JPH0529133U - Assembled wafer boat with legs - Google Patents
Assembled wafer boat with legsInfo
- Publication number
- JPH0529133U JPH0529133U JP8626391U JP8626391U JPH0529133U JP H0529133 U JPH0529133 U JP H0529133U JP 8626391 U JP8626391 U JP 8626391U JP 8626391 U JP8626391 U JP 8626391U JP H0529133 U JPH0529133 U JP H0529133U
- Authority
- JP
- Japan
- Prior art keywords
- wafer boat
- wafer
- legs
- support shaft
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】
【目的】 組立式ウェーハボートの機能を損なわずに、
部品点数を減らして組立、分解を簡単に行えるようにし
た、脚付き組立式ウェーハボートを提供する。
【構成】 半導体ウェーハを複数載置して所定の熱処理
を施すウェーハボートであって、ウェーハを支持する2
以上の支持軸と、この支持軸の両端部を保持する側板と
から構成する。ウェーハを支持する支持軸には、それ自
体のたわみを抑止するための脚を形成する。この脚に支
持軸の中間支持部材の機能を持たせる。
(57) [Abstract] [Purpose] Without impairing the function of the assembly type wafer boat,
(EN) Provided is an assembling type wafer boat with legs, in which the number of parts is reduced and the assembling and disassembling can be easily performed. [Structure] A wafer boat for mounting a plurality of semiconductor wafers and subjecting them to a predetermined heat treatment.
The support shaft is composed of the above support shafts and side plates holding both ends of the support shaft. The supporting shaft for supporting the wafer is formed with legs for suppressing the bending of itself. This leg is made to have the function of an intermediate support member for the support shaft.
Description
【0001】[0001]
本考案は、脚付き組立式ウェーハボートに関するものである。 The present invention relates to an assembled wafer boat with legs.
【0002】[0002]
半導体ウェーハを拡散炉内において熱処理する時に用いられる支持具があり、 これは複数枚のウェーハを一定の間隔で並置して拡散炉内に収納できるようにし てある。 この種の支持具は、ウェーハボートとも称されて組立式のものがあり、例えば 図3に示すように一対の側板aと、この側板に着脱自在に支持される複数のウェ ーハ支持軸bと、このウェーハ支持軸の中間部を支持する複数の中間支持部材c とから構成されている(実開平2−73731号公報)。 There is a supporting tool used for heat-treating semiconductor wafers in a diffusion furnace, which allows a plurality of wafers to be housed in the diffusion furnace side by side at regular intervals. This type of support is also called a wafer boat and is of an assembly type. For example, as shown in FIG. 3, a pair of side plates a and a plurality of wafer support shafts b that are detachably supported by the side plates. And a plurality of intermediate support members c which support the intermediate portion of the wafer support shaft (Japanese Utility Model Laid-Open No. 2-73731).
【0003】[0003]
しかしながら、前記組立式ウェーハボートにおいては、比較的部品点数が多い ため、組立及び分解に相当時間が掛かり、部品の交換等メンテナンス面でも厄介 であり、部品点数の削減に解決すべき問題点を有している。 However, since the assembly type wafer boat has a relatively large number of parts, it takes a considerable amount of time to assemble and disassemble, and it is troublesome in terms of maintenance such as replacement of parts, and there is a problem to be solved to reduce the number of parts. is doing.
【0004】 本考案は、このような従来の問題点を解決するためになされ、組立式ウェーハ ボートの機能を損なわずに部品点数を減らして組立、分解を簡単に行えるように した、脚付き組立式ウェーハボートを提供することを課題としたものである。The present invention has been made in order to solve the above-mentioned conventional problems, and is an assembly with legs, which can be easily assembled and disassembled by reducing the number of parts without impairing the function of the assembly type wafer boat. It is an object to provide a type wafer boat.
【0005】[0005]
前記課題を技術的に解決するための手段として、本考案は、半導体ウェーハを 複数載置して所定の熱処理を施すウェーハボートであって、ウェーハを支持する 2以上の支持軸と、この支持軸の両端部を保持する側板とから構成され、前記ウ ェーハを支持する支持軸には、それ自体のたわみを抑止するための脚が形成され たことを要旨とするものである。 MEANS TO SOLVE THE PROBLEM As a means for technically solving the above-mentioned problems, the present invention is a wafer boat for mounting a plurality of semiconductor wafers and performing a predetermined heat treatment, the support boat supporting two or more wafers, and the support shafts. The gist of the present invention is that the support shaft, which is composed of side plates that hold both ends of the wafer, and that supports the wafer is formed with legs for suppressing the deflection of the wafer itself.
【0006】[0006]
脚が支持軸と一体に形成されているので、従来例のような複数の中間支持部材 が不要となって部品点数の削減が図れ、中間支持部材の機能は支持軸に持たせる ことができる。 Since the legs are formed integrally with the support shaft, a plurality of intermediate support members as in the conventional example are not required, and the number of parts can be reduced, and the function of the intermediate support member can be given to the support shaft.
【0007】[0007]
以下、本考案の実施例を添付図面に基づいて詳説する。 図1において、1は一対の側板であり、この側板に複数の角柱状支持軸2、3を 差し渡してその両端部を着脱自在に取り付け、最外側の両支持軸2の下部には一 定の間隔をあけてたわみ抑止用の脚4が支持軸と一体に形成されている。 Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In FIG. 1, reference numeral 1 denotes a pair of side plates. A plurality of prismatic support shafts 2 and 3 are arranged on the side plates, and both ends of the support shafts are detachably attached. Deflection suppressing legs 4 are formed integrally with the support shaft at intervals.
【0008】 前記支持軸2は、上面の内側縁から内面の上側縁にかけて支持軸の長手方向に 沿って一定のピッチでウェーハ装着溝2aが設けられ、前記内側に取り付ける支 持軸3の上面にも同様にウェーハ装着溝3aが設けられている。The supporting shaft 2 is provided with wafer mounting grooves 2a at a constant pitch along the longitudinal direction of the supporting shaft from the inner edge of the upper surface to the upper edge of the inner surface. Similarly, a wafer mounting groove 3a is provided.
【0009】 前記側板1は、図2に示すように上部の両肩部に切り込み溝1aが対設され、 この切り込み溝1aに前記支持軸2の端部に形成された切り込み溝(図示せず) を嵌め込むことにより支持軸2を着脱自在に取り付けられるようにしてある。 又、側板1の内面側には図1に見えるように斜めの嵌め込み用凹部1bが形成 され、この凹部に前記支持軸3の端部を嵌合することにより側板1の下部に支持 軸3を着脱自在に取り付けられるようにしてある。 つまり、一対の側板1間に2本の支持軸2、3が合計4本着脱自在に取り付け られ、これらの支持軸2、3のウェーハ装着溝2a、3aはウェーハを安定良く 保持できるように円周方向に沿って整合するようにしてある。As shown in FIG. 2, the side plate 1 is provided with cut grooves 1a at both upper shoulders, and the cut grooves 1a are formed at the end of the support shaft 2 (not shown). ) Is attached so that the support shaft 2 can be detachably attached. Further, as shown in FIG. 1, an oblique fitting recess 1b is formed on the inner surface side of the side plate 1, and the end of the support shaft 3 is fitted into this recess so that the support shaft 3 is attached to the lower part of the side plate 1. It is designed to be detachable. That is, a total of four support shafts 2 and 3 are detachably mounted between the pair of side plates 1, and the wafer mounting grooves 2a and 3a of these support shafts 2 and 3 are circular so that the wafer can be stably held. It is adapted to be aligned along the circumferential direction.
【0010】 前記側板1の上部には、取っ手5を装着するための孔1cが所定の間隔をあけ て対設され、この装着用孔1cに取っ手5の下部に設けられた係合部5aを挿入 して取っ手5を側板1の外面に密接させ、係合部5aの先端部に設けられた溝5 bにストッパー6の下部に設けられた切り欠き6aを嵌合係止することにより、 取っ手5を着脱自在に取り付けられるようにしてある。この時、ストッパー6の 上部に設けられた鉤状の係止部6bは、取っ手5の下枠5cに引っ掛かるように なっている。On the upper part of the side plate 1, holes 1c for mounting the handles 5 are provided at predetermined intervals, and an engaging portion 5a provided on the lower part of the handles 5 is provided in the mounting holes 1c. By inserting the handle 5 into close contact with the outer surface of the side plate 1 and fitting and locking the notch 6a provided in the lower portion of the stopper 6 in the groove 5b provided at the tip of the engaging portion 5a, 5 is detachably attached. At this time, the hook-shaped engaging portion 6b provided on the upper portion of the stopper 6 is adapted to be hooked on the lower frame 5c of the handle 5.
【0011】 このようにして形成されたウェーハボート7は、前記支持軸2、3のウェーハ 装着溝2a、3aに複数のウェーハ(図示せず)を装着して載置し、拡散炉内に 収納してウェーハの熱処理が行われる。前記取っ手5はこのウェーハボート7を 搬送する際に有効に利用される。The wafer boat 7 formed in this way is mounted by mounting a plurality of wafers (not shown) in the wafer mounting grooves 2a, 3a of the support shafts 2, 3 and storing them in a diffusion furnace. Then, the heat treatment of the wafer is performed. The handle 5 is effectively used when the wafer boat 7 is transported.
【0012】 前記ウェーハの熱処理において、ウェーハボート7はかなりの高温に曝され、 或は相当な温度変化を受けるが損傷乃至変形することはない。特に、最外側の支 持軸2の下部には脚4が形成されているので、これが補強作用をなし支持軸2自 体のたわみを未然に防止することができると共に、ウェーハボート7の安定性を 保持することができる。これにより、従来の中間支持部材が不要となる。In the heat treatment of the wafer, the wafer boat 7 is exposed to a considerably high temperature or undergoes a considerable temperature change but is not damaged or deformed. In particular, since the leg 4 is formed in the lower part of the outermost support shaft 2, this has a reinforcing effect and can prevent the deflection of the support shaft 2 itself, and the stability of the wafer boat 7. Can hold. This eliminates the need for a conventional intermediate support member.
【0013】 尚、ウェーハボートの構成部材は全てシリコン製であることが望ましいが、取 っ手とストッパーは石英ガラス製にすることも可能である。It is desirable that all the constituent members of the wafer boat are made of silicon, but the handle and the stopper can be made of quartz glass.
【0014】[0014]
以上説明したように、本考案によれば、ウェーハボートの脚が支持軸と一体に 形成されているので、従来例のような複数の中間支持部材が不要となり、部品点 数の削減が図れ、組立及び分解が容易にできると共に、部品交換も簡単にできる 等の優れた効果を奏する。 As described above, according to the present invention, since the legs of the wafer boat are formed integrally with the support shaft, a plurality of intermediate support members as in the conventional example are unnecessary, and the number of parts can be reduced. It has excellent effects such as easy assembly and disassembly, and easy parts replacement.
【図面の簡単な説明】[Brief description of drawings]
【図1】 本考案の実施例を示すウェーハボートの斜視
図である。FIG. 1 is a perspective view of a wafer boat according to an embodiment of the present invention.
【図2】 その側板部分の分解斜視図である。FIG. 2 is an exploded perspective view of a side plate portion thereof.
【図3】 従来例の説明図である。FIG. 3 is an explanatory diagram of a conventional example.
1…側板 1a…切り込み溝 1b…嵌め込み用凹
部 1c…装着用孔2、3…支持軸 2a、3a…
ウェーハ装着溝 4…脚 5…取っ手5a…係合部
5b…溝 5c…下枠 6…ストッパー 6
a…切り欠き 6b…係止部 7…ウェーハボートDESCRIPTION OF SYMBOLS 1 ... Side plate 1a ... Notch groove 1b ... Fitting recess 1c ... Mounting hole 2, 3 ... Support shafts 2a, 3a ...
Wafer mounting groove 4 Leg 5 Handle 5a Engagement portion 5b Groove 5c Lower frame 6 Stopper 6
a ... Notch 6b ... Locking part 7 ... Wafer boat
Claims (2)
処理を施すウェーハボートであって、ウェーハを支持す
る2以上の支持軸と、この支持軸の両端部を保持する側
板とから構成され、前記ウェーハを支持する支持軸に
は、それ自体のたわみを抑止するための脚が形成された
ことを特徴とする、脚付き組立式ウェーハボート。1. A wafer boat for mounting a plurality of semiconductor wafers and subjecting the wafer to a predetermined heat treatment, comprising two or more support shafts for supporting the wafers and side plates for holding both end portions of the support shafts. A legged assembly type wafer boat, characterized in that a leg for restraining the bending of itself is formed on a support shaft for supporting the wafer.
る、請求項1記載の脚付き組立式ウェーハボート。2. The assembled wafer boat with legs according to claim 1, wherein legs are formed on both outermost support shafts.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8626391U JP2549407Y2 (en) | 1991-09-26 | 1991-09-26 | Assembled wafer boat with legs |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8626391U JP2549407Y2 (en) | 1991-09-26 | 1991-09-26 | Assembled wafer boat with legs |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0529133U true JPH0529133U (en) | 1993-04-16 |
JP2549407Y2 JP2549407Y2 (en) | 1997-09-30 |
Family
ID=13881935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8626391U Expired - Lifetime JP2549407Y2 (en) | 1991-09-26 | 1991-09-26 | Assembled wafer boat with legs |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2549407Y2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019173589A1 (en) * | 2018-03-07 | 2019-09-12 | Tokyo Electron Limited | Horizontal substrate boat |
-
1991
- 1991-09-26 JP JP8626391U patent/JP2549407Y2/en not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019173589A1 (en) * | 2018-03-07 | 2019-09-12 | Tokyo Electron Limited | Horizontal substrate boat |
CN111868907A (en) * | 2018-03-07 | 2020-10-30 | 东京毅力科创株式会社 | Horizontal substrate boat |
Also Published As
Publication number | Publication date |
---|---|
JP2549407Y2 (en) | 1997-09-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4467028B2 (en) | Vertical wafer support jig | |
JP3280438B2 (en) | Vertical boat | |
JP4554765B2 (en) | Blades and blade assemblies for mechanical wafer handling equipment | |
JPH0529133U (en) | Assembled wafer boat with legs | |
JP6147152B2 (en) | table | |
JP3388668B2 (en) | Heat treatment boat and vertical heat treatment equipment | |
JPH0529132U (en) | Assembled wafer boat with handle | |
JP3280437B2 (en) | Vertical boat | |
JPH113865A (en) | Boat for wafer mounting and manufacture thereof | |
JP2006057126A (en) | Holder for heat treatment | |
JP3098251B2 (en) | Wafer support device | |
JPS6011640Y2 (en) | Semiconductor diffusion boat | |
JPH079374Y2 (en) | Wafer support | |
KR200322208Y1 (en) | Weight block unit with structure for easily loading and unloading to/from weight training instruments | |
JPH04120723A (en) | Jig for wafer heat treatment | |
JP2547959Y2 (en) | Wafer support device | |
JP2000150401A (en) | Fabricated wafer boat | |
JP2002305235A (en) | Semiconductor wafer supporting apparatus | |
JPH11130181A (en) | Boat for loading wafer | |
JPH06822Y2 (en) | Semiconductor wafer transfer device | |
JP2000040667A (en) | Wafer boat | |
KR100189960B1 (en) | Wafer carrier | |
CN116825688A (en) | Boat structure and sheet transport device | |
JP2001313266A (en) | Heat treating boat | |
JP4010443B2 (en) | Wafer boat |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
EXPY | Cancellation because of completion of term |