JPH05291621A - 窒化ガリウム系化合物半導体の電極材料 - Google Patents
窒化ガリウム系化合物半導体の電極材料Info
- Publication number
- JPH05291621A JPH05291621A JP11822792A JP11822792A JPH05291621A JP H05291621 A JPH05291621 A JP H05291621A JP 11822792 A JP11822792 A JP 11822792A JP 11822792 A JP11822792 A JP 11822792A JP H05291621 A JPH05291621 A JP H05291621A
- Authority
- JP
- Japan
- Prior art keywords
- gallium nitride
- compound semiconductor
- type
- electrode material
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910002601 GaN Inorganic materials 0.000 title claims abstract description 16
- 239000004065 semiconductor Substances 0.000 title claims abstract description 16
- 239000007772 electrode material Substances 0.000 title claims description 16
- -1 gallium nitride compound Chemical class 0.000 title abstract description 6
- 239000012535 impurity Substances 0.000 claims abstract description 9
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 7
- 239000000956 alloy Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 5
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 4
- 229910052709 silver Inorganic materials 0.000 claims abstract description 4
- 229910052719 titanium Inorganic materials 0.000 claims abstract description 4
- 229910052804 chromium Inorganic materials 0.000 claims abstract description 3
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 11
- 150000001875 compounds Chemical class 0.000 claims description 11
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 238000000137 annealing Methods 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000002488 metal-organic chemical vapour deposition Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/452—Ohmic electrodes on AIII-BV compounds
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Devices (AREA)
- Electrodes Of Semiconductors (AREA)
Abstract
ることにより、窒化ガリウム系化合物半導体を利用し
て、低駆動電圧化、高輝度化した発光デバイスと実現す
る。 【構成】 p型不純物をドープしたGaXAl1-XNにA
u、Pt、Ag、Niよりなる群から選択される少なく
とも一種の金属、またはそれらの合金を使用し、またn
型不純物をドープしたGaXAl1-XNにはAl、Cr、
Ti、Inよりなる群から選択される少なくとも一種の
金属、またはそれらの合金を使用する。
Description
ド、レーザーダイオード等に使用される窒化ガリウム系
化合物半導体の電極材料に係り、特にオーミック接触を
得ることのできる電極材料に関するものである。
イオード等の発光デバイスの材料として、一般式がGa
XAl1-XN(0≦X≦1)で表される窒化ガリウム系化
合物半導体が知られている。しかし、窒化ガリウム系化
合物半導体の物性については、未だよく解明されておら
ず、窒化ガリウム系化合物半導体のp型層、およびn型
層とオーミック接触を得ることのできる電極材料もよく
知られていないのが実状である。
ム系化合物半導体を利用して、低駆動電圧化、高輝度化
した発光デバイスと実現するには、p型層およびn型層
からオーミック接触を得ることが不可欠である。
ので、窒化ガリウム系化合物半導体のp型層およびn型
層からオーミック接触の得られる電極材料を提供して、
高輝度化、低電圧駆動化できる発光デバイスを実現する
ものである。
法を用い、サファイア基板上にSiをドープしたn型G
aXAl1-XNと、Mgをドープしたp型GaXAl1-XN
とをそれぞれ成長させ、さらにp型GaXAl1-XNには
電子線を照射、または500℃以上にアニーリングして
さらに低抵抗なp型とした後、n型及びp型GaXAl
1-XNに数十種類の電極材料を蒸着して、オーミック接
触の確認を取ったところ、特定の金属、またはそれらの
合金に対してのみ良好なオーミック接触が得られること
を発見し、本発明を成すに至った。
体の電極材料は、p型不純物をドープした窒化ガリウム
系化合物半導体にはAu、Pt、Ag、Niよりなる群
から選択される少なくとも一種の金属、またはそれらの
合金を使用することを特徴とするものであり、また、n
型不純物をドープした窒化ガリウム系化合物半導体に
は、Al、Cr、Ti、Inよりなる群から選択される
少なくとも一種の金属、またはそれらの合金を使用する
ことを特徴とするものである。
その電流電圧特性を測定してオーミック接触を調べた結
果を示す。はPt電極単独、はNiをベースとし、
その上にAuを設けた電極、はAu電極単独である。
また、いうまでもなくNi電極単独またはNiをベース
としその上にPt、Agを設けた場合はと同一の直線
となる。
p型層に対しオーミック接触が得られるが、特に好まし
い電極材料としてPt、Niベースの電極を挙げる
ことができる。特にNiをベースとすることにより、例
えば、p型GaXAl1-XNに対しアニーリング等の熱処
理を行った場合、Au電極単独であれば剥がれ落ちてし
まう欠点があるが、アニーリングの熱にも耐えることが
でき、強固に電極を付着させることができる。蒸着する
好ましいNiの厚さは0.01μm〜0.5μmであ
り、その上に形成するAuの厚さは0.01μm〜0.
8μmである。それらの範囲で電極を形成することによ
り、剥がれ落ちにくく、良好なオーミック接触が得られ
る。
蒸着し、その電流電圧特性を測定してオーミック接触を
調べた結果を示す。はCrをベースとし、その上にA
lを設けた電極、はAl電極単独、はTi電極単独
である。Cr電極単独またはCrをベースとしその上に
Ti、Inを設けた場合はと同一の直線となる。
n型層に対しオーミック接触が得られるが、特に好まし
い電極材料としてCrベースの電極、Al電極を挙
げることができる。
ープしてp型にし得る不純物としては例えばMg、Z
n、Cd、Be、Ca等を用いることができ、またn型
にし得る不純物としてはSi、Sn、Ge等を用いるこ
とができる。
よると、好ましくp型及びn型GaXAl1-XNとオーミ
ック接触が得られるため、GaXAl1-XNを利用した発
光ダイオード、レーザーダイオード等の開発に向けてそ
の利用価値は多大である。
圧特性を示す図。
圧特性を示す図。
Claims (2)
- 【請求項1】 p型不純物をドープした一般式GaXA
l1-XN(但し0≦X≦1)で表される窒化ガリウム系化
合物半導体とオーミック接触を得る電極材料として、A
u、Pt、Ag、Niよりなる群から選択される少なく
とも一種の金属、またはそれらの合金を使用することを
特徴とする窒化ガリウム系化合物半導体の電極材料。 - 【請求項2】 n型不純物をドープした一般式GaXA
l1-XN(但し0≦X≦1)で表される窒化ガリウム系化
合物半導体とオーミック接触を得る電極材料として、A
l、Cr、Ti、Inよりなる群から選択される少なく
とも一種の金属、またはそれらの合金を使用することを
特徴とする窒化ガリウム系化合物半導体の電極材料。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11822792A JP2778349B2 (ja) | 1992-04-10 | 1992-04-10 | 窒化ガリウム系化合物半導体の電極 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP11822792A JP2778349B2 (ja) | 1992-04-10 | 1992-04-10 | 窒化ガリウム系化合物半導体の電極 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05291621A true JPH05291621A (ja) | 1993-11-05 |
JP2778349B2 JP2778349B2 (ja) | 1998-07-23 |
Family
ID=14731374
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP11822792A Expired - Lifetime JP2778349B2 (ja) | 1992-04-10 | 1992-04-10 | 窒化ガリウム系化合物半導体の電極 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2778349B2 (ja) |
Cited By (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0622858A3 (en) * | 1993-04-28 | 1995-05-17 | Nichia Kagaku Kogyo Kk | III-V compound semiconductor device comprising gallium nitride-based compounds and manufacturing process. |
US5571391A (en) * | 1994-07-15 | 1996-11-05 | Sharp Kabushiki Kaisha | Electrode structure and method for fabricating the same |
EP0757393A2 (en) * | 1995-08-02 | 1997-02-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting element and method for fabricating the same |
JPH09270569A (ja) * | 1996-01-25 | 1997-10-14 | Matsushita Electric Ind Co Ltd | 半導体レーザ装置 |
US5701035A (en) * | 1994-07-19 | 1997-12-23 | Sharp Kabushiki Kaisha | Electrode structure and method for fabricating the same |
US5708301A (en) * | 1994-02-28 | 1998-01-13 | Sumitomo Chemical Company, Limited | Electrode material and electrode for III-V group compound semiconductor |
JPH1041254A (ja) * | 1996-07-24 | 1998-02-13 | Sony Corp | オーミック電極およびその形成方法 |
EP0911888A2 (en) * | 1994-03-22 | 1999-04-28 | Toyoda Gosei Co., Ltd. | Light emitting semiconductor device using group III nitrogen compound |
EP0926744A2 (en) * | 1997-12-15 | 1999-06-30 | Hewlett-Packard Company | Light emitting device |
JPH11186605A (ja) * | 1997-12-18 | 1999-07-09 | Toyoda Gosei Co Ltd | 窒化ガリウム系化合物半導体の電極形成方法及び素子の製造方法 |
US6008539A (en) * | 1995-06-16 | 1999-12-28 | Toyoda Gosei Co., Ltd. | Electrodes for p-type group III nitride compound semiconductors |
JP2000036619A (ja) * | 1998-05-13 | 2000-02-02 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
US6067309A (en) * | 1996-09-06 | 2000-05-23 | Kabushiki Kaisha Toshiba | Compound semiconductor light-emitting device of gallium nitride series |
US6121127A (en) * | 1996-06-14 | 2000-09-19 | Toyoda Gosei Co., Ltd. | Methods and devices related to electrodes for p-type group III nitride compound semiconductors |
US6265726B1 (en) | 1994-03-22 | 2001-07-24 | Toyoda Gosei Co., Ltd. | Light-emitting aluminum gallium indium nitride compound semiconductor device having an improved luminous intensity |
US6278136B1 (en) | 1997-04-22 | 2001-08-21 | Kabushiki Kaisha Toshiba | Semiconductor light emitting element, its manufacturing method and light emitting device |
US6281526B1 (en) | 1997-03-05 | 2001-08-28 | Kabushiki Kaisha Toshiba | Nitride compound light emitting device and method for fabricating same |
US6291840B1 (en) | 1996-11-29 | 2001-09-18 | Toyoda Gosei Co., Ltd. | GaN related compound semiconductor light-emitting device |
US6340824B1 (en) | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
US6486499B1 (en) | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
US6514782B1 (en) | 1999-12-22 | 2003-02-04 | Lumileds Lighting, U.S., Llc | Method of making a III-nitride light-emitting device with increased light generating capability |
US6573537B1 (en) | 1999-12-22 | 2003-06-03 | Lumileds Lighting, U.S., Llc | Highly reflective ohmic contacts to III-nitride flip-chip LEDs |
US6885035B2 (en) | 1999-12-22 | 2005-04-26 | Lumileds Lighting U.S., Llc | Multi-chip semiconductor LED assembly |
US6903376B2 (en) | 1999-12-22 | 2005-06-07 | Lumileds Lighting U.S., Llc | Selective placement of quantum wells in flipchip light emitting diodes for improved light extraction |
WO2005057642A1 (en) * | 2003-12-10 | 2005-06-23 | Showa Denko K.K. | Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof |
WO2005059982A1 (en) * | 2003-12-17 | 2005-06-30 | Showa Denko K.K. | Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof |
US6936859B1 (en) | 1998-05-13 | 2005-08-30 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using group III nitride compound |
US7049160B2 (en) | 2003-09-16 | 2006-05-23 | Stanley Electric Co., Ltd. | Gallium nitride compound semiconductor device and method of manufacturing the same |
JP2006229219A (ja) * | 2004-05-12 | 2006-08-31 | Showa Denko Kk | III族窒化物p型半導体およびその製造方法 |
US7145237B2 (en) | 2003-02-25 | 2006-12-05 | Sharp Kabushiki Kaishi | Electrode employing nitride-based semiconductor of III-V group compound, and producing method thereof |
JP2007109682A (ja) * | 2005-10-11 | 2007-04-26 | Sanken Electric Co Ltd | 半導体素子及びその製造方法 |
DE19921987B4 (de) * | 1998-05-13 | 2007-05-16 | Toyoda Gosei Kk | Licht-Abstrahlende Halbleitervorrichtung mit Gruppe-III-Element-Nitrid-Verbindungen |
DE19648309B4 (de) * | 1995-12-21 | 2007-10-18 | LumiLeds Lighting, U.S., LLC, San Jose | Stark reflektierende Kontakte für Licht-emittierende Halbleiterbauelemente |
US7525123B2 (en) | 2004-09-28 | 2009-04-28 | Nichia Corporation | Semiconductor device |
US7763477B2 (en) | 2004-03-15 | 2010-07-27 | Tinggi Technologies Pte Limited | Fabrication of semiconductor devices |
US7973325B2 (en) | 2004-10-07 | 2011-07-05 | Samsung Electronics Co., Ltd. | Reflective electrode and compound semiconductor light emitting device including the same |
WO2011086730A1 (ja) | 2010-01-18 | 2011-07-21 | 住友電気工業株式会社 | Iii族窒化物系半導体素子 |
WO2011086755A1 (ja) | 2010-01-18 | 2011-07-21 | 住友電気工業株式会社 | 半導体素子及び半導体素子を作製する方法 |
US8004001B2 (en) | 2005-09-29 | 2011-08-23 | Tinggi Technologies Private Limited | Fabrication of semiconductor devices for light emission |
US8034643B2 (en) | 2003-09-19 | 2011-10-11 | Tinggi Technologies Private Limited | Method for fabrication of a semiconductor device |
US8934513B2 (en) | 1994-09-14 | 2015-01-13 | Rohm Co., Ltd. | Semiconductor light emitting device and manufacturing method therefor |
US8999019B2 (en) | 2005-10-21 | 2015-04-07 | Taylor Biomass Energy, Llc | Process and system for gasification with in-situ tar removal |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5762579A (en) * | 1980-10-01 | 1982-04-15 | Matsushita Electric Ind Co Ltd | Manufacture of light emitting element |
US5006908A (en) * | 1989-02-13 | 1991-04-09 | Nippon Telegraph And Telephone Corporation | Epitaxial Wurtzite growth structure for semiconductor light-emitting device |
JPH03183173A (ja) * | 1989-12-13 | 1991-08-09 | Canon Inc | 光学素子 |
JPH04273175A (ja) * | 1991-02-27 | 1992-09-29 | Toyota Central Res & Dev Lab Inc | 窒化ガリウム系化合物半導体発光素子およびその製造方法 |
JPH05315647A (ja) * | 1992-03-10 | 1993-11-26 | Asahi Chem Ind Co Ltd | 窒化物系半導体素子およびその製造方法 |
-
1992
- 1992-04-10 JP JP11822792A patent/JP2778349B2/ja not_active Expired - Lifetime
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5762579A (en) * | 1980-10-01 | 1982-04-15 | Matsushita Electric Ind Co Ltd | Manufacture of light emitting element |
US5006908A (en) * | 1989-02-13 | 1991-04-09 | Nippon Telegraph And Telephone Corporation | Epitaxial Wurtzite growth structure for semiconductor light-emitting device |
JPH03183173A (ja) * | 1989-12-13 | 1991-08-09 | Canon Inc | 光学素子 |
JPH04273175A (ja) * | 1991-02-27 | 1992-09-29 | Toyota Central Res & Dev Lab Inc | 窒化ガリウム系化合物半導体発光素子およびその製造方法 |
JPH05315647A (ja) * | 1992-03-10 | 1993-11-26 | Asahi Chem Ind Co Ltd | 窒化物系半導体素子およびその製造方法 |
Cited By (85)
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US5652434A (en) * | 1993-04-28 | 1997-07-29 | Nichia Chemical Industries, Ltd. | Gallium nitride-based III-V group compound semiconductor |
CN1046375C (zh) * | 1993-04-28 | 1999-11-10 | 日亚化学工业株式会社 | 氮化镓系ⅲ-v族化合物半导体器件及其制造方法 |
EP0622858A3 (en) * | 1993-04-28 | 1995-05-17 | Nichia Kagaku Kogyo Kk | III-V compound semiconductor device comprising gallium nitride-based compounds and manufacturing process. |
US6610995B2 (en) | 1993-04-28 | 2003-08-26 | Nichia Corporation | Gallium nitride-based III-V group compound semiconductor |
US6998690B2 (en) | 1993-04-28 | 2006-02-14 | Nichia Corporation | Gallium nitride based III-V group compound semiconductor device and method of producing the same |
US7205220B2 (en) | 1993-04-28 | 2007-04-17 | Nichia Corporation | Gallium nitride based III-V group compound semiconductor device and method of producing the same |
US6204512B1 (en) | 1993-04-28 | 2001-03-20 | Nichia Chemical Industries, Ltd. | Gallium nitride-based III-V group compound semiconductor device and method of producing the same |
US5767581A (en) * | 1993-04-28 | 1998-06-16 | Nichia Chemical Industries, Ltd. | Gallium nitride-based III-V group compound semiconductor |
US5877558A (en) * | 1993-04-28 | 1999-03-02 | Nichia Chemical Industries, Ltd. | Gallium nitride-based III-V group compound semiconductor |
US6093965A (en) * | 1993-04-28 | 2000-07-25 | Nichia Chemical Industries Ltd. | Gallium nitride-based III-V group compound semiconductor |
US6507041B2 (en) | 1993-04-28 | 2003-01-14 | Nichia Chemical Industries, Ltd. | Gallium nitride-based III-V group compound semiconductor |
US6388323B1 (en) | 1994-02-28 | 2002-05-14 | Sumitomo Chemical Co., Ltd. | Electrode material and electrode for III-V group compound semiconductor |
US5708301A (en) * | 1994-02-28 | 1998-01-13 | Sumitomo Chemical Company, Limited | Electrode material and electrode for III-V group compound semiconductor |
US7867800B2 (en) | 1994-03-22 | 2011-01-11 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using group III nitrogen compound |
US7001790B2 (en) | 1994-03-22 | 2006-02-21 | Toyoda Gosei Co., Ltd. | Light-emitting aluminum gallium indium nitride compound semiconductor device having an improved luminous intensity |
US7138286B2 (en) | 1994-03-22 | 2006-11-21 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using group III nitrogen compound |
EP0911888A3 (en) * | 1994-03-22 | 1999-06-23 | Toyoda Gosei Co., Ltd. | Light emitting semiconductor device using group III nitrogen compound |
US6265726B1 (en) | 1994-03-22 | 2001-07-24 | Toyoda Gosei Co., Ltd. | Light-emitting aluminum gallium indium nitride compound semiconductor device having an improved luminous intensity |
US7332366B2 (en) | 1994-03-22 | 2008-02-19 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using group III nitrogen compound |
EP0911888A2 (en) * | 1994-03-22 | 1999-04-28 | Toyoda Gosei Co., Ltd. | Light emitting semiconductor device using group III nitrogen compound |
US5571391A (en) * | 1994-07-15 | 1996-11-05 | Sharp Kabushiki Kaisha | Electrode structure and method for fabricating the same |
US5701035A (en) * | 1994-07-19 | 1997-12-23 | Sharp Kabushiki Kaisha | Electrode structure and method for fabricating the same |
US5966629A (en) * | 1994-07-19 | 1999-10-12 | Sharp Kabushiki Kaisha | Method for fabricating an electrode structure |
US6429111B2 (en) | 1994-07-19 | 2002-08-06 | Sharp Kabushiki Kaisha | Methods for fabricating an electrode structure |
US6222204B1 (en) | 1994-07-19 | 2001-04-24 | Sharp Kabushiki Kaisha | Electrode structure and method for fabricating the same |
US8934513B2 (en) | 1994-09-14 | 2015-01-13 | Rohm Co., Ltd. | Semiconductor light emitting device and manufacturing method therefor |
US6008539A (en) * | 1995-06-16 | 1999-12-28 | Toyoda Gosei Co., Ltd. | Electrodes for p-type group III nitride compound semiconductors |
EP0757393A2 (en) * | 1995-08-02 | 1997-02-05 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting element and method for fabricating the same |
EP0757393A3 (en) * | 1995-08-02 | 1999-11-03 | Matsushita Electric Industrial Co., Ltd. | Semiconductor light emitting element and method for fabricating the same |
DE19648309B4 (de) * | 1995-12-21 | 2007-10-18 | LumiLeds Lighting, U.S., LLC, San Jose | Stark reflektierende Kontakte für Licht-emittierende Halbleiterbauelemente |
JPH09270569A (ja) * | 1996-01-25 | 1997-10-14 | Matsushita Electric Ind Co Ltd | 半導体レーザ装置 |
US6121127A (en) * | 1996-06-14 | 2000-09-19 | Toyoda Gosei Co., Ltd. | Methods and devices related to electrodes for p-type group III nitride compound semiconductors |
JPH1041254A (ja) * | 1996-07-24 | 1998-02-13 | Sony Corp | オーミック電極およびその形成方法 |
KR100496369B1 (ko) * | 1996-07-24 | 2005-09-08 | 소니 가부시끼 가이샤 | 오믹전극및반도체소자 |
US6067309A (en) * | 1996-09-06 | 2000-05-23 | Kabushiki Kaisha Toshiba | Compound semiconductor light-emitting device of gallium nitride series |
US6573117B2 (en) | 1996-11-29 | 2003-06-03 | Toyoda Gosei Co., Ltd. | GaN related compound semiconductor and process for producing the same |
KR100436102B1 (ko) * | 1996-11-29 | 2004-06-14 | 도요다 고세이 가부시키가이샤 | GaN계 화합물 반도체 발광장치의 제조방법 |
US6291840B1 (en) | 1996-11-29 | 2001-09-18 | Toyoda Gosei Co., Ltd. | GaN related compound semiconductor light-emitting device |
KR100338452B1 (ko) * | 1996-11-29 | 2002-11-23 | 도요다 고세이 가부시키가이샤 | Gan계 화합물 반도체 발광장치 |
US6500689B2 (en) | 1996-11-29 | 2002-12-31 | Toyoda Gosei Co., Ltd. | Process for producing GaN related compound semiconductor |
US6417020B2 (en) | 1997-03-05 | 2002-07-09 | Kabushiki Kaisha Toshiba | Nitride compound light emitting device and method for fabricating the same |
US6281526B1 (en) | 1997-03-05 | 2001-08-28 | Kabushiki Kaisha Toshiba | Nitride compound light emitting device and method for fabricating same |
US6278136B1 (en) | 1997-04-22 | 2001-08-21 | Kabushiki Kaisha Toshiba | Semiconductor light emitting element, its manufacturing method and light emitting device |
US6661030B2 (en) | 1997-09-01 | 2003-12-09 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
US6674097B2 (en) | 1997-09-01 | 2004-01-06 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
US6340824B1 (en) | 1997-09-01 | 2002-01-22 | Kabushiki Kaisha Toshiba | Semiconductor light emitting device including a fluorescent material |
EP0926744A3 (en) * | 1997-12-15 | 2000-05-31 | Hewlett-Packard Company | Light emitting device |
EP1928034A3 (en) * | 1997-12-15 | 2008-06-18 | Philips Lumileds Lighting Company LLC | Light emitting device |
US6900472B2 (en) | 1997-12-15 | 2005-05-31 | Lumileds Lighting U.S., Llc | Semiconductor light emitting device having a silver p-contact |
US7262436B2 (en) | 1997-12-15 | 2007-08-28 | Philips Lumileds Lighting Company, Llc | III-nitride semiconductor light emitting device having a silver p-contact |
EP0926744A2 (en) * | 1997-12-15 | 1999-06-30 | Hewlett-Packard Company | Light emitting device |
US6194743B1 (en) | 1997-12-15 | 2001-02-27 | Agilent Technologies, Inc. | Nitride semiconductor light emitting device having a silver p-contact |
JPH11186605A (ja) * | 1997-12-18 | 1999-07-09 | Toyoda Gosei Co Ltd | 窒化ガリウム系化合物半導体の電極形成方法及び素子の製造方法 |
US6936859B1 (en) | 1998-05-13 | 2005-08-30 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using group III nitride compound |
JP2000036619A (ja) * | 1998-05-13 | 2000-02-02 | Toyoda Gosei Co Ltd | Iii族窒化物系化合物半導体発光素子 |
US7109529B2 (en) | 1998-05-13 | 2006-09-19 | Toyoda Gosei Co., Ltd. | Light-emitting semiconductor device using group III nitride compound |
DE19921987B4 (de) * | 1998-05-13 | 2007-05-16 | Toyoda Gosei Kk | Licht-Abstrahlende Halbleitervorrichtung mit Gruppe-III-Element-Nitrid-Verbindungen |
US6903376B2 (en) | 1999-12-22 | 2005-06-07 | Lumileds Lighting U.S., Llc | Selective placement of quantum wells in flipchip light emitting diodes for improved light extraction |
US6885035B2 (en) | 1999-12-22 | 2005-04-26 | Lumileds Lighting U.S., Llc | Multi-chip semiconductor LED assembly |
US6844571B2 (en) | 1999-12-22 | 2005-01-18 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
US6486499B1 (en) | 1999-12-22 | 2002-11-26 | Lumileds Lighting U.S., Llc | III-nitride light-emitting device with increased light generating capability |
US6573537B1 (en) | 1999-12-22 | 2003-06-03 | Lumileds Lighting, U.S., Llc | Highly reflective ohmic contacts to III-nitride flip-chip LEDs |
US6521914B2 (en) | 1999-12-22 | 2003-02-18 | Lumileds Lighting, U.S., Llc | III-Nitride Light-emitting device with increased light generating capability |
US6514782B1 (en) | 1999-12-22 | 2003-02-04 | Lumileds Lighting, U.S., Llc | Method of making a III-nitride light-emitting device with increased light generating capability |
US7145237B2 (en) | 2003-02-25 | 2006-12-05 | Sharp Kabushiki Kaishi | Electrode employing nitride-based semiconductor of III-V group compound, and producing method thereof |
US7193247B2 (en) | 2003-09-16 | 2007-03-20 | Stanley Electric Co., Ltd. | Gallium nitride compound semiconductor device |
US7049160B2 (en) | 2003-09-16 | 2006-05-23 | Stanley Electric Co., Ltd. | Gallium nitride compound semiconductor device and method of manufacturing the same |
US8034643B2 (en) | 2003-09-19 | 2011-10-11 | Tinggi Technologies Private Limited | Method for fabrication of a semiconductor device |
WO2005057642A1 (en) * | 2003-12-10 | 2005-06-23 | Showa Denko K.K. | Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof |
US7452740B2 (en) | 2003-12-10 | 2008-11-18 | Showa Denko K.K. | Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof |
JP2011049609A (ja) * | 2003-12-17 | 2011-03-10 | Showa Denko Kk | 窒化ガリウム系化合物半導体発光素子およびその負極 |
WO2005059982A1 (en) * | 2003-12-17 | 2005-06-30 | Showa Denko K.K. | Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof |
US7518163B2 (en) | 2003-12-17 | 2009-04-14 | Showa Denko K.K. | Gallium nitride-based compound semiconductor light-emitting device and negative electrode thereof |
US7763477B2 (en) | 2004-03-15 | 2010-07-27 | Tinggi Technologies Pte Limited | Fabrication of semiconductor devices |
JP2006229219A (ja) * | 2004-05-12 | 2006-08-31 | Showa Denko Kk | III族窒化物p型半導体およびその製造方法 |
US7525123B2 (en) | 2004-09-28 | 2009-04-28 | Nichia Corporation | Semiconductor device |
US7973325B2 (en) | 2004-10-07 | 2011-07-05 | Samsung Electronics Co., Ltd. | Reflective electrode and compound semiconductor light emitting device including the same |
US8004001B2 (en) | 2005-09-29 | 2011-08-23 | Tinggi Technologies Private Limited | Fabrication of semiconductor devices for light emission |
JP2007109682A (ja) * | 2005-10-11 | 2007-04-26 | Sanken Electric Co Ltd | 半導体素子及びその製造方法 |
US8999019B2 (en) | 2005-10-21 | 2015-04-07 | Taylor Biomass Energy, Llc | Process and system for gasification with in-situ tar removal |
WO2011086755A1 (ja) | 2010-01-18 | 2011-07-21 | 住友電気工業株式会社 | 半導体素子及び半導体素子を作製する方法 |
US8415707B2 (en) | 2010-01-18 | 2013-04-09 | Sumitomo Electric Industries, Ltd. | Group III nitride semiconductor device |
US8227898B2 (en) | 2010-01-18 | 2012-07-24 | Sumitomo Electric Industries, Ltd. | Ohmic contact on a p-type principal surface tilting with respect to the c-plane |
WO2011086730A1 (ja) | 2010-01-18 | 2011-07-21 | 住友電気工業株式会社 | Iii族窒化物系半導体素子 |
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