JPH05335175A - Laminated ceramic capacitor - Google Patents
Laminated ceramic capacitorInfo
- Publication number
- JPH05335175A JPH05335175A JP4136718A JP13671892A JPH05335175A JP H05335175 A JPH05335175 A JP H05335175A JP 4136718 A JP4136718 A JP 4136718A JP 13671892 A JP13671892 A JP 13671892A JP H05335175 A JPH05335175 A JP H05335175A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- ceramic capacitor
- inner electrode
- laminated
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Ceramic Capacitors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、積層セラミックコンデ
ンサに関し、特に、積層セラミックコンデンサの電極に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a monolithic ceramic capacitor, and more particularly to electrodes of a monolithic ceramic capacitor.
【０００２】[0002]
【従来の技術】従来の積層セラミックコンデンサは、図
３に示すように、セラミック誘電体１２に内部電極９を
印刷して積層し、焼成した後に外部電極１１を形成する
構造となっている。2. Description of the Related Art As shown in FIG. 3, a conventional monolithic ceramic capacitor has a structure in which an internal electrode 9 is printed on a ceramic dielectric 12 and laminated, and after firing, an external electrode 11 is formed.
【０００３】特に内部電極９は、できるだけ均一な厚さ
に形成されており、内部電極９の外部電極１１との接続
部１０も同一の厚さとなっている。In particular, the internal electrode 9 is formed to have a thickness as uniform as possible, and the connecting portion 10 of the internal electrode 9 with the external electrode 11 also has the same thickness.
【０００４】また特に最近では、積層セラミックコンデ
ンサの大容量化の動きにともない、セラミック誘電体１
２と内部電極９の厚さは、薄くなる傾向がある。Further, particularly recently, with the increase in capacity of monolithic ceramic capacitors, the ceramic dielectric 1
2 and the internal electrodes 9 tend to be thin.
【０００５】[0005]
【発明が解決しようとする課題】この従来の積層セラミ
ックコンデンサでは、このようなセラミック誘電体１２
及び内部電極９の薄膜化にともない、内部電極の外部電
極との接続部１０も薄くなり、接続面積が小さくなるこ
とにより、内部電極９と外部電極１１の接続強度が低下
する傾向があった。In this conventional monolithic ceramic capacitor, such a ceramic dielectric 12 is used.
Also, as the inner electrode 9 becomes thinner, the connecting portion 10 between the inner electrode and the outer electrode also becomes thinner and the connecting area becomes smaller, so that the connection strength between the inner electrode 9 and the outer electrode 11 tends to decrease.
【０００６】このために、実装時あるいはコンデンサ使
用中の熱ショックによる、内部電極９と外部電極１１の
接続不良の発生率が高くなるという課題があった。For this reason, there has been a problem that the rate of occurrence of connection failure between the internal electrode 9 and the external electrode 11 due to heat shock during mounting or during use of the capacitor increases.
【０００７】本発明は従来の上記実情に鑑みてなされた
ものであり、従って本発明の目的は、従来の技術に内在
する上記課題を解決することを可能とした新規な積層セ
ラミックコンデンサを提供することにある。The present invention has been made in view of the above-mentioned conventional circumstances, and therefore an object of the present invention is to provide a novel monolithic ceramic capacitor capable of solving the above problems inherent in the prior art. Especially.
【０００８】[0008]
【課題を解決するための手段】上記目的を達成する為
に、本発明に係る積層セラミックコンデンサは、内部電
極のうち特に内部電極の外部電極との接続部の厚みを厚
くして構成され、しかして、内部電極と外部電極の接続
強度を上げている。In order to achieve the above object, the multilayer ceramic capacitor according to the present invention is constructed by increasing the thickness of the connection portion of the internal electrodes, particularly the internal electrodes with the external electrodes. The connection strength between the internal electrode and the external electrode is increased.
【０００９】[0009]
【実施例】次に本発明をその好ましい各実施例について
図面を参照して具体的に説明する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention will now be specifically described with reference to the drawings for each of its preferred embodiments.
【００１０】図１は本発明による第１の実施例を示す断
面図である。FIG. 1 is a sectional view showing a first embodiment according to the present invention.
【００１１】図１を参照するに、まずチタン酸バリウム
を主成分とする約２５μｍ厚のシート状に加工されたセ
ラミック誘電体４に、内部電極１として、銀・パラジウ
ムのペーストを５μｍ厚に印刷した。この時、印刷時の
マスクの厚さを部分的に厚くし、特に内部電極１の外部
電極３との接続部２にあたる部分を１０μｍの厚さにし
た。この後、内部電極１が印刷されたシート状のセラミ
ック誘電体を積層し、約１２００℃にて焼結し、銀ペー
ストを塗布し、約６００℃で焼成することにより外部電
極３を形成した。Referring to FIG. 1, first, a silver-palladium paste as an internal electrode 1 is printed to a thickness of 5 μm as an internal electrode 1 on a ceramic dielectric body 4 containing barium titanate as a main component and processed into a sheet shape having a thickness of about 25 μm. did. At this time, the thickness of the mask at the time of printing was partially increased, and particularly, the portion corresponding to the connection portion 2 of the internal electrode 1 with the external electrode 3 was made to have a thickness of 10 μm. Thereafter, sheet-shaped ceramic dielectrics having the internal electrodes 1 printed thereon were laminated, sintered at about 1200 ° C., coated with silver paste, and baked at about 600 ° C. to form the external electrodes 3.
【００１２】上記方法により、長さ３．２ｍｍ、幅１．
６ｍｍ、厚さ１．０ｍｍで、定格電圧１６Ｖ、静電容量
１μＦの積層セラミックコンデンサを得た。According to the above method, the length is 3.2 mm and the width is 1.
A laminated ceramic capacitor having a size of 6 mm, a thickness of 1.0 mm, a rated voltage of 16 V and a capacitance of 1 μF was obtained.
【００１３】この積層セラミックコンデンサ１００個
と、従来方法にて形成した同一形状同一定格、同一容量
の積層セラミックコンデンサ１００個に温度サイクル試
験を行ったところ、下記のように著しい改善結果が得ら
れた。A temperature cycle test was carried out on 100 of these monolithic ceramic capacitors and 100 monolithic ceramic capacitors of the same shape, same rating and same capacity formed by the conventional method, and the following remarkable improvement results were obtained. ..
【００１４】[0014]
【表１】 [Table 1]
【００１５】図２は、本発明による第２の実施例を示す
断面図である。FIG. 2 is a sectional view showing a second embodiment according to the present invention.
【００１６】図２を参照するに、この第２の実施例は、
内部電極５の外部電極７との接続部６の厚みを２５μｍ
とセラミック誘電体８と同じ厚さにし、より外部電極７
との接続が強化されたものである。Referring to FIG. 2, this second embodiment is
The thickness of the connection portion 6 of the internal electrode 5 with the external electrode 7 is 25 μm.
And the ceramic dielectric 8 have the same thickness as the external electrode 7
The connection with is strengthened.
【００１７】[0017]
【発明の効果】以上説明したように、本発明によれば、
内部電極として印刷された金属ペーストを、内部電極と
外部電極の接続部が他の部分に比べ、厚くなるように形
成したので、積層セラミックコンデンサの大容量化にと
もない内部電極を薄膜化にした際に、内部電極と外部電
極の接続面積を小さくする必要がなく、温度サイクルな
ど熱ショックに強い、積層セラミックコンデンサを得る
ことができる。As described above, according to the present invention,
Since the metal paste printed as the internal electrode was formed so that the connection between the internal electrode and the external electrode was thicker than other parts, when the internal electrode was made thinner as the capacity of the multilayer ceramic capacitor increased. Moreover, it is not necessary to reduce the connection area between the internal electrode and the external electrode, and it is possible to obtain a monolithic ceramic capacitor that is resistant to thermal shock such as temperature cycling.
【図１】本発明による第１の実施例を示す断面図であ
る。FIG. 1 is a sectional view showing a first embodiment according to the present invention.
【図２】本発明による第２の実施例を示す断面図であ
る。FIG. 2 is a sectional view showing a second embodiment according to the present invention.
【図３】従来例を示す断面図である。FIG. 3 is a cross-sectional view showing a conventional example.
１…内部電極 ２…内部電極（外部電極との接続部） ３…外部電極 ４…セラミック誘電体 ５…内部電極 ６…内部電極（外部電極との接続部） ７…外部電極 ８…セラミック誘電体 ９…内部電極 １０…内部電極（外部電極との接続部） １１…外部電極 １２…セラミック誘電体 DESCRIPTION OF SYMBOLS 1 ... Internal electrode 2 ... Internal electrode (connection part with external electrode) 3 ... External electrode 4 ... Ceramic dielectric 5 ... Internal electrode 6 ... Internal electrode (connection part with external electrode) 7 ... External electrode 8 ... Ceramic dielectric 9 ... Internal electrode 10 ... Internal electrode (connection part with external electrode) 11 ... External electrode 12 ... Ceramic dielectric
Claims (1)
電体に、内部電極として金属ペーストを印刷し、積層し
て高温の焼成炉で焼き固めた後に金属ペースト、金属め
っきあるいはそれらの両方を組み合わせて外部電極を形
成してなる積層セラミックコンデンサにおいて、内部電
極として印刷された金属ペーストを、内部電極と外部電
極の接続部が他の部分に比べて厚くなるように形成した
ことを特徴とする積層セラミックコンデンサ。1. A ceramic dielectric processed into a thin sheet is printed with a metal paste as an internal electrode, laminated and baked in a high-temperature firing furnace, and then the metal paste, metal plating, or a combination of both. In a monolithic ceramic capacitor having external electrodes formed, a metal paste printed as an internal electrode is formed so that a connecting portion between the internal electrode and the external electrode is thicker than other portions. Capacitors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4136718A JPH05335175A (en) | 1992-05-28 | 1992-05-28 | Laminated ceramic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4136718A JPH05335175A (en) | 1992-05-28 | 1992-05-28 | Laminated ceramic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05335175A true JPH05335175A (en) | 1993-12-17 |
Family
ID=15181874
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4136718A Pending JPH05335175A (en) | 1992-05-28 | 1992-05-28 | Laminated ceramic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05335175A (en) |
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0969463A (en) * | 1995-08-30 | 1997-03-11 | Nec Corp | Multilayer ceramic capacitor and manufacture thereof |
| EP1139352A1 (en) * | 1998-10-13 | 2001-10-04 | Matsushita Electric Industrial Co., Ltd. | Pct chip thermistor and method of manufacture thereof |
| JP2006332601A (en) * | 2005-04-27 | 2006-12-07 | Kyocera Corp | Multilayer electronic component |
| US7329976B2 (en) * | 2005-04-27 | 2008-02-12 | Kyocera Corporation | Laminated electronic component |
| JP2011124540A (en) * | 2009-12-10 | 2011-06-23 | Samsung Electro-Mechanics Co Ltd | Stacked ceramic capacitor and method of manufacturing the same |
| WO2012114784A1 (en) * | 2011-02-24 | 2012-08-30 | 株式会社村田製作所 | Laminated ceramic electronic part, and method of manufacturing thereof |
| JP2012253346A (en) * | 2011-05-31 | 2012-12-20 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic electronic component and method for manufacturing the same |
| US20130229748A1 (en) * | 2012-02-17 | 2013-09-05 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and method of manufacturing the same |
| JP2013258230A (en) * | 2012-06-12 | 2013-12-26 | Murata Mfg Co Ltd | Ceramic electronic component |
| CN104885170A (en) * | 2012-12-28 | 2015-09-02 | 株式会社村田制作所 | Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component |
| US9236188B1 (en) * | 2015-02-23 | 2016-01-12 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor |
| US11636977B2 (en) * | 2020-08-28 | 2023-04-25 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor |
| WO2024029150A1 (en) * | 2022-08-05 | 2024-02-08 | 株式会社村田製作所 | Multilayer ceramic capacitor |
-
1992
- 1992-05-28 JP JP4136718A patent/JPH05335175A/en active Pending
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0969463A (en) * | 1995-08-30 | 1997-03-11 | Nec Corp | Multilayer ceramic capacitor and manufacture thereof |
| EP1139352A1 (en) * | 1998-10-13 | 2001-10-04 | Matsushita Electric Industrial Co., Ltd. | Pct chip thermistor and method of manufacture thereof |
| EP1139352A4 (en) * | 1998-10-13 | 2007-05-02 | Matsushita Electric Ind Co Ltd | Pct chip thermistor and method of manufacture thereof |
| JP2006332601A (en) * | 2005-04-27 | 2006-12-07 | Kyocera Corp | Multilayer electronic component |
| US7329976B2 (en) * | 2005-04-27 | 2008-02-12 | Kyocera Corporation | Laminated electronic component |
| JP2011124540A (en) * | 2009-12-10 | 2011-06-23 | Samsung Electro-Mechanics Co Ltd | Stacked ceramic capacitor and method of manufacturing the same |
| US8264815B2 (en) | 2009-12-10 | 2012-09-11 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic capacitor and method for manufacturing the same |
| WO2012114784A1 (en) * | 2011-02-24 | 2012-08-30 | 株式会社村田製作所 | Laminated ceramic electronic part, and method of manufacturing thereof |
| JP2012253346A (en) * | 2011-05-31 | 2012-12-20 | Samsung Electro-Mechanics Co Ltd | Multilayer ceramic electronic component and method for manufacturing the same |
| US10347421B2 (en) | 2012-02-17 | 2019-07-09 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and method of manufacturing the same |
| US20130229748A1 (en) * | 2012-02-17 | 2013-09-05 | Samsung Electro-Mechanics Co., Ltd. | Multilayer ceramic electronic component and method of manufacturing the same |
| JP2013258230A (en) * | 2012-06-12 | 2013-12-26 | Murata Mfg Co Ltd | Ceramic electronic component |
| US9105400B2 (en) | 2012-06-12 | 2015-08-11 | Murata Manufacturing Co., Ltd. | Ceramic electronic component including internal electrode with thick section |
| CN104885170A (en) * | 2012-12-28 | 2015-09-02 | 株式会社村田制作所 | Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component |
| JPWO2014104061A1 (en) * | 2012-12-28 | 2017-01-12 | 株式会社村田製作所 | Multilayer ceramic electronic component and method of manufacturing the multilayer ceramic electronic component |
| US9905364B2 (en) | 2012-12-28 | 2018-02-27 | Murata Manufacturing Co., Ltd. | Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component |
| US9236188B1 (en) * | 2015-02-23 | 2016-01-12 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor |
| US11636977B2 (en) * | 2020-08-28 | 2023-04-25 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor |
| US11862398B2 (en) * | 2020-08-28 | 2024-01-02 | Murata Manufacturing Co., Ltd. | Multilayer ceramic capacitor |
| WO2024029150A1 (en) * | 2022-08-05 | 2024-02-08 | 株式会社村田製作所 | Multilayer ceramic capacitor |
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