JPH0547864A - Probe - Google Patents
ProbeInfo
- Publication number
- JPH0547864A JPH0547864A JP3201833A JP20183391A JPH0547864A JP H0547864 A JPH0547864 A JP H0547864A JP 3201833 A JP3201833 A JP 3201833A JP 20183391 A JP20183391 A JP 20183391A JP H0547864 A JPH0547864 A JP H0547864A
- Authority
- JP
- Japan
- Prior art keywords
- contact
- elastic body
- contact point
- device under
- under test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Measuring Leads Or Probes (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は半導体ウェーハに形成
された半導体集積回路素子の動作を試験する場合に利用
するプローブに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe used when testing the operation of a semiconductor integrated circuit element formed on a semiconductor wafer.
【０００２】[0002]
【従来の技術】従来より、ＩＣの製造過程において、半
導体ウェーハに作られた集積回路素子をチップに切断す
る前に、ウェーハの状態で動作試験を行ない良否を判定
することが行なわれている。この発明はこの場合に用い
るプローブの改良に関するものである。2. Description of the Related Art Conventionally, in the process of manufacturing an IC, before cutting an integrated circuit element formed on a semiconductor wafer into chips, an operation test is carried out in the state of the wafer to judge pass / fail. The present invention relates to the improvement of the probe used in this case.
【０００３】図５に従来のプローブの全体の構造を、図
６にプローブの要部の構造を示す。図５において、１は
被測定物を示す。この被測定物１はここでは半導体ウェ
ーハとする。半導体ウェーハには周知のように数１０〜
数１００個の集積回路素子が形成される。２はこの集積
回路素子に形成された電極に接触する接点を示す。この
接点２は図６に示すように絶縁フィルム３の面に突出し
て形成される。絶縁フィルム３には特に図示しないが、
各接点２を試験装置本体（特に図示しない）に接続する
ための配線パターンが形成される。この配線パターンが
絶縁フィルム３の周縁に延長形成される。FIG. 5 shows the entire structure of a conventional probe, and FIG. 6 shows the structure of the main part of the probe. In FIG. 5, reference numeral 1 denotes an object to be measured. The DUT 1 is a semiconductor wafer here. As is well known for semiconductor wafers
Several hundred integrated circuit elements are formed. Reference numeral 2 indicates a contact which comes into contact with an electrode formed on this integrated circuit element. The contact 2 is formed so as to project on the surface of the insulating film 3 as shown in FIG. Although not particularly shown in the insulating film 3,
A wiring pattern for connecting each contact 2 to the test apparatus main body (not particularly shown) is formed. This wiring pattern is extendedly formed on the periphery of the insulating film 3.
【０００４】絶縁フィルム３の周縁は、ホルダ４によっ
てプリント配線基板５に押し付けられ、絶縁フィルム３
に形成された配線パターンがプリント配線基板に電気的
に接続される。絶縁フィルム３の接点２を形成した位置
には弾性偏倚手段６が設けられる。この弾性偏倚手段６
によって絶縁フィルム３は下向に押され、全体に張力を
与えると共に、接点２が被試験素子に対して弾性的に接
触する構造としている。The peripheral edge of the insulating film 3 is pressed against the printed wiring board 5 by the holder 4, and
The wiring pattern formed on the substrate is electrically connected to the printed wiring board. An elastic biasing means 6 is provided at a position where the contact 2 of the insulating film 3 is formed. This elastic biasing means 6
Thus, the insulating film 3 is pushed downward to give a tension to the whole and the contact 2 is elastically brought into contact with the device under test.
【０００５】弾性偏倚手段６は図６に示すように、ホル
ダ４に形成した凹部４Ａに、弾性体６Ａ、剛体によって
構成される押し部材６Ｂ、弾性体６Ｃの順に挿入し、押
し部材６Ｂを弾性体６Ｃを介して弾性体６Ａの偏倚力に
より下向に偏倚させている。As shown in FIG. 6, the elastic biasing means 6 inserts an elastic body 6A, a pushing member 6B composed of a rigid body, and an elastic body 6C in this order into a recess 4A formed in the holder 4 to elastically push the pushing member 6B. The elastic body 6A is biased downward via the body 6C by the biasing force of the elastic body 6A.
【０００６】[0006]
【発明が解決しようとする課題】従来のこの種のプロー
ブにあっては接点２は平面形状を持つ押し部材６Ｂで被
試験素子に向って押される。このため接点２は被測定物
１に形成された被試験素子に対して垂直に押され、接点
２は被試験素子に対して接離するだけで摺動する機会が
与えられない。この結果、従来は接点２はクリーニング
機能を持たないため接触不良事故が起き易い欠点があ
る。In the conventional probe of this type, the contact 2 is pushed toward the device under test by the pushing member 6B having a planar shape. Therefore, the contact 2 is pushed vertically to the device under test formed on the device under test 1, and the contact 2 only comes into contact with and separates from the device under test and does not have an opportunity to slide. As a result, the contact 2 has conventionally not been provided with a cleaning function, so that there is a drawback that a contact failure accident is likely to occur.
【０００７】この発明の目的は接点２にクリーニング機
能を付与し、接触不良事故が起き難い、この種のプロー
ブを提供しようとするものである。An object of the present invention is to provide a cleaning function for the contact 2 and to provide a probe of this type in which a contact failure accident is unlikely to occur.
【０００８】[0008]
【課題を解決するための手段】この発明では絶縁フィル
ムの面に接点を突設し、接点を被試験素子に接触させる
と共に、この接点と絶縁フィルムに形成した配線パター
ンを通じて試験装置と被試験装置との間を電気的に接続
し、被試験素子の良否を試験する回路試験装置におい
て、接点を被試験素子に押し当る押し部材に傾斜面を形
成すると共に、この傾斜面と接点との間に弾性体を介挿
し、接点から反力が与えられることにより弾性体を弾性
変形させ、この弾性変形によって接点を傾斜面に従って
傾斜した姿勢に変位させるように構成する。According to the present invention, a contact is projected on the surface of an insulating film to bring the contact into contact with a device under test, and a test device and a device under test are provided through a wiring pattern formed on the contact and the insulating film. In the circuit testing device for electrically connecting between and, and testing the quality of the device under test, an inclined surface is formed on the pressing member that presses the contact against the device under test, and between the inclined surface and the contact. The elastic body is inserted, and a reaction force is applied from the contact point to elastically deform the elastic body, and the elastic deformation displaces the contact point to an inclined posture along the inclined surface.
【０００９】この発明の構成によれば接点が押し部材の
傾斜面に従って傾斜した姿勢に変位するとき、接点は被
試験素子の電極上において摺動し、クリーニング作用が
得られる。従ってこの発明によれば接点２の信頼性が向
上し、これがために試験装置全体の信頼性も高めること
ができる利点が得られる。According to the structure of the present invention, when the contact is displaced in the inclined posture according to the inclined surface of the pushing member, the contact slides on the electrode of the device under test, and the cleaning action is obtained. Therefore, according to the present invention, the reliability of the contact 2 is improved, which has the advantage that the reliability of the entire test apparatus can be improved.
【００１０】[0010]
【実施例】図１にこの発明の一実施例を示す。この発明
においてはホルダ４の凹部４Ａに収納する押し部材６Ｂ
に傾斜面ＳＬＰを形成し、この傾斜面ＳＬＰを接点２と
対向させる。接点２に押圧力が与えられていない状態で
は弾性体６Ｃは傾斜面ＳＬＰに対して弾性変形すること
なく、張り出した形状を維持する。FIG. 1 shows an embodiment of the present invention. In the present invention, the pushing member 6B housed in the recess 4A of the holder 4
A slanted surface SLP is formed on the sloping surface and the slanted surface SLP faces the contact 2. In the state where no pressing force is applied to the contact 2, the elastic body 6C does not elastically deform with respect to the inclined surface SLP and maintains the protruding shape.
【００１１】図５に示したプリント配線基板５が押し下
げられ、接点２に被試験素子が押し当てられると、弾性
体６Ｃはその押圧力により押し部材６Ｂに形成した傾斜
面ＳＬＰに沿って弾性変形する（図２参照）。この弾性
変形する過程で接点２は被試験素子の電極上において傾
斜した姿勢に変位し、被試験素子に対してわずかに摺動
し、接点２をクリーニングする作用が得られる。When the printed wiring board 5 shown in FIG. 5 is pushed down and the device under test is pressed against the contact 2, the elastic body 6C is elastically deformed by the pressing force along the inclined surface SLP formed on the pressing member 6B. (See FIG. 2). In the process of elastically deforming, the contact 2 is displaced in an inclined posture on the electrode of the device under test and slightly slid with respect to the device under test, so that the contact 2 is cleaned.
【００１２】図３及び図４はこの発明の変形実施例を示
す。図３の例では弾性体６Ｃに押し部材６Ｂに形成した
傾斜面ＳＬＰとは逆向の傾斜面ＰＬＳを設け、接点２の
接触開始から接点２の降下動作を停止させるまでのスト
ロークを大きく得るように構成した場合を示す。図４の
例は押し部材６Ｂに逆向の傾斜面ＰＬＳを形成し、接点
２を内側に向く方向に変位させる構造とした場合を示
す。3 and 4 show a modified embodiment of the present invention. In the example of FIG. 3, the elastic body 6C is provided with an inclined surface PLS opposite to the inclined surface SLP formed on the pressing member 6B so that a large stroke from the start of contact of the contact 2 to the stop of the descending operation of the contact 2 can be obtained. The case where it is configured is shown. The example of FIG. 4 shows a case where the pushing member 6B is formed with an inclined surface PLS in the opposite direction and the contact 2 is displaced in the direction toward the inside.
【００１３】[0013]
【発明の効果】以上説明したように、この発明によれば
弾性偏倚手段６が接点２を押下するとき、弾性偏倚手段
６の接点２と対向する部分が接点２から与えられる反力
によって弾性変形し、接点２の姿勢を変位させる。この
接点２の変位によって接点２は接触部分に対して摺動
し、クリーニング作用が得られる。As described above, according to the present invention, when the elastic biasing means 6 presses the contact 2, the portion of the elastic biasing means 6 facing the contact 2 is elastically deformed by the reaction force applied from the contact 2. Then, the posture of the contact 2 is displaced. Due to this displacement of the contact 2, the contact 2 slides on the contact portion, and a cleaning action is obtained.
【００１４】従って集積回路素子に接触する場合に、接
点２が接触部分と摺動するから、接点２と相手の接触部
分はクリーニング作用によって相互の接触は確実に行な
われる。よって接触不良事故が起き難いプローブを提供
することができる。Therefore, when contacting the integrated circuit element, the contact 2 slides on the contact part, so that the contact 2 and the mating contact part are reliably brought into contact with each other by the cleaning action. Therefore, it is possible to provide a probe in which a contact failure accident is unlikely to occur.
【図１】この発明の一実施例を示す拡大断面図。FIG. 1 is an enlarged sectional view showing an embodiment of the present invention.
【図２】図１に示した実施例の動作を説明するための拡
大断面図。FIG. 2 is an enlarged sectional view for explaining the operation of the embodiment shown in FIG.
【図３】この発明の変形実施例を示す拡大断面図。FIG. 3 is an enlarged sectional view showing a modified embodiment of the present invention.
【図４】図３と同様の拡大断面図。FIG. 4 is an enlarged sectional view similar to FIG.
【図５】プローブ全体の構造を説明するための断面図。FIG. 5 is a sectional view for explaining the structure of the entire probe.
【図６】従来の技術を説明するための拡大断面図。FIG. 6 is an enlarged cross-sectional view for explaining a conventional technique.
１ 被測定物 ２ 接点 ３ 絶縁フィルム ４ ホルダ ５ プリント配線基板 ６ 弾性偏倚手段 ６Ａ 弾性体 ６Ｂ 押し部材 ６Ｃ 弾性体 ＳＬＰ，ＰＬＳ 傾斜面 1 DUT 2 Contact point 3 Insulating film 4 Holder 5 Printed wiring board 6 Elastic biasing means 6A Elastic body 6B Pushing member 6C Elastic body SLP, PLS Slope
Claims (1)
し、複数の接点を被試験素子に接触させ、この接点と上
記絶縁フィルムに形成した配線パターンを通じて試験装
置と被試験素子との間を電気的に接続し、被試験素子の
良否を試験する回路試験装置において、 上記接点を被試験素子に押し当る押し部材に傾斜面を形
成し、この傾斜面と接点との間に弾性体を介挿し、接点
からの反力によって弾性体を弾性変形させ、弾性体の弾
性変形によって、上記接点を上記傾斜面に従って傾斜し
た姿勢に変位させるように構成したプローブ。1. A plurality of contacts are provided on a surface of an insulating film so that the plurality of contacts are brought into contact with a device under test, and the test device and the device under test are connected through the contact and a wiring pattern formed on the insulating film. In the circuit test device for electrically connecting the test element to test the quality of the device under test, an inclined surface is formed on the pressing member that presses the contact against the device under test, and an elastic body is provided between the inclined surface and the contact. A probe which is inserted and elastically deforms an elastic body by a reaction force from a contact, and the elastic deformation of the elastic body displaces the contact in an inclined posture along the inclined surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3201833A JPH0547864A (en) | 1991-08-12 | 1991-08-12 | Probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3201833A JPH0547864A (en) | 1991-08-12 | 1991-08-12 | Probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0547864A true JPH0547864A (en) | 1993-02-26 |
Family
ID=16447655
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3201833A Pending JPH0547864A (en) | 1991-08-12 | 1991-08-12 | Probe |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0547864A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722478A (en) * | 1993-06-30 | 1995-01-24 | Kawasaki Steel Corp | Probe test apparatus and probe testing method |
| JPH0774219A (en) * | 1993-08-31 | 1995-03-17 | Kurisutaru Device:Kk | Probe substrate, its manufacture and probe device |
| KR100309889B1 (en) * | 1993-07-19 | 2001-12-15 | 히가시 데쓰로 | Probe Device |
| JP2007278860A (en) * | 2006-04-07 | 2007-10-25 | Micronics Japan Co Ltd | Electrical connection device |
| JP2007278861A (en) * | 2006-04-07 | 2007-10-25 | Micronics Japan Co Ltd | Electrical connection device |
| JP2007285803A (en) * | 2006-04-14 | 2007-11-01 | Micronics Japan Co Ltd | Electrical connection apparatus |
| JP2021529945A (en) * | 2018-07-04 | 2021-11-04 | テクノプローべ ソシエタ ペル アチオニ | Probe card for high frequency application field |
-
1991
- 1991-08-12 JP JP3201833A patent/JPH0547864A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0722478A (en) * | 1993-06-30 | 1995-01-24 | Kawasaki Steel Corp | Probe test apparatus and probe testing method |
| KR100309889B1 (en) * | 1993-07-19 | 2001-12-15 | 히가시 데쓰로 | Probe Device |
| JPH0774219A (en) * | 1993-08-31 | 1995-03-17 | Kurisutaru Device:Kk | Probe substrate, its manufacture and probe device |
| JP2007278860A (en) * | 2006-04-07 | 2007-10-25 | Micronics Japan Co Ltd | Electrical connection device |
| JP2007278861A (en) * | 2006-04-07 | 2007-10-25 | Micronics Japan Co Ltd | Electrical connection device |
| JP2007285803A (en) * | 2006-04-14 | 2007-11-01 | Micronics Japan Co Ltd | Electrical connection apparatus |
| JP2021529945A (en) * | 2018-07-04 | 2021-11-04 | テクノプローべ ソシエタ ペル アチオニ | Probe card for high frequency application field |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19981222 |