JPH0548376A - Piezoelectric component - Google Patents
Piezoelectric componentInfo
- Publication number
- JPH0548376A JPH0548376A JP23417891A JP23417891A JPH0548376A JP H0548376 A JPH0548376 A JP H0548376A JP 23417891 A JP23417891 A JP 23417891A JP 23417891 A JP23417891 A JP 23417891A JP H0548376 A JPH0548376 A JP H0548376A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- piezoelectric
- vibration
- piezoelectric substrate
- damping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、各種電子回路に組み
込んで使用される圧電部品に関し、詳しくは例えば厚み
すべりエネルギー閉じ込め形の圧電共振子における制振
構造に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a piezoelectric component used by being incorporated in various electronic circuits, and more particularly to, for example, a vibration control structure in a thickness sliding energy trapping type piezoelectric resonator.
【０００２】[0002]
【従来の技術】従来のエネルギー閉じ込め形圧電共振子
の構造を図７および図８に示す。図７は、両面に対向電
極１ａ，１ｂが形成されたセラミック製の圧電体基板２
がセラミック封止基板３，３により封止されると共に、
上記対向電極１ａ，１ｂを封止基板３，３の端面電極
４，４に導通させた構造であり、また、図８は、セラミ
ック封止基板３，３により封止された圧電体基板２の対
向電極１ａ，１ｂを、導電ペースト８，８を介して外部
電極９，９に導通させた構成である。上記セラミック封
止基板３，３を用いることにより、圧電チップ部品の耐
熱性の向上が図られるようになっている。2. Description of the Related Art The structure of a conventional energy trap type piezoelectric resonator is shown in FIGS. FIG. 7 shows a ceramic piezoelectric substrate 2 having opposite electrodes 1a and 1b on both sides.
Is sealed by the ceramic sealing substrates 3 and 3, and
The counter electrodes 1a and 1b are electrically connected to the end surface electrodes 4 and 4 of the sealing substrates 3 and 3, and FIG. 8 shows the piezoelectric substrate 2 sealed by the ceramic sealing substrates 3 and 3. The counter electrodes 1a and 1b are electrically connected to the external electrodes 9 and 9 via the conductive pastes 8 and 8. By using the ceramic sealing substrates 3 and 3, the heat resistance of the piezoelectric chip component can be improved.
【０００３】[0003]
【発明が解決しようとする課題】ところで、上記従来の
セラミック封止基板３，３にはそれぞれ制振効果がな
く、以下の欠点を生じる。 圧電体基板２の不要振動
による弊害、即ち、チップの長短辺のサイズで決定され
る長さ方向の高周波や輪郭振動等により、封止基板３，
３と圧電体基板２とが共振し、電気特性が劣化する。
圧電体基板２のメインの漏れ振動による弊害、即ち、
チップの振動部分の両端において減衰されるべき振動が
減衰されずに、該振動部分に反射することにより、メイ
ンの振動に悪影響を与える。 圧電部品の外部から衝
撃力等が加わることによる弊害、即ち、圧電チップ部品
は外力には極めて敏感であり、外力が圧電体基板２に直
接付加されて不必要な一次圧電効果を生じることによ
り、電気特性が劣化する。By the way, the above-mentioned conventional ceramic sealing substrates 3 and 3 do not have a damping effect, and the following drawbacks occur. The harmful effect of the unnecessary vibration of the piezoelectric substrate 2, that is, the high frequency in the length direction determined by the size of the long and short sides of the chip, the contour vibration, etc.
3 and the piezoelectric substrate 2 resonate, and the electrical characteristics deteriorate.
The harmful effect of the main leakage vibration of the piezoelectric substrate 2, that is,
The vibration that should be damped at both ends of the vibrating portion of the chip is not damped and is reflected by the vibrating portion, which adversely affects the main vibration. The adverse effect caused by the impact force or the like applied from the outside of the piezoelectric component, that is, the piezoelectric chip component is extremely sensitive to the external force, and the external force is directly applied to the piezoelectric substrate 2 to generate an unnecessary primary piezoelectric effect. The electrical characteristics deteriorate.
【０００４】このように、圧電体基板２の不要振動等が
封止基板３に伝播することにより、例えばディスクリミ
ネータにおいては、復調歪率波形に不要振動によるリッ
プルが現れ、復調歪率特性が低下するなどの欠点が生じ
る。As described above, the unnecessary vibration of the piezoelectric substrate 2 propagates to the sealing substrate 3, so that, for example, in the discriminator, ripples due to unnecessary vibration appear in the demodulation distortion rate waveform, and the demodulation distortion rate characteristic is obtained. Defects such as deterioration occur.
【０００５】そこで、上記不要振動を抑える方法とし
て、圧電体基板２と封止基板３とを接着する接着剤部分
を肉厚にして、この接着剤部分で振動伝播を防ぐことが
考えられるが、耐湿性の観点から接着剤部分をあまり厚
くできないのが現状である。Therefore, as a method for suppressing the above-mentioned unnecessary vibration, it is conceivable to increase the thickness of the adhesive portion for adhering the piezoelectric substrate 2 and the sealing substrate 3 and prevent the vibration propagation by this adhesive portion. At present, from the viewpoint of moisture resistance, the adhesive part cannot be made too thick.
【０００６】この発明は、上記従来の課題を解消するた
めになされたもので、圧電体基板の不要振動等に起因す
る圧電体基板と封止基板との共振を防止して、電気特性
の改善を図り得る圧電部品を提供することを目的とす
る。The present invention has been made in order to solve the above-mentioned conventional problems, and prevents resonance between the piezoelectric substrate and the sealing substrate due to unnecessary vibration of the piezoelectric substrate and improves the electrical characteristics. It is an object of the present invention to provide a piezoelectric component capable of achieving the following.
【０００７】[0007]
【課題を解決するための手段】上記課題を解決するため
に、この発明は、圧電体基板の両面に対向電極が形成さ
れた圧電共振子を封止基板で封止され、上記圧電体基板
または封止基板の少なくともいずれか一方が、圧電体基
板の不要振動やメインの漏れ振動等をダンピングするた
めの制振材を介して、拘束板で保持されている圧電部品
である。SUMMARY OF THE INVENTION In order to solve the above-mentioned problems, the present invention provides a piezoelectric resonator in which opposing electrodes are formed on both sides of a piezoelectric substrate, which is sealed with a sealing substrate. At least one of the sealing substrates is a piezoelectric component that is held by a constraining plate via a damping material for damping unnecessary vibration of the piezoelectric substrate and main leakage vibration.
【０００８】また、上記圧電共振子を回路基板に設けた
凹所に実装してなる圧電部品においては、圧電体基板を
拘束板により基板凹所に保持すると共に、該圧電体基板
と拘束板との間に上記制振材を介挿するようにしてもよ
い。In a piezoelectric component in which the above-mentioned piezoelectric resonator is mounted in a recess provided in a circuit board, the piezoelectric substrate is held in the substrate recess by a restraint plate, and the piezoelectric substrate and the restraint plate are held together. You may make it interpose the said damping material between these.
【０００９】[0009]
【作用】この発明によれば、圧電体基板または封止基板
の少なくともいずれか一方が、制振材を介して拘束板で
保持されているので、圧電体基板または封止基板そのも
のに制振効果を持たせることができ、圧電体基板の不要
振動やメインの漏れ振動等が圧電体基板または封止基板
において効率良くダンピングされる。従って、不要振動
等により圧電体基板と封止基板との間の共振を防止でき
る。According to the present invention, at least one of the piezoelectric substrate and the sealing substrate is held by the restraint plate via the damping material, so that the piezoelectric substrate or the sealing substrate itself has a damping effect. Therefore, unnecessary vibration of the piezoelectric substrate, main leakage vibration, etc. are efficiently damped in the piezoelectric substrate or the sealing substrate. Therefore, resonance between the piezoelectric substrate and the sealing substrate due to unnecessary vibration or the like can be prevented.
【００１０】[0010]
【実施例】以下、この発明の一実施例を添付図面に従っ
て説明する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the accompanying drawings.
【００１１】図１及び図２において、１０はエネルギー
閉じ込め形圧電共振子で、セラミック製圧電体基板２の
両面がセラミック封止基板３，３により封止されると共
に、このセラミック封止基板３，３が制振材１１，１１
を介してそれぞれ拘束板１２，１２により保持されてい
る。上記圧電体基板２、セラミック封止基板３，３及び
端面電極４，４の構造は従来と同一構造であり、対応す
る部分にはそれぞれ同一符号を付す。In FIGS. 1 and 2, reference numeral 10 denotes an energy trap type piezoelectric resonator, and both sides of the ceramic piezoelectric substrate 2 are sealed by the ceramic sealing substrates 3 and 3, and the ceramic sealing substrate 3 is also provided. 3 is damping material 11, 11
Are held by constraining plates 12 and 12, respectively. The structures of the piezoelectric substrate 2, the ceramic sealing substrates 3 and 3 and the end face electrodes 4 and 4 are the same as the conventional structure, and corresponding parts are designated by the same reference numerals.
【００１２】上記セラミック封止基板３と拘束板１２と
の間に、所定の厚みで介挿される制振材１１は、ゴムの
ような弾性と粘土のような粘性抵抗を兼ね備えた材料で
あって、且つゴム的な弾性体に比べて、歪などの形状変
化に対する回復時間が極めて遅い材質、例えばエポキシ
樹脂のようなものが好適に用いられる。この制振材１１
により、セラミック封止基板３そのものが制振効果を持
つこととなり、圧電基板２の不要振動等がこの制振材１
１の部分で振動エネルギーから熱エネルギーに変換さ
れ、効率の良いダンピング効果が得られるようになって
いる。The damping material 11 inserted with a predetermined thickness between the ceramic sealing substrate 3 and the constraining plate 12 is a material having both elasticity like rubber and viscous resistance like clay. In addition, a material having an extremely slow recovery time against a shape change such as strain as compared with a rubber-like elastic body, for example, an epoxy resin is preferably used. This damping material 11
As a result, the ceramic encapsulation substrate 3 itself has a vibration damping effect, and unnecessary vibration of the piezoelectric substrate 2 and the like are suppressed by the vibration damping material
The vibration energy is converted into heat energy in the portion 1 so that an efficient damping effect can be obtained.
【００１３】上記構成によれば、封止基板３と拘束板１
２との間に制振材１１を介挿して、封止基板３そのもの
に制振効果を持たせるようにしたから、圧電体基板２の
不要振動やメインの漏れ振動等が制振材１１の部分でダ
ンピングされる。従って、不要振動による圧電体基板２
と封止基板３との間の共振を防止できると共に、メイン
振動へ悪影響を及ぼすおそれがない。また、圧電部品に
外力が作用した場合であっても、その外力もまた制振材
１１の部分でダンピングされるので、圧電体基板２に不
必要な一次圧電効果を生じるおそれもない。According to the above structure, the sealing substrate 3 and the restraint plate 1
Since the vibration damping material 11 is inserted between the vibration damping material 11 and the vibration damping material 2, the sealing substrate 3 itself has a vibration damping effect. Damped in parts. Therefore, the piezoelectric substrate 2 due to unnecessary vibration
Resonance between the sealing substrate 3 and the sealing substrate 3 can be prevented, and the main vibration is not adversely affected. Further, even when an external force acts on the piezoelectric component, the external force is also damped by the damping material 11, so that the piezoelectric substrate 2 is not likely to have an unnecessary primary piezoelectric effect.
【００１４】その結果、圧電体基板２の電気特性は劣化
せず、良品率が向上する結果、例えばディスクリミネー
タにおいて復調歪率波形に不要振動によるリップルが現
れず、復調歪率特性の向上を図ることができる。さらに
はフィルタの高域スプリアスの低減や、トラップにおけ
る映像帯域内Ｇ．Ｄ．Ｔの乱れの改善を図ることができ
る等のメリットが得られる。As a result, the electrical characteristics of the piezoelectric substrate 2 are not deteriorated, and the non-defective rate is improved. As a result, for example, in the discriminator, the ripple due to unnecessary vibration does not appear in the demodulation distortion rate waveform, and the demodulation distortion rate characteristic is improved. Can be planned. Furthermore, it reduces the high frequency spurious of the filter, and G.G. D. It is possible to obtain an advantage that the disturbance of T can be improved.
【００１５】また、この実施例において、圧電体基板２
と封止基板３とを接着する接着剤部分にも制振効果のあ
る材質、例えばエポキシ樹脂を用いるようにすれば、不
要振動等のダンピング効果をより一層向上させることが
できる。Also, in this embodiment, the piezoelectric substrate 2
If a material having a vibration damping effect, such as an epoxy resin, is also used for the adhesive portion that bonds the sealing substrate 3 with the sealing substrate 3, the damping effect of unwanted vibrations can be further improved.
【００１６】さらに、図３及び図４に示すように、セラ
ミック封止基板３，３により封止された圧電体基板２の
対向電極１ａ，１ｂを、導電ペースト８，８を介して外
部電極９，９に導通させた構成において、該封止基板
３，３を制振材１１，１１を介してそれぞれ拘束板１
２，１２により保持するようにしてもよい。この場合、
上記実施例と同様、セラミック封止基板３，３そのもの
に制振効果をもたせることができるので、不要振動等の
効率の良いダンピングが得られる。Further, as shown in FIGS. 3 and 4, the counter electrodes 1a and 1b of the piezoelectric substrate 2 sealed by the ceramic sealing substrates 3 and 3 are connected to the external electrodes 9 via the conductive pastes 8 and 8. , 9 are connected to each other, the sealing substrates 3 and 3 are respectively constrained by the constraining plate 1 through the damping materials 11 and 11.
It may be held by Nos. 2 and 12. in this case,
Similar to the above embodiment, since the ceramic sealing substrates 3 and 3 themselves can have a vibration damping effect, efficient damping of unwanted vibrations can be obtained.
【００１７】尚、上記図３及び図４の変形例として、図
５に示すように、制振材１１を下側の封止基板４と拘束
板１２との間の１層のみとしてもよい。As a modification of FIGS. 3 and 4, the damping material 11 may be only one layer between the lower sealing substrate 4 and the constraining plate 12, as shown in FIG.
【００１８】この発明のさらに他の実施例として、図６
に示すように、回路基板２０に形成した凹所２１に圧電
体基板２を導電ペースト８，８にて直付けした構造にお
いて、圧電体基板２の下面両端を制振材１１を介して拘
束板１２の上面両端により保持するようにしてもよい。
３０は封止基板である。尚、上記拘束板１２は、例えば
圧電体であってもよく、また誘電体基板であってもよ
い。As yet another embodiment of the present invention, FIG.
As shown in FIG. 3, in the structure in which the piezoelectric substrate 2 is directly attached to the recess 21 formed in the circuit substrate 20 with the conductive pastes 8 and 8, both ends of the lower surface of the piezoelectric substrate 2 are bounded by the damping material 11 and the constraining plate. You may make it hold | maintain by the upper surface 12 of both ends.
30 is a sealing substrate. The constraining plate 12 may be, for example, a piezoelectric body or a dielectric substrate.
【００１９】[0019]
【発明の効果】以上説明したように、この発明によれ
ば、圧電体基板または封止基板の少なくともいずれか一
方が、制振材を介して拘束板で保持されているので、圧
電体基板の不要振動やメインの漏れ振動等が制振材の部
分において効率良くダンピングされ、不要振動等による
圧電体基板と封止基板との共振を防止したり、メイン振
動への悪影響を防止できる結果、エネルギー閉じ込め形
圧電共振子の電気特性が劣化せず、良品率が向上すると
いう格別の効果が得られる。As described above, according to the present invention, since at least one of the piezoelectric substrate and the sealing substrate is held by the restraint plate via the damping material, the piezoelectric substrate Unnecessary vibrations and main leakage vibrations are efficiently damped in the damping material, and resonance between the piezoelectric substrate and sealing substrate due to unnecessary vibrations can be prevented, and adverse effects on main vibrations can be prevented. The electrical characteristics of the confinement type piezoelectric resonator are not deteriorated, and the exceptional effect is improved.
【図１】この発明の一実施例に係るエネルギー閉じ込め
形圧電共振子を示す斜視図。FIG. 1 is a perspective view showing an energy trap type piezoelectric resonator according to an embodiment of the present invention.
【図２】図１のＡ−Ａ線縦断面図。FIG. 2 is a vertical sectional view taken along the line AA of FIG.
【図３】この発明の他の実施例を示す斜視図。FIG. 3 is a perspective view showing another embodiment of the present invention.
【図４】図３のＢ−Ｂ線縦断面図。4 is a vertical cross-sectional view taken along the line BB of FIG.
【図５】図４の変形例を示す縦断面図。5 is a vertical cross-sectional view showing a modified example of FIG.
【図６】この発明のさらに他の実施例を示す縦断面図。FIG. 6 is a longitudinal sectional view showing still another embodiment of the present invention.
【図７】従来のエネルギー閉じ込め形圧電共振子を示す
縦断面図。FIG. 7 is a vertical sectional view showing a conventional energy trap type piezoelectric resonator.
【図８】従来の他のエネルギー閉じ込め形圧電共振子を
示す縦断面図。FIG. 8 is a vertical sectional view showing another conventional energy trap type piezoelectric resonator.
２ 圧電体基板 ３ 封止基板 ８ 導電ペースト １０ エネルギー閉じ込め形圧電共振子 １１ 制振材 １２ 拘束板 ２０ 回路基板 ２１ 凹所 2 Piezoelectric Substrate 3 Sealing Substrate 8 Conductive Paste 10 Energy Confining Piezoelectric Resonator 11 Damping Material 12 Restraint Plate 20 Circuit Board 21 Recess
Claims (2)
た圧電共振子を封止基板により封止してなる圧電部品に
おいて、上記圧電体基板または封止基板の少なくともい
ずれか一方が、圧電体基板の不要振動やメインの漏れ振
動等をダンピングするための制振材を介して、拘束板で
保持されていることを特徴とする圧電部品。1. A piezoelectric component obtained by sealing a piezoelectric resonator having opposing electrodes formed on both surfaces of a piezoelectric substrate with a sealing substrate, wherein at least one of the piezoelectric substrate and the sealing substrate is a piezoelectric substrate. A piezoelectric component characterized in that it is held by a restraint plate via a damping material for damping unnecessary vibration of the body substrate and main leakage vibration.
た圧電共振子を回路基板に設けた凹所に実装してなる圧
電部品において、上記圧電体基板を拘束板により基板凹
所に保持すると共に、該圧電体基板と拘束板との間に、
圧電体基板の不要振動やメインの漏れ振動等をダンピン
グするための制振材を介挿したことを特徴とする圧電部
品。2. A piezoelectric component in which a piezoelectric resonator having opposing electrodes formed on both sides of a piezoelectric substrate is mounted in a recess provided in a circuit board, and the piezoelectric substrate is held in the substrate recess by a restraint plate. In addition, between the piezoelectric substrate and the constraining plate,
A piezoelectric component having a damping material interposed for damping unnecessary vibration of the piezoelectric substrate and main leakage vibration.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23417891A JPH0548376A (en) | 1991-08-20 | 1991-08-20 | Piezoelectric component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23417891A JPH0548376A (en) | 1991-08-20 | 1991-08-20 | Piezoelectric component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0548376A true JPH0548376A (en) | 1993-02-26 |
Family
ID=16966898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23417891A Pending JPH0548376A (en) | 1991-08-20 | 1991-08-20 | Piezoelectric component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0548376A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6915942B2 (en) | 2001-06-01 | 2005-07-12 | Nec Corporation | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy |
-
1991
- 1991-08-20 JP JP23417891A patent/JPH0548376A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6915942B2 (en) | 2001-06-01 | 2005-07-12 | Nec Corporation | Method of manufacturing mount structure without introducing degraded bonding strength of electronic parts due to segregation of low-strength/low-melting point alloy |
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