JPH05259600A - Wiring board and manufacture thereof - Google Patents

Abstract

PURPOSE:To omit a plating process and improve efficiency, by forming holes at portions necessary for connection between circuit layers, forming metal recesses around the holes by eliminating copper foils only around the holes so as not to expose an insulating board, and filling the recesses and the holes with fluid conducting material. CONSTITUTION:Copper foils 2 are stacked on both surfaces of an insulating board 1 which is not completely cured, and heat and pressure are applied, thereby forming a unified laminate. Holes are formed at portions necessary for connection between circuit layers of the above laminate. The copper foils 2 only around the holes are eliminated so as not to expose the insulating board 1, and metal recesses are formed around the holes. The recesses and the holes are filled with fluid conducting material. Reinforcing fiber like glass cloth and paper impregnated with epoxy resin, phenol resin, etc., is used for the insulating board which is not completely cured. Connection area is increased, the shape after the conducting material is buried can be flattened, and an excellent multilayer board is obtained.

Description

【発明の詳細な説明】Detailed Description of the Invention

【０００１】[0001]

【産業上の利用分野】本発明は、安価でかつ配線密度の
高い配線板と、その配線板を効率的に製造する方法に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a wiring board which is inexpensive and has a high wiring density, and a method for efficiently manufacturing the wiring board.

【０００２】[0002]

【従来の技術】従来、配線板は、銅張り積層板の接続が
必要な箇所に孔をあけ、無電解めっきや電界めっきを行
なって孔内壁を金属化し、導体の不要な箇所をエッチン
グ除去するサブトラクティブ法や、絶縁基板に孔をあ
け、孔内壁と絶縁基板表面の必要な箇所にのみ無電解め
っきを用いて回路導体を形成するアディティブ法、前記
サブトラクティブ法において、孔をあけた後、銅箔の不
要な箇所を除去しておいて、孔内壁のみを無電解めっき
によって金属化するセミアディティブ法、およびこれら
に類する様々な方法によって製造されている。2. Description of the Related Art Conventionally, a wiring board is provided with a hole at a position where a copper-clad laminate needs to be connected, electroless plating or electric field plating is performed to metalize the inner wall of the hole, and an unnecessary portion of a conductor is removed by etching. Subtractive method or a hole in the insulating substrate, an additive method of forming a circuit conductor by using electroless plating only on the inner wall of the hole and a required portion of the surface of the insulating substrate, in the subtractive method, after making a hole, It is manufactured by a semi-additive method in which unnecessary portions of the copper foil are removed and only the inner wall of the hole is metalized by electroless plating, and various methods similar to these.

【０００３】また、一方では、より安価に提供するため
に、めっきを行なわずに回路を接続する方法として、古
くから行なわれているものに、図２に示すように、金属
粒子とバインダーと溶剤を含む銀ペーストや銅ペースト
を孔内壁に充填する方法や、さらには、これらのペース
トそのもので回路を形成することも行なわれている。ま
た、孔内壁にはんだペーストを充填し、熱によって溶融
して接続する方法も知られている。On the other hand, as shown in FIG. 2, metal particles, a binder and a solvent have been used as a method for connecting circuits without plating in order to provide them at a lower cost. A method of filling the inner wall of the hole with a silver paste or a copper paste containing, and further forming a circuit with these pastes themselves have been performed. A method is also known in which the inner wall of the hole is filled with a solder paste, and the inner wall is melted by heat and connected.

【０００４】[0004]

【発明が解決しようとする課題】ところで、前述の配線
板の製造法のうち、めっきを用いるものは、特に接続信
頼性を強く求められるもについて使用されていたが、今
般の電子機器の発達に伴い、高性能の電子機器を安価に
製造することが強く望まれている。しかし、前述のめっ
きを用いる方法は、めっきの時間を現在より早くするこ
とができず、また、めっきを行なうための特定の治具が
必要であり、また、めっき液の管理が必要なこともあっ
て、かなり規模の大きい装置を必要とする。したがっ
て、現状では、めっきを行なう限り、製造の効率には限
界があるものと考えられている。また、安価に製造する
方法については、図２に示すように、導電性ペーストを
塗布しても、孔内部への完全な充填が困難であり、接続
面積が小さく、したがって、接続抵抗が大きくなるの
で、片面ないしは両面回路板等の配線密度の小さな配線
板にしか対応できないのが実情である。また、印刷法に
よって全各ペーストを用いたこの方法は、複雑な回路を
構成することができず、また、多層化するためには、接
続の信頼性が低いこともあって、安価な材料で機能の高
い配線板を製造することは困難である。By the way, among the above-mentioned wiring board manufacturing methods, the method using plating has been used especially for the case where connection reliability is strongly required. Therefore, it is strongly desired to manufacture high-performance electronic devices at low cost. However, the method using the plating described above cannot shorten the plating time, requires a specific jig for performing the plating, and requires management of the plating solution. Yes, it requires a fairly large device. Therefore, at present, it is considered that there is a limit to the efficiency of production as long as plating is performed. Further, regarding the method of manufacturing at low cost, as shown in FIG. 2, even if the conductive paste is applied, it is difficult to completely fill the inside of the hole, the connection area is small, and therefore the connection resistance is large. Therefore, in reality, it can only be applied to a wiring board having a low wiring density such as a single-sided or double-sided circuit board. In addition, this method using all the pastes by the printing method cannot form a complicated circuit, and in order to form a multi-layered structure, the reliability of the connection is low, so an inexpensive material is used. It is difficult to manufacture a wiring board having a high function.

【０００５】本発明は、安価で配線密度の高い配線板
と、その配線板を効率よく製造する方法を提供すること
を目的とする。An object of the present invention is to provide a wiring board which is inexpensive and has a high wiring density, and a method for efficiently manufacturing the wiring board.

【０００６】[0006]

【課題を解決するための手段】本発明の配線板は、時１
（ｂ）に示すように、絶縁材または内層回路板に明けら
れた孔と、孔の周囲の絶縁材の少なくとも一方の面に設
けられ、かつ、孔の近くの箇所がそれより外の箇所に比
べ低く個本でいる導体で形成されたランド部と、その凹
んだ箇所にのみ充填された導電性物質とを有することを
特徴とする。図４（ａ）および（ｂ）に、このような構
造の上面図を示す。DISCLOSURE OF THE INVENTION The wiring board of the present invention is
As shown in (b), a hole provided in the insulating material or the inner layer circuit board and at least one surface of the insulating material around the hole, and a portion near the hole is located outside the hole. It is characterized in that it has a land portion formed of a conductor which is lower than that of the individual conductor and a conductive material filled only in the recessed portion. A top view of such a structure is shown in FIGS.

【０００７】また、図１（ａ）に示すように、前記導電
性物質を、前記凹んだ箇所と、前記孔内部に充填するこ
ともでき、この場合、製造工程にめっき工程を用いず、
効率的となり好ましい。Further, as shown in FIG. 1A, the conductive material may be filled in the recessed portion and the inside of the hole. In this case, a plating step is not used in the manufacturing process,
It is efficient and preferable.

【０００８】本発明の第２の発明である配線板の製造法
は、図５に示すように、完全に硬化していない絶縁基板
の両方の面に銅箔を重ねて加熱・加圧して積層一体化し
た積層板（図５（ａ）に示す。）の、回路層間の接続に
必要な箇所に、孔をあけ（図５（ｂ）に示す。）、その
孔の周囲のみの銅箔を前記絶縁板が露出しない程度に除
去して孔周囲に金属製の凹みを形成し（図５（ｃ）に示
す。）、その凹み及び孔内に、流動性の導電性物質を充
填する（図５（ｄ）に示す。）ことを特徴とする。As shown in FIG. 5, the wiring board manufacturing method according to the second aspect of the present invention is such that copper foils are superposed on both surfaces of an insulating substrate which is not completely cured, and are laminated by heating and pressing. A hole (shown in FIG. 5 (b)) is formed in the integrated laminated plate (shown in FIG. 5 (a)) at a position necessary for connection between circuit layers, and a copper foil only around the hole is provided. The insulating plate is removed to the extent that it is not exposed to form a metal recess around the hole (shown in FIG. 5C), and a fluid conductive material is filled into the recess and the hole (FIG. 5C). 5 (d)).

【０００９】また、内層回路基板にプリプレグを重ねた
ものの少なくとも一方の面に、銅箔を重ねて加熱・加圧
して積層一体化した積層板の、回路層間の接続に必要な
箇所に、孔をあけ、その孔の周囲のみの銅箔を前記プリ
プレグが露出しない程度に除去して孔周囲に金属製の凹
みを形成し、その凹み及び孔内に流動性の導電性物質を
充填することもできる。In addition, a hole is formed at a position necessary for connection between circuit layers of a laminated board in which a copper foil is laminated and heated and pressed to be laminated and integrated on at least one surface of a prepreg laminated on an inner layer circuit board. It is also possible to open and remove the copper foil only around the hole to such an extent that the prepreg is not exposed to form a metal recess around the hole, and to fill the recess and the hole with a fluid conductive substance. ..

【００１０】完全に硬化していない絶縁基板の両方の面
に、コアとなる金属層と少なくとも一方の面に形成され
た銅層の２層以上の金属層であって、コアとなる金属層
は銅層と除去条件が異なるものである金属箔を重ねて加
熱・加圧して積層一体化した積層板の、回路層間の接続
に必要な箇所に、孔をあけ、その孔の周囲のみの銅層の
みを除去し、孔周囲に金属製の凹みを形成し、その凹み
及び孔内に、流動性の導電性物質を充填することもでき
る。Two or more metal layers, which are a metal layer serving as a core and a copper layer formed on at least one surface on both surfaces of the insulating substrate which is not completely cured, wherein the metal layer serving as a core is A copper layer is formed only on the periphery of the holes in the laminated board that is laminated and laminated by heating and pressing metal foils whose removal conditions are different from those of the copper layer, and where it is necessary to connect between circuit layers. It is also possible to remove only the above, form a metal recess around the hole, and fill the recess and the hole with a fluid conductive substance.

【００１１】内層回路基板にプリプレグを重ねたものの
少なくとも一方の面に、コアとなる金属層と少なくとも
一方の面に形成された銅層の２層以上の金属層であっ
て、コアとなる金属層は銅層と除去条件が異なるもので
ある金属箔を重ねて加熱・加圧して積層一体化した積層
板の、回路層間の接続に必要な箇所に、孔をあけ、その
孔の周囲のみの銅層を除去し、孔周囲に金属製の凹みを
形成し、その凹み及び孔内に流動性の導電性物質を充填
することもできる。Two or more metal layers, which are a metal layer serving as a core and a copper layer formed on at least one surface on at least one surface of a prepreg superposed on the inner layer circuit board, the metal layer serving as a core. Is a copper layer with different removal conditions. Metal foils are stacked, heated and pressed to form a laminated plate, and holes are made at the locations required for connection between circuit layers. It is also possible to remove the layer, form a metal depression around the hole, and fill the depression and the hole with a flowable conductive substance.

【００１２】完全に硬化していない絶縁基板の両方の面
に銅箔を重ねて加熱・加圧して積層一体化した積層板
の、回路層間の接続に必要な箇所の、孔をあける予定の
箇所の周囲のみの銅箔を前記絶縁板が露出しない程度に
除去して孔周囲に金属製の凹みを形成し、孔をあけ、そ
の凹み及び孔内に、流動性の導電性物質を充填すること
もできる。Places where holes are to be formed in places required for connection between circuit layers of a laminated board in which copper foils are superposed on both surfaces of an insulating substrate which is not completely cured To form a metal recess around the hole by removing the copper foil only around the periphery to the extent that the insulating plate is not exposed, and to form a hole and fill the recess and the hole with a fluid conductive substance. You can also

【００１３】内層回路基板にプリプレグを重ねたものの
少なくとも一方の面に、銅箔を重ねて加熱・加圧して積
層一体化した積層板の、回路層間の接続に必要な箇所
の、孔をあける予定の箇所の周囲のみの銅箔を前記プリ
プレグが露出しない程度に除去して孔周囲に金属製の凹
みを形成し、孔をあけ、その凹み及び孔内に流動性の導
電性物質を充填することもできる。At least one surface of the inner layer circuit board on which the prepreg is superposed is to be perforated at a position necessary for connection between circuit layers of a laminated board in which copper foil is superposed and heated and pressed to be laminated and integrated. To remove the copper foil only around the area to the extent that the prepreg is not exposed to form a metal recess around the hole, make a hole, and fill the recess and the hole with a fluid conductive substance. You can also

【００１４】完全に硬化していない絶縁基板の両方の面
に、コアとなる金属層と少なくとも一方の面に形成され
た銅層の２層以上の金属層であって、コアとなる金属層
は銅層と除去条件が異なるものである金属箔を重ねて加
熱・加圧して積層一体化した積層板の、回路層間の接続
に必要な箇所の、孔をあける予定の箇所の周囲のみの銅
層のみを除去し、孔周囲に金属製の凹みを形成し、孔を
あけ、その凹み及び孔内に、流動性の導電性物質を充填
することもできる。On both surfaces of the insulating substrate which is not completely cured, there are two or more metal layers of a core metal layer and a copper layer formed on at least one surface, and the core metal layer is Copper layer only around the place where holes are planned to be formed in the laminated board, in which metal foil, which has different removal conditions from those of the copper layer, are stacked, heated and pressed, and laminated and integrated to connect between circuit layers It is also possible to remove only the above, form a metal recess around the hole, open the hole, and fill the recess and the hole with a fluid conductive substance.

【００１５】内層回路基板にプリプレグを重ねたものの
少なくとも一方の面に、コアとなる金属層と少なくとも
一方の面に形成された銅層の２層以上の金属層であっ
て、コアとなる金属層は銅層と除去条件が異なるもので
ある金属箔を重ねて加熱・加圧して積層一体化した積層
板の、回路層間の接続に必要な箇所の、孔をあける予定
の箇所の周囲のみの銅層を除去し、孔周囲に金属製の凹
みを形成し、その凹み及び孔内に流動性の導電性物質を
充填することもできる。Two or more metal layers, which are a metal layer serving as a core and a copper layer formed on at least one surface of at least one surface of a prepreg superposed on the inner layer circuit board, the metal layer serving as a core. Is a copper layer whose removal conditions are different from those of the copper layer. Copper on the periphery of the place where holes are to be drilled, where the holes are to be connected, between the circuit layers of a laminated board that has been laminated by heating and pressurizing metal foil. It is also possible to remove the layer, form a metal depression around the hole, and fill the depression and the hole with a flowable conductive substance.

【００１６】また、一例として図５（ｅ）に示すよう
に、このような金属製の凹み及び孔内に流動性の導電性
物質３を充填する工程の後に、流動性の導電性物質３を
固定し、孔周囲の面より盛り上がった前記導電性物質３
を除去し、その固定した導電性物質３を含む回路導体の
必要な箇所にレジストを形成し、レジストから露出した
導体をエッチング除去することにより配線板とすること
ができる。As an example, as shown in FIG. 5 (e), after the step of filling the fluid conductive material 3 into the metallic depressions and holes, the fluid conductive material 3 is added. The conductive substance 3 fixed and raised from the surface around the hole
Is removed, a resist is formed on a necessary portion of the fixed circuit conductor containing the conductive substance 3, and the conductor exposed from the resist is removed by etching to obtain a wiring board.

【００１７】さらにまた、本発明の製造法を用いて、内
層回路基板に、前記完全に硬化していない絶縁基板の両
方の面に銅箔を重ねて加熱・加圧して積層一体化した積
層板の、回路層間の接続に必要な箇所に、孔をあけ、そ
の孔の周囲のみの銅箔を前記絶縁基板が露出しない程度
に除去して孔周囲に金属製の凹みを形成し、その凹み及
び孔内に、流動性の導電性物質を充填し、流動性の導電
性物質を固定し、孔周囲の面より盛り上がった前記導電
性物質を除去し、その固定した導電性物質を含む回路導
体の必要な箇所にレジストを形成し、レジストから露出
した導体をエッチング除去したものを用い、その上の少
なくとも一方の面に、プリプレグと銅箔とを重ね、加熱
・加圧して積層一体化し、接続の必要な箇所に孔をあ
け、その孔内壁にめっきによる金属層を形成し、回路と
なる外層銅箔の箇所にレジストを形成し、不要な外層銅
箔をエッチング除去することによって、多層配線板とす
ることができる。Furthermore, using the manufacturing method of the present invention, a laminated board in which copper foil is laminated on both surfaces of the insulating substrate which is not completely cured, and the inner layer circuit board is heated and pressed to be laminated and integrated. , A hole is formed in a portion necessary for connection between circuit layers, and a copper foil only around the hole is removed to the extent that the insulating substrate is not exposed to form a metal recess around the hole, and the recess and The hole is filled with a fluid conductive substance, the fluid conductive substance is fixed, the conductive substance that has risen from the surface around the hole is removed, and the circuit conductor containing the fixed conductive substance is removed. A resist is formed at a required location, and a conductor exposed from the resist is removed by etching.On at least one surface of the resist, a prepreg and a copper foil are overlaid, and heat and pressure are applied to laminate and integrate the connection. Make a hole in the required area and insert it into the inner wall of the hole. Forming a metal layer by vapor, a resist is formed on the portion of the outer layer copper foil as a circuit, an unnecessary outer layer copper foil by etching away may be a multi-layer wiring board.

【００１８】内層回路基板に、完全に硬化していない絶
縁基板の両方の面に、コアとなる金属層と少なくとも一
方の面に形成された銅層の２層以上の金属層であって、
コアとなる金属層は銅層と除去条件が異なるものである
金属箔を重ねて加熱・加圧して積層一体化した積層板
の、回路層間の接続に必要な箇所に、孔をあけ、その孔
の周囲のみの銅層のみを除去し、孔周囲に金属製の凹み
を形成し、その凹み及び孔内に、流動性の導電性物質を
充填し、流動性の導電性物質を固定し、孔周囲の面より
盛り上がった前記導電性物質を除去し、その固定した導
電性物質を含む回路導体の必要な箇所にレジストを形成
し、レジストから露出した導体をエッチング除去したも
のを用い、その上の少なくとも一方の面に、プリプレグ
と銅箔とを重ね、加熱・加圧して積層一体化し、接続の
必要な箇所に孔をあけ、その孔内壁にめっきによる金属
層を形成し、回路となる外層銅箔の箇所にレジストを形
成し、不要な外層銅箔をエッチング除去することもでき
る。In the inner layer circuit board, two or more metal layers including a metal layer to be a core and a copper layer formed on at least one surface on both surfaces of the insulating substrate which is not completely cured,
The metal layer to be the core has different removal conditions from those of the copper layer.Metal foils are stacked, heated and pressed, and laminated and laminated to form a hole at the location required for connection between circuit layers. Remove only the copper layer around the periphery of the hole, form a metal recess around the hole, fill the recess and the hole with a fluid conductive substance, fix the fluid conductive substance, and After removing the conductive material that has risen from the surrounding surface, forming a resist at the required location of the circuit conductor containing the fixed conductive material, and using the one that is exposed and removed from the resist by etching, On at least one surface, prepreg and copper foil are stacked, heated and pressed to laminate and integrate, holes are formed at the places where connection is required, and a metal layer is formed on the inner wall of the hole by plating to form a circuit outer layer copper. A resist is formed on the foil to prevent unnecessary outer layer copper. It is also possible to etch removal.

【００１９】図７に示すように、内層回路基板に、前記
完全に硬化していない絶縁基板１の両方の面に銅箔２を
重ねて加熱・加圧して積層一体化した積層板（図７
（ａ）に示す。）の、回路層間の接続に必要な箇所に、
孔をあけ、その孔の周囲のみの銅箔を前記絶縁基板１が
露出しない程度に除去して孔周囲に金属製の凹みを形成
し（図７（ｂ）に示す。）、その凹み及び孔内に、流動
性の導電性物質３を充填し、流動性の導電性物質３を固
定し、孔周囲の面より盛り上がった前記導電性物質３を
除去し（図７（ｃ）に示す。）、その固定した導電性物
質３を含む回路導体の必要な箇所にレジストを形成し、
レジストから露出した導体をエッチング除去し（図７
（ｄ）に示す。）たものを用い、その上の少なくとも一
方の面に、プリプレグ５と銅箔２１とを重ね、加熱・加
圧して積層一体化し（図７（ｅ）に示す。）、その内層
回路の導電性物質３を充填した孔のうち少なくとも１箇
所に、内層回路と外層回路とを接続する孔をあけ（図７
（ｆ）に示す。）、かつ、その孔径が、前記内層回路の
導電性物質３を充填した孔径よりも小さいものであっ
て、その後、内層回路と外層回路とを接続する孔の周囲
のみの銅箔２１を前記プリプレグ５が露出しない程度に
除去して孔周囲に金属製の凹みを形成し、その凹み及び
孔内に、流動性の導電性物質３１を充填する（図７
（ｇ）に示す。）こともできる。As shown in FIG. 7, a copper foil 2 is placed on both surfaces of the incompletely cured insulating substrate 1 on the inner layer circuit board, and the copper foil 2 is heated and pressed to form a laminate (FIG. 7).
It shows in (a). ), Where necessary for connection between circuit layers,
A hole is opened, and the copper foil only around the hole is removed to the extent that the insulating substrate 1 is not exposed to form a metal recess around the hole (shown in FIG. 7B). The recess and the hole The fluid conductive substance 3 is filled therein, the fluid conductive substance 3 is fixed, and the conductive substance 3 rising from the surface around the hole is removed (shown in FIG. 7C). , Forming a resist on a necessary portion of the circuit conductor containing the fixed conductive substance 3,
The conductor exposed from the resist is removed by etching (see FIG. 7).
It shows in (d). ), The prepreg 5 and the copper foil 21 are superposed on at least one surface thereof, heated and pressed to be laminated and integrated (shown in FIG. 7E), and the conductivity of the inner layer circuit is obtained. At least one of the holes filled with the substance 3 has a hole for connecting the inner layer circuit and the outer layer circuit (see FIG. 7).
It shows in (f). ) And the hole diameter is smaller than the hole diameter filled with the conductive substance 3 of the inner layer circuit, and then the copper foil 21 only around the hole connecting the inner layer circuit and the outer layer circuit is formed on the prepreg. 5 is removed to the extent that it is not exposed to form a metal depression around the hole, and the fluid conductive material 31 is filled into the depression and the hole (FIG. 7).
It shows in (g). You can also

【００２０】内層回路基板に、前記完全に硬化していな
い絶縁基板の両方の面に銅箔を重ねて加熱・加圧して積
層一体化した積層板の、回路層間の接続に必要な箇所
に、孔をあけ、その孔の周囲のみの銅箔を前記絶縁基板
が露出しない程度に除去して孔周囲に金属製の凹みを形
成し、その凹み及び孔内に、流動性の導電性物質を充填
し、流動性の導電性物質を固定し、孔周囲の面より盛り
上がった前記導電性物質を除去し、その固定した導電性
物質を含む回路導体の必要な箇所にレジストを形成し、
レジストから露出した導体をエッチング除去したものを
用い、その上の少なくとも一方の面に、プリプレグと前
記コアとなる金属層と少なくとも一方の面に形成された
銅層の２層以上の金属層であって、コアとなる金属層は
銅層と除去条件が異なるものである金属箔とを重ね、加
熱・加圧して積層一体化し、その内層回路の導電性物質
を充填した孔のうち少なくとも１箇所に、内層回路と外
層回路とを接続する孔をあけ、かつ、その孔径が、前記
内層回路の導電性物質を充填した孔径よりも小さいもの
であって、その孔の周囲のみの銅層みを除去し、孔周囲
に金属製の凹みを形成し、その凹み及び孔内に流動性の
導電性物質を充填し、流動性の導電性物質を固定し、孔
周囲の面より盛り上がった前記導電性物質を除去し、そ
の固定した導電性物質を含む回路導体の必要な箇所にレ
ジストを形成し、レジストから露出した導体をエッチン
グ除去することもできる。On the inner layer circuit board, copper foil is laid on both sides of the insulating substrate which has not been completely cured, and the laminated and laminated board by heating and pressurizing is integrated at a position necessary for connection between circuit layers, Open a hole and remove the copper foil only around the hole to the extent that the insulating substrate is not exposed to form a metal recess around the hole, and fill the recess and the hole with a fluid conductive substance. Then, the fluid conductive material is fixed, the conductive material that has risen from the surface around the hole is removed, and a resist is formed at a necessary portion of the circuit conductor containing the fixed conductive material,
A conductor obtained by etching away the conductor exposed from the resist is used, and on at least one surface thereof, there are two or more metal layers of a metal layer serving as the prepreg and the core and a copper layer formed on at least one surface. The core metal layer is formed by stacking a copper layer and a metal foil whose removal conditions are different from each other, heating and pressurizing the layers to integrate them, and at least one of the holes filled with the conductive substance of the inner layer circuit A hole for connecting the inner layer circuit and the outer layer circuit is formed, and the hole diameter is smaller than the hole diameter of the inner layer circuit filled with the conductive substance, and only the copper layer around the hole is removed. Then, a metal recess is formed around the hole, and a fluid conductive substance is filled in the recess and the hole, and the fluid conductive substance is fixed, and the conductive substance rises from the surface around the hole. Removes its fixed conductivity A resist is formed to the required portion of the circuit conductors including quality, the conductor exposed from the resist may be etched away.

【００２１】内層回路板として、完全に硬化していない
絶縁基板の両方の面に、コアとなる金属層と少なくとも
一方の面に形成された銅層の２層以上の金属層であっ
て、コアとなる金属層は銅層と除去条件が異なるもので
ある金属箔を重ねて加熱・加圧して積層一体化した積層
板の、回路層間の接続に必要な箇所に、孔をあけ、その
孔の周囲のみの銅層もしくは前記コアとなる金属層のみ
を除去し、孔周囲に金属製の凹みを形成し、その凹み及
び孔内に、流動性の導電性物質を充填し、流動性の導電
性物質を固定し、孔周囲の面より盛り上がった前記導電
性物質を除去し、その固定した導電性物質を含む回路導
体の必要な箇所にレジストを形成し、レジストから露出
した導体をエッチング除去したものを使用し、その上の
少なくとも一方の面に、プリプレグと銅箔とを重ね、加
熱・加圧して積層一体化し、その内層回路の導電性物質
を充填した孔のうち少なくとも１箇所に、内層回路と外
層回路とを接続する孔をあけ、かつ、その孔径が、前記
内層回路の導電性物質を充填した孔径よりも小さいもの
であって、その後、内層回路と外層回路とを接続する孔
の周囲のみの銅箔を前記プリプレグが露出しない程度に
除去して孔周囲に金属製の凹みを形成し、その凹み及び
孔内に、流動性の導電性物質を充填することもできる。As the inner layer circuit board, two or more metal layers including a metal layer to be a core and a copper layer formed on at least one surface on both surfaces of an insulating substrate which is not completely cured, The metal layer to be used is different from the copper layer in terms of removal conditions. Metal foils are stacked, heated, pressed and laminated to form a laminated plate. By removing only the copper layer around the periphery or only the metal layer to be the core, a metal depression is formed around the hole, and a fluid conductive substance is filled into the depression and the hole to obtain fluid conductivity. A substance is fixed, the conductive substance that has risen from the surface around the hole is removed, a resist is formed at a necessary portion of the circuit conductor containing the fixed conductive substance, and the conductor exposed from the resist is removed by etching. Use at least one side on it , A prepreg and a copper foil are stacked, heated and pressed to be laminated and integrated, and at least one of the holes filled with a conductive substance of the inner layer circuit is provided with a hole for connecting the inner layer circuit and the outer layer circuit, and , The hole diameter is smaller than the hole diameter filled with a conductive substance of the inner layer circuit, and then the copper foil only around the hole connecting the inner layer circuit and the outer layer circuit is exposed to such an extent that the prepreg is not exposed. It is also possible to remove and form a metal recess around the hole, and fill the recess and the hole with a fluid conductive substance.

【００２２】内層回路板として、完全に硬化していない
絶縁基板の両方の面に、コアとなる金属層と少なくとも
一方の面に形成された銅層の２層以上の金属層であっ
て、コアとなる金属層は銅層と除去条件が異なるもので
ある金属箔を重ねて加熱・加圧して積層一体化した積層
板の、回路層間の接続に必要な箇所に、孔をあけ、その
孔の周囲のみの銅層もしくは前記コアとなる金属層のみ
を除去し、孔周囲に金属製の凹みを形成し、その凹み及
び孔内に、流動性の導電性物質を充填し、流動性の導電
性物質を固定し、孔周囲の面より盛り上がった前記導電
性物質を除去し、その固定した導電性物質を含む回路導
体の必要な箇所にレジストを形成し、レジストから露出
した導体をエッチング除去したものを使用し、その上の
少なくとも一方の面に、プリプレグと前記コアとなる金
属層と少なくとも一方の面に形成された銅層の２層以上
の金属層であって、コアとなる金属層は銅層と除去条件
が異なるものである金属箔とを重ね、加熱・加圧して積
層一体化し、その内層回路の導電性物質を充填した孔の
うち少なくとも１箇所に、内層回路と外層回路とを接続
する孔をあけ、かつ、その孔径が、前記内層回路の導電
性物質を充填した孔径よりも小さいものであって、その
孔の周囲のみの銅層みを除去し、孔周囲に金属製の凹み
を形成し、その凹み及び孔内に流動性の導電性物質を充
填し、流動性の導電性物質を固定し、孔周囲の面より盛
り上がった前記導電性物質を除去し、その固定した導電
性物質を含む回路導体の必要な箇所にレジストを形成
し、レジストから露出した導体をエッチング除去するこ
ともできる。As an inner layer circuit board, two or more metal layers including a metal layer to be a core and a copper layer formed on at least one surface on both sides of an insulating substrate which is not completely cured, The metal layer to be used is different from the copper layer in terms of removal conditions. Metal foils are stacked, heated, pressed and laminated to form a laminated plate. By removing only the copper layer around the periphery or only the metal layer to be the core, a metal depression is formed around the hole, and a fluid conductive substance is filled into the depression and the hole to obtain fluid conductivity. A substance is fixed, the conductive substance that has risen from the surface around the hole is removed, a resist is formed at a necessary portion of the circuit conductor containing the fixed conductive substance, and the conductor exposed from the resist is removed by etching. Use at least one side on it A metal foil having two or more layers of a prepreg, a metal layer to be the core, and a copper layer formed on at least one surface, the metal layer to be the core being different in removal condition from the copper layer; Are laminated by heating / pressurizing, and a hole for connecting the inner layer circuit and the outer layer circuit is formed in at least one of the holes filled with the conductive substance of the inner layer circuit, and the hole diameter is It is smaller than the hole diameter filled with the conductive material in the inner layer circuit, removes only the copper layer around the hole, forms a metal recess around the hole, and fluidizes the recess and the hole. Of the conductive material is fixed, the fluid conductive material is fixed, the conductive material that has risen from the surface around the hole is removed, and a resist is applied to a necessary portion of the circuit conductor containing the fixed conductive material. Form and etch conductor exposed from resist It can also be grayed removal.

【００２３】内層回路基板に、前記完全に硬化していな
い絶縁基板の両方の面に銅箔を重ねて加熱・加圧して積
層一体化した積層板の、回路層間の接続に必要な箇所
の、孔をあける予定の箇所の周囲のみの銅箔を前記絶縁
基板が露出しない程度に除去して孔周囲に金属製の凹み
を形成し、その凹みに、流動性の導電性物質を充填し、
流動性の導電性物質を固定し、孔周囲の面より盛り上が
った前記導電性物質を除去し、その固定した導電性物質
を含む回路導体の必要な箇所にレジストを形成し、レジ
ストから露出した導体をエッチング除去したものを用
い、その上の少なくとも一方の面に、プリプレグと銅箔
とを重ね、加熱・加圧して積層一体化し、接続の必要な
箇所に孔をあけ、その孔内壁にめっきによる金属層を形
成し、回路となる外層銅箔の箇所にレジストを形成し、
不要な外層銅箔をエッチング除去することもできる。On the inner layer circuit board, copper foil is laid on both surfaces of the insulating substrate which has not been completely cured, and the laminated and laminated board is heated and pressed to integrate the layers, which are necessary for connection between circuit layers. Forming a metal depression around the hole by removing the copper foil only around the place where a hole is to be formed so that the insulating substrate is not exposed, and filling the depression with a fluid conductive substance,
A fluid conductive material is fixed, the conductive material that has risen from the surface around the hole is removed, and a resist is formed at a required portion of the circuit conductor containing the fixed conductive material, and the conductor is exposed from the resist. Using the one that has been removed by etching, prepreg and copper foil are overlaid on at least one surface on top of it, laminated by heating and pressurizing, and holes are formed at the places where connection is required, and the inner wall of the holes is plated. Form a metal layer, form a resist on the outer copper foil to be the circuit,
Unnecessary outer layer copper foil can also be removed by etching.

【００２４】内層回路基板に、完全に硬化していない絶
縁基板の両方の面に、コアとなる金属層と少なくとも一
方の面に形成された銅層の２層以上の金属層であって、
コアとなる金属層は銅層と除去条件が異なるものである
金属箔を重ねて加熱・加圧して積層一体化した積層板
の、回路層間の接続に必要な箇所の、孔をあける予定の
箇所の周囲のみの銅層のみを除去し、孔周囲に金属製の
凹みを形成し、その凹みに、流動性の導電性物質を充填
し、流動性の導電性物質を固定し、孔周囲の面より盛り
上がった前記導電性物質を除去し、その固定した導電性
物質を含む回路導体の必要な箇所にレジストを形成し、
レジストから露出した導体をエッチング除去したものを
用い、その上の少なくとも一方の面に、プリプレグと銅
箔とを重ね、加熱・加圧して積層一体化し、接続の必要
な箇所に孔をあけ、その孔内壁にめっきによる金属層を
形成し、回路となる外層銅箔の箇所にレジストを形成
し、不要な外層銅箔をエッチング除去することもでき
る。In the inner layer circuit board, two or more metal layers including a metal layer to be a core and a copper layer formed on at least one surface on both surfaces of the insulating substrate which is not completely cured,
The metal layer to be the core has different removal conditions from those of the copper layer. In the laminated board in which metal foils are stacked, heated and pressed to be laminated and integrated, locations where holes are to be formed at locations required for connection between circuit layers Remove only the copper layer around the periphery of the hole, form a metal depression around the hole, fill the depression with a fluid conductive substance, fix the fluid conductive substance, and The conductive material that has risen more is removed, and a resist is formed at a necessary portion of the circuit conductor containing the fixed conductive material,
Using the conductor exposed from the resist removed by etching, on at least one surface on it, prepreg and copper foil are overlaid, laminated by heating and pressurizing, and holes are formed at the points where connection is required. It is also possible to form a metal layer by plating on the inner wall of the hole, form a resist on the portion of the outer copper foil that will become a circuit, and remove the unnecessary outer copper foil by etching.

【００２５】図６に示すように、内層回路基板に、前記
完全に硬化していない絶縁基板１の両方の面に銅箔２を
重ねて加熱・加圧して積層一体化した積層板（図６
（ａ）に示す。）の、回路層間の接続に必要な箇所の、
孔をあける予定の箇所の周囲のみの銅箔２を前記絶縁基
板１が露出しない程度に除去して孔周囲に金属製の凹み
を形成し、その凹みに、流動性の導電性物質３を充填し
（図６（ｂ）に示す。）、流動性の導電性物質３を固定
し、孔周囲の面より盛り上がった前記導電性物質３を除
去し、その固定した導電性物質３を含む回路導体の必要
な箇所にレジストを形成し、レジストから露出した導体
をエッチング除去し（図６（ｃ）に示す。）たものを用
い、その上の少なくとも一方の面に、プリプレグ５と銅
箔２１とを重ね、加熱・加圧して積層一体化し、その内
層回路の導電性物質３を充填した凹みのうち少なくとも
１箇所に、内層回路と外層回路とを接続する孔をあけ、
かつ、その孔径が、前記内層回路の導電性物質３を充填
した凹みの直径よりも小さいものであって、その後、内
層回路と外層回路とを接続する孔の周囲のみの銅箔２１
を前記プリプレグ５が露出しない程度に除去し（図６
（ｄ）に示す。）て孔周囲に金属製の凹みを形成し、そ
の凹み及び孔内に、流動性の導電性物質３１を充填する
（図６（ｅ）に示す。）こともできる。As shown in FIG. 6, a copper foil 2 is laminated on both surfaces of the incompletely cured insulating substrate 1 on the inner layer circuit board and heated and pressed to form a laminated plate (FIG. 6).
It shows in (a). ) Of the part necessary for connection between circuit layers,
The copper foil 2 only around the place where the hole is to be drilled is removed to the extent that the insulating substrate 1 is not exposed to form a metal recess around the hole, and the recess is filled with a fluid conductive substance 3. 6 (b), the fluid conductive material 3 is fixed, the conductive material 3 rising from the surface around the hole is removed, and the circuit conductor containing the fixed conductive material 3 is removed. Is formed at a required location of the prepreg, the conductor exposed from the resist is removed by etching (shown in FIG. 6C), and the prepreg 5 and the copper foil 21 are provided on at least one surface of Are laminated by heating and pressurizing, and a hole for connecting the inner layer circuit and the outer layer circuit is formed in at least one of the recesses of the inner layer circuit filled with the conductive substance 3.
In addition, the hole diameter is smaller than the diameter of the recess filled with the conductive substance 3 of the inner layer circuit, and thereafter, the copper foil 21 only around the hole connecting the inner layer circuit and the outer layer circuit.
Is removed to the extent that the prepreg 5 is not exposed (see FIG.
It shows in (d). It is also possible to form a metal recess around the hole and fill the recess and the hole with a fluid conductive material 31 (shown in FIG. 6E).

【００２６】内層回路基板に、前記完全に硬化していな
い絶縁基板の両方の面に銅箔を重ねて加熱・加圧して積
層一体化した積層板の、回路層間の接続に必要な箇所
の、孔をあける予定の箇所の周囲のみの銅箔を前記絶縁
基板が露出しない程度に除去して孔周囲に金属製の凹み
を形成し、その凹みに、流動性の導電性物質を充填し、
流動性の導電性物質を固定し、孔周囲の面より盛り上が
った前記導電性物質を除去し、その固定した導電性物質
を含む回路導体の必要な箇所にレジストを形成し、レジ
ストから露出した導体をエッチング除去したものを用
い、その上の少なくとも一方の面に、プリプレグと前記
コアとなる金属層と少なくとも一方の面に形成された銅
層の２層以上の金属層であって、コアとなる金属層は銅
層と除去条件が異なるものである金属箔とを重ね、加熱
・加圧して積層一体化し、その内層回路の導電性物質を
充填した凹みのうち少なくとも１箇所に、内層回路と外
層回路とを接続する孔をあけ、かつ、その孔径が、前記
内層回路の導電性物質を充填した凹みの直径よりも小さ
いものであって、その孔の周囲のみの銅層みを除去し、
孔周囲に金属製の凹みを形成し、その凹み及び孔内に流
動性の導電性物質を充填し、流動性の導電性物質を固定
し、孔周囲の面より盛り上がった前記導電性物質を除去
し、その固定した導電性物質を含む回路導体の必要な箇
所にレジストを形成し、レジストから露出した導体をエ
ッチング除去することもできる。On the inner layer circuit board, copper foil is laminated on both surfaces of the insulating substrate which has not been completely cured, and the laminated board integrally laminated by heating and pressurizing is provided at a position necessary for connection between circuit layers, Forming a metal depression around the hole by removing the copper foil only around the place where a hole is to be formed so that the insulating substrate is not exposed, and filling the depression with a fluid conductive substance,
A fluid conductive material is fixed, the conductive material that has risen from the surface around the hole is removed, and a resist is formed at a required portion of the circuit conductor containing the fixed conductive material, and the conductor is exposed from the resist. Which has been removed by etching, and which has at least one surface on which a prepreg, a metal layer to be the core, and a copper layer formed on at least one surface are two or more metal layers, which will become the core. The metal layer is formed by stacking a copper layer and a metal foil whose removal conditions are different from each other, heating and pressurizing to laminate and integrate, and at least one of the recesses filled with the conductive substance of the inner layer circuit, the inner layer circuit and the outer layer. A hole for connecting the circuit is formed, and the diameter of the hole is smaller than the diameter of the recess filled with the conductive substance of the inner layer circuit, and the copper layer only around the hole is removed.
Form a metal recess around the hole, fill the recess and the hole with a fluid conductive material, fix the fluid conductive material, and remove the conductive material that rises from the surface around the hole. However, it is also possible to form a resist on a necessary portion of the circuit conductor containing the fixed conductive substance and to remove the conductor exposed from the resist by etching.

【００２７】内層回路板として、完全に硬化していない
絶縁基板の両方の面に、コアとなる金属層と少なくとも
一方の面に形成された銅層の２層以上の金属層であっ
て、コアとなる金属層は銅層と除去条件が異なるもので
ある金属箔を重ねて加熱・加圧して積層一体化した積層
板の、回路層間の接続に必要な箇所の、孔をあける予定
の箇所の周囲のみの銅層もしくは前記コアとなる金属層
のみを除去し、孔周囲に金属製の凹みを形成し、その凹
みに、流動性の導電性物質を充填し、流動性の導電性物
質を固定し、孔周囲の面より盛り上がった前記導電性物
質を除去し、その固定した導電性物質を含む回路導体の
必要な箇所にレジストを形成し、レジストから露出した
導体をエッチング除去したものを使用し、その上の少な
くとも一方の面に、プリプレグと銅箔とを重ね、加熱・
加圧して積層一体化し、その内層回路の導電性物質を充
填した凹みのうち少なくとも１箇所に、内層回路と外層
回路とを接続する孔をあけ、かつ、その孔径が、前記内
層回路の導電性物質を充填した凹みの直径よりも小さい
ものであって、その後、内層回路と外層回路とを接続す
る孔の周囲のみの銅箔を前記プリプレグが露出しない程
度に除去して孔周囲に金属製の凹みを形成し、その凹み
及び孔内に、流動性の導電性物質を充填することもでき
る。As the inner layer circuit board, two or more metal layers including a metal layer to be a core and a copper layer formed on at least one surface on both surfaces of an insulating substrate which is not completely cured, The metal layer to be used is different from the copper layer in the removal conditions.The metal foil is stacked and integrated by heating and pressurizing. Remove only the copper layer around the periphery or only the metal layer that will be the core, form a metal recess around the hole, fill the recess with a fluid conductive substance, and fix the fluid conductive substance Then, the conductive material that has risen from the surface around the hole is removed, a resist is formed at a necessary portion of the circuit conductor containing the fixed conductive material, and the conductor exposed from the resist is removed by etching. , On at least one side of it, Overlaid the prepreg and the copper foil, heating and
A hole for connecting the inner layer circuit and the outer layer circuit is opened in at least one of the recesses of the inner layer circuit filled with a conductive substance by pressurization, and the diameter of the hole is the conductivity of the inner layer circuit. It is smaller than the diameter of the recess filled with the substance, and then the copper foil only around the hole connecting the inner layer circuit and the outer layer circuit is removed to the extent that the prepreg is not exposed, and the copper foil around the hole is made of metal. It is also possible to form a recess and fill the recess and the hole with a fluid conductive material.

【００２８】内層回路板として、完全に硬化していない
絶縁基板の両方の面に、コアとなる金属層と少なくとも
一方の面に形成された銅層の２層以上の金属層であっ
て、コアとなる金属層は銅層と除去条件が異なるもので
ある金属箔を重ねて加熱・加圧して積層一体化した積層
板の、回路層間の接続に必要な箇所の、孔をあける予定
の箇所の周囲のみの銅層もしくは前記コアとなる金属層
のみを除去し、孔周囲に金属製の凹みを形成し、その凹
みに、流動性の導電性物質を充填し、流動性の導電性物
質を固定し、孔周囲の面より盛り上がった前記導電性物
質を除去し、その固定した導電性物質を含む回路導体の
必要な箇所にレジストを形成し、レジストから露出した
導体をエッチング除去したものを使用し、その上の少な
くとも一方の面に、プリプレグと前記コアとなる金属層
と少なくとも一方の面に形成された銅層の２層以上の金
属層であって、コアとなる金属層は銅層と除去条件が異
なるものである金属箔とを重ね、加熱・加圧して積層一
体化し、その内層回路の導電性物質を充填した凹みのう
ち少なくとも１箇所に、内層回路と外層回路とを接続す
る孔をあけ、かつ、その孔径が、前記内層回路の導電性
物質を充填した凹みの直径よりも小さいものであって、
その孔の周囲のみの銅層みを除去し、孔周囲に金属製の
凹みを形成し、その凹み及び孔内に流動性の導電性物質
を充填し、流動性の導電性物質を固定し、孔周囲の面よ
り盛り上がった前記導電性物質を除去し、その固定した
導電性物質を含む回路導体の必要な箇所にレジストを形
成し、レジストから露出した導体をエッチング除去する
こともできる。As the inner layer circuit board, two or more metal layers, that is, a metal layer serving as a core and a copper layer formed on at least one surface on both surfaces of an insulating substrate which is not completely cured, The metal layer to be used is different from the copper layer in the removal conditions.The metal foil is stacked and integrated by heating and pressurizing. Remove only the copper layer around the periphery or only the metal layer that will be the core, form a metal recess around the hole, fill the recess with a fluid conductive substance, and fix the fluid conductive substance Then, the conductive material that has risen from the surface around the hole is removed, a resist is formed at a necessary portion of the circuit conductor containing the fixed conductive material, and the conductor exposed from the resist is removed by etching. , On at least one side of it, A metal layer having two or more layers of a prepreg, a metal layer serving as the core, and a copper layer formed on at least one surface, the metal layer serving as the core and a metal foil having different removal conditions. By stacking, heating and pressurizing to integrate the layers, a hole for connecting the inner layer circuit and the outer layer circuit is formed in at least one of the recesses of the inner layer circuit filled with the conductive substance, and the hole diameter is the inner layer. Smaller than the diameter of the recess filled with the conductive material of the circuit,
Removing only the copper layer around the hole, forming a metal recess around the hole, filling the recess and the hole with a fluid conductive material, fixing the fluid conductive material, It is also possible to remove the conductive substance raised from the surface around the hole, form a resist on a necessary portion of the circuit conductor containing the fixed conductive substance, and remove the conductor exposed from the resist by etching.

【００２９】図６（ｆ）または図７（ｈ）に示すよう
に、このような金属製の凹み及び孔内に流動性の導電性
物質３１を充填する工程の後に、流動性の導電性物質３
１を固定し、孔周囲の面より盛り上がった前記導電性物
質３１を除去し、その固定した導電性物質３１を含む回
路導体の必要な箇所にレジストを形成し、レジストから
露出した導体をエッチング除去することにより多層配線
板とすることができることはいうまでもない。As shown in FIG. 6 (f) or FIG. 7 (h), after the step of filling the fluid conductive material 31 into the metallic depressions and holes, the fluid conductive material is formed. Three
1 is fixed, the conductive substance 31 rising from the surface around the hole is removed, a resist is formed on a necessary portion of the circuit conductor containing the fixed conductive substance 31, and the conductor exposed from the resist is removed by etching. It goes without saying that a multilayer wiring board can be obtained by doing this.

【００３０】本発明の完全に硬化していない絶縁基板に
は、ガラス布、紙等の強化繊維にエポキシ樹脂、フェノ
ール樹脂等を含浸したものが使用でき、ポリエステルフ
ィルム、ポリイミドフィルム等の可撓性絶縁フィルムの
表面に接着剤を塗布したものを用いることもできる。絶
縁フィルムを用いた場合には、基板全体の厚さを薄くで
き、また、一部の絶縁フィルムを他の回路との接続のケ
ーブルとして使用することもでき、好ましい。As the insulating substrate which is not completely cured according to the present invention, a reinforcing cloth such as glass cloth or paper impregnated with epoxy resin, phenol resin or the like can be used, and flexible such as polyester film or polyimide film can be used. It is also possible to use an insulating film coated with an adhesive. When the insulating film is used, the thickness of the entire substrate can be reduced, and a part of the insulating film can be used as a cable for connecting to another circuit, which is preferable.

【００３１】本発明のコアとなる金属層と少なくとも一
方の面に形成された銅層の２層以上の金属層のコアとな
る金属層に、ニッケル、ニッケル−リン合金、ニッケル
−硼素合金、並びにはんだのうちから選択されたものを
使用することができ、銅箔のエッチング量を制御するこ
となく、凹みを作ることができ、好ましい。The core metal layer of two or more metal layers of the present invention, namely, the core metal layer and the copper layer formed on at least one surface of the core metal layer, nickel, nickel-phosphorus alloy, nickel-boron alloy, and A solder selected from the above can be used, and the recess can be formed without controlling the etching amount of the copper foil, which is preferable.

【００３２】また、導電性物質としては、銀ペースト、
銅ペースト等のように、金属粒子とバインダー及び溶剤
からなるものであって、熱によって溶剤を蒸発させ、バ
インダーを硬化させることによって固定させるものが使
用できる。この場合に、はんだ等の低い融点を有する金
属粒子と溶剤とからなるものであって、孔周囲の凹みと
孔内に充填した後に、熱によって溶剤を蒸発させると共
に、低い融点を有する金属粒子を溶融し、冷却して固定
させるものを使用することもでき、接続抵抗を小さくで
き、好ましい。前記導電性物質に、はんだ等の低い融点
を有する金属粒子と溶剤とからなるものを使用した場
合、溶融したはんだが流れるのを防ぐために、孔周囲の
凹みと孔内に充填した後に、熱によって溶剤を蒸発させ
ると共に、低い融点を有する金属粒子を溶融し、冷却し
て固定させる際に、金属板に耐熱性フィルムを貼りあわ
せた積層板の耐熱性フィルム側に前記導電性物質を充填
した積層板を押しつけて行なうことが好ましい。As the conductive substance, silver paste,
It is possible to use a material such as copper paste which is composed of metal particles, a binder and a solvent and which is fixed by evaporating the solvent by heat and curing the binder. In this case, it is composed of a solvent and metal particles having a low melting point, such as solder, and after filling the recesses around the hole and the hole, the solvent is evaporated by heat, and a metal particle having a low melting point is formed. It is also possible to use one that is melted, cooled, and fixed, and is preferable because it can reduce the connection resistance. The conductive material, when using those composed of a solvent and metal particles having a low melting point, such as solder, in order to prevent the molten solder from flowing, after filling the recesses around the hole and the hole, by heat When the solvent is evaporated, the metal particles having a low melting point are melted, and when the metal particles are cooled and fixed, the heat-resistant film side of the metal plate is laminated with the conductive substance on the heat-resistant film side. It is preferable to press the plate.

【００３３】[0033]

【作用】本発明は、図１に示すように、導電性物質を充
填しても、接続信頼性を良くするために、ランドに特別
の構造を工夫したものであって、このような構造のため
に、接続面積が増え、充填した後の形状も平坦にするこ
とができ、多層化にも適しているものである。In the present invention, as shown in FIG. 1, even if a conductive substance is filled, a special structure is devised for the land in order to improve the connection reliability. Therefore, the connection area can be increased, and the shape after filling can be made flat, which is also suitable for multilayering.

【００３４】[0034]

【実施例】実施例１ ガラス布−エポキシ樹脂絶縁基板の両面に３５μｍの銅
箔を重ねて加熱・加圧して積層一体化した積層板として
ＭＣＬ−Ｅ−６７（日立化成工業株式会社製、商品名）
を用い、回路層間の接続に必要な箇所に、孔をあけ、そ
の孔の周囲のみを露出させるようにエッチングレジスト
を形成し、予めエッチング除去時間と銅箔の残り厚さと
の関係を求めておき、銅箔の厚さを約２μｍ残すように
除去して孔周囲に金属製の凹みを形成し、エッチングレ
ジストを剥離除去し、その凹み及び孔内に、銀ペースト
を、スクリーン印刷法によって印刷充填する。次に、コ
ンベア式の加熱乾燥炉によって、銀ペーストを硬化さ
せ、孔周囲の面より盛り上がった銀ペーストと銅箔表面
に付着した銀ペーストを、研磨機によって研磨除去し、
硬化した銀ペーストを含む回路導体の必要な箇所にレジ
ストを形成し、レジストから露出した導体をエッチング
除去して、配線板とした。Example 1 A MCL-E-67 (manufactured by Hitachi Chemical Co., Ltd., a product manufactured by Hitachi Chemical Co., Ltd.) as a laminated plate in which copper foil of 35 μm is laminated on both surfaces of a glass cloth-epoxy resin insulating substrate and heated / pressurized. Name)
A hole is formed at a position necessary for connection between circuit layers, and an etching resist is formed so that only the periphery of the hole is exposed, and the relationship between the etching removal time and the remaining copper foil thickness is obtained in advance. , The copper foil is removed to leave a thickness of about 2 μm to form a metal recess around the hole, the etching resist is peeled off, and the silver paste is printed and filled in the recess and the hole by screen printing. To do. Next, the conveyor-type heating and drying furnace cures the silver paste, and the silver paste that has risen from the surface around the holes and the silver paste that has adhered to the copper foil surface is removed by polishing with a polishing machine.
A resist was formed on a necessary portion of the circuit conductor containing the hardened silver paste, and the conductor exposed from the resist was removed by etching to obtain a wiring board.

【００３５】実施例２ 積層板としてＭＣＬ−Ｅ−６７（日立化成工業株式会社
製、商品名）を用い、不要な箇所の銅箔をエッチング除
去した内層回路基板の両面に、プリプレグＧＥＡ−６７
Ｎ（日立化成工業株式会社製、商品名）を重ねた両面
に、３５μｍの銅箔を重ねて加熱・加圧して積層一体化
した積層板の、回路層間の接続に必要な箇所に、孔をあ
け、その孔の周囲のみを露出させるようにエッチングレ
ジストを形成し、予めエッチング除去時間と銅箔の残り
厚さとの関係を求めておき、銅箔の厚さを約５μｍとす
るように除去して孔周囲に金属製の凹みを形成し、エッ
チングレジストを剥離除去し、その凹み及び孔内に、銀
ペーストを、スクリーン印刷法によって印刷充填する。
次に、コンベア式の加熱乾燥炉によって、銀ペーストを
硬化させ、孔周囲の面より盛り上がった銀ペーストと銅
箔表面に付着した銀ペーストを、研磨機によって研磨除
去し、硬化した銀ペーストを含む回路導体の必要な箇所
にレジストを形成し、レジストから露出した導体をエッ
チング除去して、配線板とした。Example 2 MCL-E-67 (manufactured by Hitachi Chemical Co., Ltd., trade name) was used as a laminated board, and prepreg GEA-67 was formed on both surfaces of an inner layer circuit board from which copper foil at unnecessary portions was removed by etching.
On both sides of N (manufactured by Hitachi Chemical Co., Ltd., product name), 35 μm copper foils are overlaid, heat-pressed and laminated to form a laminated plate. Open, form an etching resist so that only the periphery of the hole is exposed, find the relationship between the etching removal time and the remaining thickness of the copper foil in advance, and remove it so that the thickness of the copper foil is about 5 μm. A metal recess is formed around the hole to remove the etching resist, and a silver paste is printed and filled in the recess and the hole by a screen printing method.
Next, the silver paste is cured by a conveyor-type heating and drying furnace, and the silver paste raised from the surface around the holes and the silver paste attached to the copper foil surface are removed by polishing with a polishing machine, and the cured silver paste is contained. A resist was formed on a necessary portion of the circuit conductor, and the conductor exposed from the resist was removed by etching to obtain a wiring board.

【００３６】実施例３ ガラス布−エポキシ樹脂絶縁基板であるプリプレグＧＥ
Ａ−６７Ｎ（日立化成工業株式会社製、商品名）の両面
に、ニッケルをコアとする金属層とその両面に無電解め
っきによって形成した銅層の３層の金属箔を重ねて加熱
・加圧して積層一体化した積層板の、回路層間の接続に
必要な箇所に、エッチングレジストをその孔をあける箇
所の周囲のみが露出するように形成し、テトラアンミン
銅（II）と塩化アンモニウムとアンモニアからなるアル
カリエッチャントを用いて、銅層のみを除去し、孔周囲
に金属製の凹みを形成し、孔をあけ、その凹み及び孔内
に、銅ペーストを、スクリーン印刷法によって印刷充填
する。次に、コンベア式の加熱乾燥炉によって、銅ペー
ストを硬化させ、孔周囲の面より盛り上がった銅ペース
トと銅箔表面に付着した銅ペーストを、研磨機によって
研磨除去し、硬化した銀ペーストを含む回路導体の必要
な箇所にレジストを形成し、レジストから露出した導体
をエッチング除去して、配線板とした。Example 3 Prepreg GE which is a glass cloth-epoxy resin insulating substrate
A-67N (manufactured by Hitachi Chemical Co., Ltd., trade name) is overlaid on both sides with a three-layer metal foil of a nickel-based metal layer and a copper layer formed by electroless plating on both sides, and heated and pressed. The etching resist is formed on the part of the laminated plate that is laminated and integrated so that the periphery of the hole is exposed at the place necessary for the connection between the circuit layers, and it consists of tetraammine copper (II), ammonium chloride and ammonia. Using an alkaline etchant, only the copper layer is removed, a metal depression is formed around the hole, a hole is opened, and a copper paste is printed and filled in the depression and the hole by a screen printing method. Next, by a conveyor heating and drying furnace, the copper paste is cured, and the copper paste that has risen from the surface around the holes and the copper paste that has adhered to the copper foil surface are removed by polishing with a polishing machine, and the cured silver paste is included. A resist was formed on a necessary portion of the circuit conductor, and the conductor exposed from the resist was removed by etching to obtain a wiring board.

【００３７】実施例４ 積層板としてＭＣＬ−Ｅ−６７（日立化成工業株式会社
製、商品名）を用い、不要な箇所の銅箔をエッチング除
去した内層回路基板の両面に、プリプレグＧＥＡ−６７
Ｎ（日立化成工業株式会社製、商品名）を重ねた両面
に、ニッケル−リン合金をコアとする金属層とその両面
に電解めっきによって形成した銅層の３層の金属箔を重
ねて加熱・加圧して積層一体化した積層板の、回路層間
の接続に必要な箇所に、エッチングレジストをその孔を
あける箇所の周囲のみが露出するように形成し、テトラ
アンミン銅（II）と塩化アンモニウムとアンモニアから
なるアルカリエッチャントを用いて、銅層のみを除去
し、孔周囲に金属製の凹みを形成し、孔をあけ、その凹
み及び孔内に、銅ペーストを、スクリーン印刷法によっ
て印刷充填する。次に、コンベア式の加熱乾燥炉によっ
て、銅ペーストを硬化させ、孔周囲の面より盛り上がっ
た銅ペーストと銅箔表面に付着した銅ペーストを、研磨
機によって研磨除去し、硬化した銀ペーストを含む回路
導体の必要な箇所にレジストを形成し、レジストから露
出した導体をエッチング除去して、配線板とした。Example 4 MCL-E-67 (manufactured by Hitachi Chemical Co., Ltd., trade name) was used as a laminated board, and prepreg GEA-67 was formed on both surfaces of the inner layer circuit board from which copper foil at unnecessary portions was removed by etching.
N (manufactured by Hitachi Chemical Co., Ltd., trade name) is laminated on both sides, and a metal layer having a nickel-phosphorus alloy as a core and a copper layer formed by electrolytic plating on both sides of the metal layer are laminated and heated. An etching resist is formed on the laminated plate integrated by pressurizing and integrating it so that only the periphery of the hole is exposed at the area required for the connection between the circuit layers, and tetraammine copper (II), ammonium chloride and ammonia are added. Using an alkaline etchant consisting of, a copper layer is removed only, a metal recess is formed around the hole, a hole is opened, and a copper paste is printed and filled in the recess and the hole by a screen printing method. Next, by a conveyor heating and drying furnace, the copper paste is cured, and the copper paste that has risen from the surface around the holes and the copper paste that has adhered to the copper foil surface are removed by polishing with a polishing machine, and the cured silver paste is included. A resist was formed on a necessary portion of the circuit conductor, and the conductor exposed from the resist was removed by etching to obtain a wiring board.

【００３８】実施例５ 内層回路基板に、実施例１と同様にして作成したものを
用い、その両面に、プリプレグＧＥＡ−６７Ｎ（日立化
成工業株式会社製、商品名）と３５μｍの銅箔とを重
ね、加熱・加圧して積層一体化し、接続の必要な箇所に
孔をあけ、めっき前処理、シーディング、増感処理、無
電解めっき処理を行なって、その孔内壁に無電解めっき
による金属層を形成し、回路となる外層銅箔の箇所にレ
ジストを形成し、不要な外層銅箔をエッチング除去して
配線板とした。Example 5 An inner layer circuit board prepared in the same manner as in Example 1 was used, and a prepreg GEA-67N (trade name, manufactured by Hitachi Chemical Co., Ltd.) and a 35 μm copper foil were formed on both sides of the inner layer circuit board. Overlapping, heating and pressurizing to integrate the layers, making holes at the points where connections are required, performing plating pretreatment, seeding, sensitizing treatment, and electroless plating, and then performing electroless plating on the inner wall of the holes. Was formed, a resist was formed at the location of the outer layer copper foil to be a circuit, and unnecessary outer layer copper foil was removed by etching to obtain a wiring board.

【００３９】実施例６ 内層回路基板に、実施例２と同様にして作成したものを
用い、その両面に、プリプレグＧＥＡ−６７Ｎ（日立化
成工業株式会社製、商品名）と３５μｍの銅箔とを重
ね、加熱・加圧して積層一体化し、接続の必要な箇所に
孔をあけ、めっき前処理、シーディング、増感処理、無
電解めっき処理を行なって、その孔内壁に無電解めっき
による金属層を形成し、回路となる外層銅箔の箇所にレ
ジストを形成し、不要な外層銅箔をエッチング除去して
配線板とした。Example 6 An inner layer circuit board prepared in the same manner as in Example 2 was used, and a prepreg GEA-67N (trade name, manufactured by Hitachi Chemical Co., Ltd.) and a copper foil of 35 μm were formed on both sides of the inner layer circuit board. Overlapping, heating and pressurizing to integrate the layers, making holes at the points where connections are required, performing plating pretreatment, seeding, sensitizing treatment, and electroless plating, and then performing electroless plating on the inner wall of the holes. Was formed, a resist was formed at the location of the outer layer copper foil to be a circuit, and unnecessary outer layer copper foil was removed by etching to obtain a wiring board.

【００４０】実施例７ 内層回路基板に、ガラス布−エポキシ樹脂絶縁基板であ
るプリプレグＭＣＬ−Ｅ−６７（日立化成工業株式会社
製、商品名）の両面に、ニッケルをコアとする金属層と
その両面に無電解めっきによって形成した銅層の３層の
金属箔を重ねて加熱・加圧して積層一体化した積層板
の、回路層間の接続に必要な箇所に、エッチングレジス
トをその孔をあける箇所の周囲のみが露出するように形
成し、テトラアンミン銅（II）と塩化アンモニウムとア
ンモニアからなるアルカリエッチャントを用いて、銅層
のみを除去し、孔周囲に金属製の凹みを形成し、その凹
みに、銅ペーストを、スクリーン印刷法によって印刷充
填し、コンベア式の加熱乾燥炉によって、銅ペーストを
硬化させ、孔周囲の面より盛り上がった銅ペーストと銅
箔表面に付着した銅ペーストを、研磨機によって研磨除
去し、硬化した銀ペーストを含む回路導体の必要な箇所
にレジストを形成し、レジストから露出した導体をエッ
チング除去して、内層回路基板としたものを使用し、そ
の両面に、プリプレグＧＥＡ−６７Ｎ（日立化成工業株
式会社製、商品名）と３５μｍの銅箔とを重ね、加熱・
加圧して積層一体化し、接続の必要な箇所に孔をあけ、
めっき前処理、シーディング、増感処理、無電解めっき
処理を行なって、その孔内壁に無電解めっきによる金属
層を形成し、回路となる外層銅箔の箇所にレジストを形
成し、不要な外層銅箔をエッチング除去して配線板とし
た。Example 7 On the inner layer circuit board, a metal layer having nickel as the core and the metal layer having a core of nickel on both surfaces of a prepreg MCL-E-67 (trade name, manufactured by Hitachi Chemical Co., Ltd.) which is a glass cloth-epoxy resin insulating substrate. A place where an etching resist is formed at a place necessary for connection between circuit layers of a laminated board in which three layers of metal foil of a copper layer formed by electroless plating are stacked on both sides and heated and pressed to be laminated and integrated. It is formed so that only the periphery of the hole is exposed, and only the copper layer is removed using an alkaline etchant consisting of tetraammine copper (II), ammonium chloride and ammonia, and a metal recess is formed around the hole. The copper paste is printed and filled by a screen printing method, and the copper paste is cured by a conveyor-type heating and drying furnace, and the copper paste rises from the surface around the hole. The copper paste adhering to the foil surface is polished and removed by a polishing machine, a resist is formed at a necessary portion of the circuit conductor containing the hardened silver paste, and the conductor exposed from the resist is removed by etching to obtain an inner layer circuit board. A prepreg GEA-67N (manufactured by Hitachi Chemical Co., Ltd., trade name) and a 35 μm copper foil are overlaid on both sides and heated.
Apply pressure to stack and integrate, and make holes at the points where connection is required,
Pre-plating treatment, seeding, sensitization treatment and electroless plating treatment are performed to form a metal layer by electroless plating on the inner wall of the hole, and a resist is formed on the outer copper foil where the circuit will be formed. The copper foil was removed by etching to obtain a wiring board.

【００４１】実施例８ 内層回路基板に、実施例４と同様にして作成したものを
用い、その両面に、プリプレグＭＣＬ−Ｅ−６７（日立
化成工業株式会社製、商品名）と３５μｍの銅箔とを重
ね、加熱・加圧して積層一体化し、接続の必要な箇所に
孔をあけ、めっき前処理、シーディング、増感処理、無
電解めっき処理を行なって、その孔内壁に無電解めっき
による金属層を形成し、回路となる外層銅箔の箇所にレ
ジストを形成し、不要な外層銅箔をエッチング除去して
配線板とした。Example 8 An inner layer circuit board prepared in the same manner as in Example 4 was used, and prepreg MCL-E-67 (trade name, manufactured by Hitachi Chemical Co., Ltd.) and 35 μm copper foil were formed on both sides of the inner layer circuit board. And heat and pressure to stack and integrate them, make holes in the places where connection is required, perform plating pretreatment, seeding, sensitization treatment, and electroless plating, and then use electroless plating on the inner walls of the holes. A metal layer was formed, a resist was formed on a portion of the outer layer copper foil which becomes a circuit, and unnecessary outer layer copper foil was removed by etching to obtain a wiring board.

【００４２】実施例９ 内層回路基板に、実施例１と同様にして作成したものを
用い、その内層回路の銀ペースト充填した孔径は、１．
５ｍｍとし、その両面に、プリプレグＧＥＡ−６７Ｎ
（日立化成工業株式会社製、商品名）と３５μｍの銅箔
とを重ね、加熱・加圧して積層一体化し、その内層回路
の銀ペースト充填した孔の箇所に、内層回路と外層回路
とを接続する孔をあけ、かつ、その孔径を０．８ｍｍと
し、その孔の周囲のみを露出させるようにエッチングレ
ジストを形成し、予めエッチング除去時間と銅箔の残り
厚さとの関係を求めておき、銅箔の厚さのほぼ半分程度
を除去して孔周囲に金属製の凹みを形成し、エッチング
レジストを剥離除去し、その凹み及び孔内に、同じ銀ペ
ーストを、スクリーン印刷法によって印刷充填する。次
に、コンベア式の加熱乾燥炉によって、銀ペーストを硬
化させ、孔周囲の面より盛り上がった銀ペーストと銅箔
表面に付着した銀ペーストを、研磨機によって研磨除去
し、硬化した銀ペーストを含む回路導体の必要な箇所に
レジストを形成し、レジストから露出した導体をエッチ
ング除去して、配線板とした。Example 9 An inner layer circuit board prepared in the same manner as in Example 1 was used, and the hole diameter of the inner layer circuit filled with silver paste was 1.
5 mm, with prepreg GEA-67N on both sides
(Hitachi Chemical Co., Ltd., trade name) and 35 μm copper foil are overlaid, heated and pressed to be laminated and integrated, and the inner layer circuit and the outer layer circuit are connected to the holes of the inner layer circuit filled with silver paste. To form a hole having a diameter of 0.8 mm, an etching resist is formed so that only the periphery of the hole is exposed, and the relationship between the etching removal time and the remaining copper foil thickness is obtained in advance. About half the thickness of the foil is removed to form a metal recess around the hole, the etching resist is peeled off, and the recess and the hole are filled with the same silver paste by screen printing. Next, the silver paste is cured by a conveyor-type heating and drying furnace, and the silver paste raised from the surface around the holes and the silver paste attached to the copper foil surface are removed by polishing with a polishing machine, and the cured silver paste is contained. A resist was formed on a necessary portion of the circuit conductor, and the conductor exposed from the resist was removed by etching to obtain a wiring board.

【００４３】実施例１０ 内層回路基板に、実施例３と同様にして作成したものを
用い、その内層回路の銀ペースト充填した孔径は、１．
５ｍｍとし、その両面に、プリプレグＧＥＡ−６７Ｎ
（日立化成工業株式会社製、商品名）と、ニッケル−硼
素合金をコアとする金属層とその両面に無電解めっきに
よって形成した銅層の３層の金属箔とを重ねて加熱・加
圧して積層一体化した積層板の、回路層間の接続に必要
な箇所に、内層回路と外層回路とを接続する孔をあけ、
かつ、その孔径を０．８ｍｍとし、その孔の周囲のみを
露出させるようにエッチングレジストを形成し、テトラ
アンミン銅（II）と塩化アンモニウムとアンモニアから
なるアルカリエッチャントを用いて、銅層のみを除去し
て孔周囲に金属製の凹みを形成し、エッチングレジスト
を剥離除去し、その凹み及び孔内に、同じ銀ペースト
を、スクリーン印刷法によって印刷充填する。次に、コ
ンベア式の加熱乾燥炉によって、銀ペーストを硬化さ
せ、孔周囲の面より盛り上がった銀ペーストと銅箔表面
に付着した銀ペーストを、研磨機によって研磨除去し、
硬化した銀ペーストを含む回路導体の必要な箇所にレジ
ストを形成し、レジストから露出した導体をエッチング
除去して、配線板とした。Example 10 An inner layer circuit board prepared in the same manner as in Example 3 was used, and the hole diameter of the inner layer circuit filled with silver paste was 1.
5 mm, with prepreg GEA-67N on both sides
(Hitachi Chemical Co., Ltd., trade name), a metal layer having a nickel-boron alloy as a core, and a three-layer metal foil of a copper layer formed by electroless plating on both sides of the metal layer are stacked and heated and pressed. A hole for connecting the inner layer circuit and the outer layer circuit is formed in a portion of the laminated plate that is laminated and integrated to be necessary for connection between circuit layers,
Moreover, the hole diameter is set to 0.8 mm, an etching resist is formed so as to expose only the periphery of the hole, and only the copper layer is removed using an alkali etchant composed of tetraammine copper (II), ammonium chloride and ammonia. A metal recess is formed around the hole, the etching resist is removed by stripping, and the same silver paste is printed and filled in the recess and the hole by a screen printing method. Next, the conveyor-type heating and drying furnace cures the silver paste, and the silver paste that has risen from the surface around the holes and the silver paste that has adhered to the copper foil surface is removed by polishing with a polishing machine.
A resist was formed on a necessary portion of the circuit conductor containing the hardened silver paste, and the conductor exposed from the resist was removed by etching to obtain a wiring board.

【００４４】実施例１１ 内層回路板として、実施例２と同様にして作成したもの
を用い、その両面に、プリプレグＧＥＡ−６７Ｎ（日立
化成工業株式会社製、商品名）と３５μｍの銅箔とを重
ね、加熱・加圧して積層一体化し、その内層回路の銀ペ
ースト充填した孔の箇所に、内層回路と外層回路とを接
続する孔をあけ、かつ、その孔径を０．８ｍｍとし、そ
の孔の周囲のみを露出させるようにエッチングレジスト
を形成し、予めエッチング除去時間と銅箔の残り厚さと
の関係を求めておき、銅箔の厚さのほぼ半分程度を除去
して孔周囲に金属製の凹みを形成し、エッチングレジス
トを剥離除去し、その凹み及び孔内に、同じ銀ペースト
を、スクリーン印刷法によって印刷充填する。次に、コ
ンベア式の加熱乾燥炉によって、銀ペーストを硬化さ
せ、孔周囲の面より盛り上がった銀ペーストと銅箔表面
に付着した銀ペーストを、研磨機によって研磨除去し、
硬化した銀ペーストを含む回路導体の必要な箇所にレジ
ストを形成し、レジストから露出した導体をエッチング
除去して、配線板とした。Example 11 An inner layer circuit board prepared in the same manner as in Example 2 was used, and a prepreg GEA-67N (manufactured by Hitachi Chemical Co., Ltd., trade name) and a 35 μm copper foil were used on both sides thereof. Overlapping, heating and pressurizing to integrate the layers, a hole for connecting the inner layer circuit and the outer layer circuit is made at the hole of the inner layer circuit filled with silver paste, and the hole diameter is 0.8 mm. Form an etching resist so that only the surroundings are exposed, obtain the relationship between the etching removal time and the remaining thickness of the copper foil in advance, and remove approximately half the thickness of the copper foil to remove the metal around the hole. A recess is formed, the etching resist is removed by stripping, and the same silver paste is printed and filled in the recess and the hole by a screen printing method. Next, the conveyor-type heating and drying furnace cures the silver paste, and the silver paste that has risen from the surface around the holes and the silver paste that has adhered to the copper foil surface is removed by polishing with a polishing machine.
A resist was formed on a necessary portion of the circuit conductor containing the hardened silver paste, and the conductor exposed from the resist was removed by etching to obtain a wiring board.

【００４５】実施例１２ 積層板としてＭＣＬ−Ｅ−６７（日立化成工業株式会社
製、商品名）を用い、不要な箇所の銅箔をエッチング除
去した内層回路基板の両面に、プリプレグＧＥＡ−６７
Ｎ（日立化成工業株式会社製、商品名）を重ねた両面
に、ニッケル−リン合金をコアとする金属層とその両面
に電解めっきによって形成した銅層の３層の金属箔を重
ねて加熱・加圧して積層一体化した積層板の、回路層間
の接続に必要な箇所に、エッチングレジストをその孔を
あける箇所の周囲のみが露出するように形成し、テトラ
アンミン銅（II）と塩化アンモニウムとアンモニアから
なるアルカリエッチャントを用いて、銅層のみを除去
し、孔周囲に金属製の凹みを形成し、その凹みに、銅ペ
ーストを、スクリーン印刷法によって印刷充填し、コン
ベア式の加熱乾燥炉によって、銅ペーストを硬化させ、
孔周囲の面より盛り上がった銅ペーストと銅箔表面に付
着した銅ペーストを、研磨機によって研磨除去し、硬化
した銀ペーストを含む回路導体の必要な箇所にレジスト
を形成し、レジストから露出した導体をエッチング除去
して、内層回路板としたものを使用し、その内層回路の
銀ペースト充填した孔径は、１．５ｍｍとし、その両面
に、プリプレグＧＥＡ−６７Ｎ（日立化成工業株式会社
製、商品名）と、ニッケル−硼素合金をコアとする金属
層とその両面に無電解めっきによって形成した銅層の３
層の金属箔とを重ねて加熱・加圧して積層一体化した積
層板の、回路層間の接続に必要な箇所に、内層回路と外
層回路とを接続する孔をあけ、かつ、その孔径を０．８
ｍｍとし、その孔の周囲のみを露出させるようにエッチ
ングレジストを形成し、テトラアンミン銅（II）と塩化
アンモニウムとアンモニアからなるアルカリエッチャン
トを用いて、銅層のみを除去して孔周囲に金属製の凹み
を形成し、エッチングレジストを剥離除去し、その凹み
及び孔内に、同じ銀ペーストを、スクリーン印刷法によ
って印刷充填する。次に、コンベア式の加熱乾燥炉によ
って、銀ペーストを硬化させ、孔周囲の面より盛り上が
った銀ペーストと銅箔表面に付着した銀ペーストを、研
磨機によって研磨除去し、硬化した銀ペーストを含む回
路導体の必要な箇所にレジストを形成し、レジストから
露出した導体をエッチング除去して、配線板とした。Example 12 MCL-E-67 (manufactured by Hitachi Chemical Co., Ltd., trade name) was used as a laminated board, and prepreg GEA-67 was formed on both surfaces of an inner layer circuit board from which copper foil at unnecessary portions was removed by etching.
N (manufactured by Hitachi Chemical Co., Ltd., trade name) is laminated on both sides, and a metal layer having a nickel-phosphorus alloy as a core and a copper layer formed by electrolytic plating on both sides of the metal layer are laminated and heated. An etching resist is formed on the laminated plate integrated by pressurizing and integrating it so that only the periphery of the hole is exposed at the area required for the connection between the circuit layers, and tetraammine copper (II), ammonium chloride and ammonia are added. Using an alkaline etchant consisting of, to remove only the copper layer, to form a metal depression around the hole, in the depression, copper paste is printed and filled by the screen printing method, by a conveyor-type heating and drying furnace, Cure the copper paste,
The copper paste that rises from the surface around the holes and the copper paste that has adhered to the copper foil surface are removed by polishing with a polishing machine, and a resist is formed at the required locations on the circuit conductor containing the hardened silver paste. The inner diameter of the inner layer circuit filled with silver paste was set to 1.5 mm, and prepreg GEA-67N (manufactured by Hitachi Chemical Co., Ltd., trade name) was used. ) And a metal layer having a nickel-boron alloy as a core and a copper layer formed on both surfaces thereof by electroless plating.
A hole for connecting the inner layer circuit and the outer layer circuit is formed at a position necessary for connection between the circuit layers of the laminated plate in which the metal foils of the layers are stacked, heated and pressed to be laminated and integrated, and the hole diameter is 0. .8
mm, an etching resist is formed so as to expose only the perimeter of the hole, and only the copper layer is removed by using an alkali etchant composed of tetraammine copper (II), ammonium chloride and ammonia, and the perimeter of the hole is made of metal. A recess is formed, the etching resist is removed by stripping, and the same silver paste is printed and filled in the recess and the hole by a screen printing method. Next, the silver paste is cured by a conveyor-type heating and drying furnace, and the silver paste raised from the surface around the holes and the silver paste attached to the copper foil surface are removed by polishing with a polishing machine, and the cured silver paste is contained. A resist was formed on a necessary portion of the circuit conductor, and the conductor exposed from the resist was removed by etching to obtain a wiring board.

【００４６】実施例１３ 導電性物質に、はんだ等の低い融点を有する金属粒子と
溶剤とからなるはんだペーストを用い、孔周囲の凹みと
孔内に充填した後に、コンベア式の加熱乾燥炉によっ
て、溶剤を蒸発させると共に、はんだを溶融し、冷却し
て固定させた以外は実施例１と同様に行ない配線板とし
た。Example 13 As a conductive substance, a solder paste composed of metal particles having a low melting point such as solder and a solvent was used, and after filling the pits around the holes and the holes, a conveyor type heating and drying furnace was used. A wiring board was prepared in the same manner as in Example 1 except that the solvent was evaporated and the solder was melted, cooled and fixed.

【００４７】実施例１４ 積層板として、紙−フェノール樹脂と３５μｍの銅箔を
積層したＭＣＬ−４３７Ｆ（日立化成工業株式会社製、
商品名）を用いた以外は、実施例２と同様に行ない配線
板とした。Example 14 As a laminate, MCL-437F (manufactured by Hitachi Chemical Co., Ltd.) in which paper-phenol resin and 35 μm copper foil are laminated
A wiring board was prepared in the same manner as in Example 2 except that the product name) was used.

【００４８】実施例１５ 積層板として、ポリエステルフィルムに接着剤で３５μ
ｍの銅箔を貼り合わせた銅箔貼り積層フィルムを用いた
以外は、実施例１と同様にして配線板を作成した。Example 15 As a laminate, a polyester film having an adhesive of 35 μm was used.
A wiring board was prepared in the same manner as in Example 1 except that a copper foil-clad laminated film obtained by laminating copper foil of m was used.

【００４９】実施例１６ 積層板として、ポリイミドフィルムに接着剤で、はんだ
めっきを行なった銅箔を貼り合わせたはんだ−銅箔貼り
積層フィルムを用いた以外は、実施例１３と同様にして
配線板を作成した。また、孔周囲の凹みと孔内に充填し
た後に、熱によって溶剤を蒸発させると共に、低い融点
を有する金属粒子を溶融し、冷却して固定させる際に、
厚さ１ｍｍのアルミニウム板にポリイミドフィルムを貼
りあわせた積層板の耐熱性フィルム側に、前記積層板を
重ね、粘着性シートでその両面をラミネートし、加熱路
に投入した。Example 16 A wiring board was prepared in the same manner as in Example 13 except that a solder-copper foil-laminating film obtained by laminating a copper foil plated with solder with an adhesive on a polyimide film was used as the laminate. It was created. Also, after filling the recesses around the holes and the holes, while evaporating the solvent by heat, melting the metal particles having a low melting point, when cooling and fixing,
The laminate was laminated on the heat-resistant film side of a laminate obtained by laminating a polyimide film on an aluminum plate having a thickness of 1 mm, both sides were laminated with an adhesive sheet, and the mixture was put into a heating path.

【００５０】以上のようにして作成した配線板は、通常
のスルーホールを用いた配線板に比較して、無電解めっ
きを行なわないで済むため、完全自動化した製造ライン
を構成することができるという見通しを立てることがで
きた。また、同様の理由で、工程時間の大半の時間を要
するめっき工程の時間が削減でき、かなり低経費で製造
できることも分かった。特性については、いずれも電気
特性以外は、ほぼ通常の配線板と同様に使用できること
を確認した。はんだを使用したものは、耐熱性の上で、
はんだの融点以下で使用しなければならないということ
以外は、他の配線板とほぼ同程度の特性であった。電気
特性としては、導電性物質にはんだを用いたものは、ほ
ぼ通常の配線板と道程度であったが、電源等の電流が多
く流れる回路において、わずかに電圧の低下があり、半
導体にＥＣＬ（エミッタ−カップルド−ロジック）回路
等、厳しい要求のものには使用できないものの、携帯ワ
ープロ、携帯パソコン等消費電力の小さいＣ−ＭＯＳ半
導体を使用したものは、いずれも従来の配線板と同様に
実用できるものであった。The wiring board produced as described above does not require electroless plating as compared with a wiring board using a normal through hole, and thus a fully automated production line can be constructed. I was able to get a prospect. Also, for the same reason, it has been found that the time of the plating process, which requires most of the process time, can be reduced, and the manufacturing can be performed at a considerably low cost. Regarding the characteristics, it was confirmed that they can be used in almost the same manner as ordinary wiring boards except for the electric characteristics. The one using solder has heat resistance,
It had almost the same characteristics as other wiring boards, except that it had to be used below the melting point of solder. Regarding the electrical characteristics, the one using solder as the conductive material was about the same as a normal wiring board, but in a circuit such as a power source where a large amount of current flows, there is a slight drop in voltage, and ECL Although it cannot be used for strict requirements such as (emitter-coupled-logic) circuits, portable word processors, portable personal computers, etc. that use C-MOS semiconductors with low power consumption are the same as conventional wiring boards. It was practical.

【００５１】[0051]

【発明の効果】以上に説明したように、本発明によっ
て、ほぼ現状の配線板の性能を維持した上で、安価でか
つ配線密度の高い配線板とすることができ、このような
配線板を効率的に製造する方法を提供できるものであ
る。As described above, according to the present invention, it is possible to obtain a wiring board which is inexpensive and has a high wiring density while maintaining the performance of the current wiring board. It is possible to provide an efficient manufacturing method.

【図面の簡単な説明】[Brief description of drawings]

【図１】本発明の一実施例の要部を示す断面図である。FIG. 1 is a sectional view showing a main part of an embodiment of the present invention.

【図２】従来例の課題を説明するための要部を示す断面
図である。FIG. 2 is a cross-sectional view showing a main part for explaining a problem of a conventional example.

【図３】本発明の他の実施例の要部を示す断面図であ
る。FIG. 3 is a cross-sectional view showing the main parts of another embodiment of the present invention.

【図４】（ａ）および（ｂ）は本発明の一実施例並びに
他の実施例の要部を示す上面図である。4 (a) and 4 (b) are top views showing a main part of one embodiment and another embodiment of the present invention.

【図５】（ａ）〜（ｅ）は本発明の一実施例の各工程を
説明するための断面図である。5A to 5E are cross-sectional views for explaining each step of one embodiment of the present invention.

【図６】（ａ）〜（ｆ）は本発明の他の実施例の各工程
を説明するための断面図である。6 (a) to 6 (f) are cross-sectional views for explaining each step of another embodiment of the present invention.

【図７】（ａ）〜（ｈ）は本発明のさらに他の実施例の
各工程を説明するための断面図である。7A to 7H are sectional views for explaining each step of still another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

１．絶縁層 ２，２１．銅箔 ３，３１．導電性物質 ４．配線 ５．プリプレグ 1. Insulating layer 2, 21. Copper foil 3,31. Conductive substance 4. Wiring 5. Prepreg

───────────────────────────────────────────────────── フロントページの続き (72)発明者 畠山 修一 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 (72)発明者 浦崎 直之 茨城県下館市大字小川1500番地 日立化成 工業株式会社下館研究所内 ─────────────────────────────────────────────────── ─── Continuation of the front page (72) Inventor Shuichi Hatakeyama 1500 Ogawa, Shimodate, Ibaraki Shimodate Research Laboratory, Hitachi Chemical Co., Ltd. (72) Naoyuki Urasaki 1500 Ogawa, Shimodate, Ibaraki Hitachi Chemical Co., Ltd. Shimodate Research Center

Claims (30)

【特許請求の範囲】[Claims] 【請求項１】 絶縁材または内層回路板に明けられた孔
と、孔の周囲の絶縁材の少なくとも一方の面に設けら
れ、かつ、孔の近くの箇所がそれより外の箇所に比べ低
く個本でいる導体で形成されたランド部と、その凹んだ
箇所にのみ充填された導電性物質とを有することを特徴
とする配線板。1. A hole provided in an insulating material or an inner-layer circuit board and at least one surface of the insulating material around the hole, and a portion near the hole is lower than a portion outside the hole. A wiring board having a land portion formed of a conductor in a book and a conductive material filled only in the recessed portion. 【請求項２】 前記導電性物質が、前記凹んだ箇所と、
前記孔内部に充填されたことを特徴とする請求項１に記
載の配線板。2. The conductive material, the recessed portion,
The wiring board according to claim 1, wherein the wiring board is filled inside the hole. 【請求項３】 完全に硬化していない絶縁基板の両方の
面に銅箔を重ねて加熱・加圧して積層一体化した積層板
の、回路層間の接続に必要な箇所に、孔をあけ、その孔
の周囲のみの銅箔を前記絶縁板が露出しない程度に除去
して孔周囲に金属製の凹みを形成し、その凹み及び孔内
に、流動性の導電性物質を充填することを特徴とする配
線板の製造法。3. A hole is formed at a position required for connection between circuit layers of a laminated board in which copper foils are superposed on both surfaces of an insulating substrate which is not completely cured and heated and pressed to be laminated and integrated. The copper foil only around the hole is removed to the extent that the insulating plate is not exposed to form a metal recess around the hole, and the recess and the hole are filled with a fluid conductive substance. Manufacturing method of wiring board. 【請求項４】 内層回路基板にプリプレグを重ねたもの
の少なくとも一方の面に、銅箔を重ねて加熱・加圧して
積層一体化した積層板の、回路層間の接続に必要な箇所
に、孔をあけ、その孔の周囲のみの銅箔を前記プリプレ
グが露出しない程度に除去して孔周囲に金属製の凹みを
形成し、その凹み及び孔内に流動性の導電性物質を充填
することを特徴とする配線板の製造法。4. A hole is formed at a position necessary for connection between circuit layers of a laminated board in which a copper foil is laminated and heated / pressurized and integrated on at least one surface of an inner layer circuit board on which a prepreg is laminated. A hole is formed, a copper foil only around the hole is removed to the extent that the prepreg is not exposed to form a metal recess around the hole, and a fluid conductive material is filled in the recess and the hole. Manufacturing method of wiring board. 【請求項５】 完全に硬化していない絶縁基板の両方の
面に、コアとなる金属層と少なくとも一方の面に形成さ
れた銅層の２層以上の金属層であって、コアとなる金属
層は銅層と除去条件が異なるものである金属箔を重ねて
加熱・加圧して積層一体化した積層板の、回路層間の接
続に必要な箇所に、孔をあけ、その孔の周囲のみの銅層
のみを除去し、孔周囲に金属製の凹みを形成し、その凹
み及び孔内に、流動性の導電性物質を充填することを特
徴とする配線板の製造法。5. A core metal comprising two or more metal layers, a metal layer serving as a core and a copper layer formed on at least one surface on both surfaces of an insulating substrate which is not completely cured. The layer is different in removal condition from the copper layer. Layers of metal foil are stacked, heated and pressed to form a layered body, and holes are made at the locations necessary for connection between circuit layers. A method for manufacturing a wiring board, which comprises removing only the copper layer, forming metal recesses around the holes, and filling the recesses and the holes with a fluid conductive material. 【請求項６】 内層回路基板にプリプレグを重ねたもの
の少なくとも一方の面に、コアとなる金属層と少なくと
も一方の面に形成された銅層の２層以上の金属層であっ
て、コアとなる金属層は銅層と除去条件が異なるもので
ある金属箔を重ねて加熱・加圧して積層一体化した積層
板の、回路層間の接続に必要な箇所に、孔をあけ、その
孔の周囲のみの銅層を除去し、孔周囲に金属製の凹みを
形成し、その凹み及び孔内に流動性の導電性物質を充填
することを特徴とする配線板の製造法。6. A core layer comprising at least one surface of a laminate of a prepreg on an inner-layer circuit board and a metal layer of a core and a copper layer formed on at least one surface of the prepreg. The metal layer has different removal conditions from the copper layer.Metal foils are stacked, heated and pressed to form a laminate, and holes are made at the locations required for connection between circuit layers, and only around the holes. The method for producing a wiring board, comprising removing the copper layer, forming a metal recess around the hole, and filling the recess and the hole with a fluid conductive substance. 【請求項７】 完全に硬化していない絶縁基板の両方の
面に銅箔を重ねて加熱・加圧して積層一体化した積層板
の、回路層間の接続に必要な箇所の、孔をあける予定の
箇所の周囲のみの銅箔を前記絶縁板が露出しない程度に
除去して孔周囲に金属製の凹みを形成し、孔をあけ、そ
の凹み及び孔内に、流動性の導電性物質を充填すること
を特徴とする配線板の製造法。7. A hole is formed at a position necessary for connecting between circuit layers of a laminated board in which copper foil is superposed on both surfaces of an insulating substrate which is not completely cured and heated and pressed to be laminated. The copper foil only around the area is removed to the extent that the insulating plate is not exposed to form a metal depression around the hole, a hole is made, and a fluid conductive substance is filled into the depression and the hole. A method of manufacturing a wiring board, comprising: 【請求項８】 内層回路基板にプリプレグを重ねたもの
の少なくとも一方の面に、銅箔を重ねて加熱・加圧して
積層一体化した積層板の、回路層間の接続に必要な箇所
の、孔をあける予定の箇所の周囲のみの銅箔を前記プリ
プレグが露出しない程度に除去して孔周囲に金属製の凹
みを形成し、孔をあけ、その凹み及び孔内に流動性の導
電性物質を充填することを特徴とする配線板の製造法。8. A hole is formed at a position necessary for connection between circuit layers of a laminated board in which a copper foil is laminated and heated and pressed to be laminated and integrated on at least one surface of an inner layer circuit board on which a prepreg is laminated. Remove the copper foil only around the area to be opened to the extent that the prepreg is not exposed to form a metal depression around the hole, make a hole, and fill the depression and hole with a fluid conductive substance. A method of manufacturing a wiring board, comprising: 【請求項９】 完全に硬化していない絶縁基板の両方の
面に、コアとなる金属層と少なくとも一方の面に形成さ
れた銅層の２層以上の金属層であって、コアとなる金属
層は銅層と除去条件が異なるものである金属箔を重ねて
加熱・加圧して積層一体化した積層板の、回路層間の接
続に必要な箇所の、孔をあける予定の箇所の周囲のみの
銅層のみを除去し、孔周囲に金属製の凹みを形成し、孔
をあけ、その凹み及び孔内に、流動性の導電性物質を充
填することを特徴とする配線板の製造法。9. A core metal comprising two or more metal layers, a metal layer serving as a core and a copper layer formed on at least one surface on both surfaces of an insulating substrate which is not completely cured. The layer is different in removal condition from the copper layer. Only the periphery of the place where holes are to be drilled, where the holes are to be connected, between the circuit layers of a laminated board that is made by stacking metal foil and heating and pressing to laminate. A method for producing a wiring board, which comprises removing only the copper layer, forming a metal recess around the hole, forming a hole, and filling the recess and the hole with a fluid conductive substance. 【請求項１０】 内層回路基板にプリプレグを重ねたも
のの少なくとも一方の面に、コアとなる金属層と少なく
とも一方の面に形成された銅層の２層以上の金属層であ
って、コアとなる金属層は銅層と除去条件が異なるもの
である金属箔を重ねて加熱・加圧して積層一体化した積
層板の、回路層間の接続に必要な箇所の、孔をあける予
定の箇所の周囲のみの銅層を除去し、孔周囲に金属製の
凹みを形成し、その凹み及び孔内に流動性の導電性物質
を充填することを特徴とする配線板の製造法。10. An inner layer circuit board on which at least one surface of a prepreg is superposed has two or more metal layers of a metal layer to be a core and a copper layer formed on at least one surface to be a core. The metal layer has different removal conditions from those of the copper layer. Only on the periphery of the place where holes are to be drilled, where the holes are to be connected between the circuit layers of the laminated plate that is made by stacking and heating and pressing metal foil. The method for producing a wiring board, comprising removing the copper layer, forming a metal recess around the hole, and filling the recess and the hole with a fluid conductive substance. 【請求項１１】 前記金属製の凹み及び孔内に流動性の
導電性物質を充填する工程の後に、流動性の導電性物質
を固定し、孔周囲の面より盛り上がった前記導電性物質
を除去し、その固定した導電性物質を含む回路導体の必
要な箇所にレジストを形成し、レジストから露出した導
体をエッチング除去することを特徴とする請求項２〜９
のうちいずれかに記載の配線板の製造法。11. After the step of filling a fluid conductive material into the metal recess and the hole, the fluid conductive material is fixed and the conductive material raised from the surface around the hole is removed. 10. A resist is formed on a necessary portion of the fixed circuit conductor containing the conductive substance, and the conductor exposed from the resist is removed by etching.
The method for manufacturing a wiring board according to any one of 1. 【請求項１２】 内層回路基板に、前記完全に硬化して
いない絶縁基板の両方の面に銅箔を重ねて加熱・加圧し
て積層一体化した積層板の、回路層間の接続に必要な箇
所に、孔をあけ、その孔の周囲のみの銅箔を前記絶縁基
板が露出しない程度に除去して孔周囲に金属製の凹みを
形成し、その凹み及び孔内に、流動性の導電性物質を充
填し、流動性の導電性物質を固定し、孔周囲の面より盛
り上がった前記導電性物質を除去し、その固定した導電
性物質を含む回路導体の必要な箇所にレジストを形成
し、レジストから露出した導体をエッチング除去したも
のを用い、その上の少なくとも一方の面に、プリプレグ
と銅箔とを重ね、加熱・加圧して積層一体化し、接続の
必要な箇所に孔をあけ、その孔内壁にめっきによる金属
層を形成し、回路となる外層銅箔の箇所にレジストを形
成し、不要な外層銅箔をエッチング除去することを特徴
とする配線板の製造法。12. A portion required for connection between circuit layers of a laminated board in which a copper foil is placed on both surfaces of the insulating substrate which is not completely cured and is laminated by heating and pressurizing the inner layer circuit substrate. , A hole is formed, and a copper foil only around the hole is removed to the extent that the insulating substrate is not exposed to form a metal recess around the hole, and a fluid conductive material is formed in the recess and the hole. To fix the fluid conductive material, remove the conductive material that rises from the surface around the hole, and form a resist at the required location of the circuit conductor containing the fixed conductive material, the resist The conductor exposed from the conductor is removed by etching, and the prepreg and copper foil are stacked on at least one surface on top of it, and they are laminated by heating and pressurizing, and holes are made at the places where connection is required. A metal layer is formed on the inner wall by plating to form a circuit. A method for manufacturing a wiring board, characterized in that a resist is formed on a portion of the outer-layer copper foil, and unnecessary outer-layer copper foil is removed by etching. 【請求項１３】 内層回路基板に、完全に硬化していな
い絶縁基板の両方の面に、コアとなる金属層と少なくと
も一方の面に形成された銅層の２層以上の金属層であっ
て、コアとなる金属層は銅層と除去条件が異なるもので
ある金属箔を重ねて加熱・加圧して積層一体化した積層
板の、回路層間の接続に必要な箇所に、孔をあけ、その
孔の周囲のみの銅層のみを除去し、孔周囲に金属製の凹
みを形成し、その凹み及び孔内に、流動性の導電性物質
を充填し、流動性の導電性物質を固定し、孔周囲の面よ
り盛り上がった前記導電性物質を除去し、その固定した
導電性物質を含む回路導体の必要な箇所にレジストを形
成し、レジストから露出した導体をエッチング除去した
ものを用い、その上の少なくとも一方の面に、プリプレ
グと銅箔とを重ね、加熱・加圧して積層一体化し、接続
の必要な箇所に孔をあけ、その孔内壁にめっきによる金
属層を形成し、回路となる外層銅箔の箇所にレジストを
形成し、不要な外層銅箔をエッチング除去することを特
徴とする配線板の製造法。13. An inner layer circuit board comprising two or more metal layers, a metal layer serving as a core and a copper layer formed on at least one surface on both sides of an insulating substrate which is not completely cured. The core metal layer has different removal conditions from the copper layer, and metal foils are stacked and heated and pressed to form a laminated plate. Only the copper layer around the hole is removed, a metal recess is formed around the hole, and a fluid conductive substance is filled in the recess and the hole to fix the fluid conductive substance, The conductive material that has risen from the surface around the hole is removed, a resist is formed at a necessary portion of the circuit conductor containing the fixed conductive material, and the conductor exposed from the resist is removed by etching. On at least one side of the prepreg and copper foil, Heat and pressure are applied to stack and integrate, holes are formed in the places where connections are required, a metal layer is formed by plating on the inner walls of the holes, and a resist is formed on the places of the outer copper foil that will be the circuit, and unnecessary outer copper foil A method for manufacturing a wiring board, which comprises removing by etching. 【請求項１４】 内層回路基板に、前記完全に硬化して
いない絶縁基板の両方の面に銅箔を重ねて加熱・加圧し
て積層一体化した積層板の、回路層間の接続に必要な箇
所に、孔をあけ、その孔の周囲のみの銅箔を前記絶縁基
板が露出しない程度に除去して孔周囲に金属製の凹みを
形成し、その凹み及び孔内に、流動性の導電性物質を充
填し、流動性の導電性物質を固定し、孔周囲の面より盛
り上がった前記導電性物質を除去し、その固定した導電
性物質を含む回路導体の必要な箇所にレジストを形成
し、レジストから露出した導体をエッチング除去したも
のを用い、その上の少なくとも一方の面に、プリプレグ
と銅箔とを重ね、加熱・加圧して積層一体化し、その内
層回路の導電性物質を充填した孔のうち少なくとも１箇
所に、内層回路と外層回路とを接続する孔をあけ、か
つ、その孔径が、前記内層回路の導電性物質を充填した
孔径よりも小さいものであって、その後、内層回路と外
層回路とを接続する孔の周囲のみの銅箔を前記プリプレ
グが露出しない程度に除去して孔周囲に金属製の凹みを
形成し、その凹み及び孔内に、流動性の導電性物質を充
填することを特徴とする配線板の製造法。14. A portion required for connection between circuit layers of a laminated board in which copper foil is laid on both surfaces of the insulating substrate which is not completely cured and is laminated by heating and pressurizing the inner layer circuit substrate. , A hole is formed, and a copper foil only around the hole is removed to the extent that the insulating substrate is not exposed to form a metal recess around the hole, and a fluid conductive material is formed in the recess and the hole. To fix the fluid conductive material, remove the conductive material that rises from the surface around the hole, and form a resist at the required location of the circuit conductor containing the fixed conductive material, the resist The conductor exposed from the conductor is removed by etching, and the prepreg and copper foil are laid on at least one surface of the conductor, and the layers are integrated by heating and pressing. At least one of them has an inner circuit and an outer layer A hole for connecting the circuit is formed, and the diameter of the hole is smaller than the diameter of the hole filled with the conductive substance of the inner layer circuit, and then only the periphery of the hole connecting the inner layer circuit and the outer layer circuit is formed. A method for manufacturing a wiring board, characterized in that the copper foil is removed to such an extent that the prepreg is not exposed to form a metal recess around the hole, and the recess and the hole are filled with a fluid conductive substance. .. 【請求項１５】 内層回路基板に、前記完全に硬化して
いない絶縁基板の両方の面に銅箔を重ねて加熱・加圧し
て積層一体化した積層板の、回路層間の接続に必要な箇
所に、孔をあけ、その孔の周囲のみの銅箔を前記絶縁基
板が露出しない程度に除去して孔周囲に金属製の凹みを
形成し、その凹み及び孔内に、流動性の導電性物質を充
填し、流動性の導電性物質を固定し、孔周囲の面より盛
り上がった前記導電性物質を除去し、その固定した導電
性物質を含む回路導体の必要な箇所にレジストを形成
し、レジストから露出した導体をエッチング除去したも
のを用い、その上の少なくとも一方の面に、プリプレグ
と前記コアとなる金属層と少なくとも一方の面に形成さ
れた銅層の２層以上の金属層であって、コアとなる金属
層は銅層と除去条件が異なるものである金属箔とを重
ね、加熱・加圧して積層一体化し、その内層回路の導電
性物質を充填した孔のうち少なくとも１箇所に、内層回
路と外層回路とを接続する孔をあけ、かつ、その孔径
が、前記内層回路の導電性物質を充填した孔径よりも小
さいものであって、その孔の周囲のみの銅層みを除去
し、孔周囲に金属製の凹みを形成し、その凹み及び孔内
に流動性の導電性物質を充填し、流動性の導電性物質を
固定し、孔周囲の面より盛り上がった前記導電性物質を
除去し、その固定した導電性物質を含む回路導体の必要
な箇所にレジストを形成し、レジストから露出した導体
をエッチング除去することを特徴とする配線板の製造
法。15. A portion required for connection between circuit layers of a laminated board in which a copper foil is laminated on both surfaces of the insulating substrate which is not completely cured and is laminated by heating and pressing on an inner layer circuit substrate. , A hole is formed, and a copper foil only around the hole is removed to the extent that the insulating substrate is not exposed to form a metal recess around the hole, and a fluid conductive material is formed in the recess and the hole. To fix the fluid conductive material, remove the conductive material that rises from the surface around the hole, and form a resist at the required location of the circuit conductor containing the fixed conductive material, the resist A conductor obtained by etching away the exposed conductor is used, and on at least one surface of the conductor, there are two or more metal layers including a prepreg, a metal layer serving as the core, and a copper layer formed on at least one surface. , The metal layer used as the core has the same removal conditions as the copper layer. A metal foil, which is different, is layered, heated and pressed to be laminated and integrated, and at least one of the holes filled with the conductive substance of the inner layer circuit is provided with a hole for connecting the inner layer circuit and the outer layer circuit, And, the hole diameter is smaller than the hole diameter filled with the conductive substance of the inner layer circuit, only the copper layer around the hole is removed, and a metal recess is formed around the hole, A circuit conductor containing the fixed conductive material by filling the recess and the hole with the conductive conductive material, fixing the conductive conductive material, removing the conductive material rising from the surface around the hole, and removing the conductive material. A method for manufacturing a wiring board, characterized in that a resist is formed in a necessary portion of the above, and the conductor exposed from the resist is removed by etching. 【請求項１６】 内層回路板として、完全に硬化してい
ない絶縁基板の両方の面に、コアとなる金属層と少なく
とも一方の面に形成された銅層の２層以上の金属層であ
って、コアとなる金属層は銅層と除去条件が異なるもの
である金属箔を重ねて加熱・加圧して積層一体化した積
層板の、回路層間の接続に必要な箇所に、孔をあけ、そ
の孔の周囲のみの銅層もしくは前記コアとなる金属層の
みを除去し、孔周囲に金属製の凹みを形成し、その凹み
及び孔内に、流動性の導電性物質を充填し、流動性の導
電性物質を固定し、孔周囲の面より盛り上がった前記導
電性物質を除去し、その固定した導電性物質を含む回路
導体の必要な箇所にレジストを形成し、レジストから露
出した導体をエッチング除去したものを使用し、その上
の少なくとも一方の面に、プリプレグと銅箔とを重ね、
加熱・加圧して積層一体化し、その内層回路の導電性物
質を充填した孔のうち少なくとも１箇所に、内層回路と
外層回路とを接続する孔をあけ、かつ、その孔径が、前
記内層回路の導電性物質を充填した孔径よりも小さいも
のであって、その後、内層回路と外層回路とを接続する
孔の周囲のみの銅箔を前記プリプレグが露出しない程度
に除去して孔周囲に金属製の凹みを形成し、その凹み及
び孔内に、流動性の導電性物質を充填することを特徴と
する配線板の製造法。16. An inner layer circuit board comprising two or more metal layers, a metal layer serving as a core and a copper layer formed on at least one surface on both surfaces of an insulating substrate which is not completely cured. The core metal layer has different removal conditions from the copper layer, and metal foils are stacked and heated and pressed to form a laminated plate. By removing only the copper layer around the hole or the metal layer serving as the core, a metal recess is formed around the hole, and a fluid conductive material is filled in the recess and the hole to improve the fluidity. A conductive substance is fixed, the conductive substance that rises from the surface around the hole is removed, a resist is formed at a required portion of the circuit conductor containing the fixed conductive substance, and the conductor exposed from the resist is removed by etching. Use at least one of the above On the surface, overlay the prepreg and copper foil,
A layer for connecting the inner layer circuit and the outer layer circuit is formed in at least one of the holes of the inner layer circuit filled with a conductive substance by heating and pressurizing, and the hole diameter is equal to that of the inner layer circuit. It is smaller than the hole diameter filled with a conductive substance, and then, the copper foil only around the hole connecting the inner layer circuit and the outer layer circuit is removed to the extent that the prepreg is not exposed and the metal is made around the hole. A method for manufacturing a wiring board, comprising forming a recess and filling the recess and the hole with a fluid conductive substance. 【請求項１７】 内層回路板として、完全に硬化してい
ない絶縁基板の両方の面に、コアとなる金属層と少なく
とも一方の面に形成された銅層の２層以上の金属層であ
って、コアとなる金属層は銅層と除去条件が異なるもの
である金属箔を重ねて加熱・加圧して積層一体化した積
層板の、回路層間の接続に必要な箇所に、孔をあけ、そ
の孔の周囲のみの銅層もしくは前記コアとなる金属層の
みを除去し、孔周囲に金属製の凹みを形成し、その凹み
及び孔内に、流動性の導電性物質を充填し、流動性の導
電性物質を固定し、孔周囲の面より盛り上がった前記導
電性物質を除去し、その固定した導電性物質を含む回路
導体の必要な箇所にレジストを形成し、レジストから露
出した導体をエッチング除去したものを使用し、その上
の少なくとも一方の面に、プリプレグと前記コアとなる
金属層と少なくとも一方の面に形成された銅層の２層以
上の金属層であって、コアとなる金属層は銅層と除去条
件が異なるものである金属箔とを重ね、加熱・加圧して
積層一体化し、その内層回路の導電性物質を充填した孔
のうち少なくとも１箇所に、内層回路と外層回路とを接
続する孔をあけ、かつ、その孔径が、前記内層回路の導
電性物質を充填した孔径よりも小さいものであって、そ
の孔の周囲のみの銅層みを除去し、孔周囲に金属製の凹
みを形成し、その凹み及び孔内に流動性の導電性物質を
充填し、流動性の導電性物質を固定し、孔周囲の面より
盛り上がった前記導電性物質を除去し、その固定した導
電性物質を含む回路導体の必要な箇所にレジストを形成
し、レジストから露出した導体をエッチング除去するこ
とを特徴とする配線板の製造法。17. An inner layer circuit board comprising two or more metal layers including a metal layer to be a core and a copper layer formed on at least one surface on both surfaces of an insulating substrate which is not completely cured. The core metal layer has different removal conditions from the copper layer, and metal foils are stacked and heated and pressed to form a laminated plate. By removing only the copper layer around the hole or the metal layer serving as the core, a metal recess is formed around the hole, and a fluid conductive material is filled in the recess and the hole to improve the fluidity. A conductive substance is fixed, the conductive substance that rises from the surface around the hole is removed, a resist is formed at a required portion of the circuit conductor containing the fixed conductive substance, and the conductor exposed from the resist is removed by etching. Use at least one of the above A metal layer having two or more layers, a prepreg, a metal layer serving as the core, and a copper layer formed on at least one surface, the metal layer serving as the core having different removal conditions from those of the copper layer. The foil is overlaid, heated and pressed to be laminated and integrated, and at least one of the holes filled with the conductive substance of the inner layer circuit is provided with a hole for connecting the inner layer circuit and the outer layer circuit, and the hole diameter is , The inner layer circuit is smaller than the hole diameter filled with a conductive substance, the copper layer only around the hole is removed, a metal recess is formed around the hole, and the recess and the hole are Fill the fluid conductive material, fix the fluid conductive material, remove the conductive material that rises from the surface around the hole, and remove the conductive material at the necessary place of the circuit conductor containing the fixed conductive material. Form a resist and etch the conductor exposed from the resist. Preparation of a wiring board, which comprises ring removed. 【請求項１８】 内層回路基板に、前記完全に硬化して
いない絶縁基板の両方の面に銅箔を重ねて加熱・加圧し
て積層一体化した積層板の、回路層間の接続に必要な箇
所の、孔をあける予定の箇所の周囲のみの銅箔を前記絶
縁基板が露出しない程度に除去して孔周囲に金属製の凹
みを形成し、その凹みに、流動性の導電性物質を充填
し、流動性の導電性物質を固定し、孔周囲の面より盛り
上がった前記導電性物質を除去し、その固定した導電性
物質を含む回路導体の必要な箇所にレジストを形成し、
レジストから露出した導体をエッチング除去したものを
用い、その上の少なくとも一方の面に、プリプレグと銅
箔とを重ね、加熱・加圧して積層一体化し、接続の必要
な箇所に孔をあけ、その孔内壁にめっきによる金属層を
形成し、回路となる外層銅箔の箇所にレジストを形成
し、不要な外層銅箔をエッチング除去することを特徴と
する配線板の製造法。18. A portion required for connection between circuit layers of a laminated board in which a copper foil is laminated on both surfaces of the insulating substrate which is not completely cured and is laminated by heating and pressurizing on an inner layer circuit substrate. , The copper foil only around the place to be drilled is removed to the extent that the insulating substrate is not exposed to form a metal recess around the hole, and the recess is filled with a fluid conductive substance. Fixing a fluid conductive substance, removing the conductive substance rising from the surface around the hole, and forming a resist at a necessary portion of the circuit conductor containing the fixed conductive substance,
Using the conductor exposed from the resist removed by etching, on at least one surface on it, prepreg and copper foil are overlaid, laminated by heating and pressurizing, and holes are formed at the points where connection is required. A method for manufacturing a wiring board, comprising forming a metal layer on the inner wall of the hole by plating, forming a resist on a portion of the outer layer copper foil to be a circuit, and etching away unnecessary outer layer copper foil. 【請求項１９】 内層回路基板に、完全に硬化していな
い絶縁基板の両方の面に、コアとなる金属層と少なくと
も一方の面に形成された銅層の２層以上の金属層であっ
て、コアとなる金属層は銅層と除去条件が異なるもので
ある金属箔を重ねて加熱・加圧して積層一体化した積層
板の、回路層間の接続に必要な箇所の、孔をあける予定
の箇所の周囲のみの銅層のみを除去し、孔周囲に金属製
の凹みを形成し、その凹みに、流動性の導電性物質を充
填し、流動性の導電性物質を固定し、孔周囲の面より盛
り上がった前記導電性物質を除去し、その固定した導電
性物質を含む回路導体の必要な箇所にレジストを形成
し、レジストから露出した導体をエッチング除去したも
のを用い、その上の少なくとも一方の面に、プリプレグ
と銅箔とを重ね、加熱・加圧して積層一体化し、接続の
必要な箇所に孔をあけ、その孔内壁にめっきによる金属
層を形成し、回路となる外層銅箔の箇所にレジストを形
成し、不要な外層銅箔をエッチング除去することを特徴
とする配線板の製造法。19. An inner layer circuit board comprising two or more metal layers, a metal layer serving as a core and a copper layer formed on at least one surface on both surfaces of an insulating substrate which is not completely cured. The core metal layer has different removal conditions from the copper layer. Metal foils are stacked and heated / pressurized to form a laminate. Only the copper layer around the area is removed, a metal depression is formed around the hole, and a fluid conductive substance is filled in the depression, and the fluid conductive substance is fixed, and The conductive material that has risen from the surface is removed, a resist is formed at a required location of the circuit conductor containing the fixed conductive material, and the conductor exposed from the resist is removed by etching, and at least one of them is used. On the surface of the prepreg and copper foil and heat・ Pressurize and integrate to form a hole in the place where connection is required, form a metal layer by plating on the inner wall of the hole, form a resist on the place of the outer copper foil to be the circuit, and remove unnecessary outer copper foil. A method for manufacturing a wiring board, which comprises removing by etching. 【請求項２０】 内層回路基板に、前記完全に硬化して
いない絶縁基板の両方の面に銅箔を重ねて加熱・加圧し
て積層一体化した積層板の、回路層間の接続に必要な箇
所の、孔をあける予定の箇所の周囲のみの銅箔を前記絶
縁基板が露出しない程度に除去して孔周囲に金属製の凹
みを形成し、その凹みに、流動性の導電性物質を充填
し、流動性の導電性物質を固定し、孔周囲の面より盛り
上がった前記導電性物質を除去し、その固定した導電性
物質を含む回路導体の必要な箇所にレジストを形成し、
レジストから露出した導体をエッチング除去したものを
用い、その上の少なくとも一方の面に、プリプレグと銅
箔とを重ね、加熱・加圧して積層一体化し、その内層回
路の導電性物質を充填した凹みのうち少なくとも１箇所
に、内層回路と外層回路とを接続する孔をあけ、かつ、
その孔径が、前記内層回路の導電性物質を充填した凹み
の直径よりも小さいものであって、その後、内層回路と
外層回路とを接続する孔の周囲のみの銅箔を前記プリプ
レグが露出しない程度に除去して孔周囲に金属製の凹み
を形成し、その凹み及び孔内に、流動性の導電性物質を
充填することを特徴とする配線板の製造法。20. A portion of a laminated board in which copper foil is laminated on both surfaces of the insulating substrate which is not completely cured on an inner-layer circuit substrate, and which is laminated by heating and pressurization, which are necessary for connection between circuit layers. , The copper foil only around the place to be drilled is removed to the extent that the insulating substrate is not exposed to form a metal recess around the hole, and the recess is filled with a fluid conductive substance. Fixing a fluid conductive substance, removing the conductive substance rising from the surface around the hole, and forming a resist at a necessary portion of the circuit conductor containing the fixed conductive substance,
The conductor exposed from the resist is removed by etching, and the prepreg and copper foil are laid on at least one surface on top of them, and they are laminated by heating and pressing to form a dent filled with a conductive substance in the inner layer circuit. A hole for connecting the inner layer circuit and the outer layer circuit is formed in at least one of the
The hole diameter is smaller than the diameter of the recess filled with the conductive material of the inner layer circuit, and then the prepreg does not expose the copper foil only around the hole connecting the inner layer circuit and the outer layer circuit. A method for manufacturing a wiring board, characterized in that a metal-made recess is formed around the hole to fill the recess and the hole with a fluid conductive substance. 【請求項２１】 内層回路基板に、前記完全に硬化して
いない絶縁基板の両方の面に銅箔を重ねて加熱・加圧し
て積層一体化した積層板の、回路層間の接続に必要な箇
所の、孔をあける予定の箇所の周囲のみの銅箔を前記絶
縁基板が露出しない程度に除去して孔周囲に金属製の凹
みを形成し、その凹みに、流動性の導電性物質を充填
し、流動性の導電性物質を固定し、孔周囲の面より盛り
上がった前記導電性物質を除去し、その固定した導電性
物質を含む回路導体の必要な箇所にレジストを形成し、
レジストから露出した導体をエッチング除去したものを
用い、その上の少なくとも一方の面に、プリプレグと前
記コアとなる金属層と少なくとも一方の面に形成された
銅層の２層以上の金属層であって、コアとなる金属層は
銅層と除去条件が異なるものである金属箔とを重ね、加
熱・加圧して積層一体化し、その内層回路の導電性物質
を充填した凹みのうち少なくとも１箇所に、内層回路と
外層回路とを接続する孔をあけ、かつ、その孔径が、前
記内層回路の導電性物質を充填した凹みの直径よりも小
さいものであって、その孔の周囲のみの銅層みを除去
し、孔周囲に金属製の凹みを形成し、その凹み及び孔内
に流動性の導電性物質を充填し、流動性の導電性物質を
固定し、孔周囲の面より盛り上がった前記導電性物質を
除去し、その固定した導電性物質を含む回路導体の必要
な箇所にレジストを形成し、レジストから露出した導体
をエッチング除去することを特徴とする配線板の製造
法。21. A portion required for connection between circuit layers of a laminated board in which a copper foil is laminated on both surfaces of the insulating substrate which is not completely cured and is laminated by heating and pressurizing the inner layer circuit substrate. , The copper foil only around the place to be drilled is removed to the extent that the insulating substrate is not exposed to form a metal recess around the hole, and the recess is filled with a fluid conductive substance. Fixing a fluid conductive substance, removing the conductive substance rising from the surface around the hole, and forming a resist at a necessary portion of the circuit conductor containing the fixed conductive substance,
A conductor obtained by etching away the conductor exposed from the resist is used, and on at least one surface thereof, there are two or more metal layers of a metal layer serving as the prepreg and the core and a copper layer formed on at least one surface. Then, the metal layer to be the core is laminated with a copper layer and a metal foil whose removal conditions are different, and is heated and pressed to be laminated and integrated, and at least one of the recesses filled with the conductive substance of the inner layer circuit is formed. , A hole for connecting the inner layer circuit and the outer layer circuit is formed, and the diameter of the hole is smaller than the diameter of the recess filled with the conductive substance of the inner layer circuit, and only the copper layer around the hole is formed. To form a metal dent around the hole, fill the dent and the hole with a fluid conductive substance, fix the fluid conductive substance, and raise the conductivity above the surface around the hole. Remove the volatile substances and fix them A resist is formed to the required portion of the circuit conductor comprising a conductive material, manufacturing method of a wiring board, wherein a conductor exposed from the resist is removed by etching. 【請求項２２】 内層回路板として、完全に硬化してい
ない絶縁基板の両方の面に、コアとなる金属層と少なく
とも一方の面に形成された銅層の２層以上の金属層であ
って、コアとなる金属層は銅層と除去条件が異なるもの
である金属箔を重ねて加熱・加圧して積層一体化した積
層板の、回路層間の接続に必要な箇所の、孔をあける予
定の箇所の周囲のみの銅層もしくは前記コアとなる金属
層のみを除去し、孔周囲に金属製の凹みを形成し、その
凹みに、流動性の導電性物質を充填し、流動性の導電性
物質を固定し、孔周囲の面より盛り上がった前記導電性
物質を除去し、その固定した導電性物質を含む回路導体
の必要な箇所にレジストを形成し、レジストから露出し
た導体をエッチング除去したものを使用し、その上の少
なくとも一方の面に、プリプレグと銅箔とを重ね、加熱
・加圧して積層一体化し、その内層回路の導電性物質を
充填した凹みのうち少なくとも１箇所に、内層回路と外
層回路とを接続する孔をあけ、かつ、その孔径が、前記
内層回路の導電性物質を充填した凹みの直径よりも小さ
いものであって、その後、内層回路と外層回路とを接続
する孔の周囲のみの銅箔を前記プリプレグが露出しない
程度に除去して孔周囲に金属製の凹みを形成し、その凹
み及び孔内に、流動性の導電性物質を充填することを特
徴とする配線板の製造法。22. As the inner layer circuit board, two or more metal layers including a metal layer to be a core and a copper layer formed on at least one surface on both surfaces of an insulating substrate which is not completely cured, The core metal layer has different removal conditions from the copper layer. Metal foils are stacked and heated / pressurized to form a laminate. Only the copper layer around the location or the metal layer to be the core is removed, a metal depression is formed around the hole, and the depression is filled with a fluid conductive substance, so that the fluid conductive substance Is fixed, the conductive material that has risen from the surface around the hole is removed, a resist is formed at a necessary portion of the circuit conductor containing the fixed conductive material, and the conductor exposed from the resist is removed by etching. Use and on at least one side of it , A prepreg and a copper foil are stacked, heated and pressed to be laminated and integrated, and a hole for connecting the inner layer circuit and the outer layer circuit is formed in at least one of the recesses filled with the conductive substance of the inner layer circuit, and , The diameter of the hole is smaller than the diameter of the recess filled with the conductive substance of the inner layer circuit, and then the prepreg does not expose the copper foil only around the hole connecting the inner layer circuit and the outer layer circuit. A method for manufacturing a wiring board, which comprises removing metal to a certain extent to form a metal recess around the hole and filling the recess and the hole with a fluid conductive substance. 【請求項２３】 内層回路板として、完全に硬化してい
ない絶縁基板の両方の面に、コアとなる金属層と少なく
とも一方の面に形成された銅層の２層以上の金属層であ
って、コアとなる金属層は銅層と除去条件が異なるもの
である金属箔を重ねて加熱・加圧して積層一体化した積
層板の、回路層間の接続に必要な箇所の、孔をあける予
定の箇所の周囲のみの銅層もしくは前記コアとなる金属
層のみを除去し、孔周囲に金属製の凹みを形成し、その
凹みに、流動性の導電性物質を充填し、流動性の導電性
物質を固定し、孔周囲の面より盛り上がった前記導電性
物質を除去し、その固定した導電性物質を含む回路導体
の必要な箇所にレジストを形成し、レジストから露出し
た導体をエッチング除去したものを使用し、その上の少
なくとも一方の面に、プリプレグと前記コアとなる金属
層と少なくとも一方の面に形成された銅層の２層以上の
金属層であって、コアとなる金属層は銅層と除去条件が
異なるものである金属箔とを重ね、加熱・加圧して積層
一体化し、その内層回路の導電性物質を充填した凹みの
うち少なくとも１箇所に、内層回路と外層回路とを接続
する孔をあけ、かつ、その孔径が、前記内層回路の導電
性物質を充填した凹みの直径よりも小さいものであっ
て、その孔の周囲のみの銅層みを除去し、孔周囲に金属
製の凹みを形成し、その凹み及び孔内に流動性の導電性
物質を充填し、流動性の導電性物質を固定し、孔周囲の
面より盛り上がった前記導電性物質を除去し、その固定
した導電性物質を含む回路導体の必要な箇所にレジスト
を形成し、レジストから露出した導体をエッチング除去
することを特徴とする配線板の製造法。23. An inner layer circuit board comprising two or more metal layers including a metal layer serving as a core and a copper layer formed on at least one surface on both surfaces of an insulating substrate which is not completely cured. The core metal layer has different removal conditions from the copper layer. Metal foils are stacked and heated / pressurized to form a laminate. Only the copper layer around the location or the metal layer to be the core is removed, a metal depression is formed around the hole, and the depression is filled with a fluid conductive substance, so that the fluid conductive substance Is fixed, the conductive material that has risen from the surface around the hole is removed, a resist is formed at a necessary portion of the circuit conductor containing the fixed conductive material, and the conductor exposed from the resist is removed by etching. Use and on at least one side of it A metal foil having two or more layers of a prepreg, a metal layer to be the core, and a copper layer formed on at least one surface, the metal layer to be the core being different in removal condition from the copper layer; Are laminated by heating and pressurizing, and a hole for connecting the inner layer circuit and the outer layer circuit is formed in at least one of the recesses of the inner layer circuit filled with the conductive substance, and the hole diameter is It is smaller than the diameter of the recess filled with the conductive material of the inner layer circuit, removes only the copper layer around the hole, forms a metal recess around the hole, and Fill the fluid conductive material, fix the fluid conductive material, remove the conductive material that rises from the surface around the hole, and remove the conductive material at the necessary place of the circuit conductor containing the fixed conductive material. Form a resist and remove the conductor exposed from the resist. Etching process of the wiring board, and removing. 【請求項２４】 前記金属製の凹み及び孔内に流動性の
導電性物質を充填する工程の後に、流動性の導電性物質
を固定し、孔周囲の面より盛り上がった前記導電性物質
を除去し、その固定した導電性物質を含む回路導体の必
要な箇所にレジストを形成し、レジストから露出した導
体をエッチング除去することを特徴とする請求項１１〜
２３のうちいずれかに記載の配線板の製造法。24. After the step of filling a fluid conductive material into the metallic depressions and holes, the fluid conductive material is fixed and the conductive material raised from the surface around the hole is removed. 11. A resist is formed on a necessary portion of the circuit conductor containing the fixed conductive material, and the conductor exposed from the resist is removed by etching.
23. The method for manufacturing a wiring board according to any one of 23. 【請求項２５】 前記完全に硬化していない絶縁基板
が、ガラス布、紙等の強化繊維にエポキシ樹脂、フェノ
ール樹脂等を含浸したものであることを特徴とする請求
項３、５、７、９、および１１〜２４のうちいずれかに
記載の配線板の製造法。25. The insulative substrate which is not completely cured is one in which a reinforcing fiber such as glass cloth or paper is impregnated with an epoxy resin, a phenol resin, or the like. 9. The method for manufacturing a wiring board according to any one of 9 and 11 to 24. 【請求項２６】 前記完全に硬化していない絶縁基板
が、ポリエステルフィルム、ポリイミドフィルム等の可
撓性絶縁フィルムの表面に接着剤を塗布したものである
ことを特徴とする請求項３、５、７、９、および１１〜
２４のうちいずれかに記載の配線板の製造法。26. The insulative substrate which is not completely cured is a flexible insulating film such as a polyester film or a polyimide film coated with an adhesive on the surface thereof. 7, 9, and 11-
25. The method for manufacturing a wiring board according to any one of 24. 【請求項２７】 前記コアとなる金属層と少なくとも一
方の面に形成された銅層の２層以上の金属層のコアとな
る金属層に、ニッケル、ニッケル−リン合金、ニッケル
−硼素合金、並びにはんだのうちから選択されたものを
使用することを特徴とする請求項５、６、９、１３、１
５〜１７、１９、および２１〜２４のうちいずれかに記
載の配線板の製造法。27. Nickel, a nickel-phosphorus alloy, a nickel-boron alloy, and a metal layer to be a core of two or more metal layers of a metal layer to be the core and a copper layer formed on at least one surface thereof, A solder selected from solders is used.
The method for manufacturing a wiring board according to any one of 5 to 17, 19 and 21 to 24. 【請求項２８】 前記導電性物質が、銀ペースト、銅ペ
ースト等のように、金属粒子とバインダー及び溶剤から
なるものであって、熱によって溶剤を蒸発させ、バイン
ダーを硬化させることによって固定させるものであるこ
とを特徴とする請求項３〜２７のうちいずれかに記載の
配線板の製造法。28. The conductive substance is composed of metal particles, a binder and a solvent, such as a silver paste or a copper paste, and is fixed by evaporating the solvent by heat and curing the binder. 28. The method for manufacturing a wiring board according to any one of claims 3 to 27, wherein 【請求項２９】 前記導電性物質が、はんだ等の低い融
点を有する金属粒子と溶剤とからなるものであって、孔
周囲の凹みと孔内に充填した後に、熱によって溶剤を蒸
発させると共に、低い融点を有する金属粒子を溶融し、
冷却して固定させるものであることを特徴とする請求項
３〜２７のうちいずれかに記載の配線板の製造法。29. The conductive substance is composed of a solvent and metal particles having a low melting point, such as solder, and a solvent, and the solvent is evaporated by heat after filling the recess around the hole and the hole, Melting metal particles having a low melting point,
The method for manufacturing a wiring board according to claim 3, wherein the wiring board is cooled and fixed. 【請求項３０】 前記導電性物質を、はんだ等の低い融
点を有する金属粒子と溶剤とからなるものとし、孔周囲
の凹みと孔内に充填した後に、熱によって溶剤を蒸発さ
せると共に、低い融点を有する金属粒子を溶融し、冷却
して固定させる際に、金属板に耐熱性フィルムを貼りあ
わせた積層板の耐熱性フィルム側に前記導電性物質を充
填した積層板を押しつけて行なうことを特徴とする請求
項２９に記載の配線板の製造法。30. The conductive substance is composed of metal particles having a low melting point, such as solder, and a solvent, and after filling the recesses around the hole and the hole, the solvent is evaporated by heat and the melting point is low. When melting and cooling and fixing the metal particles having, a laminated plate filled with the conductive substance is pressed against the heat resistant film side of the laminated plate in which the heat resistant film is attached to the metal plate. The method for manufacturing a wiring board according to claim 29.