JPH05230180A - Epoxy resin composition for semiconductor sealing - Google Patents
Epoxy resin composition for semiconductor sealingInfo
- Publication number
- JPH05230180A JPH05230180A JP3153168A JP15316891A JPH05230180A JP H05230180 A JPH05230180 A JP H05230180A JP 3153168 A JP3153168 A JP 3153168A JP 15316891 A JP15316891 A JP 15316891A JP H05230180 A JPH05230180 A JP H05230180A
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- epoxy resin
- resin composition
- epoxy
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- specific
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、半導体封止用のエポキ
シ樹脂組成物に関するものである。特に、吸湿半田処理
時のクラック性に優れた半導体封止用エポキシ樹脂組成
物に関するものである。FIELD OF THE INVENTION The present invention relates to an epoxy resin composition for semiconductor encapsulation. In particular, the present invention relates to an epoxy resin composition for semiconductor encapsulation, which is excellent in cracking property during moisture absorption soldering treatment.
【０００２】[0002]
【従来技術】近年、ダイオ−ド、トランジスタ−、Ｉ
Ｃ，ＬＳＩなどの半導体や電子部品の封止方法として、
たとえばエポキシ樹脂やシリコン樹脂などの低圧トラン
スファ−成形による樹脂封止法が信頼性の向上とともに
大量生産や価格面で有利性から主流を占めている。中で
もエポキシ樹脂を用いた樹脂封止法においては、オルソ
クレゾ−ルノボラック型エポキシ樹脂を樹脂成分とし、
フェノ−ルノボラック樹脂を硬化剤成分とするエポキシ
樹脂組成物からなる成形材料が最も多く使用されてい
る。しかしながら、最近ＩＣ，ＬＳＩ、ＶＬＳＩなどの
半導体、電子部品の集積度が高密度化されるとともに、
半導体装置の成形品の薄肉化、表面実装のために、これ
までのエポキシ樹脂組成物では必ずしも十分に対応する
ことができなくなっている。2. Description of the Related Art In recent years, diodes, transistors, I
As a method for sealing semiconductors such as C and LSI and electronic parts,
For example, a resin encapsulation method by low-pressure transfer molding of epoxy resin, silicon resin, or the like has become the mainstream because of its improved reliability, mass production and price advantages. Among them, in the resin sealing method using an epoxy resin, orthocresol-novolac type epoxy resin as a resin component,
A molding material composed of an epoxy resin composition containing a phenol novolac resin as a curing agent component is most often used. However, with the recent increase in the integration density of semiconductors such as IC, LSI, and VLSI, and electronic parts,
Due to the thinning of molded articles of semiconductor devices and surface mounting, conventional epoxy resin compositions have not always been sufficient.
【０００３】たとえば、表面実装用半導体装置において
は、実装時に、半導体装置自身が、半田に直接浸漬され
るなど、急激に高温の環境下にさらされるため、半導体
装置にパッケ−ジクラックの発生が避けられない事態と
なっている。この現象は、成形品後、半導体装置が保管
中に吸湿した水分が、高温の半田に浸漬された際に、急
激に気化膨張し、封止樹脂がそれに耐えきれず、パッケ
−ジクラックを生じると考えらる。この対応として半導
体封止用エポキシ樹脂組成物について、耐熱性、吸湿性
向上などの検討からこれら特性の改良が特開平3-39323
号公報に開示されなされてきているが、特に低応力性と
ともに上記の耐吸湿半田クラック性の向上については今
だ十分に満足できる状況にはない。For example, in a semiconductor device for surface mounting, during mounting, the semiconductor device itself is rapidly exposed to a high-temperature environment such as being directly immersed in solder, so that generation of package cracks in the semiconductor device is avoided. It is a situation that cannot be done. This phenomenon occurs when the moisture absorbed during storage of the semiconductor device after the molded product is rapidly vaporized and expanded when immersed in high-temperature solder, and the sealing resin cannot withstand it, resulting in package cracks. I think about it. In response to this, improvement of these properties of the epoxy resin composition for semiconductor encapsulation has been made in consideration of improvements in heat resistance and hygroscopicity.
Although it has been disclosed in Japanese Patent Laid-Open Publication No. JP-A No. 2004-242242, the improvement of the above moisture absorption solder crack resistance as well as the low stress property is not yet sufficiently satisfactory.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、このような
事情に鑑みてなされたものであり、従来の半導体封止用
エポキシ樹脂組成物の欠点を改善し、低応力性の改善と
耐吸湿半田クラック性の向上を図ることのできる新規な
半導体封止用エポキシ樹脂組成物を提供することにあ
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and improves the drawbacks of the conventional epoxy resin composition for semiconductor encapsulation, improves the low stress property, and resists moisture absorption. It is an object of the present invention to provide a novel epoxy resin composition for semiconductor encapsulation that can improve solder cracking properties.
【０００５】[0005]
【課題を解決するための手段】本発明は、上記課題を解
決するためになされたもので、次の〜の成分、下
記の一般式〔１〕で表されるエポキシ樹脂、フェノ−
ル性水酸基を有する硬化剤、エポキシ基または、およ
び、ハイドロジエン基を有するポリオキシアルキレン変
性シリコーン：硬化性ポリオルガノシロキサンを１：９
９〜５０：５０の範囲からなるシリコーン重合体、無
機充填材を含有してなる半導体封止用エポキシ樹脂組成
物を提供することにある。The present invention has been made to solve the above-mentioned problems, and it comprises the following components (1) to (3), an epoxy resin represented by the following general formula [1], and a phenol resin.
Polyoxyalkylene-modified silicone having a curable hydroxyl group-containing curing agent, an epoxy group or a hydrogen group and a curable polyorganosiloxane at a ratio of 1: 9
Another object of the present invention is to provide a semiconductor encapsulating epoxy resin composition containing a silicone polymer in the range of 9 to 50:50 and an inorganic filler.
【０００６】[0006]
【化２】 [Chemical 2]
【０００７】以下、この発明を詳しく説明する。エポキ
シ樹脂としては、前記の一般式〔１〕で表されるエポキ
シ樹脂を用いる必要があり、その配合量はエポキシ樹脂
中に占める割合で５０重量％以上用いるのが好ましい。
５０重量％未満では低吸湿の効果が小さいからである。
なお、一般式〔１〕で表されるエポキシ樹脂以外に、フ
ェノ−ルノボラック型エポキシ樹脂、クレゾ−ルノボラ
ック型エポキシ樹脂、ビスフェノ−ルＡ型エポキシ樹
脂、ビスフェノ−ルＦ型エポキシ樹脂または、これらの
ハロゲン化エポキシ樹脂などの１種また、それ以上を併
用することができる。その中でも１分子中に２個以上の
エポキシ基をもつエポキシ樹脂で、エポキシ当量１８０
〜２２０、軟化点６０〜１００℃のものを単独、もしく
は組み合わせ、半導体封止用エポキシ樹脂組成物の５〜
３５重量％の範囲で用いると成形材料として混合、加
熱、溶融、混練するのに均一性が確保でき、良好に取扱
うことができる。The present invention will be described in detail below. As the epoxy resin, it is necessary to use the epoxy resin represented by the above general formula [1], and the blending amount thereof is preferably 50% by weight or more based on the proportion in the epoxy resin.
This is because if it is less than 50% by weight, the effect of low moisture absorption is small.
In addition to the epoxy resin represented by the general formula [1], a phenol novolac type epoxy resin, a cresol novolac type epoxy resin, a bisphenol A type epoxy resin, a bisphenol F type epoxy resin, or a halogen thereof. One or more such as a modified epoxy resin can be used in combination. Among them, an epoxy resin having two or more epoxy groups in one molecule has an epoxy equivalent of 180
, 220, and a softening point of 60 to 100 ° C., individually or in combination, of 5 to 5 of the epoxy resin composition for semiconductor encapsulation.
When it is used in the range of 35% by weight, uniformity can be ensured in mixing, heating, melting and kneading as a molding material, and it can be handled satisfactorily.
【０００８】フェノ−ル性水酸基を有する硬化剤とし
は、次に示す一般式〔２〕のナフタレン骨格を有するク
レゾール化合物やクレゾールノボラック、フェノ−ルノ
ボラック樹脂、クレゾールノボラック樹脂、ノリルフェ
ノ−ルノボラック樹脂などを１種又はそれ以上を併用す
ることができる。その中でも１分子中に２個以上の水酸
基をもつフェノ−ル樹脂であり、水酸基当量８０〜１２
０、軟化点６０〜１２０℃のものを単独、もしくは組み
合わせ、半導体封止用エポキシ樹脂組成物の２〜２５重
量％の範囲で用いると成形材料として混合、加熱、溶
融、混練するのに均一性が確保でき、良好に取扱うこと
ができる。Examples of the curing agent having a phenolic hydroxyl group include cresol compounds having a naphthalene skeleton represented by the following general formula [2], cresol novolac, phenol novolac resin, cresol novolac resin, and norylphenol novolac resin. One or more species can be used in combination. Among them, it is a phenol resin having two or more hydroxyl groups in one molecule and has a hydroxyl group equivalent of 80 to 12
0, having a softening point of 60 to 120 ° C., alone or in combination, used in the range of 2 to 25% by weight of the epoxy resin composition for semiconductor encapsulation, it is uniform in mixing, heating, melting and kneading as a molding material. Can be secured and can be handled satisfactorily.
【０００９】[0009]
【化３】 [Chemical 3]
【００１０】のシリコーン重合体としては、エポキシ
基または、および、ハイドロジエン基を有するポリオキ
シアルキレン変性シリコーン：硬化性ポリオルガノシロ
キサンを１：９９〜５０：５０の範囲で用いる必要があ
る。なぜなら、反応性シリコーンの使用では機械強度の
低下が大きく、シリコーンゴムの使用では低応力性が確
保できないからである。As the silicone polymer, it is necessary to use a polyoxyalkylene-modified silicone having an epoxy group or a hydrogen group and a curable polyorganosiloxane in the range of 1:99 to 50:50. This is because the use of reactive silicone causes a large decrease in mechanical strength, and the use of silicone rubber cannot ensure low stress.
【００１１】無機充填材としては、例えば、溶融シリ
カ、結晶シリカ、タルク、アルミナ、珪酸カルシュウ
ム、炭酸カルシュウム、窒化硅素などの粉末があげら
れ、単独、もしくは組み合わせて用いることができる。
しかし、電子部品の封止に供するものであるため、無機
質充填材５ｇを純水４５ｇで９５℃、２０時間抽出した
ときの抽出水の電気伝導度が１００μs ／cm以下の高純
度な無機質充填材が好ましい。特にシリカが好適であ
る。無機充填材の配合量は半導体封止用エポキシ樹脂組
成物の６５〜９５重量％の範囲で用いると成形材料とし
て混合、加熱、溶融、混練するのに均一性が確保でき、
良好に取扱うことができる。Examples of the inorganic filler include powders of fused silica, crystalline silica, talc, alumina, calcium silicate, calcium carbonate, silicon nitride and the like, which can be used alone or in combination.
However, since it is used for sealing electronic parts, the high-purity inorganic filler whose electric conductivity is 100 μs / cm or less when 5 g of inorganic filler is extracted with 45 g of pure water at 95 ° C. for 20 hours Is preferred. Silica is particularly preferable. When the compounding amount of the inorganic filler is within the range of 65 to 95% by weight of the epoxy resin composition for semiconductor encapsulation, it is possible to ensure uniformity in mixing, heating, melting and kneading as a molding material,
You can handle it well.
【００１２】硬化促進剤としては、リン系のトリフェニ
ルホスフィン、三級アミンのトリエタノールアミン、２
−ジメチルアミノメチルフェノ−ル、イミダゾール類の
２−メチルイミダゾール、２−メチル・４−エチルイミ
ダゾールなどを単独、または組み合わせて用いることが
できる。As the curing accelerator, phosphorus-based triphenylphosphine, tertiary amine triethanolamine, 2
-Dimethylaminomethylphenol, imidazoles such as 2-methylimidazole and 2-methyl-4-ethylimidazole can be used alone or in combination.
【００１３】なお、本発明の半導体封止用のエポキシ樹
脂組成物の配合成分としては、以上の他に、適当な添加
剤、硬化促進剤、難燃剤、離型剤、着色剤などを適用す
ることができる。As the compounding ingredients of the epoxy resin composition for semiconductor encapsulation of the present invention, in addition to the above, suitable additives, curing accelerators, flame retardants, release agents, colorants, etc. are applied. be able to.
【００１４】また、以上の配合成分からなる半導体封止
用エポキシ樹脂組成物を成形材料とするには、配合成分
を均一に混合し、加熱溶融、冷却、粉砕の通常のプロセ
スで製造することができ、この際に使用される装置たと
えば、ミキサー、ブレンダー、ニーダー、ロールなど通
常使用されるものをそのまま適用することができる。In order to use the epoxy resin composition for semiconductor encapsulation comprising the above-mentioned compounding ingredients as a molding material, the compounding ingredients are uniformly mixed and manufactured by a usual process of heating, melting, cooling and crushing. The apparatus used in this case, for example, a mixer, a blender, a kneader, a roll or the like which is normally used, can be applied as it is.
【００１５】次に本発明を実施例と比較例によって具体
的に説明する。Next, the present invention will be specifically described with reference to Examples and Comparative Examples.
【００１６】[0016]
実施例 １〜４と比較例１〜４ のエポキシ樹脂としては、前記一般式〔１〕のナフタ
レン骨格を有するエポキシ樹脂で日本化薬社製のEOCN-7
000 （エポキシ当量218 ）とオルソ−クレゾ−ルノボラ
ックエポキシ樹脂（エポキシ当量１９５、軟化点６５
℃、表１ではOCNエポキシ樹脂と省記する）をそれぞれ
単独または組合せて用いた。の硬化剤として、フェノ
−ルノボラック樹脂（水酸基当量１０４、軟化点８０
℃）を用いた。のシリコーン重合体として、シリコー
ン重合体（Ａ）はエポキシ基含有ポリオキシアルキレン
変性シリコーン（エポキシ当量2300）４０重量部と硬化
性ポリオルガノシロキサン（東レ社製SE1821）５０重量
部からなるもの、シリコーン重合体（Ｂ）はハイドロジ
エン基含有ポリオキシアルキレン変性シリコーン（水素
当量2500）１０重量部と硬化性ポリオルガノシロキサン
（東レ社製SE1821）９０重量部からなるもの、シリコー
ン重合体（Ｃ）は硬化性ポリオルガノシロキサン（東レ
社製SE1821）１００重量部からなるもの、シリコーンゴ
ム（平均粒子径２μｍ）、エポキシシリコーンオイル
（エポキシ当量 600）をそれぞれ用いた。、、の
各配合量は表１に示した。単位は重量部である。これ以
外の配合材料とその配合量は共通で次のものを用いた。
単位はいずれも重量部であり、以下「部」と省記する。The epoxy resin of Examples 1 to 4 and Comparative Examples 1 to 4 is an epoxy resin having a naphthalene skeleton represented by the general formula [1] and is EOCN-7 manufactured by Nippon Kayaku Co., Ltd.
000 (epoxy equivalent 218) and ortho-cresol novolac epoxy resin (epoxy equivalent 195, softening point 65
C., OCN epoxy resin in Table 1) is used alone or in combination. As a curing agent for a phenol novolac resin (hydroxyl group equivalent 104, softening point 80
C) was used. The silicone polymer (A) is composed of 40 parts by weight of an epoxy group-containing polyoxyalkylene-modified silicone (epoxy equivalent 2300) and 50 parts by weight of a curable polyorganosiloxane (SE1821 manufactured by Toray Industries Inc.). The compound (B) is composed of 10 parts by weight of a hydrogenoxy group-containing polyoxyalkylene-modified silicone (hydrogen equivalent 2500) and 90 parts by weight of a curable polyorganosiloxane (SE1821 manufactured by Toray Industries, Inc.), and the silicone polymer (C) is curable. One consisting of 100 parts by weight of polyorganosiloxane (SE1821 manufactured by Toray Industries, Inc.), silicone rubber (average particle diameter 2 μm), and epoxy silicone oil (epoxy equivalent 600) were used. The respective compounding amounts of, and are shown in Table 1. The unit is parts by weight. The following materials were used in common with the other compounding materials and their compounding amounts.
All units are parts by weight, and will be referred to as "parts" hereinafter.
【００１７】無機充填材としては、平均粒子径１４μ
m 、抽出水の電気伝導度３μs ／cmの溶融シリカを７３
９部、カップリング剤としてγ−グリシドキシプロピル
トリメトキシシランを５部、硬化促進剤としてトリフェ
ニルホスフィンを１．５部、難燃剤として三酸化アンチ
モンを２１部、臭素化エポキシ樹脂（エポキシ当量400
、軟化点65℃）を１４部、着色剤としてカ−ボンブラ
ックを２．５部、離型剤としてカルナバワックスを３部
それぞれ用いた。The inorganic filler has an average particle diameter of 14 μm.
m, the electric conductivity of the extracted water 3μs / cm fused silica 73μm / cm
9 parts, 5 parts of γ-glycidoxypropyltrimethoxysilane as a coupling agent, 1.5 parts of triphenylphosphine as a curing accelerator, 21 parts of antimony trioxide as a flame retardant, brominated epoxy resin (epoxy equivalent) 400
, A softening point of 65 ° C.), 14 parts of carbon black as a colorant, and 3 parts of carnauba wax as a release agent.
【００１８】以上の配合成分の配合量を各例ごとに均一
に混合し、ロ−ル温度100 ℃のミキシングロ−ルで加
熱、溶融、混練した後、冷却し、粉砕して各半導体封止
用エポキシ樹脂組成物の成形材料を得た。The above compounding amounts of the compounding ingredients are uniformly mixed in each example, and the mixture is heated, melted and kneaded in a mixin roll having a roll temperature of 100 ° C., then cooled and pulverized to seal each semiconductor. A molding material of an epoxy resin composition for use was obtained.
【００１９】以上で得た各成形材料を用いて７５トント
ランスファー成形機に所定の金型を取付け、それぞれ金
型温度１８０℃、成形時間６０秒で試験片を成形した。Using the molding materials obtained above, a predetermined mold was attached to a 75-ton transfer molding machine, and a test piece was molded at a mold temperature of 180 ° C. and a molding time of 60 seconds.
【００２０】曲げ弾性率はＪＩＳ・Ｋ6911に準じて行
い、線膨張率はディライトメーター法で行い、吸湿率は
径50mm、厚み３mmの試験片を、８５℃、８５％相対湿度
で７２時間処理する前後の試験片の重量変化率で求め
た。それぞれの結果は表２に示した。The flexural modulus was measured in accordance with JIS K6911, the linear expansion coefficient was measured by the delight meter method, and the moisture absorption coefficient was 50 mm in diameter and 3 mm in thickness. A test piece was treated at 85 ° C. and 85% relative humidity for 72 hours. The weight change rate of the test piece before and after was measured. The respective results are shown in Table 2.
【００２１】吸湿半田クラックは、櫛形状のアルミニウ
ム配線回路をシリコンチップ表面に配設した評価用素子
を４２アロイ製の 60QFPリードフレームに搭載したもの
を使って封止成形した60QFP 成形品１２個を試験片と
し、８５℃、８５％相対湿度で７２時間処理後、２５０
℃の半田槽に１０秒間浸漬し、外観クラック発生の有無
で検査した。結果は、クラック発生個数／全試料数で表
２に示した。Moisture-absorbing solder cracks were obtained by sealing and molding 12 pieces of 60QFP molded products by using an evaluation element having comb-shaped aluminum wiring circuits arranged on the surface of a silicon chip mounted on a 60QFP lead frame made of 42 alloy. After being treated as a test piece and treated at 85 ° C and 85% relative humidity for 72 hours, 250
It was immersed in a solder bath at a temperature of 10 ° C. for 10 seconds and inspected for appearance cracks. The results are shown in Table 2 by the number of cracks generated / total number of samples.
【００２２】表２の結果より、エポキシ樹脂がナフタ
レン骨格を有するエポキシ樹脂フェノ−ル性水酸基を
有する硬化剤、エポキシ基または、および、ハイドロ
ジエン基を有するポリオキシアルキレン変性シリコーン
と硬化性ポリオルガノシロキサンからなるシリコーン重
合体、無機充填材を含有してなる半導体封止用エポキ
シ樹脂組成物は、曲げ弾性率と線膨張率の積で考えられ
る低応力性と吸湿半田クラック性に優れていることが確
認できた。From the results shown in Table 2, the epoxy resin has a naphthalene skeleton, an epoxy resin, a curing agent having a phenolic hydroxyl group, a polyoxyalkylene-modified silicone having an epoxy group or a hydrogen group, and a curable polyorganosiloxane. An epoxy resin composition for semiconductor encapsulation containing an inorganic filler, which is composed of a silicone polymer, is excellent in low stress and moisture-absorption solder cracking, which are considered by the product of bending elastic modulus and linear expansion coefficient. It could be confirmed.
【００２３】[0023]
【発明の効果】本発明の半導体封止用樹脂組成物によっ
て、低応力性と耐吸湿半田クラック性に優れた半導体装
置、電子部品を得ることができる。EFFECTS OF THE INVENTION The resin composition for semiconductor encapsulation of the present invention makes it possible to obtain semiconductor devices and electronic parts which are excellent in low stress resistance and moisture absorption solder crack resistance.
【００２４】[0024]
【表１】 [Table 1]
【００２５】[0025]
【表2 】 [Table 2]
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.5 識別記号 庁内整理番号 ＦＩ 技術表示箇所 Ｃ０８Ｌ 63/00 ＮＫＢ 8830−4Ｊ Ｈ０１Ｌ 23/29 23/31 ─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. 5 Identification code Office reference number FI technical display location C08L 63/00 NKB 8830-4J H01L 23/29 23/31
Claims (2)
〔１〕で表されるエポキシ樹脂、フェノ−ル性水酸基
を有する硬化剤、エポキシ基または、及び、ハイドロ
ジエン基を有するポリオキシアルキレン変性シリコー
ン：硬化性ポリオルガノシロキサンを１：９９〜５０：
５０の範囲からなるシリコーン重合体、無機充填材を
含有してなることを特徴とする半導体封止用エポキシ樹
脂組成物。 【化１】 1. The following components (1) to (5), an epoxy resin represented by the following general formula [1], a curing agent having a phenolic hydroxyl group, an epoxy group or a polyoxyalkylene modified with a hydrogen group. Silicone: Curable polyorganosiloxane 1:99 to 50:
An epoxy resin composition for semiconductor encapsulation, comprising a silicone polymer in the range of 50 and an inorganic filler. [Chemical 1]
キシ樹脂中５０重量％以上であることを特徴とする請求
項１記載の半導体封止用エポキシ樹脂組成物。2. The epoxy resin composition for semiconductor encapsulation according to claim 1, wherein the epoxy resin of the general formula [1] is 50% by weight or more in the epoxy resin.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3153168A JP3013511B2 (en) | 1991-06-25 | 1991-06-25 | Epoxy resin composition for semiconductor encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3153168A JP3013511B2 (en) | 1991-06-25 | 1991-06-25 | Epoxy resin composition for semiconductor encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH05230180A true JPH05230180A (en) | 1993-09-07 |
| JP3013511B2 JP3013511B2 (en) | 2000-02-28 |
Family
ID=15556541
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3153168A Expired - Lifetime JP3013511B2 (en) | 1991-06-25 | 1991-06-25 | Epoxy resin composition for semiconductor encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3013511B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020255749A1 (en) * | 2019-06-21 | 2020-12-24 | パナソニックＩｐマネジメント株式会社 | Composition for sealing, semiconductor device, and method for producing semiconductor device |
| WO2021149736A1 (en) * | 2020-01-22 | 2021-07-29 | 日本化薬株式会社 | Epoxy resin mixture, epoxy resin composition and cured product of same |
-
1991
- 1991-06-25 JP JP3153168A patent/JP3013511B2/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020255749A1 (en) * | 2019-06-21 | 2020-12-24 | パナソニックＩｐマネジメント株式会社 | Composition for sealing, semiconductor device, and method for producing semiconductor device |
| WO2021149736A1 (en) * | 2020-01-22 | 2021-07-29 | 日本化薬株式会社 | Epoxy resin mixture, epoxy resin composition and cured product of same |
| CN114641533A (en) * | 2020-01-22 | 2022-06-17 | 日本化药株式会社 | Epoxy resin mixture, epoxy resin composition and cured product thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3013511B2 (en) | 2000-02-28 |
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