JPH0569164A - Laser marking device - Google Patents
Laser marking deviceInfo
- Publication number
- JPH0569164A JPH0569164A JP3227768A JP22776891A JPH0569164A JP H0569164 A JPH0569164 A JP H0569164A JP 3227768 A JP3227768 A JP 3227768A JP 22776891 A JP22776891 A JP 22776891A JP H0569164 A JPH0569164 A JP H0569164A
- Authority
- JP
- Japan
- Prior art keywords
- laser marking
- processed
- laser
- marking
- turntable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は電子部品，機構部品，工
具，プレス型などの工業製品，貴金属，装身具等に文
字，数字，図形などを高速でマーキングするレーザマー
キング装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a laser marking device for marking electronic parts, mechanical parts, tools, industrial products such as press dies, precious metals, personal accessories, etc. at high speed with letters, numbers and figures.
【０００２】[0002]
【従来の技術】近年、レーザマーキング装置は半導体や
電子部品のみならず多種類の製品の製品番号，分類記
号，図形などをマーキングするための方法として用いら
れている。2. Description of the Related Art In recent years, laser marking devices have been used as a method for marking not only semiconductors and electronic parts but also product numbers, classification symbols, figures, etc. of various kinds of products.
【０００３】以下に従来のレーザマーキング装置につい
て説明する。図６は従来のレーザマーキング装置の加工
部材の搬送方法の例を示すものである。図６において１
はレーザマーカ、２は加工部材搬入用の主搬送路、３ａ
〜３ｄは加工部材の貯蔵装置、４ａ〜４ｄは加工部材搬
入用の副搬送路、５は加工部材搬出用の主搬送路、６ａ
〜６ｄは加工済部材の貯蔵装置、７ａ〜７ｄは加工部材
搬出用の副搬送路である。A conventional laser marking device will be described below. FIG. 6 shows an example of a method of transporting a processed member of a conventional laser marking device. 1 in FIG.
Is a laser marker, 2 is a main conveyance path for carrying in a processed member, 3a
3a to 3d are storage devices for processing members, 4a to 4d are sub-conveyance paths for carrying in processing members, 5 is a main conveyance path for carrying out processing members, and 6a.
6d are storage devices for processed members, and 7a to 7d are sub-conveyance paths for carrying out processed members.
【０００４】以上のように構成されたレーザマーキング
装置の加工部材の搬送方法について、以下その動作につ
いて説明する。The operation of the method of transporting the processed member of the laser marking apparatus configured as described above will be described below.
【０００５】まず、貯蔵装置３ｄから副搬送路４ｄを経
て主搬送路２に搬送された加工部材をレーザマーカ１ま
で搬送する場合の搬送方法について説明する。First, a carrying method for carrying a processed member carried from the storage device 3d to the main carrying path 2 via the sub carrying path 4d to the laser marker 1 will be described.
【０００６】貯蔵装置３ｄより取り出した加工部材を副
搬送路４ｄへ移す。次に副搬送路４ｄから主搬送路２上
へ加工部材を移した後、主搬送路２上の加工部材を搬送
する。この動作を複数回にわたって間歇的に返すことで
加工部材がレーザマーカ１の位置へ到達するとレーザマ
ーキング処理が開始される。レーザマーキング処理が完
了すると上記動作と同じように加工済の加工部材が搬出
用の主搬送部５より搬出用の副搬送部７ａを経由して貯
蔵装置６ａへ収納される。The processed member taken out from the storage device 3d is moved to the sub-transport path 4d. Next, after moving the processed member from the sub-conveyance path 4d onto the main conveyance path 2, the processed member on the main conveyance path 2 is conveyed. By repeating this operation a plurality of times intermittently, the laser marking process is started when the processed member reaches the position of the laser marker 1. When the laser marking process is completed, the processed member is stored in the storage device 6a from the unloading main transport section 5 via the unloading sub-transport section 7a, as in the above operation.
【０００７】次に図７は従来のレーザマーキング装置で
複数個の加工部材をマーキングする場合の例を示すもの
である。図７において８はレーザ発振器、９は光ファイ
バ、１０はレーザビーム分岐光学系、１１ａ，１１ｂは
レーザビーム、１２ａ，１２ｂは反射鏡、１３ａ，１３
ｂは加工部材、１４ａ，１４ｂはレンズである。Next, FIG. 7 shows an example of marking a plurality of processed members by a conventional laser marking device. In FIG. 7, 8 is a laser oscillator, 9 is an optical fiber, 10 is a laser beam branching optical system, 11a and 11b are laser beams, 12a and 12b are reflecting mirrors, and 13a and 13 are shown.
Reference numeral b is a processed member, and 14a and 14b are lenses.
【０００８】以上のように構成されたレーザマーキング
装置について、以下その動作について説明する。The operation of the laser marking device constructed as above will be described below.
【０００９】レーザ発振器８のレーザ発振端に光ファイ
バ９の一端が接続され、この光ファイバ９の他端は、レ
ーザビーム分岐光学系１０に接続されている。このレー
ザビーム分岐光学系１０により、レーザ発振器８から発
振され、光ファイバ９を通ってレーザビーム分岐光学系
１０に伝送される単一レーザビームを２本のレーザビー
ム１１ａ，１１ｂに分岐し、反射鏡１２ａ，１２ｂおよ
びレンズ１４ａ，１４ｂを経由して複数個の加工部材１
３ａ，１３ｂがマーキングされる。One end of an optical fiber 9 is connected to the laser oscillation end of the laser oscillator 8, and the other end of the optical fiber 9 is connected to a laser beam branching optical system 10. The laser beam splitting optical system 10 splits a single laser beam oscillated from the laser oscillator 8 and transmitted through the optical fiber 9 to the laser beam splitting optical system 10 into two laser beams 11a and 11b, which are reflected. A plurality of processing members 1 via the mirrors 12a and 12b and the lenses 14a and 14b
3a and 13b are marked.
【００１０】[0010]
【発明が解決しようとする課題】しかしながら上記の従
来の加工部材の搬送方法の構成では加工部材搬入用およ
び搬出用の主搬送路２，５と複数個の加工部材の貯蔵装
置３ａ〜３ｄと貯蔵装置６ａ〜６ｄと主搬送路２，５間
で加工部材を搬送する複数個の副搬送路４ａ〜４ｄ，７
ａ〜７ｄがあり複雑な構成となっている。また、この搬
送方法では加工部材の位置決め部がないため加工部材へ
のマーキング位置精度が問題となる。However, in the construction of the above-described conventional method for conveying the processed members, the main conveyance paths 2 and 5 for loading and unloading the processed members, and the storage devices 3a to 3d for storing the plurality of processed members and the storage. A plurality of sub-conveyance paths 4a-4d, 7 for conveying the processed member between the devices 6a-6d and the main conveyance paths 2, 5.
There are a to 7d and the structure is complicated. Further, in this carrying method, since there is no positioning portion for the processed member, the marking position accuracy on the processed member becomes a problem.
【００１１】次に、従来の複数個の加工部材をマーキン
グする場合の構成ではレーザ発振器８で発振されたレー
ザビームをレーザビーム分岐光学系１０で複数のレーザ
ビーム１１ａ，１１ｂに分岐するという問題点を有して
いた。Next, in the conventional structure for marking a plurality of processed members, the laser beam oscillated by the laser oscillator 8 is split into a plurality of laser beams 11a and 11b by the laser beam splitting optical system 10. Had.
【００１２】また、従来の技術では加工部材１３の供給
および取出し時間，位置決め時間，マーキング確認時間
および多面体や円筒形加工部材の複数個所へのマーキン
グの場合、１面マーキング完了後次面への割出し時間の
間マーキングを停止しなければならないという問題を有
していた。Further, in the prior art, in the case of supplying and taking out the processed member 13, positioning time, marking confirmation time and marking on a plurality of places of a polyhedron or a cylindrical processed member, the division to the next surface after completion of the marking on one surface There was a problem that the marking had to be stopped during the delivery time.
【００１３】本発明は上記従来の問題点を解決し、簡単
な構成で確実なマーキングが行えるレーザマーキング装
置を提供することを目的とする。SUMMARY OF THE INVENTION It is an object of the present invention to solve the above-mentioned problems of the prior art and to provide a laser marking device capable of reliable marking with a simple structure.
【００１４】[0014]
【課題を解決するための手段】この目的を達成するため
に本発明のレーザマーキング装置は割出し回転されるタ
ーンテーブル上に複数個の加工部材を保持する部材保持
部をターンテーブルの各ステーションに対応する数だけ
設け、上記ターンテーブルの周囲の１ステーションに加
工部材を部材保持部に供給また加工されたものを取出す
供給・取出し部を設け、次のステーションに部材保持部
に供給された加工部材の保持位置を決定する位置決め部
を設け、次のステーションに部材保持部に位置決めされ
た一個の部材にレーザを照射しレーザマーキングを施す
レーザ発生部とこのレーザマーキングされる隣りの位置
でレーザマーキングされた後の加工部材を自転させて次
のレーザマーキングに備える部材割出し部を設けた構成
になっている。To achieve this object, the laser marking apparatus of the present invention has a member holding portion for holding a plurality of processed members on each turntable which is indexed and rotated, at each station of the turntable. A corresponding number of processing members are provided at one station around the turntable to supply the processing member to the member holding unit and to supply and take out the processed product, and the processing member supplied to the member holding unit at the next station. A positioning unit that determines the holding position of the laser is placed at the next station, and one member positioned in the member holding unit is irradiated with laser to perform laser marking, and the laser generation unit that performs laser marking and laser marking at the position next to this laser marking. The machined member after being rotated is provided with a member indexing portion which is rotated to prepare for the next laser marking.
【００１５】[0015]
【作用】この構成によって、簡単な搬送システムを実現
し、ターンテーブル上に位置決め部を設けることで加工
部材へのマーキング位置精度が向上し、また、一系統の
レーザビームで複数個の加工部材をマーキングし、レー
ザマーキング停止時間を大幅に削減できるとともに、多
面体や円筒形の加工部材の複数個所へのマーキングが可
能となる。With this configuration, a simple transfer system is realized, and the positioning position on the turntable improves the marking position accuracy on the processed member, and a plurality of processed members can be processed by a single laser beam. Marking can be performed, and the laser marking stop time can be greatly reduced, and marking on multiple points of a polyhedral or cylindrical processed member becomes possible.
【００１６】[0016]
【実施例】以下、本発明の一実施例について図面を参照
しながら説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.
【００１７】図１は本発明のレーザマーキング装置の一
実施例を示すものである。図１において、２１は加工部
材の貯蔵部、２２は主搬送路、２３は供給・取出し部、
２４ａ〜２４ｂはチャック、２５はターンテーブル、２
６ａ〜２６ｄは部材保持部、２７は位置決め部、２８は
レーザ発生部、２９はレーザマーキング部、３０は部材
割出し部、３１はマーキング確認部、３２はマーキング
済加工部材の貯蔵部である。FIG. 1 shows an embodiment of the laser marking apparatus of the present invention. In FIG. 1, reference numeral 21 is a storage member for processing members, 22 is a main transport path, 23 is a supply / removal section,
24a to 24b are chucks, 25 is a turntable, 2
Reference numerals 6a to 26d are member holding portions, 27 is a positioning portion, 28 is a laser generating portion, 29 is a laser marking portion, 30 is a member indexing portion, 31 is a marking confirmation portion, and 32 is a storage portion for marked processed members.
【００１８】なお、本実施例は多面体の加工部材であ
り、また、ターンテーブル２５上に部材保持部２６ａ〜
２６ｄが４ヵ所あり、各箇所に３個ずつ計１２個の部材
保持部がある。The present embodiment is a processed member of a polyhedron, and the member holding portions 26a to 26a on the turntable 25.
There are four 26d, and there are a total of 12 member holding parts, three at each position.
【００１９】以上のように構成されたレーザマーキング
装置について以下その動作を説明する。The operation of the laser marking device configured as described above will be described below.
【００２０】まず加工部材が加工部材の貯蔵部２１より
加工部材の主搬送路２２（たとえばフリーフローコンベ
ア）へ移替えられる。主搬送路２２上に並んだ複数個の
加工部材はチャック２４ａで保持し、供給・取出し部２
３でターンテーブル２５上の部材保持部２６ａへ移替え
られると同時に複数個（本実施例では３個）の加工済の
部材がチャック２４ｂで保持され、供給・取出し部２３
でターンテーブル２５上の部材保持部２６ａより主搬送
路２２へ移替えられる。First, the processed member is transferred from the processed member storage unit 21 to the main conveying path 22 for the processed member (for example, a free flow conveyor). A plurality of processing members lined up on the main conveyance path 22 is held by a chuck 24a, and the feeding / unloading unit 2
3 is transferred to the member holding portion 26a on the turntable 25, and at the same time, a plurality of (three in this embodiment) processed members are held by the chuck 24b, and the supply / unloading portion 23 is held.
Then, the member holding portion 26a on the turntable 25 is transferred to the main transport path 22.
【００２１】複数個の加工部材が主搬送路２２よりター
ンテーブル２５上の部材保持部２６ａに移替えられた
後、ターンテーブル２５が回転割出しされ、部材保持部
２６ａ上の複数個の加工部材が位置決め部２７へ移動す
る。部材保持部２６ａ上の複数個の加工部材が位置決め
部２７で高さ方向および回転方向の位置決めがなされ
る。高さ方向の位置決めは複数個の加工部材の上部を押
すことで、また、回転方向の位置決めは、部材保持部２
６ａを回転することで部材保持部２６ａ上の複数個の加
工部材をそれぞれ回転させ、位置決め位置で各加工部材
を停止させ位置決めする。位置決め完了後、ターンテー
ブル２５が回転割出しされ、部材保持部上の複数個の加
工部材がレーザマーキング部２９へ移動する。部材保持
部２６ａ上の複数個の加工部材の１個の第１面にレーザ
発生部２８からのレーザ光を照射しレーザマーキングを
施す。レーザマーキング完了後隣りの加工部材の第１面
にレーザマーキングを施す。この間先にレーザマーキン
グ完了の加工部材は部材保持部２６ａを部材割出し部３
０により回転割出しさせ、加工部材の第２面目へのレー
ザマーキングのために回転割出しされる。この動作を複
数個の加工部材間で繰り返し、すべての加工部材へのレ
ーザマーキングが行われる。なお、図２に複数個の各加
工部材（１），（２），（３）へのレーザマーキングと
各加工部材の回転割出しのタイミングチャートを示す。After the plurality of processed members are transferred from the main transport path 22 to the member holding portion 26a on the turntable 25, the turntable 25 is rotationally indexed and the plurality of processed members on the member holding portion 26a. Moves to the positioning unit 27. The plurality of processed members on the member holding portion 26a are positioned in the height direction and the rotation direction by the positioning portion 27. Positioning in the height direction is performed by pushing the upper portions of a plurality of processed members, and positioning in the rotation direction is performed by the member holding portion 2.
By rotating 6a, each of the plurality of processed members on the member holding portion 26a is rotated, and each processed member is stopped and positioned at the positioning position. After the positioning is completed, the turntable 25 is rotationally indexed, and the plurality of processed members on the member holding unit move to the laser marking unit 29. The laser beam from the laser generator 28 is irradiated onto one first surface of the plurality of processed members on the member holder 26a to perform laser marking. After the completion of laser marking, laser marking is performed on the first surface of the adjacent processed member. In the meantime, the processed member for which the laser marking has been completed is provided with the member holding portion 26a and the member indexing portion 3
It is rotationally indexed by 0, and rotationally indexed for laser marking on the second surface of the processed member. This operation is repeated among a plurality of processed members to perform laser marking on all the processed members. In addition, FIG. 2 shows a timing chart of laser marking on each of the plurality of processed members (1), (2) and (3) and rotation indexing of each processed member.
【００２２】複数個の加工部材全てのレーザマーキング
完了後ターンテーブル２５が回転割出しされ、部材保持
部２６ａ上の複数個の加工済部材がマーキング確認部３
１へ移動する。部材保持部２６ａ上の複数個の加工済部
材１個ずつ回転割出ししながらカメラ等を用いて外観検
査しマーキング，文字，図形などを確認検査する。な
お、このステーションはマーキング確認のみならず他の
目的にも利用できる。複数個の加工済部材すべてのマー
キングが確認検査された後、ターンテーブル２５が回転
割出しされ、部材保持部２６ａ上の複数個の加工済部材
が供給・取出し部２３へ移動する。そこで、前記したよ
うに、複数個の加工済部材はチャック２４ｂで保持さ
れ、供給・取出し部２３でターンテーブル２５上の部材
保持部２６ａより主搬送路２２へ移替えられる。その
後、加工済部材は主搬送路２２よりマーキング済加工部
材の貯蔵部３２へと移替えられ収納される。After completion of laser marking of all the plurality of processed members, the turntable 25 is rotationally indexed, and the plurality of processed members on the member holding portion 26a are marked by the marking confirmation unit 3.
Move to 1. While rotating and indexing a plurality of processed members one by one on the member holding portion 26a, the appearance is inspected by using a camera or the like, and the markings, characters, figures and the like are confirmed and inspected. This station can be used for other purposes as well as marking confirmation. After the markings of all the plurality of processed members are confirmed and inspected, the turntable 25 is rotationally indexed, and the plurality of processed members on the member holding portion 26a are moved to the supply / removal unit 23. Therefore, as described above, the plurality of processed members are held by the chuck 24b and transferred from the member holding section 26a on the turntable 25 to the main transport path 22 by the supply / removal section 23. Then, the processed member is transferred from the main transport path 22 to the marked processed member storage unit 32 and is stored therein.
【００２３】図３〜図５に本発明のレーザマーキング装
置のターンテーブル部上の部材保持部および部材割出し
部の詳細図を示し、レーザマーキングと加工部材の動き
について詳細に説明する。図３〜図５において、３３は
加工部材、３４はレーザ光、２６は部材保持部、３５は
回転軸（Ａ）、３６はホルダ（Ａ）、３７は軸受
（Ａ）、２５はターンテーブル、３９はブレーキ取付
板、４０はブレーキ板、４１はバネ、４２はブレーキリ
ング、４３はカムフォロア取付板、４４はカムフォロ
ア、４５はガイドプレート、４６は回転軸（Ｂ）、４７
はホルダ（Ｂ）、４８は軸受（Ｂ）、４９はベアリング
ナット、５０はタイミングプーリ（Ａ）、５１は検出
板、５２はセンサ、５３はセンサ取付板、５４はタイミ
ングベルト、５５はタイミングプーリ（Ｂ）、５６はモ
ータ、５９はモータ取付板、５８はフレンジシャフト、
５９はインデックスユニット、６０はベース、６１は筐
体である。3 to 5 show detailed views of the member holding portion and the member indexing portion on the turntable portion of the laser marking apparatus of the present invention, and the laser marking and the movement of the processed member will be described in detail. 3 to 5, 33 is a processed member, 34 is a laser beam, 26 is a member holding portion, 35 is a rotating shaft (A), 36 is a holder (A), 37 is a bearing (A), 25 is a turntable, 39 is a brake mounting plate, 40 is a brake plate, 41 is a spring, 42 is a brake ring, 43 is a cam follower mounting plate, 44 is a cam follower, 45 is a guide plate, 46 is a rotating shaft (B), 47
Is a holder (B), 48 is a bearing (B), 49 is a bearing nut, 50 is a timing pulley (A), 51 is a detection plate, 52 is a sensor, 53 is a sensor mounting plate, 54 is a timing belt, and 55 is a timing pulley. (B), 56 is a motor, 59 is a motor mounting plate, 58 is a flange shaft,
Reference numeral 59 is an index unit, 60 is a base, and 61 is a housing.
【００２４】以上のように構成されたレーザマーキング
装置のターンテーブル部上の部材保持部および部材割出
し部について、以下その機構ならびに動作とレーザマー
キングについて説明する。The mechanism and operation of the member holding portion and the member indexing portion on the turntable portion of the laser marking apparatus having the above-described structure will be described below.
【００２５】まず複数個の加工部材３３が位置決め部に
て位置決め完了後インデックスユニット５９の入力軸が
回転し、出力軸に取付けられたフランジシャフト５８を
かえしてターンテーブル２５が回転割出しされる。その
時、カムフォロア４４は図５に示すようにガイドプレー
ト４５と回転軸（Ｂ）４６にある溝の中をころがりなが
ら位置決め部２７よりレーザマーキング部２９へと移動
する。レーザマーキング部２９へ移動した複数個の加工
部材３３の１個目の第１面にレーザ発生部からのレーザ
光３４を照射しレーザマーキングを施す。加工部材３３
の１個目の第１面のレーザマーキングが完了すると隣り
の加工部材３３（２個目）の第１面にレーザマーキング
を施す。この間先にレーザマーキングが完了した１個目
の加工部材３３は第１面より第２面へと回転割出しされ
る。この機構および動作について詳細に説明すると、加
工部材３３は部材保持部２６により保持されている。部
材保持部２６は回転軸（Ａ）３５に取付けてあり、ホル
ダ（Ａ）３６と軸受（Ａ）３７によりターンテーブル２
５上で回転できるようになっている。この回転軸（Ａ）
３５にはブレーキリング４２が取付けてあり、ブレーキ
取付板３９よりバネ４１のバネ力によりブレーキ板４０
をブレーキリング４２に押えつけることで回転軸（Ａ）
３５，部材保持部２６と加工部材３３の回転オーバーラ
ンを防ぐ構造になっている。また、回転軸（Ａ）３５の
端にカムフォロア取付板４３でカムフォロア４４が取付
けてある。このカムフォロア４４は回転軸（Ｂ）４６の
溝にはまっている。回転軸（Ｂ）４６はガイドプレート
４５に取付けているホルダ（Ｂ）４７と軸受（Ｂ）４８
により回転できる。なお軸受（Ｂ）４８はベアリングナ
ット４９で固定されている。筐体６１上のベース６０に
取付けられたモータ取付板５７上のモータ５６を回転さ
せることでタイミングプーリ（Ｂ）５５，タイミングベ
ルト５４，タイミングプーリ（Ａ）５０を通じ、回転軸
（Ｂ）４６は回転する。また回転軸（Ｂ）４６の回転方
向の原点および回転角度はセンサ取付板５３に取付けら
れたセンサ５２と検出板５１で確認できる機構となって
いる。First, after the positioning of the plurality of processing members 33 at the positioning portion, the input shaft of the index unit 59 rotates, the flange shaft 58 attached to the output shaft is replaced, and the turntable 25 is rotationally indexed. At that time, the cam follower 44 moves from the positioning portion 27 to the laser marking portion 29 while rolling in the groove formed in the guide plate 45 and the rotary shaft (B) 46 as shown in FIG. Laser marking 34 is applied by irradiating the laser beam 34 from the laser generator to the first first surface of the plurality of processing members 33 that have moved to the laser marking unit 29. Processing member 33
When the laser marking of the first surface of the first piece is completed, the laser marking is performed on the first surface of the adjacent processed member 33 (second piece). In the meantime, the first processed member 33 whose laser marking has been completed earlier is rotationally indexed from the first surface to the second surface. The mechanism and operation will be described in detail. The processing member 33 is held by the member holding portion 26. The member holding portion 26 is attached to the rotary shaft (A) 35, and the turntable 2 is held by the holder (A) 36 and the bearing (A) 37.
It can be rotated on 5. This rotation axis (A)
A brake ring 42 is attached to the brake plate 35.
The rotation axis (A)
35, the structure for preventing the rotational overrun of the member holding portion 26 and the processing member 33. Also, a cam follower 44 is attached to the end of the rotary shaft (A) 35 by a cam follower attachment plate 43. The cam follower 44 is fitted in the groove of the rotary shaft (B) 46. The rotating shaft (B) 46 has a holder (B) 47 attached to the guide plate 45 and a bearing (B) 48.
Can be rotated by. The bearing (B) 48 is fixed by a bearing nut 49. By rotating the motor 56 on the motor mounting plate 57 mounted on the base 60 on the housing 61, the rotary shaft (B) 46 passes through the timing pulley (B) 55, the timing belt 54, and the timing pulley (A) 50. Rotate. The origin and the rotation angle of the rotating shaft (B) 46 in the rotating direction can be confirmed by the sensor 52 and the detecting plate 51 mounted on the sensor mounting plate 53.
【００２６】そこで、加工部材３３の第１面のレーザマ
ーキング完了の信号により、加工部材３３の第１面より
第２面への回転割出しが開始する。まず、モータ５６が
回転割出しの角度分だけ回転を始める。タイミングプー
リ（Ｂ）５５，タイミングベルト５４，タイミングプー
リ（Ａ）５０を通じて回転軸（Ｂ）４６が回転する。回
転軸（Ｂ）４６の溝にはまっているカムフォロア４４と
カムフォロア取付板４３を介して回転軸（Ａ）３５が回
転し、その上に取付けられた部材保持部２６，加工部材
３３も回転する。モータ５６により回転割出しの角度分
だけ回転したか回転軸（Ｂ）４６端に取付けてある検出
板５１とセンサ５２で確認し加工部材３３の回転割出し
が完了する。Then, the rotation indexing from the first surface of the processing member 33 to the second surface is started by the signal of the laser marking completion of the first surface of the processing member 33. First, the motor 56 starts to rotate by the rotation index angle. The rotary shaft (B) 46 rotates through the timing pulley (B) 55, the timing belt 54, and the timing pulley (A) 50. The rotary shaft (A) 35 rotates via the cam follower 44 and the cam follower mounting plate 43 fitted in the groove of the rotary shaft (B) 46, and the member holding portion 26 and the processing member 33 mounted thereon also rotate. It is confirmed by the detection plate 51 and the sensor 52 attached to the end of the rotary shaft (B) 46 whether the motor 56 has rotated by the rotation indexing angle, and the rotation indexing of the processing member 33 is completed.
【００２７】以上の動作が複数個の加工部材３３に渡り
全ての加工面の順に割出し回転，レーザマーキングがな
され再び複数個の加工部材３３が回転原点（検出板５１
とセンサ５２で確認）にくると複数個の加工部材３３の
全面にレーザマーキングが施され、レーザマーキング完
了となる。続いて、インデックスユニット５９，フラン
ジシャフト５８によりターンテーブル２５が回転し、新
しい複数個の加工部材３３がレーザマーキング部２９へ
と移動する。By the above operation, all the machining surfaces are indexed, rotated and laser-marked over a plurality of machining members 33 in order, and the plurality of machining members 33 are rotated again.
Then, the laser marking is performed on the entire surfaces of the plurality of processing members 33, and the laser marking is completed. Then, the turntable 25 is rotated by the index unit 59 and the flange shaft 58, and a plurality of new processing members 33 are moved to the laser marking portion 29.
【００２８】なお、以上は多面体の加工部材３３へのレ
ーザマーキングの場合の例であるが円筒形，円柱形等の
加工部材の場合は上記の方法でも、また加工部材を部材
割出し部３０で連続回転させながらレーザマーキングを
施すことでも可能となる。The above is an example in the case of laser marking on the polyhedral processing member 33, but in the case of a cylindrical or cylindrical processing member, the above method is also used, and the processing member is processed by the member indexing portion 30. It is also possible to perform laser marking while continuously rotating.
【００２９】[0029]
【発明の効果】以上のように本発明は簡単な搬送システ
ムの実現および１系統のレーザビームで複数個の加工部
材をレーザマーキングすることで設備価格を低減するこ
とができる。また、ターンテーブル上に位置決め部およ
びマーキング確認部を設けることでレーザマーキングの
品質の確保，保証ができる。さらに、複数個の加工部材
へのレーザマーキングと加工面の回転割出しを連続的に
行うことでレーザマーキング停止時間が大幅に削減でき
生産性が向上する。また、多面体や円筒形，円柱形の加
工部材の複数箇所へのレーザマーキングが可能となる。As described above, according to the present invention, it is possible to reduce the equipment cost by realizing a simple transfer system and laser marking a plurality of processed members with one laser beam. Further, by providing the positioning portion and the marking confirmation portion on the turntable, the quality of laser marking can be secured and guaranteed. Further, by continuously performing laser marking on a plurality of processed members and rotational indexing of the processed surface, the laser marking stop time can be greatly reduced and the productivity is improved. Further, it is possible to perform laser marking on a plurality of points of a polyhedral, cylindrical or cylindrical processed member.
【図１】本発明のレーザマーキング装置の一実施例を示
す概略構成図FIG. 1 is a schematic configuration diagram showing an embodiment of a laser marking device of the present invention.
【図２】同レーザマーキングと各加工部材の回転割出し
のタイミングチャートFIG. 2 is a timing chart of the same laser marking and rotation indexing of each processed member.
【図３】同装置の上面図FIG. 3 is a top view of the device.
【図４】同装置の要部断面正面図FIG. 4 is a sectional front view of the main part of the device.
【図５】同図４のＡ−Ａからみた上面図FIG. 5 is a top view seen from AA in FIG.
【図６】従来のレーザマーキング装置の概略構成図FIG. 6 is a schematic configuration diagram of a conventional laser marking device.
【図７】同装置の動作説明図FIG. 7 is an operation explanatory diagram of the device.
２１ 加工部材の貯蔵部 ２２ 主搬送路 ２３ 供給・取出し部 ２４ａ，２４ｂ チャック ２５ ターンテーブル ２６ａ〜２６ｄ 部材保持部 ２７ 位置決め部 ２８ レーザ発生部 ２９ レーザマーキング部 ３０ 部材割出し部 ３１ マーキング確認部 ３２ マーキング済加工部材の貯蔵部 21 Processing Material Storage Section 22 Main Conveying Path 23 Supply / Ejection Section 24a, 24b Chuck 25 Turntable 26a-26d Member Holding Section 27 Positioning Section 28 Laser Generation Section 29 Laser Marking Section 30 Member Indexing Section 31 Marking Confirmation Section 32 Marking Storage part for processed parts
───────────────────────────────────────────────────── フロントページの続き (72)発明者 高木 昌博 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 (72)発明者 間井谷 弘行 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Masahiro Takagi 1006 Kadoma, Kadoma City, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Hiroyuki Maitani, 1006 Kadoma, Kadoma City, Osaka Matsushita Electric Industrial Co., Ltd.
Claims (1)
個の加工部材を保持する部材保持部をターンテーブルの
各ステーションに対応する数だけ設け、上記ターンテー
ブルの周囲の１ステーションに加工部材を部材保持部に
供給また加工されたものを取出す供給・取出し部を設
け、次のステーションに部材保持部に供給された加工部
材の保持位置を決定する位置決め部を設け、次のステー
ションに部材保持部に位置決めされた一個の部材にレー
ザを照射しレーザマーキングを施すレーザ発生部とこの
レーザマーキングされる隣りの位置でレーザマーキング
された後の加工部材を自転させて次のレーザマーキング
に備える割出部を設けてなるレーザマーキング装置。1. A number of member holding portions for holding a plurality of processing members are provided on a turntable that is index-rotated, the number of which corresponds to each station of the turntable, and the processing members are provided at one station around the turntable. The member holding unit is provided with a supply / removal unit for taking out the processed or supplied product, the positioning station for determining the holding position of the processed member supplied to the member holding unit is provided at the next station, and the member holding unit is provided at the next station. A laser generator that irradiates a laser to one member positioned in the position to perform laser marking and an indexing unit that prepares for the next laser marking by rotating the machined member after laser marking at the position adjacent to this laser marking A laser marking device provided with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3227768A JP2833284B2 (en) | 1991-09-09 | 1991-09-09 | Laser marking device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3227768A JP2833284B2 (en) | 1991-09-09 | 1991-09-09 | Laser marking device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0569164A true JPH0569164A (en) | 1993-03-23 |
| JP2833284B2 JP2833284B2 (en) | 1998-12-09 |
Family
ID=16866079
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3227768A Expired - Fee Related JP2833284B2 (en) | 1991-09-09 | 1991-09-09 | Laser marking device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2833284B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09225659A (en) * | 1996-01-05 | 1997-09-02 | Lazare Kaplan Internatl Inc | Mark forming system by laser |
| US5986235A (en) * | 1996-01-24 | 1999-11-16 | Micron Electronics, Inc. | Method of efficiently laser marking singulated semiconductor devices |
| DE10362303B4 (en) * | 2002-08-02 | 2011-01-27 | Mauser-Werke Oberndorf Maschinenbau Gmbh | Device for surface structuring |
| CN105618935A (en) * | 2016-03-28 | 2016-06-01 | 天津宏光伟业激光科技有限公司 | CO2 laser marking machine |
-
1991
- 1991-09-09 JP JP3227768A patent/JP2833284B2/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09225659A (en) * | 1996-01-05 | 1997-09-02 | Lazare Kaplan Internatl Inc | Mark forming system by laser |
| JP3238875B2 (en) * | 1996-01-05 | 2001-12-17 | ラザール カプラン インターナショナル，インコーポレイティド | Apparatus and method for micro-engraving by laser energy |
| US5986235A (en) * | 1996-01-24 | 1999-11-16 | Micron Electronics, Inc. | Method of efficiently laser marking singulated semiconductor devices |
| DE10362303B4 (en) * | 2002-08-02 | 2011-01-27 | Mauser-Werke Oberndorf Maschinenbau Gmbh | Device for surface structuring |
| CN105618935A (en) * | 2016-03-28 | 2016-06-01 | 天津宏光伟业激光科技有限公司 | CO2 laser marking machine |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2833284B2 (en) | 1998-12-09 |
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