JPH05326114A - Printed heater and manufacture thereof - Google Patents
Printed heater and manufacture thereofInfo
- Publication number
- JPH05326114A JPH05326114A JP4108742A JP10874292A JPH05326114A JP H05326114 A JPH05326114 A JP H05326114A JP 4108742 A JP4108742 A JP 4108742A JP 10874292 A JP10874292 A JP 10874292A JP H05326114 A JPH05326114 A JP H05326114A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- hole
- substrate
- conductor
- printing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Surface Heating Bodies (AREA)
- Resistance Heating (AREA)
- Fixing For Electrophotography (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、例えば複写機のトナ
ー定着等に用いられるヒーターの一種である印刷ヒータ
ーの構造および製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure and a manufacturing method of a printing heater which is a kind of heater used for fixing toner of a copying machine.
【０００２】[0002]
【従来の技術】電子式複写機のトナー定着等に用いられ
る定着ヒーターとして、近年、細長いセラミック等の絶
縁性基板の表面に銀・パラジウム合金粉末等のペースト
を印刷塗布焼成して細長いライン状の抵抗発熱体層を形
成した印刷ヒーターが実用化されている。このライン状
の抵抗発熱体層の両端に電圧を印加し、抵抗発熱体層の
発熱でトナーを定着するものである。、の定着用の印刷
ヒーターは、抵抗発熱体の表面がガラス層で被覆されて
いる。2. Description of the Related Art In recent years, as a fixing heater used for fixing toner in an electronic copying machine, a paste such as a silver / palladium alloy powder is printed on a surface of an insulating substrate such as a slender ceramic and baked to form a slender line. A printing heater having a resistance heating element layer has been put into practical use. A voltage is applied to both ends of this line-shaped resistance heating element layer, and the toner is fixed by the heat generated by the resistance heating element layer. In the printing heater for fixing No. 3, the surface of the resistance heating element is covered with a glass layer.
【０００３】この印刷ヒーターの一種として、細長い絶
縁性基板にスルーホールを設け、前記基板表側に印刷形
成された抵抗発熱体層と電気的に導通し、かつ前記スル
ーホールの周囲の基板表側及び裏側ならびにスルーホー
ル内側に連続的に導体貫通層を印刷形成し、さらにこの
導体貫通層に電気的に接続する裏側導通層を設けた両面
利用の印刷ヒーターが本発明者らによって開発されつつ
ある。As a kind of this printing heater, a through hole is provided in an elongated insulating substrate to electrically connect with a resistance heating element layer formed by printing on the front side of the substrate, and the front and back sides of the substrate around the through hole. In addition, the present inventors are developing a double-sided printing heater in which a conductor through layer is continuously formed by printing inside the through hole, and a back side conductive layer electrically connected to the conductor through layer is provided.
【０００４】この両面利用の印刷ヒーターは、抵抗発熱
体層のスルーホールとは反対側の端部に表側電極部を形
成し、裏側導通層の前記スルーホールとは反対側の端部
に裏側電極部を形成してあり、両電極部を基板の片側に
設けることで、ヒーターへのリード線の処理を容易かつ
安全にしたものである。In this double-sided printing heater, a front electrode portion is formed at the end of the resistance heating element layer opposite to the through hole, and a back electrode is formed at the end of the back conductive layer opposite to the through hole. Portions are formed and both electrode portions are provided on one side of the substrate, so that the treatment of the lead wire to the heater is easy and safe.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、従来の
両面利用の印刷ヒーターは、電気絶縁の信頼性が片面利
用の印刷ヒーターに比べて低いという欠点があった。す
なわち、従来抵抗発熱体層や各種導通層の電気絶縁は、
抵抗発熱体層や各種導通層の表面に積層されたガラス層
で行っていたが、このガラス層の絶縁耐圧が、スルーホ
ール付近で低下する欠点があった。定着用のヒーターに
ついては絶縁耐圧がどこでも直流電圧１５００Ｖ以上確
保する必要があるが、スルーホール付近では、１５００
Ｖに満たない場合があった。However, the conventional double-sided printing heater has a drawback that the reliability of electrical insulation is lower than that of the single-sided printing heater. That is, the electrical insulation of the conventional resistance heating element layer and various conductive layers is
This is done with a glass layer laminated on the surface of the resistance heating element layer and various conductive layers, but there is a drawback that the withstand voltage of this glass layer is lowered near the through hole. It is necessary to secure a DC voltage of 1500V or higher for the fixing heater everywhere, but 1500V is required near the through hole.
In some cases, it was less than V.
【０００６】本発明の目的は、スルーホール付近の絶縁
耐圧を向上させた、改良された構造を有する印刷ヒータ
ーおよびその製造方法を提供することにある。It is an object of the present invention to provide a printing heater having an improved structure in which the withstand voltage near the through hole is improved, and a method for manufacturing the same.
【０００７】[0007]
【課題を解決するための手段】上記目的を達成するため
に、請求項１ないし請求項４に記載の印刷ヒーターはス
ルーホールを有する絶縁性の基板を有している。前記基
板表側には抵抗発熱体層が印刷形成されている。前記ス
ルーホールの周囲の基板表側及び裏側ならびにスルーホ
ール内側には導体貫通層が連続的に印刷形成されている
とともに、この導体貫通層は前記抵抗発熱体層と電気的
に導通している。前記スルーホールの周囲の基板表側及
び裏側ならびにスルーホール内側の導体貫通層上には絶
縁ガラス層が印刷形成されている。このような印刷ヒー
ターにおいてさらに前記スルーホールの基板表側ならび
に基板裏側への開口付近は開口付近に近付くに従って拡
開する拡開部が形成されたことを特徴とする。In order to achieve the above object, the printing heater according to any one of claims 1 to 4 has an insulating substrate having through holes. A resistance heating element layer is formed by printing on the front side of the substrate. Conductor through layers are continuously printed on the front and back sides of the substrate around the through holes and inside the through holes, and the conductor through layers are electrically connected to the resistance heating element layer. An insulating glass layer is formed by printing on the front and back sides of the substrate around the through hole and on the conductor through layer inside the through hole. In such a printing heater, further, a widened portion is formed near the opening of the through hole to the front side of the substrate and the back side of the substrate so as to widen toward the vicinity of the opening.
【０００８】また請求項５および請求項６に記載の印刷
ヒーターは、請求項１ないし請求項４に記載の印刷ヒー
ターの基板に代わって、導体貫通層に開口付近に近付く
に従って拡開する拡開部を形成したことを特徴とする。Further, in the printing heater according to claim 5 or 6, instead of the substrate of the printing heater according to any one of claims 1 to 4, an expansion that expands as the conductor penetrating layer gets closer to the vicinity of the opening. It is characterized in that a part is formed.
【０００９】さらに請求項７に記載の印刷ヒーターの製
造方法は、スルーホールを有する絶縁性の基板の表側に
抵抗発熱体層を印刷形成する工程と、前記抵抗発熱体層
と電気的に導通し、前記スルーホールの周囲の基板表側
及び裏側ならびにスルーホール内側に連続的に導体貫通
層を印刷形成する工程と、前記スルーホールの周囲の基
板表側及び裏側ならびにスルーホール内側に、導体貫通
層上に絶縁ガラス層を印刷形成する工程を有し、導体貫
通層を印刷形成する工程が、スルーホールの周囲の基板
表側及び裏側ならびにスルーホール内側に連続的に導体
貫通層を印刷形成する工程の後、再度前記スルーホール
の周囲の基板表側及び裏側導体貫通層を印刷形成するこ
とにより、前記導体貫通層は、基板表側ならびに基板裏
側へのスルーホール開口付近に、開口付近に近付くに従
って拡開する拡開部を形成する工程を有することを特徴
とする。Further, according to a seventh aspect of the present invention, there is provided a method of manufacturing a printing heater in which a resistance heating element layer is formed by printing on the front side of an insulating substrate having a through hole, and the resistance heating element layer is electrically connected to the resistance heating element layer. A step of continuously forming a conductor through layer on the front and back sides of the substrate around the through hole and on the inside of the through hole; and on the front and back sides of the substrate around the through hole and on the inside of the through hole, on the conductor through layer. Having a step of printing and forming an insulating glass layer, the step of printing and forming a conductor through layer, after the step of continuously printing and forming a conductor through layer on the substrate front side and back side around the through hole and inside the through hole, The conductor through layer is printed again on the substrate front side and the back side conductor penetrating layer around the through hole, so that the conductor penetrating layer is formed on the substrate front side and the substrate back side through hole. The vicinity of the opening, characterized by having a step of forming a diverging portion diverging toward the vicinity of the opening.
【００１０】[0010]
【作用】請求項１ないし請求項６に記載の印刷ヒーター
は、スルーホールの開口付近に、開口付近に近付くに従
って拡開する拡開部が形成されているので、絶縁ガラス
層を印刷形成するときに、スルーホールの開口部で絶縁
ガラス層の膜厚が薄くなって、絶縁低下をもたらす欠点
を抑制することができる。In the printing heater according to any one of claims 1 to 6, when the insulating glass layer is formed by printing, since the expanding portion is formed near the opening of the through hole and expands as it approaches the opening. In addition, it is possible to suppress the drawback that the insulating glass layer becomes thin at the opening of the through hole and the insulation is deteriorated.
【００１１】また請求項７に記載の印刷ヒーターの製造
方法は、スルーホールの開口付近に、開口付近に近付く
に従って拡開する拡開部が導体貫通層を印刷形成する工
程を２回行うだけで、簡単に形成できる。Further, in the method of manufacturing a printing heater according to a seventh aspect of the present invention, the step of printing the conductor through layer with the expanding portion that expands in the vicinity of the opening of the through hole is performed only twice. , Easy to form.
【００１２】[0012]
【実施例】以下第１図ないし第４図を参照して本発明の
一実施例を説明する。第１図は実施例の定着用の印刷ヒ
ーターの平面図、第２図は第１図中のＢ−Ｂ線の断面
図、第３図は裏面図、第４図は第１図中のＡ−Ａ線の断
面図である。この断面図は、発明を理解しやすくするた
め、特徴部分を大きく目だつように変形してある。基板
（１）は耐熱性を有するアルミナセラミクス（Ａｌ2Ｏ
3）製の長形平板（約２７０mm×７mm×１mm程度の大き
さ）である。基板（１）の片側一端には基板（１）の表
側と裏側を貫通するスルーホール（３）が予め２箇所形
成されている。スルーホール（３）の開口部は、角が削
られて斜面部（４）が形成されている。スルーホール
（３）の内径（直径）は各々０．４mmである。斜面部
（４）はスルーホール（３）の周囲に０．１mmの幅の領
域が４５度の角度で角が削られたものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT An embodiment of the present invention will be described below with reference to FIGS. FIG. 1 is a plan view of a fixing printing heater according to an embodiment, FIG. 2 is a sectional view taken along line BB in FIG. 1, FIG. 3 is a rear view, and FIG. 4 is A in FIG. It is a sectional view taken along the line A. In order to make the invention easier to understand, this sectional view is modified such that the characteristic portions are largely marked. The substrate (1) is a heat-resistant alumina ceramics (Al2O
It is a long flat plate made of 3) (about 270 mm x 7 mm x 1 mm in size). Two through holes (3) penetrating the front side and the back side of the substrate (1) are formed at one end on one side of the substrate (1) in advance. The opening of the through hole (3) has a beveled surface (4) with its corners shaved off. The inner diameter (diameter) of each through hole (3) is 0.4 mm. The inclined surface portion (4) is formed by cutting a region having a width of 0.1 mm around the through hole (3) at an angle of 45 degrees.
【００１３】基板（１）の表側には帯状の抵抗発熱体層
（５）が設けられている。抵抗発熱体層（５）は導電性
のペースト状塗料（材質は銀パラジウム合金（Ａｇ／Ｐ
ｄ）、又はこれに酸化ルテニウムを加えた金属（Ａｇ／
Ｐｄ＋ＲｕＯ2））を基板（１）上に長手方向に沿った
帯状に印刷塗布・焼成することにより厚さ約１０μｍに
形成したものである。この合金に含まれるパラジウムが
電気的な抵抗要素となり、その比率によって発熱体の抵
抗値が調節される。本実施例では、３４オーム［Ω］の
抵抗値を有し、１００Ｖの電圧印加により３Ａの電流が
流れ、３００Ｗの発熱量となる。抵抗発熱体層（５）の
一端片側は幅広に形成されており、電極形成部（７）を
構成する。抵抗発熱体層（５）の他端片側もスルーホー
ル（３）の周囲を含めて幅広に形成されており、基板
（１）裏側へ電気的導通を図る表側導通下地部（９）を
構成する。抵抗発熱体層（５）の電極形成部（７）と表
側導通下地部（９）とを除いた帯状部が発熱する。A strip-shaped resistance heating element layer (5) is provided on the front side of the substrate (1). The resistance heating element layer (5) is a conductive paste paint (made of silver-palladium alloy (Ag / P
d), or a metal (Ag /
Pd + RuO2)) is formed on the substrate (1) by printing and applying it in a strip shape along the longitudinal direction to a thickness of about 10 μm. The palladium contained in this alloy serves as an electrical resistance element, and the resistance value of the heating element is adjusted by the ratio. In this embodiment, the resistance value is 34 Ω [Ω], the current of 3 A flows by the voltage application of 100 V, and the heat generation amount is 300 W. One end of the resistance heating element layer (5) is formed wider on one side to form an electrode forming portion (7). The other end side of the resistance heating layer (5) is also formed to be wide including the periphery of the through hole (3), and constitutes a front side conductive base portion (9) for electrically conducting to the back side of the substrate (1). .. The strip-shaped part of the resistance heating layer (5) excluding the electrode forming part (7) and the front side conductive base part (9) generates heat.
【００１４】電極形成部（７）の表面には外部電極（図
示しない）と接続をするための表側電極層（１１）が形
成されている。この表側電極層（１１）は抵抗発熱体層
（５）よりも接触電気抵抗が小さくするために設けられ
たもので、銀（Ａｇ），銀プラチナ合金（Ａｇ／Ｐ
ｔ），金（Ａｕ），プラチナ（Ｐｔ）等の金属ペースト
が用いられる。すなわち、電極形成部（７）を含めて抵
抗発熱体層（５）が形成された後（抵抗発熱体ペースト
を印刷塗布・焼成後）、これらの金属ペーストを電極形
成部（７）上に印刷塗布・焼成することで厚さ３〜５μ
ｍ程度に表側電極層（１１）が形成される。A surface side electrode layer (11) for connecting to an external electrode (not shown) is formed on the surface of the electrode forming portion (7). This front side electrode layer (11) is provided in order to make contact electric resistance smaller than that of the resistance heating element layer (5), and is made of silver (Ag), silver platinum alloy (Ag / P).
A metal paste of t), gold (Au), platinum (Pt), or the like is used. That is, after the resistance heating element layer (5) is formed including the electrode formation portion (7) (after the resistance heating element paste is applied by printing and firing), these metal pastes are printed on the electrode formation portion (7). 3-5μ thick by coating and baking
The front electrode layer (11) is formed in a thickness of about m.
【００１５】表側導通下地部（９）の表面にはスルーホ
ール（３）の周囲を含めて、基板（１）裏側へ電気的導
通を図る表側導体貫通層（１３）が積層形成されてい
る。この表側導体貫通層（１３）は表側電極層（１１）
と同じ材料、同じスクリーン印刷で同時に印刷塗布・焼
成される。厚さも同じ３〜５μｍ程度である。A front conductor penetration layer (13) for electrically conducting to the back side of the substrate (1) including the periphery of the through hole (3) is laminated on the surface of the front conduction ground portion (9). The front conductor penetration layer (13) is the front electrode layer (11).
The same material and the same screen printing are applied and fired at the same time. The thickness is also about 3 to 5 μm.
【００１６】表側導体貫通層（１３）がスルーホール
（３）周囲に印刷塗布されるとき、斜面部（４）を含め
てスルーホール（３）の内側にも金属ペーストが印刷塗
布される。スルーホール（３）の内側は、表側導体貫通
層（１３）がスルーホール（３）周囲に印刷塗布された
後、焼成前に印刷面の反対側から真空ポンプで吸引する
ことで金属ペーストが流れ込み、内側導体貫通層（１
５）が形成される。When the front conductor penetrating layer (13) is printed and applied around the through hole (3), the metal paste is also applied and printed inside the through hole (3) including the inclined surface portion (4). Inside the through hole (3), after the front conductor penetrating layer (13) is applied by printing around the through hole (3), the metal paste flows in by suction with a vacuum pump from the opposite side of the printed surface before firing. , Inner conductor penetration layer (1
5) is formed.
【００１７】基板（１）の裏側には表側と同様に、両端
が幅広に形成された帯状の裏側導通層（１７）が設けら
れている。裏側導通層（１７）の一端側の幅広部、すな
わち表側導体貫通層（１３）に対応する裏側導通層（１
７）の幅広部は、表側導体貫通層（１３）、内側導体貫
通層（１５）と連続的に導通形成された裏側導体貫通層
（１９）を構成している。On the back side of the substrate (1), a strip-shaped back side conductive layer (17) having wide ends is provided, like the front side. The wide portion on one end side of the back side conductive layer (17), that is, the back side conductive layer (1) corresponding to the front side conductor penetrating layer (13).
The wide part of 7) constitutes the back conductor penetration layer (19) continuously conductively formed with the front conductor penetration layer (13) and the inner conductor penetration layer (15).
【００１８】裏側導通層（１７）は表側電極層（１１）
ならびに表側導体貫通層（１３）と同じ材料、同じスク
リーン印刷で塗布され、その後焼成されて形成される。
厚さも同じ３〜５μｍ程度である。The back side conductive layer (17) is a front side electrode layer (11).
The same material as the front conductor penetrating layer (13) is applied by the same screen printing as that of the front conductor penetrating layer (13), and then baked to form the same.
The thickness is also about 3 to 5 μm.
【００１９】裏側導通層（１７）の他端側の幅広部、す
なわち表側電極層（１１）に対応する裏側導通層（１
７）の幅広部は、外部電極（図示しない）と接続をする
ための裏側電極層（２１）を構成している。裏側電極層
（２１）は表側電極層（１１）とずれた位置に形成され
ている。The back side conduction layer (1) corresponding to the wide portion on the other end side of the back side conduction layer (17), that is, the front side electrode layer (11).
The wide part of 7) constitutes a back electrode layer (21) for connecting to an external electrode (not shown). The back electrode layer (21) is formed at a position deviated from the front electrode layer (11).
【００２０】上記抵抗発熱体層（５）の帯状部分の表面
は、電気絶縁性の高いガラス質によってコーティングさ
れて、絶縁ガラス層（２３）が形成されている。この絶
縁ガラス層（２３）はほう珪酸ガラスを主成分としてお
り、例えば日本電気ガラス（株）製の絶縁ガラスペース
トＰＬＳ３３１０を印刷塗布・焼成して厚さ約１０μｍ
に形成したものである。ＰＬＳ３３１０を用いた絶縁ガ
ラスは厚さ３５μｍの場合に直流電圧を印加する条件で
電気絶縁耐圧が２０００Ｖを有する。絶縁ガラスペース
トＰＬＳ３３１０は抵抗発熱体層（２３）形成後にスク
リーン印刷法で塗布されその後焼成される。The surface of the strip-shaped portion of the resistance heating element layer (5) is coated with a glass material having a high electric insulation property to form an insulating glass layer (23). The insulating glass layer (23) has borosilicate glass as a main component, and for example, an insulating glass paste PLS3310 manufactured by Nippon Electric Glass Co., Ltd. is applied by printing and baked to have a thickness of about 10 μm.
It was formed in. The insulating glass using PLS3310 has an electric breakdown voltage of 2000 V under the condition that a DC voltage is applied when the thickness is 35 μm. The insulating glass paste PLS3310 is applied by the screen printing method after the resistance heating element layer (23) is formed and then fired.
【００２１】絶縁ガラス層（２３）は抵抗発熱体層
（５）の帯状部分だけでなく電極層（１１）の境界部分
まで塗布されている。これは抵抗発熱体層（５）の帯状
部分と電極形成部（７）の境界付近の温度勾配が急なた
めに、この付近の抵抗発熱体層（５）が断線する可能性
が高いが、この部分を絶縁ガラス層（２３）で覆うこと
により、この危険性を低減している。また電極層（１
１）の境界付近（抵抗発熱体層（５）の帯状部分側）は
発熱の影響で剥離しやすいが、この部分を絶縁ガラス層
（２３）で覆うことにより、この危険性も低減してい
る。The insulating glass layer (23) is applied not only to the strip-shaped portion of the resistance heating element layer (5) but also to the boundary portion of the electrode layer (11). This is because the temperature gradient near the boundary between the strip-shaped portion of the resistance heating element layer (5) and the electrode forming portion (7) is steep, so that the resistance heating element layer (5) in the vicinity is likely to be disconnected, This risk is reduced by covering this part with an insulating glass layer (23). In addition, the electrode layer (1
Around the boundary of 1) (on the side of the strip portion of the resistance heating element layer (5)) is easily peeled off due to the effect of heat generation, but this risk is also reduced by covering this portion with the insulating glass layer (23). ..
【００２２】絶縁ガラス層（２３）は、裏側導通層（１
７）、表側導体貫通層（１３）、内側導体貫通層（１
５）および裏側導体貫通層（１９）の表面にも形成され
ている。絶縁ガラス層（２３）は、複写用紙上に形成さ
れたトナー像をヒーターの熱で定着させる際、ヒーター
のこの面を用紙に密着させ滑らせる動作をするため、抵
抗発熱体層（５）及び複写用紙の保護と滑り摩擦の低減
と電気絶縁性の確保を目的としたものである。The insulating glass layer (23) is a back conductive layer (1).
7), front conductor penetration layer (13), inner conductor penetration layer (1)
5) and also on the surface of the back conductor penetrating layer (19). When the toner image formed on the copy paper is fixed by the heat of the heater, the insulating glass layer (23) performs an operation of bringing this surface of the heater into close contact with the paper and sliding, so that the resistance heating layer (5) and The purpose is to protect copy paper, reduce sliding friction, and ensure electrical insulation.
【００２３】以上の構成の印刷ヒーターは、スルーホー
ル（３）の開口付近に、開口付近に近付くに従って拡開
する斜面部（４）等の拡開部が形成されているので、絶
縁ガラス層（２３）をスクリーン印刷形成するときに、
スルーホールの開口部で絶縁ガラス層（２３）の膜厚が
薄くなって、絶縁低下をもたらす欠点を抑制することが
できる。In the printing heater having the above-mentioned structure, since the expanded portion such as the slope portion (4) which expands as it approaches the opening is formed near the opening of the through hole (3), the insulating glass layer ( 23) When screen printing
It is possible to suppress the drawback that the insulating glass layer (23) becomes thin at the opening of the through hole and the insulation is deteriorated.
【００２４】上記実施例ではスルーホール（３）の縁に
おける電気絶縁耐圧が平坦部分の２０００Ｖに対して、
１９００Ｖであり、電気絶縁耐圧の大きな低下は見られ
ない。これに対して、斜面部（４）を形成しない印刷ヒ
ーターを同じ条件で制作してスルーホール（３）の縁に
おける電気絶縁耐圧を測定したところ４００Ｖと大きく
低下した。このことから、斜面部（４）を形成すること
で電気絶縁耐圧の低下を防止できることがわかった。こ
の理由は、斜面部（４）等の拡開部が形成されていない
と、絶縁ガラス層（２３）をスクリーン印刷形成すると
きに、スルーホールの開口部の縁であるいは角で、絶縁
ガラス層（２３）の膜厚が薄くなり、この部分で電気絶
縁性の低下をもたらすからと推測される。In the above embodiment, the electric breakdown voltage at the edge of the through hole (3) is 2000 V in the flat portion,
Since it is 1900 V, no large decrease in the electric breakdown voltage is observed. On the other hand, when a printing heater without forming the inclined surface portion (4) was manufactured under the same conditions and the electric withstand voltage at the edge of the through hole (3) was measured, it was greatly reduced to 400V. From this, it was found that the formation of the inclined surface portion (4) can prevent the decrease of the electric breakdown voltage. The reason for this is that if the widened portion such as the inclined surface portion (4) is not formed, the insulating glass layer (23) may be formed by screen printing at the edge or corner of the opening of the through hole when the insulating glass layer (23) is formed by screen printing. It is presumed that the film thickness of (23) becomes thin and the electrical insulating property is deteriorated at this portion.
【００２５】実際、斜面部（４）を設けない印刷ヒータ
ーに１０μｍの厚さで絶縁ガラス層を塗布した場合、ス
ルーホールの開口部の縁であるいは角での絶縁ガラス層
の厚さは３〜５μｍに低下していることが確認された。In fact, when a 10 μm thick insulating glass layer is applied to a printing heater having no slope (4), the insulating glass layer has a thickness of 3 to 3 at the edge of the opening of the through hole or at the corner. It was confirmed that the thickness was lowered to 5 μm.
【００２６】次に本発明の他の実施例を図５を参照して
説明する。図５は第２の実施例の印刷ヒーターのスルー
ホール近傍の基板の要部断面図である。スルーホールの
構造が僅かに第一の実施例と異なるだけであり、印刷ヒ
ーターの全体的構成を示す図１、図２、図３は第一の実
施例と同様である。従って第一の実施例と同様な構成に
ついては説明を省略する。Next, another embodiment of the present invention will be described with reference to FIG. FIG. 5 is a cross-sectional view of the main part of the substrate near the through hole of the printing heater of the second embodiment. The structure of the through hole is only slightly different from that of the first embodiment, and FIGS. 1, 2, and 3 showing the overall structure of the printing heater are the same as those of the first embodiment. Therefore, the description of the same configuration as the first embodiment is omitted.
【００２７】基板（１）に形成されたスルーホール
（３）は、断面が図４と異なり、斜面部が形成されてい
ない。基板（１）の表面には第１の実施例と同様、スク
リーン印刷・焼成により表側導通下地部（９）が形成さ
れている。表側導通下地部（９）が形成された後、表側
導通下地部（９）上、スルーホール（３）内側、基板裏
面のスルーホール（３）近傍に、各々表側導体貫通層
（１３ａ）、内側導体貫通層（１５）、裏側導体貫通層
（１９）が形成されている。表側導体貫通層（１３ａ）
がスクリーン印刷・塗布された後、裏側からスルーホー
ル（３）内を真空引きし、基板表側から金属ペーストが
スルーホール（３）内側に回り込むようにする。この後
さらに裏側導体貫通層（１９）がスクリーン印刷・塗布
される。この後、表側導体貫通層（１３ａ）、内側導体
貫通層（１５）、裏側導体貫通層（１９）が同時に焼成
される。The through hole (3) formed in the substrate (1) has a cross section different from that of FIG. On the surface of the substrate (1), as in the first embodiment, the front side conductive underlayer (9) is formed by screen printing and firing. After the front-side conductive underlayer (9) is formed, on the front-side conductive underlayer (9), inside the through hole (3), near the through-hole (3) on the back surface of the substrate, the front-side conductor through layer (13a) and the inside are respectively formed. A conductor penetrating layer (15) and a back conductor penetrating layer (19) are formed. Front conductor penetration layer (13a)
After being screen-printed and applied, the inside of the through hole (3) is evacuated from the back side so that the metal paste wraps around the inside of the through hole (3) from the front side of the substrate. After this, the back conductor penetrating layer (19) is further screen-printed and applied. Then, the front conductor through layer (13a), the inner conductor through layer (15), and the back conductor through layer (19) are simultaneously fired.
【００２８】この後すぐに絶縁ガラス層（２３）を形成
すると、従来例そのものとなり、スルーホール（３）の
開口部の縁で絶縁ガラス層（２３）が薄くなって絶縁性
能が低下する欠点を有する。本実施例ではこの後、再
度、基板（１）表側の表側導体貫通層（１３ａ）上に第
２の表側導体貫通層（１３ｂ）を、裏側導体貫通層（１
９ａ）上に第２の裏側導体貫通層（１９ｂ）スクリーン
印刷・塗布し、このあと焼成を行う。第１の表側導体貫
通層（１３ａ）をスクリーン印刷・塗布した後に、裏側
からスルーホール（３）内を真空引きしたような工程は
第２の表側導体貫通層（１３ｂ）をスクリーン印刷・塗
布した後には行わない。この結果、第２の表側導体貫通
層（１３ｂ）、第２の裏側導体貫通層（１９ｂ）のスル
ーホール（３）開口端には、スルーホール（３）にせり
出すせり出し部（１３ｃ）、（１９ｃ）が形成される。
このせり出し部（１３ｃ）、（１９ｃ）は第１の表側導
体貫通層（１３ａ）および第１の裏側導体貫通層（１９
ａ）の下地があることと、真空引きをしないことによ
り、比較的大きな斜面部（４）が迫り出し部（１３
ｃ）、（１９ｃ）と一体的に形成されている。If the insulating glass layer (23) is formed immediately after this, the conventional example itself is obtained, and the insulating glass layer (23) becomes thin at the edge of the opening of the through hole (3), and the insulating performance deteriorates. Have. In this example, thereafter, the second front conductor through layer (13b) was again provided on the front conductor through layer (13a) on the front side of the substrate (1) and the back conductor through layer (1).
The second back side conductor penetrating layer (19b) is screen-printed and applied on 9a), and then baked. After screen-printing / applying the first front-side conductor penetrating layer (13a), the second front-side conductor penetrating layer (13b) was screen-printed / applied in a process in which the inside of the through-hole (3) was evacuated from the back side. I won't do it later. As a result, the protruding portions (13c) and (19c) protruding to the through hole (3) are provided at the open ends of the through holes (3) of the second front conductor penetrating layer (13b) and the second back conductor penetrating layer (19b). ) Is formed.
The protrusions (13c) and (19c) are the first front conductor penetrating layer (13a) and the first back conductor penetrating layer (19).
Due to the presence of the base of a) and the fact that the vacuum is not drawn, the relatively large slope part (4) is pushed out (13).
c) and (19c) are formed integrally.
【００２９】この後、絶縁ガラス層（２３）が形成され
る。絶縁ガラスペーストを表側にスクリーン印刷・塗布
した後、スルーホール（３）内を真空引きして、表側の
絶縁ガラスペーストがスルーホール（３）内側に回り込
むようにする。この後、裏側にも絶縁ガラスペーストを
スクリーン印刷・塗布し、この後焼成して、絶縁ガラス
層（２３）を形成する。After this, an insulating glass layer (23) is formed. After the insulating glass paste is screen-printed and applied on the front side, the inside of the through hole (3) is evacuated so that the insulating glass paste on the front side wraps around the inside of the through hole (3). After this, an insulating glass paste is screen-printed and applied on the back side as well, and then baked to form an insulating glass layer (23).
【００３０】絶縁ガラスペーストが塗布されるときに
は、スルーホール（３）開口端には、既に第２の表側導
体貫通層（１３ｂ）、第２の裏側導体貫通層（１９ｂ）
により、斜面部（４）が形成されているので、スルーホ
ール（３）開口端で絶縁ガラス層（２３）が薄くなって
絶縁性能の低下をもたらすのが防止される。When the insulating glass paste is applied, the second front conductor penetrating layer (13b) and the second back conductor penetrating layer (19b) are already formed at the open ends of the through holes (3).
Thus, since the inclined surface portion (4) is formed, it is prevented that the insulating glass layer (23) becomes thin at the opening end of the through hole (3) and the insulation performance is deteriorated.
【００３１】また、上記の実施例では、表側導体貫通層
ならびに裏側導体貫通層を各々２度塗布するだけで、基
板（１）を特別に加工することなく、斜面部（４）が簡
単に形成できる。Further, in the above embodiment, the inclined surface portion (4) can be easily formed by only applying the front side conductor penetration layer and the back side conductor penetration layer twice, without special processing of the substrate (1). it can.
【００３２】上記第２の実施例では表側導体貫通層なら
びに裏側導体貫通層が各々２度塗布形成されているが、
３回以上であってもよい。In the second embodiment, the front conductor through layer and the back conductor through layer are formed twice by coating.
It may be three times or more.
【００３３】また、上記２つの実施例とも、スルーホー
ル（３）が一箇所に２つ設けられているが、１つであっ
てもよい。また抵抗発熱体層（５）が１本であるが、途
中で枝分かれしているものなどにも適用できる。さらに
実施例では表側電極層（１１）と裏側電極層（２１）を
除いて絶縁ガラス層（２３）が形成されているが、電気
絶縁を確保する必要が表側だけの場合には表側にのみ絶
縁ガラス層（２３）を設ければよい。この場合、スルー
ホール（３）の裏側開口部には斜面部（４）を設ける必
要はない。Further, in each of the above two embodiments, two through holes (3) are provided at one place, but one may be provided. Further, although the resistance heating element layer (5) is one, it can be applied to a branching element in the middle. Further, in the embodiment, the insulating glass layer (23) is formed excluding the front side electrode layer (11) and the back side electrode layer (21), but when it is necessary to secure electrical insulation, only the front side is insulated. The glass layer (23) may be provided. In this case, it is not necessary to provide the slope portion (4) in the opening on the back side of the through hole (3).
【００３４】[0034]
【発明の効果】本発明の印刷ヒーターは、スルーホール
の開口付近に、開口付近に近付くに従って拡開する拡開
部が形成されているので、絶縁ガラス層をスクリーン印
刷形成するときに、スルーホールの開口部で絶縁ガラス
層の膜厚が薄くならず、従って電気絶縁低下をもたらす
欠点を抑制することができる。In the printing heater of the present invention, since the expanded portion is formed near the opening of the through hole so as to expand as it approaches the opening, the through hole is formed when the insulating glass layer is formed by screen printing. The thickness of the insulating glass layer does not become thin at the openings of the above, and therefore, the drawback of lowering the electrical insulation can be suppressed.
【００３５】また本発明の印刷ヒーターの製造方法によ
れば、スルーホールの開口付近に、開口付近に近付くに
従って拡開する拡開部が導体貫通層を印刷形成する工程
を２回行うだけで、簡単に形成できる。Further, according to the method of manufacturing a printing heater of the present invention, the step of printing the conductor through layer with the expanded portion which expands in the vicinity of the opening of the through hole as it approaches the opening is performed only twice. It can be easily formed.
【図１】図１は第一の実施例の定着用の印刷ヒーターの
平面図である。FIG. 1 is a plan view of a printing heater for fixing according to a first embodiment.
【図２】図２は第１図中のＢ−Ｂ線の断面図である。FIG. 2 is a sectional view taken along line BB in FIG.
【図３】図３は第一の実施例の定着用の印刷ヒーターの
裏面図である。FIG. 3 is a rear view of the fixing print heater according to the first embodiment.
【図４】図４は第１図中のＡ−Ａ線の断面図である。FIG. 4 is a sectional view taken along the line AA in FIG.
【図５】図５は第２の実施例の印刷ヒーターの要部断面
図である。FIG. 5 is a sectional view of an essential part of a printing heater according to a second embodiment.
１・・・基板、 ３・・・スルーホール、 ４・・・斜
面部 ５・・・抵抗発熱体層、 ７・・・電極形成部、 ９・
・・表側導通下地部 １１・・・表側電極層、 １３・・・表側導体貫通層 １３ａ・・・第１の表側導体貫通層、 １３ｂ・・・第
２の表側導体貫通層 １３ｃ・・・せり出し部、 １５・・・内側導体貫通
層、 １７・・・裏側導通層 １９・・・裏側導体貫通
層、 １９ａ・・・第１の裏側導体貫通層 １９ｂ・・・第２の裏側導体貫通層、 １９ｃ・・・せ
り出し部 ２１・・・裏側電極層、 ２３・・・絶縁ガラス層DESCRIPTION OF SYMBOLS 1 ... Substrate, 3 ... Through hole, 4 ... Slope part 5 ... Resistance heating element layer, 7 ... Electrode formation part, 9 ...
.. Front side conductive base layer 11 ... Front side electrode layer, 13 ... Front side conductor through layer 13a ... First front side conductor through layer, 13b ... Second front side conductor through layer 13c ... Projection Part, 15 ... Inside conductor penetration layer, 17 ... Back side conduction layer 19 ... Back side conductor penetration layer, 19a ... First back side conductor penetration layer 19b ... Second back side conductor penetration layer, 19c ... Protruding part 21 ... Back side electrode layer, 23 ... Insulating glass layer
Claims (7)
前記基板表側に印刷形成された抵抗発熱体層と、前記抵
抗発熱体層と電気的に導通し、前記スルーホールの周囲
の基板表側及び裏側ならびにスルーホール内側に連続的
に印刷形成された導体貫通層と、前記スルーホールの周
囲の基板表側及び裏側ならびにスルーホール内側に、導
体貫通層上に印刷形成された絶縁ガラス層とからなる印
刷ヒーターにおいて、前記スルーホールの基板表側なら
びに基板裏側へのスルーホール開口付近は開口付近に近
付くに従って拡開する拡開部が形成されたことを特徴と
する印刷ヒーター。1. An insulating substrate having a through hole,
A resistance heating element layer printed on the front side of the substrate and a conductor penetrating electrically connected to the resistance heating element layer and continuously printed on the front and back sides of the board around the through hole and inside the through hole. In a printing heater comprising a layer, an insulating glass layer printed on a conductor through layer on the front and back sides of the substrate around the through hole, and on the inside of the through hole, the through hole is provided on the front side and the back side of the substrate. A printing heater characterized in that a widened portion is formed near the opening of the hole so as to widen near the opening.
特徴とする請求項１の印刷ヒーター。2. The printing heater according to claim 1, wherein the expanded portion forms a slope.
し、前記抵抗発熱体層は前記基板両端をつなぐ帯状部を
有し、前記スルーホールは、基板の一端部に形成され、
かつ前記導体貫通層に電気的に導通し、前記基板裏側に
基板両端をつなぐ帯状部を形成した裏側導通層を有する
ことを特徴とする請求項１の印刷ヒーター。3. The substrate has an elongated shape having both ends, the resistance heating element layer has a band-shaped portion connecting both ends of the substrate, and the through hole is formed at one end of the substrate,
2. The printing heater according to claim 1, further comprising a back side conductive layer which is electrically connected to the conductor penetrating layer and has a band-shaped portion connecting both ends of the board formed on the back side of the substrate.
は反対側の端部に表側電極部を形成し、裏側導通層の前
記スルーホールとは反対側の端部に裏側電極部を形成し
たことを特徴とする請求項３の印刷ヒーター。4. A front electrode portion is formed at an end of the resistance heating element layer opposite to the through hole, and a back electrode portion is formed at an end of the back conductive layer opposite to the through hole. The printing heater according to claim 3, wherein:
前記基板表側に印刷形成された抵抗発熱体層と、前記抵
抗発熱体層と電気的に導通し、前記スルーホールの周囲
の基板表側及び裏側ならびにスルーホール内側に連続的
に印刷形成された導体貫通層と、前記スルーホールの周
囲の基板表側及び裏側ならびにスルーホール内側に、導
体貫通層上に印刷形成された絶縁ガラス層とからなる印
刷ヒーターにおいて、前記導体貫通層は、基板表側なら
びに基板裏側へのスルーホール開口付近に、開口付近に
近付くに従って拡開する拡開部が形成されていることを
特徴とする印刷ヒーター。5. An insulating substrate having a through hole,
A resistance heating element layer printed on the front side of the substrate and a conductor penetrating electrically connected to the resistance heating element layer and continuously printed on the front and back sides of the board around the through hole and inside the through hole. In a printing heater comprising a layer, a substrate front side and a back side around the through hole, and an insulating glass layer printed and formed on a conductor penetrating layer on the inside of the through hole, the conductor penetrating layer is provided on the board front side and the substrate back side. A printing heater characterized in that an expanding portion is formed near the opening of the through hole and expands as it approaches the opening.
スルーホールに向かってせり出しているせり出し部を有
し、前記拡開部は前記せり出し部に形成されていること
を特徴とする請求項５の印刷ヒーター。6. The conductor penetrating layer has a protruding portion protruding toward the through hole in the vicinity of the opening of the through hole, and the widened portion is formed in the protruding portion. Printing heater.
側に抵抗発熱体層を印刷形成する工程と、前記抵抗発熱
体層と電気的に導通し、前記スルーホールの周囲の基板
表側及び裏側ならびにスルーホール内側に連続的に導体
貫通層を印刷形成する工程と、前記スルーホールの周囲
の基板表側及び裏側ならびにスルーホール内側に、導体
貫通層上に絶縁ガラス層を印刷形成する工程を有する印
刷ヒーターの製造方法において、導体貫通層を印刷形成
する工程は、スルーホールの周囲の基板表側及び裏側な
らびにスルーホール内側に連続的に導体貫通層を印刷形
成する工程の後、再度前記スルーホールの周囲の基板表
側及び裏側導体貫通層を印刷形成することにより、前記
導体貫通層は、基板表側ならびに基板裏側へのスルーホ
ール開口付近に、開口付近に近付くに従って拡開する拡
開部を形成する工程を有することを特徴とする印刷ヒー
ターの製造方法。7. A step of printing a resistance heating element layer on the front side of an insulating substrate having a through hole, electrically connecting with the resistance heating element layer, and a front side and a back side of the substrate around the through hole. A printing heater having a step of continuously printing and forming a conductor through layer inside the through hole, and a step of printing and forming an insulating glass layer on the conductor through layer on the front and back sides of the substrate around the through hole and inside the through hole. In the manufacturing method, the step of printing and forming the conductor through layer is performed after the step of continuously printing and forming the conductor through layer on the front and back sides of the substrate around the through hole and on the inside of the through hole. By forming a conductor through layer on the front and back sides of the substrate by printing, the conductor through layer is formed near the through holes on the front and back sides of the substrate. A method of manufacturing a printing heater, comprising the step of forming an expanded portion that expands as it approaches the mouth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4108742A JPH05326114A (en) | 1992-03-27 | 1992-03-31 | Printed heater and manufacture thereof |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7139092 | 1992-03-27 | ||
| JP4-71390 | 1992-03-27 | ||
| JP4108742A JPH05326114A (en) | 1992-03-27 | 1992-03-31 | Printed heater and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05326114A true JPH05326114A (en) | 1993-12-10 |
Family
ID=13459145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4108742A Pending JPH05326114A (en) | 1992-03-27 | 1992-03-31 | Printed heater and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05326114A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11122840B2 (en) | 2016-01-26 | 2021-09-21 | Haydale Graphene Industries Plc | Heatable garment, fabrics for such garments, and methods of manufacture |
-
1992
- 1992-03-31 JP JP4108742A patent/JPH05326114A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11122840B2 (en) | 2016-01-26 | 2021-09-21 | Haydale Graphene Industries Plc | Heatable garment, fabrics for such garments, and methods of manufacture |
| US11918061B2 (en) | 2016-01-26 | 2024-03-05 | Haydale Graphene Industries Plc | Heatable garment, fabrics for such garments, and methods of manufacture |
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