JPH0538694A - Ic suction device - Google Patents
Ic suction deviceInfo
- Publication number
- JPH0538694A JPH0538694A JP3195376A JP19537691A JPH0538694A JP H0538694 A JPH0538694 A JP H0538694A JP 3195376 A JP3195376 A JP 3195376A JP 19537691 A JP19537691 A JP 19537691A JP H0538694 A JPH0538694 A JP H0538694A
- Authority
- JP
- Japan
- Prior art keywords
- suction
- hot chuck
- rubber pad
- pad
- pad unit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manipulator (AREA)
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は水平搬送方式を採るＩ
Ｃ搬送装置に用いられるＩＣ吸着装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention This invention adopts a horizontal transfer system.
The present invention relates to an IC adsorption device used in a C transfer device.
【０００２】[0002]
【従来の技術】ＩＣの端子ピン導出構造の多様化に伴な
って、ＩＣ試験装置のＩＣ搬送機構としてＩＣの自重を
利用して案内レール上を滑走させて搬送する方式から、
真空吸着手段を利用した水平搬送方式を採る傾向にあ
る。つまりＸ−Ｙ方向に移動する水平移動ヘッドにＩＣ
吸着装置を搭載し、このＩＣ吸着装置にＩＣを吸着して
所定位置からテスト部にＩＣを搬送し、テストを終わっ
たＩＣをテスト部から排出部に搬送する構造のＩＣ搬送
装置が実用されている。2. Description of the Related Art With the diversification of IC terminal pin lead-out structures, a method of sliding on a guide rail using an IC's own weight as an IC carrying mechanism of an IC tester and carrying
There is a tendency to adopt a horizontal transfer method using a vacuum suction means. That is, the horizontal moving head that moves in the X-Y direction is provided with an IC.
An IC carrier device having a structure in which a suction device is mounted, the IC is sucked to the IC suction device, the IC is transported from a predetermined position to a test unit, and the IC after the test is transported from the test unit to the discharge unit has been put into practical use. There is.
【０００３】この発明は水平移動ヘッド等に搭載される
ＩＣ吸着装置の改良に関するものである。図２に従来か
ら用いられているＩＣ吸着装置の構造を示す。図中１は
水平移動ヘッドを示す。この水平移動ヘッドはＸ軸方向
に差渡されたガイドシャフト２に移動自在に支持され、
Ｘ軸方向に移動できるように支持されると共に、ガイド
シャフト２は両端部においてＹ軸方向（紙面に対して垂
直方向）に移動できるように支持される。このようにし
て水平移動ヘッド１はＸ−Ｙ方向に移動できるように支
持される。水平移動ヘッド１には例えばエアシリンダの
ようなＺ軸駆動手段３が取付けられる。つまりＺ軸駆動
手段３はＸ軸とＹ軸とから成る水平面から鉛直方向に進
退する可動ロッド３Ａを有し、可動ロッド３Ａの下端に
ＩＣ吸着装置を取付けるためのマウント４が取付けられ
る。マウント４は底面にＩＣ吸着装置５を取付ける取付
面４Ａを有し、また側面に吸引ポンプ及び開閉弁に連結
するポンプ接続口４Ｂが設けられる。The present invention relates to an improvement of an IC adsorption device mounted on a horizontal moving head or the like. FIG. 2 shows the structure of an IC adsorption device that has been conventionally used. In the figure, 1 indicates a horizontal moving head. This horizontal moving head is movably supported by a guide shaft 2 which is passed in the X-axis direction,
The guide shaft 2 is supported so as to be movable in the X-axis direction, and is also supported so as to be movable in the Y-axis direction (direction perpendicular to the paper surface) at both ends. In this way, the horizontal moving head 1 is supported so as to be movable in the XY directions. A Z-axis driving means 3 such as an air cylinder is attached to the horizontally moving head 1. That is, the Z-axis driving means 3 has a movable rod 3A that advances and retreats in the vertical direction from a horizontal plane composed of the X-axis and the Y-axis, and a mount 4 for attaching the IC suction device is attached to the lower end of the movable rod 3A. The mount 4 has a mounting surface 4A for mounting the IC adsorption device 5 on the bottom surface, and a pump connection port 4B for connecting to the suction pump and the opening / closing valve on the side surface.
【０００４】ＩＣ吸着装置５はホットチャック５Ａと、
このホットチャック５Ａの中央に形成した貫通孔５Ｂに
収納した吸着パッドユニット５Ｃと、吸着パッドユニッ
ト５Ｃの先端に取付けられたゴムパッド５Ｄとによって
構成される。ホットチャック５Ａは内部にヒータを内蔵
し、ＩＣを温度試験する場合には所定の温度に加熱さ
れ、吸着したＩＣに温度を印加し、ＩＣの温度が低下し
ないように設けられる。吸着パッドユニット５Ｃは上端
にネジ部を有するパイプによって構成され、ネジ部をマ
ウント４の取付面に形成したネジ孔に螺入し、吸着パッ
ドユニット５Ｃをマウント４に取付けると共に、この装
着によって吸着パッドユニット５Ｃの中空孔はポンプ接
続孔４Ｂに連通される。吸着パッドユニット５Ｃの下端
側にゴムパッド５Ｄが取付けられる。ゴムパッド５Ｄは
吸盤状に形成され、その先端がホットチャック５Ａの吸
着面からわずかに突出され、このわずかな突出部分がＩ
Ｃのパッケージの上面に接触し、ＩＣを吸着する。The IC suction device 5 includes a hot chuck 5A,
The hot chuck 5A is composed of a suction pad unit 5C housed in a through hole 5B formed in the center and a rubber pad 5D attached to the tip of the suction pad unit 5C. The hot chuck 5A has a built-in heater therein, and is heated to a predetermined temperature when the temperature of the IC is tested, and the temperature is applied to the adsorbed IC so that the temperature of the IC does not decrease. The suction pad unit 5C is composed of a pipe having a threaded portion at the upper end, and the screwed portion is screwed into a screw hole formed in the mounting surface of the mount 4 to mount the suction pad unit 5C on the mount 4 and by this mounting, the suction pad unit 5C. The hollow hole of the unit 5C communicates with the pump connection hole 4B. The rubber pad 5D is attached to the lower end side of the suction pad unit 5C. The rubber pad 5D is formed in a suction cup shape, and its tip is slightly projected from the suction surface of the hot chuck 5A.
It contacts the upper surface of the C package and adsorbs the IC.
【０００５】[0005]
【発明が解決しようとする課題】ゴムパッド５Ｄに吸着
したＩＣをホットチャック５Ａの吸着面５Ｅに接触させ
るにはゴムパッド５Ｄの突出量はわずかな方がよい。然
し乍らゴムパッド５Ｄの突出量を小さく採ると、Ｘ−Ｙ
駆動機構の平行度の誤差によりＩＣの吸着不能事故や、
ＩＣをＩＣ吸着装置５によって押しつぶしてしまう事故
が起きる不都合がある。In order to bring the IC adsorbed on the rubber pad 5D into contact with the adsorbing surface 5E of the hot chuck 5A, the amount of protrusion of the rubber pad 5D should be small. However, if the amount of protrusion of the rubber pad 5D is set small, X-Y
Due to the parallelism error of the drive mechanism
There is an inconvenience of causing an accident that the IC is crushed by the IC suction device 5.
【０００６】つまりＩＣ吸着装置５の下降時の停止位置
とＩＣとの間の誤差はゴムパッド５Ｄの突出量の範囲内
になくてはならない。従ってゴムパッド５Ｄの突出量を
あまり小さくするとＸ−Ｙ駆動機構の平行度の誤差をゴ
ムパッド５Ｄの突出量によって吸収できなくなる。つま
り水平移動ロッド１の位置と載置されたＩＣとの間の距
離が規定より長くなっている場所ではＺ軸駆動手段３に
よってＩＣ吸着装置５を降下させた場合、ＩＣにゴムパ
ッド５Ｄがとどかなくなり、吸着不能となる。このため
ＩＣ吸着装置５の停止位置を低く設定したとすると、水
平移動ヘッド１の位置と載置されたＩＣとの間の距離が
規定より小さくなっている場所では、ＩＣ吸着装置５を
降下させた場合、ＩＣ吸着装置５がＩＣを押しつぶして
しまう事故が起きることになる。That is, the error between the IC stop position when the IC suction device 5 is lowered and the IC must be within the range of the protrusion amount of the rubber pad 5D. Therefore, if the amount of protrusion of the rubber pad 5D is made too small, the parallelism error of the XY drive mechanism cannot be absorbed by the amount of protrusion of the rubber pad 5D. That is, when the distance between the position of the horizontally moving rod 1 and the mounted IC is longer than the regulation, when the Z-axis driving means 3 lowers the IC suction device 5, the rubber pad 5D does not reach the IC. , Can not be adsorbed. Therefore, if the stop position of the IC suction device 5 is set low, the IC suction device 5 is lowered at a place where the distance between the position of the horizontal moving head 1 and the mounted IC is smaller than the regulation. In that case, an accident occurs in which the IC suction device 5 crushes the IC.
【０００７】このような不都合を解消するためにはゴム
パッド５Ｄの突出量を大きく採り、ＩＣ吸着装置の降下
時の停止位置をＩＣの載置面より離れた位置に設定すれ
ばよい。然し乍らこのようにゴムパッド５Ｄの突出量を
大きく採った場合には、吸着したＩＣをホットチャック
５Ａの吸着面５Ｅに接触させることができない不都合が
ある。従ってこのような場合、Ｘ−Ｙ駆動機構の平行度
を調整し直さなくてはならなくなり、その作業は多くの
手間と時間が掛る不都合がある。In order to eliminate such an inconvenience, a large amount of protrusion of the rubber pad 5D may be adopted, and the stop position when the IC suction device is lowered may be set to a position apart from the IC mounting surface. However, when the amount of protrusion of the rubber pad 5D is large as described above, there is a disadvantage that the sucked IC cannot be brought into contact with the suction surface 5E of the hot chuck 5A. Therefore, in such a case, it is necessary to readjust the parallelism of the X-Y drive mechanism, which is inconvenient and time-consuming.
【０００８】この発明の目的はゴムパッドの突出量を大
きく採り、ＩＣを確実に吸着することができると共に、
吸着したＩＣを確実にホットチャックに接触させること
ができる機能を具備したＩＣ吸着装置を提供しようとす
るものである。The object of the present invention is to make the amount of protrusion of the rubber pad large so that the IC can be surely adsorbed, and
It is an object of the present invention to provide an IC suction device having a function of surely bringing the sucked IC into contact with the hot chuck.
【０００９】[0009]
【課題を解決するための手段】この発明では吸着パッド
ユニットを上下に多少移動できるように支持すると共
に、ゴムパッドにＩＣを吸着すると、吸着パッドユニッ
トが空気の吸引力によって吸引されて上方に移動し、こ
の移動によってＩＣをホットチャックに接触させる。According to the present invention, the suction pad unit is supported so as to be movable up and down, and when the IC is sucked onto the rubber pad, the suction pad unit is sucked by the suction force of air to move upward. The IC is brought into contact with the hot chuck by this movement.
【００１０】従ってこの発明によれば吸着パッドユニッ
トに許可した移動量の範囲内でＸ−Ｙ駆動機構の平行度
の誤差による高低差を吸収することができる。また吸着
したＩＣをホットチャックに確実に接触させることがで
きる。Therefore, according to the present invention, it is possible to absorb the height difference due to the error of the parallelism of the XY drive mechanism within the range of the movement amount permitted to the suction pad unit. Further, the sucked IC can be surely brought into contact with the hot chuck.
【００１１】[0011]
【実施例】図１にこの発明によるＩＣ吸着装置の構造を
示す。図１では水平移動ヘッド及びＺ軸駆動装置は省略
して示している。図中４はマウントを示す。マウント４
の下面４ＡにＩＣ吸着装置５が取付けられる点の構造は
従来の技術と同じである。この発明の特徴とする点の構
造は、ホットチャック５Ａに形成した貫通孔５Ｂに収納
する吸着パッドユニット５Ｃを、上下に移動できるよう
に支持した点である。図の実施例ではパイプ状の吸着パ
ッドユニット５Ｃをホットチャック５Ａに形成した貫通
孔５Ｂに上下方向に移動できるように収納すると共に、
吸着パッドユニット５Ｃの周面に軸芯と平行する方向に
凹溝５Ｆを形成し、この凹溝５Ｆにホットチャック５Ａ
の外周面から螺子込んだストッパ５Ｇの先端を係合さ
せ、凹溝５Ｆの長さの範囲で吸着パッドユニット５Ｃを
上下に移動できるように支持した例を示す。1 shows the structure of an IC adsorption device according to the present invention. In FIG. 1, the horizontal moving head and the Z-axis drive device are omitted. In the figure, 4 indicates a mount. Mount 4
The structure in that the IC suction device 5 is attached to the lower surface 4A of the above is the same as the conventional technique. The characteristic structure of the present invention is that the suction pad unit 5C housed in the through hole 5B formed in the hot chuck 5A is supported so as to be vertically movable. In the illustrated embodiment, the pipe-shaped suction pad unit 5C is housed in the through hole 5B formed in the hot chuck 5A so as to be vertically movable, and
A concave groove 5F is formed on the peripheral surface of the suction pad unit 5C in a direction parallel to the axis, and the hot chuck 5A is formed in the concave groove 5F.
An example in which the tip of a stopper 5G screwed in from the outer peripheral surface of the suction pad unit 5C is supported so that the suction pad unit 5C can be moved up and down within the range of the length of the groove 5F is shown.
【００１２】吸着パッドユニット５Ｃが最下位に位置す
るとき、ゴムパッド５Ｄはホットチャック５ＡのＩＣ吸
着面５Ｅから最大に突出する。吸着パッドユニット５Ｃ
が最上位に移動するとゴムパッド５Ｄの下端はホットチ
ャック５ＡのＩＣ吸着面５Ｅとほぼ面一の状態に引き込
まれる。ゴムパッド５ＤにＩＣが吸着されていない状態
では吸着パッドユニット５Ｃは自重によって最下位に位
置する。従ってＩＣを吸着するためにＩＣ吸着装置が下
降している状態ではゴムパッド５Ｄは最大に突出した姿
勢にある。ゴムパッド５ＤがＩＣに近づき、これと共に
ポンプ接続口４Ｂに接続した開閉弁（特に図示しない）
を開け、空気の吸引を開始する。空気の吸引が開始され
た状態でゴムパッド５ＤがＩＣのパッケージに近づきゴ
ムパッド５Ｄの下端がＩＣのパッケージに接触すると、
空気の吸引力によってＩＣはゴムパッド５Ｄに吸着され
る。このときＺ軸駆動手段の下降が続いていればゴムパ
ッド５Ｄは貫通孔５Ｂに向って或る量だけ押し込まれ
る。When the suction pad unit 5C is located at the lowest position, the rubber pad 5D protrudes to the maximum from the IC suction surface 5E of the hot chuck 5A. Adsorption pad unit 5C
When is moved to the uppermost position, the lower end of the rubber pad 5D is pulled into a state substantially flush with the IC suction surface 5E of the hot chuck 5A. When the IC is not adsorbed on the rubber pad 5D, the adsorption pad unit 5C is located at the lowest position due to its own weight. Therefore, the rubber pad 5D is in the maximum projecting position when the IC suction device is lowered to suck the IC. The rubber pad 5D approaches the IC, and the opening / closing valve connected to the pump connection port 4B (not shown)
Open and start sucking air. When the rubber pad 5D approaches the IC package and the lower end of the rubber pad 5D comes into contact with the IC package when air suction is started,
The IC is attracted to the rubber pad 5D by the suction force of air. At this time, if the Z-axis drive means continues to descend, the rubber pad 5D is pushed toward the through hole 5B by a certain amount.
【００１３】ＩＣがゴムパッド５Ｄに吸着されると、吸
着パッドユニット５Ｃの中空孔はＩＣのパッケージによ
って塞がれるから、空気の吸引力は吸着パッドユニット
５Ｃに掛る。この結果、吸着パッドユニット５Ｃは空気
の吸引力によって上方に移動し、ゴムパッド５Ｄに吸着
されてＩＣはホットチャック５ＡのＩＣ吸着面５Ｅに確
実に接触され、ＩＣは加熱される。When the IC is adsorbed by the rubber pad 5D, the hollow hole of the adsorption pad unit 5C is closed by the IC package, so that the suction force of air is exerted on the adsorption pad unit 5C. As a result, the suction pad unit 5C moves upward by the suction force of the air, is sucked by the rubber pad 5D, the IC is surely brought into contact with the IC suction surface 5E of the hot chuck 5A, and the IC is heated.
【００１４】[0014]
【発明の効果】以上説明したように、この発明によれば
ＩＣ吸着装置５がＩＣを吸着しようとしている状態では
ゴムパッド５Ｄがホットチャック５Ａの吸着面５Ｅから
最大に突出した姿勢でＩＣに近づく、従ってＩＣ吸着装
置５はＸ−Ｙ駆動機構の水平度の誤差によって生じるＩ
Ｃまでの高低差があっても、ゴムパッド５Ｄの移動量に
よってこの高低差を吸収することができる。つまりホッ
トチャック５Ａを降下させて停止したとき、ＩＣ吸着面
５Ｅと待機しているＩＣとの間の距離を限りなく０に近
づけて設定しなくても、ゴムパッド５Ｄの移動量の範囲
内で可及的に離れた距離に設定することができる。As described above, according to the present invention, the rubber pad 5D approaches the IC in a state in which it is maximally projected from the suction surface 5E of the hot chuck 5A when the IC suction device 5 is trying to suck the IC. Therefore, the IC suction device 5 causes I caused by an error in horizontality of the XY drive mechanism.
Even if there is a height difference up to C, this height difference can be absorbed by the movement amount of the rubber pad 5D. In other words, when the hot chuck 5A is lowered and stopped, the distance between the IC suction surface 5E and the waiting IC does not have to be set to 0 as much as possible, and it is possible within the range of the movement amount of the rubber pad 5D. The distance can be set as far as possible.
【００１５】この結果、Ｘ−Ｙ駆動機構の平行度の誤差
により生ずるホットチャック５ＡとＩＣとの間の高低差
によって、ホットチャック５ＡがＩＣを押しつぶす事故
或はゴムパッド５ＤがＩＣにとどかずに吸着できない事
故が起きることはない。またＸ−Ｙ駆動機構の平行度の
調整を行なわなくてもよいため、製造が容易なＩＣ吸着
装置を提供することができる。As a result, the height difference between the hot chuck 5A and the IC caused by the parallelism error of the XY drive mechanism causes the hot chuck 5A to crush the IC or the rubber pad 5D to be attracted without reaching the IC. There is no accident that cannot be done. Further, since it is not necessary to adjust the parallelism of the XY drive mechanism, it is possible to provide an IC suction device that is easy to manufacture.
【図１】この発明の一実施例を示す断面図。FIG. 1 is a sectional view showing an embodiment of the present invention.
【図２】従来の技術を説明するための断面図。FIG. 2 is a sectional view for explaining a conventional technique.
１ 水平移動ヘッド ２ ガイドシャフト ３ Ｚ軸駆動手段 ４ マウント ５ ＩＣ吸着装置 ５Ａ ホットチャック ５Ｂ 貫通孔 ５Ｃ 吸着パッドユニット ５Ｄ ゴムパッド ５Ｅ ＩＣ吸着面 1 Horizontal movement head 2 Guide shaft 3 Z-axis drive means 4 Mount 5 IC suction device 5A Hot chuck 5B Through hole 5C Suction pad unit 5D Rubber pad 5E IC suction surface
Claims (1)
にほぼ等しい面積形状を有する吸着面と、この吸着面の
中央にこの吸着面から鉛直方向に形成された貫通孔とを
具備し、吸着したＩＣのパッケージに熱を印加するホッ
トチャックと、 Ｂ．このホットチャックに形成された貫通孔に収納さ
れ、貫通孔の軸芯方向にわずかに移動できるように支持
された吸着パッドユニットと、 Ｃ．この吸着パッドユニットの先端に取付けられ、上記
ホットチャックの吸着面からわずかに突出して支持され
たゴムパッドと、 を具備して成るＩＣ吸着装置。1. A. An adsorption surface having an area shape substantially equal to the plane area of the IC package to be adsorbed, and a through hole formed in the vertical direction from the adsorption surface in the center of the adsorption surface are provided, and the adsorption IC package is heat-treated. A hot chuck for applying B. A suction pad unit housed in a through hole formed in the hot chuck and supported so as to be slightly movable in the axial direction of the through hole; An IC suction device comprising a rubber pad attached to the tip of the suction pad unit and supported by slightly protruding from the suction surface of the hot chuck.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3195376A JP2813723B2 (en) | 1991-08-05 | 1991-08-05 | IC suction device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3195376A JP2813723B2 (en) | 1991-08-05 | 1991-08-05 | IC suction device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0538694A true JPH0538694A (en) | 1993-02-19 |
| JP2813723B2 JP2813723B2 (en) | 1998-10-22 |
Family
ID=16340141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3195376A Expired - Fee Related JP2813723B2 (en) | 1991-08-05 | 1991-08-05 | IC suction device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2813723B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6072157A (en) * | 1998-12-11 | 2000-06-06 | Euv Llc | Thermophoretic vacuum wand |
| JP2002178287A (en) * | 2000-12-15 | 2002-06-25 | Juki Corp | Electronic part mounting device |
| US8211081B2 (en) | 2004-10-20 | 2012-07-03 | Fresenius Kabi Deutschland Gmbh | Closing cap for containers filled with medical liquids |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62106782U (en) * | 1985-12-25 | 1987-07-08 | ||
| JPS62192646U (en) * | 1986-05-29 | 1987-12-08 | ||
| JPS6335972U (en) * | 1986-08-25 | 1988-03-08 |
-
1991
- 1991-08-05 JP JP3195376A patent/JP2813723B2/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62106782U (en) * | 1985-12-25 | 1987-07-08 | ||
| JPS62192646U (en) * | 1986-05-29 | 1987-12-08 | ||
| JPS6335972U (en) * | 1986-08-25 | 1988-03-08 |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6072157A (en) * | 1998-12-11 | 2000-06-06 | Euv Llc | Thermophoretic vacuum wand |
| US6232578B1 (en) | 1998-12-11 | 2001-05-15 | Buv Llc | Thermophoretic vacuum wand |
| JP2002178287A (en) * | 2000-12-15 | 2002-06-25 | Juki Corp | Electronic part mounting device |
| US8211081B2 (en) | 2004-10-20 | 2012-07-03 | Fresenius Kabi Deutschland Gmbh | Closing cap for containers filled with medical liquids |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2813723B2 (en) | 1998-10-22 |
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