JPH05311450A - Electroless plating bath - Google Patents
Electroless plating bathInfo
- Publication number
- JPH05311450A JPH05311450A JP11735492A JP11735492A JPH05311450A JP H05311450 A JPH05311450 A JP H05311450A JP 11735492 A JP11735492 A JP 11735492A JP 11735492 A JP11735492 A JP 11735492A JP H05311450 A JPH05311450 A JP H05311450A
- Authority
- JP
- Japan
- Prior art keywords
- plated
- plating solution
- plating
- impellers
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、均一なめっき皮膜を
得るためのめっき液攪拌機構を備えた無電解めっき槽に
関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroless plating tank equipped with a plating solution stirring mechanism for obtaining a uniform plating film.
【０００２】[0002]
【従来の技術】液攪拌の果たす役割は、めっき槽内にお
けるめっき浴の温度や濃度を均一化すること、また被め
っき物表面に強い対流を起こしてイオン拡散を増強する
ことなどである。前者の場合、めっき槽内に緩慢な対流
を生じさせれば良いため、液の流れ方向やその強さはさ
ほど問題とはならない。しかし、後者の場合では、液攪
拌はめっきの反応速度やめっき皮膜物性（組成）に大き
く影響する。図１１は、例えば「表面技術総覧」（鵜飼
義一編，６０６ページ，広信社発行，１９８３／６／１
５）に記載された従来の空気攪拌方法をあらわすめっき
槽の構成図である。空気攪拌は攪拌効率の高い方法であ
るが、空気酸化を嫌うめっき液の場合、一般に空気の代
わりにめっき液を循環ポンプによって吹き出させること
によってめっき液の攪拌を行っている。例えば、めっき
液１内に垂直に浸漬した平板状の被めっき物２に対し
て、ノズル３からめっき液を図中矢印で示すように噴出
させながらめっきを行う場合、従来の装置ではノズル３
が被めっき物２の上側または下側に設けてあり、ノズル
３からのめっき液１噴流が被めっき物２の表面に沿って
上方または下方に流れるようになっている。2. Description of the Related Art The role of liquid agitation is to make the temperature and concentration of a plating bath in a plating tank uniform, and to cause strong convection on the surface of an object to be plated to enhance ion diffusion. In the former case, since it is sufficient to generate slow convection in the plating tank, the flow direction of the liquid and its strength do not matter so much. However, in the latter case, the liquid stirring greatly affects the reaction rate of plating and the physical properties (composition) of the plating film. FIG. 11 shows, for example, “Surface Technology Overview” (edited by Ukai Yoshikazu, 606 pages, published by Koushinsha, 1983/6/1)
It is a block diagram of the plating tank showing the conventional air stirring method described in 5). Air agitation is a method with high agitation efficiency, but in the case of a plating solution that does not like air oxidation, generally, the plating solution is agitated by blowing out the plating solution with a circulation pump instead of air. For example, when plating is performed on the flat plate-shaped object 2 vertically dipped in the plating solution 1 while ejecting the plating solution from the nozzle 3 as shown by the arrow in the figure, the nozzle 3 is used in the conventional apparatus.
Is provided on the upper side or the lower side of the object to be plated 2, and the jet of the plating solution 1 from the nozzle 3 flows upward or downward along the surface of the object to be plated 2.
【０００３】[0003]
【発明が解決しようとする課題】従来のめっき槽では液
攪拌が以上のようになされており、めっき液の流れ方向
が一定であるため、被めっき物の上部と下部ではめっき
液の液流速が異なり、被めっき物表面における液攪拌効
果が不均一であった。このため、液攪拌がめっきの反応
速度やめっき皮膜物性に大きく影響する無電解めっきの
場合、被めっき物表面での液流速に差がある場合では、
めっき皮膜の厚さや組成や物性が不均一になるという問
題点があった。In the conventional plating tank, the liquid stirring is performed as described above, and since the flow direction of the plating liquid is constant, the liquid flow velocity of the plating liquid is higher in the upper and lower parts of the object to be plated. Differently, the liquid stirring effect on the surface of the object to be plated was not uniform. Therefore, in the case of electroless plating in which liquid stirring greatly affects the reaction rate of plating and the physical properties of the plating film, when there is a difference in the liquid flow rate on the surface of the object to be plated,
There is a problem that the thickness, composition and physical properties of the plating film become non-uniform.
【０００４】この発明は上記のような問題点を解決する
ために成されたものであり、平板状の被めっき物表面に
均一な液流動を生じさせることができるめっき液攪拌機
構を備えた無電解めっき槽を得ることを目的とする。The present invention was made in order to solve the above problems, and is provided with a plating solution stirring mechanism capable of producing a uniform solution flow on the surface of a flat object to be plated. The purpose is to obtain an electrolytic plating bath.
【０００５】[0005]
【課題を解決するための手段】この発明に係る請求項１
の無電解めっき槽は、貯溜されためっき液内に平板状の
被めっき物が吊持されるめっき液槽と、被めっき物の両
面に沿い所定の間隙を介して配設される一対の案内板
と、被めっき物の両側に配設され同一方向に回転するこ
とにより被めっき物と案内板との間隙にめっき液の流れ
を形成する一対のインペラーとを備え、このインペラー
の回転方向を周期的に反転させるようにしたものであ
る。[Means for Solving the Problems] Claim 1 according to the present invention
The electroless plating tank is a plating solution tank in which a plate-shaped object to be plated is suspended in the stored plating solution, and a pair of guides arranged along both sides of the object to be plated with a predetermined gap. A plate and a pair of impellers that are arranged on both sides of the object to be plated and that rotate in the same direction to form a flow of the plating solution in the gap between the object to be plated and the guide plate are provided. It is designed to be inverted.
【０００６】又、請求項２の無電解めっき槽は、貯溜さ
れためっき液内に複数の平板状の被めっき物が並列して
吊持されるめっき液槽と、各被めっき物の両側にそれぞ
れ配設され相隣なる同士がお互いに逆方向に回転するこ
とにより各被めっき物間にめっき液の流れを形成する複
数対のインペラーとを備え、各インペラーの回転方向を
周期的に反転させるようにしたものである。The electroless plating bath according to claim 2 has a plating solution tank in which a plurality of flat plate-like objects to be plated are suspended in parallel in the stored plating solution, and both sides of each object to be plated. Equipped with a plurality of pairs of impellers, which are arranged and adjacent to each other rotate in opposite directions to form a flow of the plating solution between the objects to be plated, and the direction of rotation of each impeller is periodically reversed. It was done like this.
【０００７】さらに、請求項３の無電解めっき槽は、貯
溜されためっき液内に平板状の被めっき物が吊持される
めっき液槽と、被めっき物の両面に沿い所定の間隙を介
して配設される一対の案内板と、被めっき物の両側に配
設され同一方向に回転することにより被めっき物と案内
板との間隙にめっき液の流れを形成する一対のインペラ
ーと、被めっき物と案内板との間隙の出、入口にそれぞ
れ配設されるメッシュ状の邪魔板とを備え、インペラー
の回転方向を周期的に反転させるようにしたものであ
る。Further, in the electroless plating bath of claim 3, a flat plate-shaped object to be plated is suspended in the stored plating solution, and a predetermined gap is provided along both sides of the object to be plated. A pair of guide plates disposed on both sides of the plated object, and a pair of impellers arranged on both sides of the plated object and rotating in the same direction to form a flow of the plating solution in the gap between the plated object and the guide plate; A mesh-shaped baffle plate is provided at each of the gap between the plated product and the guide plate and at the inlet, and the rotating direction of the impeller is periodically reversed.
【０００８】[0008]
【作用】この発明における無電解めっき槽の対をなすイ
ンペラーは、同一方向で且つ周期的に反転することによ
り、被めっき物表面に沿って平行で且つ均一にめっき液
を流通させる。The pair of impellers of the electroless plating tank in the present invention are reversed in the same direction and periodically to allow the plating solution to flow in parallel and evenly along the surface of the object to be plated.
【０００９】[0009]
【実施例】 実施例１．以下、この発明の実施例を図について説明す
る。図１はこの発明の実施例１における無電解めっき槽
の構成を示す断面図、図２は図１における線II-IIに沿
う断面図である。図において、４はめっき液５の冒され
ない例えば樹脂またはチタン等で形成されるめっき液
槽、６は吊治具７によって吊持され、めっき液５内に浸
漬される例えばプリント配線板等のような平板状の被め
っき物、８ａ、８ｂはこの被めっき物６の両側に配設さ
れ円柱状の軸を中心に複数枚の羽根を備え、テフロンコ
ーティングされた金属（鉄、ステンレス等）又はチタン
等で形成されるインペラーである。EXAMPLES Example 1. Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing the structure of an electroless plating bath in Embodiment 1 of the present invention, and FIG. 2 is a sectional view taken along line II-II in FIG. In the figure, 4 is a plating solution tank that is not affected by the plating solution 5 and is formed of, for example, resin or titanium, and 6 is suspended by a hanging jig 7 and immersed in the plating solution 5, such as a printed wiring board. The flat plate-shaped objects 8a and 8b are provided on both sides of the object 6 and are provided with a plurality of blades around a cylindrical shaft, and are made of Teflon-coated metal (iron, stainless steel, etc.) or titanium. It is an impeller formed by the above.
【００１０】そして、これらインペラー８ａ、８ｂはそ
れぞれモータ９ａ、９ｂにより同一方向に且つ同一速度
で回転駆動され、回転方向が周期的に反転される。な
お、インペラー８ａ、８ｂの軸方向長さは被めっき物６
の縦方向長さより大に設定されている。１０ａ、１０ｂ
は被めっき物６の両面に沿い且つ対向させて所定の間隙
（２０〜６０ｍｍ程度）を介して配設される案内板、１
１ａ、１１ｂは被めっき物６とその両側に配設される両
インペラー８ａ、８ｂ間に平行に配設される仕切板で、
被めっき物６と両仕切板１１ａ、１１ｂとの間隔は５〜
３０ｍｍ、両仕切板１１ａ、１１ｂと両インペラー８
ａ、８ｂの羽根車先端との間隔は５〜１０ｍｍにそれぞ
れ設定されている。The impellers 8a and 8b are rotationally driven in the same direction and at the same speed by the motors 9a and 9b, respectively, and the rotation directions are periodically reversed. The axial length of the impellers 8a and 8b is the same as that of the object 6 to be plated.
Is larger than the vertical length of. 10a, 10b
Is a guide plate arranged along both sides of the object to be plated 6 and facing each other with a predetermined gap (about 20 to 60 mm) in between.
1a and 11b are partition plates arranged in parallel between the object 6 to be plated and both impellers 8a and 8b arranged on both sides thereof,
The distance between the object 6 to be plated and both partition plates 11a and 11b is 5 to
30mm, both partition plates 11a, 11b and both impellers 8
The distance between the a and 8b tips of the impellers is set to 5 to 10 mm, respectively.
【００１１】次に上記のように構成された実施例１にお
ける無電解めっき槽の動作について説明する。まず、モ
ータ９ａ、９ｂを駆動させるとインペラー８ａ、８ｂが
回転を開始する。このインペラー８ａ、８ｂの回転数は
めっき液５の種類や被めっき物６の形状によって異なる
が、実施例１では４００ｒｐｍに設定した。インペラー
８ａ、８ｂの回転により、めっき液槽４内のめっき液５
は図中矢印で示すように、仕切板１１ｂの一方の表面を
通り案内板１０ａに沿って被めっき物６の一方の表面を
平行且つ均一に流れ、仕切板１１ａの一方の表面を通っ
てインペラー８ａに到達する。Next, the operation of the electroless plating bath in the embodiment 1 configured as described above will be described. First, when the motors 9a and 9b are driven, the impellers 8a and 8b start rotating. The rotation speeds of the impellers 8a and 8b differ depending on the type of the plating solution 5 and the shape of the object 6 to be plated, but in Example 1, they were set to 400 rpm. By rotating the impellers 8a and 8b, the plating solution 5 in the plating solution tank 4
As shown by the arrow in the drawing, the flow passes through one surface of the partition plate 11b and parallelly and evenly flows through the one surface of the workpiece 6 along the guide plate 10a, and passes through one surface of the partition plate 11a. Reach 8a.
【００１２】そして今度は、インペラー８ａにより上記
と同様に、仕切板１１ａの他方の表面を通って案内板１
０ｂに沿って被めっき物６の他方の表面を平行且つ均一
に流れ、仕切板１１ｂの他方の表面を通って再びインペ
ラー８ｂ側に戻る。上記のような動作を繰り返し一定時
間経過した後、両モータ９ａ、９ｂの回転が逆方向に切
り替えられ、両インペラー８ａ、８ｂの回転も反転さ
れ、めっき液５は図中矢印とは反対方向に流れが変わ
る。なお、めっき液５の流れを反転させるまでの時間
は、めっき液の種類、めっき時間、被めっき物６の形状
等によって異なるが、１０秒〜５分間程度であるのが望
ましく、実施例１では１分間とした。Then, in the same manner as above, the guide plate 1 is passed through the other surface of the partition plate 11a by the impeller 8a.
0b in parallel and uniformly on the other surface of the object 6 to be plated, and returns to the impeller 8b side through the other surface of the partition plate 11b. After the above operation is repeated for a certain period of time, the rotations of both motors 9a and 9b are switched to the opposite direction, the rotations of both impellers 8a and 8b are also reversed, and plating solution 5 moves in the direction opposite to the arrow in the figure. The flow changes. The time until the flow of the plating solution 5 is reversed varies depending on the type of plating solution, the plating time, the shape of the object 6 to be plated, etc., but is preferably about 10 seconds to 5 minutes. 1 minute.
【００１３】図３はこの発明の実施例１における無電解
めっき槽を用い、めっき液５として、スズ（０．１モ
ル）、鉛（０．０１モル）、有機スルホン酸（０．２モ
ル）、チオ尿素（２モル）を主成分とする無電解はんだ
めっき液を使用し、被めっき物６としては２４０×１８
０ｍｍのプリント配線基板を適用し、めっき浴温７０
℃、めっき時間２０分でめっきを行った後、０．５ｍｍ
□のパタン部分のめっき厚さを測定した場合の結果を示
すものであり、又、図４は被めっき物２の下部に設けた
ノズル３からめっき液１を噴出させて攪拌を行う図１１
に示したような従来の無電解めっき槽を用い、上記同様
の条件でめっきを行った場合の結果を示すものである。FIG. 3 shows a case where the electroless plating bath according to the first embodiment of the present invention is used, and tin (0.1 mol), lead (0.01 mol), organic sulfonic acid (0.2 mol) is used as a plating solution 5. , An electroless solder plating solution containing thiourea (2 mol) as a main component is used, and the plated object 6 is 240 × 18.
Applying 0mm printed wiring board, plating bath temperature 70
0.5 mm after plating at ℃ for 20 minutes
11 shows the result when the plating thickness of the pattern portion of □ was measured, and FIG. 4 shows that the plating solution 1 is jetted from the nozzle 3 provided under the object to be plated 2 to perform stirring.
The results are shown in the case of performing plating under the same conditions as above using a conventional electroless plating bath as shown in FIG.
【００１４】両図を比較すると明らかなように、図４に
示す無電解めっき厚さ分布では、被めっき物６の下部分
では上部分に比べ厚く析出しており、全体に不均一なめ
っき厚さ分布を示している。これに対し、図４に示す実
施例１における無電解めっき厚さ分布では、ほぼ被めっ
き物６全面で均一な厚さの皮膜が形成されていることが
わかる。図５に使用しためっき液５におけるめっき厚さ
と攪拌強度の関係を示す。図５に示すように、本めっき
液５は攪拌の有無や強弱によってめっき速度が大きく影
響を受けることがわかる。又、本めっき液５で形成され
るめっき厚さは４００ｒｐｍ以上ではほぼ一定となるこ
とがわかる。このことからも実施例１におけるめっき液
攪拌機構を備えた無電解めっき槽では、従来のめっき液
噴流式攪拌機構を備えた無電解めっき槽に比べ、均一な
攪拌効果が得られることは明かである。As is clear from a comparison between the two figures, in the electroless plating thickness distribution shown in FIG. 4, the lower portion of the object to be plated 6 is deposited thicker than the upper portion, and the plating thickness is uneven throughout. It shows the distribution. On the other hand, in the electroless plating thickness distribution in Example 1 shown in FIG. 4, it can be seen that a film having a uniform thickness is formed on the entire surface of the object 6 to be plated. FIG. 5 shows the relationship between the plating thickness and the stirring strength of the plating solution 5 used. As shown in FIG. 5, it can be seen that the plating rate of the present plating solution 5 is greatly affected by the presence or absence of stirring and the strength. Further, it can be seen that the plating thickness formed by the present plating solution 5 becomes almost constant at 400 rpm or more. From this, it is clear that the electroless plating tank having the plating solution stirring mechanism in Example 1 can obtain a uniform stirring effect as compared with the conventional electroless plating tank having the plating solution jet stirring mechanism. is there.
【００１５】実施例２．上記実施例１においては、被め
っき物６と両インペラー８ａ、８ｂとの間に仕切板１１
ａ、１１ｂを設けて、各インペラー８ａ、８ｂによるめ
っき液５の流れが乱れることなく、被めっき物６の表面
と各案内板１０ａ、１０ｂとの間にスムーズに流れるよ
うにしているが、被めっき物６と両インペラー８ａ、８
ｂとの間の距離を条件に応じて考慮すれば、仕切板１１
ａ、１１ｂを設けない場合にも上記実施例１と同様の効
果を奏する。Example 2. In the first embodiment, the partition plate 11 is provided between the object to be plated 6 and the impellers 8a and 8b.
a and 11b are provided so that the flow of the plating solution 5 by the impellers 8a and 8b is not disturbed and the smooth flow can be made between the surface of the object 6 and the guide plates 10a and 10b. Plated product 6 and both impellers 8a, 8
If the distance to b is considered according to the conditions, the partition plate 11
Even when a and 11b are not provided, the same effect as that of the first embodiment is obtained.
【００１６】実施例３．図６はこの発明の実施例３にお
ける無電解めっき槽の構成を模式的に示す斜視図、図７
は図６における無電解めっき槽の構成を示す平面図であ
る。図において、１２はめっき液１３に冒されない例え
ば樹脂またはチタン等で形成されるめっき液槽、１４
ａ、１４ｂ、１４ｃは吊治具（図示せず）によって吊持
され、めっき液１３内に浸漬される例えばプリント配線
板等のような平板状の被めっき物で、所定の間隔を介し
て平行に配設されている。１５ａ、１５ｂ、１５ｃおよ
び１６ａ、１６ｂ、１６ｃはこれら各被めっき物１４
ａ、１４ｂ、１４ｃの一側および他側にそれぞれ配設さ
れるインペラー、１７ａ、１７ｂ、１７ｃおよび１８
ａ、１８ｂ、１８ｃは各インペラー１５ａ、１５ｂ、１
５ｃと各被めっき物１４ａ、１４ｂ、１４ｃとの間およ
び各被めっき物１４ａ、１４ｂ、１４ｃと各インペラー
１６ａ、１６ｂ、１６ｃとの間にそれぞれ平行に配設さ
れる仕切板、１９ａ、１９ｂ、１９ｃおよび２０ａ、２
０ｂ、２０ｃは各インペラー１５ａ、１５ｂ、１５ｃお
よび１６ａ、１６ｂ、１６ｃを回転駆動するモータであ
る。Embodiment 3. FIG. 6 is a perspective view schematically showing the configuration of an electroless plating bath in Embodiment 3 of the present invention, and FIG.
FIG. 7 is a plan view showing the configuration of the electroless plating bath in FIG. 6. In the figure, 12 is a plating solution tank which is not affected by the plating solution 13 and is made of, for example, resin or titanium, 14
a, 14b, and 14c are flat plate-like objects to be plated, such as a printed wiring board, which are suspended by a hanging jig (not shown) and immersed in the plating solution 13, and are parallel to each other with a predetermined interval. It is installed in. 15a, 15b, 15c and 16a, 16b, 16c are each of these plated objects 14
a, 14b, 14c Impellers, 17a, 17b, 17c and 18 respectively arranged on one side and the other side
a, 18b, 18c are impellers 15a, 15b, 1
Partition plates, 19a, 19b, which are arranged in parallel between 5c and the objects to be plated 14a, 14b, 14c and between the objects to be plated 14a, 14b, 14c and the impellers 16a, 16b, 16c, respectively. 19c and 20a, 2
Reference numerals 0b and 20c denote motors for rotationally driving the impellers 15a, 15b, 15c and 16a, 16b, 16c.
【００１７】次に上記のように構成された実施例３にお
ける無電解めっき槽の動作について説明する。まず、各
モータ１９ａ〜１９ｃ、２０ａ〜２０ｃを同一速度で、
且つ１９ａ、１９ｃ、２０ａ、２０ｃを同一方向、１９
ｂ、２０ｂを異なる方向にそれぞれ回転すると、各イン
ペラー１５ａ〜１５ｃ、１６ａ〜１６ｃは図７中破線矢
印で示す方向に回転し、めっき液槽１２内のめっき液１
３は図７中実線矢印で示すように流れ、例えば、インペ
ラー１５ａによって送出されるめっき液１３は、仕切板
１７ａの表面を通りめっき液槽１２の内壁に沿って被め
っき物１４ａの一方の表面を平行且つ均一に流れ、仕切
板１８ａの表面を通ってインペラー１６ａに到達する。Next, the operation of the electroless plating bath in the third embodiment configured as described above will be described. First, the motors 19a to 19c and 20a to 20c at the same speed,
And 19a, 19c, 20a, 20c in the same direction, 19
When b and 20b are respectively rotated in different directions, the impellers 15a to 15c and 16a to 16c rotate in the directions indicated by the broken line arrows in FIG.
3 flows as indicated by a solid line arrow in FIG. 7. For example, the plating solution 13 delivered by the impeller 15a passes through the surface of the partition plate 17a and extends along the inner wall of the plating solution tank 12 to one surface of the object to be plated 14a. Through the surface of the partition plate 18a to reach the impeller 16a.
【００１８】そして今度は、インペラー１６ａによって
送出され、インペラー１６ｂによって送出されるめっき
液１３とともに両仕切板１８ａ、１８ｂ間を通り、両被
めっき物１４ａ、１４ｂの表面を平行且つ均一に流れ、
両仕切板１７ａ、１７ｂ間を通って両インペラー１５
ａ、１５ｂに戻る。その後、めっき液１３は両インペラ
ー１５ａ、１５ｂによって分岐され、めっき液槽１２の
内壁と被めっき物１４ａの表面との間、および被めっき
物１４ａの表面と被めっき物１４ｂの表面との間にそれ
ぞれ流出される。Then, the plating solution 13 sent by the impeller 16a and the plating solution 13 sent by the impeller 16b passes between the partition plates 18a, 18b and flows in parallel and evenly on the surfaces of the plated objects 14a, 14b.
Both impellers 15 pass between both partition plates 17a and 17b.
Return to a and 15b. After that, the plating solution 13 is branched by both impellers 15a and 15b, and between the inner wall of the plating solution tank 12 and the surface of the object to be plated 14a and between the surface of the object to be plated 14a and the surface of the object to be plated 14b. Each is leaked.
【００１９】このように、例えば被めっき物１４ａの両
側にそれぞれ配置される両インペラー１５ａ、１６ａは
同一方向に、又、相隣なる両インペラー１５ａと１５ｂ
および１６ａと１６ｂは異なる方向にそれぞれ回転させ
てやれば、お互いに相隣なる被めっき物１４ａ、１４ｂ
同士が実施例１における案内板１０ａ、１０ｂの役割を
果たし、お互いの表面に平行且つ均一な流れを形成す
る。そして、上記各実施例のように各インペラーの回転
方向を周期的に反転させてやることにより、均一な攪拌
効果が得られ、上記各実施例と同様な効果を奏すること
は言うまでもない。Thus, for example, both impellers 15a and 16a arranged on both sides of the object 14a to be plated are in the same direction and are adjacent to each other.
And 16a and 16b are respectively rotated in different directions, the plated objects 14a and 14b adjacent to each other
The two play a role of the guide plates 10a and 10b in the first embodiment, and form parallel and uniform flows on their surfaces. Further, it is needless to say that by uniformly reversing the rotation direction of each impeller as in each of the above-described embodiments, a uniform stirring effect can be obtained and the same effect as each of the above-described embodiments can be obtained.
【００２０】実施例４．図８はこの発明の実施例４にお
ける無電解めっき槽の構成を示す断面図、図９は図８に
おける無電解めっき槽の構成を示す一部破断斜視図であ
る。図において、めっき液槽４、めっき液５、被めっき
物６、吊治具７、インペラー８ａ、８ｂモータ９ａ、９
ｂ、案内板１０ａ、１０ｂ（図示せず）および仕切板１
１ａ、１１ｂは図１に示す実施例１のものと同様である
ので説明を省略する。２１はインペラー８ａと仕切板１
１ａとの間およびインペラー８ｂと仕切板１１ｂとの間
にそれぞれ配設されるメッシュ状の邪魔板で、めっき液
５に冒されないテフロンでコーティングされた鉄、ステ
ンレスまたはチタン等の材料で形成されている。Example 4. FIG. 8 is a sectional view showing the structure of the electroless plating bath in Embodiment 4 of the present invention, and FIG. 9 is a partially cutaway perspective view showing the structure of the electroless plating bath in FIG. In the figure, a plating solution tank 4, a plating solution 5, an object to be plated 6, a hanging jig 7, impellers 8a, 8b motors 9a, 9
b, guide plates 10a, 10b (not shown) and partition plate 1
Since 1a and 11b are the same as those of the first embodiment shown in FIG. 1, their description is omitted. 21 is an impeller 8a and a partition plate 1
1a, and a mesh-shaped baffle disposed between the impeller 8b and the partition plate 11b, which is made of a material such as iron, stainless steel, or titanium coated with Teflon that is not affected by the plating solution 5. There is.
【００２１】上記のように構成された実施例４における
無電解めっき槽においても、上記実施例１におけると同
様に、まず、モータ９ａ、９ｂを駆動させるとインペラ
ー８ａ、８ｂが回転を開始する。このインペラー８ａ、
８ｂの回転によりめっき液槽４内のめっき液５は、両邪
魔板２１を横切ってそれぞれ仕切板１１ａ、１１ｂを通
り、被めっき物６の表面と両案内板１０ａ、１０ｂとの
間を平行且つ均一に流れて循環する。そして、一定時間
経過した後、両モータ９ａ、９ｂの回転が逆方向に切り
替えられ、めっき液５の流れも反対方向に変えられる。
以下、上記の動作が順次繰り返されて被めっき物６には
所望のめっきが施される。Also in the electroless plating bath in the fourth embodiment having the above-described structure, as in the first embodiment, first, when the motors 9a and 9b are driven, the impellers 8a and 8b start rotating. This impeller 8a,
By the rotation of 8b, the plating solution 5 in the plating solution tank 4 crosses both the baffles 21 and passes through the partition plates 11a and 11b, respectively, and the surface of the object to be plated 6 and the guide plates 10a and 10b are parallel to each other. Circulates evenly. Then, after a lapse of a certain time, the rotations of both motors 9a and 9b are switched to the opposite direction, and the flow of the plating solution 5 is also changed to the opposite direction.
Thereafter, the above operation is sequentially repeated to perform desired plating on the object 6 to be plated.
【００２２】図１０はインペラー９ｂ近傍のめっき液５
の流れの状態を示す模式図で、図１０−（Ａ）は邪魔板
２１が無い場合、図１０−（Ｂ）は邪魔２１を設置した
場合をそれぞれ示す。両図を比較すると明らかなよう
に、邪魔板２１が無い場合は、インペラー９ｂの中心部
と外周部とではインペラー半径が異なるため、送出力も
当然のことながら異なり攪拌むらが生じる。しかしなが
ら、邪魔板２１を設置した場合は、メッシュにより攪拌
力が均等化されて、均一なめっき液５の流れを実現する
ことができ、又、同時にインペラー９ｂの回転によって
生じるめっき液５中の泡もメッシュによって捕獲するこ
とができるので、泡が被めっき物６の近傍に流れて悪影
響を与えることも防止される。FIG. 10 shows the plating solution 5 near the impeller 9b.
10- (A) shows a case where the baffle 21 is not provided, and FIG. 10- (B) shows a case where the baffle 21 is installed. As is clear from a comparison between the two drawings, when the baffle plate 21 is not provided, the impeller radius is different between the central portion and the outer peripheral portion of the impeller 9b, and therefore the output is naturally different and uneven stirring occurs. However, when the baffle plate 21 is installed, the stirring force is equalized by the mesh and a uniform flow of the plating solution 5 can be realized, and at the same time, bubbles in the plating solution 5 generated by the rotation of the impeller 9b. Since bubbles can also be captured by the mesh, it is possible to prevent bubbles from flowing to the vicinity of the object 6 to be plated and adversely affecting it.
【００２３】実施例５．上記実施例１および実施例４に
おいては、被めっき物６の両表面と対向させて平行に案
内板１０ａ、１０ｂをそれぞれ配設しているが、めっき
液槽４の内壁面を被めっき物６の両表面に平行且つ所定
の間隙となるように配置すれば、案内板１０ａ、１０ｂ
を省略することが可能となり、この場合は、めっき液槽
４の内壁面が案内板１０ａ、１０ｂの役割も兼ねること
によって、上記各実施例と同様の効果を奏する。Example 5. In the first and fourth embodiments described above, the guide plates 10a and 10b are arranged parallel to each other so as to face both surfaces of the object 6 to be plated. If the guide plates 10a and 10b are arranged so as to be parallel to both surfaces of the and have a predetermined gap.
Can be omitted. In this case, the inner wall surface of the plating solution tank 4 also serves as the guide plates 10a and 10b, and the same effect as each of the above-described embodiments can be obtained.
【００２４】実施例６．上記実施例４においては、邪魔
板２１のメッシュの数については何も説明しなかった
が、インペラー９ａ、９ｂの中心側から外周側に向け
て、対応する邪魔板２１のメッシュの数が順次増加する
ように形成してやれば、めっき液５の送出力が大きな外
周側にいく程、邪魔板２１のメッシュは細かくなるの
で、送出力は抑制され攪拌力の均等化はさらに向上す
る。Example 6. Although the number of meshes of the baffle plate 21 is not described in the fourth embodiment, the number of meshes of the corresponding baffle plate 21 is sequentially increased from the center side of the impellers 9a and 9b toward the outer peripheral side. If it is formed in such a manner that the mesh of the baffle plate 21 becomes finer as the sending power of the plating solution 5 increases toward the outer peripheral side, the sending power is suppressed and the equalization of the stirring force is further improved.
【００２５】[0025]
【発明の効果】以上のように、この発明によれば貯溜さ
れためっき液内に平板状の被めっき物が吊持されるめっ
き液槽と、被めっき物の両面に沿い所定の間隙を介して
配設される一対の案内板と、被めっき物の両側に配設さ
れ同一方向に回転することにより被めっき物と案内板と
の間隙にめっき液の流れを形成する一対のインペラーと
を備え、このインペラーの回転方向を周期的に反転さ
せ、又、さらに被めっき物と案内板との間隙の出入口に
それぞれメッシュ状の邪魔板を配設したので、平板状の
被めっき物表面に均一な液流動を生じさせることができ
る無電解めっき槽の提供が可能となる。As described above, according to the present invention, a plating solution tank in which a plate-shaped object to be plated is suspended in the stored plating solution and a predetermined gap along both sides of the object to be plated are provided. A pair of guide plates arranged on both sides of the object to be plated, and a pair of impellers that rotate in the same direction to form a flow of the plating solution in the gap between the object to be plated and the guide plate. The rotating direction of this impeller is periodically reversed, and mesh-shaped baffles are provided at the entrance and exit of the gap between the object to be plated and the guide plate, so that the flat surface of the object to be plated is made uniform. It is possible to provide an electroless plating tank capable of causing liquid flow.
【図１】この発明の実施例１における無電解めっき槽の
構成を示す断面図である。FIG. 1 is a cross-sectional view showing the configuration of an electroless plating bath according to a first embodiment of the present invention.
【図２】図１における線II-IIに沿う断面図である。FIG. 2 is a sectional view taken along the line II-II in FIG.
【図３】図１における無電解めっき槽でめっきを行った
プリント配線板上のめっき厚さの分布状態を示す図であ
る。FIG. 3 is a view showing a distribution state of plating thickness on a printed wiring board plated in the electroless plating bath in FIG.
【図４】従来における無電解めっき槽でめっきを行った
プリント配線板上のめっき厚さの分布状態を示す図であ
る。FIG. 4 is a diagram showing a distribution state of plating thickness on a printed wiring board plated in a conventional electroless plating bath.
【図５】図１に示す無電解めっき槽においてプリント配
線板上にめっきを行った場合のめっき厚さとインペラー
回転数との関係を示す特性図である。5 is a characteristic diagram showing a relationship between a plating thickness and an impeller rotation speed when a printed wiring board is plated in the electroless plating bath shown in FIG.
【図６】この発明の実施例３における無電解めっき槽の
構成を模式的に示す斜視図である。FIG. 6 is a perspective view schematically showing the configuration of an electroless plating bath in Embodiment 3 of the present invention.
【図７】図６における無電解めっき槽の構成を示す平面
図である。FIG. 7 is a plan view showing the configuration of the electroless plating bath in FIG.
【図８】この発明の実施例４における無電解めっき槽の
構成を示す断面図である。FIG. 8 is a cross-sectional view showing the structure of an electroless plating bath in Embodiment 4 of the present invention.
【図９】図８における無電解めっき槽の構成を示す一部
破断斜視図である。9 is a partially cutaway perspective view showing the configuration of the electroless plating bath in FIG.
【図１０】図８における無電解めっき槽のインペラー近
傍のめっき液の流れの状態を示すもので、（Ａ）は邪魔
板が無い場合、（Ｂ）は邪魔板を設置した場合をそれぞ
れ示す模式図である。FIG. 10 shows the flow of the plating solution in the vicinity of the impeller of the electroless plating tank in FIG. 8, where (A) shows a case without a baffle and (B) shows a case where a baffle is installed. It is a figure.
【図１１】従来の空気攪拌方法を表すめっき槽の構成を
示す模式図である。FIG. 11 is a schematic diagram showing a configuration of a plating tank representing a conventional air stirring method.
４、１２ めっき液槽 ５、１３ めっき液 ６、１４ａ、１４ｂ、１４ｃ 被めっき物 ７ 吊治具 8a、8b、15a、15b、15c、16a、16b、16c インペラー 9a、9b、19a、19b、19c、20a、20b、20c モータ １０ａ、１０ｂ 案内板 11a、11b、17a、17b、17c、18a、18b、18c 仕切板 ２１ 邪魔板 4, 12 Plating solution tank 5, 13 Plating solution 6, 14a, 14b, 14c Plated object 7 Lifting jig 8a, 8b, 15a, 15b, 15c, 16a, 16b, 16c Impeller 9a, 9b, 19a, 19b, 19c , 20a, 20b, 20c Motors 10a, 10b Guide plates 11a, 11b, 17a, 17b, 17c, 18a, 18b, 18c Partition plates 21 Baffle plates
───────────────────────────────────────────────────── フロントページの続き (72)発明者 森田 毅 尼崎市塚口本町８丁目１番１号 三菱電機 株式会社生産技術研究所内 (72)発明者 高浜 隆 尼崎市塚口本町８丁目１番１号 三菱電機 株式会社生産技術研究所内 (72)発明者 林 修 尼崎市塚口本町８丁目１番１号 三菱電機 株式会社生産技術研究所内 (72)発明者 宇崎 俊介 相模原市宮下一丁目１番57号 三菱電機株 式会社相模製作所内 (72)発明者 須藤 俊英 相模原市宮下一丁目１番57号 三菱電機株 式会社相模製作所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Takeshi Morita 8-1-1 Tsukaguchihonmachi, Amagasaki City Mitsubishi Electric Corporation Production Technology Laboratory (72) Inventor Takashi Takahama 8-1-1 Tsukaguchihonmachi, Amagasaki Mitsubishi (72) Inventor Osamu Hayashi 8-1-1 Tsukaguchi Honcho, Amagasaki City Mitsubishi Electric Co., Ltd. (72) Inventor Shunsuke Uzaki 1-157 Miyashita, Sagamihara Mitsubishi Electric (72) Inventor Toshihide Sudo 1-157 Miyashita, Sagamihara City Mitsubishi Electric Co., Ltd. Sagami Manufacturing Co., Ltd.
Claims (3)
き物が吊持されるめっき液槽と、上記被めっき物の両面
に沿い所定の間隙を介して配設される一対の案内板と、
上記被めっき物の両側に配設され同一方向に回転するこ
とにより上記被めっき物と上記案内板との間隙に上記め
っき液の流れを形成する一対のインペラーとを備え、上
記インペラーの回転方向を周期的に反転させるようにし
たことを特徴とする無電解めっき槽。1. A plating solution tank in which a flat plate-shaped object to be plated is suspended in a stored plating solution, and a pair of guide plates arranged along both sides of the object to be plated with a predetermined gap. When,
A pair of impellers that are disposed on both sides of the object to be plated and that rotate in the same direction to form a flow of the plating solution in the gap between the object to be plated and the guide plate are provided. An electroless plating bath characterized by being periodically inverted.
被めっき物が並列して吊持されるめっき液槽と、上記各
被めっき物の両側にそれぞれ配設され相隣なる同士がお
互いに逆方向に回転することにより上記各被めっき物間
に上記めっき液の流れを形成する複数対のインペラーと
を備え、上記各インペラーの回転方向を周期的に反転さ
せるようにしたことを特徴とする無電解めっき槽。2. A plating solution tank in which a plurality of flat plate-like objects to be plated are suspended in parallel in the stored plating solution, and a plating solution tank arranged on each side of each of the objects to be plated and adjacent to each other. A plurality of pairs of impellers that form a flow of the plating solution between the objects to be plated by rotating in opposite directions are provided, and the rotation direction of each impeller is periodically reversed. Electroless plating bath to be.
き物が吊持されるめっき液槽と、上記被めっき物の両面
に沿い所定の間隙を介して配設される一対の案内板と、
上記被めっき物の両側に配設され同一方向に回転するこ
とにより上記被めっき物と上記案内板との間隙に上記め
っき液の流れを形成する一対のインペラーと、上記被め
っき物と上記案内板との間隙の出、入口にそれぞれ配設
されるメッシュ状の邪魔板とを備え、上記インペラーの
回転方向を周期的に反転させるようにしたことを特徴と
する無電解めっき槽。3. A plating solution tank in which a flat plate-shaped object to be plated is suspended in a stored plating solution, and a pair of guide plates arranged along both sides of the object to be plated with a predetermined gap. When,
A pair of impellers arranged on both sides of the object to be plated and rotating in the same direction to form a flow of the plating solution in a gap between the object to be plated and the guide plate; the object to be plated and the guide plate; A non-electrolytic plating tank comprising: a mesh-shaped baffle plate provided at each of the gap and the entrance, and the rotating direction of the impeller is periodically reversed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11735492A JPH05311450A (en) | 1992-05-11 | 1992-05-11 | Electroless plating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11735492A JPH05311450A (en) | 1992-05-11 | 1992-05-11 | Electroless plating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05311450A true JPH05311450A (en) | 1993-11-22 |
Family
ID=14709617
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11735492A Pending JPH05311450A (en) | 1992-05-11 | 1992-05-11 | Electroless plating bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05311450A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI485286B (en) * | 2011-11-16 | 2015-05-21 | Ebara Corp | Electroless plating and electroless plating |
-
1992
- 1992-05-11 JP JP11735492A patent/JPH05311450A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI485286B (en) * | 2011-11-16 | 2015-05-21 | Ebara Corp | Electroless plating and electroless plating |
| US9293364B2 (en) | 2011-11-16 | 2016-03-22 | Ebara Corporation | Electroless plating apparatus and electroless plating method |
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