JPH05295557A - Electroless nickel phosphate plating solution - Google Patents
Electroless nickel phosphate plating solutionInfo
- Publication number
- JPH05295557A JPH05295557A JP10004892A JP10004892A JPH05295557A JP H05295557 A JPH05295557 A JP H05295557A JP 10004892 A JP10004892 A JP 10004892A JP 10004892 A JP10004892 A JP 10004892A JP H05295557 A JPH05295557 A JP H05295557A
- Authority
- JP
- Japan
- Prior art keywords
- nickel
- ion
- plating solution
- electroless nickel
- acid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、液安定性に優れた次亜
リン酸塩還元による無電解ニッケルリンめっき液に関す
るものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electroless nickel-phosphorus plating solution by reducing hypophosphite, which is excellent in solution stability.
【０００２】[0002]
【従来の技術】無電解ニッケルめっきは、被めっき材に
ニッケル皮膜を化学還元により析出させる方法で、装飾
用、電子部品用、最近ではディスク用、ＥＭＩ用に広く
使用されている。その方法および有用な組成液は広く知
られており、また実用化されている。公知の無電解ニッ
ケルめっき液は、例えば特公昭５３−３３２６号公報に
開示されているような、 （１）硫酸ニッケル等のニッケルイオン源 （２）ニッケルイオンの還元剤としての次亜リン酸塩 （３）オキシカルボン酸等のニッケルイオンの錯化剤 （４）ｐＨ調整剤 を主成分とする水溶液である。しかし、このような無電
解ニッケルめっき液は、非常に高温で使用するため液安
定性に乏しく、また、ニッケルイオンの化学還元や亜リ
ン酸生成等の副反応により連鎖的に液分解が促進するた
め、実際には微量の液安定剤を添加して液安定性を保っ
ている。液安定剤としては、特公昭５３−３３２６号公
報に開示されているような二価のイオウ化合物、鉛イオ
ン、ヨウ素化合物、アセチレン化合物や、特公昭５３−
１７５３４号公報に開示されている第１銅イオン、特公
昭５６−４３１０８号公報に開示されているヨード置換
有機化合物などが使用されている。2. Description of the Related Art Electroless nickel plating is a method of depositing a nickel film on a material to be plated by chemical reduction, and is widely used for decoration, electronic parts, and recently for disks and EMI. The method and useful composition liquid are widely known and put to practical use. The known electroless nickel plating solution is, for example, as disclosed in Japanese Patent Publication No. 53-3326, (1) nickel ion source such as nickel sulfate (2) hypophosphite as a reducing agent for nickel ions. (3) Complexing agent for nickel ions such as oxycarboxylic acid (4) pH adjusting agent An aqueous solution containing as a main component. However, such an electroless nickel plating solution is poor in solution stability because it is used at an extremely high temperature, and further, liquid decomposition is promoted in a chain manner by side reactions such as chemical reduction of nickel ions and generation of phosphorous acid. Therefore, the liquid stability is actually maintained by adding a small amount of the liquid stabilizer. Examples of the liquid stabilizer include divalent sulfur compounds, lead ions, iodine compounds, and acetylene compounds as disclosed in JP-B-53-3326, and JP-B-53-53.
A cuprous ion disclosed in Japanese Patent No. 17534 and an iodine substituted organic compound disclosed in Japanese Patent Publication No. 56-43108 are used.
【０００３】[0003]
【発明が解決しようとする課題】従来の無電解ニッケル
めっき液の液安定剤のうち、二価のイオウ化合物は最も
一般的であり、通常、硫化カリウムや硫化ナトリウムな
どを１〜２０ｐｐｍの濃度で使用するが、これらの二価
のイオウ化合物は無電解ニッケルめっき液を連続で使用
する場合、Of the liquid stabilizers for conventional electroless nickel plating solutions, divalent sulfur compounds are the most common, and potassium sulfide, sodium sulfide, etc. are usually used at a concentration of 1 to 20 ppm. These divalent sulfur compounds are used when the electroless nickel plating solution is continuously used.
【化１】 の反応による水素イオンの生成により液のｐＨが下がる
ため、反応して硫酸イオンになり、液安定剤としての効
果が著しく低下することがわかった。[Chemical 1] It was found that since the pH of the liquid is lowered by the generation of hydrogen ions by the reaction of 1), it reacts to form sulfate ions, and the effect as the liquid stabilizer is significantly reduced.
【０００４】また、ヨウ素イオン、アセチレン化合物、
ヨード置換有機化合物は単独添加では十分な液安定性が
得られなかった。それに対し、第１銅イオン添加は十分
な液安定性が得られたが、ニッケル皮膜中に銅が共析す
るため、電子部品等の製造の際、後処理で無電解金めっ
き処理した時に無電解金めっき液中にニッケル皮膜から
銅が溶け出し、無電解金めっき液の液分解を促進するこ
とがわかった。In addition, iodine ions, acetylene compounds,
Sufficient liquid stability was not obtained when the iodo-substituted organic compound was added alone. On the other hand, the addition of cuprous ion gave sufficient liquid stability, but copper co-deposited in the nickel film, so that it was not produced when electroless gold plating was performed as a post-treatment during the production of electronic components. It was found that copper was dissolved from the nickel film in the electrolytic gold plating solution to promote the liquid decomposition of the electroless gold plating solution.
【０００５】無電解ニッケルめっき液を連続的に使用す
る場合、十分な液安定性が得られた液安定剤は鉛イオン
であり、建浴分のニッケル金属のめっき処理での消費を
１ターンとした場合、５ターン補充時でも液は安定であ
った。しかしながら、無電解ニッケルめっき液の連続処
理に伴い各成分が補給されるため、無電解ニッケルめっ
き液中の鉛イオンも蓄積され、５ターン処理時ではニッ
ケル析出速度が建浴時処理の約５％低下する問題があっ
た。この問題に対し、ニッケル析出速度の低下を抑える
ためには、建浴時の鉛イオン濃度を可能な限り低くし、
成分補充により鉛イオン濃度があまり高くならないよう
に添加すればよいが、実用上では鉛イオン濃度を１ｐｐ
ｍ以下にしなければならないため、液分解の心配があっ
た。When the electroless nickel plating solution is continuously used, the solution stabilizer that has obtained sufficient solution stability is lead ion, and the consumption of nickel metal for the construction bath in the plating treatment is one turn. In that case, the solution was stable even after replenishing for 5 turns. However, since each component is replenished as the electroless nickel plating solution is continuously treated, lead ions are also accumulated in the electroless nickel plating solution, and the nickel deposition rate at the time of 5 turns is about 5% of that at the time of the bath treatment. There was a problem of decline. For this problem, in order to suppress the decrease in nickel deposition rate, the lead ion concentration in the bath should be as low as possible,
It may be added so that the lead ion concentration does not become too high by supplementing the components, but in practice, the lead ion concentration is 1 pp
Since it had to be less than m, there was concern about liquid decomposition.
【０００６】本発明は、液安定性に優れた長期連続めっ
き可能な無電解ニッケルリンめっき液を提供するもので
ある。The present invention provides an electroless nickel-phosphorus plating solution having excellent solution stability and capable of long-term continuous plating.
【０００７】[0007]
【課題を解決するための手段】本発明の無電解ニッケル
リンめっき液は、ニッケルイオンとニッケルイオンの還
元剤として次亜リン酸塩と、ニッケルイオンの錯化剤と
してオキシカルボン酸、ジカルボン酸、モノカルボン酸
のうち少なくとも２種類以上のカルボン酸と、ｐＨ調整
剤を含む無電解ニッケルリンめっき液であって、液安定
剤として０．１〜１ｐｐｍの鉛イオンと５〜１００ｐｐ
ｍの２−２′ビピリジルの両方を含むことを特徴とする
ものである。The electroless nickel-phosphorus plating solution of the present invention comprises hypophosphite as a reducing agent for nickel ions and nickel ions, and oxycarboxylic acid, dicarboxylic acid as a complexing agent for nickel ions, An electroless nickel-phosphorus plating solution containing at least two kinds of carboxylic acids among monocarboxylic acids and a pH adjuster, wherein 0.1 to 1 ppm of lead ions and 5 to 100 pp are used as a liquid stabilizer.
It is characterized by containing both 2-2 'bipyridyl of m.
【０００８】ニッケルイオン源としては、硫酸ニッケル
６水和物、塩化ニッケル６水和物、酢酸ニッケル４水和
物、硫酸ニッケルアンモニウム６水和物を使用する。ニ
ッケルイオン濃度は３〜１０ｇ／ｌが好ましい。ニッケ
ル濃度が３ｇ／ｌ以下では、ニッケル析出速度が遅く実
用性に劣る。また、１０ｇ／ｌ以上では液が不安定にな
る。次亜リン酸塩は汎用性の面から考え、次亜リン酸ナ
トリウム１水和物を使用する。次亜リン酸ナトリウム１
水和物濃度は１０〜５０ｇ／ｌが好ましく、ニッケルイ
オン濃度に対して、モル比で２〜３倍の含有が必要であ
る。次亜リン酸ナトリウム１水和物濃度が１０ｇ／ｌ以
下ではニッケル析出速度が遅く、また５０ｇ／ｌ以上で
は液が不安定になる。Nickel sulfate hexahydrate, nickel chloride hexahydrate, nickel acetate tetrahydrate and nickel ammonium sulfate hexahydrate are used as the nickel ion source. The nickel ion concentration is preferably 3 to 10 g / l. When the nickel concentration is 3 g / l or less, the nickel deposition rate is slow and the practicality is poor. Further, if it is 10 g / l or more, the liquid becomes unstable. As the hypophosphite, sodium hypophosphite monohydrate is used from the viewpoint of versatility. Sodium hypophosphite 1
The hydrate concentration is preferably 10 to 50 g / l, and it is necessary to contain the nickel ion concentration in a molar ratio of 2 to 3 times. When the sodium hypophosphite monohydrate concentration is 10 g / l or less, the nickel deposition rate is slow, and when it is 50 g / l or more, the solution becomes unstable.
【０００９】ニッケルイオンの錯化剤は、オキシカルボ
ン酸、ジカルボン酸、モノカルボン酸を２種類以上合わ
せて使用する。オキシカルボン酸としては、クエン酸１
水和物、乳酸、リンゴ酸、酒石酸を使用する。オキシカ
ルボン酸は、ニッケルイオンの錯化剤として液安定性を
向上する他、フリーのニッケルイオンと結合し、液を分
解させる亜リン酸ニッケルの生成を防ぐ効果がある。ジ
カルボン酸としては、マロン酸、シュウ酸２水和物、コ
ハク酸、マレイン酸を、モノカルボン酸としては、酢
酸、グリシンを使用する。ジカルボン酸とモノカルボン
酸は、オキシカルボン酸が液安定性を高める反面、ニッ
ケル析出速度を抑制するのに対し、添加することにより
ニッケル析出速度を向上させる効果がある。そのため、
一般的には、錯化剤として１種類以上のオキシカルボン
酸と１種類以上のジカルボン酸またはモノカルボン酸の
組合わせで使用することが好ましい。As the complexing agent for nickel ions, two or more kinds of oxycarboxylic acid, dicarboxylic acid and monocarboxylic acid are used in combination. As an oxycarboxylic acid, citric acid 1
Use hydrates, lactic acid, malic acid, tartaric acid. Oxycarboxylic acid improves the liquid stability as a complexing agent for nickel ions and also has the effect of preventing the formation of nickel phosphite, which binds to free nickel ions and decomposes the liquid. Malonic acid, oxalic acid dihydrate, succinic acid and maleic acid are used as the dicarboxylic acid, and acetic acid and glycine are used as the monocarboxylic acid. Dicarboxylic acids and monocarboxylic acids have the effect of improving the nickel deposition rate by adding them, while oxycarboxylic acids increase the liquid stability, while suppressing the nickel deposition rate. for that reason,
Generally, it is preferable to use a combination of at least one oxycarboxylic acid and at least one dicarboxylic acid or monocarboxylic acid as a complexing agent.
【００１０】ｐＨ調整剤は、水酸化ナトリウム、水酸化
カリウム、水酸化アンモニウム、またはこれらの混合物
を使用し、ｐＨを４．５〜７に調整する。ｐＨが４．５
以下ではニッケル析出速度が遅く、ｐＨが７以上ではめ
っきの反応が激しく液安定性が得られない。As the pH adjuster, sodium hydroxide, potassium hydroxide, ammonium hydroxide, or a mixture thereof is used to adjust the pH to 4.5 to 7. pH is 4.5
In the following, the nickel deposition rate is slow, and in the case of pH 7 or more, the plating reaction is vigorous and the liquid stability cannot be obtained.
【００１１】鉛イオン源としては、水溶性の酢酸鉛３水
和物、硝酸鉛を使用する。鉛イオン濃度は０．１〜１ｐ
ｐｍが好ましい。鉛イオン濃度が０．１ｐｐｍ以下では
短時間で液分解することがあり、また１ｐｐｍ以上では
成分補給による蓄積のため、ニッケル析出速度を低下さ
せる。As the lead ion source, water-soluble lead acetate trihydrate and lead nitrate are used. Lead ion concentration is 0.1-1p
pm is preferred. When the lead ion concentration is 0.1 ppm or less, liquid decomposition may occur in a short time, and when the lead ion concentration is 1 ppm or more, accumulation due to component replenishment reduces the nickel deposition rate.
【００１２】２−２′ビピリジル濃度は、５〜１００ｐ
ｐｍが好ましく、５ｐｐｍ以下では短時間で液分解する
ことがあり、また１００ｐｐｍ以上では完全に溶解しな
い。２−２′ビピリジルは、単独では液安定性は得られ
ないが、液安定剤としての鉛イオンの補助剤的な役割を
する。The 2-2'-bipyridyl concentration is 5 to 100 p.
pm is preferable, and when it is 5 ppm or less, liquid decomposition may occur in a short time, and when it is 100 ppm or more, it is not completely dissolved. Although 2-2'-bipyridyl cannot obtain liquid stability by itself, it serves as an auxiliary agent for lead ions as a liquid stabilizer.
【００１３】本発明の無電解ニッケルリンめっき液は、
例えば次のようにして製造することができる。まず、５
０℃に加温した８００ｍｌの温純水に２−２′ビピリジ
ルを５〜１００ｍｇ溶解する。次に、硫酸ニッケル６水
和物１３〜４５ｇ、クエン酸１水和物１０〜３０ｇ、マ
ロン酸５〜２０ｇ、コハク酸５〜３０ｇ、酢酸鉛０．１
〜１ｍｇを順次溶解する。各成分とも前に添加した成分
が完全に溶解したことを目視で確認した後に加える。次
に、攪拌しながら水酸化ナトリウムを少しづつ加えてい
き、ｐＨを４．５〜７に調整する。最後に、次亜リン酸
ナトリウム１水和物を１０〜５０ｇ加え、純水で１ｌに
調整する。The electroless nickel phosphorus plating solution of the present invention is
For example, it can be manufactured as follows. First, 5
5 to 100 mg of 2-2 'bipyridyl is dissolved in 800 ml of warm pure water heated to 0 ° C. Next, nickel sulfate hexahydrate 13-45 g, citric acid monohydrate 10-30 g, malonic acid 5-20 g, succinic acid 5-30 g, lead acetate 0.1
Dissolve ~ 1 mg sequentially. It is added after visually confirming that each of the components has been completely dissolved. Next, sodium hydroxide is added little by little with stirring to adjust the pH to 4.5 to 7. Finally, 10 to 50 g of sodium hypophosphite monohydrate is added and adjusted to 1 liter with pure water.
【００１４】[0014]
実施例１ 硫酸ニッケル６水和物２５ｇ、次亜リン酸ナトリウム１
水和物３０ｇ、クエン酸１水和物２０ｇ、マロン酸５
ｇ、コハク酸１０ｇ、酢酸鉛３水和物０．５ｍｇ、２−
２′ビピリジル１０ｍｇを含み、水酸化ナトリウムでｐ
Ｈを６に調整した無電解ニッケルリンめっき液１ｌを８
５℃に加温し、そこにパラジウム置換触媒メルプレート
アクチベータ３５０（メルテックス（株）製、商品名）
で処理した５ｃｍ×１０ｃｍの銅板（板厚０．２ｍｍ）
を３０分間浸漬し、無電解めっき処理した。銅板上には
光沢のある均一なニッケルリン皮膜が得られた。めっき
厚は、６．５μｍであった。また、上記の各成分の５倍
の濃縮液を作成し、その液と２ｍｏｌの水酸化ナトリウ
ム水溶液を成分補給液とし、ニッケル濃度の低下分を濃
縮液で、ｐＨの低下分を水酸化ナトリウム水溶液で補給
しながら連続めっき処理を行った。建浴時のニッケル濃
度分の補給を１ターンとした場合、５ターン処理時の液
安定性は良好で、その時のめっき厚は６．９μｍであっ
た。Example 1 25 g of nickel sulfate hexahydrate, sodium hypophosphite 1
Hydrate 30 g, citric acid monohydrate 20 g, malonic acid 5
g, succinic acid 10 g, lead acetate trihydrate 0.5 mg, 2-
Contains 2 mg of 2'bipyridyl, p with sodium hydroxide
1 liter of electroless nickel-phosphorus plating solution with H adjusted to 6
After heating to 5 ° C, palladium substitution catalyst Melplate Activator 350 (Meltex Co., Ltd., trade name)
5 cm x 10 cm copper plate treated with (plate thickness 0.2 mm)
Was dipped for 30 minutes and subjected to electroless plating. A shiny and uniform nickel-phosphorus coating was obtained on the copper plate. The plating thickness was 6.5 μm. In addition, a concentrated solution of 5 times each of the above components was prepared, and the solution and 2 mol of sodium hydroxide aqueous solution were used as component replenishing solutions, the reduced nickel concentration was the concentrated solution, and the reduced pH was the aqueous sodium hydroxide solution. The continuous plating treatment was performed while replenishing with. When the supply of the nickel concentration during the building bath was set to 1 turn, the solution stability after 5 turns was good, and the plating thickness at that time was 6.9 μm.
【００１５】実施例２ ２−２′ビピリジルの濃度を９０ｍｇに変更した他は、
実施例１と同じ。建浴時のめっき厚は６．１μｍであっ
た。５ターン処理時の液安定性は良好で、めっき厚は
６．１μｍであった。Example 2 Except that the concentration of 2-2'-bipyridyl was changed to 90 mg,
Same as Example 1. The plating thickness at the time of building the bath was 6.1 μm. The liquid stability after 5 turns was good, and the plating thickness was 6.1 μm.
【００１６】比較例１ 酢酸鉛３水和物を除いた以外は、実施例１と同じ。建浴
時、めっき開始後１３分で液が分解した。Comparative Example 1 Same as Example 1 except that lead acetate trihydrate was omitted. During the bath construction, the solution decomposed 13 minutes after the start of plating.
【００１７】比較例２ 酢酸鉛３水和物の濃度を３ｍｇに変更した他は、実施例
１と同じ。建浴時のめっき厚は６．５μｍであった。５
ターン処理時の液安定性は良好であったが、めっき厚は
２．８μｍしか得られなかった。Comparative Example 2 Same as Example 1 except that the concentration of lead acetate trihydrate was changed to 3 mg. The plating thickness at the time of building the bath was 6.5 μm. 5
The liquid stability during the turn treatment was good, but the plating thickness was only 2.8 μm.
【００１８】比較例３ ２−２′ビピリジルを除いた以外は、実施例１と同じ。
１ターン処理途中で液が分解した。Comparative Example 3 Same as Example 1 except that 2-2 'bipyridyl was omitted.
The liquid decomposed during the process of one turn.
【００１９】比較例４ 酢酸鉛３水和物と２−２′ビピリジルを除いた以外は、
実施例１と同じ。めっき処理前の８５℃加温中に液が分
解した。Comparative Example 4 Except that lead acetate trihydrate and 2-2 'bipyridyl were removed.
Same as Example 1. The solution decomposed during heating at 85 ° C before the plating treatment.
【００２０】[0020]
【発明の効果】以上に説明したとおり、本発明の無電解
ニッケルリンめっき液は、液安定剤として微量の鉛イオ
ンと２−２′ビピリジルを含むことにより液安定性に優
れており、長期連続めっき処理が可能である。また、建
浴時の鉛イオン濃度を１ｐｐｍ以下に低くできるため、
成分補給による鉛イオンの蓄積が少なく、連続めっき処
理後もニッケル析出速度の増減に影響を与えない。As described above, the electroless nickel-phosphorus plating solution of the present invention is excellent in solution stability because it contains a trace amount of lead ions and 2-2'-bipyridyl as a solution stabilizer, and thus it can be continuously used for a long time. Can be plated. Also, since the lead ion concentration during bathing can be lowered to 1 ppm or less,
There is little lead ion accumulation due to component replenishment, and it does not affect the increase or decrease in nickel deposition rate even after continuous plating.
Claims (3)
剤として次亜リン酸塩と、ニッケルイオンの錯化剤とし
てオキシカルボン酸、ジカルボン酸、モノカルボン酸の
うち少なくとも２種類以上のカルボン酸と、ｐＨ調整剤
を含む無電解ニッケルリンめっき液であって、液安定剤
として０．１〜１ｐｐｍの鉛イオンと５〜１００ｐｐｍ
の２−２′ビピリジルの両方を含むことを特徴とする無
電解ニッケルリンめっき液。1. A nickel ion, a hypophosphite as a reducing agent for nickel ions, and at least two or more carboxylic acids selected from oxycarboxylic acids, dicarboxylic acids and monocarboxylic acids as complexing agents for nickel ions. An electroless nickel-phosphorus plating solution containing a pH adjuster, which contains 0.1 to 1 ppm of lead ions and 5 to 100 ppm as a solution stabilizer.
2. An electroless nickel-phosphorus plating solution containing both 2-2'-bipyridyl.
または酢酸鉛であることを特徴とする請求項１に記載の
無電解ニッケルリンめっき液。2. The electroless nickel-phosphorus plating solution according to claim 1, wherein the supply source of the lead ions is water-soluble lead nitrate or lead acetate.
酸化カリウム、水酸化アンモニウムまたはこれらの混合
物であり、ｐＨの範囲を４．５〜７に維持することを特
徴とする請求項１または２に記載の無電解ニッケルリン
めっき液。3. The pH adjusting agent is sodium hydroxide, potassium hydroxide, ammonium hydroxide or a mixture thereof, and maintains the pH range of 4.5 to 7. The electroless nickel-phosphorus plating solution according to 2.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10004892A JPH05295557A (en) | 1992-04-21 | 1992-04-21 | Electroless nickel phosphate plating solution |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10004892A JPH05295557A (en) | 1992-04-21 | 1992-04-21 | Electroless nickel phosphate plating solution |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH05295557A true JPH05295557A (en) | 1993-11-09 |
Family
ID=14263622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10004892A Pending JPH05295557A (en) | 1992-04-21 | 1992-04-21 | Electroless nickel phosphate plating solution |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH05295557A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286736A (en) * | 2011-08-29 | 2011-12-21 | 深圳市化讯应用材料有限公司 | Displacement-type electroless gold plating solution |
| WO2015008952A1 (en) * | 2013-07-16 | 2015-01-22 | 한국생산기술연구원 | Electroless nickel plating solution, electroless nickel plating method using same, and flexible nickel plated layer formed by using same |
-
1992
- 1992-04-21 JP JP10004892A patent/JPH05295557A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286736A (en) * | 2011-08-29 | 2011-12-21 | 深圳市化讯应用材料有限公司 | Displacement-type electroless gold plating solution |
| WO2015008952A1 (en) * | 2013-07-16 | 2015-01-22 | 한국생산기술연구원 | Electroless nickel plating solution, electroless nickel plating method using same, and flexible nickel plated layer formed by using same |
| US10358724B2 (en) | 2013-07-16 | 2019-07-23 | Korea Institute Of Industrial Technology | Electroless nickel plating solution, electroless nickel plating method using same, and flexible nickel plated layer formed by using same |
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