JPH01268713A - Epoxy resin composition for sealing semiconductor - Google Patents
Epoxy resin composition for sealing semiconductorInfo
- Publication number
- JPH01268713A JPH01268713A JP9546588A JP9546588A JPH01268713A JP H01268713 A JPH01268713 A JP H01268713A JP 9546588 A JP9546588 A JP 9546588A JP 9546588 A JP9546588 A JP 9546588A JP H01268713 A JPH01268713 A JP H01268713A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- curing agent
- formula
- solder
- resin composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 33
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 33
- 239000000203 mixture Substances 0.000 title claims abstract description 16
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 238000007789 sealing Methods 0.000 title description 6
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 18
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims abstract description 10
- LJBWJFWNFUKAGS-UHFFFAOYSA-N 2-[bis(2-hydroxyphenyl)methyl]phenol Chemical compound OC1=CC=CC=C1C(C=1C(=CC=CC=1)O)C1=CC=CC=C1O LJBWJFWNFUKAGS-UHFFFAOYSA-N 0.000 claims abstract description 5
- 239000011256 inorganic filler Substances 0.000 claims abstract description 5
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 5
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 3
- 229910052794 bromium Inorganic materials 0.000 claims abstract description 3
- 229910052801 chlorine Inorganic materials 0.000 claims abstract description 3
- 229910052736 halogen Inorganic materials 0.000 claims abstract description 3
- 150000002367 halogens Chemical class 0.000 claims abstract description 3
- 238000005538 encapsulation Methods 0.000 claims description 4
- WKBOTKDWSSQWDR-UHFFFAOYSA-N Bromine atom Chemical compound [Br] WKBOTKDWSSQWDR-UHFFFAOYSA-N 0.000 claims description 2
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 2
- GDTBXPJZTBHREO-UHFFFAOYSA-N bromine Substances BrBr GDTBXPJZTBHREO-UHFFFAOYSA-N 0.000 claims description 2
- 239000000460 chlorine Substances 0.000 claims description 2
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000843 powder Substances 0.000 abstract description 4
- 239000005350 fused silica glass Substances 0.000 abstract description 3
- WADSJYLPJPTMLN-UHFFFAOYSA-N 3-(cycloundecen-1-yl)-1,2-diazacycloundec-2-ene Chemical compound C1CCCCCCCCC=C1C1=NNCCCCCCCC1 WADSJYLPJPTMLN-UHFFFAOYSA-N 0.000 abstract 1
- -1 Cl or Br) Chemical class 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 description 26
- 238000012360 testing method Methods 0.000 description 18
- 230000035882 stress Effects 0.000 description 16
- 239000012778 molding material Substances 0.000 description 9
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000006229 carbon black Substances 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 239000011342 resin composition Substances 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- 239000001993 wax Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical group C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- QEZIKGQWAWNWIR-UHFFFAOYSA-N antimony(3+) antimony(5+) oxygen(2-) Chemical compound [O--].[O--].[O--].[O--].[Sb+3].[Sb+5] QEZIKGQWAWNWIR-UHFFFAOYSA-N 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- CAYGQBVSOZLICD-UHFFFAOYSA-N hexabromobenzene Chemical compound BrC1=C(Br)C(Br)=C(Br)C(Br)=C1Br CAYGQBVSOZLICD-UHFFFAOYSA-N 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000006082 mold release agent Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
Landscapes
- Sealing Material Composition (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、耐半田ストレス性に優れた半導体封止用エポ
キシ樹脂組成物に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an epoxy resin composition for semiconductor encapsulation that has excellent solder stress resistance.
半導体関連技術は近年の軽薄短小化傾向より実装密度を
向上させる方向で進んできた。そのためにメモリーの集
積度の向上や実装方法のスルーホール実装から表面実装
への移行が進んでいる。Semiconductor-related technology has progressed in the direction of increasing packaging density due to the recent trend toward lighter, thinner, and smaller devices. To this end, the density of memory is increasing and the mounting method is shifting from through-hole mounting to surface mounting.
従ってパフケージは従来のＤＩＰタイプから表面実装用
として小型薄型のフラットパッケージ、ＳＯＰ、、ＳＯ
Ｊ、ＰＬＣＣに変わってきており、応力によるパッケー
ジクランクの発生、これらのクランクによる耐湿性の低
下等の問題がある。Therefore, the puff cage has changed from the conventional DIP type to a small and thin flat package for surface mounting, SOP, SO.
J, PLCC, and there are problems such as the occurrence of package cranks due to stress and a decrease in moisture resistance due to these cranks.
特に表面実装工程でのリードの半゛田付は時でパッケー
ジは急激な温度変化を受け、このためにパッケージにク
ランクが生じる問題が大きくクローズアップされている
。Particularly during the soldering of leads in the surface mounting process, the package is subject to rapid temperature changes, and the problem of cranking of the package due to this is attracting a lot of attention.
これらの問題を解決するために半田付は時の熱衝撃を緩
和する目的で、熱可塑性オリゴマーの添加（特開昭６２
−１１５８４９号公報）や各種シリコーン化合物の添加
（特開昭６２−１１５８５０号公報、６２−１１６６５
４号公報、６２−１２８１６２号公報）、更にはシリコ
ーン変性（特開昭６２−１３６８６０号公報）などの手
法で対処しているがいずれも半田付は時にパッケージに
クランクが生じてしまい借問性の優れた半導体封止用エ
ポキシ樹脂組成物を得るまでには至らなかったの
一方、耐半田ストレス性に優れた耐熱性エポキシＰ４ｙ
Ｎ組成物を得る為に樹脂系としては多官能エポキシ樹脂
の使用（特開昭６１−１６８６２０号公報）等が検討さ
れてきたが、多官能エポキシ樹脂の使用では架橋密度が
上がり耐熱性が向上するが特に２００°Ｃ〜３００ ’
Ｃのような高温にさらされた場合においては耐半田スト
レス性が不充分であった。In order to solve these problems, soldering requires the addition of thermoplastic oligomers (Japanese Patent Laid-Open No. 62/1999) to alleviate the thermal shock caused by soldering.
-115849) and addition of various silicone compounds (JP-A-62-115850, 62-11665)
4, 62-128162) and silicone modification (Japanese Patent Application Laid-open No. 62-136860), these methods sometimes cause cracks in the package when soldering, resulting in damage to the package. Although it has not been possible to obtain an excellent epoxy resin composition for semiconductor encapsulation, heat-resistant epoxy P4y with excellent solder stress resistance has been developed.
In order to obtain N compositions, the use of polyfunctional epoxy resins (Japanese Unexamined Patent Publication No. 168620/1983) has been considered as a resin system, but the use of polyfunctional epoxy resins increases crosslinking density and improves heat resistance. But especially between 200°C and 300'
When exposed to high temperatures such as C, the solder stress resistance was insufficient.
本発明はこのような問題に対して、エポキシ樹脂として
トリス（ヒドロキシフェニル）メタントリグリシジルエ
ーテルを、硬化剤としてジシクロペンタジェン変性硬化
剤を用いることにより耐半田ストレス性が著しく優れた
半導体封止用エポキシ樹脂組成物を便供するところにあ
る。The present invention solves these problems by using tris(hydroxyphenyl)methane triglycidyl ether as an epoxy resin and a dicyclopentadiene-modified curing agent as a curing agent, thereby creating a semiconductor encapsulation with extremely excellent solder stress resistance. It provides epoxy resin compositions for use.
本発明のエポキシ樹脂組成物は従来の封止用樹脂組成物
に比べて非常に優れた耐半田ストレス性を有したもので
ある。The epoxy resin composition of the present invention has extremely superior solder stress resistance compared to conventional sealing resin compositions.
・−・・・・・・・・−・−・ （ｎ）ｎ＝ｌｌ Ｏ
〜 ５
（式中のＲは水素原子、アルキル基及び塩素、臭素等の
ハロゲンを表わす、）
上記式（１）で現わされるエポキシ樹脂は１分子中に３
個以上のエポキシ基を有する多官能エポキシ樹脂であり
、この多官能エポキシ樹脂と上記式（ＩＩ）で表わされ
るジシクロペンタジェン変性硬化剤を併用することによ
り多官能エポキシ樹脂の使用だけでは得られなかった耐
半田ストレス性に非常に優れたエポキシ４１４脂組成物
を得ることができる。・−・・・・・・・・・・−・−・ (n)n=ll O
~ 5 (R in the formula represents a hydrogen atom, an alkyl group, or a halogen such as chlorine or bromine) The epoxy resin represented by the above formula (1) contains 3 in one molecule.
It is a polyfunctional epoxy resin having 1 or more epoxy groups, and by using this polyfunctional epoxy resin together with a dicyclopentadiene-modified curing agent represented by the above formula (II), it can be obtained by using only a polyfunctional epoxy resin. It is possible to obtain an epoxy 414 resin composition that has excellent solder stress resistance, which was previously unavailable.
このようなエポキシ樹脂の使用量は、これを調節するこ
とにより耐半田ストレス性を最大限に引き出すことがで
きる。耐半田ストレス性の効果を出す為には好ましくは
トリス（ヒドロキシフェニル）メタン・トリグリシジル
エーテルを、エポキシ樹脂の５０重量％以上、更に好ま
しくは７０重量％以上の使用が望ましい、５０重量％以
下だと架橋密度が上がらず耐半田ストレス性が不充分で
ある。By adjusting the amount of such epoxy resin used, the solder stress resistance can be maximized. In order to achieve the effect of solder stress resistance, it is preferable to use tris(hydroxyphenyl)methane triglycidyl ether in an amount of at least 50% by weight of the epoxy resin, more preferably at least 70% by weight, but not more than 50% by weight. The crosslinking density does not increase and the solder stress resistance is insufficient.
又２官能以下のエポキシ樹脂では、架橋密度が上がらず
耐熱性が劣り耐半田ストレス性の効果が得られない。Furthermore, when using an epoxy resin with less than two functional groups, the crosslinking density does not increase, the heat resistance becomes poor, and the effect of solder stress resistance cannot be obtained.
ここでいうエポキシ樹脂とは、エポキシ基を有するもの
全般をいう。たとえばビスフェノール型エポキシ樹脂、
ノボラック型エポキシ樹脂・トリアジン核含有エポキシ
樹脂等のことをいう。The epoxy resin referred to herein refers to any resin having an epoxy group. For example, bisphenol-type epoxy resin,
Refers to novolac type epoxy resin, triazine core-containing epoxy resin, etc.
上記式（１１）で表わされるジシクロペンタジェン変性
硬化剤は分布中に可撓性を有するジシクロペンクジエン
構造をもつ多官能ポリマーであり、これを用いることに
より可撓性に冨み、耐半田ストレス性に良好なエポキシ
樹脂組成物を得ることができる。The dicyclopentadiene-modified curing agent represented by the above formula (11) is a polyfunctional polymer having a flexible dicyclopentadiene structure in its distribution, and its use increases flexibility and resistance. An epoxy resin composition with good solder stress resistance can be obtained.
ジシクロペンタジェン変性硬化剤の使用量は、これを調
節することにより耐半田ストレス性を最大限に引き出す
ことができる。耐半田ストレス性の効果を出す為には、
好ましくは全硬化剤に対して５０重量％以上更に好まし
くは７０重量％以上の使用が望ましい、５０重量％以下
だと可撓性が上がらず耐半田ストレス性が不充分である
。By adjusting the amount of dicyclopentadiene-modified curing agent used, solder stress resistance can be maximized. In order to achieve the effect of solder stress resistance,
Preferably, it is used in an amount of 50% by weight or more, more preferably 70% by weight or more, based on the total curing agent. If it is less than 50% by weight, flexibility will not increase and the solder stress resistance will be insufficient.
ジシクロペンタジェン変性硬化剤以外の硬化剤としては
エポキシ樹脂と硬化反応するポリマー全般のことをいい
、例えばフェノールノボラック、タレゾールノボラック
樹脂、酸無水物といった一般名を挙げるεとが出来る。The curing agent other than the dicyclopentadiene-modified curing agent refers to polymers in general that undergo a curing reaction with epoxy resins, and includes common names such as phenol novolak, talesol novolak resin, and acid anhydride.
エポキシ樹脂と硬化剤の配合比はエポキシ樹脂のエポキ
・シ基と硬化剤の水酸基との当量比が０．５〜５の範囲
内に有することが望ましい。As for the compounding ratio of the epoxy resin and the curing agent, it is desirable that the equivalent ratio of the epoxy groups of the epoxy resin to the hydroxyl groups of the curing agent be within the range of 0.5 to 5.
当量比が０．５未満又は５を超えたものは耐湿性、成形
作業性及び硬化物の電気特性が悪くなるので好ましくな
い。If the equivalent ratio is less than 0.5 or more than 5, the moisture resistance, molding workability, and electrical properties of the cured product will deteriorate, which is not preferable.
本発明に使用される無機充填材としては通常のシリカ粉
末や、アルミナ等があげられ、とくに溶融シリカ粉末が
好ましい。Examples of the inorganic filler used in the present invention include ordinary silica powder and alumina, with fused silica powder being particularly preferred.
本発明に使用される硬化促進剤はエポキシ基とフェノー
ル性水酸基との反応を促進するものであればよく、一般
に封止用材料に使用されているものを広く使用すること
ができ、例えばジアザビシクロウンデセン（ＤＢＵ）、
）リフェニルホスフィン（ＴＰＰ）、ジメチルベンジル
アミン（ＢＤＭＡ）や２メチルイミダゾール（２ＭＺ）
等が単独もしくは２種類以上混合して用いられる。The curing accelerator used in the present invention may be one that promotes the reaction between the epoxy group and the phenolic hydroxyl group, and a wide variety of those commonly used in sealing materials can be used, such as diaza. Bicycloundesene (DBU),
) Riphenylphosphine (TPP), dimethylbenzylamine (BDMA) and 2methylimidazole (2MZ)
etc. may be used alone or in combination of two or more.
本発明の封止用エポキシ樹脂組成物はエポキシ樹脂、硬
化剤、硬化促進剤及び無機充填剤を必須成分とするが、
これ以外に必要に応じてシランカップリング剤、ブロム
化エポキシ樹脂、二酸化アンチモン、ヘキサブロムベン
ゼン等の難燃剤、カーボンブラック、ベンガラ等の着色
剤、天然ワックス、合成ワックス等の離型剤及びシリコ
ンオイル、ゴム等の低応力添加剤等の種々の添加剤を適
宜配合しても差し支えがない。The epoxy resin composition for sealing of the present invention contains an epoxy resin, a curing agent, a curing accelerator, and an inorganic filler as essential components,
In addition to this, silane coupling agents, brominated epoxy resins, antimony dioxide, flame retardants such as hexabromobenzene, coloring agents such as carbon black and red iron, mold release agents such as natural waxes and synthetic waxes, and silicone oil are also required. There is no problem in appropriately blending various additives such as low stress additives such as rubber and the like.
又、本発明の封止用エポキシ樹脂組成物を成形材料とし
て製造するには、エポキシ樹脂、硬化剤、硬化促進剤、
充填剤、その他の添加剤をミキサー等によって十分に均
一に混合した後、さらに熱ロールまたはニーダ−等で溶
融混練し、冷却後粉砕して成形材料とすることができる
。これらの成形材料は電子部品あるいは電気部品の封止
、被覆、絶縁等に適用することができる。In addition, in order to produce the epoxy resin composition for sealing of the present invention as a molding material, an epoxy resin, a curing agent, a curing accelerator,
After the filler and other additives are thoroughly and uniformly mixed using a mixer or the like, the mixture can be further melt-kneaded using a heated roll or kneader, cooled, and then ground to obtain a molding material. These molding materials can be applied to sealing, covering, insulating, etc. electronic or electrical components.
実施例１
下記組成物
式（１）で示されるトリス（ヒドロキシフェニル）メタ
ントリグリシジルエーテル １０重量部（ｎ−０，１，
２の混合物であり、４：３：３）オルトクレゾールノボ
ラフクエボキシ樹脂１０重量部
式（Ｉｆ）で示されるジシクロペンタジェン変性フェノ
ール樹脂 ５重量部・・−−−−−−
・−・・−・（■・）ｎ−Ｑ〜５
フェノールノボラック樹脂 ５重量部溶融シ
リカ粉末 ６８．８重量部トリフェニ
ルホスフィン ｏ、２！１部カーボンブラッ
ク ０．５重量部カルナバワックス
０．５１１部を混合した後コニーグー
で混練しエポキシ樹脂成形材料を得た。Example 1 Tris(hydroxyphenyl)methane triglycidyl ether represented by the following composition formula (1) 10 parts by weight (n-0,1,
2, 4:3:3) 10 parts by weight of orthocresol novolafukueboxy resin 5 parts by weight of dicyclopentadiene-modified phenol resin represented by formula (If)...
・-・・-・(■・)n-Q~5 Phenol novolak resin 5 parts by weight Fused silica powder 68.8 parts by weight Triphenylphosphine o, 2!1 parts Carbon black 0.5 parts by weight Carnauba wax
After mixing 0.511 parts, the mixture was kneaded with Coney Goo to obtain an epoxy resin molding material.
得られた成形材料をタブレット化し、低圧トランスファ
ー成形機にて１７５°Ｃ１７０ｋｇ／ｃｄ、１２０秒の
条件で半田クランク試験用として６×６閣のチップを５
２ｐパンケージに封止し、又半田耐湿性試験用として３
×６ａＩＩ１１のチップを１６ＰＳＯＰパツケージに封
止した。The obtained molding material was made into tablets, and five 6×6 chips were molded for a solder crank test using a low-pressure transfer molding machine at 175°C, 170 kg/cd, and 120 seconds.
It is sealed in a 2p pan cage, and also used for solder moisture resistance testing.
A x6aII11 chip was sealed in a 16PSOP package.
封止したテスト用素子について下記の半田クランク試験
及び半田耐湿性試験をおこなった。The following solder crank test and solder moisture resistance test were conducted on the sealed test element.
半田クランク試験：封止したテスト用素子を８５°Ｃ１
８５％ＲＨの環環境下で４８Ｈ「および７２Ｈｒ処理し
、その後２５０°Ｃの半田槽に１０秒間浸漬後顕微鏡で
外部クランクを観察した。Solder crank test: sealed test element at 85°C1
The external crank was processed for 48 hours and 72 hours in a ring environment of 85% RH, and then immersed in a solder bath at 250°C for 10 seconds, and the external crank was observed with a microscope.
半田耐湿性平均寿命（Ｈｒ） ：封止したテスト用素子
を８５°Ｃ１８５％ＰＨの環境下で７２Ｈｒ処理し、そ
の後２５０°Ｃの半田槽に１０秒間浸漬後プレッシ十−
クシカー試験（１２５°Ｃ１１００％Ｒ１１）を行い５
０％の回路のオーブン不良が発生するまでの時間を測定
した。Solder moisture resistance average life (Hr): The sealed test element was treated in an environment of 85°C and 185% PH for 72 hours, then immersed in a solder bath at 250°C for 10 seconds, and then
Conduct a comb test (125°C, 1100% R11).5
The time required for 0% circuit oven failure to occur was measured.
試験結果を第１表に示す。The test results are shown in Table 1.
実施例２〜７
第１表の処方に従って配合し、実施例１と同様にして成
形材料を得た。この成形材料で試験用の封止した成形品
を得、この成形品を用いて実施例１と同様に半田クラッ
ク試験及び半田耐湿性試験を行なった。試験結果を第１
表に示す。Examples 2 to 7 Molding materials were obtained in the same manner as in Example 1 by blending according to the prescriptions in Table 1. A sealed molded article for testing was obtained using this molding material, and a solder crack test and a solder moisture resistance test were conducted in the same manner as in Example 1 using this molded article. Test results first
Shown in the table.
比較例１〜６
第１表の処方に従って配合し、実施例１と同様にして成
形材料を得た。この成形材料で試験用の封止した成形品
を得、この成形品を用いて実施例１と同様に半田クラン
ク試験及び半田耐湿性試験を行なった。試験結果を第１
表に示す。Comparative Examples 1 to 6 Molding materials were obtained in the same manner as in Example 1 by blending according to the formulations in Table 1. A sealed molded product for testing was obtained using this molding material, and a solder crank test and a solder moisture resistance test were conducted in the same manner as in Example 1 using this molded product. Test results first
Shown in the table.
本発明に従うと従来技術では得ることのできなかった耐
熱性及び、可撓性を有するエポキシ樹ＪＩＷ＆［Ｉ放物
を得ることができるので、半田付は工程による急激な温
度変化による熱ストレスを受けたときの耐クラツク性に
非常に優れ、更に耐湿性が、良好なことから電子、電気
部品の封止用、被覆用、絶縁用等に用いた場合、特に表
面実装パフケージに搭載された高集積大型チップＩＣに
おいて信耗性が非常に必要とする製品について好適であ
る。According to the present invention, it is possible to obtain an epoxy tree JIW&[I paraboloid that has heat resistance and flexibility that could not be obtained with conventional techniques, so soldering is not subject to heat stress due to rapid temperature changes during the process. It has excellent crack resistance when exposed to heat, and has good moisture resistance, making it ideal for use in sealing, covering, and insulating electronic and electrical components, especially for highly integrated devices mounted on surface-mounted puff cages. It is suitable for large-chip IC products that require high reliability.
Claims (1)
エーテルを５０〜１００重量％含むエポキシ樹脂 （Ｂ）式IIで示される硬化剤 ▲数式、化学式、表等があります▼・・・・・（II） （式中のＲは水素原子、アルキル基及び塩素、臭素等の
ハロゲンを表わす。） ジシクロペンタジエン変性硬化剤を５０〜１００重量％
含む硬化剤 （Ｃ）無機充填剤 （Ｄ）硬化促進剤 を必須成分とすることを特徴とする半導体封止用エポキ
シ樹脂組成物。(1) (A) Epoxy resin shown by formula I ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ...... (I) n = 0 to 5 Tris (hydroxyphenyl) methane triglycidyl ether 50 to 100 Epoxy resin containing % by weight (B) Curing agent shown by formula II ▲ Numerical formula, chemical formula, table, etc. are available ▼・・・・・・(II) (R in the formula is a hydrogen atom, an alkyl group, chlorine, bromine, etc. (Represents halogen.) 50 to 100% by weight of dicyclopentadiene-modified curing agent.
An epoxy resin composition for semiconductor encapsulation, comprising a curing agent (C), an inorganic filler, and (D) a curing accelerator as essential components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63095465A JPH062800B2 (en) | 1988-04-20 | 1988-04-20 | Epoxy resin composition for semiconductor encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63095465A JPH062800B2 (en) | 1988-04-20 | 1988-04-20 | Epoxy resin composition for semiconductor encapsulation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01268713A true JPH01268713A (en) | 1989-10-26 |
| JPH062800B2 JPH062800B2 (en) | 1994-01-12 |
Family
ID=14138408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63095465A Expired - Fee Related JPH062800B2 (en) | 1988-04-20 | 1988-04-20 | Epoxy resin composition for semiconductor encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH062800B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05148410A (en) * | 1991-11-26 | 1993-06-15 | Shin Etsu Chem Co Ltd | Thermosetting resin composition and semiconductor device |
| KR100642607B1 (en) * | 2005-10-13 | 2006-11-10 | (주)디피아이 홀딩스 | Epoxy resin, epoxy resin composition including the same and method of preparing the epoxy resin |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6229070A (en) * | 1985-07-30 | 1987-02-07 | Sanyo Electric Co Ltd | Nonaqueous electrolyte battery |
| JPS6296521A (en) * | 1985-10-23 | 1987-05-06 | Mitsubishi Gas Chem Co Inc | Epoxy resin composition |
| JPS6298793A (en) * | 1985-10-25 | 1987-05-08 | 三菱瓦斯化学株式会社 | Epoxy resin compound for printed circuit substrate |
| JPS62184020A (en) * | 1986-02-07 | 1987-08-12 | Toshiba Chem Corp | Sealing resin composition |
| JPS62290720A (en) * | 1986-06-11 | 1987-12-17 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing electronic component |
-
1988
- 1988-04-20 JP JP63095465A patent/JPH062800B2/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6229070A (en) * | 1985-07-30 | 1987-02-07 | Sanyo Electric Co Ltd | Nonaqueous electrolyte battery |
| JPS6296521A (en) * | 1985-10-23 | 1987-05-06 | Mitsubishi Gas Chem Co Inc | Epoxy resin composition |
| JPS6298793A (en) * | 1985-10-25 | 1987-05-08 | 三菱瓦斯化学株式会社 | Epoxy resin compound for printed circuit substrate |
| JPS62184020A (en) * | 1986-02-07 | 1987-08-12 | Toshiba Chem Corp | Sealing resin composition |
| JPS62290720A (en) * | 1986-06-11 | 1987-12-17 | Hitachi Chem Co Ltd | Epoxy resin molding material for sealing electronic component |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05148410A (en) * | 1991-11-26 | 1993-06-15 | Shin Etsu Chem Co Ltd | Thermosetting resin composition and semiconductor device |
| KR100642607B1 (en) * | 2005-10-13 | 2006-11-10 | (주)디피아이 홀딩스 | Epoxy resin, epoxy resin composition including the same and method of preparing the epoxy resin |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH062800B2 (en) | 1994-01-12 |
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