JPH05302955A - Pattern inspection method of printed wiring board - Google Patents
Pattern inspection method of printed wiring boardInfo
- Publication number
- JPH05302955A JPH05302955A JP4134219A JP13421992A JPH05302955A JP H05302955 A JPH05302955 A JP H05302955A JP 4134219 A JP4134219 A JP 4134219A JP 13421992 A JP13421992 A JP 13421992A JP H05302955 A JPH05302955 A JP H05302955A
- Authority
- JP
- Japan
- Prior art keywords
- inspection
- carbon
- lands
- land
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
- H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Image Analysis (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明はプリント配線板のパター
ン検査方法に関し、さらに詳しく言えば、例えばエッチ
ングにより回路パターンを形成し、その上にハンダレジ
ストを印刷した後、所定のランド間にカーボン導体を印
刷する際、そのカーボン導体の配線状態を検査するパタ
ーン検査方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pattern inspection method for a printed wiring board, and more specifically, it forms a circuit pattern by etching, prints a solder resist on the circuit pattern, and then prints a carbon conductor between predetermined lands. The present invention relates to a pattern inspection method for inspecting the wiring state of the carbon conductor when printing.
【0002】[0002]
【従来の技術】まず、図3を参照しながらカーボン導体
についてその概略を説明する。プリント配線板を得るに
は、銅張積層基板1に例えば所定の配線パターンを有す
るドライフィルムを被せ、露光してエッチングレジスト
を形成し現像した後、エッチングすることにより、銅箔
からなる回路パターン2を形成する。2. Description of the Related Art First, an outline of a carbon conductor will be described with reference to FIG. To obtain a printed wiring board, for example, a copper-clad laminated substrate 1 is covered with a dry film having a predetermined wiring pattern, exposed to form an etching resist, developed, and then etched to form a circuit pattern 2 made of a copper foil. To form.
【0003】ここで説明の便宜上、形成された4つの回
路パターンの内、図3において左からその参照符号を2
a,2b,2c,2dとする。Here, for convenience of explanation, of the four formed circuit patterns, the reference numeral is 2 from the left in FIG.
a, 2b, 2c and 2d.
【0004】しかる後、回路パターン2上にハンダレジ
スト3が設けられる。この場合、ハンダレジスト3が形
成される部分は図3の斜線部であり、所定のランドは表
面に露出された状態に残される。この例では、左側の回
路パターン2aのランドと右側の回路パターン2dのラ
ンドとが露出された状態とされ、それらの間に位置する
回路パターン2b,2dはハンダレジスト3により、そ
の全体がマスクされているものとする。Thereafter, the solder resist 3 is provided on the circuit pattern 2. In this case, the portion where the solder resist 3 is formed is the hatched portion in FIG. 3, and the predetermined land is left exposed on the surface. In this example, the land of the circuit pattern 2a on the left side and the land of the circuit pattern 2d on the right side are exposed, and the circuit patterns 2b and 2d located between them are entirely masked by the solder resist 3. It is assumed that
【0005】ところで、回路パターン2a,2d同士を
接続するには、その接続パターンをそのエッチング処理
時に同時に形成すれば良いのであるが、基板1にその配
線スペースがなく、しかもそれらの間に他の回路パター
ン2b,2cがあるような場合にカーボン導体4が用い
られる。By the way, in order to connect the circuit patterns 2a and 2d to each other, it suffices to form the connection patterns at the same time during the etching process. However, there is no wiring space on the substrate 1, and there is another space between them. The carbon conductor 4 is used when there are the circuit patterns 2b and 2c.
【0006】すなわち、この接続用のカーボン導体4は
回路パターン2aのランドと回路パターン2dのランド
との間において回路パターン2b,2cをジャンプする
ようにハンダレジスト3上に印刷される。That is, the connecting carbon conductor 4 is printed on the solder resist 3 so as to jump the circuit patterns 2b and 2c between the land of the circuit pattern 2a and the land of the circuit pattern 2d.
【0007】その際、基板1の余白部1aにカーボンよ
りなるパターンずれ検査用の検査パターン5が同時に形
成される。図4にはその断面図が示されており、これに
よると、検査パターン5は予め余白部1aに形成されて
いるランド6a,6間にわたって印刷される。At this time, the inspection pattern 5 for inspecting the pattern shift made of carbon is simultaneously formed on the blank portion 1a of the substrate 1. FIG. 4 shows a cross-sectional view thereof, according to which the inspection pattern 5 is printed between the lands 6a formed in the margin portion 1a in advance.
【0008】[0008]
【発明が解決しようとする課題】パターンずれの検査は
一対のプローブ7a,7bを検査パターン5に接触さ
せ、その間の抵抗値を測定することにより行なわれる。The inspection of the pattern deviation is performed by bringing a pair of probes 7a and 7b into contact with the inspection pattern 5 and measuring the resistance value therebetween.
【0009】しかしながら、カーボンの抵抗値は銅など
に比べて極めて高く、プローブ7a,7bの接触部位が
僅かに変化するだけでも検出抵抗値が大きく異なるた
め、信頼性の面で問題があった。However, the resistance value of carbon is extremely higher than that of copper, etc., and even if the contact portions of the probes 7a and 7b are slightly changed, the detected resistance values are greatly different, which causes a problem in reliability.
【0010】なお、カーボン印刷はその特殊性ゆえ印刷
が難しく、一見良品に見えても不良である場合が多いた
め、全品検査が要求されている。Since carbon printing is difficult due to its peculiarity and often looks defective even if it looks good, inspection of all products is required.
【0011】[0011]
【課題を解決するための手段】本発明は上記従来の事情
に鑑みなされたもので、その構成の特徴は、銅張積層基
板に所定の回路パターンを形成し、同回路パターンのラ
ンドを除いてハンダレジストを形成した後、所定のラン
ド間にカーボン導体を印刷してそれらの回路パターンを
導通させるプリント配線板のパターン検査方法におい
て、上記基板の所定部位に2つのスルーホールを穿設す
るとともに、その表裏両面に同スルーホール内に挿通さ
れる電気抵抗値がカーボンより低い導電性の金属ピンに
て導通状態とされる検査用ランドを設け、カーボン導体
の印刷時にそれと同時に上記検査用ランド間に電気抵抗
検査用のカーボン導体を形成し、その裏側の検査用ラン
ドから同検査用カーボン導体の抵抗値を測定し、カーボ
ン導体の配線状態を検査するようにしたことにある。SUMMARY OF THE INVENTION The present invention has been made in view of the above conventional circumstances, and is characterized in that a predetermined circuit pattern is formed on a copper clad laminated board and the land of the circuit pattern is removed. In a pattern inspection method for a printed wiring board, in which a carbon conductor is printed between predetermined lands after forming a solder resist to conduct those circuit patterns, in the predetermined area of the board, two through holes are formed, and Provided on both front and back sides are inspection lands that are inserted into the same through holes with conductive metal pins whose electrical resistance value is lower than that of carbon, and between the inspection lands at the same time when the carbon conductor is printed. Form a carbon conductor for electrical resistance inspection, measure the resistance value of the inspection carbon conductor from the inspection land on the back side, and check the wiring condition of the carbon conductor. Lies in the fact that so as to 査.
【0012】この場合、スルーホールおよび検査用ラン
ドは基板の余白部に形成されることが好ましい。In this case, it is preferable that the through hole and the inspection land are formed in the blank portion of the substrate.
【0013】[0013]
【作用】プローブを検査用ランドに接触させ、そのラン
ドを介して検査用カーボン導体の抵抗値を検出するた
め、プローブの接触部位が異なっても測定値が大幅に変
化することがなく、信頼性の高い検査を行なうことがで
きる。[Function] Since the probe is brought into contact with the inspection land and the resistance value of the inspection carbon conductor is detected through the land, the measured value does not change significantly even if the contact portion of the probe is different, and reliability is improved. High-quality inspection can be performed.
【0014】[0014]
【実施例】以下、図1および図2を参照しながら、本発
明の一実施例を説明する。なお、これらの図において、
先に説明した従来例と同一の部分にはそれと同じ参照符
号が用いられている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. In these figures,
The same reference numerals are used for the same parts as the conventional example described above.
【0015】まず、銅張積層板1に所定の回路パターン
を有する例えばドライフィルムを添設し、露光してエッ
チングレジストを形成した後、エッチングして所定の回
路パターン2a〜2dを形成する。First, for example, a dry film having a predetermined circuit pattern is attached to the copper clad laminate 1, exposed to form an etching resist, and then etched to form predetermined circuit patterns 2a to 2d.
【0016】この回路パターンの形成時に、基板1の余
白部1aの両面2箇所に検査用ランド11a,11b;
12a,12bをそれぞれ同軸的に形成する。そして、
その各検査用ランドの中央部にスルーホール13,13
を穿設し、同スルーホール13,13内にカーボンより
も電気抵抗の低い導電性の金属ピン、例えば銅、鉄もし
くはアルミニウムなどの金属ピン14,14を挿通し、
これらのピンにて検査用ランド11aと11b、12a
と12bをそれぞれ導通状態とする。At the time of forming this circuit pattern, the inspection lands 11a and 11b are provided at two positions on both sides of the blank portion 1a of the substrate 1.
12a and 12b are formed coaxially. And
Through holes 13, 13 are formed in the center of each inspection land.
And a conductive metal pin having a lower electric resistance than carbon, for example, a metal pin 14, 14 made of copper, iron, aluminum, or the like is inserted through the through holes 13, 13.
With these pins, the inspection lands 11a, 11b, 12a
And 12b are made conductive.
【0017】次ぎに、回路パターン2aのランドと回路
パターン2dのランドとを除いてハンダレジスト3を形
成し、それらのランド間に接続用のカーボン導体4を印
刷し、回路パターン2aと2dとを電気的に接続するの
であるが、その際同時に検査用ランド11aと12aと
の間にも検査用カーボン導体15を印刷する。Next, a solder resist 3 is formed except for the lands of the circuit pattern 2a and the lands of the circuit pattern 2d, and a carbon conductor 4 for connection is printed between these lands to form the circuit patterns 2a and 2d. Although electrically connected, at the same time, the inspection carbon conductor 15 is also printed between the inspection lands 11a and 12a.
【0018】しかる後、この検査用カーボン導体15の
抵抗値を測定して接続用のカーボン導体4の配線状態を
含むカーボン印刷の良否、すなわち印刷ずれなどの有無
を検査するのであるが、この場合、プローブ7a,7b
はカーボン印刷がされない裏面側の検査用ランド11
b,12bに接触させる。Thereafter, the resistance value of the inspection carbon conductor 15 is measured to inspect whether or not the carbon printing including the wiring state of the connecting carbon conductor 4 is good or bad, that is, the presence or absence of print misalignment. In this case, , Probes 7a, 7b
Is an inspection land 11 on the back side where carbon printing is not performed.
b, 12b.
【0019】このランド11b,12bの電気抵抗はカ
ーボンに比べてきわめて小さいため、プローブ7a,7
bの接触箇所がずれたとしても検査用カーボン導体15
の抵抗値測定には殆ど影響を与えず、正確にカーボン導
体の良否を判別することができる。Since the electric resistance of the lands 11b and 12b is extremely smaller than that of carbon, the probes 7a and 7b
Carbon conductor 15 for inspection even if the contact position of b is displaced
The resistance of the carbon conductor is hardly affected, and the quality of the carbon conductor can be accurately determined.
【0020】上記実施例では基板1の余白部1aにカー
ボン印刷用の検査パターンを形成するようにしている
が、カーボン導体が印刷される回路内のランドがスルー
ホールにより裏面側に導通可能であれば、その裏面側の
ランドを利用してカーボン導体の抵抗値を測定しても良
い。In the above-mentioned embodiment, the inspection pattern for carbon printing is formed on the blank portion 1a of the substrate 1, but the land in the circuit on which the carbon conductor is printed can be conducted to the back side by the through hole. For example, the resistance value of the carbon conductor may be measured using the land on the back surface side.
【0021】[0021]
【発明の効果】以上説明したように、本発明によれば、
基板の2箇所にスルーホールを穿設するとともに、その
表裏両面に同スルーホール内の導電性金属ピンにて導通
状態とされるランドを形成し、基板の一方の面側のラン
ド間にカーボン導体を印刷し、基板の他方の面側のラン
ドにプローブを接触させ、そのランドを介してカーボン
導体の抵抗値を検出するようにしたことにより、プロー
ブの接触部位が異なっても測定値が大幅に変化すること
がなく、カーボン印刷の信頼性の高い検査を行なうこと
ができる。As described above, according to the present invention,
Through holes are formed at two positions on the board, and lands that are brought into conduction by conductive metal pins in the through holes are formed on both front and back surfaces of the board, and carbon conductors are provided between lands on one surface side of the board. Is printed, the probe is brought into contact with the land on the other surface side of the substrate, and the resistance value of the carbon conductor is detected through the land. It is possible to perform a highly reliable inspection of carbon printing without any change.
【図1】本発明の一実施例を説明するためのプリント配
線板の一例を示した同基板の摸式的な平面図。FIG. 1 is a schematic plan view of the same printed circuit board illustrating an example of the present invention.
【図2】図1のA−A線断面図。FIG. 2 is a sectional view taken along line AA of FIG.
【図3】従来の検査方法によって検査される基板を示し
た説明図。FIG. 3 is an explanatory view showing a substrate to be inspected by a conventional inspection method.
【図4】図3のB−B線断面図FIG. 4 is a sectional view taken along line BB of FIG.
1 基板 1a 基板の余白部 2 回路パターン 3 ハンダレジスト 4 接続用カーボン導体 11,12 検査用ランド 13 スルーホール 14 導電性金属ピン 15 検査用カーボン導体 1 board 1a board margin 2 circuit pattern 3 solder resist 4 connection carbon conductor 11, 12 inspection land 13 through hole 14 conductive metal pin 15 inspection carbon conductor
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 FI 技術表示箇所 H05K 3/00 T 6921−4E ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location H05K 3/00 T 6921-4E
Claims (2)
成し、同回路パターンのランドを除いてハンダレジスト
を形成した後、所定のランド間にカーボン導体を印刷し
てそれらの回路パターンを導通させるプリント配線板の
パターン検査方法において、上記基板の所定部位に2つ
のスルーホールを穿設するとともに、その表裏両面に同
スルーホール内に挿通される電気抵抗値がカーボンより
低い導電性の金属ピンにて導通状態とされる検査用ラン
ドを設け、カーボン導体の印刷時にそれと同時に上記検
査用ランド間に電気抵抗検査用のカーボン導体を形成
し、その裏側の検査用ランドから同検査用カーボン導体
の抵抗値を測定し、カーボン導体の配線状態を検査する
ようにしたことを特徴とするプリント配線板のパターン
検査方法。1. A predetermined circuit pattern is formed on a copper-clad laminated substrate, a solder resist is formed except for the land of the circuit pattern, and then a carbon conductor is printed between the predetermined lands to make those circuit patterns conductive. In the method for inspecting a pattern of a printed wiring board, a conductive metal pin having two through holes formed in a predetermined portion of the substrate and having electric resistance values lower than that of carbon inserted through the through holes on both front and back surfaces thereof. To provide a conductive land for inspection, and at the same time when printing the carbon conductor, form a carbon conductor for electrical resistance inspection between the above-mentioned inspection lands, and from the inspection land on the back side of A method for inspecting a pattern of a printed wiring board, which comprises measuring a resistance value and inspecting a wiring state of a carbon conductor.
ドは上記基板の余白部に形成されることを特徴とする請
求項1に記載のプリント配線板のパターン検査方法。2. The pattern inspection method for a printed wiring board according to claim 1, wherein the through hole and the inspection land are formed in a blank portion of the substrate.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4134219A JPH05302955A (en) | 1992-04-27 | 1992-04-27 | Pattern inspection method of printed wiring board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4134219A JPH05302955A (en) | 1992-04-27 | 1992-04-27 | Pattern inspection method of printed wiring board |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05302955A true JPH05302955A (en) | 1993-11-16 |
Family
ID=15123211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4134219A Withdrawn JPH05302955A (en) | 1992-04-27 | 1992-04-27 | Pattern inspection method of printed wiring board |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05302955A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10185824A (en) * | 1996-12-24 | 1998-07-14 | Kooei:Kk | Device for inspecting small product and method using the device |
US7333346B2 (en) | 2003-08-27 | 2008-02-19 | Denso Corporation | Circuit board having test coupon and method for evaluating the circuit board |
CN102445648A (en) * | 2010-10-13 | 2012-05-09 | 富葵精密组件(深圳)有限公司 | Method for detecting skip printing of characters of circuit board |
-
1992
- 1992-04-27 JP JP4134219A patent/JPH05302955A/en not_active Withdrawn
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10185824A (en) * | 1996-12-24 | 1998-07-14 | Kooei:Kk | Device for inspecting small product and method using the device |
US7333346B2 (en) | 2003-08-27 | 2008-02-19 | Denso Corporation | Circuit board having test coupon and method for evaluating the circuit board |
CN102445648A (en) * | 2010-10-13 | 2012-05-09 | 富葵精密组件(深圳)有限公司 | Method for detecting skip printing of characters of circuit board |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Application deemed to be withdrawn because no request for examination was validly filed |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990706 |