JPH05337866A - Ic handling device - Google Patents
Ic handling deviceInfo
- Publication number
- JPH05337866A JPH05337866A JP14385092A JP14385092A JPH05337866A JP H05337866 A JPH05337866 A JP H05337866A JP 14385092 A JP14385092 A JP 14385092A JP 14385092 A JP14385092 A JP 14385092A JP H05337866 A JPH05337866 A JP H05337866A
- Authority
- JP
- Japan
- Prior art keywords
- suction
- rubber pad
- bellows
- adsorption
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Landscapes
- Manipulator (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体装置（以下、Ｉ
Ｃ）の製造工程に用いるＩＣハンドリング装置に関し、
特に樹脂封入後のＩＣの搬送に用いるハンドリング装置
に関する。BACKGROUND OF THE INVENTION The present invention relates to a semiconductor device (hereinafter referred to as I
Regarding the IC handling device used in the manufacturing process of C),
In particular, the present invention relates to a handling device used for carrying an IC after resin encapsulation.
【０００２】[0002]
【従来の技術】従来、この種のＩＣハンドリング装置
は、金属管の先端部にゴムのパッドを有する吸着部を備
えており、図３の断面図を用いて説明すると図３
（ａ），図３（ｂ）に示すように、金属管６の先端に取
り付けられたゴム製パッド２と、金属管６を通し吸着部
自体を移動させる台（以下、ハンド３）と、金属管６の
他端に接続した吸引ノズル４と、ゴム製パッド２を押圧
するばね７と、ばね７のストッパー８とを備え、ＩＣ５
を吸着する。このように、ゴム製パッド２と金属管６が
ばね７を緩衝材として上下の自由度を持った構造となっ
ている。2. Description of the Related Art Conventionally, an IC handling device of this type is provided with a suction portion having a rubber pad at the tip of a metal tube, which will be described with reference to the sectional view of FIG.
As shown in FIGS. 3 (a) and 3 (b), a rubber pad 2 attached to the tip of a metal tube 6, a stand for moving the suction section itself through the metal tube 6, and a metal. The suction nozzle 4 connected to the other end of the pipe 6, a spring 7 for pressing the rubber pad 2, and a stopper 8 for the spring 7 are provided.
Adsorb. In this way, the rubber pad 2 and the metal tube 6 have a structure having a vertical degree of freedom using the spring 7 as a cushioning material.
【０００３】吸着・搬送の方法としては、ゴム製パッド
２がＩＣ５に接する位置までハンド３を移動し、吸引ノ
ズル４からの吸引力により、ＩＣ５をゴム製パッドに吸
着させ搬送先にハンド３を移動し、吸引を止めることに
よりＩＣ５をゴム製パッド２から分離し、搬送先に置く
という方法が一般的である。As a suction / transportation method, the hand 3 is moved to a position where the rubber pad 2 contacts the IC 5, and the suction force from the suction nozzle 4 causes the IC 5 to be attracted to the rubber pad and the hand 3 to the transport destination. A general method is to move the IC 5 to separate it from the rubber pad 2 by stopping suction and place it at the destination.
【０００４】なお、図３（ａ）は、ＩＣを搬送中の図で
あり、図３（ｂ）は、ゴム製パッド２をＩＣ５に押しつ
けて吸着しようとしているところの図である。Incidentally, FIG. 3 (a) is a view showing that the IC is being conveyed, and FIG. 3 (b) is a view showing that the rubber pad 2 is being pressed against the IC 5 for adsorption.
【０００５】[0005]
【発明が解決しようとする課題】上述した従来のハンド
リング装置では、第１に吸着部の自由度が上下方向にし
かないために、極く僅かなＩＣの傾きに対しても吸着ミ
スを起こす。第２に吸着部の高さがずれてＩＣと吸着部
との距離が接近し過ぎた場合、ＩＣに無理な力が加わり
外観不良や特性不良を誘発させるという欠点があった。In the conventional handling device described above, firstly, since the degree of freedom of the suction portion is only in the vertical direction, a suction error occurs even with a very slight inclination of the IC. Secondly, when the height of the suction portion is deviated and the distance between the IC and the suction portion becomes too close, an unreasonable force is applied to the IC to cause a defective appearance and a characteristic defect.
【０００６】[0006]
【課題を解決するための手段】本発明のＩＣハンドリン
グ装置は、吸引ノズルとゴム製パッドの管の吸着部に金
属管に代る蛇腹状の管を有している。The IC handling device of the present invention has a bellows-shaped tube instead of a metal tube in the suction portion of the suction nozzle and the tube of the rubber pad.
【０００７】[0007]
【実施例】次に本発明について図面を参照して説明す
る。The present invention will be described below with reference to the drawings.
【０００８】図１（ａ），（ｂ）は、それぞれ本発明の
実施例１の断面図である。図１に示すように、本実施例
は吸引ノズル４に接続した蛇腹状の管１と、蛇腹状の管
１の先端に取り付けたゴム製パッド２と、蛇腹状の管１
の他端に固定したハンド３と、吸引ノズル４とを備え、
ＩＣ５を吸着する。また、図１（ａ）はＩＣ吸着前の図
であり、図１（ｂ）はＩＣ吸着時（ＩＣ搬送時）の図で
ある。FIGS. 1A and 1B are sectional views of a first embodiment of the present invention. As shown in FIG. 1, in this embodiment, a bellows-shaped tube 1 connected to a suction nozzle 4, a rubber pad 2 attached to the tip of the bellows-shaped tube 1, and a bellows-shaped tube 1 are provided.
A hand 3 fixed to the other end of the
Adsorb IC5. Further, FIG. 1A is a diagram before IC adsorption, and FIG. 1B is a diagram when IC adsorption (at IC conveyance).
【０００９】ＩＣハンドリング時には、まずハンド３が
ゴム製パッド２とＩＣ５とが接する位置に移動し、次に
吸引ノズル４による吸引力によりゴム製パッド２にＩＣ
５を吸着させる。この時、本実施例の特徴とする蛇腹状
の管の作用により、吸着前は、ゴム製パッド２にはあら
ゆる方向に自由度があるために、ＩＣ５に多少の傾きが
ある場合も吸着が可能となる。また、蛇腹状の管１を用
いていることにより吸着高さがずれても収縮し、吸着時
に無理な力をＩＣ５に加えることはない。At the time of IC handling, first, the hand 3 is moved to a position where the rubber pad 2 and the IC 5 are in contact with each other, and then the IC is applied to the rubber pad 2 by the suction force of the suction nozzle 4.
Adsorb 5 At this time, due to the action of the bellows-shaped tube, which is a feature of the present embodiment, the rubber pad 2 has a degree of freedom in all directions before adsorption, so that adsorption is possible even when the IC 5 has some inclination. Becomes Further, since the bellows-shaped tube 1 is used, the bellows-shaped tube 1 contracts even if the suction height shifts, and an unreasonable force is not applied to the IC 5 at the time of suction.
【００１０】吸着後は、図１（ｂ）に示す様に蛇腹状の
管１は収縮した状態となり、ＩＣ５は固定された状態で
搬送される。搬送先へハンド３が移動した後、吸引ノズ
ル４からの吸引力を止めることによりＩＣ５をゴム製パ
ッド２から分離し、ＩＣ５を搬送先に設置する。After adsorption, the bellows-shaped tube 1 is contracted as shown in FIG. 1 (b), and the IC 5 is conveyed in a fixed state. After the hand 3 is moved to the destination, the IC 5 is separated from the rubber pad 2 by stopping the suction force from the suction nozzle 4, and the IC 5 is installed at the destination.
【００１１】図２（ａ），（ｂ）はそれぞれ本発明の実
施例２の断面図である。図２は、従来の構造の金属管と
ゴム製パッドの間にばねに代って蛇腹状の管を組み込ん
だ場合の実施例であり、金属管を有するという点で実施
例１と異なる。本実施例は図２（ａ），（ｂ）に示すよ
うに、金属管６の先端に接続した蛇腹状の管１と、蛇腹
状の管１の先端に接続したゴム製パッド２と、金属管６
に固定され吸着部を移動するハンド３と、吸引ノズル４
とを備え、ＩＣ５を吸着する。また、図２（ａ）はＩＣ
吸着前の図であり、図２（ｂ）はＩＣ吸着時（ＩＣ搬送
時）の図である。実施例１と同様に、ＩＣハンドリング
時、まずハンド３がゴム製パッド２とＩＣ５とが接する
位置に移動し、次に吸引ノズル４による吸引力によりゴ
ム製パッド２，にＩＣ５を吸着させる。この時、本実施
例の特徴とする蛇腹状の管の作用により、吸着前は、ゴ
ム製パッド２にはあらゆる方向に自由度があるために、
ＩＣ５に多少の傾きがある場合も吸着が可能となる。ま
た、蛇腹状の管１を用いていることにより吸着高さがず
れても吸着時に無理な力をＩＣ５に加えることはない。FIGS. 2A and 2B are sectional views of a second embodiment of the present invention. FIG. 2 shows an embodiment in which a bellows-shaped pipe is incorporated in place of a spring between a metal pipe and a rubber pad having a conventional structure, and differs from the first embodiment in that a metal pipe is provided. In this embodiment, as shown in FIGS. 2A and 2B, a bellows-shaped tube 1 connected to the tip of a metal tube 6, a rubber pad 2 connected to the tip of the bellows-shaped tube 1, and a metal Tube 6
A hand 3 that is fixed to the moving part and moves the suction part, and a suction nozzle 4
And adsorbs IC5. Further, FIG. 2 (a) shows an IC
FIG. 2B is a diagram before adsorption, and FIG. 2B is a diagram during IC adsorption (at the time of IC transportation). Similar to the first embodiment, during IC handling, the hand 3 first moves to a position where the rubber pad 2 and the IC 5 are in contact with each other, and then the IC 5 is attracted to the rubber pad 2 by the suction force of the suction nozzle 4. At this time, due to the action of the bellows-shaped tube, which is a feature of this embodiment, since the rubber pad 2 has a degree of freedom in all directions before adsorption,
Adsorption is possible even when the IC5 has a slight inclination. Further, since the bellows-shaped tube 1 is used, even if the suction height is shifted, an unreasonable force is not applied to the IC 5 during suction.
【００１２】吸着後は、図２（ｂ）に示す様に蛇腹状の
管１は収縮した状態となり、ＩＣ５は固定された状態で
搬送される。搬送先へハンド３が移動した後、吸引ノズ
ル４からの吸引力を止めることによりＩＣ５をゴム製パ
ッド２から分離し、ＩＣ５を搬送先に設置する。このよ
うに、実施例２は、実施例１ほど自由度を要求しない場
合に有効である。After adsorption, the bellows-shaped tube 1 is contracted as shown in FIG. 2B, and the IC 5 is conveyed in a fixed state. After the hand 3 is moved to the destination, the IC 5 is separated from the rubber pad 2 by stopping the suction force from the suction nozzle 4, and the IC 5 is installed at the destination. As described above, the second embodiment is effective when the degree of freedom is not required as in the first embodiment.
【００１３】[0013]
【発明の効果】以上説明したように本発明のＩＣハンド
リング装置は、従来の金属管とばねの代わりに蛇腹状の
管を用いることにより、多少傾いたＩＣも吸着すること
ができるので、吸着ミスによる設備の停止回数を３０％
以上低減することができ、また、ＩＣ吸着時に無理な力
を加えることもないので、吸着時の無理な加圧によるＩ
Ｃ外観不良、特性不良を回避することができる。As described above, in the IC handling device of the present invention, since a bellows-shaped tube is used in place of the conventional metal tube and spring, even a slightly inclined IC can be adsorbed. 30% of equipment stoppages due to
It can be reduced more than the above, and since no unreasonable force is applied at the time of IC adsorption, I due to excessive pressure at the time of adsorption
C It is possible to avoid appearance defects and characteristic defects.
【図１】本発明の実施例１を示す図で、同図（ａ）は吸
着前、同図（ｂ）は吸着後を示すそれぞれ断面図であ
る。1A and 1B are views showing a first embodiment of the present invention, wherein FIG. 1A is a sectional view before adsorption and FIG. 1B is a sectional view after adsorption.
【図２】本発明の実施例２を示す図で、同図（ａ）は吸
着前，同図（ｂ）は吸着後を示すそれぞれ断面図であ
る。2A and 2B are views showing a second embodiment of the present invention, in which FIG. 2A is a sectional view before adsorption and FIG. 2B is a sectional view after adsorption.
【図３】従来のＩＣハンドリング装置を示す図で、同図
（ａ）は搬送中，同図（ｂ）は吸着状態をそれぞれ示す
断面図である。3A and 3B are views showing a conventional IC handling device, in which FIG. 3A is a sectional view showing a state of conveyance and FIG. 3B is a sectional view showing a suction state.
１ 蛇腹状の管 ２ ゴム製パッド ３ ハンド ４ 吸引ノズル ５ ＩＣ ６ 金属管 ７ ばね ８ ストッパー 1 bellows-like tube 2 rubber pad 3 hand 4 suction nozzle 5 IC 6 metal tube 7 spring 8 stopper
Claims (1)
付け、ＩＣを吸着して搬送するＩＣハンドリング装置に
おいて、前記吸引ノズルとゴム製パッドの間に蛇腹状の
管を接続したことを特徴とするＩＣハンドリング装置。1. An IC handling device for attaching a rubber pad to the tip of a suction nozzle to adsorb and convey an IC, wherein a bellows-shaped tube is connected between the suction nozzle and the rubber pad. IC handling device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14385092A JPH05337866A (en) | 1992-06-04 | 1992-06-04 | Ic handling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14385092A JPH05337866A (en) | 1992-06-04 | 1992-06-04 | Ic handling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05337866A true JPH05337866A (en) | 1993-12-21 |
Family
ID=15348417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14385092A Withdrawn JPH05337866A (en) | 1992-06-04 | 1992-06-04 | Ic handling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05337866A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100420778B1 (en) * | 2000-03-17 | 2004-03-02 | 가부시키가이샤 어드밴티스트 | Apparatus for supporting electronic components |
| US6772509B2 (en) * | 2002-01-28 | 2004-08-10 | Motorola, Inc. | Method of separating and handling a thin semiconductor die on a wafer |
| JP2007329506A (en) * | 2003-03-31 | 2007-12-20 | Asml Netherlands Bv | Supporting structure, lithographic projection apparatus, and method of manufacturing device |
| JP2014108492A (en) * | 2012-12-03 | 2014-06-12 | Ishida Co Ltd | Absorption transport device and absorption transport method |
| KR102183925B1 (en) * | 2020-07-14 | 2020-11-27 | 주식회사 엘에스텍 | Nozzle tip and semiconductor apparatus including the same |
-
1992
- 1992-06-04 JP JP14385092A patent/JPH05337866A/en not_active Withdrawn
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100420778B1 (en) * | 2000-03-17 | 2004-03-02 | 가부시키가이샤 어드밴티스트 | Apparatus for supporting electronic components |
| US6772509B2 (en) * | 2002-01-28 | 2004-08-10 | Motorola, Inc. | Method of separating and handling a thin semiconductor die on a wafer |
| JP2007329506A (en) * | 2003-03-31 | 2007-12-20 | Asml Netherlands Bv | Supporting structure, lithographic projection apparatus, and method of manufacturing device |
| JP4625059B2 (en) * | 2003-03-31 | 2011-02-02 | エーエスエムエル ネザーランズ ビー．ブイ． | Support structure, lithographic projection apparatus, robot and device manufacturing method |
| JP2014108492A (en) * | 2012-12-03 | 2014-06-12 | Ishida Co Ltd | Absorption transport device and absorption transport method |
| KR102183925B1 (en) * | 2020-07-14 | 2020-11-27 | 주식회사 엘에스텍 | Nozzle tip and semiconductor apparatus including the same |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990831 |