JPH0536301Y2 - - Google Patents

Info

Publication number
JPH0536301Y2
JPH0536301Y2 JP212588U JP212588U JPH0536301Y2 JP H0536301 Y2 JPH0536301 Y2 JP H0536301Y2 JP 212588 U JP212588 U JP 212588U JP 212588 U JP212588 U JP 212588U JP H0536301 Y2 JPH0536301 Y2 JP H0536301Y2
Authority
JP
Japan
Prior art keywords
printed wiring
wiring board
stacked
resist
wiring boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP212588U
Other languages
English (en)
Japanese (ja)
Other versions
JPH01107174U (es
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP212588U priority Critical patent/JPH0536301Y2/ja
Publication of JPH01107174U publication Critical patent/JPH01107174U/ja
Application granted granted Critical
Publication of JPH0536301Y2 publication Critical patent/JPH0536301Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP212588U 1988-01-11 1988-01-11 Expired - Lifetime JPH0536301Y2 (es)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP212588U JPH0536301Y2 (es) 1988-01-11 1988-01-11

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP212588U JPH0536301Y2 (es) 1988-01-11 1988-01-11

Publications (2)

Publication Number Publication Date
JPH01107174U JPH01107174U (es) 1989-07-19
JPH0536301Y2 true JPH0536301Y2 (es) 1993-09-14

Family

ID=31202625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP212588U Expired - Lifetime JPH0536301Y2 (es) 1988-01-11 1988-01-11

Country Status (1)

Country Link
JP (1) JPH0536301Y2 (es)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010258389A (ja) * 2009-04-28 2010-11-11 Kyocer Slc Technologies Corp 多数個取り配線基板
JPWO2017081738A1 (ja) * 2015-11-10 2018-01-25 三菱電機株式会社 交流発電機

Also Published As

Publication number Publication date
JPH01107174U (es) 1989-07-19

Similar Documents

Publication Publication Date Title
EP0593938A1 (en) Method and apparatus for uniform deposition of solder paste on a pcb
US6267288B1 (en) Pallet for combined surface mount and wave solder manufacture of printed ciruits
US7316060B2 (en) System for populating a circuit board with semiconductor chips
JPS6212679B2 (es)
JPH0536301Y2 (es)
US7337522B2 (en) Method and apparatus for fabricating a circuit board with a three dimensional surface mounted array of semiconductor chips
JPH02187166A (ja) 液体付着装置及び方法
US7100813B2 (en) System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication
US6557247B1 (en) Component placement apparatus
JPH01321685A (ja) 基板吸着治具
JPH062241Y2 (ja) チツプ抵抗
JPH04120263A (ja) マスキング材セット用治具
JP2728857B2 (ja) 自動キャッピング装置
JPH09148688A (ja) 半田プリコート配線基板
JPS61265232A (ja) チップ実装装置
JP2713621B2 (ja) チップ部品の実装方法
KR100286042B1 (ko) 플립칩과그실장방법및플립칩의전극돌기에도포용치공구
JP2710251B2 (ja) 電子部品装着方法
JPH0644095Y2 (ja) レジスト塗布装置
JPS60106751A (ja) プリント基板位置決め装置
JPH01208836A (ja) 接着方法及び装置
JPH08267399A (ja) 基板分割治具及び基板分割方法
JPH01171292A (ja) プリント基板の表面処理方法
JPH1154554A (ja) 電子部品の基板実装用加工方法
JPS6348440B2 (es)