JPH0567027U - Through electrode of substrate - Google Patents
Through electrode of substrateInfo
- Publication number
- JPH0567027U JPH0567027U JP1241892U JP1241892U JPH0567027U JP H0567027 U JPH0567027 U JP H0567027U JP 1241892 U JP1241892 U JP 1241892U JP 1241892 U JP1241892 U JP 1241892U JP H0567027 U JPH0567027 U JP H0567027U
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electrode
- hole
- magnetic
- reduced
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Measuring Magnetic Variables (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】
【目的】 磁気センサを小型化すると共に、磁気的影響
を解消する。
【構成】 基板１０の表面には磁気検知部１３を形成す
ると共に、裏面には端子１４を形成し、基板１０の表裏
方向に貫通して導電性を有する貫通電極１１を設け、こ
の貫通電極１１の一端面に磁気検知部１３の少なくとも
一部を重合接続する。
【効果】 基板の表面に略磁気検知部のみが形成され、
リード電極等を形成しなくても良いことから、チップ面
積が小さくなり小型化が可能となってコストを低減させ
ることができると共に、リード電極に対する磁気的影響
を解消することができる。また、チップ面積が小さいこ
とから、封止によるピンホールが生じ難くなって不良を
減少させることができる。
(57) [Abstract] [Purpose] To reduce the size of the magnetic sensor and eliminate the magnetic influence. A magnetic detection section 13 is formed on a front surface of a substrate 10, terminals 14 are formed on a rear surface thereof, and a through electrode 11 having conductivity is provided so as to penetrate through the substrate 10 in the front and back directions. At least a part of the magnetic sensing portion 13 is superposed and connected to one end surface of the. [Effect] Only the magnetic sensing portion is formed on the surface of the substrate,
Since it is not necessary to form the lead electrode or the like, the chip area can be reduced, the size can be reduced, the cost can be reduced, and the magnetic influence on the lead electrode can be eliminated. Moreover, since the chip area is small, pinholes due to sealing are less likely to occur, and defects can be reduced.
Description
【０００１】[0001]
本考案は、基板の貫通電極に関する。さらに詳述すると、本考案は、特に基板 の表面に磁気抵抗素子やホール素子等を形成した磁気センサに好適な基板の貫通 電極に関する。 The present invention relates to a through electrode of a substrate. More specifically, the present invention relates to a through electrode of a substrate, which is suitable for a magnetic sensor in which a magnetoresistive element, a Hall element or the like is formed on the surface of the substrate.
【０００２】[0002]
この種の基板の貫通電極は、図４に示すようにセラミック等からなる基板１０ は、図示前方端近傍に１個所、及び後方端近傍の２個所に、基板１０の表裏方向 に貫通する貫通電極１１が設けられている。貫通電極１１は基板１０に穿設した 貫通孔内に、銀ペースト１２等を充填し、その後、熱処理を施すことによって形 成される。 As shown in FIG. 4, the through electrode of this type of substrate is a substrate 10 made of ceramic or the like, which penetrates in the front and back directions of the substrate 10 at one location near the front end and two locations near the rear end. 11 is provided. The through electrode 11 is formed by filling the through hole formed in the substrate 10 with the silver paste 12 or the like, and then performing heat treatment.
【０００３】 上記基板１０の表面には、磁気抵抗素子用の磁性体金属からなる薄膜状の磁気 検知部１３が形成されている。磁気検知部１３は、図示のように２本のストライ プＡ，Ｂが並設されていて、ストライプＡ，Ｂを形成する際に各端部の一部を貫 通電極１１の端面に重合するように接続させている。さらに、基板１０の表面に は、図５に示すようにシリコン酸化物、エポキシ樹脂等の封止材１５を被覆して 磁気検知部１３及び貫通電極１１の端面を外部からの物理的化学物ダメージから 保護している。また、基板１０の裏面は、貫通電極１１の端面を露出させて端子 １４とし、図示しない他の制御回路等に接続される。On the surface of the substrate 10 is formed a thin film magnetic detection portion 13 made of a magnetic metal for a magnetoresistive element. As shown in the figure, the magnetic detection unit 13 has two stripes A and B arranged in parallel, and when forming the stripes A and B, a part of each end is overlapped with the end surface of the penetrating electrode 11. Are connected. Further, the surface of the substrate 10 is covered with a sealing material 15 such as silicon oxide or epoxy resin as shown in FIG. Are protected from In addition, the back surface of the substrate 10 exposes the end surface of the through electrode 11 to serve as a terminal 14, which is connected to another control circuit (not shown) or the like.
【０００４】[0004]
上記従来の基板の貫通電極において、基板１０の貫通孔内に、銀ペースト１２ を充填した後に熱処理を施すと、銀ペースト１２が収縮することから、図５に誇 張して示すように、貫通孔と銀ペースト１２との間に隙間ｇが発生する。この結 果、銀ペースト１２が貫通孔から抜け落ちてしまう問題点がある。また、基板１ ０と貫通電極１１の熱膨張係数の相違から、当初は保持されていても、その後に 基板１０を使用中に振動や温度変化等の外部応力が加わる等によって抜け落ちて しまい、電気的接続不良となり、信頼性が低下してしまう問題点もあった。 In the conventional through electrode of the substrate described above, when the heat treatment is performed after the silver paste 12 is filled in the through hole of the substrate 10, the silver paste 12 shrinks. Therefore, as shown exaggeratedly in FIG. A gap g is generated between the hole and the silver paste 12. As a result, there is a problem that the silver paste 12 falls off from the through hole. In addition, due to the difference in the thermal expansion coefficient between the substrate 10 and the through electrode 11, even if the substrate 10 is initially held, it will fall off afterwards due to external stress such as vibration or temperature change while the substrate 10 is in use. There is also a problem that the reliability is lowered due to poor connection.
【０００５】 本考案は、このような問題点を解消するためになされたもので、基板に貫通し て設けた貫通電極の抜け落ちを防止し、信頼性を向上させることのできる基板の 貫通電極を提供することを目的とする。The present invention has been made in order to solve such a problem, and provides a through electrode of a substrate capable of preventing the through electrode provided through the substrate from coming off and improving the reliability. The purpose is to provide.
【０００６】[0006]
本考案は、基板の表裏方向に貫通する貫通孔内に設けた導電性を有する貫通電 極であって、上記貫通孔は円形や多角形の基本形状から内方に向かう複数の突起 部を形成したことを特徴とする。 The present invention is a through-electrode having conductivity provided in a through-hole penetrating in the front-back direction of a substrate, wherein the through-hole has a plurality of protrusions directed inward from a circular or polygonal basic shape. It is characterized by having done.
【０００７】[0007]
基板の貫通孔を円形や多角形の基本形状から内方に向かう複数の突起部を形成 すると、貫通電極となる銀ペースト等と貫通孔の内面との接触面積が大きくなっ て、複数の個所で係止されるので貫通孔からの抜け落ちが抑制され、信頼性が向 上する。また、貫通孔の内面の面積が大きくなることから、貫通電極が導電体膜 の場合には、導電部分の面積が増加して抵抗値が減少する。 If a plurality of protrusions are formed inward from the basic shape of a circle or polygon in the through-hole of the board, the contact area between the silver paste etc., which will be the through-electrode, and the inner surface of the through-hole becomes large, and at multiple locations. Since it is locked, falling out of the through hole is suppressed and reliability is improved. In addition, since the area of the inner surface of the through hole becomes large, when the through electrode is a conductor film, the area of the conductive portion increases and the resistance value decreases.
【０００８】[0008]
以下、図１及び図２を参照しながら本考案にかかる基板の貫通電極の実施例に ついて説明する。 基板１は、例えば感光性結晶化ガラスが用いられ、図１に示すように基板１の 表裏方向に貫通する貫通電極２が設けられている。貫通電極１１は感光性結晶化 ガラスに予め形成された貫通孔３の内部に形成されている。貫通孔３は感光性結 晶化ガラスに所望の形状に紫外線を照射し、熱処理を施した後に弗酸によって、 紫外線照射部分を溶解することにより、フォトリソグラフィの精度で容易に貫通 孔３が形成できる。図２は貫通孔３の一例を示し、あたかも３弁の花弁のような 形状に形成されている。各花弁等の間には内方に向かう３個の突起部４が形成さ れている。さらに各突起部４の先端間の入口部分の開口寸法Ｗ１を、奥部分の寸 法Ｗ２よりも狭くなるように形成されている。即ち、図２に示す貫通孔３は、基 本形状が円形であり、この円形の内面から中心方向の内方に向けて複数の突起部 ４を形成したものである。 Hereinafter, an embodiment of a through electrode of a substrate according to the present invention will be described with reference to FIGS. 1 and 2. The substrate 1 is made of, for example, photosensitive crystallized glass, and as shown in FIG. 1, the through electrodes 2 are provided so as to penetrate the substrate 1 in the front and back directions. The through electrode 11 is formed inside the through hole 3 previously formed in the photosensitive crystallized glass. The through holes 3 are easily formed with photolithographic accuracy by irradiating the photosensitive crystallized glass with ultraviolet rays in a desired shape, heat-treating it, and then dissolving the ultraviolet rays irradiated portion with hydrofluoric acid. it can. FIG. 2 shows an example of the through hole 3, which is formed like a petal of three valves. Three protrusions 4 are formed inward between the petals. Further, the opening size W1 of the entrance portion between the tips of the protrusions 4 is formed to be narrower than the dimension W2 of the inner portion. That is, the through hole 3 shown in FIG. 2 has a basic shape of a circle, and a plurality of protrusions 4 are formed from the inner surface of the circle toward the center inward.
【０００９】 上記貫通孔３の形状としては、図３（ａ）に示すように、基本形状を四角形と して対向する２辺に突起部４を形成したり、さらに、図３（ｂ）に示すように５ 角形を基本形状として、星形のように５個の突起部４を形成してもよい。また、 円形の場合には、図３（ｃ）に示すように内方に向かう３個の突起部４を形成す るようにしてもよい。As for the shape of the through hole 3, as shown in FIG. 3 (a), the basic shape is a quadrangle and the protrusions 4 are formed on two opposite sides, and further, in FIG. 3 (b). As shown, a pentagon may be used as a basic shape and five protrusions 4 may be formed like a star. In the case of a circular shape, three protrusions 4 that face inward may be formed as shown in FIG.
【００１０】 このように形成された基板１の貫通孔３には、内部に銀ペースト５もしくは銅 ペーストをスクリーン印刷等によって充填し、その後、熱処理を施すことによっ て貫通電極２が形成される。銀ペースト５は熱処理によって収縮するが、前述の 如く、貫通孔４の入口部分が奥部分よりも狭く形成されていることから、収縮に よって入口部分に食い込むことから、内部の貫通電極２は貫通孔４の内面に接合 して抜け落ちが阻止される。尚、貫通電極２としては、貫通孔４の内面に導電体 膜を中空筒状に形成したものであってもよい。その後、必要に応じて貫通電極２ の開口端を基板１の表裏面と同一面となるように平坦に研磨している。The through hole 3 of the substrate 1 thus formed is filled with silver paste 5 or copper paste by screen printing or the like, and then heat treated to form the through electrode 2. .. Although the silver paste 5 shrinks due to heat treatment, as described above, since the entrance part of the through hole 4 is formed narrower than the inner part, it contracts into the entrance part due to contraction, so that the penetration electrode 2 inside penetrates. It is bonded to the inner surface of the hole 4 and is prevented from falling off. The through electrode 2 may be one in which a conductor film is formed in a hollow cylindrical shape on the inner surface of the through hole 4. Then, if necessary, the open ends of the through electrodes 2 are flatly polished so as to be flush with the front and back surfaces of the substrate 1.
【００１１】 以上のように構成した基板１を用いて磁気抵抗素子を制作するには、前述と同 様に、基板１の表面に例えばパーマロイ或いはニッケル−コバルト等磁性体金属 からなる薄膜状の磁気抵抗素子をスパッタリング、真空蒸着、或いはエッチング 等の手段によって２本のストライプＡ，Ｂを形成し、磁気検知部１３を形成すれ ばよい。そして、磁気検知部１３の２本のストライプＡ，Ｂは、各端部の一部が 貫通電極２の端面に重合するように接続させる。尚、上記基板１の応用例として は、磁気抵抗素子の他にホール素子であっても良い。In order to manufacture a magnetoresistive element using the substrate 1 configured as described above, in the same manner as described above, a thin film magnetic layer made of a magnetic metal such as permalloy or nickel-cobalt is formed on the surface of the substrate 1. The magnetic sensing portion 13 may be formed by forming the two stripes A and B on the resistance element by means of sputtering, vacuum deposition, etching or the like. Then, the two stripes A and B of the magnetic detection portion 13 are connected so that a part of each end portion is overlapped with the end surface of the through electrode 2. As an application example of the substrate 1, a Hall element may be used instead of the magnetoresistive element.
【００１２】 本考案は上記の各実施例に限定されるものではなく、貫通孔としては、前述の 形状の他に種々変形可能である。また、基板としては、感光性結晶化ガラスの他 にセラミック等を使用する等、本考案の要旨を逸脱しない範囲において種々変形 実施可能である。The present invention is not limited to the above embodiments, and the through hole can be variously modified in addition to the above-described shape. Further, as the substrate, other than the photosensitive crystallized glass, ceramic or the like can be used, and various modifications can be made without departing from the scope of the present invention.
【００１３】[0013]
以上の説明から明らかなように、本考案の基板の貫通電極によれば、基板の貫 通孔を円形や多角形の基本形状から内方に向かう複数の突起部を形成しているの で、貫通電極となる銀ペースト等と貫通孔の内面との接触面積が大きくなり、複 数の個所で係止されることから、貫通孔からの抜け落ちが抑制され信頼性を向上 することができる利点がある。また、貫通孔の内面の面積が大きくなるので、貫 通電極が導電体膜の場合には、導電部分の面積が増加するので抵抗値を減少させ ることができる利点もある。 As is clear from the above description, according to the through-electrode of the substrate of the present invention, the through-hole of the substrate is formed with a plurality of protrusions inward from the circular or polygonal basic shape. Since the contact area between the silver paste etc., which will be the through electrode, and the inner surface of the through hole is large, and it is locked at multiple points, there is an advantage that slipping out of the through hole can be suppressed and reliability can be improved. is there. Further, since the area of the inner surface of the through hole is large, the area of the conductive portion is increased when the penetrating electrode is a conductor film, so that there is also an advantage that the resistance value can be reduced.
【００１４】[0014]
【図１】本考案にかかる基板の貫通電極の一実施例を示
す斜視図である。FIG. 1 is a perspective view showing an embodiment of a through electrode of a substrate according to the present invention.
【図２】同上貫通孔の一例を示す要部平面図である。FIG. 2 is a plan view of an essential part showing an example of the through hole.
【図３】（ａ）（ｂ）（ｃ）は同上貫通孔の変形例を示
す平面図である。3 (a), (b) and (c) are plan views showing modified examples of the through hole.
【図４】従来の基板の貫通電極を示す斜視図である。FIG. 4 is a perspective view showing a through electrode of a conventional substrate.
【図５】同従来の基板の貫通電極を示す断面図である。FIG. 5 is a cross-sectional view showing a through electrode of the conventional substrate.
１ 基板 ２ 貫通電極 ３ 貫通孔 ４ 突起部 ５ 銀ペースト 1 Substrate 2 Through electrode 3 Through hole 4 Protrusion 5 Silver paste
Claims (1)
けた導電性を有する貫通電極であって、上記貫通孔は円
形や多角形の基本形状から内方に向かう複数の突起部を
形成してなる基板の貫通電極。1. A through electrode having conductivity provided in a through hole penetrating in a front and back direction of a substrate, wherein the through hole has a plurality of protrusions directed inward from a basic shape of a circle or a polygon. Through electrode of the substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1241892U JPH0567027U (en) | 1992-02-06 | 1992-02-06 | Through electrode of substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1241892U JPH0567027U (en) | 1992-02-06 | 1992-02-06 | Through electrode of substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0567027U true JPH0567027U (en) | 1993-09-03 |
Family
ID=11804726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1241892U Withdrawn JPH0567027U (en) | 1992-02-06 | 1992-02-06 | Through electrode of substrate |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0567027U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4728708B2 (en) * | 2005-06-17 | 2011-07-20 | 日本電気株式会社 | Wiring board and manufacturing method thereof |
-
1992
- 1992-02-06 JP JP1241892U patent/JPH0567027U/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4728708B2 (en) * | 2005-06-17 | 2011-07-20 | 日本電気株式会社 | Wiring board and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0186818B1 (en) | Chip to pin interconnect method | |
| JPH0567027U (en) | Through electrode of substrate | |
| JP3013968B2 (en) | Magnetic detector | |
| TWI778721B (en) | Flexible sensing device and manufacturing method thereof | |
| JPH0567026U (en) | Through electrode of substrate | |
| JPS6232637A (en) | Semiconductor device | |
| JPS61244035A (en) | Connection of bump electrodes | |
| JP3018132B2 (en) | Magnetoresistive element | |
| JPS6334268Y2 (en) | ||
| JPH0535584B2 (en) | ||
| JP3527798B2 (en) | Method of manufacturing magnetoresistive element | |
| JPS60242643A (en) | Wiring for electronic part | |
| JPH0642588B2 (en) | Manufacturing method of substrate for hybrid integrated circuit | |
| JPH02187081A (en) | Thin film thermocouple | |
| JP2937336B2 (en) | Method for manufacturing semiconductor memory device | |
| JPS6135976Y2 (en) | ||
| JPH04118979A (en) | Magnetic sensor and manufacture thereof | |
| JPS5911602A (en) | Negative temperature coefficient thermistor and method of producing same | |
| JPH04179288A (en) | Ceramic substrate for proximity sensor and its manufacture | |
| JPS61216371A (en) | Mold type magnetic resistance element | |
| JPS5814746B2 (en) | hand tai souchi no seizou houhou | |
| JPH03263886A (en) | Magnetic resistance element and manufacture thereof | |
| JPH0373148B2 (en) | ||
| JPH05267748A (en) | Magnetic sensor | |
| JPH02177579A (en) | Semiconductor magnetoresistance element and manufacture thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19960606 |