 ４〜５
芳香族ポリスルホン樹脂としてポリエーテルス
ルホン樹脂（PESと略す）〔VICTREX PES
200P（商標）〕を、ハードフエライトとしてSr系
フエライトを、磁性金属体として鉄粉を、ソフト
フエライトとしてMn−Zn系をそれぞれ表−２に
示した量を添加し、ヘンシエルミキサーで混合し
た後、単軸押出機によりストランド状に押し出し
ペレツト化した。このペレツトを用い射出成形機
により50mm角の箱および蓋を成形し、以下実施例
と同様の方法で箱の電磁波遮蔽性と蓋の体積固有
抵抗を測定した。結果を表−２に示した。
表−２に示す如く、比較例４の場合は電磁波遮
蔽性が劣り、比較例５の場合は体積固有抵抗が大
きすぎ、かつ電磁波遮蔽性の製品ごとのバラツキ
が大きくなつた。[Table] Comparative Examples 4-5 Polyethersulfone resin (abbreviated as PES) as aromatic polysulfone resin [VICTREX PES]
200P (trademark)], Sr-based ferrite as hard ferrite, iron powder as magnetic metal, and Mn-Zn-based as soft ferrite in the amounts shown in Table 2, and mixed with a Henschel mixer. The mixture was extruded into strands using a single-screw extruder and pelletized. Using this pellet, a 50 mm square box and lid were molded using an injection molding machine, and the electromagnetic wave shielding properties of the box and the volume resistivity of the lid were measured in the same manner as in the examples. The results are shown in Table-2. As shown in Table 2, in the case of Comparative Example 4, the electromagnetic wave shielding property was poor, and in the case of Comparative Example 5, the volume resistivity was too large, and the variation in electromagnetic wave shielding property from product to product was large.
【表】【table】
Claims (1)
ハードフエライト、磁性金属およびソフトフエラ
イトの３種の磁性体粉末の混合物30〜300重量部
からなつており、かつ上記３種の磁性体の混合割
合が、ハードフエライト40〜60重量部、磁性金属
15〜35重量部、ソフトフエライト15〜35重量部の
比率である電気・電子機器用樹脂組成物。1 For 100 parts by weight of aromatic polysulfone resin,
It consists of 30 to 300 parts by weight of a mixture of three types of magnetic powders: hard ferrite, magnetic metal, and soft ferrite, and the mixing ratio of the three types of magnetic substances is 40 to 60 parts by weight of hard ferrite, magnetic metal.
A resin composition for electrical/electronic equipment having a ratio of 15 to 35 parts by weight of soft ferrite and 15 to 35 parts by weight of soft ferrite.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59029878A JPS60173049A (en) | 1984-02-20 | 1984-02-20 | Heat-resistant resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59029878A JPS60173049A (en) | 1984-02-20 | 1984-02-20 | Heat-resistant resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60173049A JPS60173049A (en) | 1985-09-06 |
| JPH0573783B2 true JPH0573783B2 (en) | 1993-10-15 |
Family
ID=12288232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59029878A Granted JPS60173049A (en) | 1984-02-20 | 1984-02-20 | Heat-resistant resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60173049A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5347440A (en) * | 1976-10-14 | 1978-04-27 | Dowa Tetsupun Kougiyou Kk | Antistatic resin moldings |
| JPS5941246A (en) * | 1982-07-22 | 1984-03-07 | ダ−ト・インダストリ−ス・インコ−ポレ−テツド | Fiber reinforced composite material |
| JPH049185A (en) * | 1990-04-27 | 1992-01-13 | Brother Ind Ltd | Cloth pressing device of sewing machine |
-
1984
- 1984-02-20 JP JP59029878A patent/JPS60173049A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5347440A (en) * | 1976-10-14 | 1978-04-27 | Dowa Tetsupun Kougiyou Kk | Antistatic resin moldings |
| JPS5941246A (en) * | 1982-07-22 | 1984-03-07 | ダ−ト・インダストリ−ス・インコ−ポレ−テツド | Fiber reinforced composite material |
| JPH049185A (en) * | 1990-04-27 | 1992-01-13 | Brother Ind Ltd | Cloth pressing device of sewing machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60173049A (en) | 1985-09-06 |
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