JPH0524217B2 - - Google Patents
Info
- Publication number
- JPH0524217B2 JPH0524217B2 JP63214527A JP21452788A JPH0524217B2 JP H0524217 B2 JPH0524217 B2 JP H0524217B2 JP 63214527 A JP63214527 A JP 63214527A JP 21452788 A JP21452788 A JP 21452788A JP H0524217 B2 JPH0524217 B2 JP H0524217B2
- Authority
- JP
- Japan
- Prior art keywords
- alloy
- content
- connectors
- terminals
- punching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 21
- 238000004080 punching Methods 0.000 claims description 15
- 229910052710 silicon Inorganic materials 0.000 claims description 7
- 229910052749 magnesium Inorganic materials 0.000 claims description 6
- 229910052718 tin Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 229910052745 lead Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 239000012535 impurity Substances 0.000 claims description 2
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000000956 alloy Substances 0.000 description 13
- 230000000694 effects Effects 0.000 description 9
- 229910000679 solder Inorganic materials 0.000 description 5
- 229910045601 alloy Inorganic materials 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000005096 rolling process Methods 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 238000000137 annealing Methods 0.000 description 2
- 229910052796 boron Inorganic materials 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 229910052761 rare earth metal Inorganic materials 0.000 description 2
- 238000009864 tensile test Methods 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- 229910000967 As alloy Inorganic materials 0.000 description 1
- 229910006680 Si—Zn—Sn Inorganic materials 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- 229910052790 beryllium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003610 charcoal Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005097 cold rolling Methods 0.000 description 1
- 238000009749 continuous casting Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Landscapes
- Conductive Materials (AREA)
Description
〔産業上の利用分野〕
この発明は、端子・コネクタの製造に際して用
いられる打抜金型の摩耗がきわめて少なく、した
がつて、打抜金型の使用寿命の延命化を可能とす
るばかりでなく、端子・コネクタに要求される強
度、ばね性、耐熱クリープ性、およびはんだの耐
熱剥離性を具備したCu合金に関するものである。
〔従来の技術〕
一般に、端子・コネクタは、Cu合金として、
特開昭63−76839号公報に記載されるNi、Si、
Zn、およびCaを主要合金成分とし、これにMg、
Ｂ、Cr、Mn、Co、希土類元素、Al、Sn、およ
びTiのうちの１種または２種以上を含有させた
Cu合金や、特開昭63−62834号公報に記載される
NiおよびSiを主要合金成分とし、これにZn、Ｐ、
Sn、As、Cr、Mg、Mn、Sb、Fe、Co、Al、
Ti、Zr、Be、Ag、Pb、Ｂ、および希土類元素
のうちの１種または２種以上を含有させたCu合
金などを用い、これらのCu合金の板材あるいは
条材から金型を用いて所定形状の端子・コネクタ
素材を打抜加工し、ついで前記打抜加工と同時
に、あるいは別工程として前記素材を最終形状に
プレス成形する基本工程によつて製造されてい
る。
〔発明が解決しようとする課題〕
しかし、上記の従来Cu合金においては、これ
の板材あるいは条材の金型による打抜加工に際し
て、金型の摩耗（打抜金型摩耗）がはやく、寸法
精度の面から金型の使用寿命が短かくならざるを
得ないのが現状である。
〔課題を解決するための手段〕
そこで、本発明者等は、上述のような観点か
ら、打抜金型を極力摩耗させない端子・コネクタ
用Cu合金を開発すべく研究を行なつた結果、Cu
−Ni−Si−Zn−Sn系合金に、Mg、Ca、および
Pbを共存含有させると、金型による打抜加工に
際して金型の摩耗が著しく低減するようになり、
さらに合金成分として含有するNi、Si、Zn、お
よびSnによつて端子・コネクタに要求される強
度、ばね性、耐熱クリープ性、およびはんだの耐
熱剥離性を具備するようになるという知見を得た
のである。
この発明は、上記知見にもとづいてなされたも
のであつて、重量％で（以下％は重量％を示す）、
Ni：0.5〜３％、Si：0.02〜0.7％、Zn：0.1〜３
％、Sn：0.1〜0.9％、Mg：0.001〜0.2％、Ca：
0.001〜0.01％、Pb：0.001〜0.01％、
を含有し、残りがCuと不可避不純物からなる組
成を有する打抜金型摩耗の少ない端子・コネクタ
用Cu合金に特徴を有するものである。
つぎに、この発明のCu合金の成分組成を上記
の通りに限定した理由を説明する。
(a) NiおよびSi
これらの成分は、共存した状態で化合物を形
成し、もつて導電性の大幅な低下なく、強度を
向上させると共に、軟化温度を高めて、耐熱ク
リープ性を向上させる作用をもつが、その含有
量が、Ni：0.5％未満でも、またSi：0.02％未
満でも化合物の形成が不十分で、前記作用に所
望の効果が得られず、一方Niの含有量が３％
を越えても、またSiの含有量が0.7％を越えて
も熱間加工性が低下するようになることから、
その含有量を、それぞれNi：0.5〜３％、Si：
0.02〜0.7％と定めた。
(b) Zn
Zn成分には、はんだの耐熱剥離性を向上さ
せるほか、鋳造性を改善する作用があるが、そ
の含有量が0.1％未満では前記作用に所望の効
果が得られず、一方その含有量が３％を越える
と、はんだ付け性が損なわれるようになること
から、その含有量を0.1〜３％と定めた。
(c) Sn
Sn成分には、ばね性を一段と向上させる作
用があるが、その含有量が0.1％未満では所望
のばね性を確保することができず、一方その含
有量が0.9％を越えると導電性に低下傾向が現
われるようになることから、その含有量を0.1
〜0.9％と定めた。
(d) Mg、Ca、およびPb
これらの成分には、３者が共存した状態で打
抜金型の摩耗を著しく低減する作用があり、し
たがつてこれら３成分のうちのいずれかの成分
でも所定量含有しない場合、すなわちいずれか
の成分でも、その含有量が0.001％未満になる
と、打抜金型の摩耗低減効果が得られず、一方
その含有量が、Mgにあつては0.2％を越える
と、Cu合金溶湯調製後の鋳塊への鋳造性が悪
化し、鋳塊欠陥が増加するようになり、また
Caにあつては0.01％を越えると、添加含有時の
酸化消耗が激しく、含有歩留が著しく低下する
ようになつて経済的でなく、さらにPbにあつ
ては0.01％を越えると、鋳造時に結晶粒界に析
出するようになり、熱間圧延性が低下するよう
になることから、その含有量をそれぞれMg：
0.001〜0.2％、Ca：0.001〜0.01％、および
Pb：0.001〜0.01％と定めた。
〔実施例〕
つぎに、この発明のCu合金を実施例により具
体的に説明する。
通常の低周波溝型溶解炉を用い、木炭被覆下の
大気雰囲気中で、それぞれ第１表に示されるCu
合金溶湯を調製し、半連続鋳造法により厚さ：
160mm×幅：450mm×長さ：2400mmの寸法をもつた
鋳塊に鋳造し、この鋳塊に、750〜900℃の範囲内
の所定の圧延開始温度で熱間圧延を施して、厚
さ：10mmの熱延板とした後、直ちに水冷し、スケ
ール除去の面削を行ない、ついでこの熱延板に、
冷間圧延と焼鈍とを繰り返し施し、50％の圧延率
にて仕上げ圧延を行なつて厚さ：0.25mmの条材と
し、最終的に250〜550℃の範囲内の所定温度に１
時間保持の条件で焼鈍を施すことによつて本発明
Cu合金材１〜10および比較Cu合金材１〜８を製
造した。
なお、比較Cu合金材１〜８は、いずれも構成
成分のうちのいずれかの成分含有量（第１表に※
印を付す）がこの発明の範囲から外れた組成をも
つものである。
つぎに、この結果得られた各種のCu合金材に
ついて、引張試験、はんだの熱剥離試験、および
打抜金型摩耗試験を行ない、かつばね限界値を測
定すると共に、応力緩和率を算定し、耐熱クリー
プ性を評価した。
なお、引張試験は、圧延方向に平行に採取した
JIS5号試験片を用いて行ない、引張強さと伸びを
測定した。
[Industrial Application Field] This invention not only allows for extremely little wear on the punching dies used in the manufacture of terminals and connectors, but also extends the useful life of the punching dies. This invention relates to a Cu alloy that has the strength, spring properties, heat creep resistance, and heat peeling resistance of solder required for terminals and connectors. [Prior art] Generally, terminals and connectors are made of Cu alloy.
Ni, Si, described in Japanese Patent Application Laid-open No. 63-76839
The main alloy components are Zn and Ca, and Mg,
Contains one or more of B, Cr, Mn, Co, rare earth elements, Al, Sn, and Ti.
Cu alloy and described in Japanese Patent Application Laid-Open No. 63-62834
Ni and Si are the main alloy components, and Zn, P,
Sn, As, Cr, Mg, Mn, Sb, Fe, Co, Al,
A Cu alloy containing one or more of Ti, Zr, Be, Ag, Pb, B, and rare earth elements is used, and a plate or strip of these Cu alloys is molded into a specified shape. It is manufactured by a basic process of punching a shaped terminal/connector material and then press-forming the material into the final shape either simultaneously with the punching or as a separate process. [Problems to be Solved by the Invention] However, when using the conventional Cu alloys mentioned above, when punching plates or strips using a die, the die wears quickly (punching die wear), and dimensional accuracy deteriorates. The current situation is that the service life of molds has to be shortened due to these reasons. [Means for Solving the Problems] Therefore, from the above-mentioned viewpoint, the present inventors conducted research to develop a Cu alloy for terminals and connectors that minimizes the wear of punching dies.
−Ni−Si−Zn−Sn alloy contains Mg, Ca, and
When Pb is co-contained, the wear of the mold during punching process is significantly reduced.
Furthermore, we obtained the knowledge that Ni, Si, Zn, and Sn contained as alloy components provide the strength, springiness, heat creep resistance, and heat peeling resistance of solder required for terminals and connectors. It is. This invention was made based on the above-mentioned knowledge, and in weight% (hereinafter % indicates weight%), Ni: 0.5 to 3%, Si: 0.02 to 0.7%, Zn: 0.1 to 3
%, Sn: 0.1-0.9%, Mg: 0.001-0.2%, Ca:
0.001-0.01%, Pb: 0.001-0.01%, and the rest is Cu and unavoidable impurities.The Cu alloy for terminals and connectors is characterized by less wear on the punching die. Next, the reason why the composition of the Cu alloy of the present invention is limited as described above will be explained. (a) Ni and Si These components coexist to form a compound and have the effect of improving strength, increasing the softening temperature, and improving heat creep resistance without significantly reducing conductivity. However, even if the content of Ni is less than 0.5% or less than 0.02% of Si, the formation of the compound is insufficient and the desired effect cannot be obtained.
Even if the Si content exceeds 0.7%, the hot workability decreases.
The content is Ni: 0.5-3%, Si:
It was set at 0.02-0.7%. (b) Zn The Zn component has the effect of improving the heat peeling resistance of the solder as well as the castability, but if its content is less than 0.1%, the desired effect cannot be obtained; If the content exceeds 3%, solderability will be impaired, so the content was set at 0.1 to 3%. (c) Sn The Sn component has the effect of further improving spring properties, but if its content is less than 0.1%, the desired spring properties cannot be secured, while if its content exceeds 0.9%, Since the conductivity tends to decrease, its content is reduced to 0.1.
It was set at ~0.9%. (d) Mg, Ca, and Pb These three components have the effect of significantly reducing the wear of the punching die when they coexist; therefore, even if any one of these three components If the specified amount of Mg is not contained, that is, if the content of any component is less than 0.001%, the wear reduction effect of the punching die cannot be obtained.On the other hand, if the content of Mg is less than 0.2% If it exceeds the limit, the castability into an ingot after preparing the Cu alloy molten metal will deteriorate, ingot defects will increase, and
In the case of Ca, if it exceeds 0.01%, oxidation consumption will be severe when it is added and the content yield will drop significantly, making it uneconomical.Furthermore, in the case of Pb, if it exceeds 0.01%, it will cause severe oxidation consumption when it is added. Since Mg begins to precipitate at grain boundaries and reduces hot rolling properties, the Mg content is
0.001-0.2%, Ca: 0.001-0.01%, and
Pb: 0.001 to 0.01%. [Example] Next, the Cu alloy of the present invention will be specifically explained with reference to Examples. Using an ordinary low-frequency groove-type melting furnace, the Cu melt shown in Table 1 was melted in an atmospheric atmosphere under a charcoal coating.
Prepare molten alloy and use semi-continuous casting method to obtain thickness:
It is cast into an ingot with dimensions of 160 mm x width: 450 mm x length: 2400 mm, and this ingot is hot-rolled at a predetermined rolling start temperature within the range of 750 to 900°C, resulting in a thickness of: After making a 10mm hot-rolled sheet, it was immediately cooled with water and surface milled to remove scale.
Cold rolling and annealing are repeated, and finish rolling is performed at a rolling ratio of 50% to obtain a strip with a thickness of 0.25 mm.
The present invention is achieved by annealing under conditions of time holding.
Cu alloy materials 1 to 10 and comparative Cu alloy materials 1 to 8 were manufactured. In addition, comparative Cu alloy materials 1 to 8 all have the content of one of the constituent components (as shown in Table 1).
(marked) have compositions outside the scope of this invention. Next, the various Cu alloy materials obtained as a result were subjected to a tensile test, a solder thermal peel test, and a punching die wear test, and the spring limit value was measured and the stress relaxation rate was calculated. The heat-resistant creep property was evaluated. In addition, for the tensile test, samples were taken parallel to the rolling direction.
Tensile strength and elongation were measured using JIS No. 5 test pieces.
第１表に示される結果から、本発明Cu合金材
１〜10は、いずれもこれの打抜加工に用いられる
金型の摩耗が、従来端子・コネクタ用Cu合金材
と同等の金型平均摩耗率を示す比較Cu合金材５
〜８に比して著しく少なく、その上端子・コネク
タに要求される55Kgｆ／mm2以上の引張強さおよび
35Kgｆ／mm2以上のばね限界値を十分に余裕をもつ
て具備し、かつすぐれた耐熱クリープ性およびは
んだの耐熱剥離性を有するのに対して、比較Cu
合金材１〜８に見られるように、構成成分のうち
のいずれかの成分含有量でもこの発明の範囲から
低い方に外れると上記の特性のうちの少なくとも
いずれかの性質が劣つたものになることが明らか
である。
また、上記の本発明Cu合金材１〜10は、いず
れも端子・コネクタに要求される30％（IACS％）
以上の高い導電率を示した。
上述のように、この発明のCu合金は、端子・
コネクタに要求される強度、ばね性、耐熱クリー
プ性、およびはんだの耐熱剥離性を具備した上
で、端子・コネクタの製造に際して用いられる打
抜金型の摩耗を著しく低減することを可能とし、
打抜金型の使用寿命の延命化に寄与し、大なる経
済効果をもたらすなど工業上有用な特性を有する
のである。
From the results shown in Table 1, it can be seen that Cu alloy materials 1 to 10 of the present invention have the same average die wear as the conventional Cu alloy materials for terminals and connectors. Comparative Cu alloy material 5 showing the rate
〜8, and has a tensile strength of 55 Kgf/mm 2 or more required for terminals and connectors.
In comparison, Cu
As seen in Alloy Materials 1 to 8, if the content of any of the constituent components falls below the range of the present invention, at least one of the above properties will be inferior. That is clear. In addition, the above-mentioned Cu alloy materials 1 to 10 of the present invention all have a 30% (IACS%) required for terminals and connectors.
It showed high electrical conductivity. As mentioned above, the Cu alloy of this invention can be used for terminals and
In addition to providing the strength, springiness, heat creep resistance, and heat peeling resistance of solder required for connectors, it is possible to significantly reduce the wear of punching dies used in the manufacture of terminals and connectors.
It has industrially useful properties such as contributing to extending the useful life of punching dies and bringing about great economic effects.
Claims (1)
３％、Sn：0.1〜0.9％、Mg：0.001〜0.2％、
Ca：0.001〜0.01％、Pb：0.001〜0.01％、 を含有し、残りがCuと不可避不純物からなる組
成（以上重量％）を有することを特徴とする打抜
金型摩耗の少ない端子・コネクタ用Cu合金。[Claims] 1 Ni: 0.5 to 3%, Si: 0.02 to 0.7%, Zn: 0.1 to 3%
3%, Sn: 0.1-0.9%, Mg: 0.001-0.2%,
For terminals and connectors with low punching die wear, characterized by having a composition (weight %) containing Ca: 0.001 to 0.01%, Pb: 0.001 to 0.01%, and the remainder consisting of Cu and unavoidable impurities. Cu alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21452788A JPH0266130A (en) | 1988-08-29 | 1988-08-29 | Cu alloy for terminal and connector having less wear or blanking die |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21452788A JPH0266130A (en) | 1988-08-29 | 1988-08-29 | Cu alloy for terminal and connector having less wear or blanking die |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0266130A JPH0266130A (en) | 1990-03-06 |
| JPH0524217B2 true JPH0524217B2 (en) | 1993-04-07 |
Family
ID=16657200
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21452788A Granted JPH0266130A (en) | 1988-08-29 | 1988-08-29 | Cu alloy for terminal and connector having less wear or blanking die |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0266130A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2503793B2 (en) * | 1991-03-01 | 1996-06-05 | 三菱伸銅株式会社 | Cu alloy plate material for electric and electronic parts, which has the effect of suppressing the wear of punching dies |
| JP3739214B2 (en) * | 1998-03-26 | 2006-01-25 | 株式会社神戸製鋼所 | Copper alloy sheet for electronic parts |
| JP6355672B2 (en) * | 2016-03-31 | 2018-07-11 | Ｊｘ金属株式会社 | Cu-Ni-Si based copper alloy and method for producing the same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127842A (en) * | 1984-11-24 | 1986-06-16 | Kobe Steel Ltd | Copper alloy for terminal and connector and its manufacture |
| JPS6376839A (en) * | 1986-09-18 | 1988-04-07 | Furukawa Electric Co Ltd:The | Copper alloy for electronic equipment and its production |
| JPS63130739A (en) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | High strength and high conductivity copper alloy for semiconductor device lead material or conductive spring material |
-
1988
- 1988-08-29 JP JP21452788A patent/JPH0266130A/en active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61127842A (en) * | 1984-11-24 | 1986-06-16 | Kobe Steel Ltd | Copper alloy for terminal and connector and its manufacture |
| JPS6376839A (en) * | 1986-09-18 | 1988-04-07 | Furukawa Electric Co Ltd:The | Copper alloy for electronic equipment and its production |
| JPS63130739A (en) * | 1986-11-20 | 1988-06-02 | Nippon Mining Co Ltd | High strength and high conductivity copper alloy for semiconductor device lead material or conductive spring material |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0266130A (en) | 1990-03-06 |
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