JPH05337866A - Ic handling device - Google Patents

Ic handling device

Info

Publication number
JPH05337866A
JPH05337866A JP14385092A JP14385092A JPH05337866A JP H05337866 A JPH05337866 A JP H05337866A JP 14385092 A JP14385092 A JP 14385092A JP 14385092 A JP14385092 A JP 14385092A JP H05337866 A JPH05337866 A JP H05337866A
Authority
JP
Japan
Prior art keywords
suction
rubber pad
bellows
adsorption
time
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP14385092A
Other languages
Japanese (ja)
Inventor
Hiroaki Matsuoka
宏明 松岡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Yamaguchi Ltd
Original Assignee
NEC Yamaguchi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Yamaguchi Ltd filed Critical NEC Yamaguchi Ltd
Priority to JP14385092A priority Critical patent/JPH05337866A/en
Publication of JPH05337866A publication Critical patent/JPH05337866A/en
Withdrawn legal-status Critical Current

Links

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Manipulator (AREA)

Abstract

PURPOSE:To reduce the stop frequency of equipment generated by a suction error at the time of performing the horizontal conveyance of an IC after resin filling and prevent unreasonable force from being applied to the IC at the time of sucking the IC. CONSTITUTION:A bellows pipe 1 is provided between a suction nozzle 4 and a rubber pad 2. The freedom of the rubber pad 2 is thereby enlarged, so that even a slightly inclined IC 5 can be sucked, and at the suction time, suction can be performed without applying unreasonable force to the IC 5.

Description

【発明の詳細な説明】Detailed Description of the Invention

【0001】[0001]

【産業上の利用分野】本発明は半導体装置(以下、I
C)の製造工程に用いるICハンドリング装置に関し、
特に樹脂封入後のICの搬送に用いるハンドリング装置
に関する。
BACKGROUND OF THE INVENTION The present invention relates to a semiconductor device (hereinafter referred to as I
Regarding the IC handling device used in the manufacturing process of C),
In particular, the present invention relates to a handling device used for carrying an IC after resin encapsulation.

【0002】[0002]

【従来の技術】従来、この種のICハンドリング装置
は、金属管の先端部にゴムのパッドを有する吸着部を備
えており、図3の断面図を用いて説明すると図3
(a),図3(b)に示すように、金属管6の先端に取
り付けられたゴム製パッド2と、金属管6を通し吸着部
自体を移動させる台(以下、ハンド3)と、金属管6の
他端に接続した吸引ノズル4と、ゴム製パッド2を押圧
するばね7と、ばね7のストッパー8とを備え、IC5
を吸着する。このように、ゴム製パッド2と金属管6が
ばね7を緩衝材として上下の自由度を持った構造となっ
ている。
2. Description of the Related Art Conventionally, an IC handling device of this type is provided with a suction portion having a rubber pad at the tip of a metal tube, which will be described with reference to the sectional view of FIG.
As shown in FIGS. 3 (a) and 3 (b), a rubber pad 2 attached to the tip of a metal tube 6, a stand for moving the suction section itself through the metal tube 6, and a metal. The suction nozzle 4 connected to the other end of the pipe 6, a spring 7 for pressing the rubber pad 2, and a stopper 8 for the spring 7 are provided.
Adsorb. In this way, the rubber pad 2 and the metal tube 6 have a structure having a vertical degree of freedom using the spring 7 as a cushioning material.

【0003】吸着・搬送の方法としては、ゴム製パッド
2がIC5に接する位置までハンド3を移動し、吸引ノ
ズル4からの吸引力により、IC5をゴム製パッドに吸
着させ搬送先にハンド3を移動し、吸引を止めることに
よりIC5をゴム製パッド2から分離し、搬送先に置く
という方法が一般的である。
As a suction / transportation method, the hand 3 is moved to a position where the rubber pad 2 contacts the IC 5, and the suction force from the suction nozzle 4 causes the IC 5 to be attracted to the rubber pad and the hand 3 to the transport destination. A general method is to move the IC 5 to separate it from the rubber pad 2 by stopping suction and place it at the destination.

【0004】なお、図3(a)は、ICを搬送中の図で
あり、図3(b)は、ゴム製パッド2をIC5に押しつ
けて吸着しようとしているところの図である。
Incidentally, FIG. 3 (a) is a view showing that the IC is being conveyed, and FIG. 3 (b) is a view showing that the rubber pad 2 is being pressed against the IC 5 for adsorption.

【0005】[0005]

【発明が解決しようとする課題】上述した従来のハンド
リング装置では、第1に吸着部の自由度が上下方向にし
かないために、極く僅かなICの傾きに対しても吸着ミ
スを起こす。第2に吸着部の高さがずれてICと吸着部
との距離が接近し過ぎた場合、ICに無理な力が加わり
外観不良や特性不良を誘発させるという欠点があった。
In the conventional handling device described above, firstly, since the degree of freedom of the suction portion is only in the vertical direction, a suction error occurs even with a very slight inclination of the IC. Secondly, when the height of the suction portion is deviated and the distance between the IC and the suction portion becomes too close, an unreasonable force is applied to the IC to cause a defective appearance and a characteristic defect.

【0006】[0006]

【課題を解決するための手段】本発明のICハンドリン
グ装置は、吸引ノズルとゴム製パッドの管の吸着部に金
属管に代る蛇腹状の管を有している。
The IC handling device of the present invention has a bellows-shaped tube instead of a metal tube in the suction portion of the suction nozzle and the tube of the rubber pad.

【0007】[0007]

【実施例】次に本発明について図面を参照して説明す
る。
The present invention will be described below with reference to the drawings.

【0008】図1(a),(b)は、それぞれ本発明の
実施例1の断面図である。図1に示すように、本実施例
は吸引ノズル4に接続した蛇腹状の管1と、蛇腹状の管
1の先端に取り付けたゴム製パッド2と、蛇腹状の管1
の他端に固定したハンド3と、吸引ノズル4とを備え、
IC5を吸着する。また、図1(a)はIC吸着前の図
であり、図1(b)はIC吸着時(IC搬送時)の図で
ある。
FIGS. 1A and 1B are sectional views of a first embodiment of the present invention. As shown in FIG. 1, in this embodiment, a bellows-shaped tube 1 connected to a suction nozzle 4, a rubber pad 2 attached to the tip of the bellows-shaped tube 1, and a bellows-shaped tube 1 are provided.
A hand 3 fixed to the other end of the
Adsorb IC5. Further, FIG. 1A is a diagram before IC adsorption, and FIG. 1B is a diagram when IC adsorption (at IC conveyance).

【0009】ICハンドリング時には、まずハンド3が
ゴム製パッド2とIC5とが接する位置に移動し、次に
吸引ノズル4による吸引力によりゴム製パッド2にIC
5を吸着させる。この時、本実施例の特徴とする蛇腹状
の管の作用により、吸着前は、ゴム製パッド2にはあら
ゆる方向に自由度があるために、IC5に多少の傾きが
ある場合も吸着が可能となる。また、蛇腹状の管1を用
いていることにより吸着高さがずれても収縮し、吸着時
に無理な力をIC5に加えることはない。
At the time of IC handling, first, the hand 3 is moved to a position where the rubber pad 2 and the IC 5 are in contact with each other, and then the IC is applied to the rubber pad 2 by the suction force of the suction nozzle 4.
Adsorb 5 At this time, due to the action of the bellows-shaped tube, which is a feature of the present embodiment, the rubber pad 2 has a degree of freedom in all directions before adsorption, so that adsorption is possible even when the IC 5 has some inclination. Becomes Further, since the bellows-shaped tube 1 is used, the bellows-shaped tube 1 contracts even if the suction height shifts, and an unreasonable force is not applied to the IC 5 at the time of suction.

【0010】吸着後は、図1(b)に示す様に蛇腹状の
管1は収縮した状態となり、IC5は固定された状態で
搬送される。搬送先へハンド3が移動した後、吸引ノズ
ル4からの吸引力を止めることによりIC5をゴム製パ
ッド2から分離し、IC5を搬送先に設置する。
After adsorption, the bellows-shaped tube 1 is contracted as shown in FIG. 1 (b), and the IC 5 is conveyed in a fixed state. After the hand 3 is moved to the destination, the IC 5 is separated from the rubber pad 2 by stopping the suction force from the suction nozzle 4, and the IC 5 is installed at the destination.

【0011】図2(a),(b)はそれぞれ本発明の実
施例2の断面図である。図2は、従来の構造の金属管と
ゴム製パッドの間にばねに代って蛇腹状の管を組み込ん
だ場合の実施例であり、金属管を有するという点で実施
例1と異なる。本実施例は図2(a),(b)に示すよ
うに、金属管6の先端に接続した蛇腹状の管1と、蛇腹
状の管1の先端に接続したゴム製パッド2と、金属管6
に固定され吸着部を移動するハンド3と、吸引ノズル4
とを備え、IC5を吸着する。また、図2(a)はIC
吸着前の図であり、図2(b)はIC吸着時(IC搬送
時)の図である。実施例1と同様に、ICハンドリング
時、まずハンド3がゴム製パッド2とIC5とが接する
位置に移動し、次に吸引ノズル4による吸引力によりゴ
ム製パッド2,にIC5を吸着させる。この時、本実施
例の特徴とする蛇腹状の管の作用により、吸着前は、ゴ
ム製パッド2にはあらゆる方向に自由度があるために、
IC5に多少の傾きがある場合も吸着が可能となる。ま
た、蛇腹状の管1を用いていることにより吸着高さがず
れても吸着時に無理な力をIC5に加えることはない。
FIGS. 2A and 2B are sectional views of a second embodiment of the present invention. FIG. 2 shows an embodiment in which a bellows-shaped pipe is incorporated in place of a spring between a metal pipe and a rubber pad having a conventional structure, and differs from the first embodiment in that a metal pipe is provided. In this embodiment, as shown in FIGS. 2A and 2B, a bellows-shaped tube 1 connected to the tip of a metal tube 6, a rubber pad 2 connected to the tip of the bellows-shaped tube 1, and a metal Tube 6
A hand 3 that is fixed to the moving part and moves the suction part, and a suction nozzle 4
And adsorbs IC5. Further, FIG. 2 (a) shows an IC
FIG. 2B is a diagram before adsorption, and FIG. 2B is a diagram during IC adsorption (at the time of IC transportation). Similar to the first embodiment, during IC handling, the hand 3 first moves to a position where the rubber pad 2 and the IC 5 are in contact with each other, and then the IC 5 is attracted to the rubber pad 2 by the suction force of the suction nozzle 4. At this time, due to the action of the bellows-shaped tube, which is a feature of this embodiment, since the rubber pad 2 has a degree of freedom in all directions before adsorption,
Adsorption is possible even when the IC5 has a slight inclination. Further, since the bellows-shaped tube 1 is used, even if the suction height is shifted, an unreasonable force is not applied to the IC 5 during suction.

【0012】吸着後は、図2(b)に示す様に蛇腹状の
管1は収縮した状態となり、IC5は固定された状態で
搬送される。搬送先へハンド3が移動した後、吸引ノズ
ル4からの吸引力を止めることによりIC5をゴム製パ
ッド2から分離し、IC5を搬送先に設置する。このよ
うに、実施例2は、実施例1ほど自由度を要求しない場
合に有効である。
After adsorption, the bellows-shaped tube 1 is contracted as shown in FIG. 2B, and the IC 5 is conveyed in a fixed state. After the hand 3 is moved to the destination, the IC 5 is separated from the rubber pad 2 by stopping the suction force from the suction nozzle 4, and the IC 5 is installed at the destination. As described above, the second embodiment is effective when the degree of freedom is not required as in the first embodiment.

【0013】[0013]

【発明の効果】以上説明したように本発明のICハンド
リング装置は、従来の金属管とばねの代わりに蛇腹状の
管を用いることにより、多少傾いたICも吸着すること
ができるので、吸着ミスによる設備の停止回数を30%
以上低減することができ、また、IC吸着時に無理な力
を加えることもないので、吸着時の無理な加圧によるI
C外観不良、特性不良を回避することができる。
As described above, in the IC handling device of the present invention, since a bellows-shaped tube is used in place of the conventional metal tube and spring, even a slightly inclined IC can be adsorbed. 30% of equipment stoppages due to
It can be reduced more than the above, and since no unreasonable force is applied at the time of IC adsorption, I due to excessive pressure at the time of adsorption
C It is possible to avoid appearance defects and characteristic defects.

【図面の簡単な説明】[Brief description of drawings]

【図1】本発明の実施例1を示す図で、同図(a)は吸
着前、同図(b)は吸着後を示すそれぞれ断面図であ
る。
1A and 1B are views showing a first embodiment of the present invention, wherein FIG. 1A is a sectional view before adsorption and FIG. 1B is a sectional view after adsorption.

【図2】本発明の実施例2を示す図で、同図(a)は吸
着前,同図(b)は吸着後を示すそれぞれ断面図であ
る。
2A and 2B are views showing a second embodiment of the present invention, in which FIG. 2A is a sectional view before adsorption and FIG. 2B is a sectional view after adsorption.

【図3】従来のICハンドリング装置を示す図で、同図
(a)は搬送中,同図(b)は吸着状態をそれぞれ示す
断面図である。
3A and 3B are views showing a conventional IC handling device, in which FIG. 3A is a sectional view showing a state of conveyance and FIG. 3B is a sectional view showing a suction state.

【符号の説明】[Explanation of symbols]

1 蛇腹状の管 2 ゴム製パッド 3 ハンド 4 吸引ノズル 5 IC 6 金属管 7 ばね 8 ストッパー 1 bellows-like tube 2 rubber pad 3 hand 4 suction nozzle 5 IC 6 metal tube 7 spring 8 stopper

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 吸引ノズルの先端にゴム製パッドを取り
付け、ICを吸着して搬送するICハンドリング装置に
おいて、前記吸引ノズルとゴム製パッドの間に蛇腹状の
管を接続したことを特徴とするICハンドリング装置。
1. An IC handling device for attaching a rubber pad to the tip of a suction nozzle to adsorb and convey an IC, wherein a bellows-shaped tube is connected between the suction nozzle and the rubber pad. IC handling device.
JP14385092A 1992-06-04 1992-06-04 Ic handling device Withdrawn JPH05337866A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14385092A JPH05337866A (en) 1992-06-04 1992-06-04 Ic handling device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14385092A JPH05337866A (en) 1992-06-04 1992-06-04 Ic handling device

Publications (1)

Publication Number Publication Date
JPH05337866A true JPH05337866A (en) 1993-12-21

Family

ID=15348417

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14385092A Withdrawn JPH05337866A (en) 1992-06-04 1992-06-04 Ic handling device

Country Status (1)

Country Link
JP (1) JPH05337866A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100420778B1 (en) * 2000-03-17 2004-03-02 가부시키가이샤 어드밴티스트 Apparatus for supporting electronic components
US6772509B2 (en) * 2002-01-28 2004-08-10 Motorola, Inc. Method of separating and handling a thin semiconductor die on a wafer
JP2007329506A (en) * 2003-03-31 2007-12-20 Asml Netherlands Bv Supporting structure, lithographic projection apparatus, and method of manufacturing device
JP2014108492A (en) * 2012-12-03 2014-06-12 Ishida Co Ltd Absorption transport device and absorption transport method
KR102183925B1 (en) * 2020-07-14 2020-11-27 주식회사 엘에스텍 Nozzle tip and semiconductor apparatus including the same

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100420778B1 (en) * 2000-03-17 2004-03-02 가부시키가이샤 어드밴티스트 Apparatus for supporting electronic components
US6772509B2 (en) * 2002-01-28 2004-08-10 Motorola, Inc. Method of separating and handling a thin semiconductor die on a wafer
JP2007329506A (en) * 2003-03-31 2007-12-20 Asml Netherlands Bv Supporting structure, lithographic projection apparatus, and method of manufacturing device
JP4625059B2 (en) * 2003-03-31 2011-02-02 エーエスエムエル ネザーランズ ビー.ブイ. Support structure, lithographic projection apparatus, robot and device manufacturing method
JP2014108492A (en) * 2012-12-03 2014-06-12 Ishida Co Ltd Absorption transport device and absorption transport method
KR102183925B1 (en) * 2020-07-14 2020-11-27 주식회사 엘에스텍 Nozzle tip and semiconductor apparatus including the same

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Legal Events

Date Code Title Description
A300 Withdrawal of application because of no request for examination

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19990831