JPH0529795A - Electronic part mounting apparatus, part attracting method, and part mounting method - Google Patents
Electronic part mounting apparatus, part attracting method, and part mounting methodInfo
- Publication number
- JPH0529795A JPH0529795A JP3178087A JP17808791A JPH0529795A JP H0529795 A JPH0529795 A JP H0529795A JP 3178087 A JP3178087 A JP 3178087A JP 17808791 A JP17808791 A JP 17808791A JP H0529795 A JPH0529795 A JP H0529795A
- Authority
- JP
- Japan
- Prior art keywords
- nozzles
- component
- component mounting
- component suction
- mounting machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Supply And Installment Of Electrical Components (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、電子部品装着機および
それを用いた部品吸着方法ならびに部品装着方法に関す
る。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting machine, a component suction method and a component mounting method using the same.
【0002】[0002]
【従来の技術】従来の電子部品装着機では、主軸を中心
にしたロータリ円周上に等間隔にたとえば10個の部品
吸着装置を円周を10等分した位置に配置し、それぞれ
の部品吸着装置は部品吸着用のノズルを1個持ってい
る。主軸は1/10回転ごとに一時停止する間欠回転を
行ない各々の部品吸着装置は図4に示すように各停止位
置で、吸着−規正−ノズル回転(姿勢検出)−装着−不
良品排出−ノズル回転(原点戻し)−ノズルチェンジ、
の作業を繰り返す。2. Description of the Related Art In a conventional electronic component mounting machine, for example, ten component suction devices are arranged at equal intervals on a rotary circumference centered on a main shaft at positions where the circumference is divided into ten equal parts. The device has one nozzle for picking up parts. The main shaft performs intermittent rotation in which it pauses every 1/10 rotation, and each component suction device is at each stop position, as shown in FIG. 4, suction-regulation-nozzle rotation (posture detection) -mounting-defective product discharge-nozzle Rotation (return to origin) -nozzle change,
Repeat the work of.
【0003】上記の動きを図5で説明する。1は主軸、
2は主軸テーブル、3は主軸テーブル2に固定された部
品吸着装置、4はノズルで先端に電子部品を吸着しプリ
ント基板上に実装する。ノズル4は部品吸着装置3内を
上下に摺動動作を行ない、ここでは図示しないが部品吸
着の負圧を出す吸気装置その他の機構が附属している。
5はノズル4に直結したローラ、6はローラカムで固定
物である。主軸1が回転するとローラ5はローラカム6
の溝7に沿ってなだらかに上下し、それにともなってノ
ズル4も上下に動く。主軸1が停止した状態でノズル4
の上下移動が必要な場合、たとえば装着位置ではローラ
カム6に縦溝8がついている。縦溝8にはスライドカム
9(斜線で示している)が挿入されている。スライドカ
ム9は図示しない機構に駆動されて縦溝8の中を上下に
スライドし、それによってノズル4も上下移動する。The above movement will be described with reference to FIG. 1 is the main axis,
Reference numeral 2 is a spindle table, 3 is a component suction device fixed to the spindle table 2, and 4 is a nozzle that sucks an electronic component at its tip and mounts it on a printed circuit board. The nozzle 4 slides up and down in the component suction device 3, and although not shown here, an intake device and other mechanisms for producing a negative pressure for component suction are attached.
Reference numeral 5 is a roller directly connected to the nozzle 4, and 6 is a roller cam, which is a fixed object. When the main shaft 1 rotates, the roller 5 becomes the roller cam 6
The groove 4 moves up and down gently, and the nozzle 4 also moves up and down accordingly. Nozzle 4 with main shaft 1 stopped
When it is necessary to move up and down, for example, the roller cam 6 has a vertical groove 8 at the mounting position. A slide cam 9 (shown by diagonal lines) is inserted in the vertical groove 8. The slide cam 9 is driven by a mechanism (not shown) to slide up and down in the vertical groove 8, whereby the nozzle 4 also moves up and down.
【0004】[0004]
【発明が解決しようとする課題】電子部品を部品供給部
から順次吸着して取り出しプリント基板に実装する行程
は高速化の傾向にある。それと共に吸着不良と呼ばれる
立ち吸着や未吸着が発生する。この原因はいろいろある
が重要な原因として高速化にともなって吸着時間が短縮
されたことが上げられる。The process of sequentially adsorbing electronic components from the component supply unit and picking them up and mounting them on a printed circuit board tends to be speeded up. At the same time, standing adsorption or non-adsorption, which is called adsorption failure, occurs. There are various causes for this, but an important reason is that the adsorption time was shortened as the speed increased.
【0005】本発明は上記課題を解決するもので、作業
を高速化し、かつ安定した部品吸着を行なう部品吸着装
置を有する電子部品装着機を提供することを目的とす
る。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and an object of the present invention is to provide an electronic component mounting machine having a component suction device for speeding up work and for stable component suction.
【0006】[0006]
【課題を解決するための手段】上記目的を達成するた
め、本発明の電子部品装着機に用いられる部品供給装置
は、各々独立して上下移動できる複数のノズルを各ステ
ーションに配置している。In order to achieve the above-mentioned object, the component supply apparatus used in the electronic component mounting machine of the present invention has a plurality of nozzles which can be moved up and down independently at each station.
【0007】[0007]
【作用】上記手段により、複数のノズルによって複数の
電子部品を1回の吸着で吸着させることができるので、
同じ作業効率でも吸着時間を通常の複数倍かけることが
でき、部品吸着不良が減少する。With the above-mentioned means, a plurality of electronic components can be adsorbed by a plurality of nozzles by a single adsorption.
Even if the work efficiency is the same, the suction time can be extended several times more than usual, and the component suction failure is reduced.
【0008】[0008]
【実施例】以下、本発明の一実施例を図面を参照しなが
ら説明する。本発明の電子部品装着機は間欠運転する主
軸に駆動されてロータリ円周上を移動する各々複数のノ
ズルを有する複数の部品吸着装置と、部品吸着装置の移
動にともなって上記複数のノズルを溝に沿って移動させ
るローラカム機構と、部品装着位置にある上記複数のノ
ズルを縦溝に沿って個別に上下移動させるスライドカム
機構とを備えたロータリ方式のものである。図1は本発
明で用いられる部品吸着装置20の斜視図である。2個
のノズル21,22があり、本図面では見えないが背面
には各々のノズルに連結したローラ23,24(従来例
の図5のローラ5に相当する)がある。ノズル21,2
2はロータリ円周上を図2に示すような動作を行ないな
がら移動するが、各位置で必要に応じて上下移動があ
る。図3はその動作を説明する図で簡単のため部品吸着
装置20は1個だけにしている。部品吸着装置20はロ
ータリ円周上をローラカム30の外周に沿って移動す
る。背面のローラ23,24はローラ溝35に嵌合して
おり、ノズル21,22は部品吸着装置20の移動につ
れてローラ溝35に沿って移動する。間欠回転で停止す
るステーションの位置では必要に応じてスライド溝3
1,32が設置されている。スライド溝31,32に挿
入されているスライドカム33,34は図示しない機構
に駆動されてスライド溝31,32内を上下移動する。
それによってノズル21,22も上下移動する。部品吸
着装置20が部品吸着位置にある時はノズル21,22
は同時に下方に移動して同時に部品を吸着する。しかし
部品装着位置にある時はノズル21,22は個別に上下
移動して順次部品装着を行なう。したがってノズル2
1,22が部品を吸着している間に2個の部品が装着さ
れ、作業タクトが同一であっても吸着作業に許される時
間はノズルが1個の場合に比べて倍の時間であり、吸着
ミスが減少する。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. The electronic component mounting machine of the present invention is driven by an intermittently operating main shaft and has a plurality of component suction devices each having a plurality of nozzles that move on a rotary circumference, and the plurality of nozzles are grooved as the component suction device moves. The rotary type is provided with a roller cam mechanism that moves along the vertical groove and a slide cam mechanism that individually moves the plurality of nozzles at the component mounting position up and down along the vertical groove. FIG. 1 is a perspective view of a component suction device 20 used in the present invention. There are two nozzles 21 and 22, which are not visible in this figure, but on the back side there are rollers 23 and 24 (corresponding to the roller 5 in FIG. 5 of the prior art example) connected to each nozzle. Nozzle 21,2
2 moves on the circumference of the rotary while performing the operation as shown in FIG. 2, but there is vertical movement at each position as required. FIG. 3 is a diagram for explaining the operation, and for simplicity, only one component suction device 20 is provided. The component suction device 20 moves along the outer circumference of the roller cam 30 on the rotary circumference. The rollers 23 and 24 on the back surface are fitted in the roller groove 35, and the nozzles 21 and 22 move along the roller groove 35 as the component suction device 20 moves. If necessary, slide groove 3 at the position of the station that stops by intermittent rotation
1, 32 are installed. The slide cams 33 and 34 inserted in the slide grooves 31 and 32 are driven by a mechanism (not shown) to move up and down in the slide grooves 31 and 32.
As a result, the nozzles 21 and 22 also move up and down. When the component suction device 20 is at the component suction position, the nozzles 21 and 22
Simultaneously moves downward and picks up parts at the same time. However, when in the component mounting position, the nozzles 21 and 22 individually move up and down to sequentially mount components. Therefore, the nozzle 2
Two parts are mounted while parts 1 and 22 are picking up parts, and even if the work tact is the same, the time allowed for picking work is twice as long as the case where there is one nozzle, Adsorption error is reduced.
【0009】[0009]
【発明の効果】以上の説明で明らかなように、本発明の
電子部品装着機に用いられる部品吸着装置は複数のノズ
ルを備えているので部品実装の作業時間を同じとすれば
部品を吸着するのにあてられる時間はそれだけ長くなる
ので、吸着時間が短いために起きていた立ち吸着・斜め
吸着・未吸着等の諸問題が解決できる。As is clear from the above description, since the component suction device used in the electronic component mounting machine of the present invention is provided with a plurality of nozzles, the components are suctioned if the work time for mounting the components is the same. Since the time that can be applied to the above becomes longer, it is possible to solve various problems such as standing adsorption, oblique adsorption, and non-adsorption that occur due to the short adsorption time.
【図1】本発明の電子部品装着機に用いられる複数のノ
ズルを有する部品吸着装置の斜視図FIG. 1 is a perspective view of a component suction device having a plurality of nozzles used in an electronic component mounting machine of the present invention.
【図2】本発明の電子部品装着機の部品吸着装置の配置
を示す概略図FIG. 2 is a schematic view showing the arrangement of a component suction device of the electronic component mounting machine of the present invention.
【図3】本発明の電子部品装着機のローラカムおよびス
ライドカムの動作を説明する図FIG. 3 is a diagram for explaining operations of a roller cam and a slide cam of the electronic component mounting machine of the present invention.
【図4】従来の電子部品装着機の部品吸着装置の配置を
示す概略図FIG. 4 is a schematic view showing the arrangement of a component suction device of a conventional electronic component mounting machine.
【図5】従来の電子部品装着機のローラカムおよびスラ
イドカムの動作を説明する図FIG. 5 is a diagram for explaining operations of a roller cam and a slide cam of a conventional electronic component mounting machine.
20 部品吸着装置 21 ノズル 22 ノズル 23 ローラ 24 ローラ 30 ローラカム 31 スライド溝(縦溝) 32 スライド溝(縦溝) 33 スライドカム 34 スライドカム 35 ローラ溝 20 Parts suction device 21 nozzles 22 nozzles 23 Laura 24 roller 30 roller cam 31 slide groove (vertical groove) 32 slide groove (vertical groove) 33 slide cam 34 Slide cam 35 roller groove
───────────────────────────────────────────────────── フロントページの続き (72)発明者 瀬野 眞透 大阪府門真市大字門真1006番地 松下電器 産業株式会社内 ─────────────────────────────────────────────────── ─── Continued front page (72) Inventor Shino Seno 1006 Kadoma, Kadoma-shi, Osaka Matsushita Electric Sangyo Co., Ltd.
Claims (4)
周上を移動する各々複数のノズルを有する複数の部品吸
着装置と、部品吸着装置の移動にともなって上記複数の
ノズルをローラ溝に沿って移動させるローラカム機構
と、部品装着位置にある上記複数のノズルを縦溝に沿っ
て個別に上下移動させるスライドカム機構とを備えたロ
ータリ方式の電子部品装着機。1. A plurality of component suction devices each having a plurality of nozzles that are driven by an intermittently operating main shaft and move on a rotary circumference, and the plurality of nozzles are provided along a roller groove as the component suction device moves. A rotary type electronic component mounting machine including a roller cam mechanism for moving the nozzles and a slide cam mechanism for individually moving the plurality of nozzles at the component mounting position up and down along a vertical groove.
給部に対して平行になるように部品吸着装置が設置され
ている請求項1記載の電子部品装着機。2. The electronic component mounting machine according to claim 1, wherein the component suction device is installed such that the plurality of nozzles at the component suction position are parallel to the component supply unit.
部品吸着を行なう請求項1記載の電子部品装着機を用い
た部品吸着方法。3. A component suction method using an electronic component mounting machine according to claim 1, wherein a plurality of nozzles located at the component suction position simultaneously suction components.
動して部品装着を行なう請求項1記載の電子部品装着機
を用いた部品装着方法。4. The component mounting method using an electronic component mounting machine according to claim 1, wherein the nozzles at the component mounting position individually move up and down to mount the component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3178087A JPH0529795A (en) | 1991-07-18 | 1991-07-18 | Electronic part mounting apparatus, part attracting method, and part mounting method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3178087A JPH0529795A (en) | 1991-07-18 | 1991-07-18 | Electronic part mounting apparatus, part attracting method, and part mounting method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0529795A true JPH0529795A (en) | 1993-02-05 |
Family
ID=16042406
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3178087A Pending JPH0529795A (en) | 1991-07-18 | 1991-07-18 | Electronic part mounting apparatus, part attracting method, and part mounting method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0529795A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997004633A1 (en) * | 1995-07-24 | 1997-02-06 | Matsushita Electric Industrial Co., Ltd. | Electronic part mounting device |
JP2007027551A (en) * | 2005-07-20 | 2007-02-01 | Fujitsu Ltd | Ic chip packaging method |
US9126351B2 (en) | 2009-07-14 | 2015-09-08 | Abbey And Pride Ip Pty Ltd. | Slab production and processing |
-
1991
- 1991-07-18 JP JP3178087A patent/JPH0529795A/en active Pending
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997004633A1 (en) * | 1995-07-24 | 1997-02-06 | Matsushita Electric Industrial Co., Ltd. | Electronic part mounting device |
US6293003B1 (en) | 1995-07-24 | 2001-09-25 | Matsushita Electric Industrial Co., Ltd. | Electronic part mounting device |
JP2007027551A (en) * | 2005-07-20 | 2007-02-01 | Fujitsu Ltd | Ic chip packaging method |
JP4616719B2 (en) * | 2005-07-20 | 2011-01-19 | 富士通株式会社 | IC chip mounting method |
US9126351B2 (en) | 2009-07-14 | 2015-09-08 | Abbey And Pride Ip Pty Ltd. | Slab production and processing |
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