JPH05304071A - Stage of light exposure device - Google Patents

Stage of light exposure device

Info

Publication number
JPH05304071A
JPH05304071A JP10720892A JP10720892A JPH05304071A JP H05304071 A JPH05304071 A JP H05304071A JP 10720892 A JP10720892 A JP 10720892A JP 10720892 A JP10720892 A JP 10720892A JP H05304071 A JPH05304071 A JP H05304071A
Authority
JP
Japan
Prior art keywords
wafer
stage
semiconductor substrate
segments
exposure device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP10720892A
Other languages
Japanese (ja)
Inventor
Takumi Tomizawa
巧 富澤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Kyushu Ltd
Original Assignee
NEC Kyushu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Kyushu Ltd filed Critical NEC Kyushu Ltd
Priority to JP10720892A priority Critical patent/JPH05304071A/en
Publication of JPH05304071A publication Critical patent/JPH05304071A/en
Pending legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Details Of Measuring And Other Instruments (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)

Abstract

PURPOSE:To provide a light exposure device where a pattern is prevented from being irregularly transferred in form and from being transferred out of position by making a substrate flat even if it is curled. CONSTITUTION:A disc-shaped stage main body where a wafer 8 is placed is divided into cylindrical segments 9a to 9e arranged in a concentrical manner, the tops of the segments 9a to 9e are adjusted in height conforming to the curve of the wafer 8 so as to come into contact with the wafer 8, and the wafer 8 is hold as being sucked. The segments 9a to 9e are made to recover their initial positions holding the wafer 8 to make the surface of the wafer 8 flat and hold it.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は露光装置における半導体
基板であるウェーハを保持する露光装置のステージに関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a stage of an exposure apparatus which holds a wafer which is a semiconductor substrate in the exposure apparatus.

【０００２】[0002]

【従来の技術】図３は従来の露光装置のステージの一例
を示す部分図である。従来、この種の露光装置のステー
ジ（以下単にステージと呼び）は、図３に示すように、
ベース６に対してＸ及びＹ方向に移動するＸ方向駆動部
４及びＹ方向駆動部５と、Ｘ方向駆動部４に搭載されて
いるとともにＺ方向（上下方向）に移動するＺ方向駆動
部３と、このＺ方向駆動部に搭載されているとともに表
面に吸着穴７が放射状の位置に形成されるステージ本体
１ａとを有している。2. Description of the Related Art FIG. 3 is a partial view showing an example of a stage of a conventional exposure apparatus. Conventionally, a stage of an exposure apparatus of this type (hereinafter simply referred to as a stage) is as shown in FIG.
An X-direction drive unit 4 and a Y-direction drive unit 5 that move in the X and Y directions with respect to the base 6, and a Z-direction drive unit 3 that is mounted on the X-direction drive unit 4 and that moves in the Z direction (vertical direction). And a stage main body 1a mounted on the Z-direction drive section and having suction holes 7 formed in radial positions on the surface.

【０００３】この露光装置でウェーハ面にパターンを転
写する場合は、このステージにウェーハ確実に保持する
とともに転写ぼけがないように、ウェーハはその平坦度
を精度良く保つ必要があった。このステージにおけるウ
ェーハの保持方法は、ステージ本体１ａの吸着穴７から
真空排気し、ウェーハ８をステージ本体１ａの面に密着
させることで行っていた。When the pattern is transferred to the wafer surface by this exposure apparatus, it is necessary to hold the wafer securely on this stage and to keep the flatness of the wafer with high precision so that there is no transfer blur. The method of holding the wafer on this stage has been performed by evacuating the wafer through the suction holes 7 of the stage body 1a and bringing the wafer 8 into close contact with the surface of the stage body 1a.

【０００４】[0004]

【発明が解決しようとする課題】しかしながら、上述し
た従来のステージでは、ステージのウェーハをステージ
本体面に吸着させて保持しているので、ウェーハが湾曲
していると、保持されなかったり、保持されても、湾曲
したまま保持されているためパターン位置のずれや、焦
点ばけによるパターン形状不良を起すという問題があっ
た。However, in the above-described conventional stage, since the wafer of the stage is held by being attracted to the surface of the stage body, when the wafer is curved, it is not held or is held. However, since it is kept curved, there is a problem in that the pattern position shifts and the pattern shape defect due to defocus occurs.

【０００５】本発明の目的は、かかる問題を解消すべ
く、ウェーハの湾曲を矯正し、平坦に保ち保持するステ
ージを提供することである。An object of the present invention is to provide a stage that corrects the curvature of the wafer and keeps it flat in order to solve such problems.

【０００６】[0006]

【課題を解決するための手段】本発明の露光装置のステ
ージは、半導体基板を載置する円板状のステージ本体を
備え、このステージ本体を複数の同心円状の円筒部材に
分割し、これら同心円状の円筒部材が上下方向に互いに
摺動し得るとともに各円筒部材に前記半導体基板と接触
して吸着する吸着穴を有し、前記各円筒部材が前記半導
体基板に対応する部分を吸着保持して移動することによ
って前記半導体基板の湾曲を平坦に矯正することを特徴
としている。A stage of an exposure apparatus according to the present invention comprises a disc-shaped stage body on which a semiconductor substrate is mounted, and the stage body is divided into a plurality of concentric circular cylindrical members. -Shaped cylindrical members are capable of sliding in the vertical direction, and each cylindrical member has a suction hole for contacting and adsorbing the semiconductor substrate, and each cylindrical member adsorbs and holds a portion corresponding to the semiconductor substrate. It is characterized in that the curvature of the semiconductor substrate is corrected to be flat by moving the semiconductor substrate.

【０００７】[0007]

【実施例】次に本発明について図面を参照して説明す
る。The present invention will be described below with reference to the drawings.

【０００８】図１は本発明の露光装置のステージの一実
施例を示す部分断面図、図２は図１のステージの動作を
説明するためのステージ本体の断面図である。このステ
ージは、図１に示すように、ステージ本体１を円筒状の
セグメント９ａ，９ｂ，９ｃ，９ｄ，９ｅに分割し、そ
れぞれのセグメントが独立して高さ方向に移動調整出来
るようにしたことである。FIG. 1 is a partial sectional view showing an embodiment of the stage of the exposure apparatus of the present invention, and FIG. 2 is a sectional view of the stage body for explaining the operation of the stage of FIG. In this stage, as shown in FIG. 1, the stage main body 1 is divided into cylindrical segments 9a, 9b, 9c, 9d, 9e, and each segment can be independently moved and adjusted in the height direction. Is.

【０００９】次に、このステージの動作について説明す
る。ここで、図２（ａ）に示すように、ウェーハ８が下
側に凸に湾曲しているものと仮定する。まず、湾曲めに
接触するように、各セグメント９ａ〜９ｅは上昇し、各
セグメント９ａ〜９ｅの先端部がウェーハ８と接触す
る。次に、各セグメント９ａ〜９ｅに設けられた吸着穴
７より真空排気する。このことにより、各セグメント９
ａ〜９ｅはウェーハ８を湾曲した状態で吸着保持する。
次に、各セグメント９ａ〜９ｅは下降し、その先端部を
同一面内に揃うようにする。このことにより、図２
（ｂ）に示すように、ウェーハ８は湾曲が矯正され、表
面は所望の平坦度を保ち保持される。Next, the operation of this stage will be described. Here, it is assumed that the wafer 8 is convexly curved downward as shown in FIG. First, each of the segments 9a to 9e rises so that the segments 9a to 9e contact with the wafer 8 so as to make a curved contact. Next, vacuum suction is performed through the suction holes 7 provided in each of the segments 9a to 9e. As a result, each segment 9
a to 9e adsorb and hold the wafer 8 in a curved state.
Next, each of the segments 9a to 9e descends so that the tips thereof are aligned in the same plane. As a result, FIG.
As shown in (b), the wafer 8 is straightened, and the surface is maintained at a desired flatness.

【００１０】[0010]

【発明の効果】以上説明したように、本発明は、ウェー
ハを載置する円板状のステージ本体を複数の同心円筒状
のセグメントに分割し、ウェーハの湾曲に応じて各セグ
メントの先端部の高さを調整し、その先端部をウェーハ
の各部と接触させ吸着保持し、各セグメントの位置を戻
すことによりウェーハの湾曲を平坦になるように矯正す
ることによって、転写するパターンの位置ずれやパター
ン形状のぼけを無くすことのできるという効果がある。As described above, according to the present invention, the disc-shaped stage main body on which the wafer is placed is divided into a plurality of concentric cylindrical segments, and the tip portion of each segment is divided according to the curvature of the wafer. Adjusting the height, adsorbing and holding the tip part with each part of the wafer by suction, and returning the position of each segment to correct the curvature of the wafer so that it becomes flat. This has the effect of eliminating the blurring of the shape.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の露光装置のステージの一実施例を示す
部分断面図である。FIG. 1 is a partial sectional view showing an embodiment of a stage of an exposure apparatus of the present invention.

【図２】図１のステージの動作を説明するためのステー
ジ本体の断面図である。FIG. 2 is a cross-sectional view of a stage body for explaining the operation of the stage of FIG.

【図３】従来の露光装置のステージの一例を示す部分図
である。FIG. 3 is a partial view showing an example of a stage of a conventional exposure apparatus.

【符号の説明】[Explanation of symbols]

１，１ａ ステージ本体 ３ Ｚ方向駆動部 ４ Ｘ方向駆動部 ５ Ｙ方向駆動部 ６ ベース ７ 吸着穴 ８ ウェーハ ９ａ〜９ｅ セグメント 1, 1a Stage body 3 Z-direction drive unit 4 X-direction drive unit 5 Y-direction drive unit 6 Base 7 Adsorption hole 8 Wafer 9a to 9e Segment

Claims (1)

【特許請求の範囲】[Claims] 【請求項１】 半導体基板を載置する円板状のステージ
本体を備え、このステージ本体を複数の同心円状の円筒
部材に分割し、これら同心円状の円筒部材が上下方向に
互いに摺動し得るとともに各円筒部材に前記半導体基板
と接触して吸着する吸着穴を有し、前記各円筒部材が前
記半導体基板に対応する部分を吸着保持して移動するこ
とによって前記半導体基板の湾曲を平坦に矯正すること
を特徴とする露光装置のステージ。1. A disk-shaped stage main body for mounting a semiconductor substrate is provided, the stage main body is divided into a plurality of concentric circular cylindrical members, and the concentric circular cylindrical members can slide vertically. Along with each of the cylindrical members, there is a suction hole that comes into contact with the semiconductor substrate to suck the semiconductor substrate, and the cylindrical member is sucked and held at a portion corresponding to the semiconductor substrate to move to flatten the curvature of the semiconductor substrate. A stage of an exposure apparatus characterized by:
JP10720892A 1992-04-27 1992-04-27 Stage of light exposure device Pending JPH05304071A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10720892A JPH05304071A (en) 1992-04-27 1992-04-27 Stage of light exposure device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10720892A JPH05304071A (en) 1992-04-27 1992-04-27 Stage of light exposure device

Publications (1)

Publication Number Publication Date
JPH05304071A true JPH05304071A (en) 1993-11-16

Family

ID=14453227

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10720892A Pending JPH05304071A (en) 1992-04-27 1992-04-27 Stage of light exposure device

Country Status (1)

Country Link
JP (1) JPH05304071A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181054A (en) * 1994-12-26 1996-07-12 Nikon Corp Stage apparatus and controlling method therefor
JP2007311374A (en) * 2006-05-16 2007-11-29 Nikon Corp Substrate holder, exposure apparatus and manufacturing method of device
KR20070118782A (en) * 2006-06-13 2007-12-18 주식회사 아이피에스 Waferblock
JP2012253136A (en) * 2011-06-01 2012-12-20 Seiko Epson Corp Liquid droplet discharging device, material removing method, and material feeding/removing method
JP2013243172A (en) * 2012-05-17 2013-12-05 Tokyo Ohka Kogyo Co Ltd Peeling device and peeling method
JP2017112343A (en) * 2015-12-18 2017-06-22 日本特殊陶業株式会社 Substrate holding device and substrate holding method
CN107272351A (en) * 2017-07-28 2017-10-20 武汉华星光电技术有限公司 Bogey and the exposure sources with the bogey
JP2020136477A (en) * 2019-02-19 2020-08-31 日本特殊陶業株式会社 Substrate holding device and substrate holding method

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08181054A (en) * 1994-12-26 1996-07-12 Nikon Corp Stage apparatus and controlling method therefor
JP2007311374A (en) * 2006-05-16 2007-11-29 Nikon Corp Substrate holder, exposure apparatus and manufacturing method of device
KR20070118782A (en) * 2006-06-13 2007-12-18 주식회사 아이피에스 Waferblock
JP2012253136A (en) * 2011-06-01 2012-12-20 Seiko Epson Corp Liquid droplet discharging device, material removing method, and material feeding/removing method
JP2013243172A (en) * 2012-05-17 2013-12-05 Tokyo Ohka Kogyo Co Ltd Peeling device and peeling method
JP2017112343A (en) * 2015-12-18 2017-06-22 日本特殊陶業株式会社 Substrate holding device and substrate holding method
CN107272351A (en) * 2017-07-28 2017-10-20 武汉华星光电技术有限公司 Bogey and the exposure sources with the bogey
JP2020136477A (en) * 2019-02-19 2020-08-31 日本特殊陶業株式会社 Substrate holding device and substrate holding method

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Effective date: 19981027