JPH0549291U - Transportable body of IC transport device - Google Patents
Transportable body of IC transport deviceInfo
- Publication number
- JPH0549291U JPH0549291U JP10036991U JP10036991U JPH0549291U JP H0549291 U JPH0549291 U JP H0549291U JP 10036991 U JP10036991 U JP 10036991U JP 10036991 U JP10036991 U JP 10036991U JP H0549291 U JPH0549291 U JP H0549291U
- Authority
- JP
- Japan
- Prior art keywords
- suction pad
- change kit
- movable body
- vacuum
- main body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】
【目的】 ＩＣ素子の品種対応に交換するチェンジキッ
トと可動体本体との接触部の真空シールを確実にする。
【構成】 チェンジキット１２の可動体本体１１への取
付け面１７の中央部に凹部２１が形成され、凹部２１の
底面に、ＩＣ素子吸着用と同一の吸着用パッド２２の基
部が取付けられ、チェンジキット１２を可動体本体１１
へ取付けた状態で、吸着用パッド２２の吸着口部分が本
体１１の取付け面１６に弾性的に接触して真空シールさ
れ、本体１１とチェンジキット１２との両真空ラインが
吸着用パッド２２で連結される。チェンジキット１２の
下端に吸着パッド１３が取付けられ、真空ライン１４に
よる真空引きにより、吸着パッド１３にＩＣ素子１５が
吸着される。
(57) [Summary] [Purpose] To ensure a vacuum seal at the contact part between the change kit and the movable body that are to be replaced according to the type of IC element. [Structure] A recess 21 is formed in a central portion of a mounting surface 17 of a change kit 12 to be mounted on a movable body 11, and a base of a suction pad 22 for adsorbing an IC element is attached to a bottom surface of the recess 21 for changing. Kit 12 is movable body 11
The suction port portion of the suction pad 22 elastically contacts the mounting surface 16 of the main body 11 and is vacuum-sealed in a state where the suction pad 22 is attached to both the vacuum lines of the main body 11 and the change kit 12 by the suction pad 22. To be done. The suction pad 13 is attached to the lower end of the change kit 12, and the IC element 15 is suctioned to the suction pad 13 by vacuuming by the vacuum line 14.
Description
【０００１】[0001]
この考案は例えばＩＣ試験装置に用いられ、ＩＣ素子を搬送可動体で真空引き 吸着して搬送するＩＣ搬送装置における上記搬送可動体に関する。 The present invention relates to the above-mentioned movable movable body used in an IC testing apparatus, for example, in an IC conveying apparatus which conveys an IC element by vacuum suction and adsorption by the movable movable body.
【０００２】[0002]
図２に従来のＩＣ搬送装置に用いられている搬送可動体を示す。搬送可動体の 本体１１の底面にチェンジキット（品種対応部）１２が取付けられ、チェンジキ ット１２はその下端部に吸着パッド１３を有する。本体１１及びチェンジキット １２を通じる真空ライン１４が形成され、吸着パッド１３をＩＣ素子１５と接触 又は接近させて、真空ライン１４から真空引きすることによりＩＣ素子１５を吸 着し、この状態で搬送可動体を移動させることによりＩＣ素子１５を搬送する。 FIG. 2 shows a transfer movable body used in a conventional IC transfer device. A change kit (model-corresponding part) 12 is attached to the bottom surface of the main body 11 of the transporting movable body, and the change kit 12 has a suction pad 13 at the lower end thereof. A vacuum line 14 passing through the main body 11 and the change kit 12 is formed, the suction pad 13 is brought into contact with or close to the IC element 15, and the IC element 15 is sucked by vacuuming from the vacuum line 14 and conveyed in this state. The IC element 15 is conveyed by moving the movable body.
【０００３】 ＩＣ素子１５の品種によりチェンジキット１２を交換して使用する。本体１１ のチェンジキット取付け面（底面）１６にチェンジキット１２の上面（取付け面 ）１７を押し付けて、本体１１をチェンジキット１２との接触部を真空シールし ている。あるいは本体１１のチェンジキット取付け面１６、チェンジキット１２ の取付け面１７の何れか側に、図２Ｂに示すようにＯリング１８を装着して、Ｏ リング１８により本体１１とチェンジキット１２との接触部を真空シールしてい る。The change kit 12 is exchanged and used depending on the type of the IC element 15. The upper surface (mounting surface) 17 of the change kit 12 is pressed against the change kit mounting surface (bottom surface) 16 of the main body 11 to vacuum-seal the contact portion of the main body 11 with the change kit 12. Alternatively, as shown in FIG. 2B, an O-ring 18 is attached to either side of the change kit mounting surface 16 of the main body 11 or the mounting surface 17 of the change kit 12, and the O-ring 18 makes contact between the main body 11 and the change kit 12. The part is vacuum-sealed.
【０００４】[0004]
チェンジキット取付け面１６とチェンジキット１２の取付け面１７との単なる 面接触で、これら接触部を真空シールするものにおいては、本体１１へのチェン ジキッド１２の取付けは、その交換を容易にするため、ワンプッシュ式の締結手 段を用いているため、取付け面１６と上面１７との圧接を十分強くすることが困 難であり、十分な真空シールが得られないことがある。特に本体１１の取付け面 １６、チェンジキット１２の取付け面１７の各平面度が十分でないと、両面１６ ，１７は密着しないため、ＩＣ素子１５に対する吸着口での真空圧が極端に下が り、ＩＣ素子１５を吸着できない場合が生じるおそれがある。 In the case where the change kit mounting surface 16 and the mounting surface 17 of the change kit 12 are simply surface-contacted to vacuum-seal these contact portions, the mounting of the change kid 12 to the main body 11 facilitates the replacement thereof. Since the one-push type fastening means is used, it is difficult to make the pressure contact between the mounting surface 16 and the upper surface 17 sufficiently strong, and a sufficient vacuum seal may not be obtained. In particular, if the flatness of each of the mounting surface 16 of the main body 11 and the mounting surface 17 of the change kit 12 is not sufficient, the both surfaces 16, 17 do not adhere to each other, and the vacuum pressure at the suction port for the IC element 15 is extremely lowered. There is a possibility that the IC element 15 cannot be adsorbed.
【０００５】 Ｏリング１８を用いる場合は、チェンジキット１２の締結力が十分でないと、 Ｏリング１８が十分一様に変形しないため、取付け面１６に対し、チェンジキッ ト１２が傾いてしまい、ＩＣ素子１５を吸着できないことが生じるおそれがある 。When the O-ring 18 is used, unless the fastening force of the change kit 12 is sufficient, the O-ring 18 does not deform sufficiently uniformly, so that the change kit 12 tilts with respect to the mounting surface 16, and the IC There is a possibility that the element 15 may not be adsorbed.
【０００６】[0006]
この考案によれば搬送可動体の本体とチェンジキットとの両取付け面の一方に も吸着用パッドが取付けられ、その吸着用パッドにより、可動体の本体とチェン ジキットとの接触部が真空シールされる。 According to this invention, a suction pad is attached to one of the mounting surfaces of both the main body of the movable body and the change kit, and the suction pad vacuum seals the contact portion between the main body of the movable body and the change kit. It
【０００７】[0007]
図１Ａにこの考案の実施例を示し、図２と対応する部分に同一符号を付けてあ る。この実施例ではチェンジキット１２の取付け面１７の中央部に凹部２１が形 成され、凹部２１の底面中央部にゴムなどの弾性体よりなる吸着用パッド２２が 取付けられる。この際吸着用パッド２２の貫通孔で本体１１側の真空ラインとチ ェンジキット１２の真空ラインとを連結し、かつ吸着用パッド２２の吸着口が本 体１１の取付け面１２に弾性的に接触するようにされる。このようにして吸着用 パッド２２により本体１１とチェンジキット１２との接触部が真空シールされる 。吸着用パッド２２としては吸着パッド１３と同一のものが好ましい。 FIG. 1A shows an embodiment of this invention, and parts corresponding to those in FIG. 2 are designated by the same reference numerals. In this embodiment, a recess 21 is formed in the center of the mounting surface 17 of the change kit 12, and a suction pad 22 made of an elastic material such as rubber is mounted in the center of the bottom of the recess 21. At this time, the vacuum line on the main body 11 side is connected to the vacuum line of the change kit 12 through the through hole of the suction pad 22, and the suction port of the suction pad 22 elastically contacts the mounting surface 12 of the main body 11. To be done. In this manner, the contact portion between the main body 11 and the change kit 12 is vacuum-sealed by the suction pad 22. The suction pad 22 is preferably the same as the suction pad 13.
【０００８】 図１Ｂに示すように本体１１の取付け面１６の中央部に凹部２３を形成し、そ の凹部２３の底面に吸着用パッド２２を取付けてもよい。なお吸着用パッド２２ は、チェンジキット１２を本体１１から外した時、これら取付けられた側の取付 け面１６（又は１７）から０．５〜１ｍｍ程度突出するようにされる。As shown in FIG. 1B, a recess 23 may be formed in the central portion of the mounting surface 16 of the main body 11, and the suction pad 22 may be mounted on the bottom surface of the recess 23. When the change kit 12 is removed from the main body 11, the suction pad 22 is projected from the mounting surface 16 (or 17) on the side where they are mounted by about 0.5 to 1 mm.
【０００９】[0009]
【考案の効果】 以上述べたようにこの考案によれば本体１１とチェンジキット１２との接触部 の真空シールを吸着用パッド２２を用いて行うため、吸着用パッド２２の吸着口 の部分は柔軟な構造、特にＩＣ素子吸着に用いるものを利用すると一層柔軟なた め、本体１１へのチェンジキット１２の締結力が弱くても十分な真空シールが得 られる。取付け面１６，１７の各平面度が十分出ていなくても十分な真空シール が得られ、取付け面１６，１７の加工精度を低くすることができる。またチェン ジキット１２が傾むいて取付けられるおそれもない。従って吸着パッド１３の吸 着口の真空圧が十分な値となり、ＩＣ素子１５を確実に吸着することができる。As described above, according to the present invention, since the vacuum seal of the contact portion between the main body 11 and the change kit 12 is performed by using the suction pad 22, the suction port portion of the suction pad 22 is flexible. Since a flexible structure having a different structure, especially one used for adsorbing IC elements, is used, a sufficient vacuum seal can be obtained even if the fastening force of the change kit 12 to the main body 11 is weak. Even if the flatness of the mounting surfaces 16 and 17 is not sufficiently high, a sufficient vacuum seal can be obtained, and the processing accuracy of the mounting surfaces 16 and 17 can be reduced. In addition, there is no possibility that the change kit 12 may be attached by tilting. Therefore, the vacuum pressure at the suction port of the suction pad 13 becomes a sufficient value, and the IC element 15 can be securely sucked.
【００１０】 ＩＣ素子１５を吸着する吸着パッド１３は吸着、その解除が何回も繰返される ため、ある回数以上吸着が行われると、その吸着口付近の部分が劣化して吸着ミ スを起す。従って吸着パッド１５は交換しなければならない。吸着用パッド２２ は繰返し吸着を行わないため、劣化が生じないから、吸着パッド１３と同一のも のを用いておけば、吸着パッド１３を交換する際に、吸着用パッド２２と交換し て、使用することにより、経済的に済ますことができる。The adsorption pad 13 that adsorbs the IC element 15 is repeatedly adsorbed and released many times. Therefore, if adsorption is performed a certain number of times or more, a portion near the adsorption port deteriorates and causes an adsorption miss. Therefore, the suction pad 15 must be replaced. Since the suction pad 22 does not perform repeated suction, deterioration does not occur. Therefore, if the same suction pad 13 is used, when the suction pad 13 is replaced, it is replaced with the suction pad 22. By using it, it can be done economically.
【図１】この考案の実施例を示す断面図。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】従来の搬送可動体を示す断面図。FIG. 2 is a cross-sectional view showing a conventional movable movable body.
Claims (1)
に交換可能にチェンジキットを取付け、そのチェンジキ
ットにてＩＣ素子を吸着させて、ＩＣ素子を搬送するよ
うにされたＩＣ搬送装置の上記搬送可動体において、 上記搬送可動体の本体と上記チェンジキットとの両取着
け面の一方に吸着用パッドが取付けられ、 その吸着パッドにより、上記搬送可動体の本体と上記チ
ェンジキットとの接触部が真空シールされていることを
特徴とするＩＣ搬送装置の搬送可動体。1. An IC transfer device, wherein a change kit is attached to the main body of a transfer movable body so as to be interchangeable depending on the type of IC element, and the IC element is sucked by the change kit to transfer the IC element. In the transporting movable body, a suction pad is attached to one of the mounting surfaces of the transporting movable body and the change kit, and the suction pad makes contact between the transporting movable body and the change kit. A movable body of an IC carrier, characterized in that a portion thereof is vacuum-sealed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10036991U JPH0549291U (en) | 1991-12-05 | 1991-12-05 | Transportable body of IC transport device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10036991U JPH0549291U (en) | 1991-12-05 | 1991-12-05 | Transportable body of IC transport device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0549291U true JPH0549291U (en) | 1993-06-29 |
Family
ID=14272137
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10036991U Pending JPH0549291U (en) | 1991-12-05 | 1991-12-05 | Transportable body of IC transport device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0549291U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08187690A (en) * | 1995-01-09 | 1996-07-23 | Kitano Shoji Kk | Suction conveying method and device thereof |
| WO2009119348A1 (en) * | 2008-03-28 | 2009-10-01 | Hoya株式会社 | Lens holder, lens holding method and lens processing method |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827093B2 (en) * | 1977-02-17 | 1983-06-07 | 株式会社プラスチック工学研究所 | Hollow body forming equipment |
-
1991
- 1991-12-05 JP JP10036991U patent/JPH0549291U/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5827093B2 (en) * | 1977-02-17 | 1983-06-07 | 株式会社プラスチック工学研究所 | Hollow body forming equipment |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08187690A (en) * | 1995-01-09 | 1996-07-23 | Kitano Shoji Kk | Suction conveying method and device thereof |
| WO2009119348A1 (en) * | 2008-03-28 | 2009-10-01 | Hoya株式会社 | Lens holder, lens holding method and lens processing method |
| JPWO2009119348A1 (en) * | 2008-03-28 | 2011-07-21 | Hoya株式会社 | Lens holder, lens holding method and lens processing method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19971209 |